USD1030689S1 - Semiconductor probe pin - Google Patents
Semiconductor probe pin Download PDFInfo
- Publication number
- USD1030689S1 USD1030689S1 US29/858,093 US202229858093F USD1030689S US D1030689 S1 USD1030689 S1 US D1030689S1 US 202229858093 F US202229858093 F US 202229858093F US D1030689 S USD1030689 S US D1030689S
- Authority
- US
- United States
- Prior art keywords
- probe pin
- semiconductor probe
- semiconductor
- pin
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000523 sample Substances 0.000 title claims description 3
- 239000004065 semiconductor Substances 0.000 title claims description 3
Images
Description
Claims (1)
- The ornamental design for a semiconductor probe pin, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR30-2022-0017284 | 2022-04-29 | ||
KR20220017284 | 2022-04-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD1030689S1 true USD1030689S1 (en) | 2024-06-11 |
Family
ID=88880621
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/858,093 Active USD1030689S1 (en) | 2022-04-29 | 2022-10-28 | Semiconductor probe pin |
Country Status (2)
Country | Link |
---|---|
US (1) | USD1030689S1 (en) |
TW (1) | TWD226028S (en) |
Citations (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2811702A (en) * | 1956-06-21 | 1957-10-29 | Malco Tool & Mfg Co | Terminal pin for printed circuit board |
US4681392A (en) * | 1986-04-21 | 1987-07-21 | Bead Chain Manufacturing Company | Swaged compliant connector pins for printed circuit boards |
US5124646A (en) * | 1989-12-15 | 1992-06-23 | Kabushiki Kaisha Toshiba | Universal probe card for use in a semiconductor chip die sorter test |
USD344029S (en) * | 1992-09-28 | 1994-02-08 | Sullivan Frank K | Measuring belt |
US5487684A (en) * | 1992-07-01 | 1996-01-30 | Berg Technology, Inc. | Electrical contact pin for printed circuit board |
US6032994A (en) * | 1998-11-25 | 2000-03-07 | Promos Technologies Inc. | Tools for positioning semiconductor chip test probes |
US6056627A (en) * | 1997-09-03 | 2000-05-02 | Mitsubishi Denki Kabushiki Kaisha | Probe cleaning tool, probe cleaning method and semiconductor wafer testing method |
US6098281A (en) * | 1996-11-06 | 2000-08-08 | Weidmuller Interface Gmbh & Co. | Electrical pins and method for their insertion into apertures of a circuit board |
US6137296A (en) * | 1997-09-08 | 2000-10-24 | Samsung Electronics, Co., Ltd. | Probe card for testing semiconductor devices |
US6294922B1 (en) * | 1996-02-13 | 2001-09-25 | Nihon Denshizairyo Kabushiki Kaisha | Probe for testing a semiconductor integrated circuit |
US20060252172A1 (en) * | 2003-04-10 | 2006-11-09 | Hong-Sik Park | Method of fabricating semiconductor probe with resistive tip |
US20070051169A1 (en) * | 2005-09-03 | 2007-03-08 | Samsung Electronics Co., Ltd. | Semiconductor probe with high resolution resistive tip and method of fabricating the same |
US20100244869A1 (en) * | 2009-03-25 | 2010-09-30 | Kabushiki Kaisha Toshiba | Probe for electrical inspection, method for fabricating the same, and method for fabricating a semiconductor device |
US20120249174A1 (en) * | 2011-03-29 | 2012-10-04 | Yamaichi Electronics., Co. Ltd. | Contact probe and semiconductor device socket including contact probe |
US20120289102A1 (en) * | 2011-05-11 | 2012-11-15 | Tyco Electronics Corporation | Contact having a profiled compliant pin |
US20140266277A1 (en) * | 2013-03-18 | 2014-09-18 | Cheng Yun Technology Co., Ltd. | Semiconductor testing probe needle |
US20150369859A1 (en) * | 2012-07-23 | 2015-12-24 | Yamaichi Electronics Co., Ltd. | Contact probe and semiconductor element socket provided with same |
USD764331S1 (en) * | 2014-12-04 | 2016-08-23 | Omron Corporation | Probe pin |
USD764330S1 (en) * | 2014-12-04 | 2016-08-23 | Omron Corporation | Probe pin |
USD769747S1 (en) * | 2014-12-15 | 2016-10-25 | Omron Corporation | Probe pin |
USD769754S1 (en) * | 2015-09-15 | 2016-10-25 | Omron Corporation | Probe pin |
USD769753S1 (en) * | 2014-12-19 | 2016-10-25 | Omron Corporation | Probe pin |
USD769752S1 (en) * | 2014-12-15 | 2016-10-25 | Omron Corporation | Probe pin |
USD769750S1 (en) * | 2015-09-15 | 2016-10-25 | Omron Corporation | Probe pin |
USD769751S1 (en) * | 2014-12-15 | 2016-10-25 | Omron Corporation | Probe pin |
USD769748S1 (en) * | 2014-12-15 | 2016-10-25 | Omron Corporation | Probe pin |
USD769749S1 (en) * | 2014-12-19 | 2016-10-25 | Omron Corporation | Probe pin |
USD775984S1 (en) * | 2015-03-04 | 2017-01-10 | Omron Corporation | Probe pin |
USD776552S1 (en) * | 2014-12-15 | 2017-01-17 | Omron Corporation | Probe pin |
USD776551S1 (en) * | 2014-12-15 | 2017-01-17 | Omron Corporation | Probe pin |
USD788615S1 (en) * | 2016-02-15 | 2017-06-06 | Omron Corporation | Probe pin |
USD789223S1 (en) * | 2016-02-15 | 2017-06-13 | Omron Corporation | Probe pin |
USD789224S1 (en) * | 2016-02-15 | 2017-06-13 | Omron Corporation | Probe pin |
US20170184632A1 (en) * | 2015-12-28 | 2017-06-29 | Texas Instruments Incorporated | Force biased spring probe pin assembly |
USD792255S1 (en) * | 2015-11-12 | 2017-07-18 | Omron Corporation | Probe pin |
USD792254S1 (en) * | 2015-11-12 | 2017-07-18 | Omron Corporation | Probe pin |
USD792256S1 (en) * | 2015-11-12 | 2017-07-18 | Omron Corporation | Probe pin |
USD792253S1 (en) * | 2015-11-12 | 2017-07-18 | Omron Corporation | Probe pin |
USD811912S1 (en) * | 2016-04-12 | 2018-03-06 | Qualmax Testech, Inc. | Plunger for semiconductor chip-testing probe |
US20190094269A1 (en) * | 2016-06-17 | 2019-03-28 | Omron Corporation | Probe pin |
TWD197914S (en) | 2017-12-27 | 2019-06-01 | 日商歐姆龍股份有限公司 | Probe pin for continuity test |
US20190361049A1 (en) * | 2016-09-21 | 2019-11-28 | Omron Corporation | Probe pin and inspection unit |
USD894025S1 (en) * | 2018-05-16 | 2020-08-25 | Nidec-Read Corporation | Electric characteristic measuring probe |
-
2022
- 2022-10-27 TW TW111305316F patent/TWD226028S/en unknown
- 2022-10-28 US US29/858,093 patent/USD1030689S1/en active Active
Patent Citations (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2811702A (en) * | 1956-06-21 | 1957-10-29 | Malco Tool & Mfg Co | Terminal pin for printed circuit board |
US4681392A (en) * | 1986-04-21 | 1987-07-21 | Bead Chain Manufacturing Company | Swaged compliant connector pins for printed circuit boards |
US5124646A (en) * | 1989-12-15 | 1992-06-23 | Kabushiki Kaisha Toshiba | Universal probe card for use in a semiconductor chip die sorter test |
US5487684A (en) * | 1992-07-01 | 1996-01-30 | Berg Technology, Inc. | Electrical contact pin for printed circuit board |
USD344029S (en) * | 1992-09-28 | 1994-02-08 | Sullivan Frank K | Measuring belt |
US6294922B1 (en) * | 1996-02-13 | 2001-09-25 | Nihon Denshizairyo Kabushiki Kaisha | Probe for testing a semiconductor integrated circuit |
US6098281A (en) * | 1996-11-06 | 2000-08-08 | Weidmuller Interface Gmbh & Co. | Electrical pins and method for their insertion into apertures of a circuit board |
US6056627A (en) * | 1997-09-03 | 2000-05-02 | Mitsubishi Denki Kabushiki Kaisha | Probe cleaning tool, probe cleaning method and semiconductor wafer testing method |
US6137296A (en) * | 1997-09-08 | 2000-10-24 | Samsung Electronics, Co., Ltd. | Probe card for testing semiconductor devices |
US6032994A (en) * | 1998-11-25 | 2000-03-07 | Promos Technologies Inc. | Tools for positioning semiconductor chip test probes |
US20060252172A1 (en) * | 2003-04-10 | 2006-11-09 | Hong-Sik Park | Method of fabricating semiconductor probe with resistive tip |
US20070051169A1 (en) * | 2005-09-03 | 2007-03-08 | Samsung Electronics Co., Ltd. | Semiconductor probe with high resolution resistive tip and method of fabricating the same |
US20100244869A1 (en) * | 2009-03-25 | 2010-09-30 | Kabushiki Kaisha Toshiba | Probe for electrical inspection, method for fabricating the same, and method for fabricating a semiconductor device |
US20120249174A1 (en) * | 2011-03-29 | 2012-10-04 | Yamaichi Electronics., Co. Ltd. | Contact probe and semiconductor device socket including contact probe |
US20120289102A1 (en) * | 2011-05-11 | 2012-11-15 | Tyco Electronics Corporation | Contact having a profiled compliant pin |
US20150369859A1 (en) * | 2012-07-23 | 2015-12-24 | Yamaichi Electronics Co., Ltd. | Contact probe and semiconductor element socket provided with same |
US20140266277A1 (en) * | 2013-03-18 | 2014-09-18 | Cheng Yun Technology Co., Ltd. | Semiconductor testing probe needle |
USD764331S1 (en) * | 2014-12-04 | 2016-08-23 | Omron Corporation | Probe pin |
USD764330S1 (en) * | 2014-12-04 | 2016-08-23 | Omron Corporation | Probe pin |
USD769751S1 (en) * | 2014-12-15 | 2016-10-25 | Omron Corporation | Probe pin |
USD776552S1 (en) * | 2014-12-15 | 2017-01-17 | Omron Corporation | Probe pin |
USD769752S1 (en) * | 2014-12-15 | 2016-10-25 | Omron Corporation | Probe pin |
USD776551S1 (en) * | 2014-12-15 | 2017-01-17 | Omron Corporation | Probe pin |
USD769747S1 (en) * | 2014-12-15 | 2016-10-25 | Omron Corporation | Probe pin |
USD769748S1 (en) * | 2014-12-15 | 2016-10-25 | Omron Corporation | Probe pin |
USD769753S1 (en) * | 2014-12-19 | 2016-10-25 | Omron Corporation | Probe pin |
USD769749S1 (en) * | 2014-12-19 | 2016-10-25 | Omron Corporation | Probe pin |
USD775984S1 (en) * | 2015-03-04 | 2017-01-10 | Omron Corporation | Probe pin |
USD769754S1 (en) * | 2015-09-15 | 2016-10-25 | Omron Corporation | Probe pin |
USD769750S1 (en) * | 2015-09-15 | 2016-10-25 | Omron Corporation | Probe pin |
USD792254S1 (en) * | 2015-11-12 | 2017-07-18 | Omron Corporation | Probe pin |
USD792253S1 (en) * | 2015-11-12 | 2017-07-18 | Omron Corporation | Probe pin |
USD792256S1 (en) * | 2015-11-12 | 2017-07-18 | Omron Corporation | Probe pin |
USD792255S1 (en) * | 2015-11-12 | 2017-07-18 | Omron Corporation | Probe pin |
US20170184632A1 (en) * | 2015-12-28 | 2017-06-29 | Texas Instruments Incorporated | Force biased spring probe pin assembly |
USD789224S1 (en) * | 2016-02-15 | 2017-06-13 | Omron Corporation | Probe pin |
USD789223S1 (en) * | 2016-02-15 | 2017-06-13 | Omron Corporation | Probe pin |
USD788615S1 (en) * | 2016-02-15 | 2017-06-06 | Omron Corporation | Probe pin |
USD811912S1 (en) * | 2016-04-12 | 2018-03-06 | Qualmax Testech, Inc. | Plunger for semiconductor chip-testing probe |
US20190094269A1 (en) * | 2016-06-17 | 2019-03-28 | Omron Corporation | Probe pin |
US20190361049A1 (en) * | 2016-09-21 | 2019-11-28 | Omron Corporation | Probe pin and inspection unit |
TWD197914S (en) | 2017-12-27 | 2019-06-01 | 日商歐姆龍股份有限公司 | Probe pin for continuity test |
USD894025S1 (en) * | 2018-05-16 | 2020-08-25 | Nidec-Read Corporation | Electric characteristic measuring probe |
Non-Patent Citations (1)
Title |
---|
"Notice of Allowance of Taiwan Counterpart Application," issued on May 2, 2023, pp. 1-6. |
Also Published As
Publication number | Publication date |
---|---|
TWD226028S (en) | 2023-06-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
USD975020S1 (en) | Socket | |
USD947781S1 (en) | Socket | |
USD991058S1 (en) | Probe | |
USD967606S1 (en) | Hoodie | |
USD983766S1 (en) | Baby monitor | |
USD915844S1 (en) | Spatula | |
USD914469S1 (en) | Spoon | |
USD1008558S1 (en) | Tweezer | |
USD957959S1 (en) | Thermometer probe | |
USD954651S1 (en) | Socket | |
USD984602S1 (en) | Toilet | |
USD915159S1 (en) | Spoon | |
USD1007824S1 (en) | Slide | |
USD967605S1 (en) | Hoodie | |
USD915846S1 (en) | Spoon | |
USD993568S1 (en) | Confection | |
USD981257S1 (en) | Thermometer | |
USD1000974S1 (en) | Soil tester | |
USD1004349S1 (en) | Organizer | |
USD975022S1 (en) | Socket | |
USD1035341S1 (en) | Under sink organizer | |
USD1037674S1 (en) | Snowbrush | |
USD1025489S1 (en) | Tweezer | |
USD1022334S1 (en) | False eyelashes | |
USD975429S1 (en) | Quilting pin |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO SMALL (ORIGINAL EVENT CODE: SMAL); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |