WO1995001659A1 - Element de circuit non reciproque - Google Patents

Element de circuit non reciproque Download PDF

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Publication number
WO1995001659A1
WO1995001659A1 PCT/JP1994/001059 JP9401059W WO9501659A1 WO 1995001659 A1 WO1995001659 A1 WO 1995001659A1 JP 9401059 W JP9401059 W JP 9401059W WO 9501659 A1 WO9501659 A1 WO 9501659A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit device
center electrode
reciprocal circuit
multilayer substrate
holding
Prior art date
Application number
PCT/JP1994/001059
Other languages
English (en)
Japanese (ja)
Inventor
Hiroki Dejima
Takashi Hasegawa
Yutaka Ishiura
Yoshikazu Chigodou
Hiroshi Matsui
Keiji Ogawa
Original Assignee
Murata Manufacturing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co., Ltd. filed Critical Murata Manufacturing Co., Ltd.
Priority to KR1019950700468A priority Critical patent/KR0174636B1/ko
Priority to EP94919825A priority patent/EP0664573B1/fr
Priority to DE69428421T priority patent/DE69428421T2/de
Publication of WO1995001659A1 publication Critical patent/WO1995001659A1/fr
Priority to FI950884A priority patent/FI114584B/fi
Priority to NO19950729A priority patent/NO311391B1/no

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/32—Non-reciprocal transmission devices
    • H01P1/38—Circulators
    • H01P1/383—Junction circulators, e.g. Y-circulators
    • H01P1/387—Strip line circulators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/18—Waveguides; Transmission lines of the waveguide type built-up from several layers to increase operating surface, i.e. alternately conductive and dielectric layers

Definitions

  • the present invention relates to a non-reciprocal circuit device used in the VHF, UHF, and SHF bands, for example, a circuit device such as a circuit device or an isolator device. Reduce the power of the system.
  • non-reciprocal circuits such as a relay and a circuit have a function of passing signals only in the transmission direction and blocking transmission in the reverse direction. It is an indispensable stand for the transmission circuit part of mobile intercom equipment such as mobile phones and T17 ⁇ . In such applications, the size and weight of the non-reciprocal circuit element n must be reduced. In addition, lower prices are required to stimulate demand. In order to meet such demands, a center electrode is added to the dielectric substrate.
  • FIG. 8 mainly shows the structure of the body plate.
  • the conventional circuit unit has a dielectric substrate 1 inside the metal jokes 101.
  • ferries 1 and 104 and magnets 106 are arranged.o
  • the ferrites 104 interpose the ground plate 105. Connected to the bottom of the yoke 104. Dielectric paste 1
  • Reference numerals 07 to 109 are arranged at positions where the center electrode 102 formed on the substrate faces the ferrite 104.
  • the magnet 106 is attached to the inside of the yoke 101 so as to face the center electrode 102.
  • the magnet 106 applies a DC magnetic field to the light 104.
  • the center electrode 102, the capacitor electrode 110, and the earth electrode 111 are formed in a laminate of three dielectric S plates 107 to 109. It has been done.
  • This laminated substrate is manufactured by the following process. First, after sintering the ceramic green sheet to form each of the substrates 107 to 109, one of the main surfaces of each of the substrates 107 to 109 is formed. The center electrode 102, the capacitor electrode 110, and the earth electrode 111 are patterned on the other side, and the ground electrode 111 is formed on the other main surface. Perform attachment processing. Then, the dielectric substrates 107 to 109 on which the electrodes are formed are laminated and pressed.
  • the ground electrodes 11 1 and 11 2 are connected to each other using the through-hole electrode 11.
  • An external electrode 114 connected to the input / output terminal is formed on each capacitor electrode 110.
  • the matching electrode is constituted by the capacitor electrode 110, each of the dielectric substrates 107 to 109, and the earth electrode 112.
  • This conventional circuit design is based on the fact that matching capacitors are formed around the three center poles 102 that intersect each other. In this way, the size of the entire component is reduced.
  • the capacitance of the capacitor electrode 110 is defined by the opposing surface of the capacitor electrode 110 and the anode electrode 112. For this reason, if the required capacitance value becomes large, it is necessary to increase the electrode size of the capacitance electrode 110. Accordingly, the board area of each of the dielectric boards 107 to 109 increases, and as a result, the total rest of the parts increases. In other words, the required capacitance value limits the size of the component.
  • An object of the present invention is to provide a non-reciprocal circuit device capable of downsizing components.
  • a non-reciprocal circuit device intersects with a multilayer substrate in which a plurality of dielectric layers are stacked and is formed in the multilayer substrate and is electrically insulated from each other. And a plurality of center electrodes formed in a multilayer substrate.
  • a matching capacitor having a plurality of capacitors connected to each center electrode, a magnetic body provided facing the center electrode, and a magnet for applying a DC magnetic field to the magnetic body
  • the matching capacitance is determined by appropriately setting the number of the fi: parts that are JSJ-formed in the multilayer substrate. As a result, the required capacitance value can be secured.
  • Another object of the present invention is to provide a non-reciprocal circuit device capable of reducing the size of components and reducing the cost of components.
  • a nonreciprocal circuit device is formed by integrally firing a number of dielectric layers each having a multilayer substrate.
  • the multilayer substrate is integrally formed by a single firing step. Therefore, the number of firing steps is reduced as compared with the above-described conventional non-reversible circuit element, and the manufacturing cost is reduced.
  • a first holding portion for holding the magnetic body at a position facing the center electrode is formed in the multilayer substrate.
  • the magnetic body is held by the first holding unit.
  • the magnetic material is the first substrate of the multilayer substrate.
  • the relative position to the center electrode is automatically set by mounting on the holding part. Therefore, a complicated positioning step is omitted, and the production can be reduced.
  • a second holding portion for holding the magnet at a position corresponding to the block is formed in the middle, and the magnet is held in the second holding portion.
  • the plurality of center electrodes may be formed at different heights in the multilayer substrate.
  • the multilayer substrate is obtained by using the integrated firing technique.
  • the plurality of center electrodes may be formed on the surface of the dielectric layer.
  • the center electrode is formed on the first dielectric layer on one surface of one dielectric layer in the substrate, on the other surface: a second electrocardiogram arranged on the other surface, and formed on the dielectric layer.
  • it may be configured to include a bracket and a through-hole conducting section for electrically connecting the second pole section.
  • a through-hole conductive portion is formed on one dielectric layer, and the upper and lower surfaces of the dielectric layer are formed on one dielectric layer, which is obtained by a multilayer M-plate body firing technique.
  • the first and second center electrode portions may be formed.
  • the first and second center electrode portions may be formed by a dielectric having a through-hole conductive portion formed thereon.
  • a first center electrode portion may be formed on one surface of the body layer, and a second center electrode portion may be formed on one surface of another dielectric layer that is in contact with the other surface of the dielectric layer.
  • FIG. 1 is an exploded perspective view showing the formation of a circuit according to an embodiment of the present invention I j.
  • FIG. 2 is a sectional view showing the structure of the circuit shown in FIG. 1.
  • FIG. 3 is an exploded perspective view showing the configuration of the multilayer board of the circuit board of the first embodiment.
  • FIG. 4 is an explanatory diagram for explaining Tachibana Shige of the multilayer substrate shown in FIG.
  • FIG. 5 is an exploded perspective view showing a configuration of a storage device according to a second embodiment of the present invention.
  • FIG. 6 is a cross-sectional view showing the structure of the circuit of the second embodiment.
  • FIG. 7 is a perspective view for explaining a main part of a storage device according to a modification of the present invention. :
  • FIG. 8 is an exploded perspective view showing the structure of a conventional circuit board.
  • FIG. 9 is a sectional view showing the structure of a conventional circuit.
  • the circuit 1 has a multilayer substrate 3 and a lower yoke 2 and an upper yoke 6.
  • the lower yoke 2 and the upper yoke 6 are made of magnetic suspension and have a box-like shape that wraps around the multilayer base plate 3 from above and below.
  • the multilayer board 3 has a first recess 26 for receiving the ferrite 4 and a second recess 25 for receiving the permanent magnet 5 in the upper portion of the upper yoke 6 side. And convex portions 7 and 7 are formed at both ends on the lower yoke 2 side.
  • the projections 7 and 7 are connected to the upper yoke 6 so that the external electrodes 8a to 8c and 9a to 9c serving as input / output terminals and ground terminals are exposed to the outside. It protrudes from the question with the lower yoke2.
  • the external electrodes 8a to 8c and 9a to 9c are connected to the electrode lines of the circuit board. .
  • Ferrite 4 is mounted in second concave portion 26 in multilayer substrate 3. Further, the permanent magnet 5 is mounted in the second concave portion 25 at the upper part of the ferrite 4 with the ground plate 27 interposed therebetween.
  • the multilayer board 3 is a sintered body formed by integrally firing a large number of dielectric calendars. Each electrode is provided inside the sintered body. Is buried.
  • the multilayer plate 3 is mainly classified into six layers L1 to L6.
  • the layer L1 has a second concave portion 25 for receiving the water magnet 5, and is composed of, for example, two first dielectric sheets 12. In the center of the first dielectric sheet 12, a hole 12 a having a size capable of receiving the permanent magnet 5 is formed.
  • 2 ML 2 has a first concave portion 26 for receiving the ferrite 4, and is formed by, for example, two second dielectric sheets 13. Has been done. 2nd dielectric sheet 1
  • the third layer L 3 is mainly used to form a matching capacitor, and the third dielectric sheet on which the electrode 14 a is formed is formed.
  • the ground electrode 14a is formed on almost the entire surface of the third dielectric sheet 14 except for the central portion thereof, and is externally led out to one side edge of the third dielectric sheet 14. It has two external lead-out portions 1b on the other side edge of the portion 14b. 'These external sources 14b are connected to external 8b, 9a, and 9c, respectively.
  • the yori electrodes 15a15c are uniformly arranged on the surface of the fourth dielectric sheet 15 at an interval of 120 degrees from each other. Then, one capacitor electrode, for example, 15a, and one dielectric sheet 1 are provided, and the combination of 15 and one ground electrode 14a is one. Is composed of two capacitors
  • the third layer L3 a large number of such capacitance portions are stacked.
  • the number of stacked capacitors is set according to the required capacitance value of the matching capacitor.
  • the fourth layer L4 is formed of the third dielectric sheet 16 having the central electrode 16a formed thereon.
  • the five dielectric sheets 16 also serve as the dielectric material forming the above-mentioned m part.
  • Each central electrode 16a has two lines extending parallel to the center on the surface of the fifth dielectric sheet 16.
  • Each of the center electrodes 16a formed in the three fifth body sheets 16 to 16 intersect each other at an angle of 120 degrees with each other.
  • One of the center electrodes 16a, which is arranged on the body sheet, is connected to one end of each of the center electrodes 16a, in contact with one of the capacitor electrodes 16b constituting the upper one of the capacitor portions. The other end of the center electrode 16a is connected to one pole 16c.
  • An externally derived electrode 16 d is formed on each capacitance electrode 16 b.
  • Each of the lead electrodes 16 d is in contact with the external poles 8 a, 8 c, and 9 b, respectively.
  • external leads 16e formed on each of the ground electrodes 16c are connected to the external electrodes 8b, 9a, and 9c, respectively.
  • the fifth layer L5 is formed by laminating a plurality of fourth inductor sheets 14 each having the ground electrode 14a formed thereon. 4 indicates that the electrode 14a is facing downwards.
  • the sixth L 6 is a part constituting the two convex portions 7 and 7.
  • a plurality of strip-shaped ceramic sheets 23 and 24 are stacked. Electrodes 8a 'to 8c', corresponding to external electrodes 8a to 8c and 9a to 9c, respectively, are provided on the outer surface of each ceramic mix 23 and 24. 9a 'to 9c' are formed.
  • the plurality of capacitance electrodes 15a and 16b formed in the third fL3 are connected in the stacking direction via the through-hole electrode 20. .
  • the capacitive electrodes 15b, 16b and the capacitive electrodes 15c, 16b are connected in the stacking direction via the through-hole poles 20, 20, respectively. It has been.
  • the plurality of earth electrodes 14a are connected in the stacking direction via the through-hole electrodes 21.
  • the respective capacitance sections formed in the third layer L3 are connected in parallel for each of the center electrodes 16a to form respective matching capacitors.
  • the electrodes 8a, 8c and 9b formed on the sixth layer L6 are connected to the capacitance electrodes 16d to 16d, respectively, as described above.
  • the multi-layer substrate 3 having the following is manufactured as follows. First, from a slurry in which a dielectric ceramic 'powder and an organic binder are mixed, for example, the material is flexible depending on the extruded shape. A ceramic green sheet is formed and cut to the specified dimensions. Next, electrodes such as Cu, Pd, Pt, and Ag are printed on the surface of a ceramic green sheet with a thickness of about several tens of meters / m. Alternatively, a pattern is formed using a vapor deposition method or the like. Then, after stacking the dielectric sheets in the order shown in Fig.
  • the laminate is formed by firing at a high temperature "5.
  • the ceramic sheets 23, 24 constituting the projections 7, 7 are also fired at the same time.
  • a multilayer substrate 3 is formed in which the dielectric sheet and each electrode are integrally fired.
  • the first and second recesses 25 and 26 for inserting the permanent magnet 5 and the ferrite are provided in advance in the ceramic green sheet. It may be formed and fired, or the upper surface of the integrally fired multilayer substrate 3 may be cut and formed.
  • First, in the assembling process first, in the first and second concave portions 25 and 26 of the multilayer substrate 3, the flute 4, the ground plate 27 and the permanent magnet 5 are inserted. After inserting, the lower yoke 2 and the upper yoke 6 are assembled to complete.
  • the ferrite 4 and the permanent magnet 5 are positioned at predetermined positions facing the center electrode 16a by the first and second concave portions 25 and 26 formed in advance. It is automatically positioned at Then, the permanent magnet 5 applies a DC magnetic field to the ferrite 4.
  • the first embodiment of the present invention has the following features.
  • the matching capacitor is not formed by connecting a plurality of capacitor units stacked in the third layer L3 of the multilayer substrate 3 in parallel. Therefore, when the required capacitance value is very large, it can be dealt with by increasing the number of stacked capacitance portions. In this case, since the thickness of each dielectric sheet constituting the capacitance section is about several tens of micrometers, even if the number of stacked layers increases, the number of multilayer sheets increases. The rate at which the thickness of the entire plate 3 increases is extremely small. Therefore, the effect of reducing the planar area of the capacitance electrodes 15a and 16b constituting the capacitance portion contributes greatly to miniaturization of components.
  • the multi-layer S plate 3 is manufactured by forming a predetermined fibrous pole pattern on the surface of a plurality of ceramic green sheets and then firing for a while. . Therefore, the number of firing steps can be reduced and the manufacturing cost can be reduced as compared with the above-described conventional example which requires two firing steps. Is possible.
  • (3) The ferrite 4 and the permanent magnet 5 are positioned only by inserting them into the first and second recesses 25, 26 formed in advance on the upper surface of the multilayer board 3. . As a result, the step of positioning the ferrite or the permanent magnet required in the conventional example can be substantially omitted, and the assembling step is simplified. . This also makes it possible to reduce manufacturing costs.
  • the first recess 26 for receiving the ferrite 4 and the second recess 25 for receiving the permanent magnet 5 are formed coaxially and continuously on the upper surface of the multilayer substrate 3. It is. For this reason, the permanent magnet 5 and the light 4 are arranged close to each other. Generally, since the magnetic field of the permanent magnet 5 has a shape that spreads outward, the magnetic flux becomes weaker as the distance between the magnet and the fly increases. The closer it gets, the denser the magnetic flux. For this reason, in the configuration of this embodiment in which the distance between the permanent magnet 5 and the ferrite 4 is short, the magnetic flux becomes dense, and even if the permanent magnet 5 having a lower magnetic force than the conventional example is used. Can perform the same function Example 2
  • the circuit arrangement of the circuit according to the second embodiment differs from that of the first embodiment in the arrangement of the ferrite and the permanent magnet 5. That is, as shown in FIG. 5 and FIG. 6, this solar cell module 50 is provided with the upper and lower surfaces facing the center electrode (not shown) of the calendar board 53. In the lower part, second recesses 55, 55 for receiving the permanent stones 5 and first recesses 56, 56 for receiving the ferrite 4 are formed. Permanent magnets 5 and 5 are mounted in each second recess 55, and ferrites 1, 4, and 4 are mounted in the first recess 56 via a ground plate 27.
  • Each of the center electrodes in the multi-plate 53 is sandwiched from above and below by a pair of ferrites 4 so that a force and a pair
  • a pair of ferrites 4 which is configured so that a bias magnetic field is applied to the upper and lower surfaces by the permanent magnet 5, especially in the first embodiment
  • the circuit is described as an example of a nonreciprocal circuit element.
  • the configuration of the present invention is applicable to an isolator circuit. It is also possible. In the case of the application to the isolating operation, it is realized by connecting a terminating resistor to any one of the three center electrodes 16a and one of the lead electrodes 16d.
  • the multilayer substrate 3 it is formed in the multilayer substrate 3.
  • the respective capacitor electrodes and ground electrodes were connected via a through-hole electrode, but instead of the through-hole electrode, they were connected to the side of the dielectric sheet.
  • the electrodes may be formed and connected between the electrodes.
  • the central electrodes of the number of expulsions are formed on different dielectric layers, but a plurality of central electrodes in the present invention use the same dielectric sheet. It is also possible to form it. Such a modification will be described with reference to FIG.
  • the dielectric sheet 61 in FIG. 7 corresponds to a structure used in place of the three fifth dielectric sheets 16 shown in FIG.
  • First central electrode portions 62 a to 67 a are formed in the central region of the upper surface of dielectric sheet 61. These six first central electrode portions 62a to 67a are classified into three groups, with a pair of first central electrode portions extending parallel to each other as one group. You. For example, the first center electrode portion '62a and the first center electrode portion 63a constitute one group, and the first center electrode portion 6a constitutes one group. 2a has a longer length than the other first center electrode portion 63a.
  • first center electrode portions constituting each group are electrically connected to fan-shaped electrode portions 68 to 70 with the center side missing.
  • the dielectric sheet 61 has Through-hole conductive part 7! ⁇ 73 are formed.
  • the through-hole conductive portions 71 to 73 are formed by filling the through holes with a conductive material.
  • the electrode portions 68 to 70 are drawn out to the iffi below the dielectric sheet 61 by the through-hole conductive portions 71 to 73.
  • a through-hole conductive portion 74 is formed at the tip of each of the plurality of center electrode portions 62a to 67a.
  • the lower electrode shape is projected downward to clarify the lower electrode shape.
  • second center electrode portions 62b to 67b are formed at the center.
  • Each of the second center electrode portions 62 b to 67 b is electrically connected to the corresponding first center electrode portion via the above-described through-hole conductive portion 74, respectively.
  • the second center electrode portion 62b is electrically connected to the first center electrode portion 62a on the upper surface side through the through-hole conductive portion 74, and Thus, one central electrode is formed.
  • the other first and second center electrode portions are also electrically connected to each other through the through-hole conductive portion, and each of them forms a center electrode.
  • each center electrode is formed using the upper surface and the lower surface of one dielectric sheet 61, and the dielectric sheet 61
  • Each of the plurality of center electrodes crossed in the central region is configured using the upper and lower surfaces of a single dielectric sheet 61. Sand That is, the plurality of center electrodes are not separated via the dielectric layer in the multilayer substrate.
  • the tip portion connected to the through-hole conductive portion 74 of the second center electrode portion 62-b-67'b and the portion on the opposite side are: It is pneumatically connected to the earth electrode 77 formed around si. Further, in the earth electrode 77, a plurality of notches 78 opened toward the central region are formed. Each notch 78 is electrically connected to the through-hole conductive portions 71 to 73 electrically connected to the electrode portions 68 to 70 and the earth electrode 77. Established to prevent connection.
  • Through-hole conductive part 7! To 73 are electrically connected to the through-hole conductive portion 20 shown in FIG.
  • the earth electrode 77 is electrically connected to a through-hole conductive portion 21 (see FIG. 3) disposed below as shown by a dashed circle.
  • the above electrode structure is provided on the upper surface and the lower surface of one dielectric sheet 61, but the electrode structure on the lower side of the dielectric sheet 61 is provided.
  • the dielectric sheet may be formed on the upper surface of another dielectric sheet placed on the lower surface of the dielectric sheet 61.
  • the electrode structure in the present modified example can be divided into a plurality of dielectric sheets as long as it can be connected by the through-hole conductive portion. Good.

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  • Non-Reversible Transmitting Devices (AREA)
  • Amplifiers (AREA)

Abstract

Ledit élément peut être miniaturisé quelle que soit la valeur de la capacité adaptée. Un circulateur (1) est doté d'une carte (3) multicouche destinée à former une électrode centrale (16a) et d'adapter la capacité. Ladite carte (3) multicouche est produite par stratification d'une pluralité de feuilles diélectriques sur lesquelles l'électrode centrale ou l'électrode d'adaptation de capacité est formée, et en leur brûlage intégral. Le condensateur d'adaptation possède une structure résultant de la connexion en parallèle des condensateurs formés par stratification d'un grand nombre de feuilles diélectriques pincées par une paire d'électrodes capacitives. Sur la surface supérieure de la carte (3) multicouche, un premier évidement (26) destiné à recevoir la ferrite (4) et un second évidement (25) destiné à recevoir un aimant permanent (5) sont formés à des emplacements faisant face à l'électrode centrale (16a). La ferrite (4) et l'aimant permanent (5) sont installés respectivement dans ces évidements.
PCT/JP1994/001059 1993-06-30 1994-06-29 Element de circuit non reciproque WO1995001659A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1019950700468A KR0174636B1 (ko) 1993-06-30 1994-06-29 비가역 회로 소자
EP94919825A EP0664573B1 (fr) 1993-06-30 1994-06-29 Element de circuit non reciproque
DE69428421T DE69428421T2 (de) 1993-06-30 1994-06-29 Nicht-reziprokes schaltungselement
FI950884A FI114584B (fi) 1993-06-30 1995-02-27 Ei-resiprookkinen piirielementti
NO19950729A NO311391B1 (no) 1993-06-30 1995-02-27 Kretselement med ikkeresiprok respons

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5/161736 1993-06-30
JP16173693 1993-06-30

Publications (1)

Publication Number Publication Date
WO1995001659A1 true WO1995001659A1 (fr) 1995-01-12

Family

ID=15740914

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1994/001059 WO1995001659A1 (fr) 1993-06-30 1994-06-29 Element de circuit non reciproque

Country Status (7)

Country Link
EP (1) EP0664573B1 (fr)
KR (1) KR0174636B1 (fr)
CN (1) CN1041256C (fr)
DE (1) DE69428421T2 (fr)
FI (1) FI114584B (fr)
NO (1) NO311391B1 (fr)
WO (1) WO1995001659A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2709874A1 (fr) * 1992-08-05 1995-03-17 Murata Manufacturing Co Elément de circuit non réciproque à haute fréquence.
US6107895A (en) * 1996-04-03 2000-08-22 Deltec Telesystems International Limited Circulator and components thereof

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3264193B2 (ja) * 1995-11-27 2002-03-11 株式会社村田製作所 非可逆回路素子
JP3125693B2 (ja) * 1996-11-14 2001-01-22 株式会社村田製作所 非可逆回路素子
US6731183B2 (en) 2000-03-27 2004-05-04 Hitachi Metals, Ltd. Non-reciprocal circuit device and wireless communications equipment comprising same
US20240313380A1 (en) * 2023-03-17 2024-09-19 Ttm Technologies, Inc. Folded circulator device with coupling elements and flex connections for interconnects and methods of fabricating the circulator device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02203602A (ja) * 1989-02-01 1990-08-13 Nippon Ferrite Ltd 集中定数型アイソレータ
JPH02134711U (fr) * 1989-04-13 1990-11-08
JPH0386608U (fr) * 1989-12-22 1991-09-02
JPH0425302U (fr) * 1990-06-25 1992-02-28
JPH05136572A (ja) * 1991-11-15 1993-06-01 Matsushita Electric Ind Co Ltd 多層セラミツク基板の製造方法
JPH05299904A (ja) * 1992-04-17 1993-11-12 Murata Mfg Co Ltd 非可逆回路素子およびその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59005125D1 (de) * 1990-05-12 1994-04-28 Hegenscheidt Gmbh Wilhelm Verfahren zum Profilieren oder Reprofilieren von Eisenbahnrädern durch zerspanende Bearbeitung.

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02203602A (ja) * 1989-02-01 1990-08-13 Nippon Ferrite Ltd 集中定数型アイソレータ
JPH02134711U (fr) * 1989-04-13 1990-11-08
JPH0386608U (fr) * 1989-12-22 1991-09-02
JPH0425302U (fr) * 1990-06-25 1992-02-28
JPH05136572A (ja) * 1991-11-15 1993-06-01 Matsushita Electric Ind Co Ltd 多層セラミツク基板の製造方法
JPH05299904A (ja) * 1992-04-17 1993-11-12 Murata Mfg Co Ltd 非可逆回路素子およびその製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP0664573A4 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2709874A1 (fr) * 1992-08-05 1995-03-17 Murata Manufacturing Co Elément de circuit non réciproque à haute fréquence.
US6107895A (en) * 1996-04-03 2000-08-22 Deltec Telesystems International Limited Circulator and components thereof
US6317010B1 (en) 1996-04-03 2001-11-13 Deltec Telesystems International Limited Thermostable circulator with the magnetic characteristics of the ferrite and magnet correlated

Also Published As

Publication number Publication date
CN1041256C (zh) 1998-12-16
EP0664573B1 (fr) 2001-09-26
KR0174636B1 (ko) 1999-04-01
FI950884A0 (fi) 1995-02-27
KR950703213A (ko) 1995-08-23
NO311391B1 (no) 2001-11-19
NO950729L (no) 1995-02-27
DE69428421D1 (de) 2001-10-31
CN1111075A (zh) 1995-11-01
FI114584B (fi) 2004-11-15
DE69428421T2 (de) 2002-05-23
EP0664573A1 (fr) 1995-07-26
EP0664573A4 (fr) 1996-11-20
FI950884A (fi) 1995-02-27
NO950729D0 (no) 1995-02-27

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