WO1990009888A1 - Tete a jet d'encre dotee d'une resistance thermogene composee d'une substance non monocristalline contenant de l'iridium, du tantale et de l'aluminium, et dispositif a jet d'encre equipe de ladite tete - Google Patents
Tete a jet d'encre dotee d'une resistance thermogene composee d'une substance non monocristalline contenant de l'iridium, du tantale et de l'aluminium, et dispositif a jet d'encre equipe de ladite tete Download PDFInfo
- Publication number
- WO1990009888A1 WO1990009888A1 PCT/JP1990/000257 JP9000257W WO9009888A1 WO 1990009888 A1 WO1990009888 A1 WO 1990009888A1 JP 9000257 W JP9000257 W JP 9000257W WO 9009888 A1 WO9009888 A1 WO 9009888A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- ink jet
- ink
- jet head
- heating resistor
- head
- Prior art date
Links
- 239000000126 substance Substances 0.000 title claims abstract description 30
- 229910052715 tantalum Inorganic materials 0.000 title claims abstract description 24
- 229910052741 iridium Inorganic materials 0.000 title claims abstract description 21
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 title abstract description 5
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 title abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title 1
- 229910052782 aluminium Inorganic materials 0.000 title 1
- 238000010438 heat treatment Methods 0.000 claims abstract description 106
- 239000010410 layer Substances 0.000 claims description 45
- 239000000203 mixture Substances 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 37
- 239000011241 protective layer Substances 0.000 claims description 20
- 230000001681 protective effect Effects 0.000 claims description 13
- 239000000470 constituent Substances 0.000 claims description 7
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- 230000005070 ripening Effects 0.000 claims description 5
- 239000002178 crystalline material Substances 0.000 claims description 4
- 239000012535 impurity Substances 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 229910052708 sodium Inorganic materials 0.000 claims description 2
- 241000612182 Rexea solandri Species 0.000 claims 2
- 230000009471 action Effects 0.000 abstract description 2
- 239000000976 ink Substances 0.000 description 227
- 239000000758 substrate Substances 0.000 description 50
- 238000012360 testing method Methods 0.000 description 38
- 230000008859 change Effects 0.000 description 36
- 239000007788 liquid Substances 0.000 description 30
- 239000013078 crystal Substances 0.000 description 24
- 239000007789 gas Substances 0.000 description 17
- 238000004544 sputter deposition Methods 0.000 description 16
- 239000000956 alloy Substances 0.000 description 13
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- 230000000052 comparative effect Effects 0.000 description 11
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- 230000015572 biosynthetic process Effects 0.000 description 10
- 230000003628 erosive effect Effects 0.000 description 10
- 238000003487 electrochemical reaction Methods 0.000 description 9
- 230000003647 oxidation Effects 0.000 description 9
- 238000007254 oxidation reaction Methods 0.000 description 9
- 230000035939 shock Effects 0.000 description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 8
- 238000012546 transfer Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 7
- 239000002994 raw material Substances 0.000 description 7
- 238000005477 sputtering target Methods 0.000 description 7
- 238000004458 analytical method Methods 0.000 description 6
- 230000002829 reductive effect Effects 0.000 description 6
- 230000004043 responsiveness Effects 0.000 description 6
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- 229910052786 argon Inorganic materials 0.000 description 4
- 238000011088 calibration curve Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000004090 dissolution Methods 0.000 description 4
- 239000006260 foam Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910001362 Ta alloys Inorganic materials 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000004453 electron probe microanalysis Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
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- 238000001454 recorded image Methods 0.000 description 3
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- 230000001133 acceleration Effects 0.000 description 2
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- 239000004020 conductor Substances 0.000 description 2
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- 150000002739 metals Chemical class 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 235000021419 vinegar Nutrition 0.000 description 2
- 239000000052 vinegar Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- HEAUFJZALFKPBA-JPQUDPSNSA-N (3s)-3-[[(2s,3r)-2-[[(2s)-6-amino-2-[[(2s)-2-amino-3-(1h-imidazol-5-yl)propanoyl]amino]hexanoyl]amino]-3-hydroxybutanoyl]amino]-4-[[(2s)-1-[[(2s)-1-[[(2s)-1-[[2-[[(2s)-1-[[(2s)-1-amino-4-methylsulfanyl-1-oxobutan-2-yl]amino]-4-methyl-1-oxopentan-2-yl]amin Chemical compound C([C@@H](C(=O)N[C@H](C(=O)NCC(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](CCSC)C(N)=O)C(C)C)NC(=O)[C@H](CO)NC(=O)[C@H](CC(O)=O)NC(=O)[C@@H](NC(=O)[C@H](CCCCN)NC(=O)[C@@H](N)CC=1NC=NC=1)[C@@H](C)O)C1=CC=CC=C1 HEAUFJZALFKPBA-JPQUDPSNSA-N 0.000 description 1
- CZMRCDWAGMRECN-UHFFFAOYSA-N 2-{[3,4-dihydroxy-2,5-bis(hydroxymethyl)oxolan-2-yl]oxy}-6-(hydroxymethyl)oxane-3,4,5-triol Chemical compound OCC1OC(CO)(OC2OC(CO)C(O)C(O)C2O)C(O)C1O CZMRCDWAGMRECN-UHFFFAOYSA-N 0.000 description 1
- 241000380873 Algon Species 0.000 description 1
- 241000212978 Amorpha <angiosperm> Species 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 101800000399 Neurokinin A Proteins 0.000 description 1
- 241000287462 Phalacrocorax carbo Species 0.000 description 1
- 102100024304 Protachykinin-1 Human genes 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000000703 anti-shock Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
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- 230000020169 heat generation Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000001659 ion-beam spectroscopy Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
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- 238000000206 photolithography Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
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- 239000011734 sodium Substances 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/14129—Layer structure
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1604—Production of bubble jet print heads of the edge shooter type
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
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- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
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- B41J2/1621—Manufacturing processes
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- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
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- B41J2/01—Ink jet
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- B41J2/1621—Manufacturing processes
- B41J2/1635—Manufacturing processes dividing the wafer into individual chips
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- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
- C22C27/02—Alloys based on vanadium, niobium, or tantalum
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/04—Alloys based on a platinum group metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/03—Specific materials used
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12458—All metal or with adjacent metals having composition, density, or hardness gradient
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12639—Adjacent, identical composition, components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
- Y10T428/12819—Group VB metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12875—Platinum group metal-base component
Definitions
- the present invention provides a shock resistance of a cavity (hereinafter referred to as "cavity resistance”), and a method using the cavity.
- Resistance hereinafter referred to as “erosion resistance”
- chemical stability hereinafter referred to as “erosion resistance”
- electrochemical stability oxidation resistance
- dissolution resistance heat resistance
- thermal shock resistance It is widely used in ink-jet heads and ink-jet equipment equipped with electrothermal converters with excellent mechanical cooking properties.
- the ink jet head and the ink jet device discharge ink by directly applying heat energy to the ink on the heating surface.
- a typical example is a device provided with an electrothermal converter having a heating resistor which is generated by energizing the heat energy used for power supply. .
- This electrothermal converter has low power consumption and excellent responsiveness to an input signal.
- the ink jet method described in U.S. Pat. No. 4,723,129 and U.S. Pat. No. 4,740,796 Is capable of high-speed, high-density, high-definition, high-quality recording, and is suitable for colorization and compaction, and has recently attracted attention.
- an ink a recording liquid or the like
- Action part is present.
- a heat-generating resistor having a heat-acting portion is provided in correspondence with the ink path, and the ink is rapidly generated by using the mature energy generated from the heat-generating resistor.
- this heat-acting part has some parts that seemingly resemble the structure of a conventional so-called general head.
- the heat acting part of the ink jet head is-. It is severe as described above:-Because it is exposed to the environment-The protective film on the heating resistor and to eg S i 0 2, S i C , electrically Ze' layer S i 3 N 4 or the like or al ing, further a T a like or al of Ru ⁇ Ki ya Bite tion layer thereon
- the heat acting part is protected from the operating environment.
- a constituent material of a protective film used for such an ink jet head for example, a material described in U.S. Pat. No. 4,335,389 described in US Pat. It is possible to name materials that are strong against impacts and variations due to the heat sink.
- T a z 0 5, etc. or et ing wear layer to support over Ma Le head generally have found that Ru use in is always and that has excellent ⁇ Ki ya Bite tion of There is no limit.
- a heating resistor is used to reduce the power consumption and increase the response to the input signal. It is desired that the heat generated acts on the ink as efficiently and quickly as possible. Therefore, in addition to the above-mentioned form in which the protective film is provided, a form in which the heating resistor is in direct contact with the ink is also proposed. Has been done.
- the head in this form is provided with a protective film in terms of thermal efficiency. Even though it is superior, the heating resistor is not only subject to the ⁇ -section due to the cavitation, but also to the rise and fall of the temperature. Since the recording liquid that comes into contact with the body has conductivity, a current also flows in the recording liquid, and the resulting electrochemical reaction also exposes the thermal resistor. . For this reason, the conventional heat generating resistor material and to T a 2 that have been known to N, R u 0 2 the beginning and to that a variety of metals, alloys, metal compounds, have Ru Oh also Sami Tsu DOO, this It is not necessarily sufficient in durability and stability to be used for the heating resistor of the head in the form of (1).
- the ink jet head As for the ink jet head provided with the protective film as described above, it has been proposed that the ink jet head can be practically used in terms of durability and resistance change. However, in any case, it is very difficult to completely prevent the occurrence of defects that occur during the formation of the protective film, which is a major factor that lowers the yield during mass production. Become. This is a major problem, as there is a need for higher-speed and higher-density recording, and the number of head ejection ports tends to increase accordingly. It has become to.
- the above-mentioned protective film reduces the heat transfer efficiency from the heating resistor to the recording liquid, but if the heat transfer efficiency is low, the required overall power consumption increases and the device can be driven.
- the temperature change of the head becomes large. This temperature change leads to a change in the volume of the droplet ejected from the ejection port, and causes a change in density in an image.
- the power consumption in the head will increase accordingly, and the temperature change will increase.
- an image from which this temperature change is obtained has a corresponding density change.
- the heating resistor is driven by the calibrated impulse erosion.
- one di ® down even only in a rather they Ru is being al in raising and lowering of the temperature, since it is al also the electrochemical reaction, a conventional T a 2 N, R u 0 2, H f B
- the material of the heating resistor such as 2 has a problem in durability such as being mechanically destroyed, corroded or dissolved.
- ejection stability is indispensable.
- the heating resistor and the change in resistance be small. Practically, it is desirable to be 5% or less.
- the Ta and Ta_A alloys described in Japanese Unexamined Patent Publication No. 59-96971 are heat-generating resistors that are in direct contact with the ink jet head. It is relatively excellent in durability in that the resistor does not break when it is used as a body, that is, in short, in the resistance to cavitation.
- Ta and Ta-AJ? Alloys are not so small and do not have a groove foot.
- the heating resistor has a structure in which the heating resistor is provided so as to be in direct contact with the ink, and has high heat conduction efficiency, excellent signal responsiveness, and sufficient durability and ejection stability. It is not easy to obtain a single-headed and twin-headed jet equipment.
- the main object of the present invention is to solve and improve the above-mentioned problems in the conventional ink jet head in which the ink directly contacts the heating resistor.
- An object of the present invention is to provide an ink jet head and an ink jet apparatus having the ink jet head.
- An object of the present invention is to provide an improved ink jet head that provides a recorded image.
- Still another object of the present invention is to provide a structure in which a heating resistor is brought into direct contact with a recording liquid, to reduce power consumption by the heating resistor, and to reduce a temperature of a head.
- the change is extremely small, the ink is discharged stably at all times even after repeated use for ⁇ hours, and the resulting image has no density change due to the temperature change of the head. It is in providing an inkjet head.
- Another object of the present invention is to provide an ink jet device having the above-mentioned ink jet head.
- the present inventors have conducted extensive research to solve the above-mentioned problems in a conventional ink jet head in which the ink comes into direct contact with the heating resistor to achieve the above object.
- Ir iridium
- Ta tantalum
- the non-single-crystalline substance contains iridium (Ir) and tantalum (Ta) in a composition of 35 to 77 atomic% and 23 to 65 atomic%, respectively.
- An amorphous (amorphous) substance, a polycrystalline (polycrystalline) substance, or a mixture of an amorphous substance and a polycrystalline substance K ( Hereinafter, it is referred to as " 11 non-single-crystal Ir-Ta substance" or "Ir-Ta alloy”.
- the present inventors have selected iridium (Ir) from the viewpoint of a substance that is rich in heat resistance and oxidation resistance and is chemically stable, has mechanical strength, and has solvent resistance.
- Ir iridium
- T a is selected from the viewpoint of a substance that also brings oxides rich in non-single crystals, and a non-single crystal K containing these two elements at a predetermined composition ratio
- Several material samples were prepared by the sputtering method.
- Each sample uses a single crystal Si substrate and a sputter ring device (trade name: sputter ring device CFS-8EP, manufactured by Tokuda Seisakusho Co., Ltd.) as shown in Fig. 4. It was fabricated by forming a film on a Si single crystal substrate with a thermally oxidized Sioz film of 2.5 formed on the surface.
- reference numeral 201 denotes a film forming chamber.
- Reference numeral 102 denotes a substrate holder for holding a substrate 203 provided in the film forming chamber 201.
- the base holder 202 has a built-in heater (not shown) for heating the substrate 203.
- the substrate holder 202 is supported by a face-shift shaft 21 extending from a drive motor (not shown) installed outside the system, and can move up and down. And it is designed to be able to turn around.
- a target holder 205 for holding the film forming target is installed at a position facing the substrate 203 in the film forming chamber 201.
- Reference numeral 206 denotes a Ta target consisting of a Ta plate having a purity of 99.9% by weight or more placed on the surface of the target holder 205.
- Reference numeral 207 denotes an Ir target consisting of an Ir sheet having a purity of 99.9% by weight or more, which is arranged on the Ta target. As shown in FIG.
- a plurality of Ir targets each having a predetermined area are formed on the surface of the Ta target target 206 as indicated by 2007: 208.
- the area and arrangement of each of the Ir targets 207 and 208 arranged at an interval of 2 are as follows: a film having the desired composition of Ir and Ta at a predetermined composition ratio The relationship between the area ratios of the targets is determined in advance, and a calibration curve is prepared, and a calibration curve is prepared based on the calibration curve.
- Reference numeral 204 denotes a system which is provided at a position above the target holder 205 so as to be horizontally moved so as to cut off the empty space between the substrate 203 and the target holder 205. It is a shutter board.
- the shutter # 204 is used as follows. In other words, before starting the film formation, the Ta target and the Ir target It is moved to the upper part of the target holder 205 holding the nozzle, and an inert gas such as argon (Ar) gas is deposited through the gas supply pipe 212 in the film forming chamber 205.
- the RF power supply 215 is electrically connected to the peripheral wall of the film forming chamber 201 via the conductor 216, and the target holder is also electrically connected via the conductor 217. It is electrically connected to 205.
- Reference numeral 2 14 denotes a matching box.
- the target holder 205 has a mechanism for internally circulating cooling water so that the Ta target and the Ir target are maintained at a predetermined temperature during film formation. (Not shown) is provided.
- the film forming chamber 201 is provided with an exhaust pipe 210 for exhausting the inside of the film forming chamber.
- the exhaust pipe is connected to a vacuum pump (e.g., a vacuum pump) via an exhaust valve 211.
- argon gas (Ar gas), helium gas (He gas), etc. are connected in the film forming chamber 201.
- a gas supply line for introducing a gas for snow and gas ringing 2 13 is a flow rate control valve for the gas for sputtering, provided on the gas supply line.
- Reference numeral 209 denotes a target holder 205 and a film forming chamber 205 for electrically isolating the target holder 205 from the film forming chamber 201.
- 2 is a vacuum gauge provided in the film forming chamber 201.
- 2 is a vacuum gauge provided in the film forming chamber 201. The vacuum gauge is provided in the film forming chamber 2 by the vacuum gauge. 0 A pressure of 1 is automatically detected.
- the apparatus shown in FIG. 4 has a form in which one target holder is provided as described above, but a plurality of target holders are provided. You can also.
- the target holders are arranged at equal positions on the concentric R at a position facing the substrate 203 in the film forming chamber 201.
- Each target holder has an individual The separate RF power supplies are electrically connected via a matching box.
- two target holders are used because the two types of targets, namely the Ir target and the Ta target, are used. As described above, they are arranged in the film forming chamber 201, and each target is individually set on each target holder.
- a predetermined RF power can be independently applied to each target.
- One or both of the Ir and Ta elements can be changed by changing the composition ratio of the constituent elements of the film to be formed. It is possible to form a film whose thickness changes in the film thickness direction.
- the production of each sample using the apparatus shown in FIG. 4 described above was performed in each case by placing the Ir target 200 on the Ta target 206 surface. Except that the arrangement of 208 was performed based on a calibration curve prepared in advance for a non-single-crystal K substance (film) having a predetermined composition ratio of Ir and Ta to be obtained, The deposition was performed under the film forming conditions. Substrate placed on substrate holder 202:
- the remaining film was subjected to a step test (SST) for observing heat resistance and impact resistance in air.
- the pond test was prepared by dissolving sodium acetate 0.15 wt /% in a solution consisting of 70 parts by weight of water and 30 parts by weight of dichroic alcohol as an immersion liquid. The procedure was the same as that described below for the “Durability test for foaming in a low-conductivity ink” except that the slurried liquid was used.
- the SST was performed by the same method as the “step stress test” described later. When the results of the pond test and the results of the SST were comprehensively examined, the following results were obtained.
- the most preferred samples are mostly polycrystalline substances, and include 'polymorphic substances and amorphous substances and amorpha' substances. It turned out to be.
- Ir was 35 to 77 atoms 3 ⁇ 4 Ta was 23 to 65 atom%. I was convinced.
- Ir was found to be 42 to 77 at% and Ta was found to be 23 to 58 at%.
- Ir was between 60 and 77 atomic% and Ta was between 23 and 40 atomic%.
- a non-single-crystal Ir-Ta substance having Ir and Ta as essential components in the following composition ratio is an ink jet head. It has been determined that it is suitable for use as a heating resistor.
- the present inventors described that the non-single-crystal Ir-Ta substance was used to construct a heat-generating antibody, and that an ink jet head was produced. There was found.
- an ink-jet head that has a heat-generating resistor that has excellent electrochemical and chemical stability and heat resistance in addition to its resistance to erosion and erosion. be able to.
- the heat energy generated from the heat generating portion of the heat generating resistor can be directly applied to the ink, so that the heat transfer efficiency to the ink is improved. good.
- the heating resistor it is possible to suppress the power consumption by the heating resistor to a low level, and it is possible to significantly reduce the temperature rise of the head (temperature change of the head). In addition, it is possible to avoid the occurrence of a change in image density due to a change in head tone. Further, it is possible to obtain better responsiveness to the ejection signal applied to the heating resistor.
- the heating resistor according to the present invention it is possible to obtain a desired specific resistance value with good controllability and a very small variation in the resistance value in one head. Wear. Therefore, it is possible to discharge ink much more stably than before, and to obtain an ink jet head having excellent durability. Wear.
- the ink jet head which has the above-mentioned good characteristics, is very suitable for high-speed recording and high image quality due to the multiple outlets. Become. Detailed description of the preferred embodiment
- one aspect of the present invention is to provide a thermal energy directly to the ink on the heat-working surface and to energize the thermal energy used to discharge the ink.
- the heating resistor is substantially composed of Ir and Ta.
- the present invention provides an ink jet head characterized by comprising a non-monocrystalline material containing r and Ta in the following composition ratios.
- Another embodiment of the present invention has a heating resistor that generates the above-mentioned heat energy used for discharging the ink by directly applying heat energy to the ink on the heat-acting surface by applying a current.
- the heating resistor is actually composed of Ir and Ta, and the Ir and Ta are contained in the following composition ratio.
- the present invention provides an ink jet head characterized in that it is made of a non-monocrystalline material.
- a heating resistor which is generated by conducting heat energy, which is used for directly applying thermal energy to an ink on a heat working surface and discharging ink.
- the heating resistor is substantially composed of Ir and Ta, and the Ir and Ta are in the following composition ratio.
- the present inventors have found that the above-mentioned specific non-single-crystal Ir-Ta material (ie, -amorphous (amorphous) Ir-Ta alloy, polycrystalline Ir-Ta alloy or Ink using non-single crystal Ir-Ta substance other than the mixture of both) It was confirmed through experiments that the following problems were encountered when constructing a heating resistor for a jet head.
- the heat-generating part of the heat-generating resistor can be in direct contact with the ink in the ink path.
- the ink jet head according to the present invention has a heating resistor directly in contact with a conventionally proposed ink.
- There are no pitfalls that can be seen in the head-it has various advantages that cannot be predicted from the prior art, such as: -(I) Cavitation resistance, ⁇ -resistance, mechanical durability, chemical stability, electrochemical stability, resistance stability, heat resistance, oxidation resistance Excellent in both solubility and thermal shock resistance, and has excellent thermal conductivity: (H) Even if any recording liquid (that is, ink) is used, it will last for ⁇ hours.
- the heat generating resistor is made of the above-mentioned specific polycrystalline Ir-Ta material, and The heat generation part is in direct contact with the ink in the ink path.
- the state stability and the resistance stability are particularly prominent.
- the thickness of the layer of the heating resistor in the present invention is appropriately determined so that appropriate heat energy is effectively generated.
- the thickness be 300 persons.
- ⁇ L ⁇ m more preferably 100 OA to 500 000 people.
- the heating resistor composed of the specific non-single-crystal Ir-Ta material described above is more preferably formed in a single-layer structure than in the case of force. It can also be in the form of a layered structure.
- the composition of the two elements constituting the material, namely Ir and Ta is as described above. It is not necessary that it be uniform over the entire area of the layer. That is, while the respective composition ratios of Ir and Det are within the above-mentioned specific ranges, one or more of these elements are unevenly distributed in the layer thickness direction. It may be.
- the non-single-crystal Ir-1Ta material constituting the layer is composed of one constituent element for an ink jet head. It can be distributed relatively much in the layer region on the substrate side.
- the heating resistor is formed into a two-layer structure by laminating layers made of a non-single-crystal Ir-Ta material, and is located on the substrate side of the ink jet head.
- the layer can be one in which one constituent element is relatively more distributed in the layer region on the substrate side.
- the surface or inside of the layer is generally oxidized by exposure to the air or during the manufacturing process. However, in the material according to the present invention, this is not the case. The effect is not diminished by such slight surface or internal oxidation.
- Such impurities may include at least one selected from C, N, Si, B, Na, C, and Fe, including, for example, ⁇ by oxidation described above. Two elements can be mentioned.
- the heat generating resistor according to the present invention for example, simultaneously mixes each material. Or alternately deposited DC, RF, ion beam sputtering, vacuum evaporation, CVD, or organic metal It can be formed by a film forming method of applying and firing.
- an ink jet head according to the present invention using the alloy material having the above-described composition as a heating resistor and having excellent thermal efficiency, signal response, and the like will be described with reference to the drawings. explain.
- FIG. 1 (a) is a schematic front view of the main part of an example of the ink jet head of the present invention viewed from the discharge port side, and FIG. 1 (b) is one point in FIG. 1).
- FIG. 4 is a schematic cross-sectional view of a portion indicated by a XY line.
- the ink jet head comprises a heating resistor layer 3 having a predetermined shape on a support having a lower layer 2 provided on the surface of a substrate 1 and an electrical connection.
- An electrothermal converter having poles 4 and 5 is formed, and a protective layer 6 covering at least the electrodes 4 and 5 is laminated on the electrothermal converter, and further connected to the discharge port 8 thereon.
- It has a basic configuration in which a grooved plate 7 having a concave portion for providing a liquid passage 11 through which the groove is formed is joined.
- the electrothermal converter in this example has a heating resistor 3, electrodes 4 and ⁇ connected to the heating resistor 3, and a protective layer 6 provided as needed. That is.
- the substrate for an ink jet head has a support having a substrate 1 and a lower layer 2, an electrothermal converter, and a protective layer 6.
- the ripening surface 9 that directly transfers heat to the ink is formed by the heat-generating resistor 3 in which the portion (heat-generating portion) sandwiched between the electrodes 4> 5 is an infinity. The surface is almost equivalent to the surface in contact with the heat, and corresponds to a portion of the heat generating portion that is not covered with the protective film 6.
- the lower layer 2 is provided as necessary, and has a function of adjusting the amount of heat escaping to the substrate 1 side and efficiently transmitting heat generated in the heat generating portion to the ink.
- the electrodes 4 and 5 are electrodes for supplying electricity to the layer 3 of the heating resistor to generate heat from the heat generating portion.
- the electrode 4 is common to each heat generating portion.
- Electrode and electrode 5 are used to selectively supply current to each heat generating part. It is a pole.
- Protector 6 is provided as necessary to prevent electrodes 4 and 5 from being chemically attacked by contacting the ink and from preventing electrode shorts through the ink.
- FIG. 1 (c) is a schematic plan view of the base for an ink jet head at the stage where the heating resistor layer 3 and the electrodes 4 and 5 are provided.
- FIG. 1 (d) is a schematic plan view of a base for an ink jet head at a stage where a protective layer 6 is provided on those layers.
- the ink jet head since the alloy material having the above composition is used for the layer 3 of the heating resistor, the ink is directly in contact with the heat acting surface 9. Despite the fact that it has good durability. In this way, if the heat generating part of the heat generating resistor, which is the heat energy source, is configured to be in direct contact with the ink, the heat generated in the heat generating part can be directly transmitted to the ink. In addition, heat transfer can be performed extremely efficiently as compared with the configuration in which the ink is transferred to the ink via a protective layer or the like.
- the power consumption of the heating resistor can be kept low, and the degree of heating of the head can be reduced.
- the responsiveness to an input signal (discharge command signal) to the electrothermal converter is improved, and a foaming state required for discharge can be stably obtained.
- the configuration of the electrothermal converter having a heating resistor formed by using the alloy material according to the present invention is not limited to the example of FIG. 1, but may be, for example, a configuration as shown in FIG. Various modes can be adopted.
- the electrode 4.5 is covered with the layer 3 of the heating resistor made of the alloy material having the above composition. It is not necessary to provide a protective layer.
- the structure of the discharge port and the liquid path of the ink jet head has a
- the direction in which the ink is supplied and the direction in which the ink is discharged from the discharge port 8 using the thermal energy generated from the heat generating portion are not limited to the same direction. Their directions may be different. For example, as shown in FIG. 3) and FIG. 3 (3 ⁇ 4), a configuration in which the two directions form a substantially right angle is also possible.
- Reference numeral 10 in FIG. 3 denotes a plate (discharge port plate) having an appropriate thickness provided with a discharge port, and reference numeral 12 denotes a support wall for supporting the discharge port plate. It is a member.
- the ink discharge unit is, for example, 8 tubes / » ⁇ or more, and 12 / TO or more.
- the present invention is particularly effective when arranged at high density.
- a structure having a plurality of the ink discharge structural units for example, a structure in which the ink discharge structural units are arranged over the entire width of the printing area of the recording target member. You can list the so-called full-length ink jet head.
- the number of ejection ports is 100 or more.
- the variation of the resistance value of each heating part in one head depends on the volume of the droplet discharged from the discharge port. This may affect the uniformity of the image, which may cause uneven image density.
- the heating resistor according to the present invention it is possible to obtain a desired specific resistance value with good controllability and with a very small variation in resistance value in one head. As a result, the aforementioned problem can be solved with a much better condition.
- the heating resistor according to the present invention is required to have a higher recording speed (for example, a printing speed of 30 cm / sec or more, furthermore, a printing speed of 60 cm / sec or more) and a higher density.
- a higher recording speed for example, a printing speed of 30 cm / sec or more, furthermore, a printing speed of 60 cm / sec or more
- a disc squirtable trike-type ink jet integrated with an integrated ink tank that stores the ink supplied to the heat-acting surface.
- the heating resistor according to the present invention is also very effective for the heat sink. This is because this type of inkjet head has a low running cost of the entire ink jet device to which the head is attached.
- the heating resistor according to the present invention can be configured to be in direct contact with the ink, heat transfer to the ink can be performed. This is because the efficiency can be improved, so that the power consumption of the entire device can be reduced, and it is easy to meet the above-mentioned requirements.
- the ink jet head of the present invention can be in a form in which a protective layer is provided on a heating resistor.
- the heat transfer efficiency to the ink is somewhat sacrificed, but the durability of the electrothermal converter and the resistance change of the pit thermal resistor due to the electrochemical reaction are considered. Can get even better ink jet heads.
- the entire layer thickness be within the range of 100 to 5 'm.
- the heater may be used as a heater for heating, and is particularly preferably used when such a heater is in direct contact with the ink.
- High-speed recording and high-quality recording can be performed by attaching the ink jet head having the above-mentioned configuration to the device main body and applying a signal from the device main body to the head. It is possible to obtain an ink jet recording device that can be operated at high speed.
- FIG. 5 is a schematic perspective view showing an example of the ink jet recording apparatus IJRA to which the present invention is applied.
- the driving force transmission gear 5 is linked to the forward / reverse rotation of the driving motor 501 13.
- 0 1 1, 5 0 0 9 Carrier HC that engages with spiral groove 5 0 4 of lead screw 5 0 5 rotating through 5 0 9 is a pin (Not shown), and is reciprocated in the directions of arrows a and b.
- Reference numeral 5002 denotes a paper holding plate, which presses the paper against the plate 5000 in the carriage moving direction.
- 507 and 508 are photo-power blurs, and the presence of the carrier lever 506 in this area is confirmed. It is home position detection means for performing direction switching and the like.
- Reference numeral 50 16 is a cap member that caps the front of the IJC, which is a recording head of a cartridge type with an integrated ink tank.
- Reference numeral 502 denotes a member for supporting the suction head, which is a suction means for sucking the inside of the cap, and recovering the suction head of the recording head through the opening 520 in the cap.
- Reference numeral 501 designates a cleaning blade, and reference numeral 501 designates a member capable of moving the blade in the front-rear direction. These are supported. The blade is not in this form, nor is a well-known cleaning blade applicable to this example.
- Reference numeral 501 denotes a lever for starting suction on the suction surface, which moves with the movement of the cam 520 which engages with the carriage, and drives the motor.
- the movement of the driving force from the motor is controlled by known transmission means such as clutch switching.
- the CPU for providing signals to the electrothermal converter provided in the ink jet head IJC and for controlling the driving of each mechanism described above is provided on the device body side. (Not shown).
- portions other than the above-mentioned heating resistor can be formed by using a known material and a known method. .
- One Si single-crystal substrate manufactured by Pippori Ichisha
- one Si single crystal substrate manufactured by Pichiri Ippani
- the substrate 203 for the sputtering is set on the substrate holder 202 of the film forming chamber 201 of the high-frequency sputtering apparatus shown in FIG. 4 described above.
- a T-a target 106 which is a raw material having a high purity of 99.9% by weight or more
- an Ir sheet 20 ", 208 of similar purity was added.
- co-sputtering was performed under the following conditions to form an alloy layer having a thickness of about 2000 persons.
- Target area ⁇ inch (.1 2 ⁇ mm) ⁇
- the target was continuously switched to the A target, and the ⁇ layers to be the electrodes 4 and 5 were sputtered on the alloy layer according to a conventional method.
- the layer was formed to a thickness of 600 ⁇ by talling, and the sputtering was completed.
- the photo register is stored in a predetermined location using photolithography technology. Formed twice in turns, once in A-layer cut etching, twice The eye is that the alloy layer is drained by ion milling, and the heating resistor 3 and the electrode 4 having the shapes shown in FIGS. 1 (b) and 1 (c) are formed. , 5 were formed.
- the dimensions of the heat-generating part are 30 ⁇ 170 ⁇ m.
- the pitch of the heat-generating part is 1 25 ⁇ "m, and a group of 24 heat-generating parts arranged in a line. Were formed on the Sioz film substrate.
- vinegar Roh, 'Tsu form a data re-down Ri by the grayed S i 0 2 film on top of this, that after, S i 0 z ⁇ the full O door Li source grayed La off I technology of this and Using a reactive ion etching, the protective layer 6 was formed by buttering so as to cover the electrodes at both sides of the heat generating portion 10 // m.
- the dimensions of the heat acting portion 9 are SO ⁇ mxlSOm.
- the product in such a state is cut out and processed in the above-described group to prepare a number of substrates for an ink jet head, and a part of the substrate is evaluated as described below. The test was performed. .
- a glass grooved plate 7 is joined to another part to form a spout 8 and a liquid passage 11 shown in FIGS. 1) and (b), and the ink jet is formed.
- EPMA Electro Probe Microanalysis
- Quantitative analysis is based on only the target main constituent elements as raw materials. This was not done for argon, which is generally incorporated into the film by sputtering. In addition, for all other impurity elements, it was confirmed that the detection error of the analyzer was less than about 0.2 weight by both quantitative and qualitative analysis.
- the film thickness was measured by a step difference measurement using a stylus type surface shape measuring instrument (available from TENCORINSTRUMENTSTS).
- the X-ray diffraction pattern of the sample formed on the Si single crystal substrate was measured using the above-mentioned measuring device, and the peaks due to the crystal were observed.
- the quality was classified into three types: quality (C), those that seemed to be in an amorphous state without sharp peaks (A), and those that seemed to be a mixture of both (M).
- the specific resistance was calculated from the sheet resistance and film thickness measured with a four-probe resistance meter (K-705 R L manufactured by Kyowa Riken Co., Ltd.).
- the change in the weight of the substrate before and after the film formation was measured with an Ultramic balance made by INABA SEI S AKS U O S H L T D, and the density was calculated from the value and the film thickness.
- the warpage of two fine glass substrates was measured before and after film formation, and the amount of change was measured, and the length, thickness, Young's modulus, Poisson's ratio, and film thickness of the glass substrates were measured. The internal stress was calculated from the thickness. The results are shown in Table 1.
- the part of the device (ink jet head base) that has not been formed beforehand with the discharge port and liquid passage, provided with the protection staff 6 is replaced with the low conductivity And a rectangular voltage having a width of T sec and a frequency of 5 kHz is applied from an external power source to the electrodes 4 and 5 while gradually increasing the voltage.
- the voltage (V th ) was determined.
- the ink having the above composition has a small conductivity, so that the influence of the electrochemical reaction is small, and the main factor of the fracture is erosion or thermal shock due to cavitation. It is. According to this test, it is possible to know the durability of the heating resistor with respect to these.
- the value of the measurement result was calculated as an average value in the same manner as in (7) above, and the obtained value was used in a foaming durability test in a high conductivity ink in Comparative Example 8 described later.
- the average value of the measurement results was used as the reference value, and the relative value is shown in Table 1 ( kappa black in “Pond Test” in Table 1).
- the ink having the above composition has a high ink conductivity, and a current flows even during the ink when a voltage is applied. According to this test, in addition to the impact erosion due to the cavitation, it is necessary to know the status of whether the electrochemical reaction will damage the heating resistor. Can be done. ⁇ Again, this is an acceleration test for the actual discharge mode.
- Pulse width, frequency (?) In the same manner as in the ®, a constant scan STEP (6 X 1 0 5 Nono. Le vinegar, 2 minutes ⁇ ) a pulse voltage to each rather have high Ku and scan tape performs a class tap be sampled Les scan te be sampled in the air, breaking voltage (V br ea k) and (7! determine the ratio of the required meta-V th (M), the heat acting surface in the V brea k is The temperature reached was estimated, and the results are shown in Table 1. From the test results, it was possible to find out the heat resistance and heat shock resistance of the heating resistor in air. You.
- V th discharge threshold voltage
- Ratio (relative value) of the result of the durability test by the pond test in the low conductivity ink ⁇ 6
- Ratio of the result of the durability test by the pond test in the high conductivity ink (relative value): ⁇ 3
- Example 10 In the same manner as in Example 1 except that the area ratio of each raw material in the sputtering target was changed variously as shown in Table 1 when the heating resistor was formed. A device (substrate for ink jet head) and an ink jet head were manufactured. The obtained devices were analyzed and evaluated in the same manner as in Example 1, and the results are shown in Table 1. In addition, each of the ink jet heads manufactured using these devices had good recording characteristics and durability.
- Example 1 The sputtering equipment used in Example 1 was modified to have multiple target holders in the film forming chamber, and RF power was applied independently to each of the target holders. A film deposition system that can be used has been fabricated. In addition, two target holders each having a purity of 99.9 wt% or more and Ta> Ir were attached to the two target holders of this device. Metals can be sputtered independently and simultaneously. With this apparatus, a film was formed by multi-element simultaneous sputtering under the following conditions, using the same substrate as in Example 1.
- Snotter gas pressure 0.4 P a (A r) The power applied to each target was changed linearly and continuously with respect to the film formation time.
- Example 1 The same analysis and evaluation as in Example 1 were performed on the obtained film, and the results are shown in Table 1. Regarding the composition, separate film formation was carried out under the same conditions with the initial applied power constant and the final applied power constant, and quantitative analysis by EPMA was performed as in Example 1. The results of the analysis were as follows.
- the substrate-side region and the surface-side region of the previously obtained film have the compositions of the above (1) and (2), respectively. It was estimated that the composition changed continuously from (1) to (2) over the side region. By changing the composition in the thickness direction in this way, the adhesion to the substrate is further improved, and the internal stress is favorably controlled.
- Example 10 Using the same apparatus as that used in Example 10, except that the applied power was changed as described below, film formation was performed under the same conditions, and the resulting devices and ink jets were used. The same analysis and evaluation as in Example 1 were performed on the rods, and the results are shown in Table 1.
- a protective layer of 1.0 mm thick Si0z is formed on the layer of the heating resistor of the substrate for the ink head manufactured in the same manner as the substrate for the ink head manufactured in Example 19, respectively. Then, by using the sputtering apparatus shown in FIG. 4 described above to sputter the Si0z, a protective layer of 1.0 mm thick Si0z is formed. Each method was performed except that a Ta protective layer with a thickness of 0.5 // m was provided by sputtering Ta over the Si0z protective layer. In the same manner as in the example, a substrate for an ink jet head and an ink jet head were produced.
- a device (ink) was formed in the same manner as in Example 1 except that a Ta sunset target was used as a sputtering target when the heating resistor was formed.
- a substrate for a jet head) and an ink jet head were manufactured.
- the obtained devices and head to the fin click di We Tsu preparative Example when that put in 1 was analyzed and evaluated in the same manner, t Comparative Example were shown in Table 1 the results 2-7
- the device (a) was formed in the same manner as in Example 1 except that the area ratio of each raw material in the sputtering target was changed as shown in Table 1 when the heating resistor was formed.
- the substrate for the ink jet head) and the ink jet head were manufactured.
- the heating resistor When forming the heating resistor, use a Ta sheet on the A target as the sputtering target, and use the sputtering target.
- the device in the same manner as in Example 1 except that the area ratio of the raw materials in one get was changed as shown in the section of Comparative Example 8 in Table 2, the device (ink device) was used. (A head for a jet head) and an ink jet head.
- the results of the pond test in this comparative example are used as reference values for the results of the pond test in other examples (Examples and other comparative examples).
- Examples and other comparative examples were. That is, as shown in Table 2, the value of the test result in this comparative example is 1 for both the low conductivity ink and the high conductivity ink.
- the result of the pond test with the low conductivity ink was about 0.7 times the result of the pond test with the high conductivity ink. Comparative Examples 9 to 12
- the sputtering When forming the heating resistor, the sputtering —Use the one with the Ta sheet on the target, and use the snow.
- the device for an ink jet head
- Substrate and an ink jet head were prepared.
- Example 2 When forming a heating resistor, use a sputtering target with an Ir sheet provided on the A target as a sputtering target.
- the device substrate for four-ink jet head
- the ink jet were used. A head was prepared.
- the obtained noise and ink jet heads were each analyzed and evaluated in the same manner as in Example 1, and the results were described in Table 3 and above.
- the description is made using a liquid ink, but in the present invention, at room temperature, even if the ink is solid, it can be softened at room temperature. Can be used.
- the temperature of the ink itself is controlled within a range of 30 ° C or more and 70 or less within the following range so that the viscosity of the ink is in a stable discharge range. Since the temperature is generally controlled, it is sufficient if the ink is in a liquid state when the use recording signal is applied.
- positively preventing temperature rise due to thermal energy can be prevented by using the ink as an energy to change the state of the ink from a solid state to a liquid state, or Either use an ink that solidifies in a standing state to prevent evaporation of the ink, and in any case, apply the heat energy according to the recording signal according to the recording signal.
- the use of an ink that has the property of being liquefied only by mature energy, such as one that starts to solidify at the same time, is also applicable to the present invention.
- the ink may be in a porous sheet concave portion or a concave portion as disclosed in JP-A-54-56847 and JP-A-60-71260. It may be configured so as to face the electrothermal converter in a state where the through hole is held as liquid or solid.
- the most effective one for each of the above-mentioned inks is to execute the above-mentioned film boiling method.
- bubbles of liquid (ink) can be formed in one-to-one correspondence with the driving signal, which is effective. Due to the growth and contraction of the bubbles, the liquid (ink) is discharged through the discharge opening to form at least one droplet.
- the driving signal is formed into a pulse shape, the growth and shrinkage of the bubbles are performed immediately and appropriately, so that a liquid (ink) having particularly excellent responsiveness can be discharged, which is more preferable.
- Suitable drive signals of this pulse shape are those described in U.S. Pat. Nos. 4,463,359 and 4,345,262. are doing. Further, if the conditions described in U.S. Pat. No. 4,313,124 of the invention in which the temperature rise rate of the heat acting surface is set to M are adopted, more excellent recording can be performed. Wear.
- a combination of a plurality of recording heads may be used to increase the length of the recording head, or may be configured as a single recording head integrally formed. The effect can be exerted more effectively.
- the recording head of the interchangeable tip which is attached to the main body of the device, enables electrical connection with the main body and supply of ink from the main body, or
- the present invention is also effective when a recording head of a cartridge type integrally provided with an ink tank on the recording head itself is used.
- the recording head has a cabling means, a cleaning means, a pressurizing or suctioning means, an electrothermal converter or another heating element or a heating element. It is also effective to perform a pre-heating mode and a pre-ejection mode in which ejection is performed separately from the recording by performing a pre-ejection mode by combining these.
- the recording mode of the recording device is limited to only mainstream colors such as black.
- the recording head may be configured as a single unit or as a combination of multiple units, but with a multi-color color or a mixed color of different colors.
- the present study is also extremely effective for an apparatus equipped with at least one full-power line.
- Target film composition Film thickness ratio ⁇ Internal stress pool test.
- the resistance to cavitation erosion, electrochemical stability, chemical stability, oxidation resistance, melting resistance, heat resistance, heat shock resistance It is possible to obtain an ink jet head and an ink jet head device having an electrothermal converter having a heating resistor excellent in mechanical durability and the like. .
- the heat energy generated from the heat generating portion of the heat generating resistor can directly act on the ink, so that the heat conduction efficiency to the ink is good.
- the power consumption by the heating resistor can be kept low, and the temperature rise of the head (temperature change of the head) can be significantly reduced, so that the temperature change of the head can be reduced. It is possible to avoid the occurrence of a change in image density due to the image. Further, it is possible to obtain better responsiveness to the ejection signal applied to the heating resistor.
- a desired specific resistance value can be obtained with good controllability and with a very small variation in resistance value in one head.
- Ink jet heads and ink jet devices that have the above-mentioned good characteristics are very suitable for high-speed recording and high-quality printing due to multiple ejection outlets. It will be something.
- FIG. 1 is a schematic front view of a main part of an example of an ink jet head according to the present invention as viewed from a discharge port side.
- FIG. 1 (b) is a schematic cross-sectional view of a portion indicated by a one-point line XY in FIG. 1 (a).
- Fig. 1 (c) shows the base for the ink jet head at the stage where the heating layer and the electrode are provided. It is a schematic plan view of a body.
- FIG. 1 (d) is a schematic plan view of a base for an ink jet head at a stage where a protective layer 6 is provided on those layers.
- FIG. 2 is a schematic cross-sectional view showing another example of the base used for the ink jet head according to the present invention.
- FIGS. 3) and 3 (b) are a schematic top view and a cross-sectional view, respectively, showing another example of an ink jet head according to the present invention.
- FIG. 4 is a schematic cross-sectional view showing one example of a high-frequency sputtering device used for producing a film such as a heating resistor according to the present invention.
- FIG. 1 is an external perspective view showing an example of an ink jet apparatus.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Physical Vapour Deposition (AREA)
- Ceramic Products (AREA)
- Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
- Inspection Of Paper Currency And Valuable Securities (AREA)
- Glass Compositions (AREA)
- Chemical Vapour Deposition (AREA)
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE69019671T DE69019671T2 (de) | 1989-02-28 | 1990-02-28 | Tintenstrahlkopf mit hitzeerzeugendem widerstand aus nichtkristallinem material enthaltend iridium und tantal, sowie tintenstrahlvorrichtung mit solchem kopf. |
EP90903920A EP0425679B1 (en) | 1989-02-28 | 1990-02-28 | Ink jet head having heat-generating resistor constituted of non-monocrystalline substance containing iridium and tantalum, and ink jet device equipped with said head |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4676989 | 1989-02-28 | ||
JP1/46769 | 1989-02-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1990009888A1 true WO1990009888A1 (fr) | 1990-09-07 |
Family
ID=12756537
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1990/000258 WO1990010089A1 (fr) | 1989-02-28 | 1990-02-28 | Nouvelle substance non monocristalline contenant de l'iridium, du tantale et de l'aluminium |
PCT/JP1990/000257 WO1990009888A1 (fr) | 1989-02-28 | 1990-02-28 | Tete a jet d'encre dotee d'une resistance thermogene composee d'une substance non monocristalline contenant de l'iridium, du tantale et de l'aluminium, et dispositif a jet d'encre equipe de ladite tete |
PCT/JP1990/000256 WO1990009887A1 (fr) | 1989-02-28 | 1990-02-28 | Tete a jet d'encre dotee d'une resistance thermogene composee d'une substance non monocristalline contenant de l'iridium, du tantale et de l'aluminium, et dispositif a jet d'encre equipe de ladite tete |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1990/000258 WO1990010089A1 (fr) | 1989-02-28 | 1990-02-28 | Nouvelle substance non monocristalline contenant de l'iridium, du tantale et de l'aluminium |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1990/000256 WO1990009887A1 (fr) | 1989-02-28 | 1990-02-28 | Tete a jet d'encre dotee d'une resistance thermogene composee d'une substance non monocristalline contenant de l'iridium, du tantale et de l'aluminium, et dispositif a jet d'encre equipe de ladite tete |
Country Status (7)
Country | Link |
---|---|
US (3) | US5142308A (ja) |
EP (3) | EP0428730B1 (ja) |
JP (1) | JP3411983B2 (ja) |
AT (3) | ATE122966T1 (ja) |
CA (3) | CA2028124C (ja) |
DE (3) | DE69019671T2 (ja) |
WO (3) | WO1990010089A1 (ja) |
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AU633446B2 (en) * | 1990-08-02 | 1993-01-28 | Boehringer Mannheim Gmbh | Method and device for the metered application of a biochemical analytical liquid to a target |
US6252617B1 (en) | 1992-05-29 | 2001-06-26 | Canon Kabushiki Kaisha | Ink jet recording method |
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JP2821809B2 (ja) * | 1990-10-01 | 1998-11-05 | キヤノン株式会社 | インクジェット記録装置 |
EP0479270B1 (en) * | 1990-10-03 | 1996-05-22 | Canon Kabushiki Kaisha | Recording apparatus |
JP2980444B2 (ja) * | 1991-01-19 | 1999-11-22 | キヤノン株式会社 | 液室内気泡導入機構を備えた液体噴射器およびこれを用いた記録装置および記録方法 |
DE69232570T2 (de) * | 1991-08-02 | 2002-10-02 | Canon Kk | Tintenstrahlkopfträgerschicht, mit dieser Schicht versehener Tintenstrahlkopf und Tintenstrahlaufzeichnungsvorrichtung mit solchem Kopf |
US5992980A (en) * | 1991-08-02 | 1999-11-30 | Canon Kabushiki Kaisha | Substrate for ink jet head, ink jet head provided with said substrate and ink jet apparatus having such ink jet head |
ATE160729T1 (de) * | 1992-04-16 | 1997-12-15 | Canon Kk | Tintenstrahlaufzeichnungskopf und verfahren zu seiner herstellung und aufzeichnungsgerät damit versehen |
US5831648A (en) * | 1992-05-29 | 1998-11-03 | Hitachi Koki Co., Ltd. | Ink jet recording head |
US6406740B1 (en) * | 1992-06-23 | 2002-06-18 | Canon Kabushiki Kaisha | Method of manufacturing a liquid jet recording apparatus and such a liquid jet recording apparatus |
JP3248964B2 (ja) * | 1992-12-22 | 2002-01-21 | キヤノン株式会社 | 液体噴射記録ヘッド及び同ヘッドを備えた液体噴射記録装置 |
US5448273A (en) * | 1993-06-22 | 1995-09-05 | Xerox Corporation | Thermal ink jet printhead protective layers |
US6070969A (en) * | 1994-03-23 | 2000-06-06 | Hewlett-Packard Company | Thermal inkjet printhead having a preferred nucleation site |
US5641421A (en) * | 1994-08-18 | 1997-06-24 | Advanced Metal Tech Ltd | Amorphous metallic alloy electrical heater systems |
US6071470A (en) * | 1995-03-15 | 2000-06-06 | National Research Institute For Metals | Refractory superalloys |
JP3194465B2 (ja) * | 1995-12-27 | 2001-07-30 | 富士写真フイルム株式会社 | インクジェット記録ヘッド |
JPH09216392A (ja) * | 1996-02-09 | 1997-08-19 | Sharp Corp | 光熱変換記録装置 |
EP0794057B1 (en) | 1996-03-04 | 2002-07-03 | Hewlett-Packard Company, A Delaware Corporation | Ink jet pen with a heater element having a contoured surface |
US5901425A (en) | 1996-08-27 | 1999-05-11 | Topaz Technologies Inc. | Inkjet print head apparatus |
US6142612A (en) * | 1998-11-06 | 2000-11-07 | Lexmark International, Inc. | Controlled layer of tantalum for thermal ink jet printer |
US6140909A (en) * | 1999-03-23 | 2000-10-31 | Industrial Technology Research Institute | Heat-generating resistor and use thereof |
US6387719B1 (en) * | 2001-02-28 | 2002-05-14 | Lexmark International, Inc. | Method for improving adhesion |
US20070120929A1 (en) * | 2005-11-29 | 2007-05-31 | Chuan-Yi Wu | Ink Jet Process |
JP2008248322A (ja) * | 2007-03-30 | 2008-10-16 | Ishifuku Metal Ind Co Ltd | 耐熱性Ir基合金 |
US7951708B2 (en) * | 2009-06-03 | 2011-05-31 | International Business Machines Corporation | Copper interconnect structure with amorphous tantalum iridium diffusion barrier |
CN109023007A (zh) * | 2018-09-27 | 2018-12-18 | 江苏高顶电热材料有限公司 | 一种高电阻电热合金生产方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5590376A (en) * | 1978-12-28 | 1980-07-08 | Canon Inc | Multicolor liquid jet device |
JPS55132267A (en) * | 1979-04-02 | 1980-10-14 | Canon Inc | Recording device |
JPS5640565A (en) * | 1979-09-12 | 1981-04-16 | Canon Inc | Liquid injection recording device |
JPS5772867A (en) * | 1980-10-23 | 1982-05-07 | Canon Inc | Liquid injecting recording apparatus |
JPS5996971A (ja) * | 1982-11-26 | 1984-06-04 | Canon Inc | 液体噴射記録装置 |
JPS59135169A (ja) * | 1983-01-25 | 1984-08-03 | Canon Inc | インク噴射記録ヘッド |
JPS6067163A (ja) * | 1983-09-26 | 1985-04-17 | Canon Inc | 液体噴射記録装置 |
JPS6233790A (ja) * | 1985-08-02 | 1987-02-13 | Koji Hashimoto | 活性化非晶質合金電極 |
JPS62280340A (ja) * | 1986-05-27 | 1987-12-05 | ザ スタンダ−ド オイル カンパニ− | ハロゲン電極としてイリジウム基非晶質金属合金を含有する陽極及びその使用方法 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2467675A (en) * | 1942-09-30 | 1949-04-19 | Callite Tungsten Corp | Alloy of high density |
US2719797A (en) * | 1950-05-23 | 1955-10-04 | Baker & Co Inc | Platinizing tantalum |
US3109734A (en) * | 1959-02-18 | 1963-11-05 | Union Carbide Corp | Means of preventing embrittlement in metals exposed to aqueous electrolytes |
US3627577A (en) * | 1968-05-22 | 1971-12-14 | Bell Telephone Labor Inc | Thin film resistors |
US3833410A (en) * | 1971-12-30 | 1974-09-03 | Trw Inc | High stability thin film alloy resistors |
LU67831A1 (ja) * | 1972-10-31 | 1973-08-28 | Siemens Ag | |
GB1424980A (en) * | 1973-06-20 | 1976-02-11 | Siemens Ag | Thin-film electrical circuits |
JPS6036948B2 (ja) * | 1976-03-10 | 1985-08-23 | 株式会社パイロット | ドツトプリンテイングワイヤ− |
US4233185A (en) * | 1976-12-08 | 1980-11-11 | Johnson, Matthey & Co., Limited | Catalysts for oxidation and reduction |
CA1127227A (en) * | 1977-10-03 | 1982-07-06 | Ichiro Endo | Liquid jet recording process and apparatus therefor |
JPS5936879B2 (ja) * | 1977-10-14 | 1984-09-06 | キヤノン株式会社 | 熱転写記録用媒体 |
US4330787A (en) * | 1978-10-31 | 1982-05-18 | Canon Kabushiki Kaisha | Liquid jet recording device |
US4345262A (en) * | 1979-02-19 | 1982-08-17 | Canon Kabushiki Kaisha | Ink jet recording method |
JPS55126462A (en) * | 1979-03-23 | 1980-09-30 | Canon Inc | Recording head |
US4335389A (en) * | 1979-03-27 | 1982-06-15 | Canon Kabushiki Kaisha | Liquid droplet ejecting recording head |
US4463359A (en) * | 1979-04-02 | 1984-07-31 | Canon Kabushiki Kaisha | Droplet generating method and apparatus thereof |
US4313124A (en) * | 1979-05-18 | 1982-01-26 | Canon Kabushiki Kaisha | Liquid jet recording process and liquid jet recording head |
US4429321A (en) * | 1980-10-23 | 1984-01-31 | Canon Kabushiki Kaisha | Liquid jet recording device |
US4558333A (en) * | 1981-07-09 | 1985-12-10 | Canon Kabushiki Kaisha | Liquid jet recording head |
US4514741A (en) * | 1982-11-22 | 1985-04-30 | Hewlett-Packard Company | Thermal ink jet printer utilizing a printhead resistor having a central cold spot |
JPS59123670A (ja) * | 1982-12-28 | 1984-07-17 | Canon Inc | インクジエツトヘツド |
JPS59138461A (ja) * | 1983-01-28 | 1984-08-08 | Canon Inc | 液体噴射記録装置 |
JPS6071260A (ja) * | 1983-09-28 | 1985-04-23 | Erumu:Kk | 記録装置 |
US4931813A (en) * | 1987-09-21 | 1990-06-05 | Hewlett-Packard Company | Ink jet head incorporating a thick unpassivated TaAl resistor |
-
1990
- 1990-02-28 DE DE69019671T patent/DE69019671T2/de not_active Expired - Fee Related
- 1990-02-28 AT AT90903920T patent/ATE122966T1/de not_active IP Right Cessation
- 1990-02-28 US US07/598,707 patent/US5142308A/en not_active Expired - Lifetime
- 1990-02-28 DE DE69020864T patent/DE69020864T2/de not_active Expired - Fee Related
- 1990-02-28 EP EP90903919A patent/EP0428730B1/en not_active Expired - Lifetime
- 1990-02-28 DE DE69027070T patent/DE69027070T2/de not_active Expired - Fee Related
- 1990-02-28 WO PCT/JP1990/000258 patent/WO1990010089A1/ja active IP Right Grant
- 1990-02-28 CA CA002028124A patent/CA2028124C/en not_active Expired - Lifetime
- 1990-02-28 EP EP90903921A patent/EP0412171B1/en not_active Expired - Lifetime
- 1990-02-28 CA CA002028125A patent/CA2028125C/en not_active Expired - Fee Related
- 1990-02-28 AT AT90903921T patent/ATE138418T1/de not_active IP Right Cessation
- 1990-02-28 JP JP50397890A patent/JP3411983B2/ja not_active Expired - Fee Related
- 1990-02-28 WO PCT/JP1990/000257 patent/WO1990009888A1/ja active IP Right Grant
- 1990-02-28 AT AT90903919T patent/ATE124915T1/de not_active IP Right Cessation
- 1990-02-28 EP EP90903920A patent/EP0425679B1/en not_active Expired - Lifetime
- 1990-02-28 CA CA002028123A patent/CA2028123C/en not_active Expired - Fee Related
- 1990-02-28 WO PCT/JP1990/000256 patent/WO1990009887A1/ja active IP Right Grant
- 1990-02-28 US US07/601,714 patent/US5148191A/en not_active Expired - Lifetime
- 1990-10-25 US US07/601,726 patent/US5234774A/en not_active Expired - Lifetime
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5590376A (en) * | 1978-12-28 | 1980-07-08 | Canon Inc | Multicolor liquid jet device |
JPS55132267A (en) * | 1979-04-02 | 1980-10-14 | Canon Inc | Recording device |
JPS5640565A (en) * | 1979-09-12 | 1981-04-16 | Canon Inc | Liquid injection recording device |
JPS5772867A (en) * | 1980-10-23 | 1982-05-07 | Canon Inc | Liquid injecting recording apparatus |
JPS5996971A (ja) * | 1982-11-26 | 1984-06-04 | Canon Inc | 液体噴射記録装置 |
JPS59135169A (ja) * | 1983-01-25 | 1984-08-03 | Canon Inc | インク噴射記録ヘッド |
JPS6067163A (ja) * | 1983-09-26 | 1985-04-17 | Canon Inc | 液体噴射記録装置 |
JPS6233790A (ja) * | 1985-08-02 | 1987-02-13 | Koji Hashimoto | 活性化非晶質合金電極 |
JPS62280340A (ja) * | 1986-05-27 | 1987-12-05 | ザ スタンダ−ド オイル カンパニ− | ハロゲン電極としてイリジウム基非晶質金属合金を含有する陽極及びその使用方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU633446B2 (en) * | 1990-08-02 | 1993-01-28 | Boehringer Mannheim Gmbh | Method and device for the metered application of a biochemical analytical liquid to a target |
US6252617B1 (en) | 1992-05-29 | 2001-06-26 | Canon Kabushiki Kaisha | Ink jet recording method |
Also Published As
Publication number | Publication date |
---|---|
EP0412171A1 (en) | 1991-02-13 |
CA2028123A1 (en) | 1990-08-29 |
ATE124915T1 (de) | 1995-07-15 |
DE69019671T2 (de) | 1995-12-14 |
DE69019671D1 (de) | 1995-06-29 |
CA2028125A1 (en) | 1990-08-29 |
US5234774A (en) | 1993-08-10 |
EP0425679A4 (en) | 1991-10-16 |
CA2028123C (en) | 1998-02-10 |
EP0412171B1 (en) | 1996-05-22 |
US5142308A (en) | 1992-08-25 |
US5148191A (en) | 1992-09-15 |
CA2028125C (en) | 1996-06-18 |
ATE122966T1 (de) | 1995-06-15 |
EP0428730B1 (en) | 1995-07-12 |
WO1990009887A1 (fr) | 1990-09-07 |
EP0425679B1 (en) | 1995-05-24 |
WO1990010089A1 (fr) | 1990-09-07 |
EP0425679A1 (en) | 1991-05-08 |
ATE138418T1 (de) | 1996-06-15 |
EP0428730A1 (en) | 1991-05-29 |
DE69020864T2 (de) | 1995-12-14 |
EP0412171A4 (en) | 1991-09-11 |
JP3411983B2 (ja) | 2003-06-03 |
DE69020864D1 (de) | 1995-08-17 |
DE69027070T2 (de) | 1996-10-24 |
DE69027070D1 (de) | 1996-06-27 |
EP0428730A4 (en) | 1991-10-16 |
CA2028124A1 (en) | 1990-08-29 |
CA2028124C (en) | 1995-12-19 |
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