US8616930B1 - Depositing apparatus and method for manufacturing organic light emitting diode display using the same - Google Patents

Depositing apparatus and method for manufacturing organic light emitting diode display using the same Download PDF

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US8616930B1
US8616930B1 US13/677,031 US201213677031A US8616930B1 US 8616930 B1 US8616930 B1 US 8616930B1 US 201213677031 A US201213677031 A US 201213677031A US 8616930 B1 US8616930 B1 US 8616930B1
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deposition
deposition source
disposed
deposition material
angle control
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US20130337720A1 (en
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Ja-Hyun Im
Byung-Hoon Chun
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Samsung Display Co Ltd
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Samsung Display Co Ltd
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Assigned to SAMSUNG DISPLAY CO., LTD., A CORPORATION CHARTERED IN AND EXISTING UNDER THE LAWS OF THE REPUBLIC OF KOREA reassignment SAMSUNG DISPLAY CO., LTD., A CORPORATION CHARTERED IN AND EXISTING UNDER THE LAWS OF THE REPUBLIC OF KOREA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHUN, BYUNG-HOON, IM, JA-HYUN
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C23C14/044—Coating on selected surface areas, e.g. using masks using masks using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the present invention relates to a deposition apparatus and a method for manufacturing an organic light emitting diode (OLED) display using the deposition apparatus. More particularly, the present invention relates to a deposition apparatus that controls the emission direction of a deposition material using an angle control method, and a method for manufacturing an OLED display.
  • OLED organic light emitting diode
  • an organic light emitting display has a wide viewing angle, excellent contrast, and a fast response speed, and thus it has been in the limelight as the next-generation display device.
  • the organic light emitting display has a structure in which an emission layer is inserted between an anode and a cathode so as to realize colors with a theory that light emission occurs from re-combination of holes and electrons emitted from the anode and the cathode in the emission layer.
  • high efficient light emission cannot be acquired with such a structure, and intermediate layers such as an electron injection layer (EIL), an electron transport layer (ETL), a hole transport layer (HTL), and a hole injection layer (HIL) may be selectively additionally inserted between the respective electrodes and the emission layer.
  • EIL electron injection layer
  • ETL electron transport layer
  • HTL hole transport layer
  • HIL hole injection layer
  • a vacuum deposition method is used, and thus metal used as an organic material or an electrode forms a thin film on a flat plate by depositing the corresponding material in a vacuum condition.
  • a substrate on which an organic film is grown is disposed in the vacuum chamber, a fine metal mask (FMM) having a pattern that is the same as a pattern of a thin film to be formed is attached, and the organic material is vaporized or sublimated using a deposition source unit and is thus deposited on the substrate.
  • FMM fine metal mask
  • a spray angle needs to be controlled according to a characteristic of the deposition material or a pattern of the mask, and the spray angle needs to be controlled so as not to be changed as time passes.
  • One aspect of the present invention provides a deposition apparatus the can form a uniform thin film by compensating for a deposition angle that is changed as process time is increased.
  • another aspect of the present invention provides a method for manufacturing an OLED display that can form a uniform thickness of a deposited thin film by compensating for a constant deposition angle by controlling an angle of an angle control member.
  • a deposition system includes a deposition source emitting a deposition material and an angle control member disposed on both sides of the deposition source and controlling an emission direction angle of the deposition material.
  • the angle control member includes a housing having an internal space opened in an emission direction of the deposition material and a sliding member, a first end of which is inserted into the internal space and a second end of which is disposed on an emission path of the deposition material and is movable forward and backward in the emission direction of the deposition material along the internal space.
  • the deposition source is preferably a linear deposition source, a spray nozzle of which sprays the deposition material and is linearly arranged in a first direction, the angle control member being formed along the first direction.
  • the deposition source is preferably provided in plural and is arranged side by side in the first direction, the angle control member being disposed between the deposition sources.
  • the deposition source preferably further includes a driver connected to the sliding member so as to move the sliding member forward/backward in the emission direction of the deposition material.
  • the driver preferably interworks with sliding members of a pair of angle control members disposed in the outermost edge of the deposition source so as to make the sliding members move forward/backward by the same distance.
  • the driver preferably interworks with the sliding members of the angle control members disposed between the deposition sources so as to make the sliding members move forward/backward by the same distance.
  • a second end disposed in an emission path of the deposition material is preferably bent in a direction that crosses the movement direction of the sliding member.
  • a method for manufacturing an OLED display includes: preparing a deposition source that emits a deposition material; preparing a housing disposed on both sides of the deposition source and having an inner space opened in an emission direction of the deposition material, and an angle control member including a sliding member, a second end of which is disposed on an emission path of the deposition material, and moving forward/backward in the emission direction of the deposition material along the inner space; disposing a substrate so as to be opposite the deposition source and the angle control member; controlling an emission direction angle of the deposition material by moving the sliding member forward or backward with respect to the emission direction of the deposition material; and forming a thin film on the substrate by emitting the deposition material onto the substrate.
  • the deposition source is preferably provided in plural and is arranged side by side in a first direction, and the angle control member is provided between the deposition sources, and the controlling of the emission direction angle of the deposition material preferably includes moving the sliding members, included in the pair of angle control members disposed in the outermost edge, forward/backward by the same distance.
  • the deposition source is preferably provided in plural and is arranged side by side in a length direction, and the angle control member is provided between the deposition sources, and the controlling of the emission direction angle of the deposition material preferably includes moving the sliding members of the angle control members disposed between the deposition sources forward/backward the same distance.
  • the deposition material is preferably an organic material forming an organic emission layer, and the thin film is preferably an organic emission layer.
  • the thickness of the thin film can be uniformly formed.
  • the thickness of the thin film can be uniform even by compensating the change of the emission angle.
  • an organic thin film can be uniformly deposited throughout the entire pixel arrangement of the OLED display so that luminance uniformity of each pixel can be improved.
  • the angle control member can be replaced without stopping the process even though the process condition is changed during the deposition process, thereby improving the manufacturing yield. Furthermore, manufacturing can be simplified and the exemplary embodiments of the present invention can be easily applied to a large-sized substrate manufacturing process, and the manufacturing yield and the deposition efficiency can be improved.
  • FIG. 1 is a perspective view of a deposition apparatus according to an exemplary embodiment of the present invention.
  • FIG. 2 and FIGS. 3A and 3B are schematic side views of the deposition apparatus according to the exemplary embodiment of the present invention.
  • FIGS. 4A and 4B are schematic side views of a deposition apparatus according to another exemplary embodiment of the present invention.
  • FIG. 5 is a flowchart of a method for manufacturing an OLED display according to the present invention.
  • FIG. 6 is a flowchart of the operation of the deposition apparatus of the present invention.
  • FIG. 1 is a perspective view of a deposition apparatus according to an exemplary embodiment of the present invention.
  • a deposition apparatus includes a deposition source 100 ( 100 a and 100 b ) and a pair of angle control members 200 ( 200 a and 200 b ).
  • FIG. 1 is provided in a vacuum chamber that maintains a sufficient degree of vacuum.
  • a deposition apparatus and a substrate S, on which a thin film is formed, are provided in the vacuum chamber.
  • the substrate S is disposed opposite the deposition apparatus at a distance therefrom, and the deposition apparatus and the substrate S may be disposed relative to each other while moving relative to each other.
  • the substrate S may be disposed in parallel with an upper portion of the deposition apparatus, and when the deposition apparatus is disposed so as to emit the deposition material in a horizontal direction, the substrate S may be vertically disposed.
  • the deposition apparatus is disposed at the bottom side of the vacuum chamber and the substrate S is disposed at a distance in the horizontal direction (i.e. y-axis direction) at the upper side of the deposition apparatus, but the present invention is not limited thereto.
  • the substrate S may be disposed in the vertical direction (i.e., z-axis direction), and thus the deposition apparatus may be disposed at a distance in the horizontal direction from the substrate.
  • the deposition source 100 is a means for emitting a deposition material so as to deposit the deposition material on the substrate S, and it is provided with a space (not shown) for receiving a deposition material, such as an organic material.
  • the deposition material receiving space may be formed of a ceramic material having an excellent heat emission feature, such as alumina (Al 2 O 3 ), aluminum nitride (AlN), and the like, and it is not restrictive.
  • the deposition material receiving space may be formed of various materials having an excellent heat emission feature and heat resistance.
  • a heater (not shown) may be formed so as to surround the external surface of the deposition material receiving space in a closely attached manner, and the heater heats the received deposition material for vaporization of the deposition material.
  • Spray nozzles 110 110 a and 110 b ) that spray the vaporized or sublimated deposition material from an inner space of the deposition source are disposed on one side of the deposition source 100 , facing the substrate S.
  • the substrate S may be formed in the shape of a rectangular plate for forming of the deposition material, and the deposition source 100 may be formed as a linear deposition source that is linearly arranged in a first direction (x-axis direction) so that the spray nozzles 110 become parallel to one side of the substrate S.
  • the spray nozzles 110 may be arranged in a line, but it is not restrictive.
  • the spray nozzles 110 may be arranged in two or more lines.
  • the deposition source may be provided so as to be plural and arranged in a line, and two deposition sources 100 a and 100 b are exemplarily arranged side by side in the present exemplary embodiment.
  • the pair of angle control members 200 is formed in an emission path of the deposition material emitted from the spray nozzles 110 of the deposition source 100 , and functions to control an emission direction of the spray nozzles 110 .
  • the deposition material is not sprayed in a straight line in the emission direction but the spray is spread widely in a frontward direction of the emission direction, and therefore the angle control members 200 are disposed on both sides of the spray nozzles 110 .
  • the angle control members 200 include housings 202 ( 202 a and 202 b ) and sliding members 204 ( 204 a and 204 b ).
  • the housings 202 have a predetermined-sized inner space, and the receiving space is opened in a direction in which the deposition material is emitted.
  • the sliding members 204 are formed in the shape of a plate, and thus one end thereof is inserted in the inner space of the housings 202 , and the other end is disposed on the emission path of the deposition material.
  • the sliding members 204 can move forward and backward in the emission direction of the deposition material along the inner space.
  • An emission angle of the deposition material needs to be controlled according to a process condition such as the type of deposition material, a relationship between the deposition source 100 and the substrate S, and an internal pressure of the vacuum chamber.
  • the emission angle of the deposition material can be controlled according to frontward/backward movement of the sliding members 204 .
  • the angle control members 200 may be extended in the first direction. That is, the housings 202 of the angle control members 200 may also be extended in the first direction, and the sliding members 204 may be formed in the shape of a plate extended in the first direction.
  • the deposition sources 100 are provided in plural, and are thus arranged side by side in the first direction.
  • the angle control members 200 may be disposed not only on both sides of the deposition sources 100 but also between the respective deposition sources 100 .
  • the angle control members 210 may be provided between the two deposition sources 100 a and 100 b.
  • FIG. 2 and FIGS. 3A and 3B are schematic side views of the deposition apparatus according to the exemplary embodiment of the present invention.
  • the deposition material when the sliding members 204 a and 204 b are moved forward as much as a height h 3 (here, h 1 ⁇ h 3 ) in the emission direction of the deposition material, the deposition material is sprayed with an angle of ⁇ 3 (here, ⁇ 1 ⁇ 3 ) by the sliding members 204 a and 204 b , and is then attached to the substrate S. That is, the emission angle of the deposition material is decreased as the sliding members 204 a , 204 b , and 214 move in the emission direction of the deposition material. As described, the emission angle of the deposition material can be controlled according to forward/backward movement of the sliding members 204 a and 204 b.
  • a driver (not shown) connected to the sliding members 204 a and 204 b so as to move sliding members 204 a and 204 b forward/backward in the emission direction of the deposition material may be further provided.
  • the driver is formed with such a configuration that it can generate power for linear reciprocal movement of the sliding members 204 a and 204 b .
  • the driver may linearly move the sliding members 204 a and 204 b in various manners, such as a ball screw method, a cylinder method, an LM method, and the like, and the present invention is not limited thereto.
  • the driver may be driven, interworking with sliding members 204 a and 204 b of a pair of angle control members 200 a and 200 b disposed in the outermost edge of the deposition sources 100 so as to control the sliding members 204 a and 204 b so that they move by the same distance.
  • the deposition materials emitted in the outer direction of the deposition sources 100 a and 100 b may be deposited on the substrate S with the same emission angle of ⁇ 3 .
  • the deposition materials sprayed from the deposition sources 100 a and 100 b may be laterally and symmetrically emitted with reference to the center in the y-axis direction.
  • the driver may be driven, interworking with the sliding member 214 of the angle control member 210 disposed between the deposition sources 100 a and 100 b so as to control the sliding member 214 so that it moves by the same distance.
  • the sliding member 214 between the deposition sources 100 a and 100 b is interworked, emission angles of deposition materials sprayed from the plurality of deposition sources 100 a and 100 b become symmetrical so that the deposition materials can be uniformly deposited.
  • two deposition sources 100 a and 100 b are exemplarily illustrated, but a case in which three or more deposition sources are formed may be the same as the case in which two deposition sources are formed.
  • FIGS. 4A and 4B are a schematic side views of a deposition apparatus according to another exemplary embodiment of the present invention.
  • a second end disposed on an emission path of deposition materials may be bent by a predetermined length in a direction (y-axis) that crosses a movement direction of the sliding member 216 . That is, the second end of the sliding member 216 may be bent by the predetermined length in a direction crossing the movement direction of the sliding member 216 , centering a first direction as the center axis.
  • emission angles of deposition materials emitted from adjacent deposition sources 100 a and 100 b may be different from each other. As shown in FIG.
  • a deposition angle ⁇ 5 of the left side deposition source 100 a becomes larger than a deposition angle ⁇ 4 of the right side deposition source 100 b .
  • the deposition angle ⁇ 4 of the left side deposition source 100 a becomes smaller than the deposition angle ⁇ 5 of the right side deposition source 100 b .
  • a difference between the deposition angles of two deposition sources 100 a and 100 b adjacent to the sliding member 216 may be controlled according to a degree of bending of the sliding member 216 .
  • a thin film may be formed on the substrate S by emitting different deposition materials through a plurality of deposition sources depending on the type of thin film, and in this case, emission angles of the deposition materials emitted from the respective deposition sources should be different from each other.
  • the emission angles of the deposition materials emitted from the adjacent deposition sources may be set to be different from each other by bending the sliding member 214 .
  • the method for manufacturing an OLED display according to the present invention includes: preparing a deposition source that emits a deposition material ( FIG. 5 , block 501 ); preparing a housing disposed on both sides of the deposition source and having an inner space opened in an emission direction of the deposition material ( FIG. 5 , block 502 ), and an angle control member including a sliding member, a second end of which is disposed on an emission path of the deposition material, and moving forward/backward in the emission direction of the deposition material along the inner space ( FIG. 5 , blocks 503 and 504 ); disposing a substrate so as to be opposite the deposition source and the angle control member ( FIG.
  • FIG. 5 , block 505 controlling an emission direction angle of the deposition material by moving the sliding member forward or backward with respect to the emission direction of the deposition material ( FIG. 5 , blocks 506 and 507 ); and forming a thin film on the substrate by emitting the deposition material onto the substrate ( FIG. 5 , block 508 ).
  • the deposition source is preferably provided in plural and is arranged side by side in a first direction, the angle control member is provided between the deposition sources, and the controlling of the emission direction angle of the deposition material preferably includes moving the sliding members, included in the pair of angle control members disposed in the outermost edge, forward/backward by the same distance.
  • the deposition source is preferably provided in plural and is arranged side by side in a length direction, the angle control member is provided between the deposition sources, and the controlling of the emission direction angle of the deposition material preferably includes moving the sliding members of the angle control members disposed between the deposition sources forward/backward the same distance.
  • the deposition material is preferably an organic material forming an organic emission layer, and the thin film is preferably an organic emission layer.
  • FIG. 6 is a flow chart of the operation of the deposition apparatus of the present invention.
  • the substrate S is inserted into the vacuum chamber (not shown), and the substrate S is disposed in opposition to the deposition source 100 that emits the deposition material ( FIG. 6 , block 601 ).
  • a pair of angle control members 200 a and 200 b is disposed on both sides of the deposition source 100 ( FIG. 6 , block 602 ).
  • the emission angle of the deposition material may need to be controlled according to deposition process conditions such as the size of the vacuum chamber or the substrate S, a distance between the substrate S and the deposition source 100 , and the like, and as previously described, the emission direction angle of the deposition material can be controlled by moving the sliding members 204 a , 204 b and 214 forward or backward in the emission direction (z-axis) of the deposition material ( FIG. 6 , blocks 603 and 604 ).
  • the emission direction angle of the deposition material can be controlled according to a forward movement distance of the sliding members 204 a , 204 b and 214 .
  • the emission angle of the deposition material is decreased ( FIG. 6 , block 605 ).
  • the emission angle is increased ( FIG. 6 , block 606 ).
  • the deposition material is then deposited on or attached to the substrate ( FIG. 6 , block 607 ).
  • the sliding members 214 of the angle control members 210 disposed between the deposition sources 100 a and 100 b are interworked with each other and then move forward/backward by the same distance, or the sliding members 214 included in a pair of angle control members 210 disposed in the outermost edge are interworked with each other, and then move forward/backward by the same distance.
  • the deposition material is preferably an organic material that forms a sub-pixel, that is, an organic emission layer that expresses a red color R, a green color G, and a blue color B.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
US13/677,031 2012-06-15 2012-11-14 Depositing apparatus and method for manufacturing organic light emitting diode display using the same Active US8616930B1 (en)

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KR1020120064403A KR101942471B1 (ko) 2012-06-15 2012-06-15 증착 장치 및 이를 이용한 유기 발광 표시장치의 제조방법
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KR102369314B1 (ko) * 2015-06-16 2022-03-04 삼성디스플레이 주식회사 증착 장치
KR102497653B1 (ko) * 2016-03-02 2023-02-08 삼성디스플레이 주식회사 증착 장치 및 이를 이용한 발광 표시 장치의 제조 방법
CN205443432U (zh) * 2016-04-07 2016-08-10 鄂尔多斯市源盛光电有限责任公司 一种线性蒸发源、蒸发源系统及蒸镀装置
JP2018170152A (ja) * 2017-03-29 2018-11-01 Ｔｉａｎｍａ Ｊａｐａｎ株式会社 Ｏｌｅｄ表示装置の製造方法、マスク及びマスクの設計方法
CN106958007B (zh) * 2017-05-12 2019-06-25 武汉华星光电技术有限公司 蒸发装置
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