USD920264S1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- USD920264S1 USD920264S1 US29/715,103 US201929715103F USD920264S US D920264 S1 USD920264 S1 US D920264S1 US 201929715103 F US201929715103 F US 201929715103F US D920264 S USD920264 S US D920264S
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- US
- United States
- Prior art keywords
- semiconductor device
- view
- ornamental design
- semiconductor
- perspective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Claims (1)
- The ornamental design for a semiconductor device, as shown and described.
Priority Applications (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/715,103 USD920264S1 (en) | 2019-11-27 | 2019-11-27 | Semiconductor device |
GB2207806.7A GB2605306A (en) | 2019-11-27 | 2020-11-25 | Semiconductor device, printed circuit board (PCB), and method of interfacing control pin (gate pin) of a power semiconductor device (MOSFET) to a printed... |
CA3163239A CA3163239A1 (en) | 2019-11-27 | 2020-11-25 | Semiconductor device, printed circuit board (pcb), and method of interfacing control pin (gate pin) of a power semiconductor device (mosfet) to a printed circuit board (pcb) in a battery management system (bms) |
MX2022006313A MX2022006313A (en) | 2019-11-27 | 2020-11-25 | Semiconductor device, printed circuit board (pcb), and method of interfacing control pin (gate pin) of a power semiconductor device (mosfet) to a printed circuit board (pcb) in a battery management system (bms). |
JP2022531061A JP7408804B2 (en) | 2019-11-27 | 2020-11-25 | How to interface control pins (gate pins) of power semiconductor devices (MOSFETs) to printed circuit boards (PCBs) in semiconductor devices, printed circuit boards (PCBs), and battery management systems (BMS) |
US17/756,556 US12080634B2 (en) | 2019-11-27 | 2020-11-25 | Semiconductor device, printed circuit board (PCB), and method of interfacing control pin (gate pin) of a power semiconductor device (MOSFET) to a printed circuit board (PCB) |
PCT/US2020/062417 WO2021108706A1 (en) | 2019-11-27 | 2020-11-25 | Semiconductor device, printed circuit board (pcb), and method of interfacing control pin (gate pin) of a power semiconductor device (mosfet) to a printed circuit board (pcb) in a battery management system (bms) |
AU2020393921A AU2020393921B2 (en) | 2019-11-27 | 2020-11-25 | Semiconductor device, printed circuit board (PCB), and method of interfacing control pin (gate pin) of a power semiconductor device (MOSFET) to a printed circuit board (PCB) in a battery management system (BMS) |
CN202080081824.XA CN114830439A (en) | 2019-11-27 | 2020-11-25 | Semiconductor device, Printed Circuit Board (PCB) and method for interfacing control pins (gate pins) of a power semiconductor device (MOSFET) to a Printed Circuit Board (PCB) in a Battery Management System (BMS) |
AU2023204342A AU2023204342B2 (en) | 2019-11-27 | 2023-07-06 | Semiconductor device, printed circuit board (PCB), and method of interfacing control pin (gate pin) of a power semiconductor device (MOSFET) to a printed circuit board (PCB) in a battery management system (BMS) |
JP2023214360A JP2024041768A (en) | 2019-11-27 | 2023-12-20 | Semiconductor device, printed circuit board (pcb), and method of interfacing control pin (gate pin) of power semiconductor device (mosfet) to printed circuit board (pcb) in battery management system (bms) |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/715,103 USD920264S1 (en) | 2019-11-27 | 2019-11-27 | Semiconductor device |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/715,105 Continuation-In-Part USD932452S1 (en) | 2019-11-27 | 2019-11-27 | Semiconductor device |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/756,556 Continuation-In-Part US12080634B2 (en) | 2019-11-27 | 2020-11-25 | Semiconductor device, printed circuit board (PCB), and method of interfacing control pin (gate pin) of a power semiconductor device (MOSFET) to a printed circuit board (PCB) |
Publications (1)
Publication Number | Publication Date |
---|---|
USD920264S1 true USD920264S1 (en) | 2021-05-25 |
Family
ID=75921085
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/715,103 Active USD920264S1 (en) | 2019-11-27 | 2019-11-27 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
US (1) | USD920264S1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD973029S1 (en) * | 2020-12-15 | 2022-12-20 | Rohm Co., Ltd. | Semiconductor device |
USD1042376S1 (en) * | 2022-02-25 | 2024-09-17 | Rohm Co., Ltd. | Semiconductor module |
Citations (43)
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US4807087A (en) * | 1986-11-20 | 1989-02-21 | Kabushiki Kaisha Toshiba | Single-in-line type semiconductor device |
US4916519A (en) * | 1989-05-30 | 1990-04-10 | International Business Machines Corporation | Semiconductor package |
US4951124A (en) * | 1986-10-24 | 1990-08-21 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD317592S (en) * | 1987-01-19 | 1991-06-18 | Canon Kabushiki Kaisha | Semiconductor element |
USD345731S (en) * | 1992-12-03 | 1994-04-05 | Motorola, Inc. | Semiconductor package |
US5563441A (en) * | 1992-12-11 | 1996-10-08 | Mitsubishi Denki Kabushiki Kaisha | Lead frame assembly including a semiconductor device and a resistance wire |
USD394244S (en) * | 1995-11-27 | 1998-05-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD395423S (en) * | 1997-03-13 | 1998-06-23 | Sony Corporation | Semiconductor package |
USD395638S (en) * | 1997-01-30 | 1998-06-30 | Sony Corporation | Semiconductor package |
USD396846S (en) * | 1997-04-16 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
USD396847S (en) * | 1996-10-17 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
USD418485S (en) * | 1998-09-29 | 2000-01-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD421969S (en) * | 1998-09-29 | 2000-03-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD428859S (en) * | 1999-01-28 | 2000-08-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
US6100580A (en) * | 1988-09-20 | 2000-08-08 | Hitachi, Ltd. | Semiconductor device having all outer leads extending from one side of a resin member |
USD432097S (en) * | 1999-11-20 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor package |
USD448740S1 (en) * | 2000-11-30 | 2001-10-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD448739S1 (en) * | 2000-09-12 | 2001-10-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
US6476481B2 (en) * | 1998-05-05 | 2002-11-05 | International Rectifier Corporation | High current capacity semiconductor device package and lead frame with large area connection posts and modified outline |
USD466485S1 (en) * | 2001-05-23 | 2002-12-03 | Shindengen Electric Manufactuturing Co., Ltd. | Semiconductor package |
USD470463S1 (en) * | 2001-11-30 | 2003-02-18 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD470824S1 (en) * | 2001-11-30 | 2003-02-25 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
US20030042584A1 (en) * | 2001-09-05 | 2003-03-06 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and method of manufacturing the same |
USD472530S1 (en) * | 2001-11-30 | 2003-04-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD489338S1 (en) * | 2003-07-28 | 2004-05-04 | Semiconductor Components Industries, L.L.C. | Packaged semiconductor device |
USD505400S1 (en) * | 2004-03-26 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD505399S1 (en) * | 2003-03-14 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD539761S1 (en) * | 2006-08-22 | 2007-04-03 | Kabushiki Kaisha Toshiba | Semiconductor |
USD548202S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
USD548203S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
USD717255S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717254S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717253S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717256S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD719113S1 (en) * | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
US20170133315A1 (en) * | 2014-07-30 | 2017-05-11 | Kyocera Corporation | Electronic component housing package, and electronic device comprising same |
USD824866S1 (en) * | 2016-09-30 | 2018-08-07 | Rohm Co., Ltd. | Semiconductor device |
USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
USD874411S1 (en) * | 2008-04-13 | 2020-02-04 | Rohm Co., Ltd. | Semiconductor module |
DE102019128825A1 (en) * | 2018-10-25 | 2020-04-30 | Infineon Technologies Ag | SEMICONDUCTOR HOUSING WITH LINE FRAME CONNECTION STRUCTURE |
US10790245B2 (en) * | 2016-06-27 | 2020-09-29 | NGK Electronics Devices, Inc. | High-frequency ceramic board and high-frequency semiconductor element package |
USD902877S1 (en) * | 2018-06-12 | 2020-11-24 | Rohm Co., Ltd. | Packaged semiconductor module |
-
2019
- 2019-11-27 US US29/715,103 patent/USD920264S1/en active Active
Patent Citations (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4951124A (en) * | 1986-10-24 | 1990-08-21 | Kabushiki Kaisha Toshiba | Semiconductor device |
US4807087A (en) * | 1986-11-20 | 1989-02-21 | Kabushiki Kaisha Toshiba | Single-in-line type semiconductor device |
USD317592S (en) * | 1987-01-19 | 1991-06-18 | Canon Kabushiki Kaisha | Semiconductor element |
US6100580A (en) * | 1988-09-20 | 2000-08-08 | Hitachi, Ltd. | Semiconductor device having all outer leads extending from one side of a resin member |
US4916519A (en) * | 1989-05-30 | 1990-04-10 | International Business Machines Corporation | Semiconductor package |
USD345731S (en) * | 1992-12-03 | 1994-04-05 | Motorola, Inc. | Semiconductor package |
US5563441A (en) * | 1992-12-11 | 1996-10-08 | Mitsubishi Denki Kabushiki Kaisha | Lead frame assembly including a semiconductor device and a resistance wire |
USD394244S (en) * | 1995-11-27 | 1998-05-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD396847S (en) * | 1996-10-17 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
USD395638S (en) * | 1997-01-30 | 1998-06-30 | Sony Corporation | Semiconductor package |
USD395423S (en) * | 1997-03-13 | 1998-06-23 | Sony Corporation | Semiconductor package |
USD396846S (en) * | 1997-04-16 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
US6476481B2 (en) * | 1998-05-05 | 2002-11-05 | International Rectifier Corporation | High current capacity semiconductor device package and lead frame with large area connection posts and modified outline |
USD418485S (en) * | 1998-09-29 | 2000-01-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD421969S (en) * | 1998-09-29 | 2000-03-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD428859S (en) * | 1999-01-28 | 2000-08-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD432097S (en) * | 1999-11-20 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor package |
USD448739S1 (en) * | 2000-09-12 | 2001-10-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD448740S1 (en) * | 2000-11-30 | 2001-10-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD466485S1 (en) * | 2001-05-23 | 2002-12-03 | Shindengen Electric Manufactuturing Co., Ltd. | Semiconductor package |
US20030042584A1 (en) * | 2001-09-05 | 2003-03-06 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and method of manufacturing the same |
USD470463S1 (en) * | 2001-11-30 | 2003-02-18 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD472530S1 (en) * | 2001-11-30 | 2003-04-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD470824S1 (en) * | 2001-11-30 | 2003-02-25 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD505399S1 (en) * | 2003-03-14 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD489338S1 (en) * | 2003-07-28 | 2004-05-04 | Semiconductor Components Industries, L.L.C. | Packaged semiconductor device |
USD505400S1 (en) * | 2004-03-26 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD548203S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
USD548202S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
USD539761S1 (en) * | 2006-08-22 | 2007-04-03 | Kabushiki Kaisha Toshiba | Semiconductor |
USD874411S1 (en) * | 2008-04-13 | 2020-02-04 | Rohm Co., Ltd. | Semiconductor module |
USD717255S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD719113S1 (en) * | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717256S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717254S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717253S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
USD783550S1 (en) * | 2014-04-02 | 2017-04-11 | Mitsubishi Electric Corporation | Power semiconductor device |
US20170133315A1 (en) * | 2014-07-30 | 2017-05-11 | Kyocera Corporation | Electronic component housing package, and electronic device comprising same |
US10790245B2 (en) * | 2016-06-27 | 2020-09-29 | NGK Electronics Devices, Inc. | High-frequency ceramic board and high-frequency semiconductor element package |
USD824866S1 (en) * | 2016-09-30 | 2018-08-07 | Rohm Co., Ltd. | Semiconductor device |
USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
USD902877S1 (en) * | 2018-06-12 | 2020-11-24 | Rohm Co., Ltd. | Packaged semiconductor module |
DE102019128825A1 (en) * | 2018-10-25 | 2020-04-30 | Infineon Technologies Ag | SEMICONDUCTOR HOUSING WITH LINE FRAME CONNECTION STRUCTURE |
Non-Patent Citations (4)
Title |
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Crystals Electronic Isolator Semiconductor, Connector Devices Private Limited,https://www.indiamart.com/proddetail/crystals-electronic-isolator-semiconductor-7050210097.html, Apr. 2008 (Year: 2008). * |
Crystals Electronic Isolator Semiconductor, Connector Devices Private Limited,https://www.indiamart.com/proddetail/crystals-electronic-isolator-semiconductor-7050210097.html, April 2008 (Year: 2008) * |
Semiconductor Device, Siddhi Electronics,https://www.indiamart.com/proddetail/semiconductor-device-11687884748.html.Jan. 2011 (Year: 2011) * |
Semiconductor Device, Siddhi Electronics,https://www.indiamart.com/proddetail/semiconductor-device-11687884748.html.Jan. 2011 (Year: 2011). * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD973029S1 (en) * | 2020-12-15 | 2022-12-20 | Rohm Co., Ltd. | Semiconductor device |
USD1042376S1 (en) * | 2022-02-25 | 2024-09-17 | Rohm Co., Ltd. | Semiconductor module |
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