USD404371S - Wafer boat for use in a semiconductor wafer heat processing apparatus - Google Patents
Wafer boat for use in a semiconductor wafer heat processing apparatus Download PDFInfo
- Publication number
- USD404371S USD404371S US29/083,425 US8342598F USD404371S US D404371 S USD404371 S US D404371S US 8342598 F US8342598 F US 8342598F US D404371 S USD404371 S US D404371S
- Authority
- US
- United States
- Prior art keywords
- processing apparatus
- heat processing
- semiconductor wafer
- wafer
- boat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 3
Images
Description
FIG. 1 a perspective view of a wafer boat for use in a semiconductor wafer heat processing apparatus;
FIG. 2 a front elevational view thereof;
FIG. 3 a cross-sectional view taken along line III--III in FIG. 2;
FIG. 4 a cross-sectional view taken along line IV--IV in FIG. 2;
FIG. 5 a top plan view thereof;
FIG. 6 a right side view thereof;
FIG. 7 a rear elevational view thereof; and,
FIG. 8 a bottom plan view thereof.
Claims (1)
- I claim the ornamental design for wafer boat for use in a semiconductor wafer heat processing apparatus, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6509997 | 1997-08-20 | ||
| JP9-65099 | 1997-08-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD404371S true USD404371S (en) | 1999-01-19 |
Family
ID=71729423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/083,425 Expired - Lifetime USD404371S (en) | 1997-08-20 | 1998-02-05 | Wafer boat for use in a semiconductor wafer heat processing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD404371S (en) |
Cited By (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6196211B1 (en) | 1999-04-15 | 2001-03-06 | Integrated Materials, Inc. | Support members for wafer processing fixtures |
| US6205993B1 (en) | 1999-04-15 | 2001-03-27 | Integrated Materials, Inc. | Method and apparatus for fabricating elongate crystalline members |
| US6225594B1 (en) | 1999-04-15 | 2001-05-01 | Integrated Materials, Inc. | Method and apparatus for securing components of wafer processing fixtures |
| US6450346B1 (en) | 2000-06-30 | 2002-09-17 | Integrated Materials, Inc. | Silicon fixtures for supporting wafers during thermal processing |
| US6455395B1 (en) | 2000-06-30 | 2002-09-24 | Integrated Materials, Inc. | Method of fabricating silicon structures including fixtures for supporting wafers |
| US20040129203A1 (en) * | 2001-05-18 | 2004-07-08 | Raanan Zehavi | Silicon tube formed of bonded staves |
| US20060216942A1 (en) * | 2005-03-23 | 2006-09-28 | Samsung Electronics Co., Ltd. | Wafer carrier for minimizing contacting area with wafers |
| US20070006799A1 (en) * | 2001-05-18 | 2007-01-11 | Zehavi Ranaan Y | Silicon wafer support fixture with roughended surface |
| USD551634S1 (en) * | 2005-02-28 | 2007-09-25 | Tokyo Electron Limited | Wafer-boat for heat-processing of semiconductor wafers |
| USD570308S1 (en) * | 2006-05-01 | 2008-06-03 | Tokyo Electron Limited | Wafer boat |
| USD580894S1 (en) * | 2006-05-01 | 2008-11-18 | Tokyo Electron Limited | Wafer boat |
| USD734730S1 (en) * | 2012-12-27 | 2015-07-21 | Hitachi Kokusai Electric Inc. | Boat of substrate processing apparatus |
| USD737785S1 (en) * | 2013-07-29 | 2015-09-01 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
| USD738329S1 (en) * | 2013-07-29 | 2015-09-08 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
| USD739831S1 (en) * | 2013-03-22 | 2015-09-29 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
| USD740769S1 (en) * | 2013-03-22 | 2015-10-13 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
| USD747279S1 (en) * | 2013-07-29 | 2016-01-12 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
| USD763807S1 (en) * | 2014-05-22 | 2016-08-16 | Hzo, Inc. | Boat for a deposition apparatus |
| USD769201S1 (en) * | 2014-11-20 | 2016-10-18 | Tokyo Electron Limited | Wafer boat |
| USD772183S1 (en) * | 2014-11-20 | 2016-11-22 | Tokyo Electron Limited | Wafer boat |
| USD789310S1 (en) * | 2014-11-20 | 2017-06-13 | Tokyo Electron Limited | Wafer boat |
| USD791721S1 (en) * | 2014-11-20 | 2017-07-11 | Tokyo Electron Limited | Wafer boat |
| USD839219S1 (en) * | 2016-02-12 | 2019-01-29 | Kokusai Electric Corporation | Boat for substrate processing apparatus |
| USD846514S1 (en) * | 2018-05-03 | 2019-04-23 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
| USD847105S1 (en) * | 2018-05-03 | 2019-04-30 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
| US20190287832A1 (en) * | 2018-03-13 | 2019-09-19 | Samsung Electronics Co., Ltd. | Segmented vertical wafer boat |
| USD893438S1 (en) * | 2017-08-21 | 2020-08-18 | Tokyo Electron Limited | Wafer boat |
| USD908103S1 (en) * | 2019-02-20 | 2021-01-19 | Veeco Instruments Inc. | Transportable semiconductor wafer rack |
| USD908102S1 (en) * | 2019-02-20 | 2021-01-19 | Veeco Instruments Inc. | Transportable semiconductor wafer rack |
| USD939459S1 (en) * | 2019-08-07 | 2021-12-28 | Kokusai Electric Corporation | Boat for wafer processing apparatus |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD291413S (en) | 1984-07-30 | 1987-08-18 | Tokyo Denshi Kagaku Co., Ltd. | Wafer holding frame |
| US4743156A (en) | 1986-05-09 | 1988-05-10 | Motorola, Inc. | Dump transfer wafer carrier |
| US4857689A (en) | 1988-03-23 | 1989-08-15 | High Temperature Engineering Corporation | Rapid thermal furnace for semiconductor processing |
| US5174045A (en) | 1991-05-17 | 1992-12-29 | Semitool, Inc. | Semiconductor processor with extendible receiver for handling multiple discrete wafers without wafer carriers |
| US5314574A (en) | 1992-06-26 | 1994-05-24 | Tokyo Electron Kabushiki Kaisha | Surface treatment method and apparatus |
| US5320218A (en) | 1992-04-07 | 1994-06-14 | Shinko Electric Co., Ltd. | Closed container to be used in a clean room |
| USD361752S (en) | 1993-09-17 | 1995-08-29 | Tokyo Electron Kasbushiki Kaisha | Wafer boat or rack for holding semiconductor wafers |
| USD378823S (en) | 1995-05-30 | 1997-04-15 | Tokyo Electron Limited | Wafer boat |
-
1998
- 1998-02-05 US US29/083,425 patent/USD404371S/en not_active Expired - Lifetime
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD291413S (en) | 1984-07-30 | 1987-08-18 | Tokyo Denshi Kagaku Co., Ltd. | Wafer holding frame |
| US4743156A (en) | 1986-05-09 | 1988-05-10 | Motorola, Inc. | Dump transfer wafer carrier |
| US4857689A (en) | 1988-03-23 | 1989-08-15 | High Temperature Engineering Corporation | Rapid thermal furnace for semiconductor processing |
| US5174045A (en) | 1991-05-17 | 1992-12-29 | Semitool, Inc. | Semiconductor processor with extendible receiver for handling multiple discrete wafers without wafer carriers |
| US5320218A (en) | 1992-04-07 | 1994-06-14 | Shinko Electric Co., Ltd. | Closed container to be used in a clean room |
| US5314574A (en) | 1992-06-26 | 1994-05-24 | Tokyo Electron Kabushiki Kaisha | Surface treatment method and apparatus |
| USD361752S (en) | 1993-09-17 | 1995-08-29 | Tokyo Electron Kasbushiki Kaisha | Wafer boat or rack for holding semiconductor wafers |
| USD378823S (en) | 1995-05-30 | 1997-04-15 | Tokyo Electron Limited | Wafer boat |
Cited By (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6196211B1 (en) | 1999-04-15 | 2001-03-06 | Integrated Materials, Inc. | Support members for wafer processing fixtures |
| US6205993B1 (en) | 1999-04-15 | 2001-03-27 | Integrated Materials, Inc. | Method and apparatus for fabricating elongate crystalline members |
| US6225594B1 (en) | 1999-04-15 | 2001-05-01 | Integrated Materials, Inc. | Method and apparatus for securing components of wafer processing fixtures |
| US6357432B2 (en) | 1999-04-15 | 2002-03-19 | Integrated Materials, Inc. | Silicon support members for wafer processing fixtures |
| US6617540B2 (en) | 1999-04-15 | 2003-09-09 | Integrated Materials, Inc. | Wafer support fixture composed of silicon |
| US6450346B1 (en) | 2000-06-30 | 2002-09-17 | Integrated Materials, Inc. | Silicon fixtures for supporting wafers during thermal processing |
| US6455395B1 (en) | 2000-06-30 | 2002-09-24 | Integrated Materials, Inc. | Method of fabricating silicon structures including fixtures for supporting wafers |
| US6617225B2 (en) | 2000-06-30 | 2003-09-09 | Integrated Materials, Inc. | Method of machining silicon |
| US7137546B2 (en) * | 2001-05-18 | 2006-11-21 | Integrated Materials, Inc. | Silicon tube formed of bonded staves |
| US20070006799A1 (en) * | 2001-05-18 | 2007-01-11 | Zehavi Ranaan Y | Silicon wafer support fixture with roughended surface |
| US20070020885A1 (en) * | 2001-05-18 | 2007-01-25 | Integrated Materials, Inc. | Tube Formed of Bonded Silicon Staves |
| US7854974B2 (en) | 2001-05-18 | 2010-12-21 | Integrated Materials, Inc. | Tube formed of bonded silicon staves |
| US20040129203A1 (en) * | 2001-05-18 | 2004-07-08 | Raanan Zehavi | Silicon tube formed of bonded staves |
| USD551634S1 (en) * | 2005-02-28 | 2007-09-25 | Tokyo Electron Limited | Wafer-boat for heat-processing of semiconductor wafers |
| US20060216942A1 (en) * | 2005-03-23 | 2006-09-28 | Samsung Electronics Co., Ltd. | Wafer carrier for minimizing contacting area with wafers |
| USD570308S1 (en) * | 2006-05-01 | 2008-06-03 | Tokyo Electron Limited | Wafer boat |
| USD580894S1 (en) * | 2006-05-01 | 2008-11-18 | Tokyo Electron Limited | Wafer boat |
| USD734730S1 (en) * | 2012-12-27 | 2015-07-21 | Hitachi Kokusai Electric Inc. | Boat of substrate processing apparatus |
| USD739831S1 (en) * | 2013-03-22 | 2015-09-29 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
| USD740769S1 (en) * | 2013-03-22 | 2015-10-13 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
| USD737785S1 (en) * | 2013-07-29 | 2015-09-01 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
| USD747279S1 (en) * | 2013-07-29 | 2016-01-12 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
| USD738329S1 (en) * | 2013-07-29 | 2015-09-08 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
| USD763807S1 (en) * | 2014-05-22 | 2016-08-16 | Hzo, Inc. | Boat for a deposition apparatus |
| USD769201S1 (en) * | 2014-11-20 | 2016-10-18 | Tokyo Electron Limited | Wafer boat |
| USD772183S1 (en) * | 2014-11-20 | 2016-11-22 | Tokyo Electron Limited | Wafer boat |
| USD789310S1 (en) * | 2014-11-20 | 2017-06-13 | Tokyo Electron Limited | Wafer boat |
| USD791721S1 (en) * | 2014-11-20 | 2017-07-11 | Tokyo Electron Limited | Wafer boat |
| USD839219S1 (en) * | 2016-02-12 | 2019-01-29 | Kokusai Electric Corporation | Boat for substrate processing apparatus |
| USD893438S1 (en) * | 2017-08-21 | 2020-08-18 | Tokyo Electron Limited | Wafer boat |
| US10861727B2 (en) * | 2018-03-13 | 2020-12-08 | Samsung Electronics Co., Ltd. | Segmented vertical wafer boat |
| US20190287832A1 (en) * | 2018-03-13 | 2019-09-19 | Samsung Electronics Co., Ltd. | Segmented vertical wafer boat |
| USD847105S1 (en) * | 2018-05-03 | 2019-04-30 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
| USD846514S1 (en) * | 2018-05-03 | 2019-04-23 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
| USD908103S1 (en) * | 2019-02-20 | 2021-01-19 | Veeco Instruments Inc. | Transportable semiconductor wafer rack |
| USD908102S1 (en) * | 2019-02-20 | 2021-01-19 | Veeco Instruments Inc. | Transportable semiconductor wafer rack |
| USD939459S1 (en) * | 2019-08-07 | 2021-12-28 | Kokusai Electric Corporation | Boat for wafer processing apparatus |
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