WO1991009511A3 - Conducteurs electriques en resine conductrice - Google Patents

Conducteurs electriques en resine conductrice Download PDF

Info

Publication number
WO1991009511A3
WO1991009511A3 PCT/GB1990/001973 GB9001973W WO9109511A3 WO 1991009511 A3 WO1991009511 A3 WO 1991009511A3 GB 9001973 W GB9001973 W GB 9001973W WO 9109511 A3 WO9109511 A3 WO 9109511A3
Authority
WO
WIPO (PCT)
Prior art keywords
conductors
hole
substrate
applying
resin
Prior art date
Application number
PCT/GB1990/001973
Other languages
English (en)
Other versions
WO1991009511A2 (fr
Inventor
John Michael Lowe
Original Assignee
Technology Applic Company Limi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technology Applic Company Limi filed Critical Technology Applic Company Limi
Publication of WO1991009511A2 publication Critical patent/WO1991009511A2/fr
Publication of WO1991009511A3 publication Critical patent/WO1991009511A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0257—Brushing, e.g. cleaning the conductive pattern by brushing or wiping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/054—Continuous temporary metal layer over resist, e.g. for selective electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

Des procédés d'application d'un conducteur électrique en résine époxy conductrice consistent à appliquer la résine à un substrat; à appliquer un agent de réserve sur une partie des conducteurs (14) laissant des plots de contact exposés (16); à appliquer, au moyen par exemple d'une encre polymère d'impression, des conducteurs temporaires (20) au substrat (10) reliés aux zones (16); à immerger le substrat dans un bain électrolytique et à faire passer un courant électrique dans les conducteurs (20) pour déposer une couche métallique conductrice à laquelle la soudure peut adhérer au niveau des plots de contact (16). Les conducteurs (20) sont ensuite enlevés. Lors du placage à travers les trous pour relier les conducteurs de part et d'autre du substrat (10), on applique une première région de résine (26) sur un trou (24), de la résine (26a) est insufflée dans le trou (24) et une deuxième couche de résine (28) est appliquée sur la surface opposée de la carte, et le matériau (28a) provenant de cette deuxième couche est insufflé dans le trou (24) pour venir en contact avec le matériau (26a) afin de créer une voie électriquement conductrice qui traverse le trou (24).
PCT/GB1990/001973 1989-12-19 1990-12-18 Conducteurs electriques en resine conductrice WO1991009511A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB898928640A GB8928640D0 (en) 1989-12-19 1989-12-19 Electrical conductors of conductive resin
GB8928640.5 1989-12-19

Publications (2)

Publication Number Publication Date
WO1991009511A2 WO1991009511A2 (fr) 1991-06-27
WO1991009511A3 true WO1991009511A3 (fr) 1991-10-03

Family

ID=10668166

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB1990/001973 WO1991009511A2 (fr) 1989-12-19 1990-12-18 Conducteurs electriques en resine conductrice

Country Status (3)

Country Link
AU (1) AU6966191A (fr)
GB (1) GB8928640D0 (fr)
WO (1) WO1991009511A2 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE246847T1 (de) * 1997-09-19 2003-08-15 Peter Vernon Planarantennenanordnung
GB2336161B (en) * 1998-04-06 2003-03-26 John Michael Lowe Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
US6939447B2 (en) 1998-04-06 2005-09-06 Tdao Limited Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
KR100492498B1 (ko) * 2001-05-21 2005-05-30 마츠시다 덴코 가부시키가이샤 프린트 배선판의 제조 방법
US9623951B2 (en) 2013-08-21 2017-04-18 Goodrich Corporation Heating elements for aircraft heated floor panels

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB574946A (en) * 1942-11-05 1946-01-28 Standard Telephones Cables Ltd Improvements in or relating to electrically insulating plates provided with a systemof electrical connections
FR2425790A1 (fr) * 1978-05-08 1979-12-07 Limours Const Meca Elect El Perfectionnements aux circuits imprimes et a leurs procedes de fabrication
GB2038101A (en) * 1978-12-19 1980-07-16 Standard Telephones Cables Ltd Printed circuits
GB2109638A (en) * 1981-11-11 1983-06-02 Greenwoods Electronics Manufac Printed circuit boards
DE3245458A1 (de) * 1982-12-08 1984-06-14 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von durchkontaktierungen in dickschichttechnik
EP0140585A1 (fr) * 1983-09-30 1985-05-08 Electro Materials Corp. Of America Procédé pour la fabrication d'un film conducteur d'électricité soudable et composition conductrice d'électricité
DE3430290A1 (de) * 1984-08-17 1986-02-27 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zur selektiven metallisierung
US4581301A (en) * 1984-04-10 1986-04-08 Michaelson Henry W Additive adhesive based process for the manufacture of printed circuit boards

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB574946A (en) * 1942-11-05 1946-01-28 Standard Telephones Cables Ltd Improvements in or relating to electrically insulating plates provided with a systemof electrical connections
FR2425790A1 (fr) * 1978-05-08 1979-12-07 Limours Const Meca Elect El Perfectionnements aux circuits imprimes et a leurs procedes de fabrication
GB2038101A (en) * 1978-12-19 1980-07-16 Standard Telephones Cables Ltd Printed circuits
GB2109638A (en) * 1981-11-11 1983-06-02 Greenwoods Electronics Manufac Printed circuit boards
DE3245458A1 (de) * 1982-12-08 1984-06-14 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von durchkontaktierungen in dickschichttechnik
EP0140585A1 (fr) * 1983-09-30 1985-05-08 Electro Materials Corp. Of America Procédé pour la fabrication d'un film conducteur d'électricité soudable et composition conductrice d'électricité
US4581301A (en) * 1984-04-10 1986-04-08 Michaelson Henry W Additive adhesive based process for the manufacture of printed circuit boards
DE3430290A1 (de) * 1984-08-17 1986-02-27 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zur selektiven metallisierung

Also Published As

Publication number Publication date
AU6966191A (en) 1991-07-18
WO1991009511A2 (fr) 1991-06-27
GB8928640D0 (en) 1990-02-21

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