WO1986006243A1 - Procede de bouchage des trous de perçage prevus dans une carte de circuits imprimes - Google Patents

Procede de bouchage des trous de perçage prevus dans une carte de circuits imprimes Download PDF

Info

Publication number
WO1986006243A1
WO1986006243A1 PCT/DE1986/000165 DE8600165W WO8606243A1 WO 1986006243 A1 WO1986006243 A1 WO 1986006243A1 DE 8600165 W DE8600165 W DE 8600165W WO 8606243 A1 WO8606243 A1 WO 8606243A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
holes
printed circuit
mask
solder resist
Prior art date
Application number
PCT/DE1986/000165
Other languages
German (de)
English (en)
Inventor
Kaspar Eidenberg
Original Assignee
Kaspar Eidenberg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaspar Eidenberg filed Critical Kaspar Eidenberg
Publication of WO1986006243A1 publication Critical patent/WO1986006243A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Definitions

  • the invention relates to a method for closing bores provided in a printed circuit board by applying a solder resist on at least one side of the printed circuit board.
  • Printed circuit boards on which printed circuits are formed are known. These circuit boards have active and passive holes. The components are inserted into the active holes. These are electrically connected with solder. As a result, the active bores are sealed in a vacuum-tight manner. The passive bores serve for the electrical connection of one side to the other side of the circuit board. It is also called a change from one level to the next. For this purpose, the passive holes remain open. They are not closed with solder. The electrical connection from one side to the other of the circuit board takes place, for example, with the so-called through-metallization.
  • the finished printed circuit boards are checked in various ways.
  • the printed circuit boards are pulled into an adapter with negative pressure and held there by the negative pressure. This negative pressure is destroyed by the passive bores which have remained open. To use this test method, the passive bores must therefore also be closed.
  • solder stop mask made of a photopolymer layer.
  • this layer is left tensioned over the holes.
  • a solder mask is a layer made of a so-called solder resist.
  • a solder stop varnish is a varnish which is applied to a printed circuit board according to a certain pattern. It prevents solder from sticking.
  • sealing the holes with a photopolymer layer is a very expensive process.
  • the object of the invention is to find a method for closing bores in a printed circuit board which can be carried out safely and inexpensively.
  • the solution to this problem arises according to the invention in that the bores are closed with a plug from the already mentioned solder stop lacquer.
  • This solder resist is expediently applied in a screen printing process.
  • the screen printing process has great experience and can be carried out inexpensively.
  • the diameter of the holes provided in the first mask should be slightly above the diameter of the holes to be closed. That for the graft desired or required volume can be adjusted with the thickness of the first mask. As the strength increases, the volume of the plugs increases and vice versa.
  • the speed and the extent to which the solder resist penetrates into the holes to be closed can be increased according to the invention by applying a vacuum to the other side of the circuit board.
  • a second mask with a hole pattern corresponding to the number and position of the holes to be closed is placed on the other side of the circuit board and a vacuum is applied, and thus the solder resist is pressed into the holes from one side is supported.
  • the screen used for the screen printing according to the invention and applied to the first mask must be very wide-meshed.
  • the solder resist should also have a high thixotropy. This ensures that it penetrates sufficiently quickly and deeply into the holes to be closed.
  • the amount of the solder resist is adjusted so that it fills at least half the depth of the bore.
  • the method according to the invention can also be applied from the two sides of the printed circuit board. In this case, the bores are half-filled from each side and thus closed in a vacuum-tight manner.
  • Fig. 2 is an exploded perspective view of a circuit board during its manufacture, the the first mask with screen and doctor blade to be placed on it from above and the second mask to be applied to it from below,
  • FIG. 3 shows a partial illustration, partly in section, through the printed circuit board during its manufacture when the solder resist is applied
  • Fig. 4 is an illustration corresponding to FIG. 3 with additional use of the second mask on the underside of the circuit board and applying a vacuum and
  • FIG. 5 shows, on an enlarged scale, the representation of a region from FIG. 5 for better clarification of the process operations.
  • FIG. 1 shows in simplified form a printed circuit board 12 with its bores 14 remaining open. The connections of the schematically illustrated components 16 are inserted into these. 1 further shows the holes 18 to be closed. The conductor tracks 20 run between them. The holes 18 are metallized. The current can thus flow from a conductor track on the top to a conductor track on the underside of the printed circuit board 12. Fitting bores 22 are also provided in the corners of the printed circuit board 12. With these, it is kept in the correct position during its manufacture.
  • FIG. 2 shows the same printed circuit board 12 during its manufacture. All holes are still open.
  • the upper first mask 24 is located above the printed circuit board 12.
  • the lower second mask 26, which can be optionally applied, is located below the printed circuit board 12. Both masks 24 and 26 have holes 28 where the bores 18 to be closed are located .
  • the screen 30 is located directly on the upper mask 24.
  • FIG. 2 further shows the squeegee 32. It can be displaced within the frame 34. The solder resist, the is pressed by the doctor blade 32 into the bores .18 to be closed, is indicated at 36. In the printed circuit board 12, both the holes 14 and the holes 18 are still open.
  • Fig. 3 shows the practice of the method.
  • the printed circuit board 12 lies on a base 38.
  • the upper mask 24 with the holes 28 and the sieve 30 lie on the printed circuit board.
  • the through-metallization 40 of both the open bores 14 and the bores 18 to be closed is also shown.
  • the doctor blade 32 is pushed over the screen 30 in the direction of the arrow shown. He presses the solder resist 36 in front of him through the mesh of the screen 30 and through the holes 28 provided in the upper mask 24. These are located precisely over the holes 18 to be closed.
  • a plug 42 made of solder resist has been pressed into this. It fills approximately half the height of the bore 18.
  • the plug 42 has not yet reached this length in the hole 18 further to the left, above which the solder resist 36 is located.
  • solder resist 36 When using a thixotropic solder resist, it is still liquid when pressed into the bore 18. This facilitates its penetration into the bore 18.
  • the pressure exerted by the doctor blade 32 causes the upper stencil 28 with the screen 30 to be in front of and behind the doctor blade 32 slightly raised. They lie directly on the printed circuit board 12 only under the doctor blade 32.
  • the method can also be carried out from the other side, that is to say from below, as stated above.
  • the penetration of the plugs 42 into the bores 18 can be improved by applying a vacuum to the lower side of the printed circuit board 12. This is shown in FIG. 4.
  • the top of the base 38 is serrated. Channels 44 pass through the base 38.
  • the already mentioned second mask 26 lies on the grooved upper side of the base 38. It has holes 28 on the bores 18 to be closed.
  • the channels 44 are connected to a vacuum source. Via the grooves in the upper side of the base 38, the latter propagates as far as the holes 28 in the second mask 26 and thus into the bores 18 to be closed.
  • FIG. 5 shows the partial area from FIG. 4 on a larger scale, which is located on and somewhat to the left of the doctor blade 32.
  • the description of FIG. 4 relating to this part also applies to FIG. 5.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

Pour boucher les perçages passifs (14, 18) prévus dans une carte de circuits imprimés (12), on pose un masque (24, 26) avec un tamis (30). Aux endroits des perçages (14) à boucher, le masque (24, 26) présente des trous (28). A l'aide d'une raclette (32) on fait pénétrer par le tamis (30) et les trous (28) prévus dans le masque (24) un vernis de bouchage par soudure (36) dans les perçages (18), comme dans le procédé de sérigraphie. L'application d'une dépression sur la face inférieure de la carte de circuits imprimés (12) permet d'accroître la pénétration du vernis de bouchage par soudure dans les perçages (18).
PCT/DE1986/000165 1985-04-16 1986-04-15 Procede de bouchage des trous de perçage prevus dans une carte de circuits imprimes WO1986006243A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP3514093.3 1985-04-16
DE19853514093 DE3514093A1 (de) 1985-04-16 1985-04-16 Verfahren zum verschliessen von in einer leiterplatte vorgesehenen bohrungen

Publications (1)

Publication Number Publication Date
WO1986006243A1 true WO1986006243A1 (fr) 1986-10-23

Family

ID=6268527

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1986/000165 WO1986006243A1 (fr) 1985-04-16 1986-04-15 Procede de bouchage des trous de perçage prevus dans une carte de circuits imprimes

Country Status (3)

Country Link
EP (1) EP0217886A1 (fr)
DE (1) DE3514093A1 (fr)
WO (1) WO1986006243A1 (fr)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4982892A (en) * 1989-11-09 1991-01-08 International Business Machines Corporation Solder interconnects for selective line coupling
EP0329807B1 (fr) * 1988-02-25 1993-03-31 Gebr. Schmid GmbH & Co. Dispositif de traitement de cartes électriques à circuits imprimés
FR2714567A1 (fr) * 1993-12-28 1995-06-30 Thomson Hybrides Procédé de bouchage de trous métallisés de circuits de connexion.
US5825629A (en) * 1994-08-31 1998-10-20 International Business Machines Corporation Print circuit board product with stencil controlled fine pitch solder formation for fine and coarse pitch component attachment
WO1999067978A1 (fr) * 1998-06-24 1999-12-29 Vantico Ag Procede pour recouvrir des cartes de circuits ou des substrats similaires
WO2000013474A1 (fr) * 1998-09-02 2000-03-09 Hadco Santa Clara, Inc. Formation de prises dans des trous d'interconnexion de couches de cartes de circuit imprime et de sous-ensembles
WO2000052974A1 (fr) * 1999-03-04 2000-09-08 Daimlerchrysler Ag Procede de production d'ensembles circuits
FR2813216A1 (fr) * 2000-08-28 2002-03-01 Novatec Dispositif de remplissage de trous debouchants dans un substrat
US6454154B1 (en) 2000-05-31 2002-09-24 Honeywell Advanced Circuits, Inc. Filling device
US6506332B2 (en) 2000-05-31 2003-01-14 Honeywell International Inc. Filling method
FR2837345A1 (fr) * 2002-03-15 2003-09-19 Novatec Procede de remplissage de zones situees en creux sur un substrat
US6793852B2 (en) 2000-05-31 2004-09-21 Ttm Advanced Circuits, Inc. Scavenging method
US6800232B2 (en) 2000-05-31 2004-10-05 Ttm Advanced Circuits, Inc. PCB support plate method for PCB via fill
US6832714B2 (en) 2000-05-31 2004-12-21 Ttm Advanced Circuits, Inc. Heated filling device
US6855385B2 (en) 2000-05-31 2005-02-15 Ttm Advanced Circuits, Inc. PCB support plate for PCB via fill
US6929975B2 (en) 2001-01-13 2005-08-16 Conti Temic Microelectronic Gmbh Method for the production of an electronic component
EP4328028A1 (fr) * 2022-08-23 2024-02-28 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Remplissage des trous d'une structure de support de composants avec un applicateur de support mobile contrôlable et alignable

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19842590A1 (de) * 1998-09-17 2000-04-13 Daimler Chrysler Ag Verfahren zur Herstellung von Schaltungsanordnungen
DE102005011545A1 (de) * 2005-03-10 2006-09-21 Lpkf Laser & Electronics Ag Verfahren zur Kontaktierung von Leiterbahnen einer Leiterplatte

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4323593A (en) * 1979-04-11 1982-04-06 Matsushita Electric Industrial Co., Ltd. Method of printing a spot pattern in a printed circuit board
US4478882A (en) * 1982-06-03 1984-10-23 Italtel Societa Italiana Telecomunicazioni S.P.A. Method for conductively interconnecting circuit components on opposite surfaces of a dielectric layer
FR2551618A1 (fr) * 1983-09-02 1985-03-08 Inf Milit Spatiale Aeronaut Procede de fabrication d'un circuit imprime a couches enterrees et circuit imprime obtenu par un tel procede

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1249966B (de) * 1967-09-14 Ruwel-Werke, Spezialfabrik für Hochfrequenzbauteile, Inh. Ing. Fritz Stahl, Geldern (RhId.) Verfahren zum Herstellen von metallisierten Wandungen von Bohrungen in gedruckten Leiterplatten
DE3217983C2 (de) * 1982-05-13 1984-03-29 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Verfahren zum Herstellen einer Abdeckmaske
BE896966A (nl) * 1983-06-06 1983-12-06 Bell Telephone Mfg Zeefdrukproces en -toestel en daarmee verdregen elektische gedrukte ketens

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4323593A (en) * 1979-04-11 1982-04-06 Matsushita Electric Industrial Co., Ltd. Method of printing a spot pattern in a printed circuit board
US4478882A (en) * 1982-06-03 1984-10-23 Italtel Societa Italiana Telecomunicazioni S.P.A. Method for conductively interconnecting circuit components on opposite surfaces of a dielectric layer
FR2551618A1 (fr) * 1983-09-02 1985-03-08 Inf Milit Spatiale Aeronaut Procede de fabrication d'un circuit imprime a couches enterrees et circuit imprime obtenu par un tel procede

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0329807B1 (fr) * 1988-02-25 1993-03-31 Gebr. Schmid GmbH & Co. Dispositif de traitement de cartes électriques à circuits imprimés
US4982892A (en) * 1989-11-09 1991-01-08 International Business Machines Corporation Solder interconnects for selective line coupling
US5308928A (en) * 1989-11-09 1994-05-03 International Business Machines Corporation Soldering interconnects for selective line coupling
FR2714567A1 (fr) * 1993-12-28 1995-06-30 Thomson Hybrides Procédé de bouchage de trous métallisés de circuits de connexion.
US5825629A (en) * 1994-08-31 1998-10-20 International Business Machines Corporation Print circuit board product with stencil controlled fine pitch solder formation for fine and coarse pitch component attachment
WO1999067978A1 (fr) * 1998-06-24 1999-12-29 Vantico Ag Procede pour recouvrir des cartes de circuits ou des substrats similaires
US6517895B1 (en) 1998-06-24 2003-02-11 Vantico Inc. Method of coating both sides of printed circuit boards having holes
WO2000013474A1 (fr) * 1998-09-02 2000-03-09 Hadco Santa Clara, Inc. Formation de prises dans des trous d'interconnexion de couches de cartes de circuit imprime et de sous-ensembles
US6276055B1 (en) 1998-09-02 2001-08-21 Hadco Santa Clara, Inc. Method and apparatus for forming plugs in vias of a circuit board layer
US6282782B1 (en) 1998-09-02 2001-09-04 Hadco Santa Clara, Inc. Forming plugs in vias of circuit board layers and subassemblies
WO2000052974A1 (fr) * 1999-03-04 2000-09-08 Daimlerchrysler Ag Procede de production d'ensembles circuits
US6820798B1 (en) 1999-03-04 2004-11-23 Conti Temic Microelectronic Gmbh Method for producing circuit arrangments
US6454154B1 (en) 2000-05-31 2002-09-24 Honeywell Advanced Circuits, Inc. Filling device
US6855385B2 (en) 2000-05-31 2005-02-15 Ttm Advanced Circuits, Inc. PCB support plate for PCB via fill
US7066378B2 (en) 2000-05-31 2006-06-27 Ttm Advanced Circuits, Inc. Filling device
US6995321B2 (en) 2000-05-31 2006-02-07 Honeywell Advanced Circuits Etched hole-fill stand-off
US6793852B2 (en) 2000-05-31 2004-09-21 Ttm Advanced Circuits, Inc. Scavenging method
US6797224B2 (en) 2000-05-31 2004-09-28 Ttm Advanced Technologies, Inc. Heated filling method
US6800232B2 (en) 2000-05-31 2004-10-05 Ttm Advanced Circuits, Inc. PCB support plate method for PCB via fill
US6506332B2 (en) 2000-05-31 2003-01-14 Honeywell International Inc. Filling method
US6832714B2 (en) 2000-05-31 2004-12-21 Ttm Advanced Circuits, Inc. Heated filling device
US6840425B2 (en) 2000-05-31 2005-01-11 Ttm Advanced Circuits, Inc. Scavenging system
FR2813216A1 (fr) * 2000-08-28 2002-03-01 Novatec Dispositif de remplissage de trous debouchants dans un substrat
WO2002019782A1 (fr) * 2000-08-28 2002-03-07 Novatec S.A. Procede collectif de remplissage affleurant de trous debouchants dans un substrat
US6929975B2 (en) 2001-01-13 2005-08-16 Conti Temic Microelectronic Gmbh Method for the production of an electronic component
FR2837345A1 (fr) * 2002-03-15 2003-09-19 Novatec Procede de remplissage de zones situees en creux sur un substrat
EP4328028A1 (fr) * 2022-08-23 2024-02-28 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Remplissage des trous d'une structure de support de composants avec un applicateur de support mobile contrôlable et alignable

Also Published As

Publication number Publication date
EP0217886A1 (fr) 1987-04-15
DE3514093A1 (de) 1986-10-23

Similar Documents

Publication Publication Date Title
WO1986006243A1 (fr) Procede de bouchage des trous de perçage prevus dans une carte de circuits imprimes
DE2539925A1 (de) Verfahren zur herstellung einer mehrschichtigen gedruckten schaltungsplatte
DE3420966A1 (de) Siebdruckverfahren und einrichtung zur ausuebung desselben
DE2926335A1 (de) Verfahren zur herstellung gedruckter schaltungen
DE4020498C2 (de) Verfahren zum Herstellen von Multiwire-Leiterplatten mit isolierten Metalleitern und/oder optischen Leitern
DE10245688A1 (de) Mehrschichtkeramikelektronikteil, Elektronikteilaggregat und Verfahren zum Herstellen eines Mehrschichtkeramikelektronikteils
DE102007058497A1 (de) Laminierte mehrschichtige Leiterplatte
DE102006059429A1 (de) Modul für eine Prüfvorrichtung zum Testen von Leiterplatten
DE69929144T2 (de) Eine Leiterplatte umfassende elektronische Schaltungseinheit zur Verwendung für tragbare Telefone oder dergleichen, und Verfahren zu ihrer Herstellung
EP1701600A1 (fr) Procédé de mise en contact des pistes conductrices d'une carte de circuit imprimé
DE3316017A1 (de) Verfahren zur herstellung elektrischer verbindungen an multisubstratschaltungen, sowie hiernach hergestellte multisubstratschaltungen
EP3257335A1 (fr) Procédé de fabrication d'un contact traversant dans une carte de circuit imprimé multicouche
AT398876B (de) Zwei- oder mehrlagige leiterplatte
EP0299136A2 (fr) Procédé de fabrication d'une plaque de circuit
DE1930642A1 (de) Leiterplatte zum Aufnehmen und Verbinden elektrischer Bauelemente
DE19511226A1 (de) SMD-Verbindung für elektronische Steuergeräte in Kraftfahrzeugen
DE4310930A1 (de) Leiterplattenanordnung und Verfahren zur Herstellung einer bestückten Leiterplatte
DE1920061U (de) Traegerplatte nach art der gedruckten schaltung mit in mehreren ebenen vorgesehenen metalleiterbahnen, die zum teil miteinander im elektrischer kontakt stehen.
DE2611871A1 (de) Elektrische schaltungsbaugruppe in mehrschichtbauweise und verfahren zu deren herstellung
DE10043471A1 (de) Metallschablonen
DE3523646A1 (de) Mehrschichtige schaltungsplatine mit plattierten durchgangsbohrungen
DE4232666C1 (de) Verfahren zum Herstellen von Leiterplatten
DE1814805A1 (de) Elektrische Querverbindung zwischen zwei oder mehreren Leiberebenen von gedruckten Schaltungen
EP1741322B1 (fr) Procede pour produire des cartes a circuits imprimes et/ou des structures equivalentes
DE1590615B1 (de) Verfahren zur Herstellung kreuzungsfreier,gedruckter Schaltungen

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): US

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH DE FR GB IT LU NL SE