US9482694B2 - Device for measuring electronic components - Google Patents

Device for measuring electronic components Download PDF

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Publication number
US9482694B2
US9482694B2 US14/382,393 US201314382393A US9482694B2 US 9482694 B2 US9482694 B2 US 9482694B2 US 201314382393 A US201314382393 A US 201314382393A US 9482694 B2 US9482694 B2 US 9482694B2
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United States
Prior art keywords
contact
ground connection
conductors
switched
connection
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US14/382,393
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English (en)
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US20150097591A1 (en
Inventor
Roland Neuhauser
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Rosenberger Hochfrequenztechnik GmbH and Co KG
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Rosenberger Hochfrequenztechnik GmbH and Co KG
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Assigned to ROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO. KG reassignment ROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO. KG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NEUHAUSER, Roland
Publication of US20150097591A1 publication Critical patent/US20150097591A1/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31917—Stimuli generation or application of test patterns to the device under test [DUT]
    • G01R31/31926—Routing signals to or from the device under test [DUT], e.g. switch matrix, pin multiplexing

Definitions

  • the invention relates to a device for measuring electronic components, having a plurality of conductors applied to a dielectric conductor carrier, which conductors are each connected on the one hand to a contact finger and on the other hand to a connecting contact.
  • a device of the generic kind in the form of what is referred to as a wafer probe is known from, for example, DE 199 45 178 C2.
  • Wafer probes of this kind are used for example for testing the operation and electric characteristics of electronic circuits formed from wafers, for which purpose the circuits are connected to a suitable measuring device via the connecting contacts. To do this, the wafer probe is applied to the wafer in such a way that its contact fingers make contact with the printed conductors at defined points.
  • wafer probes of this kind it is known for wafer probes of this kind to be designed to have a plurality of contact fingers which are each intended to make contact at a different point of contact on the electronic component to be tested, and which are connected via respective conductors to appropriate connecting contacts (“multi-contact wafer probes”).
  • multi-contact wafer probes For each of these individual contacts of the wafer probe, the paths followed by the electrical energy conducted via them, or by the signals conducted via them, may, as a function of the contact layout of the electronic component to be tested, be different.
  • first path is a direct or exclusive connection between the contact finger and the associated connecting contact.
  • second path may be provided to provide this one contact finger, which has a conductor connecting it to a connecting contact, with, in addition, a connection to ground.
  • the connection to ground is made via buffer members such in particular as a capacitor and a resistor.
  • a device for measuring electronic components comprising: a plurality of conductors; a dielectric conductor carrier; the plurality of conductors being applied to the dielectric conductor carrier and each connected on the one hand to a contact finger and on the other hand to a connecting contact for connection to a measuring device; and a switch incorporated in at least one of the plurality of conductors, via which the at least one of the plurality of conductors between a contact finger and a connecting contact, which conductor connects the contact finger and the connecting contact, can be connected in addition to a ground connection.
  • Each of the plurality of conductors may be connected to the ground connection via a respective switch.
  • the connection to the ground connection may take place via at least one buffer member.
  • the switch may include at least three switched positions, in which case an associated conductor is not connected to a ground connection in a first switched position, is connected directly to the ground connection in a second switched position, and is connected to the ground connection via at least one buffer member in a third switched position.
  • the buffer member may comprise a capacitor and a resistor.
  • FIG. 1 is a plan view of a device according to the invention.
  • FIG. 2 is a schematic view showing the possible switched positions of each individual contact of the device according to the invention shown in FIG. 1 , together with the paths resulting therefrom.
  • FIGS. 1-2 of the drawings in which like numerals refer to like features of the invention.
  • the idea underlying the invention is to make a device of the generic kind for measuring electronic components (a multi-contact wafer probe) more flexible by making the function of at least one individual contact of the device, but preferably of every individual contact thereof, variable by means of a variability of the path followed by the electrical energy or the signals conducted via the said individual contact.
  • This makes it possible for the device to be used to test a plurality of electronic components having different contact layouts.
  • the function of the individual contacts merely has to be matched to the particular contact layout of the electronic component to be tested.
  • a device of the generic kind for measuring electronic components which comprises a plurality of conductors applied to a dielectric conductor carrier, which conductors are each connected to a contact finger and to a connecting contact, is therefore characterized in accordance with the invention in that a switch (preferably a mechanical one) is incorporated in at least one, and preferably all, of the conductors, via which the associated conductor can be connected in addition to a ground connection. Provision may preferably be made in this case for the connection to the ground connection to be made either directly or via at least one buffer member.
  • the switch prefferably has at least three switched positions, in which case the associated conductor is not connected to a ground connection in a first switched position, is connected directly to the ground connection in a second switched position and is connected to the ground connection via at least one buffer member in a third switched position.
  • the buffer member preferably comprises (at least) one capacitance (and in particular one capacitor) and (at least) one resistor.
  • the device according to the invention which is shown in FIG. 1 comprises a dielectric conductor carrier 1 to the underside of which are applied a plurality of conductors 2 in the form of printed conductors. These printed conductors are arranged at a spacing from one another and are thus electrically isolated from one another. To form an individual contact, each of the conductors 2 is connected on the one hand to a (resilient) contact finger 3 made of an electrically conductive material.
  • the contact fingers 3 which are intended to make contact with printed conductors or other electrical items on an electronic component to be tested (not shown), project beyond the conductor carrier 1 and terminate substantially along a line.
  • Each of the conductors 2 is also connected to a connecting contact 4 in the form of what is referred to as a DC pin.
  • the device is connected to a measuring device (not shown) via these connecting contacts 4 .
  • a switch 5 (a conventional miniature switch) is incorporated in each of the conductors 2 .
  • Each of these switches 5 has three, alternative, switched positions. In a first switched position, indicated as “D” in FIGS. 1 and 2 , there is a direct or exclusive electrical connection between the given contact finger 3 and the associated connecting contact 4 . If the switches 5 are moved to the (second) switched position, which is indicated as “G” in FIGS. 1 and 2 , there is an additional connection made to a ground connection 6 .
  • This buffer member comprises a (preferably firmly defined) capacitor 7 (e.g. 10 nF) and a (preferably firmly defined) resistor 8 (e.g. 2.2 ⁇ ).
  • the plurality of switches 5 can each be switched in such a way that a path matched to the contact layout is set for each of the individual contacts.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Measuring Leads Or Probes (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
US14/382,393 2012-03-08 2013-03-07 Device for measuring electronic components Active 2033-04-13 US9482694B2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE202012002391U 2012-03-08
DE202012002391U DE202012002391U1 (de) 2012-03-08 2012-03-08 Vorrichtung zur Messung elektronischer Bauteile
DE202012002391.8 2012-03-08
PCT/EP2013/000674 WO2013131651A1 (de) 2012-03-08 2013-03-07 Vorrichtung zur messung elektronischer bauteile

Publications (2)

Publication Number Publication Date
US20150097591A1 US20150097591A1 (en) 2015-04-09
US9482694B2 true US9482694B2 (en) 2016-11-01

Family

ID=47843239

Family Applications (1)

Application Number Title Priority Date Filing Date
US14/382,393 Active 2033-04-13 US9482694B2 (en) 2012-03-08 2013-03-07 Device for measuring electronic components

Country Status (10)

Country Link
US (1) US9482694B2 (de)
EP (1) EP2823324B1 (de)
JP (1) JP2015511004A (de)
KR (2) KR20140111290A (de)
CN (1) CN104160289A (de)
CA (1) CA2860901A1 (de)
DE (1) DE202012002391U1 (de)
HK (1) HK1204066A1 (de)
TW (1) TWM455873U (de)
WO (1) WO2013131651A1 (de)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5384532A (en) * 1992-07-01 1995-01-24 Hewlett-Packard Company Bipolar test probe
JP2004085377A (ja) 2002-08-27 2004-03-18 Oki Electric Ind Co Ltd プローブの接触抵抗測定方法及び半導体デバイスの試験方法
US6724209B1 (en) 2000-04-13 2004-04-20 Ralph G. Whitten Method for testing signal paths between an integrated circuit wafer and a wafer tester
US20060132158A1 (en) * 2004-12-21 2006-06-22 Formfactor Inc. Bi-directional buffer for interfacing test system channel
US20070194803A1 (en) * 1997-05-28 2007-08-23 Cascade Microtech, Inc. Probe holder for testing of a test device
US20070296422A1 (en) * 2006-06-06 2007-12-27 Formfactor, Inc. Method of Expanding Tester Drive and Measurement Capability
US20090128171A1 (en) 2005-03-31 2009-05-21 Katsuya Okumura Microstructure Probe Card, and Microstructure Inspecting Device, Method, and Computer Program
US20120214433A1 (en) * 2011-02-17 2012-08-23 Kabushiki Kaisha Toshiba Transmitter with class e amplifier
US20150155109A1 (en) * 2012-06-18 2015-06-04 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Switch

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01288782A (ja) * 1988-05-16 1989-11-21 Sumitomo Electric Ind Ltd プローブカード
JP2767845B2 (ja) * 1988-12-20 1998-06-18 日本電気株式会社 プローブカード
JPH0463641U (de) * 1990-10-11 1992-05-29
JPH04352445A (ja) * 1991-05-30 1992-12-07 Hitachi Electron Eng Co Ltd Ｉｃテスタ用テストヘッド
DE19945178C2 (de) 1999-09-21 2003-05-28 Rosenberger Hochfrequenztech Meßspitze zur Hochfrequenzmessung und Verfahren zu deren Herstellung
US6476630B1 (en) * 2000-04-13 2002-11-05 Formfactor, Inc. Method for testing signal paths between an integrated circuit wafer and a wafer tester
DE10143173A1 (de) * 2000-12-04 2002-06-06 Cascade Microtech Inc Wafersonde
DE202004021093U1 (de) * 2003-12-24 2006-09-28 Cascade Microtech, Inc., Beaverton Aktiver Halbleiterscheibenmessfühler
US7504841B2 (en) * 2005-05-17 2009-03-17 Analog Devices, Inc. High-impedance attenuator
DE102006052745A1 (de) * 2006-08-14 2008-02-21 Rohde & Schwarz Gmbh & Co. Kg Oszilloskop-Tastkopf
JP4532570B2 (ja) * 2008-01-22 2010-08-25 日置電機株式会社 回路基板検査装置および回路基板検査方法
JP2010210238A (ja) * 2009-03-06 2010-09-24 Renesas Electronics Corp プローブカード、それを備えた半導体検査装置及びプローブカードのヒューズチェック方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5384532A (en) * 1992-07-01 1995-01-24 Hewlett-Packard Company Bipolar test probe
US20070194803A1 (en) * 1997-05-28 2007-08-23 Cascade Microtech, Inc. Probe holder for testing of a test device
US6724209B1 (en) 2000-04-13 2004-04-20 Ralph G. Whitten Method for testing signal paths between an integrated circuit wafer and a wafer tester
JP2004085377A (ja) 2002-08-27 2004-03-18 Oki Electric Ind Co Ltd プローブの接触抵抗測定方法及び半導体デバイスの試験方法
US20060132158A1 (en) * 2004-12-21 2006-06-22 Formfactor Inc. Bi-directional buffer for interfacing test system channel
US20090128171A1 (en) 2005-03-31 2009-05-21 Katsuya Okumura Microstructure Probe Card, and Microstructure Inspecting Device, Method, and Computer Program
US20070296422A1 (en) * 2006-06-06 2007-12-27 Formfactor, Inc. Method of Expanding Tester Drive and Measurement Capability
US20120214433A1 (en) * 2011-02-17 2012-08-23 Kabushiki Kaisha Toshiba Transmitter with class e amplifier
US20150155109A1 (en) * 2012-06-18 2015-06-04 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Switch

Also Published As

Publication number Publication date
DE202012002391U1 (de) 2013-06-10
CN104160289A (zh) 2014-11-19
KR101900379B1 (ko) 2018-09-20
EP2823324A1 (de) 2015-01-14
TWM455873U (zh) 2013-06-21
WO2013131651A1 (de) 2013-09-12
US20150097591A1 (en) 2015-04-09
KR20150099616A (ko) 2015-08-31
EP2823324B1 (de) 2016-05-25
CA2860901A1 (en) 2013-09-12
KR20140111290A (ko) 2014-09-18
JP2015511004A (ja) 2015-04-13
HK1204066A1 (en) 2015-11-06

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