US7874847B2 - Electronic part and circuit substrate - Google Patents

Electronic part and circuit substrate Download PDF

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Publication number
US7874847B2
US7874847B2 US11/898,713 US89871307A US7874847B2 US 7874847 B2 US7874847 B2 US 7874847B2 US 89871307 A US89871307 A US 89871307A US 7874847 B2 US7874847 B2 US 7874847B2
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United States
Prior art keywords
electronic part
circuit substrate
contactors
electrical
spiral
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Expired - Fee Related, expires
Application number
US11/898,713
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English (en)
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US20080018423A1 (en
Inventor
Jun Matsui
Koji Terada
Hiroyuki Nobuhara
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Fujitsu Ltd
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Fujitsu Ltd
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Assigned to FUJITSU LIMITED reassignment FUJITSU LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MATSUI, JUN, NOBUHARA, HIROYUKI, TERADA, KOJI
Publication of US20080018423A1 publication Critical patent/US20080018423A1/en
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Definitions

  • the present invention relates to an electronic part and a circuit substrate.
  • FIG. 11 is a perspective view of an electronic part and a circuit substrate that implement a conventional hot swap mechanism.
  • FIG. 12 is a partial cross-section of an electronic part and a circuit substrate that implement the conventional hot swap mechanism.
  • a plurality of wirings 402 to 404 are formed on a main surface 401 of a plug-type connecting terminal 400 .
  • the wirings 402 to 404 are arranged to have different distances from a connecting end 405 in the direction of electrical connection (direction indicated by outlined arrows in FIG. 11 ).
  • a plug portion 510 having a hollow rectangular cross-section is formed on a main surface 501 of a receptacle-type connecting terminal 500 .
  • On an inner peripheral surface of the plug portion 510 a plurality of wirings 502 that are arranged to have the same distance from a connecting end 505 are formed.
  • the connecting terminals 400 and 500 thus arranged are connected, upon plugging the plug-type connection terminal 400 into the plug portion 510 of the receptacle-type connecting terminal 500 , the wirings 402 that are arranged at both ends in a direction perpendicular to the direction of the electrical connection and the wirings 502 are connected first, the wirings 403 and the wirings 502 are connected next, and the wirings 404 and the wirings 502 are connected finally.
  • the plug-type connecting terminal 400 is unplugged from the plug portion 510 , the wirings are disconnected in the opposite order.
  • Such a structure is referred to as card-edge connection.
  • a plurality of electrical connecting terminals 601 to 603 that are different in height (having different lengths) from a main surface 604 in an inserting direction (direction indicated by outlined arrows in FIG. 12 ) are formed and arranged two-dimensionally, as shown in FIG. 12 .
  • electrical contactors 702 are formed on inner peripheral surfaces and peripheries of holes 701 to which the electrical connecting terminals 601 to 603 are inserted.
  • the hot swap mechanism in the hot swap mechanism of conventional connecting structures such as the card-edge connection shown in FIG. 11 and PGA shown in FIG. 12 , by forming parts corresponding to one of the connecting parts (wiring or connecting terminal), which are connected to each other, in different lengths (wiring length, etc) in the direction of electrical connection, the hot swap mechanism is implemented in which contact timing of the respective parts is varied.
  • the hot swap mechanism is implemented in which contact timing of the respective parts is varied.
  • the wirings 402 to 404 can only be formed on the main surface 401 , which is on only one of the two sides of the plug-type connection terminal 400 .
  • the electrical connecting terminals 601 to 603 cannot be formed at intervals smaller than certain intervals in the electronic part 600 , in other words, there is a limit in terms of high density mounting.
  • mounting techniques such as a ball grid array (BGA) and a land grid array (LGA) have been developed, which enable electrical connection between an electronic part and a circuit substrate with electrodes formed at 0.5 millimeter (mm) intervals.
  • BGA ball grid array
  • LGA land grid array
  • this mounting technique is not suitable for part replacement or the like (For example, Japanese Patent Laid-Open Publication Nos. 2000-340709 and 2001-68594).
  • FIGS. 13A to 13C and FIGS. 14A to 14C are action transition diagrams for explaining electrical connection between an electronic part and a circuit substrate using conventional spiral contactors.
  • a plurality of spherical electrical connecting terminals (electrode bumps) 801 to 803 are formed in an electronic part 800 .
  • a plurality of planar spiral contactors 851 to 853 are formed at positions corresponding to connecting positions with the electrical connecting terminals 801 to 803 .
  • each of the electrical connecting terminals 801 to 803 comes into contact with each of the spiral contactors 851 to 853 at substantially the same time. Then, as shown in FIG. 13C , each of the spiral contactors 851 to 853 deforms in the direction of electrical connection (direction indicated by an outlined arrow in FIG. 13C ), thereby securely connecting each of the electrical connecting terminals 801 to 803 and each of the spiral contactors 851 to 853 .
  • a plurality of planar electrical contactors 901 to 903 are formed in an electronic part 900 .
  • a plurality of convex spiral contactors 951 to 953 are formed at positions corresponding to connecting positions with the electrical contactors 901 to 903 .
  • FIG. 14B if the electronic part 900 is gradually brought close to the circuit substrate 950 in the direction of the electrical connection (direction indicated by the outlined arrow in FIG. 14B ), each of the electrical contactors 901 to 903 comes into contact with each of the spiral contactors 951 to 953 at substantially the same time. Then, as shown in FIG.
  • each of the spiral contactors 901 to 903 deforms into a planar shape, thereby connecting each of the electrical contactors 901 to 903 and each of the spiral contactors 951 to 953 securely (for example, Japanese Patent No. 3440243).
  • the electrical connecting terminals 801 to 803 ( 901 to 903 ) and the spiral contactors 851 to 853 ( 951 to 953 ) come into contact at substantially the same time. Therefore, although an attaching/detaching mechanism of the electronic part 800 ( 900 ) and the circuit substrate 850 ( 950 ) is implemented, a hot swap mechanism in which, for example, after a power circuit in the electronic part 800 ( 900 ) is energized, energizing of a predetermined circuit is difficult to implement together with the attaching/detaching mechanism.
  • An electronic part according to one aspect of the present invention is mounted on a circuit substrate having a plurality of elastic electrical contactors, and includes a plurality of electrical connecting terminals enabling to establish electrical connection with the circuit substrate by contacting the electrical contactors.
  • the electrical connecting terminals are formed to be different in height from each other relative to a surface on which the electrical connecting terminals are formed.
  • a circuit substrate includes a plurality of electrical contactors that enable to establish electrical connection with an electronic part that is mounted on the circuit substrate and that includes a plurality of electrical connecting terminals, by contacting the electrical connecting terminals.
  • the electrical contactors are elastic, and are different from each other in height relative to a surface on which the electrical contactors are formed, in a state in which no external force is applied.
  • FIG. 1 is a perspective view of an electronic part and a circuit substrate according to a first embodiment of the present invention
  • FIG. 2 is a plan view of the electronic part according to the first embodiment viewed from a circuit-substrate side;
  • FIGS. 3A to 3C are diagrams showing a process of forming solder bumps of the electronic part according to the first embodiment
  • FIGS. 4A to 4C are diagrams showing a process of connecting the electronic part and the circuit substrate according to the first embodiment
  • FIG. 5 is a side view of the electronic part, partially cutaway, and the circuit substrate according to the first embodiment
  • FIG. 6 is a perspective view of an electronic part and a circuit substrate according to a second embodiment of the present invention.
  • FIGS. 7A to 7C are diagrams showing a process of forming spiral contactors of the circuit substrate according to the second embodiment
  • FIGS. 8A to 8C are diagrams showing a process of connecting the electronic part and the circuit substrate according to the second embodiment
  • FIG. 9 is a perspective view of an electronic part and a circuit substrate according to a third embodiment of the present invention.
  • FIGS. 10A to 10C are diagrams showing a process of connecting the electronic part and the circuit substrate according to the third embodiment
  • FIG. 11 is a perspective view of an electronic part and a circuit substrate that implement a conventional hot swap mechanism
  • FIG. 12 is a partial cross-section of an electronic part and a circuit substrate that implement the conventional hot swap mechanism
  • FIGS. 13A to 13C are action transition diagrams for explaining conventional electrical connection between an electronic part and a circuit substrate using spiral contactors.
  • FIGS. 14A to 14C are action transition diagrams for explaining conventional electrical connection between an electronic part and a circuit substrate using spiral contactors.
  • spherical connecting terminals soldder bumps
  • planar spiral contactors having different sizes (diameters) are used as the electrical contactors of the circuit substrate.
  • FIG. 1 is a perspective view of the electronic part and the circuit substrate according to the first embodiment.
  • FIG. 2 is a plan view of the electronic part according to the first embodiment viewed from a circuit-substrate side.
  • an electronic part 100 such as CSP
  • spherical solder bumps 101 to 103 as a plurality of electrical connecting terminals are formed on a main surface 116 of a connecting substrate 117 (see FIG. 2 ), and arranged two-dimensionally in an X direction and a Y direction.
  • planar spiral contactors 151 to 153 as a plurality of electrical contactors are formed at positions respectively corresponding to positions of the solder bumps 101 to 103 , and arranged two-dimensionally in the X direction and the Y direction.
  • the solder bumps 101 to 103 are formed in such relation as the solder bump 101 >the solder bump 102 >the solder bump 103 in diameter, and are arranged in order of the solder bump 103 , the solder bump 102 , and the solder bump 101 toward the end of the main surface 116 of the connecting substrate 117 so that the diameter of the solder bumps gradually increases.
  • the spiral contactors 151 to 153 are formed in such relation as the spiral contactor 151 >the spiral contactor 152 >the spiral contactor 153 in diameter so as to correspond to the solder bumps 101 to 103 , respectively.
  • FIGS. 3A to 3C are diagrams showing a process of forming the solder bumps 101 to 103 .
  • Electrode lands 111 to 113 formed with Cu and the like in desirable sizes are formed on the conductor pattern 119 , and the rest of the main surface 116 is covered with a resist 118 .
  • the solder bumps 101 to 103 are formed by plating on the electrode lands 111 to 113 , for example, by putting the connecting substrate 117 in liquid obtained by heating solder to be melted in a deoxygenated atmosphere.
  • the electrode lands 111 to 113 are formed in such relation as the electrode land 111 >the electrode land 112 >the electrode land 113 in size (diameter), the amount of the solder to be plated differs depending on the size of the electrode lands 111 to 113 due to surface tension of the melted solder, thereby obtaining the solder bumps 101 to 103 of different sizes.
  • the resist 118 on the main surface 116 of the connecting substrate 117 is removed by peeling or the like.
  • the connecting substrate 117 from which the resist 118 has been removed is heated again to cause the surface tension in the solder bumps 101 to 103 , thereby arranging the solder bumps 101 to 103 in a spherical shape as shown in FIG. 3C .
  • heights of the solder bumps 101 to 103 from the main surface 116 can be formed to differ.
  • the spiral contactors 151 to 153 in the circuit substrate 150 are formed by a conventional technique such as photolithography using a light beam or the like, and therefore, explanation is omitted.
  • FIGS. 4A to 4C are diagrams showing a process of connecting the electronic part 100 and the circuit substrate 150 .
  • the solder bump 101 and the spiral contactor 151 having the largest diameter come into contact first.
  • a hot swap mechanism can be implemented, for example, by a configuration in which a power source circuit is energized by contact of the solder bump 101 and the spiral contactor 151 , and other circuits such as a program circuit are energized by contact of the solder bumps 102 and 103 and the spiral contactors 152 and 153 . Therefore, in addition to the hot swap mechanism, in which an arbitrary circuit in the electronic part 100 is energized first, and other circuits are energized later, the attaching/detaching mechanism of the electronic part 100 with respect to the circuit substrate 150 can also be implemented.
  • the solder bumps 101 to 103 are arranged so that the height in the direction of contact gradually increases toward the edge of the main surface 116 . This arrangement is suitable for the following cases.
  • FIG. 5 is a side view of the electronic part 100 , partially cutaway, and the circuit substrate 150 .
  • the solder bumps 101 to 103 of the electronic part 100 having, for example, a semiconductor chip 130 are formed such that the height thereof in the direction of contact gradually increases toward the edge.
  • the spiral contactors 151 to 153 of the circuit substrate 150 are formed in a planar shape.
  • Arrangement of the solder bumps 101 to 103 is not limited to the arrangement described above, and can be modified according to a desired connecting mode and the like.
  • the size (height) of the solder bumps 101 to 103 of the electronic part 100 are varied in the direction of contact with the circuit substrate 150 relative to the main surface 116 of the connecting substrate 117 . Therefore, the contact/separation timing of the respective solder bumps 101 to 103 and the respective spiral contactors 151 to 153 are varied, thereby implementing the hot swap mechanism of the electronic part 100 with respect to the circuit substrate 150 .
  • the attaching/detaching mechanism of the electronic part 100 with respect to the circuit substrate 150 can be achieved. Therefore, for example, at the time of maintenance or replacement of parts, attachment and detachment of the electronic part 100 is possible while achieving the hot swap mechanism. Furthermore, since this electrical connection of the electronic part and the circuit substrate is applicable to BGA and LGA, high density mounting of the electronic part 100 becomes possible.
  • disk-shaped connecting terminals are used as the electrical connecting terminals of the electronic part
  • convex spiral contactors are used as the electrical contactors of the circuit substrate.
  • the same reference characters are used for the parts that have been explained, and duplicate explanation is omitted.
  • FIG. 6 is a perspective view of the electronic part and the circuit substrate according to the second embodiment.
  • an electronic part 200 such as CPS
  • disk-shaped electrode lands 201 to 203 as a plurality of electrical connecting terminals are formed on a main surface 216 of a connecting substrate 217 , and arranged two-dimensionally in the X direction and the Y direction.
  • convex spiral contactors 251 to 253 as a plurality of electrical contactors are formed at positions respectively corresponding to positions of the electrode lands 201 to 203 , and arranged two-dimensionally in the X direction and the Y direction.
  • the electrode lands 201 to 203 are formed such that the size (diameter) thereof along the main surface 216 is identical.
  • the spiral contactors 251 to 253 are formed such that the size (diameter) thereof along a main surface 256 of an insulating substrate 257 is identical corresponding to the electrode lands 201 to 203 , but the height thereof in the direction of contact with the electronic part 200 gradually increases toward the edge of the main surface 256 .
  • FIGS. 7A to 7C are diagrams showing a process of forming the spiral contactors 251 to 253 .
  • a plurality of holes 259 are opened in the insulating substrate 257 that is formed with an insulating material, and in openings of these holes 259 , the spiral contactors 251 to 253 formed with a wiring metal material such as Cu are formed.
  • FIGS. 8A to 8C are diagrams showing a process of connecting the electronic part 200 and the circuit substrate 250 .
  • FIG. 8A when the electronic part 200 in which the electrode lands 201 to 203 are formed on a conductor pattern 219 of the connecting substrate 217 is brought close to the circuit substrate 250 , the spiral contactor 251 having the largest height and the electrode land 201 come into contact first.
  • the attaching/detaching mechanism of the electronic part 200 with respect to the circuit substrate 250 can also be implemented.
  • the height of each of the spiral contactors 251 to 253 of the circuit substrate 250 is varied in the direction of contact with the electronic part 200 relative to the main surface 256 of the insulating substrate 257 .
  • the contact/separation timing of the respective electrode lands 201 to 203 and the respective spiral contactors 251 to 253 are varied, thereby implementing the hot swap mechanism of the electronic part 200 with respect to the circuit substrate 250 .
  • the attaching/detaching mechanism of the electronic part 200 with respect to the circuit substrate 250 can be achieved. Therefore, for example, at the time of maintenance or replacement of parts, attachment and detachment of the electronic part 200 is possible while achieving the hot swap mechanism.
  • the electrode lands 201 to 203 and the spiral contactors 251 to 253 can be formed such that the sizes thereof along the main surface 216 and the main surface 256 are different from each other as described in the first embodiment.
  • FIG. 9 is a perspective view of the electronic part and the circuit substrate according to the third embodiment.
  • an electronic part 300 such as CPS
  • disk-shaped electrodes 301 to 303 as a plurality of electrical connecting terminals are formed on a main surface 316 of a connecting substrate 317 , and arranged two-dimensionally in the X direction and the Y direction.
  • convex spiral contactors 351 to 353 as a plurality of electrical contactors are formed at positions respectively corresponding to positions of the electrodes 301 to 303 , and arranged two-dimensionally in the X direction and the Y direction.
  • the electrodes 301 to 303 are formed such that the size (diameter) thereof along the main surface 316 is identical, and the height thereof in the direction of contact with the circuit substrate 350 gradually increases toward the edge of the main surface 316 . Furthermore, the spiral contactors 351 to 353 are formed at positions corresponding to positions of the electrodes 301 to 303 on the main surface 356 , such that the size (diameter) thereof along a main surface 356 is identical, and the height thereof in the direction of contact with the electrode part 300 gradually increases toward the edge of the main surface 356 .
  • FIGS. 10A to 10C are diagrams showing a process of connecting the electronic part 300 and the circuit substrate 350 .
  • FIG. 10A when the electronic part 300 in which the electrodes 301 to 303 are formed on a conductor pattern 319 of the connecting substrate 317 is brought close to the circuit substrate 350 , the electrode 301 having the largest height and the spiral contactor 351 having the largest height come into contact first.
  • the hot swap mechanism in which an arbitrary circuit in the electronic part 200 is energized first and other circuits are energized later, can be implemented.
  • the height of the electrodes 301 to 303 and the height of the spiral contactors 351 to 353 of the circuit substrate 350 are varied so as to increase toward the edge of the main surface 316 and the edge of the main surface 356 in the direction of contact with each other.
  • the contact/separation timing of the respective electrodes 301 to 303 and the respective spiral contactors 351 to 353 are varied further certainly, thereby implementing the hot swap mechanism.
  • the attaching/detaching mechanism of the electronic part 300 with respect to the circuit substrate 350 can also be achieved. Therefore, for example, at the time of maintenance or replacement of parts, attachment and detachment of the electronic part 300 is possible while achieving the hot swap mechanism.
  • this electrical connection of the electronic part and the circuit substrate is applicable to BGA and LGA, high density mounting of the electronic part 300 becomes possible.
  • the electrodes 301 to 303 and the spiral contactors 351 to 353 can be formed such that the sizes thereof along the main surface 316 and the main surface 356 are different from each other as described in the first embodiment.
  • the electrical connection of the electronic part and the circuit substrate according to the present invention can be implemented, for example, by forming regular electrode lands in the circuit substrate, and using deformable conductive rubber or anisotropically conductive rubber having different sizes as the electrodes of the electronic part.
  • the contact/separation timing of the electronic part and the circuit substrate can be varied, thereby implementing the hot swap mechanism at the same time with implementation of the attaching/detaching mechanism.
  • an attaching/detaching mechanism and a hot swap mechanism of an electronic part in high density mounting can be implemented at the same time.
  • the present invention is not limited to the first to the third embodiments described above, and various modifications can be applied within a scope not departing from the points of the present invention.
  • a connector having electrical connecting terminals can be used to achieve the electrical connection in which the contact/separation timing is varied.
  • the spiral contactors 151 to 153 are flat in the initial state as shown in FIG. 4A , as long as it is within a predetermined range.
  • an attaching/detaching mechanism and a hot swap mechanism of an electronic part and a circuit substrate can be implemented at the same time. Moreover, order of electrical connection with a circuit substrate can be controlled even for electrical connecting terminals of an electronic part of surface-mounting type.

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  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connecting Device With Holders (AREA)
US11/898,713 2005-03-18 2007-09-14 Electronic part and circuit substrate Expired - Fee Related US7874847B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/005030 WO2006100746A1 (ja) 2005-03-18 2005-03-18 電子部品および回路基板

Related Parent Applications (1)

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PCT/JP2005/005030 Continuation WO2006100746A1 (ja) 2005-03-18 2005-03-18 電子部品および回路基板

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