USD939459S1 - Boat for wafer processing apparatus - Google Patents

Boat for wafer processing apparatus Download PDF

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Publication number
USD939459S1
USD939459S1 US29/716,458 US201929716458F USD939459S US D939459 S1 USD939459 S1 US D939459S1 US 201929716458 F US201929716458 F US 201929716458F US D939459 S USD939459 S US D939459S
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US
United States
Prior art keywords
view
boat
processing apparatus
wafer processing
elevational view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/716,458
Inventor
Hironori Shimada
Daigi KAMIMURA
Tomoshi Taniyama
Shuhei SAIDO
Takafumi Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KAMIMURA, DAIGI, SAIDO, SHUHEI, SASAKI, TAKAFUMI, SHIMADA, HIRONORI, TANIYAMA, TOMOSHI
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FIG. 1 is a front, top and right side perspective view of a boat for wafer processing apparatus showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is an enlarged portion view taken from the portion labeled FIG. 8 in FIG. 2;
FIG. 9 is a cross-sectional view in the direction of the arrows along line 9-9 in FIG. 2;
FIG. 10 is a cross-sectional view in the direction of the arrows along line 10-10 in FIG. 2;
FIG. 11 is a perspective view of FIG. 8 with the cylindrical device shown in broken lines removed for ease of illustration;
FIG. 12 is a front elevational view of FIG. 11;
FIG. 13 is a right side elevational view of FIG. 11;
FIG. 14 is a left side elevational view of FIG. 11;
FIG. 15 is a rear elevational view of FIG. 11;
FIG. 16 is a top plan view of FIG. 11; and,
FIG. 17 is a bottom plan view of FIG. 11.
For clarity, due to the nature and size of the portions of the article that form no part of the claimed design in FIGS. 9 and 10, hatching to indicate the cut sections is not shown in FIGS. 9 and 10.
The dashed-dot-dashed lines represent the boundary lines of the claimed design in FIGS. 1-5 and 8. The even dashed broken lines showing a full or portions of a cylindrical device in FIGS. 1-10 are included for the purpose of illustrating environment and form no part of the claimed design. The dot-dash broken line of the box showing the enlarged portion view of FIG. 8 in FIG.2 shows the bounds of the enlarged portion view and forms no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a boat for wafer processing apparatus, as shown and described.
US29/716,458 2019-08-07 2019-12-10 Boat for wafer processing apparatus Active USD939459S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-017637 2019-08-07
JPD2019-17637F JP1658652S (en) 2019-08-07 2019-08-07

Publications (1)

Publication Number Publication Date
USD939459S1 true USD939459S1 (en) 2021-12-28

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ID=70335647

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/716,458 Active USD939459S1 (en) 2019-08-07 2019-12-10 Boat for wafer processing apparatus

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US (1) USD939459S1 (en)
JP (1) JP1658652S (en)
TW (1) TWD208179S (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210035835A1 (en) * 2019-07-31 2021-02-04 Kokusai Electric Corporation Substrate processing apparatus, substrate support, and method of manufacturing semiconductor device
USD989012S1 (en) * 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
USD1019581S1 (en) * 2022-05-30 2024-03-26 Kokusai Electric Corporation Inner tube of reaction tube for semiconductor manufacturing equipment
USD1019583S1 (en) * 2022-05-30 2024-03-26 Kokusai Electric Corporation Inner tube of reaction tube for semiconductor manufacturing equipment
USD1019582S1 (en) * 2022-05-30 2024-03-26 Kokusai Electric Corporation Inner tube of reaction tube for semiconductor manufacturing equipment
USD1042374S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1042373S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1718541S (en) 2021-10-15 2022-06-29 Carrier board for handling
JP1724481S (en) 2021-10-15 2022-09-12 Carrier substrate for handling
JP1727916S (en) 2021-10-15 2022-10-21 Carrier substrate for handling
JP1718604S (en) 2021-10-15 2022-06-29 Carrier board for handling
JP1724567S (en) 2021-10-15 2022-09-12 Carrier substrate for handling

Citations (37)

* Cited by examiner, † Cited by third party
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USD366868S (en) * 1993-09-29 1996-02-06 Tokyo Electron Kabushiki Kaisha Wafer boat or rack
USD378675S (en) * 1995-05-30 1997-04-01 Tokyo Electron Limited Wafer boat
USD378823S (en) * 1995-05-30 1997-04-15 Tokyo Electron Limited Wafer boat
USD380454S (en) * 1995-05-30 1997-07-01 Tokyo Electron Limited Wafer boat
US5752609A (en) * 1996-02-06 1998-05-19 Tokyo Electron Limited Wafer boat
USD404015S (en) * 1997-01-31 1999-01-12 Tokyo Electron Ltd. Wafer boat for use in a semiconductor wafer heat processing apparatus
USD404371S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
USD409158S (en) * 1997-08-20 1999-05-04 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
USD411176S (en) * 1997-08-20 1999-06-22 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
US6062853A (en) * 1996-02-29 2000-05-16 Tokyo Electron Limited Heat-treating boat for semiconductor wafers
US6065615A (en) * 1996-02-28 2000-05-23 Asahi Glass Company, Ltd. Vertical wafer boat
US6099302A (en) * 1998-06-23 2000-08-08 Samsung Electronics Co., Ltd. Semiconductor wafer boat with reduced wafer contact area
US6287112B1 (en) * 2000-03-30 2001-09-11 Asm International, N.V. Wafer boat
US6341935B1 (en) * 2000-06-14 2002-01-29 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer boat having improved wafer holding capability
US20020092815A1 (en) * 2001-01-18 2002-07-18 Hong-Guen Kim Semiconductor wafer boat having stackable independently replaceable boat parts and vertical heat-treating apparatus comprising the same
US20020113027A1 (en) * 2001-02-20 2002-08-22 Mitsubishi Denki Kabushiki Kaisha Retainer for use in heat treatment of substrate, substrate heat treatment equipment, and method of manufacturing the retainer
US6966771B2 (en) * 2001-12-27 2005-11-22 Tokyo Electron Limited Boat for heat treatment and vertical heat treatment equipment
US7033168B1 (en) * 2005-01-24 2006-04-25 Memc Electronic Materials, Inc. Semiconductor wafer boat for a vertical furnace
USD570308S1 (en) * 2006-05-01 2008-06-03 Tokyo Electron Limited Wafer boat
USD570309S1 (en) * 2006-10-25 2008-06-03 Tokyo Electron Limited Wafer boat
USD580894S1 (en) * 2006-05-01 2008-11-18 Tokyo Electron Limited Wafer boat
US7484958B2 (en) * 2003-07-16 2009-02-03 Shin-Etsu Handotai Co., Ltd. Vertical boat for heat treatment and method for producing the same
USD600222S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
USD600221S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
USD616396S1 (en) * 2009-03-12 2010-05-25 Tokyo Electron Limited Pedestal of heat insulating cylinder for manufacturing semiconductor wafers
US7857140B2 (en) * 2005-12-06 2010-12-28 Fujitsu Semiconductor Limited Semiconductor wafer storage case and semiconductor wafer storing method
USD655255S1 (en) * 2010-06-18 2012-03-06 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
USD655682S1 (en) * 2010-06-18 2012-03-13 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
USD734730S1 (en) * 2012-12-27 2015-07-21 Hitachi Kokusai Electric Inc. Boat of substrate processing apparatus
USD737785S1 (en) * 2013-07-29 2015-09-01 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD738329S1 (en) * 2013-07-29 2015-09-08 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD739831S1 (en) * 2013-03-22 2015-09-29 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD740769S1 (en) * 2013-03-22 2015-10-13 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD747279S1 (en) * 2013-07-29 2016-01-12 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD839219S1 (en) * 2016-02-12 2019-01-29 Kokusai Electric Corporation Boat for substrate processing apparatus
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus

Patent Citations (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD366868S (en) * 1993-09-29 1996-02-06 Tokyo Electron Kabushiki Kaisha Wafer boat or rack
USD378675S (en) * 1995-05-30 1997-04-01 Tokyo Electron Limited Wafer boat
USD378823S (en) * 1995-05-30 1997-04-15 Tokyo Electron Limited Wafer boat
USD380454S (en) * 1995-05-30 1997-07-01 Tokyo Electron Limited Wafer boat
US5752609A (en) * 1996-02-06 1998-05-19 Tokyo Electron Limited Wafer boat
US6065615A (en) * 1996-02-28 2000-05-23 Asahi Glass Company, Ltd. Vertical wafer boat
US6062853A (en) * 1996-02-29 2000-05-16 Tokyo Electron Limited Heat-treating boat for semiconductor wafers
USD404015S (en) * 1997-01-31 1999-01-12 Tokyo Electron Ltd. Wafer boat for use in a semiconductor wafer heat processing apparatus
USD411176S (en) * 1997-08-20 1999-06-22 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
USD409158S (en) * 1997-08-20 1999-05-04 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
USD404371S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
US6099302A (en) * 1998-06-23 2000-08-08 Samsung Electronics Co., Ltd. Semiconductor wafer boat with reduced wafer contact area
US6287112B1 (en) * 2000-03-30 2001-09-11 Asm International, N.V. Wafer boat
US6341935B1 (en) * 2000-06-14 2002-01-29 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer boat having improved wafer holding capability
US20020092815A1 (en) * 2001-01-18 2002-07-18 Hong-Guen Kim Semiconductor wafer boat having stackable independently replaceable boat parts and vertical heat-treating apparatus comprising the same
US20020113027A1 (en) * 2001-02-20 2002-08-22 Mitsubishi Denki Kabushiki Kaisha Retainer for use in heat treatment of substrate, substrate heat treatment equipment, and method of manufacturing the retainer
US6966771B2 (en) * 2001-12-27 2005-11-22 Tokyo Electron Limited Boat for heat treatment and vertical heat treatment equipment
US7484958B2 (en) * 2003-07-16 2009-02-03 Shin-Etsu Handotai Co., Ltd. Vertical boat for heat treatment and method for producing the same
US7033168B1 (en) * 2005-01-24 2006-04-25 Memc Electronic Materials, Inc. Semiconductor wafer boat for a vertical furnace
US7857140B2 (en) * 2005-12-06 2010-12-28 Fujitsu Semiconductor Limited Semiconductor wafer storage case and semiconductor wafer storing method
USD570308S1 (en) * 2006-05-01 2008-06-03 Tokyo Electron Limited Wafer boat
USD580894S1 (en) * 2006-05-01 2008-11-18 Tokyo Electron Limited Wafer boat
USD570309S1 (en) * 2006-10-25 2008-06-03 Tokyo Electron Limited Wafer boat
USD600222S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
USD600221S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
USD616396S1 (en) * 2009-03-12 2010-05-25 Tokyo Electron Limited Pedestal of heat insulating cylinder for manufacturing semiconductor wafers
USD655255S1 (en) * 2010-06-18 2012-03-06 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
USD655682S1 (en) * 2010-06-18 2012-03-13 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
USD734730S1 (en) * 2012-12-27 2015-07-21 Hitachi Kokusai Electric Inc. Boat of substrate processing apparatus
USD739831S1 (en) * 2013-03-22 2015-09-29 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD740769S1 (en) * 2013-03-22 2015-10-13 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD737785S1 (en) * 2013-07-29 2015-09-01 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD738329S1 (en) * 2013-07-29 2015-09-08 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD747279S1 (en) * 2013-07-29 2016-01-12 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD839219S1 (en) * 2016-02-12 2019-01-29 Kokusai Electric Corporation Boat for substrate processing apparatus
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210035835A1 (en) * 2019-07-31 2021-02-04 Kokusai Electric Corporation Substrate processing apparatus, substrate support, and method of manufacturing semiconductor device
US11929272B2 (en) * 2019-07-31 2024-03-12 Kokusai Electric Corporation Substrate processing apparatus, substrate support, and method of manufacturing semiconductor device
USD989012S1 (en) * 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD1021832S1 (en) 2020-09-17 2024-04-09 Ebara Corporation Elastic membrane
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
USD1042374S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1042373S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1019581S1 (en) * 2022-05-30 2024-03-26 Kokusai Electric Corporation Inner tube of reaction tube for semiconductor manufacturing equipment
USD1019583S1 (en) * 2022-05-30 2024-03-26 Kokusai Electric Corporation Inner tube of reaction tube for semiconductor manufacturing equipment
USD1019582S1 (en) * 2022-05-30 2024-03-26 Kokusai Electric Corporation Inner tube of reaction tube for semiconductor manufacturing equipment

Also Published As

Publication number Publication date
TWD208179S (en) 2020-11-11
JP1658652S (en) 2020-04-27

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