HK1244993A1 - 具有嵌入式導電材料的裝飾性多層表面材料，由此製成的固體表面，製備這種表面材料的方法及其用途 - Google Patents

具有嵌入式導電材料的裝飾性多層表面材料，由此製成的固體表面，製備這種表面材料的方法及其用途

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Publication number
HK1244993A1
HK1244993A1 HK18104093.8A HK18104093A HK1244993A1 HK 1244993 A1 HK1244993 A1 HK 1244993A1 HK 18104093 A HK18104093 A HK 18104093A HK 1244993 A1 HK1244993 A1 HK 1244993A1
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HK
Hong Kong
Prior art keywords
materials
surfacing materials
making
methods
surfacing
Prior art date
Application number
HK18104093.8A
Other languages
English (en)
Inventor
K‧F‧奧布賴恩
B‧L‧科爾
R‧J‧克雷默
Original Assignee
得利樂公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 得利樂公司 filed Critical 得利樂公司
Publication of HK1244993A1 publication Critical patent/HK1244993A1/zh

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    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/10—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
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    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
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    • H01F38/14—Inductive couplings
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    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
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    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
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    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Laminated Bodies (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)
HK18104093.8A 2014-10-10 2018-03-23 具有嵌入式導電材料的裝飾性多層表面材料，由此製成的固體表面，製備這種表面材料的方法及其用途 HK1244993A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462062615P 2014-10-10 2014-10-10
PCT/US2015/055329 WO2016058003A1 (en) 2014-10-10 2015-10-13 Decorative multi-layer surfacing materials having embedded conductive materials, solid surfaces made therewith, methods for making such surfacing materials and uses therefor

Publications (1)

Publication Number Publication Date
HK1244993A1 true HK1244993A1 (zh) 2018-08-17

Family

ID=55653901

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18104093.8A HK1244993A1 (zh) 2014-10-10 2018-03-23 具有嵌入式導電材料的裝飾性多層表面材料，由此製成的固體表面，製備這種表面材料的方法及其用途

Country Status (17)

Country Link
US (3) US9881727B2 (zh)
EP (1) EP3205190B1 (zh)
JP (3) JP2017533838A (zh)
KR (1) KR102022863B1 (zh)
CN (1) CN107211543B (zh)
AU (2) AU2015329719A1 (zh)
BR (1) BR112017007360A2 (zh)
CA (1) CA2963975C (zh)
CL (1) CL2017000877A1 (zh)
CO (1) CO2017004458A2 (zh)
ES (1) ES2827452T3 (zh)
HK (1) HK1244993A1 (zh)
MX (1) MX2017004641A (zh)
RU (1) RU2716184C2 (zh)
SG (1) SG11201702785VA (zh)
WO (1) WO2016058003A1 (zh)
ZA (1) ZA201702787B (zh)

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JP7209289B2 (ja) * 2018-03-06 2023-01-20 アイカ工業株式会社 熱硬化性樹脂化粧板
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US11056922B1 (en) 2020-01-03 2021-07-06 Nucurrent, Inc. Wireless power transfer system for simultaneous transfer to multiple devices
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US11881716B2 (en) 2020-12-22 2024-01-23 Nucurrent, Inc. Ruggedized communication for wireless power systems in multi-device environments
US12003116B2 (en) 2022-03-01 2024-06-04 Nucurrent, Inc. Wireless power transfer system for simultaneous transfer to multiple devices with cross talk and interference mitigation
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