US9178294B2 - Printed circuit board and electronic device using printed circuit board - Google Patents

Printed circuit board and electronic device using printed circuit board Download PDF

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Publication number
US9178294B2
US9178294B2 US13/655,049 US201213655049A US9178294B2 US 9178294 B2 US9178294 B2 US 9178294B2 US 201213655049 A US201213655049 A US 201213655049A US 9178294 B2 US9178294 B2 US 9178294B2
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Prior art keywords
circuit board
hole
conductor film
printed circuit
conductor
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US13/655,049
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US20130100628A1 (en
Inventor
Takuto Yamaguchi
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Hitachi Astemo Ltd
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Hitachi Automotive Systems Ltd
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Assigned to HITACHI AUTOMOTIVE SYSTEMS, LTD. reassignment HITACHI AUTOMOTIVE SYSTEMS, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: YAMAGUCHI, TAKUTO
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion

Definitions

  • the present invention relates to a wiring board (printed circuit board) for press-connection of circuit boards, modules and connectors, and an electronic device having the circuit board.
  • press-fit connection attracts attention.
  • the press-fit connection is used in a main frame computer or the like as solderless connection method to remove difficulty in soldering between circuit board.
  • the press-fit connection is more frequently applied to an on-vehicle electronic device such as ABS (Antilocked Braking System) since (1) the connection process is simple, (2) the equipment investment to establish the process is small, and (3) it is possible to realize higher density mounting in comparison with soldering.
  • Japanese Patent Application Laid-Open Publication No. 2004-134302 discloses dispersing stress on a circuit board between through holes by changing a press-insertion direction of a press-fit terminal so as to improve the reliability of the circuit board. According to this method, when a part is arranged between the through holes, it is possible to reduce the stress applied on the part.
  • Japanese Patent Application Laid-Open Publication No. 2008-294299 discloses inserting a press-fit terminal in a printed circuit board having a metal core so as to improve the reliability. According to this method, as the hard metal core receives the distortion of the terminal, it is possible to reduce the distortion of the printed circuit board.
  • the metal core board is not widely used since the cost of the metal core board is generally high.
  • the present invention has an object to provide an electronic device to, realize high density mounting at a low cost.
  • present invention provides a printed circuit board in which three or more layers of circuit boards are laminated and a large number of through holes for insertion of terminal pins of an electronic part are formed, wherein lands of a conductor material are formed around a first through hole and a second through hole of the large number of through holes on surfaces of a top layer circuit board and a bottom circuit board, and the first land around the first through hole and the second land around the second through hole formed on the side of the top layer circuit board are electrically connected to the land around the first through hole and the land around the second through hole formed on the side of the bottom layer circuit board via a conductor member formed on an inner wall surface of the first through hole and a conductor member formed on an inner wall surface of the second through hole, and wherein, in a circuit board held between the top layer circuit board and the bottom layer circuit board, a first conductor film connected to the conductor member formed on the inner wall surface of the first through hole and a second conductor film connected to the conductor member formed on the inner wall surface of the
  • present invention provides a printed circuit board in which three or more layers of circuit boards are laminated and a large number of through holes for insertion of press-fit terminals of an electronic part are formed, wherein lands of a conductor material are formed around the through holes on a front surface and a rear surface of the printed circuit board, and the lands on the side of the front surface and the lands on the side of the rear surface are electrically connected via conductor films formed on inner wall surfaces of the through holes, and wherein a plurality of conductor films, including a conductor film connected to the conductor film formed on the inner wall surface of the through hole and a conductor film not electrically connected to the conductor film formed on the inner wall surface of the through hole, are formed on a circuit board held between a top layer circuit board and a bottom layer circuit board among the three or more layers of laminated circuit boards, further wherein when the printed circuit board is viewed from an upper surface, between adjacent through holes on which a compressive force acts upon insertion of the press-fit terminal
  • the present invention provides an electronic device using a printed circuit board including: a base plate; a first radiation member attached to the base plate; a first printed circuit board attached to the base plate via the first radiation member, where an electronic part is mounted on a surface; a cover fixed to the base plate, covering the radiation member and the first printed circuit board; a second printed circuit board attached to a surface of the cover opposite to the first printed circuit board via a second radiation member, where an electronic part is mounted on a surface; and a connector that electrically connects the first printed circuit board to the outside, wherein the first printed circuit board is connected to the second printed circuit board and the connector using a press-fit terminal, and wherein in the first printed circuit board, where three or more layers of circuit boards are laminated, and a large number of through holes for insertion of the press-fit terminal are formed, further wherein lands of a conductor material are formed around a first through hole and a second through hole among the large number of through holes on the respective surfaces of the top layer circuit board and
  • present invention provides an electronic device using a printed circuit board including: a base plate; a first radiation member attached to the base plate; a first printed circuit board attached to the base plate via the first radiation member, where an electronic part is mounted on a surface; a cover fixed to the base plate, covering the radiation member and the first printed circuit board; a second printed circuit board attached to a surface of the cover opposite to the first printed circuit board via a second radiation member, where an electronic part is mounted on a surface; and a connector that electrically connects the first printed circuit board to the outside, wherein the first printed circuit board is connected to the second printed circuit board and the connector via a press-fit terminal, and wherein in the first printed circuit board, three or more layers of circuit boards are laminated and a large number of through holes for insertion of the press-fit terminal are formed, further wherein lands of a conductor material are formed around the through holes on front surface and rear surface of the first printed circuit board, and the land on the side of the front surface and the land on the side
  • FIG. 1 is a perspective diagram showing connection of press-fit terminals with a printed circuit board
  • FIG. 2 is a cross-sectional diagram of a sample of connection of the press-fit terminals with the printed circuit board, viewed from a lateral direction of the sample, showing expansion positions;
  • FIG. 3 is a cross-sectional diagram of the sample of connection of the press-fit terminals with the printed circuit board, viewed from an upper direction of the sample, showing the expansion positions;
  • FIG. 4A is a cross-sectional diagram showing a wiring structure of a printed circuit board having rectangular lands, according to a first embodiment of the present invention
  • FIG. 4B is a plane diagram showing the wiring structure of the printed circuit board having the rectangular lands, according to the first embodiment of the present invention.
  • FIG. 4C is a plane diagram of a second layer circuit board showing the wiring structure of the printed circuit board having the rectangular lands, according to the first embodiment of the present invention
  • FIG. 5A is a cross-sectional diagram showing the wiring structure of the printed circuit board having circular lands, according to a second embodiment of the present invention.
  • FIG. 5B is a plane diagram showing the wiring structure of the printed circuit board having the circular lands, according to the second embodiment of the present invention.
  • FIG. 5C is a plane diagram of the second layer circuit board showing the wiring structure of the printed circuit board having the circular lands, according to the second embodiment of the present invention.
  • FIG. 6A is a cross-sectional diagram showing the wiring structure of the printed circuit board having the circular lands, when a part to be mounted is arranged in the vicinity of the press-fit terminal, according to the second embodiment of the present invention
  • FIG. 6B is a plane diagram showing the wiring structure of the printed circuit board having the circular lands, when an electrode for arrangement of the part to be mounted is provided in the vicinity of the press-fit terminal, according to the second embodiment of the present invention
  • FIG. 6C is a plane diagram of the second layer circuit board showing the wiring structure of the printed circuit board having the circular lands, when the part to be mounted is arranged in the vicinity of the press-fit terminal, according to the second embodiment of the present invention
  • FIG. 7A is a table showing estimation results regarding existence/absence of expansion in the printed circuit board, according to the second embodiment of the present invention.
  • FIG. 7B is a table showing the estimation results regarding the existence/absence of expansion in the printed circuit board, in which the part to be mounted is arranged in the vicinity of the press-fit terminal, according to the second embodiment of the present invention.
  • FIG. 8 is a cross-sectional diagram schematically showing the structure of an on-vehicle electronic device where the printed circuit board according to the present invention is mounted.
  • FIG. 1 shows an example of press-fit connection.
  • the press-fit connection is a method of press-inserting plural press-fit terminals 1 , provided on a press-fit connector 2 , in plural through holes 5 provided in a circuit board (printed circuit board) 4 , and performing mechanical and metallic connection between the press-fit terminals 1 and wires in the through holes 5 , so as to establish electric connection.
  • a connection member 11 of the press-fit terminal 1 has a spring structure having a width w greater than an inner diameter D of the through hole 5 , a flat part in a length L, and a thickness t. Accordingly, when the press-fit terminal 1 has been press-inserted in the through hole 5 , the press-fit terminal 1 is held in the through hole 5 by action of a spring force of the connection member 11 of the press-fit terminal 1 .
  • this connection method different from conventional solder connection, it is possible to realize connection without heating, at normal-temperatures, and in short time.
  • the distortion applied by the spring force of the connection member 11 of the press-fit terminal 1 may regulate the limit of high density mounting. Much stress is applied to the vicinity of the through hole 5 of the printed circuit board 4 in which the press-fit terminal 1 is inserted, and there is a probability of damage to the printed circuit board 4 .
  • FIG. 2 is a cross-sectional diagram of the printed circuit board 4 viewed from a lateral direction in a status where the press-fit terminals 1 - 1 and 1 - 2 are inserted in the adjacent through holes 41 - 1 and 41 - 2 .
  • FIG. 3 schematically shows a status of forces generated with the press-fit terminals 1 - 1 and 1 - 2 when a cross-section A-A′ in FIG. 2 is viewed from an arrow direction. As the spring forces act in the directions of the arrows 41 - 1 A and 41 - 2 B shown in FIG.
  • damage 3 occurs in a region 43 of the material 42 forming the printed circuit board 4 .
  • expansion 31 occurs in the surface of the printed circuit board 4 .
  • problems such as followings occur. (a) breakage of wire in the vicinity of the expansion 31 of the printed circuit board 4 , (b) degradation of humidity resistance due to peeling of solder resist formed around the through hole of the printed circuit board 4 , (c) change of electric characteristic due to distortion of parts such as chip resistors mounted on the printed circuit board 4 , and (d) deterioration of joint reliability in the solder connection member of the parts such as chip resistors mounted on the printed circuit board 4 .
  • the present invention provides a printed circuit board in which damage and distortion of the circuit board and due to a spring force can be mitigated and an electronic device using the printed circuited board.
  • the present invention addresses the above objects.
  • a printed circuit board in which a press-fit terminal is inserted and an electronic device using the printed circuit board, an inner layer and a surface wiring wider than a diameter of the through hole are arranged in a direction in which a spring force of the terminal acts in the through hole in which the terminal is inserted.
  • the printed circuit board and the electronic device using the printed circuit board has an annular ring conducting to the through hole in the inner layer of the printed circuit board, and a land having an area wider than that of the annular ring on the surface layer. Further, a deformation constraint wiring, insulated from the annular ring, is arranged in the inner layer up to a position closer to the through hole than the outer periphery of the land formed on the surface layer.
  • FIGS. 4A to 4C and FIGS. 5A to 5C show cross-sections of a printed circuit board in which press-fit terminals are inserted in through holes.
  • a multilayer printed circuit board having n layers is used; however, for the purpose of simplification of explanation, the printed circuit board here has four layers.
  • the top layer circuit board is a first layer 401 ; the next top layer circuit board, a second layer 402 ; the further next layer circuit board, a third layer 403 ; and the bottom layer circuit board, a fourth layer 404 .
  • the press-fit terminal 100 is inserted into through holes 411 - 1 to 411 - 3 from the side of the first layer 401 .
  • the diameter of the through holes 411 - 1 to 411 - 3 provided in the printed circuit board 400 or 500 is ⁇ .
  • wirings 421 , 431 , 422 and 432 are formed on the second layer circuit board 402 and the third layer circuit board 403 where circuit patterns (not shown) are formed on the surfaces.
  • the wirings 421 and 431 are called annular rings and have a role to enhance the strength so as to prevent drop of the wirings from the wall surfaces of the through holes 411 - 1 and 411 - 3 upon insertion of the press-fit terminal 100 .
  • the widths of the wirings 421 and 431 are set as L 3 and L 4 from ends of the through holes 411 - 1 to 411 - 3 having the diameter ⁇ . Further, the lengths in a direction orthogonal to the widths L 3 and L 4 are h 3 and h 5 .
  • the shape of the wirings 421 and 431 may be a rectangular shape, or may be a circular shape as indicated as the wiring 423 ( 433 ) in FIG. 5C . Further, the wirings 422 and 432 (in FIG.
  • the wirings 424 and 434 are formed away by G 2 or G 3 from the wirings 421 and 431 (in FIG. 5A , the wirings 423 and 433 ), and have a width L 5 and a depth h 3 .
  • the wiring 422 ( 432 ) will be referred to as deformation constraint wiring.
  • the second layer circuit board 402 where a circuit pattern (not shown) is formed on the surface and the wirings 421 and 422 (in FIG. 5C , the wirings 423 and 424 ) are formed, and the third layer circuit board 403 where the wirings 431 and 432 (in FIG. 5C , the wirings 433 and 434 ) are formed, are joined by laminating the first layer 401 and the fourth layer 404 where circuit patterns (not shown) are formed on the surfaces.
  • the through holes 411 - 1 to 411 - 3 are formed by drill-processing the laminated first layer 401 to the fourth layer 404 circuit boards.
  • the wirings 441 to 443 ( FIG. 4A ) or 445 to 447 ( FIG. 5A ) are connected to the wirings 421 and 431 ( 423 and 433 in FIG. 5A ) formed on the second layer circuit board 402 and the third layer circuit board 403 .
  • the wirings 441 to 443 or 445 to 447 have widths L 1 and L 2 from the ends of the respective through holes 411 - 1 to 411 - 3 having the diameter ⁇ .
  • the wirings 441 to 443 or 445 to 447 correspond to lands in a structure where pins inserted in through holes are soldered.
  • the land is formed in a circular shape around the through hole to smooth a solder fillet.
  • solder connection is not performed, and accordingly, it can be freely formed in any shape.
  • the wirings may have rectangular shapes with the widths of L 1 and L 2 and the depths of h 1 and h 2 , and as shown in FIG. 5B , may be a part of a circular shape having a diameter of L 1 +L 2 + ⁇ .
  • a pattern 444 ( 448 in FIG. 5B ) is formed in a region having a width G 1 between the adjacent wirings 441 and 442 ( 445 and 446 in FIG. 5B ).
  • the pattern 444 ( 448 in FIG. 5B ) is not always necessary.
  • the wirings 442 and 443 ( 446 and 447 in FIG. 5B ) may be arranged to be adjacent to each other without providing the pattern 444 ( 448 in FIG. 5B ), as between the through holes 411 - 2 and 411 - 3 in FIGS. 4A and 4B ( FIGS. 5A and 5B ).
  • the sizes corresponding to the widths L 1 and L 2 of the wirings 442 and 443 ( 446 and 447 in FIG. 5B ) are L 1 ′ and L 2 ′.
  • FIGS. 4A to 4C and FIGS. 5A to 5C show a status where the press-fit terminals 100 are inserted in the above-described printed circuit board 400 or 500 .
  • FIGS. 4A to 4C and FIGS. 5A to 5C show the press-fit terminal 100 , having a forked connection member 103 , which is a so-called needle-eye type terminal, however, the present invention is applicable to any terminal shape.
  • the press-fit terminal 100 is inserted in the through holes 411 - 1 to 411 - 3 of the printed circuit board 400 or 500 .
  • the contact parts between the press-fit terminal 100 and the through holes 411 - 1 to 411 - 3 are the second layer circuit board 402 and the third layer circuit board 403 .
  • the press-fit terminal 100 is not in contact with the front surface first layer circuit board 401 and the bottom surface fourth layer circuit board 404 .
  • the spring force of the press-fit terminal 100 is applied to the insulating resin and the glass fiber forming the second layer circuit board 402 and the third layer circuit board 403 inside the printed circuit board 400 in the directions indicated with arrows 41 - 1 A and 41 - 1 B and 41 - 2 A and 41 - 2 B in FIG. 3 .
  • a force to expand acts on the insulating resin and the glass fiber forming the second layer circuit board 402 and the third layer circuit board 403 which receive the spring force of the press-fit terminal 100 .
  • the annular rings 421 and 431 ( 423 and 433 in FIG. 5A ) formed of hard Cu and the deformation constraint wirings 422 and 432 ( 424 and 434 in FIG. 5C ) suppress the deformation. Further, regarding the expansion at the gaps G 2 and G 3 between the annular rings 421 and 431 ( 423 and 433 in FIG. 5A ) and the deformation constraint wirings 422 and 432 ( 424 and 434 in FIG.
  • the deformation can be suppressed by arranging the lands 441 , 442 and 443 ( 445 , 446 and 447 in FIG. 5B ) formed on the respective surfaces of the surface first layer circuit board 401 and the bottom fourth layer circuit board 404 to cover the gaps.
  • the above-described wiring structure is as follows.
  • the damage to the circuit board 4 occurs in the damage occurrence region 43 in FIG. 3 , i.e., within the range of the width of the through hole diameter in a direction in which the spring force of the terminal acts.
  • the range of the width of the through hole diameter is covered with the inner layer wirings (the annular rings and the deformation constraint wirings), as the lands 441 to 443 ( 445 to 447 in FIG. 5B ), formed on the surface first layer circuit board 401 and the rear side fourth layer circuit board 404 , and the wirings (annular rings) 421 and 431 ( 423 and 433 in FIG. 5C ) formed on the second layer circuit board 402 and the third layer circuit board 403 , held between the first layer circuit board 401 and the fourth layer circuit board 404 , and the deformation constraint wirings 422 and 432 ( 424 and 434 in FIG. 5C ).
  • the inner layer wirings the annular rings and the deformation constraint wirings
  • the thickness of the wirings is 10 ⁇ m or greater.
  • an electronic device 800 has a structure where a connector 802 and sub modules 807 and 808 are connected to a main printed circuit board 801 (corresponding to the printed circuit board 400 in FIG. 4A ), fixed to a base plate 810 via a radiation member 811 , with press-fit terminals 803 , and the sub modules 807 and 808 are fixed to a cover 815 to which a radiation fin 814 is attached, via radiation members 812 and 813 .
  • Electronic parts 816 are attached to the printed circuit board 801 and the sub modules 807 and 808 .
  • a seal member 817 seals gaps between the base plate 810 and the connector 802 and between the base plate 810 and the cover 815 .
  • the press-fit terminal 100 As the press-fit terminal 100 , a terminal, with a Cu alloy as a mother material, having an Ni-plated base and an Sn-plated surface, is used.
  • the press-fit terminal 100 has a needle eye shape as shown in FIG. 1 .
  • the outer shape of the connection member 11 has e.g. 1.2 mm (w: stress acting direction) ⁇ 0.64 mm (t: thickness direction).
  • the printed circuit board 400 is a four-layer circuit board formed by laminating four layers of circuit boards each having a thickness of 1.6 mm, and the diameter ⁇ of the through hole 5 is 1.0 mm.
  • the gaps G 1 to G 3 are 0.3 mm; the widths L 1 and L 2 , 0.6 mm; the widths L 3 and L 5 , 0.2 mm; and the width L 4 , 0.5 mm.
  • the depths h 1 to h 5 are changed from 1.0 mm, 1.5 mm to 2.0 mm.
  • the press-fit terminal 100 is inserted with a hand-press machine, and by adjusting an insertion distance, the press-fit terminal 100 is inserted in a position where the connection member 11 of the press-fit terminal 100 for connection with respect to the printed circuit board 400 is positioned between the second and third layers of the printed circuit board 400 .
  • the reliability is tested by leaving the printed circuit board at a high temperature atmosphere of 150° C. for 100 hours. With this reliability test, the damage among the through holes 411 - 1 to 411 - 3 is enlarged, and the surface expansion of the printed circuit board 400 is increased.
  • the sample after the test by observation of a cross-section of the printed circuit board, the expansion of the printed circuit board 801 and the state of damaged of resist are inspected. A part without expansion or damage is determined as “O”, but a part expanded or damaged is determined as “x”.
  • FIG. 7 shows the results of determination.
  • the deformation constraint wiring ( 422 in FIG. 4C ) does not sufficiently function, and expansion is found in the glass fiber.
  • the expansion of the glass fiber causes expansion of the surface layer corresponding to the surfaces of the first layer circuit board 401 and the fourth layer circuit board 404 in FIG. 4A . Further, cracks are found in the solder resist ( 441 to 443 in FIGS. 4A and 4B ).
  • FIGS. 6A to 6C an example using a printed circuit board 600 having a structure as shown in FIGS. 6A to 6C will be described.
  • the printed circuit board 600 shown in FIGS. 6A to 6C has approximately the same structure as that of the printed circuit board 500 shown in FIGS. 5A to 5C formed with the lands 445 to 447 , the annular rings and the deformation constraint wirings, formed in a circular wiring.
  • a chip resistor device 15 is joined, with solder 16 , to electrode pads 17 and 18 formed on the surface of the first layer circuit board 601 of the printed circuit board 500 .
  • a terminal similar to that in the first embodiment is used as the press-fit terminal 100 .
  • the printed circuit board 600 a printed circuit board formed on the same conditions as those in the first embodiment, except the laminated first layer circuit board 601 and second layer circuit board 602 , third layer circuit board 603 and fourth layer circuit board 604 , and lands 645 and 646 and annular rings 623 and 633 , and deformation constraint wirings 624 , 634 , 625 and 635 , is used.
  • numeral 648 denotes a wiring formed between the land 645 and an adjacent land (not shown).
  • the sizes of the respective parts are as follows.
  • the diameter ⁇ of the through holes 411 - 1 and 411 - 2 is 1.0 mm; the gaps G 1 and G 3 , 0.3 mm; the gap G 2 , 0.2 mm; the widths L 1 and L 2 , 0.6 mm; the widths L 3 and L 5 , 0.2 mm; and the width L 4 , 0.7 mm.
  • the width h 4 of the deformation constraint wirings 624 and 634 is changed from 1.0 mm, 1.5 to 2.0 mm.
  • inner layer wirings 625 and 635 (deformation constraint wirings) are drawn to a position directly under the chip resistor device 15 .
  • the press-fit terminals 100 are inserted in the respective through holes 411 - 1 and 411 - 2 .
  • the damage to the circuit board is tested by leaving the printed circuit board in an atmosphere at a high temperature of 150° C. for 100 hours.
  • the printed circuit board is subjected to a ⁇ 40/130° C. ⁇ 3000 cycle temperature cycle test. In this test, the status of crack growth in the solder connection member 16 at the mounted chip resistor device 15 is examined.
  • FIG. 7B shows the results of determination.
  • the width h 4 of the deformation constraint wiring 624 ( 634 ) is 1.0 mm, 1.5 to 2.0 mm, some cracks are found in the insulating resin and the glass fiber from the first layer circuit board 601 to the fourth layer circuit board 604 .
  • the deformation of the deformation constraint wiring 624 ( 634 ) is minute, and no deformation is found in the surface layer wiring formed on the first layer circuit board 601 and the fourth layer circuit board 604 . As no change is found in the surface layer, no damage is found in solder resist on the surface layer.
  • the crack lengths in the solder connection member 16 are the same as those before the inspection. Accordingly, a phenomenon that the life of the mounted part closer to the through hole 411 - 1 is shortened does not occur.
  • the width h 4 of the deformation constraint wiring 624 ( 634 ) is short and the deformation constraint wiring does not sufficiently function, the surfaces of the first layer circuit board 601 and the fourth layer circuit board 604 are expanded and distorted. This reduces the life of the mounted part close to the through hole 411 - 1 . There is no problem where the mounted part is arranged away from the through hole 411 - 1 . However, to achieve high density mounting, it is important to suppress the expansion of the surface of the circuit board.
  • annular rings, deformation constraint wirings or lands having a width equal to or wider than a through hole diameter it is possible to reduce deformation of the circuit board and increase the life of the chip part in the vicinity of the through hole.
US13/655,049 2011-10-20 2012-10-18 Printed circuit board and electronic device using printed circuit board Expired - Fee Related US9178294B2 (en)

Applications Claiming Priority (2)

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JP2011-230605 2011-10-20
JP2011230605A JP5628772B2 (ja) 2011-10-20 2011-10-20 プリント基板およびそれを用いた電子機器

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US20130100628A1 US20130100628A1 (en) 2013-04-25
US9178294B2 true US9178294B2 (en) 2015-11-03

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JP (1) JP5628772B2 (de)
CN (1) CN103068157A (de)
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TWI626872B (zh) * 2017-01-13 2018-06-11 元鼎音訊股份有限公司 印刷電路板製程之方法及其印刷電路板
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DE102012020477A1 (de) 2013-04-25
JP2013089847A (ja) 2013-05-13

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