USD981969S1 - Elastic membrane for semiconductor wafer polishing apparatus - Google Patents

Elastic membrane for semiconductor wafer polishing apparatus Download PDF

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Publication number
USD981969S1
USD981969S1 US29/794,758 US202129794758F USD981969S US D981969 S1 USD981969 S1 US D981969S1 US 202129794758 F US202129794758 F US 202129794758F US D981969 S USD981969 S US D981969S
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US
United States
Prior art keywords
semiconductor wafer
polishing apparatus
elastic membrane
wafer polishing
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Active
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US29/794,758
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English (en)
Inventor
Kenichi AKAZAWA
Tomoko OWADA
Osamu Nabeya
Makoto Fukushima
Yuichi Kato
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Ebara Corp
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Ebara Corp
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Assigned to EBARA CORPORATION reassignment EBARA CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FUKUSHIMA, MAKOTO, AKAZAWA, KENICHI, KATO, YUICHI, NABEYA, OSAMU, OWADA, TOMOKO
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US29/794,758 2020-12-18 2021-06-15 Elastic membrane for semiconductor wafer polishing apparatus Active USD981969S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2020-27290F JP1692349S (https=) 2020-12-18 2020-12-18
JP2020-027290D 2020-12-18

Publications (1)

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USD981969S1 true USD981969S1 (en) 2023-03-28

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US29/794,758 Active USD981969S1 (en) 2020-12-18 2021-06-15 Elastic membrane for semiconductor wafer polishing apparatus

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JP (1) JP1692349S (https=)

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD364384S (en) * 1994-05-23 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
US6659850B2 (en) * 2000-03-31 2003-12-09 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
USD633452S1 (en) * 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
TWD167111S (zh) 2013-05-15 2015-04-11 荏原製作所股份有限公司 半導體晶圓硏磨裝置用彈性膜
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770990S1 (en) * 2013-05-15 2016-11-08 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD790041S1 (en) * 2016-01-08 2017-06-20 Asm Ip Holding B.V. Gas dispersing plate for semiconductor manufacturing apparatus
USD808349S1 (en) * 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
TWD197827S (zh) 2017-12-19 2019-06-01 Ebara Corp 半導體晶圓研磨用彈性膜
USD859332S1 (en) 2017-06-29 2019-09-10 Ebara Corporation Elastic membrane for semiconductor wafer polishing
US10537975B2 (en) 2015-08-18 2020-01-21 Ebara Corporation Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus
USD918161S1 (en) * 2017-12-19 2021-05-04 Ebara Corporation Elastic membrane
TWD215079S (zh) 2020-09-17 2021-11-01 日商荏原製作所股份有限公司 半導體晶圓研磨用彈性膜

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD364384S (en) * 1994-05-23 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
US6659850B2 (en) * 2000-03-31 2003-12-09 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
USD633452S1 (en) * 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD813180S1 (en) * 2013-05-15 2018-03-20 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770990S1 (en) * 2013-05-15 2016-11-08 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD808349S1 (en) * 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
TWD167111S (zh) 2013-05-15 2015-04-11 荏原製作所股份有限公司 半導體晶圓硏磨裝置用彈性膜
US10537975B2 (en) 2015-08-18 2020-01-21 Ebara Corporation Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus
USD790041S1 (en) * 2016-01-08 2017-06-20 Asm Ip Holding B.V. Gas dispersing plate for semiconductor manufacturing apparatus
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD913977S1 (en) * 2016-12-12 2021-03-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD859332S1 (en) 2017-06-29 2019-09-10 Ebara Corporation Elastic membrane for semiconductor wafer polishing
TWD197827S (zh) 2017-12-19 2019-06-01 Ebara Corp 半導體晶圓研磨用彈性膜
USD918161S1 (en) * 2017-12-19 2021-05-04 Ebara Corporation Elastic membrane
TWD215079S (zh) 2020-09-17 2021-11-01 日商荏原製作所股份有限公司 半導體晶圓研磨用彈性膜

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