USD920264S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD920264S1
USD920264S1 US29/715,103 US201929715103F USD920264S US D920264 S1 USD920264 S1 US D920264S1 US 201929715103 F US201929715103 F US 201929715103F US D920264 S USD920264 S US D920264S
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US
United States
Prior art keywords
semiconductor device
view
ornamental design
semiconductor
perspective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/715,103
Inventor
James P. McBRIDE
James Richard Stanfield
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Noco Co
Original Assignee
Noco Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US29/715,103 priority Critical patent/USD920264S1/en
Application filed by Noco Co filed Critical Noco Co
Priority to PCT/US2020/062417 priority patent/WO2021108706A1/en
Priority to AU2020393921A priority patent/AU2020393921B2/en
Priority to CA3163239A priority patent/CA3163239A1/en
Priority to MX2022006313A priority patent/MX2022006313A/en
Priority to JP2022531061A priority patent/JP7408804B2/en
Priority to US17/756,556 priority patent/US12080634B2/en
Priority to CN202080081824.XA priority patent/CN114830439A/en
Priority to GB2207806.7A priority patent/GB2605306A/en
Assigned to THE NOCO COMPANY reassignment THE NOCO COMPANY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MCBRIDE, JAMES P., STANFIELD, JAMES RICHARD
Application granted granted Critical
Publication of USD920264S1 publication Critical patent/USD920264S1/en
Priority to AU2023204342A priority patent/AU2023204342B2/en
Priority to JP2023214360A priority patent/JP2024041768A/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of a semiconductor device showing our new design;
FIG. 2 is a left side view thereof;
FIG. 3 is a right side view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a front view thereof;
FIG. 6 is a top view thereof; and,
FIG. 7 is a bottom view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor device, as shown and described.
US29/715,103 2019-11-27 2019-11-27 Semiconductor device Active USD920264S1 (en)

Priority Applications (11)

Application Number Priority Date Filing Date Title
US29/715,103 USD920264S1 (en) 2019-11-27 2019-11-27 Semiconductor device
GB2207806.7A GB2605306A (en) 2019-11-27 2020-11-25 Semiconductor device, printed circuit board (PCB), and method of interfacing control pin (gate pin) of a power semiconductor device (MOSFET) to a printed...
CA3163239A CA3163239A1 (en) 2019-11-27 2020-11-25 Semiconductor device, printed circuit board (pcb), and method of interfacing control pin (gate pin) of a power semiconductor device (mosfet) to a printed circuit board (pcb) in a battery management system (bms)
MX2022006313A MX2022006313A (en) 2019-11-27 2020-11-25 Semiconductor device, printed circuit board (pcb), and method of interfacing control pin (gate pin) of a power semiconductor device (mosfet) to a printed circuit board (pcb) in a battery management system (bms).
JP2022531061A JP7408804B2 (en) 2019-11-27 2020-11-25 How to interface control pins (gate pins) of power semiconductor devices (MOSFETs) to printed circuit boards (PCBs) in semiconductor devices, printed circuit boards (PCBs), and battery management systems (BMS)
US17/756,556 US12080634B2 (en) 2019-11-27 2020-11-25 Semiconductor device, printed circuit board (PCB), and method of interfacing control pin (gate pin) of a power semiconductor device (MOSFET) to a printed circuit board (PCB)
PCT/US2020/062417 WO2021108706A1 (en) 2019-11-27 2020-11-25 Semiconductor device, printed circuit board (pcb), and method of interfacing control pin (gate pin) of a power semiconductor device (mosfet) to a printed circuit board (pcb) in a battery management system (bms)
AU2020393921A AU2020393921B2 (en) 2019-11-27 2020-11-25 Semiconductor device, printed circuit board (PCB), and method of interfacing control pin (gate pin) of a power semiconductor device (MOSFET) to a printed circuit board (PCB) in a battery management system (BMS)
CN202080081824.XA CN114830439A (en) 2019-11-27 2020-11-25 Semiconductor device, Printed Circuit Board (PCB) and method for interfacing control pins (gate pins) of a power semiconductor device (MOSFET) to a Printed Circuit Board (PCB) in a Battery Management System (BMS)
AU2023204342A AU2023204342B2 (en) 2019-11-27 2023-07-06 Semiconductor device, printed circuit board (PCB), and method of interfacing control pin (gate pin) of a power semiconductor device (MOSFET) to a printed circuit board (PCB) in a battery management system (BMS)
JP2023214360A JP2024041768A (en) 2019-11-27 2023-12-20 Semiconductor device, printed circuit board (pcb), and method of interfacing control pin (gate pin) of power semiconductor device (mosfet) to printed circuit board (pcb) in battery management system (bms)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/715,103 USD920264S1 (en) 2019-11-27 2019-11-27 Semiconductor device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/715,105 Continuation-In-Part USD932452S1 (en) 2019-11-27 2019-11-27 Semiconductor device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US17/756,556 Continuation-In-Part US12080634B2 (en) 2019-11-27 2020-11-25 Semiconductor device, printed circuit board (PCB), and method of interfacing control pin (gate pin) of a power semiconductor device (MOSFET) to a printed circuit board (PCB)

Publications (1)

Publication Number Publication Date
USD920264S1 true USD920264S1 (en) 2021-05-25

Family

ID=75921085

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/715,103 Active USD920264S1 (en) 2019-11-27 2019-11-27 Semiconductor device

Country Status (1)

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US (1) USD920264S1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD973029S1 (en) * 2020-12-15 2022-12-20 Rohm Co., Ltd. Semiconductor device
USD1042376S1 (en) * 2022-02-25 2024-09-17 Rohm Co., Ltd. Semiconductor module

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USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD874411S1 (en) * 2008-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
DE102019128825A1 (en) * 2018-10-25 2020-04-30 Infineon Technologies Ag SEMICONDUCTOR HOUSING WITH LINE FRAME CONNECTION STRUCTURE
US10790245B2 (en) * 2016-06-27 2020-09-29 NGK Electronics Devices, Inc. High-frequency ceramic board and high-frequency semiconductor element package
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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US4807087A (en) * 1986-11-20 1989-02-21 Kabushiki Kaisha Toshiba Single-in-line type semiconductor device
USD317592S (en) * 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
US6100580A (en) * 1988-09-20 2000-08-08 Hitachi, Ltd. Semiconductor device having all outer leads extending from one side of a resin member
US4916519A (en) * 1989-05-30 1990-04-10 International Business Machines Corporation Semiconductor package
USD345731S (en) * 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
US5563441A (en) * 1992-12-11 1996-10-08 Mitsubishi Denki Kabushiki Kaisha Lead frame assembly including a semiconductor device and a resistance wire
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD395638S (en) * 1997-01-30 1998-06-30 Sony Corporation Semiconductor package
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USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
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USD421969S (en) * 1998-09-29 2000-03-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
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USD874411S1 (en) * 2008-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
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USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD973029S1 (en) * 2020-12-15 2022-12-20 Rohm Co., Ltd. Semiconductor device
USD1042376S1 (en) * 2022-02-25 2024-09-17 Rohm Co., Ltd. Semiconductor module

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