US9881727B2 - Decorative multi-layer surfacing materials having embedded conductive materials, solid surfaces made therewith, methods for making such surfacing materials and uses therefor - Google Patents

Decorative multi-layer surfacing materials having embedded conductive materials, solid surfaces made therewith, methods for making such surfacing materials and uses therefor Download PDF

Info

Publication number
US9881727B2
US9881727B2 US14/881,698 US201514881698A US9881727B2 US 9881727 B2 US9881727 B2 US 9881727B2 US 201514881698 A US201514881698 A US 201514881698A US 9881727 B2 US9881727 B2 US 9881727B2
Authority
US
United States
Prior art keywords
resin
layer
impregnated paper
paper layer
conductive material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active, expires
Application number
US14/881,698
Other languages
English (en)
Other versions
US20160104566A1 (en
Inventor
Kevin Francis O'Brien
Bryce Lamar Cole
Robert Jacob KRAMER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Diller Corp
Original Assignee
Diller Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Diller Corp filed Critical Diller Corp
Priority to US14/881,698 priority Critical patent/US9881727B2/en
Assigned to FORMICA CORPORATION reassignment FORMICA CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: COLE, BRYCE LAMAR, KRAMER, ROBERT JACOB, O'BRIEN, KEVIN FRANCIS
Publication of US20160104566A1 publication Critical patent/US20160104566A1/en
Assigned to THE DILLER CORPORATION reassignment THE DILLER CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FORMICA CORPORATION
Priority to US15/850,050 priority patent/US20180122558A1/en
Application granted granted Critical
Publication of US9881727B2 publication Critical patent/US9881727B2/en
Priority to US16/157,568 priority patent/US10741322B2/en
Active legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/10—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00—Layered products comprising a layer of paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00—Layered products comprising a layer of paper or cardboard
    • B32B29/002—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B29/005—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to another layer of paper or cardboard layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F38/00—Adaptations of transformers or inductances for specific applications or functions
    • H01F38/14—Inductive couplings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/003—Printed circuit coils
    • H02J5/005—
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
    • H02J50/12—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling of the resonant type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/03—3 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/12—Coating on the layer surface on paper layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B32B2255/205—Metallic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/28—Multiple coating on one surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/028—Paper layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/402—Coloured
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/584—Scratch resistance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2451/00—Decorative or ornamental articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2809—Printed windings on stacked layers
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/40—Circuit arrangements or systems for wireless supply or distribution of electric power using two or more transmitting or receiving devices
    • H02J50/402—Circuit arrangements or systems for wireless supply or distribution of electric power using two or more transmitting or receiving devices the two or more transmitting or the two or more receiving devices being integrated in the same unit, e.g. power mats with several coils or antennas with several sub-antennas
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/0042—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries characterised by the mechanical construction
    • H02J7/025—

Definitions

  • Decorative laminates have been used as surfacing materials for many years, in both commercial and residential applications, where pleasing aesthetic effects in conjunction with desired functional behavior (such as superior wear, heat and stain resistance, cleanability and cost) are preferred.
  • Typical applications have historically included furniture, kitchen countertops, table tops, store fixtures, bathroom vanity tops, cabinets, wall paneling, office partitions, and the like.
  • the present invention is directed, in general, to decorative, multi-layer surfacing materials having electric functionality. More specifically, the present invention is directed to decorative, multi-layer surfacing materials, preferably high pressure laminates, which contain embedded conductive pathways and optional, additional circuit components, as well as methods for preparing such materials, solid surfaces capped with such materials, and methods of wirelessly transmitting energy from such materials to a device configured to receive wireless energy transmission.
  • Various embodiments of the present invention can thus provide decorative, durable, functional, surfacing materials capable of accomplishing wireless power transfer to numerous devices at the same time.
  • Surfacing materials in accordance with various embodiments of the present invention can be used to provide entire countertops, tables, desks and other ordinary furniture items found throughout homes and offices with the capability to wirelessly transfer power to rechargeable devices configured to receive wireless power transmission via coupling, which may be inductive and/or resonance coupling.
  • One embodiment of the present invention includes a decorative, multi-layer surfacing material comprising: a first resin-impregnated paper layer and a second resin-impregnated paper layer, and a first conductive material having a first terminus and a second terminus and capable of carrying an electric current from the first terminus to the second terminus; wherein the first conductive material is disposed on a first surface of the first resin-impregnated paper layer; wherein the first resin-impregnated paper layer and the second resin-impregnated paper layer are disposed in a stacked and compressed relationship such that the first conductive material is encapsulated between the first resin-impregnated paper layer and the second resin-impregnated paper layer; and wherein at least one of the first resin-impregnated paper layer, the second resin-impregnated paper layer or an optional additional resin-impregnated paper layer is a decorative layer.
  • the resin can be a thermoset resin such that the paper layers in a stacked relationship can be compressed and heated to cure the thermoset resin.
  • cured can refer to both curing of a thermoset resin in the sense of its irreversible setting, or the crosslinking of other polymers with a separate cross-linker or by various forms of energy, or any means of fixing the resin in its compressed form such that the conductive materials are encapsulated and will remain so during the normal operating temperature range of the surface application.
  • Another embodiment of the present invention includes a method comprising: (a) providing at least two sheets of resin-impregnated paper; (b) disposing a patterned conductive material on a surface of one of the at least two sheets of resin-impregnated paper; and (c) compressing the at least two sheets of resin-impregnated paper together with heat and pressure in a facing relationship wherein the conductive material is disposed between the at least two sheets of resin-impregnated paper.
  • Another embodiment of the present invention includes a method of wirelessly transmitting energy, the method comprising: (i) providing a decorative, multi-layer surfacing material according to an embodiment of the present invention; (ii) providing electrical current to the first conductive material such that an electromagnetic field is generated in a region above and adjacent to an upper surface of the surfacing material; and (iii) placing a device configured to receive wireless energy transmission proximate to the upper surface and within the electromagnetic field.
  • Yet another embodiment of the present invention includes a solid surface comprising a decorative, multi-layer surfacing material according to an embodiment of the present invention disposed on a supporting substrate, such as, for example, fiberboard.
  • the decorative, multi-layer surfacing material is a high pressure laminate.
  • FIG. 1 a is a perspective view of a multi-layer surfacing material in accordance with an embodiment of the invention
  • FIG. 1 b is a cross-sectional view of the embodiment shown in FIG. 1 a , taken along line A′-A′;
  • FIGS. 2 a -2 b are cross-sectional views of a multi-layer surfacing material in accordance with an embodiment of the invention before and after compression;
  • FIGS. 3 a -3 c are cross-sectional views of a resin-impregnated paper layer of a multi-layer surfacing material in accordance with an embodiment of the invention
  • FIG. 4 is a cross-sectional view of a multi-layer surfacing material in accordance with an embodiment of the invention.
  • FIGS. 5 a -5 b are cross-sectional views of a multi-layer surfacing material in accordance with an embodiment of the invention before and after compression.
  • Various embodiments of the present invention are directed to decorative, multi-layer surfacing materials, as well as such materials disposed upon an underlying substrate. Additional various embodiments of the present invention are directed to methods of making such surfacing materials, and other various embodiments are directed to methods including using such surfacing materials to transmit power wirelessly.
  • multi-layer refers to two or more (i.e., at least two) layers.
  • decorative refers to any aesthetic attribute, and includes, but is not limited to, color, design, texture, indicia and the like, which may appear at any portion or portions of the material or across the entire surface of the material.
  • surfacing material refers to an application of various embodiments of the present invention as an upper or outermost surface of, for example, a countertop or table which may comprise a decorative, multi-layer surfacing material in accordance with an embodiment of the invention disposed on a support or a substrate such as, for example, reconstituted wood panels, polymer foamed panels, fiberglass-reinforced plastic (FRP), solid surfacing or polymarble.
  • a substrate such as, for example, reconstituted wood panels, polymer foamed panels, fiberglass-reinforced plastic (FRP), solid surfacing or polymarble.
  • surfacing materials comprise two or more resin-impregnated paper layers which are preferably laminated together.
  • the surfacing materials include a first resin-impregnated paper layer and a second resin-impregnated paper layer between which a conductive material is disposed.
  • Suitable paper which may be used in resin-impregnated paper layers in accordance with the various embodiments of the present invention, such as the first resin-impregnated paper layer and the second resin-impregnated paper layer include but are not limited to: cellulose fiber, synthetic woven or non-woven fiber, or/and microfiber or/and nanofiber, mixtures of cellulose or/and synthetic fiber based papers or/and mineral fiber based papers or/and glass fiber based papers, coated or non-coated, pre-impregnated or non pre-impregnated that could be generally used for the production of decorative laminates.
  • paper suitable for use in resin-impregnated paper layers has at least one, and preferably all of the following properties: a minimum wet strength in the machine direction of 1400 cN/30 mm in accordance with the test method of the International Standard DIN ISO 3781, a Klemm absorbency range (capillary rise) in the machine direction of 30 to 90 mm/10 min in accordance with the test method of the International Standard DIN ISO 8787 with a preferred absorbency of 45 mm/10 mim, Ash content 0 to 50% depending of the intrinsic nature of the paper used in accordance with the test method of the International Standard Din ISO 2144, a basis weight range of 10 to 100 g/m2 at moisture content range of 2 to 8% in accordance the test method of the International Standard DIN ISO 536 with a preferred basis weight of 27 g/m2, a pH (on hot extract) of 4 to 9 in accordance with the test method of the International Standard DIN ISO 6588.
  • Paper layers suitable for use in various embodiments of the invention are impregnated with a resin.
  • resins suitable for use include thermoset resins. Specific suitable resins for use in the various embodiments of the present invention may differ depending on whether the resin-impregnated paper layer is an outer protective layer, or a core layer. Outer protective layers are discussed further hereinbelow.
  • thermoset resin including, but not limited to, polyesters, polyurethanes, phenolics, phenol-formaldehydes, urea-formaldehydes, melamines, diallyl-phthalates, epoxides, polyimides, cyanates, and polycyanurates, or copolymers, terpolymers or combinations thereof.
  • resin-impregnated paper layers which are core layers are impregnated with a phenolic and/or epoxy resin.
  • resin-impregnated paper layers which are core layers such as a first resin-impregnated paper layer and a second resin-impregnated paper layer, are impregnated with a phenolic resin, such as, for example, a phenolic-formaldehyde resin.
  • Paper layers suitable for use in various embodiments of the invention are impregnated with a resin as discussed above. Impregnating paper layers used in accordance with the various embodiments of the present invention with a resin can be carried out in any suitable manner sufficient to apply a controlled quantity of resin to the paper, including but not limited to, screen printing, rotary screen printing, dip and squeeze, dip and scrape, reverse roll-coating, Meyer bar, curtain coating, slot-dye and gravure roller.
  • the percentage of resin applied, as measured on an oven dried basis is in the range of about 5 to 75%, with a preferred percentage pick-up range of about 25-55%.
  • the preferred method of impregnating a paper layer in accordance with the various embodiments is a multistage screen printing where each screen printing stage coats and impregnates defined sections of the paper surface according to the mask pattern pre-built into each screen stage.
  • the resins used in the impregnating step are normally aqueous or solvent based solutions
  • the level of residual solvent is 5-15% with a typical level of 7.5%.
  • Various embodiments of the present invention include one or more conductive materials (e.g., a first conductive material, a second conductive material, a third conductive material, etc.) disposed on one or more surfaces of one or more resin-impregnated paper layers, or in other words, interposed between two neighboring resin-impregnated paper layers.
  • Conductive materials suitable for use in accordance with the various embodiments of the present invention include any material which can be deposited upon resin-impregnated paper and which is electrically conductive. Suitable conductive materials include metals, alloys, and conductive inks.
  • Metallization can be carried out via deposition of a metal trace on a suitable substrate and transfer to the paper layer in accordance with known transfer methodologies.
  • conductive materials for use in the various embodiments of the present invention have a low resistance, are easily deposited in a pattern and maintain their geometric integrity under the heat and pressure conditions of lamination.
  • conductive materials comprises a conductive ink.
  • Conductive inks suitable for use in various preferred embodiments of the invention are compositions which comprise metal, conductive carbon, or other conductive materials such as polymers, in a carrier medium which may include other polymers, solvents and additives, and which may be deposited by various known methodologies such as inkjet printing, screen printing, flexographic or gravure printing, extrusion printing, and three-dimensional printing.
  • Conductive inks are commercially available from a number of sources and can be prepared using a number of known methods.
  • Particularly preferred conductive inks suitable for use in various preferred embodiments of the present invention include silver and/or conductive carbon particles.
  • Conductive materials disposed on a surface of a layer in the various embodiments of the present invention have at least a first terminus and a second terminus. Conductive materials are preferably disposed in a pattern on a surface of a layer in the various embodiments of the present invention. Suitable patterns for use in accordance with various preferred embodiments of the invention provide at least one terminus that is located at or near the periphery of the layer on which it is disposed, and in various embodiments of the present invention having multiple conductive materials disposed on multiple surfaces, a terminus is provided at an inner position on the surface wherein this terminus can be conductively connected to an inner-positioned terminus of another conductive material disposed on the surface of another layer.
  • Patterns suitable for use in accordance with the various embodiments of the present invention include, but are not limited to: continuous, meandering lines; spirals; spirangles; sawtooth waves; and combinations thereof.
  • conductive materials in various embodiments of the present invention are disposed in patterns which provide the longest linear amount of conductive material on the surface while maintaining a non-conductive distance between adjacent portions of the conductive pathway.
  • a conductive material is disposed on a rectangular surface in a corresponding rectangular spirangle beginning with a first terminus located at an outer edge (i.e., periphery) of the surface and continuing in a rectangular spirangle shape towards a central location of the rectangular surface to a second terminus.
  • any linear portion of a conductive material is important in circumstances where electrical resistance is to be minimized as the total electrical resistance of any conductive track is the product of the specific resistance per square (related to cross-sectional area) and the track length.
  • specific resistance per square related to cross-sectional area
  • the track length the product of the specific resistance per square (related to cross-sectional area) and the track length.
  • higher overall track resistances lead to higher resistive heating for similar electric current levels.
  • it is preferable, in the relationship between track vertical thickness, the cross sectional area and the pitch i.e., the distance between two adjacent linear portions of the conductive material on a surface
  • the pressure involved in the compression stage in the various embodiments of the invention reduces the vertical thickness of the conductive track.
  • the overall effect on total electrical resistance may vary as the compression may increase specific resistance of the conductive ink by decreasing the cross-sectional area, while also increasing conductive contact between conductive particles within the track materials, thus decreasing resistance.
  • various factors affect overall resistance. Preferably all such factors are considered in efforts to reduce overall resistance, and thus, heat generation.
  • Multi-layer surfacing materials in accordance with the various embodiments of the present invention may include one or more conductive protrusions which provide an electrical connection between a terminus of a conductive material and the exterior of the surfacing material.
  • the surfacing material may include a conductive protrusion providing an electrical connection between a first terminus of the first conductive material in the series and the exterior of the surfacing material, and a second conductive protrusion providing an electrical connection between the second terminus of the last conductive material in the series and the exterior of the surfacing material.
  • the surfacing material may further include a component or components connected to the ends of the conductive protrusion on the exterior of the surfacing material which component(s) are configured to accept AC, or pulsed DC, voltage input from an external source such that the conductive material(s) are provided with a current.
  • Such components may include, but are not limited to various female receptacles for AC and DC plugs, and terminal boxes or the like for hard-wiring AC or DC inputs.
  • Conductive protrusions suitable for use in the various embodiments of the present invention may be comprised of any conductive material and include but are not limited to metal tabs, screws, prongs, cylindrical receptacles, etc.
  • a first resin-impregnated paper layer 10 has a first conductive material 50 disposed on a first surface thereof in a rectangular spirangle pattern.
  • the first conductive material 50 has a first terminus 51 located near the periphery of the surfacing material 1 , and a second terminus 52 in a central location of the surface.
  • a second resin-impregnated paper layer 20 is disposed in a stacked relationship with the first resin-impregnated paper layer 10 , such that their facing surfaces meet at interface 30 .
  • Conductive protrusion 61 in the form of a metal screw, is disposed at a central location and provides an electrical connection point between second terminus 52 and the exterior of the material 1 .
  • Conductive protrusions such as conductive protrusion 61 in the form of a metal screw or otherwise, may be countersunk to any depth below an exterior surface, so long as conductive connection with a conductive material terminus is maintained.
  • Conductive protrusion 62 in the form of a metal tab, is disposed along the periphery and provides an electrical connection point between first terminus 51 and the exterior of the material 1 .
  • FIG. 1 b a cross-sectional view of the decorative, multi-layer surfacing material 1 along the line A′-A′ in FIG. 1 a is shown.
  • First conductive material 50 disposed in a rectangular spirangle, is disposed on a surface of the first resin-impreganted paper layer 10 .
  • Second resin-impregnated paper layer 20 is disposed in a stacked, compressed and cured relationship with the first resin-impregnated layer 10 , such that the first conductive material 50 is encapsulated between the resin-impregnated layers 10 , 20 , at their interface 30 .
  • Conductive protrusions 61 , 62 provide electrical contact points for supplying a current to the first conductive material 50 .
  • additional layers of resin-impregnated paper and additional conductive materials may be included.
  • a second conductive material in addition to a first conductive material disposed between a first and second resin-impregnated layers, a second conductive material may be disposed on a second surface of the first resin-impregnated paper layer, and a third resin-impregnated paper layer may then be disposed in a stacked relationship with the first paper layer, such that the second conductive material is encapsulated by the first and third paper layers.
  • the second and any additional conductive materials may also be patterned, preferably in the same pattern as the first conductive material, and may also have a conductive protrusion conductively connected to either or both the first terminus and/or second terminus of the second and each of any additional conductive materials.
  • the first and second conductive materials may be conductively connected through the intervening paper layer.
  • successive conductive materials may be conductively connected through the intervening paper layer to the conductive material on either or both sides.
  • Conductive connection of two conductive materials through the intervening paper layer may be accomplished via any provision of electrical connection, and can preferably be accomplished by providing an aperture in the intervening paper layer, wherein the aperture is positioned such that the conductive materials on the opposing sides of the paper layer make a physical and electrical connection when the layers are compressed together, or can be provided by a masking and ink saturation technique described herein. Apertures may be suitably provided by the use of a mechanical punch that physically removes a section of paper.
  • a cross-sectional view of a surfacing material 201 is shown.
  • a first conductive material 250 is disposed in a pattern on a first resin-impregnated paper layer 210 .
  • a second resin-impregnated paper layer 220 is disposed in a stacked relationship with the first resin-impregnated paper layer 210 .
  • the second resin-impregnated paper layer 220 is provided with an aperture 270 located in alignment with a portion of the first conductive material 250 .
  • a third resin-impregnated layer 240 is disposed in a stacked relationship with the first and second resin-impregnated paper layers 210 , 220 .
  • a second conductive material 251 is disposed, in a pattern corresponding to the pattern of the first conductive material 250 , between the second and third resin-impregnated layers, and such that a portion of the second conductive material 251 is in alignment with aperture 270 .
  • the first and second conductive materials form a physical and electrical connection 280 through the aperture.
  • the first and second conductive materials 250 , 251 remain electrically separated 290 at all other points where there is no aperture.
  • a conductive connection between conductive materials on opposing sides of a paper layer can be provided by applying a mask (e.g., a blocking pattern) at the location on the paper where the conductive connection is to be located on both sides of the paper layer, prior to resin-impregnation.
  • the mask prevents the impregnation of the paper with the resin at the site of the mask.
  • the mask is removed, and upon deposition of a conductive ink or other conductive material capable of permeating the paper layer, a conductive connection through the paper layer is thus provided.
  • a conductive connection between conductive materials on opposing sides of a paper layer can be provided by a multi-stepped screen printing process where a specific area designated for through paper electrical connection ( 380 , 316 , 580 , 581 ) is printed with conductive ink in successive applications in vertical alignment on opposing sides of the paper such that the conductive ink penetrates through the entirety of the thickness creating a conductive pathway electrically.
  • the mask or blocking pattern can be pre-built into the screen using common photolithographical techniques known by those skilled in the art of printing screen production.
  • FIGS. 3 a through 3 b a cross-sectional view of the preparation of a conductive connection through a paper layer in accordance with an embodiment of the present invention is shown.
  • a paper layer 310 is provided and mask 315 is provided on both sides of paper layer 310 at the location of the desired conductive connection.
  • the paper layer 310 is then impregnated with a resin.
  • the portion 316 of the paper layer protected by the mask 315 does not become impregnated with the resin.
  • conductive materials 350 , 351 comprising a conductive ink are deposited on the opposing sides of the paper layer in a pattern, of which a portion covers the portion 316 not impregnated with the resin, such that the conductive ink saturates the paper forming conductive connection 380 between the first conductive material 350 and the second conductive material 351 .
  • FIG. 4 a cross-sectional view of a surfacing material 401 in accordance with an embodiment of the present invention is shown in which a first resin-impregnated paper layer 410 (such as shown in FIG. 3 c ) having a first conductive material 451 and a second conductive material 452 conductively connected by a conductive ink saturated portion 480 of the first resin-impregnated paper layer 410 , is disposed in a stacked relationship between a second resin-impregnated paper layer 420 and a third resin-impregnated paper layer 440 .
  • FIGS. 5 a and 5 b a cross-sectional view of a surfacing material 401 in accordance with an embodiment of the present invention is shown wherein conductive connections of conductive materials by a masking technique as described herein and by an aperture are combined.
  • a first resin-impregnated paper layer 510 (such as shown in FIG.
  • the third resin-impregnated paper layer 520 can have an aperture 570 positioned to be aligned with portions of the second and third conductive materials 552 , 553 .
  • a fourth resin-impregnated paper layer 540 and a fifth resin-impregnated paper layer 541 are disposed in a stacked relationship adjacent to the first and fourth conductive materials 551 , 554 , respectively. Referring to FIG. 5 b , the stacked layers shown in FIG. 5 a are compressed, preferably with heat and pressure as indicated in the figure by the large block arrows, such that the second conductive material 52 and the third conductive material 553 form a physical electrical connection 582 in the location of aperture 570 .
  • the decorative multi-layer surfacing materials in accordance with the various embodiments of the present invention include at least two resin-impregnated paper layers with a conductive material disposed between the outer layers, wherein at least one layer is a decorative layer as described herein below.
  • the various embodiments of the present invention include at least one conductive material, preferably 2 to 20 conductive materials, more preferably 6 to 14 conductive materials, and in various preferred embodiments, 6, 7, 8, 9, 10, 11, 12, 13 or 14 conductive materials can be present.
  • two or more conductive materials or all conductive materials may be conductively connected in series, and a single embodiment may include conductive connection made by multiple methods, such as both an intervening layer with an aperture and/or layers having conductive ink saturated portions connecting conductive materials on opposing surfaces of the paper layer.
  • Enhancement layers which may be included in the various embodiments of the present invention comprise a soft magnetic material dispersed in a resin which is preferably a thermoset resin.
  • a resin which is preferably a thermoset resin.
  • thermoset resins suitable for use in impregnating the paper layers used in the present invention may suitably be used for dispersion of a soft magnetic material and formation of an enhancement layer.
  • an enhancement layer can be disposed between a conductive material and an adjacent resin-impregnated paper layer. Additionally or alternatively, an enhancement layer can be incorporated as an interposing separating layer between two conductive materials.
  • a resin-impregnated paper layer having a conductive material disposed on a surface thereof can be disposed in a stacked relationship with another, second resin-impregnated paper layer having a second conductive material disposed on the surface thereof facing the first conductive material, wherein an enhancement layer is interposed between the first and second conductive materials.
  • the enhancement layer may be provided with an aperture to provide a conductive connection between the first and second conductive materials.
  • a decorative multi-layer surfacing material can comprise multiple resin-impregnated paper layers prepared as shown in FIG.
  • the enhancement layers may further include apertures to provide for conductive connections between adjacent conductive materials.
  • Various embodiments of the present invention may further include combinations of conductive connections and enhancement layers in place of or in addition to resin-impregnated paper layers.
  • various embodiments of the present invention include multi-layer surfacing materials as depicted in FIGS.
  • one or more of the second, third and/or fourth resin-impregnated paper layers 520 , 540 , 541 is replaced by, or further includes, an enhancement layer.
  • an enhancement layer In certain particularly preferred embodiments of the present invention, three to six resin-impregnated paper layers prepared as shown in FIG. 3 a -3 c , are provided in a stacked relationship with an enhancement layer interposed between each of the adjacent conductive materials with an aperture in each enhancement layer such that the 6 to 12 conductive materials are conductively connected in series.
  • Enhancement layers suitable for use in accordance with various embodiments of the present invention include a soft magnetic material dispersed in a resin.
  • Soft magnetic materials suitable for use include, but are not limited to, soft ferrites.
  • Ferrites are ceramic compounds of the transition metals with oxygen, which are ferrimagnetic but nonconductive.
  • Suitable soft ferrites include those containing nickel, zinc, and/or manganese compounds.
  • Suitable soft magnetic materials, including soft ferrites have a low coercivity, meaning the material's magnetization can easily reverse direction without dissipating much energy (hysteresis loss), while the material's high resistivity prevents eddy currents, another source of energy loss.
  • Preferred soft ferrites include manganese-zinc ferrite (MnZn, with the formula Mn a Zn (1-a) Fe 2 O 4 ) and nickel-zinc ferrite (NiZn, with the formula Ni a Zn (1-a) Fe 2 O 4 ).
  • Enhancement layers in accordance with the various embodiments of the present invention described herein can be provided by any suitable method of deposition including coating, spraying, rolling and the like.
  • Multi-layer surfacing materials in accordance with the various embodiments of the present invention include at least one decorative layer.
  • the at least one decorative layer may be the first resin-impregnated paper layer, the second resin-impregnated layer, any other resin-impregnated layer described herein, or an additional layer providing an aesthetic attributes.
  • Decorative layers include an aesthetic attribute and are known in various decorative surfacing materials which are commercially available.
  • Decorative layers may comprise a resin-impregnated paper layer wherein the paper layer further comprising a pattern, coloring, texture, embedded objects or other attributes which are visible from the exterior of the multi-layer surfacing material.
  • Decorative layers may also include polymeric layers or other materials which include a pattern or coloring or other aesthetic attributes.
  • the multi-layer surfacing material includes a decorative layer selected from the group consisting of colored paper, patterned paper and combinations thereof.
  • a decorative layer is disposed near the exterior surface of the multi-layer surfacing material to maximize the visual effect of the aesthetic attribute.
  • Decorative, multi-layer surfacing materials in accordance with various embodiments of the present invention may further include a protective outer layer.
  • Protective outer layers are preferred where the surfacing material is required or desired to have durability and/or resistance to damage which may be caused by, for example, scratching.
  • Any outer protective layer known for use in decorative surfacing materials, such as laminates may be used in the various embodiments of the present invention.
  • an outer protective layer comprises a thermosetting melamine resin, but could also be a UV or electron beam cured member of the acrylate family (e.g., epoxy acrylate, urethane, melamine acrylate). Additional protection can be provided by incorporation of an abrasive (e.g., alumina) into the resin at a level of 0.5 to 5% and particle size of 1 micron to 100 micron.
  • an abrasive e.g., alumina
  • Decorative, multi-layer surfacing materials in accordance with various embodiments of the present invention may further include circuit components embedded within the material in conductive connection with the one or more conductive materials disposed therein.
  • various resistors, inductors, capacitors, diodes, higher-order components and combinations thereof may be included on the surface of a resin-impregnated paper layer in the circuit created by the one or more conductor materials.
  • various embodiments of the present invention may include functional circuits which may control one or more electronic elements embedded or connected to the surfacing materials, including, for example, light-emitting diodes, electroluminescent materials or switches, etc.
  • Various embodiments of the present invention are directed to solid surfaces which comprises a surfacing material in accordance with any of the foregoing embodiments, disposed on an underlying substrate.
  • Underlying substrate suitable for use include, but are not limited to plywood, fiberboard and the like.
  • a surfacing material in accordance with the various embodiments of the invention may be adhered to the underlying substrate with any suitable adhesive, such as a wood glue or epoxy.
  • Solid surfaces in accordance with various embodiments of the present invention may be dimensioned and shaped to be used for various building and furniture applications, including, for example, table tops, countertops, desk tops, partitions, etc.
  • a solid surface may further comprise one or more components which are connected to the conductive material embedded in the surfacing material, preferably via one or more conductive protrusions, and which one or more components are configured to accept AC voltage input from an external source such that the conductive material(s) are provided with a current, as previously described.
  • the one or more components are configured within the underlying substrate such that they do not protrude from the substrate, i.e., such that all surfaces are flush.
  • Various embodiments of the present invention are directed to methods of making surfacing materials, and solid surfaces, in accordance with the previously described embodiments thereof.
  • Methods of making surfacing materials in accordance with various embodiments of the present invention include providing two or more resin-impregnated paper layers, with at least one conductive material disposed between the paper layers, and compressing the layers with heat and pressure.
  • the combination of layers provided in a stacked relationship to be compressed with heat and pressure can be in accordance with any of the aforementioned embodiments, with conductive connections between multiple conductive materials provided in any of the manners described herein above.
  • a high pressure lamination process is employed.
  • the multiple layers according to any of the previously described embodiments are positioned in a stacked relationship between two pressing plates.
  • the plates are then pressed to a specific pressure of at least 1000 psi.
  • the temperature can then be raised to ⁇ 140° C.
  • the plates are then held at the elevated pressure and temperature for a period of time suitable for curing the resin.
  • the temperature is then lowered to ⁇ 40° C., while maintaining the elevated temperature.
  • the pressure on the plates is then reduced to zero gauge pressure.
  • the layers need not otherwise be placed in perfect edge to edge alignment, as a post-pressing trimming may be carried out to shape the final surfacing material.
  • Methods of wirelessly transmitting energy in accordance with the present invention include providing a decorative, multi-layer surfacing material or solid surface in accordance with any of the previously described embodiments, providing electrical current to the conductive material embedded within the surfacing material such that an electromagnetic field is generated in a region adjacent to an upper (i.e., outer) surface of the surfacing material, and placing a device configured to receive wireless energy transmission proximate to the upper surface of the surfacing material and within the electromagnetic field.
  • Devices configured to receive such energy transmission include any portable electronic device provided with an internal inductor suitable for magnetic resonance inductive coupling. Such devices are known and available commercially.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Laminated Bodies (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)
US14/881,698 2014-10-10 2015-10-13 Decorative multi-layer surfacing materials having embedded conductive materials, solid surfaces made therewith, methods for making such surfacing materials and uses therefor Active 2036-04-02 US9881727B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US14/881,698 US9881727B2 (en) 2014-10-10 2015-10-13 Decorative multi-layer surfacing materials having embedded conductive materials, solid surfaces made therewith, methods for making such surfacing materials and uses therefor
US15/850,050 US20180122558A1 (en) 2014-10-10 2017-12-21 Decorative Multi-Layer Surfacing Materials Having Embedded Conductive Materials, Solid Surfaces Made Therewith, Methods for Making Such Surfacing Materials and Uses Therefor
US16/157,568 US10741322B2 (en) 2014-10-10 2018-10-11 Decorative multi-layer surfacing materials having embedded conductive materials, solid surfaces made therewith, methods for making such surfacing materials and uses therefor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462062615P 2014-10-10 2014-10-10
US14/881,698 US9881727B2 (en) 2014-10-10 2015-10-13 Decorative multi-layer surfacing materials having embedded conductive materials, solid surfaces made therewith, methods for making such surfacing materials and uses therefor

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US15/850,050 Continuation US20180122558A1 (en) 2014-10-10 2017-12-21 Decorative Multi-Layer Surfacing Materials Having Embedded Conductive Materials, Solid Surfaces Made Therewith, Methods for Making Such Surfacing Materials and Uses Therefor

Publications (2)

Publication Number Publication Date
US20160104566A1 US20160104566A1 (en) 2016-04-14
US9881727B2 true US9881727B2 (en) 2018-01-30

Family

ID=55653901

Family Applications (3)

Application Number Title Priority Date Filing Date
US14/881,698 Active 2036-04-02 US9881727B2 (en) 2014-10-10 2015-10-13 Decorative multi-layer surfacing materials having embedded conductive materials, solid surfaces made therewith, methods for making such surfacing materials and uses therefor
US15/850,050 Abandoned US20180122558A1 (en) 2014-10-10 2017-12-21 Decorative Multi-Layer Surfacing Materials Having Embedded Conductive Materials, Solid Surfaces Made Therewith, Methods for Making Such Surfacing Materials and Uses Therefor
US16/157,568 Active US10741322B2 (en) 2014-10-10 2018-10-11 Decorative multi-layer surfacing materials having embedded conductive materials, solid surfaces made therewith, methods for making such surfacing materials and uses therefor

Family Applications After (2)

Application Number Title Priority Date Filing Date
US15/850,050 Abandoned US20180122558A1 (en) 2014-10-10 2017-12-21 Decorative Multi-Layer Surfacing Materials Having Embedded Conductive Materials, Solid Surfaces Made Therewith, Methods for Making Such Surfacing Materials and Uses Therefor
US16/157,568 Active US10741322B2 (en) 2014-10-10 2018-10-11 Decorative multi-layer surfacing materials having embedded conductive materials, solid surfaces made therewith, methods for making such surfacing materials and uses therefor

Country Status (17)

Country Link
US (3) US9881727B2 (zh)
EP (1) EP3205190B1 (zh)
JP (3) JP2017533838A (zh)
KR (1) KR102022863B1 (zh)
CN (1) CN107211543B (zh)
AU (2) AU2015329719A1 (zh)
BR (1) BR112017007360A2 (zh)
CA (1) CA2963975C (zh)
CL (1) CL2017000877A1 (zh)
CO (1) CO2017004458A2 (zh)
ES (1) ES2827452T3 (zh)
HK (1) HK1244993A1 (zh)
MX (1) MX2017004641A (zh)
RU (1) RU2716184C2 (zh)
SG (1) SG11201702785VA (zh)
WO (1) WO2016058003A1 (zh)
ZA (1) ZA201702787B (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2016241B1 (en) * 2016-02-09 2017-08-15 Trespa Int Bv A decorative panel
JP6986896B2 (ja) * 2016-09-08 2021-12-22 アイカ工業株式会社 熱硬化性樹脂化粧板及び天板並びに熱硬化性樹脂化粧板の製造方法
EP3609961A4 (en) * 2017-04-13 2021-01-20 The Diller Corporation ELECTROCONDUCTIVE INK FORMULATIONS CONTAINING MICROCRYSTALLINE CELLULOSE, PROCESSES FOR PRINTING ELECTROCONDUCTIVE TRACES, AND LAMINATES CONTAINING THEM
US11605487B2 (en) 2017-04-14 2023-03-14 The Diller Corporation Laminate with induction coils and charging station device comprising same
US10440828B2 (en) 2017-04-14 2019-10-08 The Diller Corporation Integrated electrical component within laminate
US10228123B2 (en) 2017-04-14 2019-03-12 The Diller Corporation Electroluminescent element within laminate
US11600421B2 (en) * 2017-04-14 2023-03-07 The Diller Corporation Laminate with induction coils
FR3073662B1 (fr) * 2017-11-14 2022-01-21 Arjo Wiggins Fine Papers Ltd Inducteur multicouches
JP7209289B2 (ja) * 2018-03-06 2023-01-20 アイカ工業株式会社 熱硬化性樹脂化粧板
US10292288B1 (en) 2018-03-14 2019-05-14 Robert David Foote Cabinet electrification system
US11227712B2 (en) 2019-07-19 2022-01-18 Nucurrent, Inc. Preemptive thermal mitigation for wireless power systems
US11271430B2 (en) * 2019-07-19 2022-03-08 Nucurrent, Inc. Wireless power transfer system with extended wireless charging range
WO2021119374A1 (en) * 2019-12-12 2021-06-17 Encompass Group, Llc Metalized fabric heating device for medical solutions
US11056922B1 (en) 2020-01-03 2021-07-06 Nucurrent, Inc. Wireless power transfer system for simultaneous transfer to multiple devices
US11876386B2 (en) 2020-12-22 2024-01-16 Nucurrent, Inc. Detection of foreign objects in large charging volume applications
US11881716B2 (en) 2020-12-22 2024-01-23 Nucurrent, Inc. Ruggedized communication for wireless power systems in multi-device environments
US11831174B2 (en) 2022-03-01 2023-11-28 Nucurrent, Inc. Cross talk and interference mitigation in dual wireless power transmitter

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4724187A (en) 1986-03-25 1988-02-09 Nevamar Corporation Conductive laminate flooring
US4784908A (en) 1986-03-25 1988-11-15 Nevamar Corporation Static dissipative laminate for work surfaces
US5677039A (en) 1992-04-07 1997-10-14 Arjo Wiggins S.A. Antistatic sheet
WO1999038686A1 (en) 1998-02-02 1999-08-05 International Paper Company Humidity independent static dissipative laminate
US5965245A (en) 1995-09-13 1999-10-12 Hitachi Chemical Company, Ltd. Prepreg for printed circuit board
US6180215B1 (en) * 1999-07-14 2001-01-30 Intel Corporation Multilayer printed circuit board and manufacturing method thereof
US20020023777A1 (en) 2000-08-28 2002-02-28 Matsushita Electric Industrial Co., Ltd. Printed circuit board and method for producing the same
US6595426B1 (en) 1997-10-03 2003-07-22 Gemplus Method of manufacturing an electronic device having a chip and/or an antenna, and a device obtained by implementing the method
US20070102804A1 (en) 2003-12-16 2007-05-10 Mitsui Mining & Smelting Co., Ltd Multilayered printed wiring board and manufacturing method thereof
US20110006316A1 (en) 2009-07-13 2011-01-13 Luxingtek, Ltd. Lighting device, display, and method for manufacturing the same
US8349464B2 (en) 2007-06-28 2013-01-08 Schoeller Technocell Gmbh & Co. Kg Pre-impregnated product
US20130154885A1 (en) 2010-06-21 2013-06-20 Leonhard Kurz Stiftung & Co. Kg Multilayered film element
US8482303B2 (en) 2009-04-22 2013-07-09 Huf Hulsbeck & Furst Gmbh & Co. Kg Sensor electronics in a vehicle door handle
US8815375B2 (en) 2009-09-14 2014-08-26 Schoeller Technocell Gmbh & Co. Kg Support for electronic circuits
US20150296612A1 (en) 2014-04-10 2015-10-15 Schoeller Technocell Gmbh & Co. Kg Composite Body Having a Decorative Surface, an Electrically Conductive Structure and an Electronic Circuit

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4913957Y1 (zh) * 1969-11-10 1974-04-06
US3657516A (en) 1969-11-10 1972-04-18 Kansai Hoon Kogyo Kk Flexible panel-type heating unit
JPS62148263A (ja) * 1985-12-23 1987-07-02 住友ベークライト株式会社 導電性化粧板
JPS62263043A (ja) * 1986-05-12 1987-11-16 住友ベークライト株式会社 導電性化粧板
JPH06310324A (ja) * 1993-04-21 1994-11-04 Nippon Mektron Ltd 平面コイル
IL129281A (en) * 1998-06-05 2003-01-12 Premark Rwp Holdings Inc Method of making a textured decorative laminate
JP2002151813A (ja) * 2000-08-28 2002-05-24 Matsushita Electric Ind Co Ltd プリント配線基板およびその製造方法
JP2002111276A (ja) * 2000-10-03 2002-04-12 Daido Steel Co Ltd 電磁波吸収体
US6794769B2 (en) * 2001-05-01 2004-09-21 Sanmina-Sci Corporation Current mode coupler having a unitary casing
GB2388716B (en) * 2002-05-13 2004-10-20 Splashpower Ltd Improvements relating to contact-less power transfer
JP2004327847A (ja) * 2003-04-25 2004-11-18 Daido Steel Co Ltd 電磁波吸収材
US7209039B2 (en) * 2003-05-08 2007-04-24 Illinois Tool Works Inc. Decorative surface covering with embedded RF antenna and RF shield and method for making the same
KR200432043Y1 (ko) * 2006-04-12 2006-11-29 심응문 전도성 인쇄 무늬지, 및 이를 포함한 전도성 멜라민 화장판
US7909483B2 (en) * 2006-07-21 2011-03-22 Koninklijke Philips Electronics N.V. Lighting system
MX2009001628A (es) * 2006-08-15 2009-03-09 Panolam Ind Int Inc Laminado decorativo que incorpora material fotoluminescente de colores multiples.
JP2011187559A (ja) * 2010-03-05 2011-09-22 Tsuchiya Co Ltd 非接触電力伝送フィルム
JP5530783B2 (ja) * 2010-03-31 2014-06-25 日本写真印刷株式会社 コイルを備えた成形品の製造方法
JP5841132B2 (ja) * 2010-05-28 2016-01-13 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． モジュラ電力送信システムに用いられる送信器モジュール
RU2609572C2 (ru) * 2011-08-16 2017-02-02 Филипс Лайтинг Холдинг Б.В. Проводящий слой большой поверхности для распределения мощности с использованием емкостной передачи мощности
DE102012016569A1 (de) * 2012-08-22 2014-02-27 Phoenix Contact Gmbh & Co. Kg Planarer Übertrager
KR101497140B1 (ko) * 2013-01-09 2015-03-03 한국전기연구원 다중기기의 자유 위치 무선 충전을 위한 무선전력전송 시스템
KR101452093B1 (ko) * 2013-03-13 2014-10-16 삼성전기주식회사 박막 코일, 이를 포함하는 차폐 부재 및 이를 구비하는 무접점 전력 전송 장치
WO2014157030A1 (ja) * 2013-03-27 2014-10-02 株式会社村田製作所 ワイヤレス給電装置
JP5688549B2 (ja) * 2013-04-10 2015-03-25 パナソニック インテレクチュアル プロパティ コーポレーション オブアメリカＰａｎａｓｏｎｉｃ Ｉｎｔｅｌｌｅｃｔｕａｌ Ｐｒｏｐｅｒｔｙ Ｃｏｒｐｏｒａｔｉｏｎ ｏｆ Ａｍｅｒｉｃａ コイルモジュール及び電子機器
JP6306288B2 (ja) * 2013-05-13 2018-04-04 日東電工株式会社 コイルプリント配線基板、受電モジュール、電池ユニットおよび受電通信モジュール
KR101431983B1 (ko) * 2013-08-19 2014-08-20 삼성전기주식회사 무선 전력 전송용 코일형 유닛, 무선 전력 전송장치, 전자기기 및 무선전력 전송용 코일형 유닛의 제조방법
WO2015161053A1 (en) * 2014-04-16 2015-10-22 Witricity Corporation Wireless energy transfer for mobile device applications
US10002709B2 (en) * 2014-05-30 2018-06-19 Corning Incorporated Wireless charging device for an electronic device
TW201603516A (zh) * 2014-07-11 2016-01-16 源隆科技股份有限公司 接收線圈部件及應用其的穿戴體
CN105450797B (zh) * 2014-09-02 2018-08-07 全亿大科技（佛山）有限公司 手机后盖
USD765597S1 (en) * 2015-02-02 2016-09-06 Lg Electronics Inc. Charger for mobile phone
JP5931241B1 (ja) * 2015-03-05 2016-06-08 セイコーインスツル株式会社 アンテナユニットおよび携帯型電子機器

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4784908A (en) 1986-03-25 1988-11-15 Nevamar Corporation Static dissipative laminate for work surfaces
US4724187A (en) 1986-03-25 1988-02-09 Nevamar Corporation Conductive laminate flooring
US5677039A (en) 1992-04-07 1997-10-14 Arjo Wiggins S.A. Antistatic sheet
US5965245A (en) 1995-09-13 1999-10-12 Hitachi Chemical Company, Ltd. Prepreg for printed circuit board
US6595426B1 (en) 1997-10-03 2003-07-22 Gemplus Method of manufacturing an electronic device having a chip and/or an antenna, and a device obtained by implementing the method
WO1999038686A1 (en) 1998-02-02 1999-08-05 International Paper Company Humidity independent static dissipative laminate
US6180215B1 (en) * 1999-07-14 2001-01-30 Intel Corporation Multilayer printed circuit board and manufacturing method thereof
US20020023777A1 (en) 2000-08-28 2002-02-28 Matsushita Electric Industrial Co., Ltd. Printed circuit board and method for producing the same
US20070102804A1 (en) 2003-12-16 2007-05-10 Mitsui Mining & Smelting Co., Ltd Multilayered printed wiring board and manufacturing method thereof
US8349464B2 (en) 2007-06-28 2013-01-08 Schoeller Technocell Gmbh & Co. Kg Pre-impregnated product
US8482303B2 (en) 2009-04-22 2013-07-09 Huf Hulsbeck & Furst Gmbh & Co. Kg Sensor electronics in a vehicle door handle
US20110006316A1 (en) 2009-07-13 2011-01-13 Luxingtek, Ltd. Lighting device, display, and method for manufacturing the same
US8815375B2 (en) 2009-09-14 2014-08-26 Schoeller Technocell Gmbh & Co. Kg Support for electronic circuits
US20130154885A1 (en) 2010-06-21 2013-06-20 Leonhard Kurz Stiftung & Co. Kg Multilayered film element
US20150296612A1 (en) 2014-04-10 2015-10-15 Schoeller Technocell Gmbh & Co. Kg Composite Body Having a Decorative Surface, an Electrically Conductive Structure and an Electronic Circuit

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Int'l Search Report and Written Opinion dated Dec. 30, 2015 in Int'l Application No. PCT/US2015/055329.

Also Published As

Publication number Publication date
US20180122558A1 (en) 2018-05-03
JP2017533838A (ja) 2017-11-16
RU2017115743A (ru) 2018-11-15
ES2827452T3 (es) 2021-05-21
EP3205190B1 (en) 2020-07-29
JP2021020471A (ja) 2021-02-18
CA2963975A1 (en) 2016-04-14
JP2019116103A (ja) 2019-07-18
CN107211543A (zh) 2017-09-26
CO2017004458A2 (es) 2017-09-20
KR102022863B1 (ko) 2019-09-19
EP3205190A1 (en) 2017-08-16
AU2018263998A1 (en) 2018-12-06
RU2716184C2 (ru) 2020-03-06
KR20170091591A (ko) 2017-08-09
ZA201702787B (en) 2020-01-29
AU2015329719A1 (en) 2017-04-27
US10741322B2 (en) 2020-08-11
WO2016058003A1 (en) 2016-04-14
CA2963975C (en) 2021-08-24
SG11201702785VA (en) 2017-05-30
CN107211543B (zh) 2020-08-18
BR112017007360A2 (pt) 2017-12-19
US20160104566A1 (en) 2016-04-14
CL2017000877A1 (es) 2018-02-23
EP3205190A4 (en) 2018-05-30
MX2017004641A (es) 2017-10-12
HK1244993A1 (zh) 2018-08-17
US20190198224A1 (en) 2019-06-27
RU2017115743A3 (zh) 2018-11-15

Similar Documents

Publication Publication Date Title
US10741322B2 (en) Decorative multi-layer surfacing materials having embedded conductive materials, solid surfaces made therewith, methods for making such surfacing materials and uses therefor
US11264165B2 (en) Decorative panel comprising an inductive coil
WO2018191614A1 (en) Integrated electrical component within laminate
US10228123B2 (en) Electroluminescent element within laminate
US11605487B2 (en) Laminate with induction coils and charging station device comprising same
US11600421B2 (en) Laminate with induction coils
US20180302089A1 (en) Capacitive Switch Within Laminate

Legal Events

Date Code Title Description
AS Assignment

Owner name: FORMICA CORPORATION, OHIO

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:O'BRIEN, KEVIN FRANCIS;COLE, BRYCE LAMAR;KRAMER, ROBERT JACOB;REEL/FRAME:037132/0098

Effective date: 20151118

AS Assignment

Owner name: THE DILLER CORPORATION, OHIO

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:FORMICA CORPORATION;REEL/FRAME:042337/0979

Effective date: 20170509

STCF Information on status: patent grant

Free format text: PATENTED CASE

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 4