USD989012S1 - Elastic membrane - Google Patents

Elastic membrane Download PDF

Info

Publication number
USD989012S1
USD989012S1 US29/774,336 US202129774336F USD989012S US D989012 S1 USD989012 S1 US D989012S1 US 202129774336 F US202129774336 F US 202129774336F US D989012 S USD989012 S US D989012S
Authority
US
United States
Prior art keywords
elastic membrane
view
elastic
membrane
design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/774,336
Inventor
Kenichi AKAZAWA
Osamu Nabeya
Shingo Togashi
Satoru Yamaki
Tomoko OWADA
Cheng Cheng
Yuichi Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2020019863F external-priority patent/JP1683319S/en
Priority claimed from JP2020019864F external-priority patent/JP1683320S/en
Application filed by Ebara Corp filed Critical Ebara Corp
Assigned to EBARA CORPORATION reassignment EBARA CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHENG, CHENG, NABEYA, OSAMU, TOGASHI, SHINGO, YAMAKI, SATORU, AKAZAWA, KENICHI, KATO, YUICHI, OWADA, TOMOKO
Priority to US29/874,375 priority Critical patent/USD1021832S1/en
Application granted granted Critical
Publication of USD989012S1 publication Critical patent/USD989012S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a top perspective view of an elastic membrane showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a front view thereof, a rear view being identical thereto;
FIG. 6 is a right-side view thereof, a left-side view being identical thereto;
FIG. 7 is a cross sectional view taken along section line 7-7 in FIG. 3 ; and,
FIG. 8 is an enlarged portion view take along line 8-8 of FIG. 7 .
The broken lines in the drawings depict portions of the elastic membrane that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an elastic membrane, as shown and described.
US29/774,336 2020-09-17 2021-03-16 Elastic membrane Active USD989012S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/874,375 USD1021832S1 (en) 2020-09-17 2023-04-19 Elastic membrane

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020019863F JP1683319S (en) 2020-09-17 2020-09-17 Elastic film for polishing semiconductor wafers
JP2020-019863D 2020-09-17
JP2020-019864D 2020-09-17
JP2020019864F JP1683320S (en) 2020-09-17 2020-09-17 Elastic film for polishing semiconductor wafers

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/874,375 Division USD1021832S1 (en) 2020-09-17 2023-04-19 Elastic membrane

Publications (1)

Publication Number Publication Date
USD989012S1 true USD989012S1 (en) 2023-06-13

Family

ID=86670967

Family Applications (2)

Application Number Title Priority Date Filing Date
US29/774,336 Active USD989012S1 (en) 2020-09-17 2021-03-16 Elastic membrane
US29/874,375 Active USD1021832S1 (en) 2020-09-17 2023-04-19 Elastic membrane

Family Applications After (1)

Application Number Title Priority Date Filing Date
US29/874,375 Active USD1021832S1 (en) 2020-09-17 2023-04-19 Elastic membrane

Country Status (1)

Country Link
US (2) USD989012S1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1010415S1 (en) * 2021-10-27 2024-01-09 Mirka Ltd Backing pad for sander
USD1029602S1 (en) * 2022-01-04 2024-06-04 Noritake Co., Limited Polishing pad dresser
USD1084782S1 (en) * 2024-03-25 2025-07-22 Wellfine Silicone Products Co., Ltd. Bread basket

Citations (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD720313S1 (en) * 2014-06-16 2014-12-30 Emcore Solar Power, Inc. Semiconductor wafer with dicing positions for solar cell fabrication
USD723077S1 (en) * 2013-12-03 2015-02-24 Applied Materials, Inc. Chuck carrier film
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770992S1 (en) * 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD793976S1 (en) * 2013-05-15 2017-08-08 Ebara Corporation Substrate retaining ring
USD795208S1 (en) * 2015-08-18 2017-08-22 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD819580S1 (en) * 2016-04-01 2018-06-05 Veeco Instruments, Inc. Self-centering wafer carrier for chemical vapor deposition
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
US20180301367A1 (en) 2017-04-12 2018-10-18 Ebara Corporation Elastic membrane, substrate holding device, and polishing apparatus
USD832023S1 (en) * 2015-10-27 2018-10-30 Meyer Intellectual Properties Limited Circular grill pan
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD862404S1 (en) * 2016-10-25 2019-10-08 Kokusai Electric Corporation Sealing material ring for a semiconductor manufacturing apparatus
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US20190375070A1 (en) 2018-05-21 2019-12-12 Ebara Corporation Substrate holding apparatus, substrate polishing apparatus, elastic member, and manufacturing method of substrate holding apparatus
USD894137S1 (en) * 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD908645S1 (en) * 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD920936S1 (en) * 2019-01-17 2021-06-01 Asm Ip Holding B.V. Higher temperature vented susceptor
USD931240S1 (en) * 2019-07-30 2021-09-21 Applied Materials, Inc. Substrate support pedestal
USD933033S1 (en) * 2018-10-12 2021-10-12 Valqua, Ltd. Seal member for semiconductor production apparatus
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD937329S1 (en) * 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD939459S1 (en) * 2019-08-07 2021-12-28 Kokusai Electric Corporation Boat for wafer processing apparatus
USD940765S1 (en) * 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD944946S1 (en) * 2019-06-14 2022-03-01 Asm Ip Holding B.V. Shower plate
USD947144S1 (en) * 2019-05-10 2022-03-29 Tdk Corporation Vibration element for a haptic actuator
USD947914S1 (en) * 2020-11-23 2022-04-05 Applied Materials, Inc. Base plate for a processing chamber substrate support
USD949116S1 (en) * 2019-05-03 2022-04-19 Lumileds Holding B.V. Flexible circuit board with connectors

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3627338A (en) * 1969-10-09 1971-12-14 Sheldon Thompson Vacuum chuck
USD312126S (en) * 1988-02-10 1990-11-13 Redring Electric Limited Electric heater element for use in a radiant heater for a glass ceramic hob
USD323385S (en) * 1990-02-10 1992-01-21 Ceramaspeed Limited Radiant stove heater
USD517743S1 (en) * 2003-12-09 2006-03-21 Le Creuset Of America, Inc. Hotpad
USD541486S1 (en) * 2005-07-22 2007-04-24 Le Creuset Of America, Inc. Hotpad
USD650344S1 (en) * 2008-10-20 2011-12-13 Ebara Corporation Vacuum contact pad
USD616389S1 (en) * 2008-10-20 2010-05-25 Ebara Corporation Vacuum contact pad
USD625558S1 (en) * 2010-02-05 2010-10-19 Chef'n Corporation Trivet
JP1581406S (en) * 2016-10-14 2017-07-18
USD859331S1 (en) * 2017-03-31 2019-09-10 Ebara Corporation Vacuum contact pad
USD921431S1 (en) * 2019-04-01 2021-06-08 Veeco Instruments, Inc. Multi-filament heater assembly
JP1651623S (en) * 2019-07-18 2020-01-27
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber

Patent Citations (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD793976S1 (en) * 2013-05-15 2017-08-08 Ebara Corporation Substrate retaining ring
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD723077S1 (en) * 2013-12-03 2015-02-24 Applied Materials, Inc. Chuck carrier film
USD720313S1 (en) * 2014-06-16 2014-12-30 Emcore Solar Power, Inc. Semiconductor wafer with dicing positions for solar cell fabrication
USD770992S1 (en) * 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD795208S1 (en) * 2015-08-18 2017-08-22 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD832023S1 (en) * 2015-10-27 2018-10-30 Meyer Intellectual Properties Limited Circular grill pan
USD819580S1 (en) * 2016-04-01 2018-06-05 Veeco Instruments, Inc. Self-centering wafer carrier for chemical vapor deposition
USD862404S1 (en) * 2016-10-25 2019-10-08 Kokusai Electric Corporation Sealing material ring for a semiconductor manufacturing apparatus
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD913977S1 (en) * 2016-12-12 2021-03-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
US20180301367A1 (en) 2017-04-12 2018-10-18 Ebara Corporation Elastic membrane, substrate holding device, and polishing apparatus
USD894137S1 (en) * 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US20190375070A1 (en) 2018-05-21 2019-12-12 Ebara Corporation Substrate holding apparatus, substrate polishing apparatus, elastic member, and manufacturing method of substrate holding apparatus
USD933033S1 (en) * 2018-10-12 2021-10-12 Valqua, Ltd. Seal member for semiconductor production apparatus
USD933619S1 (en) * 2018-10-12 2021-10-19 Valqua, Ltd. Seal member for semiconductor production apparatus
USD920936S1 (en) * 2019-01-17 2021-06-01 Asm Ip Holding B.V. Higher temperature vented susceptor
USD958764S1 (en) * 2019-01-17 2022-07-26 Asm Ip Holding B.V. Higher temperature vented susceptor
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD949116S1 (en) * 2019-05-03 2022-04-19 Lumileds Holding B.V. Flexible circuit board with connectors
USD947144S1 (en) * 2019-05-10 2022-03-29 Tdk Corporation Vibration element for a haptic actuator
USD944946S1 (en) * 2019-06-14 2022-03-01 Asm Ip Holding B.V. Shower plate
USD931240S1 (en) * 2019-07-30 2021-09-21 Applied Materials, Inc. Substrate support pedestal
USD939459S1 (en) * 2019-08-07 2021-12-28 Kokusai Electric Corporation Boat for wafer processing apparatus
USD908645S1 (en) * 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD937329S1 (en) * 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD947914S1 (en) * 2020-11-23 2022-04-05 Applied Materials, Inc. Base plate for a processing chamber substrate support
USD940765S1 (en) * 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD966357S1 (en) * 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
SV Tech Parts—No Announcement Date [online], retrieved on Nov. 1, 2022, retrieved from internet, http://www.svtechparts.com/index.php/high-tech/semiconductor-equipment/ebara-cmp-polishing-head-from-ebara-cmp-epo-113-system.html. *
Systa—No Announcement Date [online], retrieved on Nov. 1, 2022, retrieved from internet, http://www.systa.kr/index.html?div=part&menu_1st=CK&menu_2nd=CUK&maker=&cont=view&sys_code=H2SYSCK07973. *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1010415S1 (en) * 2021-10-27 2024-01-09 Mirka Ltd Backing pad for sander
USD1029602S1 (en) * 2022-01-04 2024-06-04 Noritake Co., Limited Polishing pad dresser
USD1084782S1 (en) * 2024-03-25 2025-07-22 Wellfine Silicone Products Co., Ltd. Bread basket
USD1086814S1 (en) * 2024-03-25 2025-08-05 Wellfine Silicone Products Co., Ltd. Bread basket

Also Published As

Publication number Publication date
USD1021832S1 (en) 2024-04-09

Similar Documents

Publication Publication Date Title
USD923350S1 (en) Chair
USD915093S1 (en) Chair
USD981740S1 (en) Chair
USD975712S1 (en) Membrane keyboard
USD1011108S1 (en) Desk
USD938941S1 (en) Earphone
USD975442S1 (en) Suitcase
USD934606S1 (en) Chair
USD1025632S1 (en) Chair
USD949125S1 (en) Headphones
USD1022498S1 (en) Chair
USD942282S1 (en) Hygrothermograph
USD1083924S1 (en) Keyboard
USD1029434S1 (en) Mop
USD983948S1 (en) Bidet
USD1021832S1 (en) Elastic membrane
USD923683S1 (en) Speedlite
USD1011346S1 (en) Keyboard
USD983947S1 (en) Bidet
USD1044307S1 (en) Chair
USD1022502S1 (en) Chair
USD895069S1 (en) Faucet
USD940577S1 (en) Scale
USD984179S1 (en) Desk
USD952603S1 (en) Loudspeaker

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY