WO1990010089A1 - Nouvelle substance non monocristalline contenant de l'iridium, du tantale et de l'aluminium - Google Patents
Nouvelle substance non monocristalline contenant de l'iridium, du tantale et de l'aluminium Download PDFInfo
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- WO1990010089A1 WO1990010089A1 PCT/JP1990/000258 JP9000258W WO9010089A1 WO 1990010089 A1 WO1990010089 A1 WO 1990010089A1 JP 9000258 W JP9000258 W JP 9000258W WO 9010089 A1 WO9010089 A1 WO 9010089A1
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- 239000000126 substance Substances 0.000 title claims abstract description 80
- 229910052715 tantalum Inorganic materials 0.000 title claims abstract description 24
- 229910052741 iridium Inorganic materials 0.000 title claims abstract description 22
- 229910052782 aluminium Inorganic materials 0.000 title abstract description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title abstract description 6
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 title abstract description 6
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 title abstract description 6
- 239000000463 material Substances 0.000 claims description 51
- 239000013078 crystal Substances 0.000 claims description 41
- 239000000203 mixture Substances 0.000 claims description 37
- 239000011248 coating agent Substances 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 17
- 230000008859 change Effects 0.000 claims description 16
- 239000002178 crystalline material Substances 0.000 claims description 8
- HEAUFJZALFKPBA-JPQUDPSNSA-N (3s)-3-[[(2s,3r)-2-[[(2s)-6-amino-2-[[(2s)-2-amino-3-(1h-imidazol-5-yl)propanoyl]amino]hexanoyl]amino]-3-hydroxybutanoyl]amino]-4-[[(2s)-1-[[(2s)-1-[[(2s)-1-[[2-[[(2s)-1-[[(2s)-1-amino-4-methylsulfanyl-1-oxobutan-2-yl]amino]-4-methyl-1-oxopentan-2-yl]amin Chemical compound C([C@@H](C(=O)N[C@H](C(=O)NCC(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](CCSC)C(N)=O)C(C)C)NC(=O)[C@H](CO)NC(=O)[C@H](CC(O)=O)NC(=O)[C@@H](NC(=O)[C@H](CCCCN)NC(=O)[C@@H](N)CC=1NC=NC=1)[C@@H](C)O)C1=CC=CC=C1 HEAUFJZALFKPBA-JPQUDPSNSA-N 0.000 claims description 7
- 101800000399 Neurokinin A Proteins 0.000 claims description 7
- 102100024304 Protachykinin-1 Human genes 0.000 claims description 7
- 229910052721 tungsten Inorganic materials 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims description 4
- 229910052702 rhenium Inorganic materials 0.000 claims description 4
- 229910052707 ruthenium Inorganic materials 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- -1 Μο> s Inorganic materials 0.000 claims description 2
- 229910001369 Brass Inorganic materials 0.000 claims 3
- 239000010951 brass Substances 0.000 claims 3
- 229910052735 hafnium Inorganic materials 0.000 claims 2
- 229910052750 molybdenum Inorganic materials 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 230000005294 ferromagnetic effect Effects 0.000 claims 1
- 229910052758 niobium Inorganic materials 0.000 claims 1
- 239000010408 film Substances 0.000 description 74
- 238000004519 manufacturing process Methods 0.000 description 33
- 238000012360 testing method Methods 0.000 description 32
- 239000007788 liquid Substances 0.000 description 30
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- 239000000956 alloy Substances 0.000 description 20
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- 238000005187 foaming Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
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- 239000000470 constituent Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
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- 230000005070 ripening Effects 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
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- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
- 241000380873 Algon Species 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- 241000287463 Phalacrocorax Species 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
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- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
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- C—CHEMISTRY; METALLURGY
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- C22C—ALLOYS
- C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
- C22C27/02—Alloys based on vanadium, niobium, or tantalum
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- C—CHEMISTRY; METALLURGY
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/12819—Group VB metal-base component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12875—Platinum group metal-base component
Definitions
- the present invention is based on new strength characteristics such as chemical stability, electrochemical stability, oxidizing property, Si solubility, S ripening, S thermal shock resistance, and mechanical strength.
- the essential non-single-crystal K materials are Ir, Ta & A £.
- the present invention also relates to a novel member having the non-single crystalline material as a coating functioning in close contact with a support. These non-single-crystal materials and members not provided by the present invention can be used effectively in various G applications. Background of the Invention
- a conventional inorganic material generally called a non-single-crystal alloy or a non-single-crystal metal material is a solid material which is solidified from a molten state in which a certain amount is mixed. It is often manufactured by cooling at a high cooling rate and then used after forming.
- the inorganic material may be produced by pulverizing the component elements, mixing uniformly, and then performing pressure sintering at an appropriate temperature. Further, the inorganic material is subjected to rapid cooling and solidification by lowering the molten alloy on a metal plate and adjusting the temperature change of the metal plate and the temperature of the atmosphere to give a high cooling rate as a whole.
- ⁇ - Melt quenching method for producing solid-phase solids or manufacturing by attaching and aggregating component elements that are heated and evaporated on a desired substrate O surface in a vessel pressurized to a sufficient vacuum. It may be manufactured by a vapor deposition method or the like.
- non-single crystalline alloys are produced by various production methods, and are used for many purposes today. These non-monocrystalline alloys are used in various fields after being formed into ribbons, wires, powders, granules, films, bulks, and other suitable shapes. .
- non-single-crystalline alloys disclosed in Japanese Patent Application Laid-Open No. 59-1989-96S71 is a constituent material of a heating resistor of a liquid jet recording apparatus.
- a Ta-A ⁇ alloy has been proposed as a material.
- This Ta-A alloy is relatively easy to form, is easy to take an amorphous state, has a high melting point, and has relatively excellent mechanical properties at high temperatures. For this reason, it is worth noting. However, in terms of chemical and electrochemical reactions, it does not sufficiently satisfy the conditions required for the constituent materials of recent various devices.o
- An object of the present invention is to provide a novel inorganic material that satisfies various requirements for materials used for manufacturing various devices.
- C Another object of the present invention is to provide chemical stability, Suitable for the manufacture of various devices due to its electrochemical stability, oxidation resistance, dissolution resistance, heat resistance, thermal shock resistance, abrasion resistance, mechanical strength and mechanical strength.
- a further object of the present invention is to provide excellent overall strength characteristics such as chemical stability, electrochemical stability, oxidation resistance, dissolution resistance, g heat resistance, thermal shock resistance, shochu abrasion resistance, and mechanical durability.
- iridium (Jr, counter (T a) and aluminum (A £)) which have excellent adhesion to the support and can be suitably used for manufacturing various devices, are required.
- An object of the present invention is to provide a novel non-single-crystalline substance contained as a component of the present invention.
- the present inventors have conducted research on Ta-alloys that have already been proposed in order to meet the requirements for providing new materials by adding the above-mentioned requirements required for constituent materials of recent various devices. And several materials composed of the three elements of iridium (Ir), tantalum (T a), and aluminum (A £) were fabricated, and these materials were examined. Thus, non-single-crystal substances containing Ir, T a, and A £ in specific composition ratios have chemical stability, electrochemical stability, oxidation resistance, dissolution resistance, All of the strength characteristics such as heat resistance, thermal shock resistance, abrasion resistance, and mechanical durability are added at a sufficiently high level, and the components of various devices are added. It was found that the member had no variation in characteristics and was able to withstand use for a long period of time, but was. The present invention has been completed based on this discovery.
- the non-single crystalline substance according to the present invention comprises three elements of iridium (Ir), tantalum (Ta), and aluminum (A) each having 28 to 9 elements.
- An amorphous (amorphous) substance, a polycrystalline (polycrystalline) substance or an amorphous substance containing 0 atom, 5 to 65 atom% and 1 to 45 atom% in composition ratio 7 scan ⁇ substance and the port Li click Li is te le product kappa are mixed ⁇ (hereinafter, will have a "non-single-crystal I r - - ⁇ 3 ⁇ ⁇ product kappa" or "a alloy I r Itcho a" ).
- the non-single-crystal I r —T a A £ ⁇ K is a novel substance K which has been developed by the present inventors through experiments.
- the present inventors have selected iridium (Ir) from the viewpoint of a substance that is rich in heat resistance and oxidation resistance and stable to chemical ⁇ ⁇ , has mechanical strength, and has solubility resistance.
- Tantalum (T a) is selected from the viewpoint of a substance that provides an oxide that is rich in oxides, and a material that provides an oxide that is rich in workability and adhesion, and that is rich in dissolution resistance. From the viewpoint, aluminum (A) was selected, and a plurality of non-single-crystal material samples having these three elements in a predetermined composition ratio were prepared by the sputtering method.
- a single crystal Si substrate and surface were prepared using the sputtering equipment shown in Fig. 2 (trade name: Sputtering equipment CFS-8EP, manufactured by Takada Seisakusho Co., Ltd.). Then, a film was formed by forming a film on a single-crystal Si substrate on which 2.5 Am 'Si02 was formed.
- reference numeral 201 denotes a film forming chamber.
- Reference numeral 202 denotes a substrate holder for holding a substrate 203 provided in a certain film chamber 201.
- the substrate holder 202 contains a heater (not shown) for heating the substrate 203.
- the board holder 202 is supported by a face-shift shaft 211 extending from a drive motor (not shown) installed outside the system, and is designed to be able to move up and down and face-turn.
- -A film-forming target is held at a position facing the substrate 203 in the film-forming chamber 201.
- O Target Holgo 205 is installed.
- 206 courage holder-S9.9% by weight or more placed on the surface of 205.
- A. Y1 'consisting of A. ⁇ ⁇ . 207 is an Ir coagent consisting of 'r paste with a purity of 9.9% by weight or more placed on gE on an A target.
- 203 is an Ir which is a Ta salt solution consisting of a purity of over 9.9% by weight placed on the A target.
- target target 2G and target target 2C'8 each of which has a predetermined area A ⁇ .
- Target 2 GG They are arranged at a predetermined interval on the plane.
- the respective areas and arrangements of the Ir target 2G7 and the target A and the target 20S are as desired.
- the relationship between the area ratios of the targets is determined in advance to determine how to obtain the target, a calibration curve is prepared, and the calibration is performed based on the fi curve.
- the shutter plate 204 is used in the following manner. That is, before the start of film formation, the shutter plate 204 holds the targets 20G, 207 and 208. -Move to the upper part of the target holder 205 and introduce an inert gas such as argon (Ar) gas into the film forming chamber 201 through the gas supply pipe 212.
- Ar argon
- RF power is applied from the RF power source 215 to convert the gas into plasma, and the generated plasma is used to sputter the targets 20 G, 207 and 208. To remove impurities on each surface of the target. Thereafter, the shutter plate 204 is moved to a position (not shown) that does not impair the film formation.
- the RF power supply 215 is electrically connected to the peripheral wall of the film forming chamber 201 via the conductor 216, and the target holder is also connected via the conductor 217. one It is electrically connected to 205.
- Reference numeral 214 denotes a matching box.
- the target honoreda 205 has a mechanism for partially circulating the cooling water so that the targets 206, 2C7 and 20S are maintained at a predetermined temperature during film formation. (Not shown) is provided.
- An exhaust pipe 210 for exhausting the inside of the film forming chamber O is provided in the film forming chamber 201, and the exhaust pipe is evacuated to a vacuum pump through an exhaust valve 211.
- c 2 0 2 you are communicating with (not shown), film formation chamber 2 0 ⁇ within 1 Honoré GORE Ngasu (a 1 ⁇ 'scan), f re U beam gas (H e gas) or the like scan of It is a gas supply pipe for introducing gas for gas ring.
- Reference numeral 213 denotes a flow rate control valve for the sputtering gas provided in the gas supply pipe.
- the insulator 219 provided between the two insulators is automatically detected by the vacuum gauge e provided in the film forming chamber 201 by the vacuum gauge e .
- one target holder is provided as described above, but a plurality of target holders _ may be provided. it can.
- the target holders are arranged concentrically and equidistantly at a position facing the substrate 203 in the film forming chamber 201, and the respective target holders are arranged.
- the independent RF power sources are electrically connected via a matching box.
- the target holders of 3 mm are arranged in a certain membrane chamber 201 as described above, and each evening target is arranged. Place each target on the holder dry.
- the composition ratio of the constituent elements of the film to be formed is changed to change the composition of the elements of ⁇ r, Ta and A.
- One or more films] A film changed in the S direction can be formed.
- Each sample O was prepared by using the apparatus shown in FIG.
- EPM-810 manufactured by Katsutsu Seisakusho Co., Ltd. was used for some of the samples obtained as described above, which were formed on a substrate with a Si02 film. Then, the composition of the sample was analyzed by Electron Bloom Mix Analysis, and then the sample formed on the Si single crystal substrate was manufactured by Max Science Co., Ltd. ⁇ The crystallinity was observed with an X-ray profilometer (trade name: MXP. The obtained results are summarized in Fig. 3. In other words, the case where the sample is polycrystalline is ⁇ The case where the sample is a polycrystalline substance and an amorphous material is indicated by X, and the case where the sample is an amorphous material is indicated by ⁇ .
- a liquid immersion test was conducted to observe the heat resistance and impact resistance in air using the remaining film formed on the SiO 2 film-coated substrate.
- a step stress test (SST) for observation was performed.
- the stove is a liquid consisting of 7 G parts by weight of water and 3 G parts by weight of ethylene glycol as a liquid for immersion, and sodium acetate 1 'rim G. 1 a-I
- the same method as in "Testing and testing for low-conductivity liquid ⁇ " was used, except that a wave body with a ⁇ /% was used.
- the SS is performed by the same method as the “Stebe stress test” described later.
- the preferred samples that are suitable for use are those in the range E of (a) (b ⁇ -ic>.
- the more preferred samples are those in the range of b), and the most preferred samples are found to be in the range of (a).
- the polycrystalline substance K is relatively large, and the polycrystalline substance and the amorphous substance K are mixed and the amorphous substance K and the amorphous substance K are mixed. And were found to be included. Then the preferred range mentioned above!
- the present inventors found that the non-single-crystal Ir-Ta-A-A substance K containing Ir, Ta, and ⁇ £ as essential components in the following composition ratios was excellent.
- chemical stability, electrochemical stability, ⁇ resistance assess the this that having a heat ⁇ resistance ⁇ Ki ya the Activity over sheet '® Ne b over di tio emission of e
- non-single crystal 1-T a ⁇ is a general meeting of chemical stability, electrochemical stability, ⁇ Rev S, thermal shock resistance, abrasion resistance, dramatic durability, etc.
- Non-single-crystal Ir-Ta-A-II material has excellent adhesion to the support, and a member having this material as a film can be used effectively for various purposes. I can get it.
- m m
- One embodiment of the present invention provides a non-single-crystal crystal which actually contains Ir, Ta and A, and the composition II, Ta and A £ in the following compositional table. You.
- Another embodiment of the present invention relates to a non-single crystal K ′ which is substantially composed of 1 r, Ta and A, and has Ir, Ta and A ⁇ in the following composition ratios: I will provide a.
- a further aspect of the present invention provides a non-single crystalline material substantially composed of Ir, Ta and A £, and containing Ir, Ta and A in the following composition ratio.
- the present inventors have determined that the above-mentioned specific non-single-crystal Ir-Ta-Ap product K (that is, amorphous (amorphous) Ir-Ta-Ap alloy, polycrystalline Ir-Ta-Ap alloy, r One T a —A alloy or a mixture of both)
- the following non-single crystal I r -T s -A ⁇ K was used. And confirmed.
- the anti-cavitation property, the anti-erosion property, the electrochemical and chemical stability, the heat resistance, the adhesion, the internal stress, etc. are not appropriate.
- an atmosphere, oxidizing atmosphere, or corrosive atmosphere sufficient g-endurance cannot be obtained when cavitation ⁇ -Jones thermal shock is applied.
- Ir is too large
- film peeling may occur.
- Ta or A £ is too large
- oxidation or corrosion may become severe.
- the non-single crystal 1 r-Ta-A substance provided by the present invention has chemical stability, electrochemical stability, oxidation resistance, dissolution resistance, heat resistance, thermal shock resistance, Since it has remarkably superior overall strength characteristics such as abrasion resistance and mechanical durability, it can be suitably used for various applications.
- it is suitable as a coating material for coating the surface of a Langmuir 'probe which is used by being subjected to severe environmental agitation such as a high-temperature plasma or a severe pressure change. Can be used.
- the non-single-crystal Ir-Ta-A compound of the present invention is generally used in the form of a single layer, but may be used in a multi-layer structure in some cases.
- a set of three elements constituting it namely, a set of I r, T a and ⁇
- a single-layer film composed of Honmei G non-single crystal I r -T a — ⁇ 3 ⁇ 4 is provided on a support
- a £ is distributed relatively more in the region on the support side.
- the adhesiveness between the layer composed of the film and the support is further improved.
- a film composed of the Ir-Ta-A ⁇ substance of the present invention is laminated on a support to form a two-layer structure, and the support-side layer is formed of the former.
- the adhesion between the layer provided on the support and the support is the same as in the former case. It is preferably secured.
- the upper surface of the layer may be oxidized by contact with the air or during the manufacturing process, but in the material according to the present invention, this is not the case. The effect is not diminished by such slight surface or internal oxidation.
- Such impurities may be at least selected from C,, S i, B, K a .. C £ and F e, including, for example, 0 from the oxidation described above.
- One element can be named f
- the non-monocrystalline substance according to the present invention can be prepared, for example, by DC or RF snow, in which the respective materials are simultaneously or alternately deposited, a 'foot method', an ion beam spatula. It can be formed by a film forming method such as a thick film method in which a paste containing an organic metal is applied and baked by a paste method, a vacuum evaporation method, a CVD method, or a paste containing an organic metal.
- the support to be used depends on the type of the device G.
- W, Re, Ta, ⁇ ; 0 s can be used.
- S i monocrystalline substrate ' manufactured by mosquitoes over Corp. (Wa down mosquitoes over Corp.) and 2.5 Wa) m thick S i 0 2 film over formed on the surface of ⁇ OS i single crystal substrate'
- a substrate substrate in the film forming chamber 201 of the above-described high frequency sputtering apparatus shown in FIG. 2 was used.
- a target A206 which is a high-purity raw material of 99.9% by weight or more, a T-amount 20 of similar purity.
- co-sputtering is performed under the following G conditions to obtain an alloy with a thickness of about 200 A.
- a layer was formed on the Si02 exhibition.
- Target area ratio A: T a: I r 70 12: 18 Target area ⁇ inch (1 27 ram) ⁇
- the target is switched to the target of A £ only, and the A layer serving as electrodes 4 and 5 is formed on the alloy layer by sputtering according to a conventional method.
- the layer was formed to a thickness of 0.000 A, and the ring was completed.
- the photo resist is formed twice in a predetermined pattern by the photolithography technique, and the A-layer jet etching is performed once.
- the alloy was dried by ion milling to form an alloy layer 3 and electrodes 4 and 5 having the shapes shown in Fig. 1 (c).
- the dimensions of the heat generating part are 3 Omxl 7 Om, the pitch of the ripening part is 125 ⁇ m, and 24 ripening parts are arranged in a row. Group Formed on a sioz film substrate.
- the protective layer 6 was formed by performing the packing so as to cover the electrodes 10'm on both sides of the heat-producing part, and the protective layer 6 was formed. and dimensions of the 1 (b) c heat acting portion 7 was obtained Let's Do Device Lee scan shown in the figure is 3 0 a 'mi 5 0 m .
- EPM A Electro Probe Microanalysis
- the film thickness was measured by a step difference measurement using a stylus type surface shape measuring device (Alphasha-stip200, manufactured by TENCORINSTRUMENTSS).
- the change in the weight of the substrate before and after the film formation was measured with an Ultramic balance made by INABASEIISAKUSHOLTD, and the density was calculated from the value, the area of the film, and the film thickness.
- the warpage of the two glass substrates was measured before and after the film formation, and the amount of change was measured and the length, thickness, Young's modulus, Poisson's ratio, and film thickness of the glass substrates were measured.
- the internal stress was obtained by calculation from the thickness.
- the part of the device obtained above with the protective layer 6 was immersed in the following low-conductivity liquid, and a rectangular voltage with a width of 7 sec and a frequency of 5 kHz was gradually applied to the electrodes 4 and 5 from an external power supply.
- the foaming voltage (V th ) at which the liquid starts foaming was determined.
- the liquid having the above composition has a low conductivity, so that the effect of the electrochemical reaction is small.
- the main factor of the rupture is due to thermal shock, heating, erosion, etc. Therefore, it is possible to know the durability against these.
- the value of the measurement result was calculated as an average value in the same manner as in the above S, and the obtained value was measured in the foam durability test in a high conductivity ink in Comparative Example 7 described later.
- the liquid having the above composition has high conductivity, and a current also flows through the liquid when a voltage is applied. For this reason, according to this test, in addition to the impact and erosion due to the cavitation of the foam, the electrochemical reaction may damage the non-single-crystal guest, which forms the heating part. Whether or not o Can know the situation.
- the change in resistance of the heat generating portion is a measure of the degree of alteration of the non-single crystalline material due to heat or electrochemical reaction.
- Step stress test Pulse width, frequency (6), (7) and in the same manner, a constant scan tape flop (CX 1 0 5 pulses, the pulse voltage every 2 minutes ⁇ > have EVEN and scan Te 'Bruno off performs be sampled Les scan te be sampled Te in air, seeking. Advance voltage (V break and Ganmaganma "ratio between the calculated meth V th Te (M), viewed temperature heat acting surface in V break is differences The results are shown in the first section.
- a device was prepared in the same manner as in Production Example 1 except that the area ratio of each raw material in the sputter ring target was variously changed as shown in Table 1. Each of the obtained devices was analyzed and evaluated in the same manner as in Production 31. The results obtained are shown in Table 1. Production example 1 3
- the film (non-single crystal material) obtained in Production Example 1 was converted to an infrared image. After heating in a furnace in a nitrogen atmosphere for 100 minutes and heating for 100 minutes, the devices were crystallized.Then, devices were fabricated in the same manner as in Production Example 1.
- the sputtering system used in Production Example 1 was modified to have three target holders in the film forming chamber, and each target holder was independent. As a result, a film deposition apparatus capable of applying RF power was fabricated.
- a film was formed by multi-element simultaneous sputtering under the following conditions, using the same substrate as in Production Example 1.
- the power applied to the Ir target and the Ta target was increased linearly and continuously with respect to the film formation time.
- the support-side region and the surface-side region of the previously obtained membrane have compositions as described in (1) and (2) above, respectively. It was presumed that the composition changed continuously from (1) to (2) over the region. By changing the composition in the thickness direction in this way, the adhesion of the film to the support is further improved, and the internal stress is favorably controlled.
- a disk was prepared in the same manner as in Production Example 1 except that the area ratio of each raw material in the sputtering target was variously changed as shown in Table 1.
- a device was manufactured in the same manner as in Production Example 1 except that a Ta target was used as the sputtering target.
- Table 4 shows the area ratio of each raw material in the sputtering target using the Ir target on the Ta target as the snortering target. After the modification, a device was fabricated in the same manner as in Production Example 1.
- the run-time probe is placed in the plasma, and the probe current i (V-i characteristic) is measured by changing the probe bias voltage V and measuring the probe current.
- Zuma parameters These elements are used to measure plasma potential, electron temperature, ion temperature, and plasma density.
- the element itself is placed in the plasma, and especially in the positive bias region, the element is placed in the plasma.
- the snow for the ion around the probe In response to the impact of the data, the temperature rise of the device and the surface deterioration cause the V-i characteristics to change and the reliability of the measured data to decrease. Therefore, as a probe element material, a high-melting point metal, for example, tungsten is conventionally used. However, even if it is tungsten, it can be used as a snow or metal. In low-vacuum regions, such as in air, exposure to reactive components occurs at high temperatures, and it is not sufficiently resistant to surface alteration, especially oxidation.
- the Ir_Ta-A £ alloy is used as a Langmuir pro. Used for the probe.
- the probe matrix was an R cylindrical base material having a diameter of 0.5 TO and a length of 5.0 made of tungsten and the surface of the base material of Example o. 15 was uniformly applied to a thickness of 2000 A by the RF sputtering method.
- This probe element was attached to the vacuum chamber of the sputter device shown below.
- Plasma convergent magnetic field 500 Oe
- Target single board rush distance 5 5 « «
- FIG. 1 (a) is a schematic plan view of a device used for evaluating a non-single-crystal material of the present invention.
- FIG. 1 (W is a schematic cross-sectional view taken along the dashed-dotted line XY in FIG. 1 (a).
- FIG. 1 (c) is provided with a non-single-crystal material layer and electrodes.
- FIG. 2 is a schematic plan view of the device.
- FIG. 2 is a schematic cross-sectional view showing an example of a high-frequency sputtering device used for producing a film such as a non-single-crystal guest according to the present invention.
- FIG. 3 is a view showing a composition range of the non-single crystalline substance according to the present invention.
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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DE69027070T DE69027070T2 (de) | 1989-02-28 | 1990-02-28 | Nicht-monokristalliner stoff enhaltend iridium, tantal und aluminium |
EP90903921A EP0412171B1 (en) | 1989-02-28 | 1990-02-28 | Non-monocrystalline substance containing iridium, tantalum and aluminum |
JP50397890A JP3411983B2 (ja) | 1989-02-28 | 1990-02-28 | Ir、Ta及びAlを含有する非単結晶質物質 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1/46769 | 1989-02-28 | ||
JP4676989 | 1989-02-28 |
Publications (1)
Publication Number | Publication Date |
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WO1990010089A1 true WO1990010089A1 (fr) | 1990-09-07 |
Family
ID=12756537
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1990/000258 WO1990010089A1 (fr) | 1989-02-28 | 1990-02-28 | Nouvelle substance non monocristalline contenant de l'iridium, du tantale et de l'aluminium |
PCT/JP1990/000257 WO1990009888A1 (fr) | 1989-02-28 | 1990-02-28 | Tete a jet d'encre dotee d'une resistance thermogene composee d'une substance non monocristalline contenant de l'iridium, du tantale et de l'aluminium, et dispositif a jet d'encre equipe de ladite tete |
PCT/JP1990/000256 WO1990009887A1 (fr) | 1989-02-28 | 1990-02-28 | Tete a jet d'encre dotee d'une resistance thermogene composee d'une substance non monocristalline contenant de l'iridium, du tantale et de l'aluminium, et dispositif a jet d'encre equipe de ladite tete |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP1990/000257 WO1990009888A1 (fr) | 1989-02-28 | 1990-02-28 | Tete a jet d'encre dotee d'une resistance thermogene composee d'une substance non monocristalline contenant de l'iridium, du tantale et de l'aluminium, et dispositif a jet d'encre equipe de ladite tete |
PCT/JP1990/000256 WO1990009887A1 (fr) | 1989-02-28 | 1990-02-28 | Tete a jet d'encre dotee d'une resistance thermogene composee d'une substance non monocristalline contenant de l'iridium, du tantale et de l'aluminium, et dispositif a jet d'encre equipe de ladite tete |
Country Status (7)
Country | Link |
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US (3) | US5142308A (ja) |
EP (3) | EP0425679B1 (ja) |
JP (1) | JP3411983B2 (ja) |
AT (3) | ATE122966T1 (ja) |
CA (3) | CA2028125C (ja) |
DE (3) | DE69019671T2 (ja) |
WO (3) | WO1990010089A1 (ja) |
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- 1990-02-28 AT AT90903920T patent/ATE122966T1/de not_active IP Right Cessation
- 1990-02-28 EP EP90903920A patent/EP0425679B1/en not_active Expired - Lifetime
- 1990-02-28 CA CA002028125A patent/CA2028125C/en not_active Expired - Fee Related
- 1990-02-28 JP JP50397890A patent/JP3411983B2/ja not_active Expired - Fee Related
- 1990-02-28 US US07/598,707 patent/US5142308A/en not_active Expired - Lifetime
- 1990-02-28 US US07/601,714 patent/US5148191A/en not_active Expired - Lifetime
- 1990-02-28 CA CA002028124A patent/CA2028124C/en not_active Expired - Lifetime
- 1990-02-28 CA CA002028123A patent/CA2028123C/en not_active Expired - Fee Related
- 1990-02-28 WO PCT/JP1990/000258 patent/WO1990010089A1/ja active IP Right Grant
- 1990-02-28 EP EP90903919A patent/EP0428730B1/en not_active Expired - Lifetime
- 1990-02-28 DE DE69019671T patent/DE69019671T2/de not_active Expired - Fee Related
- 1990-02-28 AT AT90903919T patent/ATE124915T1/de not_active IP Right Cessation
- 1990-02-28 WO PCT/JP1990/000257 patent/WO1990009888A1/ja active IP Right Grant
- 1990-02-28 DE DE69027070T patent/DE69027070T2/de not_active Expired - Fee Related
- 1990-02-28 EP EP90903921A patent/EP0412171B1/en not_active Expired - Lifetime
- 1990-02-28 WO PCT/JP1990/000256 patent/WO1990009887A1/ja active IP Right Grant
- 1990-02-28 AT AT90903921T patent/ATE138418T1/de not_active IP Right Cessation
- 1990-02-28 DE DE69020864T patent/DE69020864T2/de not_active Expired - Fee Related
- 1990-10-25 US US07/601,726 patent/US5234774A/en not_active Expired - Lifetime
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JP2008248322A (ja) * | 2007-03-30 | 2008-10-16 | Ishifuku Metal Ind Co Ltd | 耐熱性Ir基合金 |
Also Published As
Publication number | Publication date |
---|---|
CA2028124C (en) | 1995-12-19 |
CA2028123C (en) | 1998-02-10 |
EP0428730A1 (en) | 1991-05-29 |
EP0425679A4 (en) | 1991-10-16 |
DE69027070D1 (de) | 1996-06-27 |
EP0428730A4 (en) | 1991-10-16 |
ATE124915T1 (de) | 1995-07-15 |
ATE122966T1 (de) | 1995-06-15 |
WO1990009887A1 (fr) | 1990-09-07 |
EP0425679A1 (en) | 1991-05-08 |
EP0412171A4 (en) | 1991-09-11 |
US5234774A (en) | 1993-08-10 |
EP0412171B1 (en) | 1996-05-22 |
DE69027070T2 (de) | 1996-10-24 |
DE69019671D1 (de) | 1995-06-29 |
CA2028125C (en) | 1996-06-18 |
CA2028125A1 (en) | 1990-08-29 |
US5142308A (en) | 1992-08-25 |
WO1990009888A1 (fr) | 1990-09-07 |
EP0412171A1 (en) | 1991-02-13 |
DE69020864T2 (de) | 1995-12-14 |
CA2028123A1 (en) | 1990-08-29 |
US5148191A (en) | 1992-09-15 |
EP0425679B1 (en) | 1995-05-24 |
CA2028124A1 (en) | 1990-08-29 |
JP3411983B2 (ja) | 2003-06-03 |
DE69020864D1 (de) | 1995-08-17 |
EP0428730B1 (en) | 1995-07-12 |
ATE138418T1 (de) | 1996-06-15 |
DE69019671T2 (de) | 1995-12-14 |
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