WO1996022563A1 - Composition de resist positif - Google Patents
Composition de resist positif Download PDFInfo
- Publication number
- WO1996022563A1 WO1996022563A1 PCT/JP1996/000061 JP9600061W WO9622563A1 WO 1996022563 A1 WO1996022563 A1 WO 1996022563A1 JP 9600061 W JP9600061 W JP 9600061W WO 9622563 A1 WO9622563 A1 WO 9622563A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- phenol compound
- molecular weight
- group
- compound
- phenol
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
- G03F7/0236—Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
Definitions
- the present invention relates to a post-type resist composition, and more particularly, to a positive-type resist composition for microfabrication used in the manufacture of semiconductor devices, magnetic bubble memory devices, integrated circuits, and the like. About.
- a post-type resist composition As a resist composition for forming a semiconductor device, a post-type resist composition has recently become the mainstream. The reason for this is that the negative resist composition generally has high sensitivity, but uses an organic solvent for development, and therefore has a large swelling and a difficulty in resolution. On the other hand, it is considered that the positive resist composition is generally excellent in resolution and can sufficiently cope with high integration of semiconductors.
- a positive resist composition generally used in this field comprises an alkaline soluble phenolic resin such as a novolak resin and a quinonediadisulfonic acid-based photosensitizer. Things. Since this positive resist composition can be developed with an aqueous alkali solution, it does not swell and is excellent in resolution. In recent years, such post-type resist compositions have been further improved in resolution by improving their own performance and the performance of exposure equipment, and the formation of fine patterns of less than lm has been achieved. It has become possible.
- the resist characteristics of the positive resist composition containing an alkali-soluble phenol resin and a quinone diazide sulfonate-based photosensitizer are improved.
- various phenolic compounds as additives.
- the positive resist compositions specifically disclosed in these documents have somewhat insufficient register characteristics such as sensitivity, resolution, and residual film ratio, and further improvement is required. I have.
- improvement of these characteristics is extremely important.
- Another object of the present invention is to provide a positive resist composition which can exhibit excellent resist characteristics when applied to a substrate having a reduced reflectance.
- the inventors have conducted intensive studies to solve these problems, and as a result, have found that the above object can be achieved by using a certain specific X-nor compound, thereby completing the present invention. Reached.
- a positive resist comprising (A) an alkali-soluble phenol resin, (B) a quinone diazide sulfonate-based photosensitizer, and (C) a phenol compound.
- the (C) phenol compound is a phenol compound (CX) having a structural unit represented by the formula (I) and a phenol compound having a structural unit represented by the formula (II).
- a positive resist composition characterized by being at least one phenolic compound selected from the group consisting of phenolic compounds (CD).
- R ′ to R S independently represent a hydrogen atom, a hydroxyl group, a halogen atom, a substituted alkyl group, a substituted cycloalkyl group, a substituted alkenyl group, a substituted alkoxy group, or a substituted aryl group.
- R 4 To R are each independently a hydrogen atom, a substitutable alkyl group, a substitutable cycloalkyl group, a substitutable alkenyl group, a substitutable aryl group, or a substitutable alkoxy group. Is an integer.
- the soluble phenol resin include, for example, a condensation reaction product of phenols and aldehydes, and a reaction product of phenols and ketones.
- a mixture of a condensation reaction product, a vinylphenol-based polymer, an isopropanol-based polymer, and a hydrogenation reaction product of these phenolic resins may be used. It can be. Above all, a novolak resin obtained by a condensation reaction between a phenol and an aldehyde is preferred.
- o-cresole, m-cresole, p-cresole, 2, 3 —dimethyl phenol, 2,5—dimethyl phenol, 3, 4-Dimethyl phenol, 3, 5-Dimethyl phenol, 2, 3, 5-Trimethyltin phenol, 3, 4, 5-Trimethyl phenol, etc. Is a preferred example.
- Each of these compounds can be used alone, or two or more of them can be used in combination.
- the combination of m-cresol Zp-cresolno 3,5 -dimethylenol and m-cresol Zp-cresol / 2,3,5 -trimethylphenol Is preferred.
- aldehydes include formalin, phenol, and phenol. Laformaldehyde, Trioxane, Acetaldehyde, Propylaldehyde, Benzaldehyde, Phenylacetaldehyde, N-Phenylpropylaldehyde, o-Phenylpropylaldehyde, o — Hydroxy Benzaldehyde, m—Hydroxybenzaldehyde, p—Hydroxybenzaldehyde, o—Cro mouth Benzanoredehid, m—Kuro mouth Benzanoredehid, p—Kro mouth Benzanorehde, o—Two lobes N-Zardaldehyde, m—two-Trobenzaldehyde, p—two-Trobenzaldehide, o—Metilbenzaldehyde, m—Metilbenzaldeh
- ketones include acetone, acetate phenon, o—hydroxyacetophenone, m—hydroxyacetophenone, and p—hydroxyacetate.
- condensation reaction products can be obtained by a conventional method, for example, by reacting phenols with aldehydes or ketones in the presence of an acidic catalyst. Can be done.
- the vinylphenol-based polymer is selected from a homopolymer of vinylphenol and a copolymer of a vinylphenol-X-copolymer and a component copolymerizable therewith.
- Isopropanol polymer is a homopolymer of isopropanol and a copolymer of isopropanol and a component copolymerizable with isopropanol.
- Specific examples of components that can be copolymerized with vinyl phenol or isopropanol include acryl Examples thereof include phosphoric acid, methacrylic acid, styrene, maleic anhydride, maleic acid imide, vinyl alcohol, acrylonitrile, and derivatives of these compounds.
- the copolymer can be obtained by a well-known method.
- the hydrogenation reaction product of the X-phenol resin can be obtained by a conventional method, for example, by dissolving the above-mentioned fluoro-resin in an organic solvent and performing hydrogenation in the presence of a homogeneous or heterogeneous catalyst. It is obtained by
- R ′ 6 and R 17 are each independently a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R 18 to R 2 ′ are each independently a alkyl group having 1 to 4 carbon atoms. is there. )
- the ratio (average esterification ratio) of esterification of the quinonediazidesulfonic acid compound to these polyhydroxy compounds is not particularly limited.
- the lower limit is usually 20%, preferably 30%, and the upper limit is usually 100%, as mol% of the quinonediazidosulfonic acid compound based on the hydroxyl group of the hydroxy compound. And preferably 95%.
- the esterification ratio is usually from 20 to 100%, preferably from 30 to 95%. If the ratio of esterification is too low, pattern shape and resolution may be degraded. If the ratio of esterification is too high, sensitivity may be lowered.
- Phenols used as a raw material of the phenol compound (CX) are not particularly limited, but preferred examples include phenol, o-cresol, and m-phenol.
- the a and a 'monosubstituted xylenes are not particularly limited, but preferred specific examples are 0—xylylene glycol, m—xylylene glycol, and p—xylylene.
- phenol compound (CX) examples include those shown in Table 1.
- R ′ to R ′ ′ in Table 1 correspond to the formula (I).
- the phenol compound (CX) contains at least one structural unit represented by the formula (I). table 1
- phenol compound (CX) examples include those having structural units represented by the following formulas (CX-I) to (CX-XVI). .
- a phenolic compound (CD) can be obtained by performing an addition reaction between phenols and dicyclopentadiene in the presence of an acid catalyst.
- Phenol compounds include phenols and dicyclopentadiene, as well as aldehydes used as raw materials for novalac resins.
- a reaction product obtained by causing coexisting analogous ketones can also be used.
- aldehydes holmaldehyde Is preferred.
- the proportion of dicyclopentagen used is 100 parts by weight of the total amount of aldehydes, ketones and dicyclopentagen. 20 parts by weight or more, preferably 50 parts by weight or more, and more preferably 70 parts by weight or more.
- One of the phenolic compounds (CX) and (CD) can be used as a resin, and the other can be used as a low-molecular-weight phenolic compound as an additive.
- the ratio of the phenolic compound (CX) to the (CX) is not a ratio of the phenolic compound (CX) to the (CD).
- CD Or
- the ratio between an additive described later and a phenol compound (CX) or (CD) used as a low-molecular-weight phenol compound are important.
- phenol compounds (CX) and (CD) can be used as those whose molecular weight and molecular weight distribution are controlled by known means.
- Examples of the method for controlling the molecular weight and the molecular weight distribution include the same methods as those for controlling the molecular weight and the molecular weight distribution of the above-mentioned alcohol-soluble phenol resin.
- the ratio (weight ratio) of the other phenolic compound to the phenolic compound (CX) and / or (CD) having an average molecular weight of less than 2,000 is from 0 :! Preferably it is 0.3-3, more preferably 0.5-2.
- the positive resist composition of the present invention is usually used by dissolving in a solvent in order to form a resist film by applying it to a substrate.
- polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, and polyoxyethylene oleyl ether; polyoxyethylene Polyoxyethylene phenol ethers such as octyl phenyl ether and polyoxyethylene nonyl phenol ethers; polyethylene glycol ether polyesters; polyethylene glycol ether resinates; Lenglicol dialkylesters; Eftop EF301, EF303, EF355 (manufactured by Shin-Akita Kasei), Megafax F171, F172, F173, F177 (manufactured by Dainippon Ink), Florad FC430, FC431 (manufactured by Sumitomo Sleep), Asahiga Mode, AG710, Surflon
- Fluoride such as S-382, SC-101, SC-102, SC-103, SC-104, SC-105, SC-106 (manufactured by Asahi Glass Co., Ltd.) Substrate surfactant; organosiloxane polymer KP341 (manufactured by Shin-Etsu Chemical Co., Ltd.); acrylic acid or methacrylic acid (co) polymer polyfluoride No. 75 and No. 95 (manufactured by Kyoeisha Yushi Kagaku Kogyo KK).
- the amount of these surfactants is usually 2 parts by weight or less, preferably 1 part by weight or less, per 100 parts by weight of the solid component of the composition. (Developer)
- Aqueous solutions of amines tetramethylammonium hydroxide, tetraethylammonium hydroxide, trimethylethylhydroxymethylene ammonium hydroxide, triethylhydroxyammonium hydroxide And quaternary ammonium hydroxides such as trimethylsilyl peroxide, etc.
- aqueous solution of proxy de can be mentioned up.
- a water-soluble organic solvent such as methanol, ethanol, propanol, ethyl alcohol, a surfactant, a resin dissolution inhibitor, etc. Can be added.
- a resist solution obtained by dissolving the resist composition of the present invention in a solvent is applied to the surface of a substrate such as a silicon wafer by a conventional method, and then the solvent is removed by drying.
- a film can be formed.
- spin coating is particularly recommended as a coating method.
- Exposure sources used for exposure to form a pattern on the resist film thus obtained include ultraviolet light, far ultraviolet light, KrF excimer laser light, X-rays, and electron beams. Electron beam sources. Heat treatment after exposure (post-exposure bake) is preferred because sensitivity can be improved and stabilized.
- the resist evaluation method in the following examples and comparative examples is as follows. All the resist evaluations were performed on silicon wafers.
- the silicon wafer on which the resist and the ° pattern were formed were cut from the vertical direction of the line pattern, and the results of observation with an electron microscope from the cross-sectional direction of the pattern were shown.
- the pattern sidewall was raised at an angle of 80 ° or more with respect to the substrate, and the film without film loss was judged as “good”, and the film with film loss was judged as “film reduced”.
- Exposure margin (E 3 — E 1) X 100 / E 2
- Mitsui Toatsu Chemical's dicyclopentagenphenol resins “DPR-500”, “DPR-300”, and “DPR-520” are good solvents, respectively. Separation was carried out using solvent acetate, ethyl acetate, and toluene as a poor solvent. Dicyclopentene phenolic resins “DPR-500” and “DPR-30000” have different molecular weight distributions, but both are dicyclopentagen and phenol. It is a copolymer with Knol. Dicyclopentagenphenol resin "DPR-5210" is a copolymer of dicyclopentagen, formaldehyde, and phenol.
- the resist solution was applied on a silicon wafer by a coater, and then prebaked at 90 for 90 seconds to form a resist film having a film thickness of 1.17 / m.
- a positive pattern was formed by developing with a 2.38% aqueous solution of tetramethylammonium hydroxide by a paddle method for 23 to 1 minute.
- the silicon wafer was taken out and observed with an electron microscope, and the sensitivity, resolution, remaining film ratio, and pattern shape were measured. Table 5 shows the results.
- Table 6 shows the formulations of the resist solutions of Examples 22 to 31 and Comparative Examples 5 to 7, and Table 7 shows the evaluation results.
- TAAI TAAI
- the positive resist composition of the present invention is excellent in sensitivity, residual film ratio, resolution, pattern shape, exposure margin, focus margin, and the like. Useful as a type register.
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- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/875,045 US6013407A (en) | 1995-01-17 | 1996-01-17 | Positive resist composition |
EP96900700A EP0831370A4 (en) | 1995-01-17 | 1996-01-17 | POSITIVELY WORKING PHOTO PAINT COMPOSITION |
KR1019970704853A KR19980701463A (ko) | 1995-01-17 | 1996-01-17 | 포지티브형 레지스트 조성물 |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7022273A JPH08194312A (ja) | 1995-01-17 | 1995-01-17 | ポジ型レジスト組成物 |
JP7/22273 | 1995-01-17 | ||
JP5503295 | 1995-02-20 | ||
JP7/55032 | 1995-02-20 | ||
JP12598595 | 1995-04-26 | ||
JP7/125985 | 1995-04-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1996022563A1 true WO1996022563A1 (fr) | 1996-07-25 |
Family
ID=27283785
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1996/000061 WO1996022563A1 (fr) | 1995-01-17 | 1996-01-17 | Composition de resist positif |
Country Status (4)
Country | Link |
---|---|
US (1) | US6013407A (ja) |
EP (1) | EP0831370A4 (ja) |
KR (1) | KR19980701463A (ja) |
WO (1) | WO1996022563A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1124271A (ja) * | 1997-06-30 | 1999-01-29 | Kurarianto Japan Kk | 高耐熱性放射線感応性レジスト組成物 |
JP4105036B2 (ja) * | 2003-05-28 | 2008-06-18 | 信越化学工業株式会社 | レジスト下層膜材料ならびにパターン形成方法 |
JP4069025B2 (ja) * | 2003-06-18 | 2008-03-26 | 信越化学工業株式会社 | レジスト下層膜材料ならびにパターン形成方法 |
US7427464B2 (en) * | 2004-06-22 | 2008-09-23 | Shin-Etsu Chemical Co., Ltd. | Patterning process and undercoat-forming material |
JP4575220B2 (ja) * | 2005-04-14 | 2010-11-04 | 信越化学工業株式会社 | レジスト下層膜材料およびパターン形成方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05204149A (ja) * | 1992-01-28 | 1993-08-13 | Fuji Photo Film Co Ltd | ポジ型フオトレジスト組成物 |
JPH06167805A (ja) * | 1992-06-04 | 1994-06-14 | Sumitomo Chem Co Ltd | ポジ型レジスト組成物 |
JPH06289607A (ja) * | 1993-04-06 | 1994-10-18 | Japan Synthetic Rubber Co Ltd | ポジ型感放射線性樹脂組成物 |
JPH0772622A (ja) * | 1993-09-06 | 1995-03-17 | Japan Synthetic Rubber Co Ltd | ポジ型感放射線性樹脂組成物 |
JPH07271022A (ja) * | 1994-03-31 | 1995-10-20 | Fuji Photo Film Co Ltd | ポジ型フオトレジスト組成物 |
JPH07306532A (ja) * | 1994-05-12 | 1995-11-21 | Fuji Photo Film Co Ltd | ポジ型感放射線性樹脂組成物 |
JPH07333843A (ja) * | 1994-06-13 | 1995-12-22 | Nippon Oil Co Ltd | ポジ型感光性樹脂組成物 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5946917A (ja) * | 1983-08-08 | 1984-03-16 | 株式会社ナカ技術研究所 | 階段用敷物 |
EP0249139B2 (en) * | 1986-06-13 | 1998-03-11 | MicroSi, Inc. (a Delaware corporation) | Resist compositions and use |
JP2572458B2 (ja) * | 1989-10-20 | 1997-01-16 | 富士写真フイルム株式会社 | 電子写真感光体 |
JPH061377B2 (ja) * | 1989-12-28 | 1994-01-05 | 日本ゼオン株式会社 | ポジ型レジスト組成物 |
KR0184870B1 (ko) * | 1990-02-20 | 1999-04-01 | 아사구라 다기오 | 감방사선성 수지 조성물 |
JP2711590B2 (ja) * | 1990-09-13 | 1998-02-10 | 富士写真フイルム株式会社 | ポジ型フオトレジスト組成物 |
JP3039048B2 (ja) * | 1991-11-01 | 2000-05-08 | 住友化学工業株式会社 | ポジ型感放射線性レジスト組成物 |
JP2655384B2 (ja) * | 1991-11-08 | 1997-09-17 | 富士写真フイルム株式会社 | ポジ型レジスト組成物 |
JP3391471B2 (ja) * | 1992-02-25 | 2003-03-31 | 住友化学工業株式会社 | ポジ型レジスト組成物 |
JPH05323602A (ja) * | 1992-05-26 | 1993-12-07 | Hitachi Chem Co Ltd | ポジ型ホトレジスト組成物およびレジストパターンの製造法 |
JPH05323605A (ja) * | 1992-05-27 | 1993-12-07 | Sumitomo Chem Co Ltd | ポジ型レジスト組成物 |
JPH06116370A (ja) * | 1992-10-02 | 1994-04-26 | Mitsui Toatsu Chem Inc | フェノールアラルキル樹脂の製法 |
KR100277365B1 (ko) * | 1992-11-11 | 2001-09-17 | 고사이 아끼오 | 포지티브형레제스트조성물 |
JPH06266107A (ja) * | 1993-03-10 | 1994-09-22 | Fuji Photo Film Co Ltd | ポジ型感光性組成物 |
JPH0859530A (ja) * | 1994-06-15 | 1996-03-05 | Sumitomo Chem Co Ltd | ポリヒドロキシ化合物及びそれを含有するポジ型レジスト組成物 |
JPH08179502A (ja) * | 1994-12-27 | 1996-07-12 | Mitsui Toatsu Chem Inc | 感光性樹脂組成物 |
US5541033A (en) * | 1995-02-01 | 1996-07-30 | Ocg Microelectronic Materials, Inc. | Selected o-quinonediazide sulfonic acid esters of phenolic compounds and their use in radiation-sensitive compositions |
-
1996
- 1996-01-17 WO PCT/JP1996/000061 patent/WO1996022563A1/ja not_active Application Discontinuation
- 1996-01-17 EP EP96900700A patent/EP0831370A4/en not_active Ceased
- 1996-01-17 US US08/875,045 patent/US6013407A/en not_active Expired - Fee Related
- 1996-01-17 KR KR1019970704853A patent/KR19980701463A/ko not_active Application Discontinuation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05204149A (ja) * | 1992-01-28 | 1993-08-13 | Fuji Photo Film Co Ltd | ポジ型フオトレジスト組成物 |
JPH06167805A (ja) * | 1992-06-04 | 1994-06-14 | Sumitomo Chem Co Ltd | ポジ型レジスト組成物 |
JPH06289607A (ja) * | 1993-04-06 | 1994-10-18 | Japan Synthetic Rubber Co Ltd | ポジ型感放射線性樹脂組成物 |
JPH0772622A (ja) * | 1993-09-06 | 1995-03-17 | Japan Synthetic Rubber Co Ltd | ポジ型感放射線性樹脂組成物 |
JPH07271022A (ja) * | 1994-03-31 | 1995-10-20 | Fuji Photo Film Co Ltd | ポジ型フオトレジスト組成物 |
JPH07306532A (ja) * | 1994-05-12 | 1995-11-21 | Fuji Photo Film Co Ltd | ポジ型感放射線性樹脂組成物 |
JPH07333843A (ja) * | 1994-06-13 | 1995-12-22 | Nippon Oil Co Ltd | ポジ型感光性樹脂組成物 |
Non-Patent Citations (1)
Title |
---|
See also references of EP0831370A4 * |
Also Published As
Publication number | Publication date |
---|---|
EP0831370A4 (en) | 1999-08-18 |
EP0831370A1 (en) | 1998-03-25 |
KR19980701463A (ko) | 1998-05-15 |
US6013407A (en) | 2000-01-11 |
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