US7338205B2 - Temperature monitoring system - Google Patents

Temperature monitoring system Download PDF

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Publication number
US7338205B2
US7338205B2 US11/562,101 US56210106A US7338205B2 US 7338205 B2 US7338205 B2 US 7338205B2 US 56210106 A US56210106 A US 56210106A US 7338205 B2 US7338205 B2 US 7338205B2
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US
United States
Prior art keywords
thermocouple
mirror
circuit board
printed circuit
flexible printed
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Active
Application number
US11/562,101
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English (en)
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US20070147471A1 (en
Inventor
Thomas Zeller
Tanja Finke-Behrend
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Trumpf Laser und Systemtechnik GmbH
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Trumpf Laser und Systemtechnik GmbH
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Assigned to TRUMPF LASER- UND SYSTEMTECHNIK GMBH reassignment TRUMPF LASER- UND SYSTEMTECHNIK GMBH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ZELLER, THOMAS, FINKE-BEHRENDS, TANJA
Publication of US20070147471A1 publication Critical patent/US20070147471A1/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
    • G01K7/023—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples provided with specially adapted connectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit

Definitions

  • the invention relates to a system for monitoring the temperature of a component, and to a gas laser resonator including a temperature monitoring system of this type for at least one mirror of the gas laser resonator.
  • U.S. Publication No. 2002/071475 A1 describes a temperature monitoring device that includes a flexible printed circuit board having a base area at the proximal end and a measuring area at the distal end, a sensor circuit including several strip conductors that are mounted onto the printed circuit board and terminate in the base area in the form of tracepads, and a connection for contacting the tracepads.
  • a sensor is mounted in the measuring area and is electrically connected to the strip conductors.
  • German Published Patent Application No. DE 44 27 181 A1 discloses a device for fixing the measuring head of a thermocouple to a compound.
  • the measuring head is mounted closely to the component by means of a strip and is either mounted on the surface of the strip facing away from the component by means of a holding foil or disposed in a bore of the strip.
  • the invention features systems that monitor the temperature of a component such as a mirror.
  • the systems include a temperature sensor in thermal contact with the component.
  • the temperature sensor includes a thermocouple and connecting lines.
  • the thermocouple is mounted in an electrically conducting fashion onto a flexible printed circuit board tape in which the connecting lines are integrated.
  • the flexible printed circuit board is disposed as an electrical insulator between the thermocouple and the component.
  • the component can be a mirror.
  • the thermocouple can be an SMD component that is mounted to exposed contact surfaces of the flexible printed circuit board tape.
  • the thermocouple can be soldered to exposed contact surfaces of the flexible printed circuit board tape.
  • the flexible printed circuit board tape can be formed from a material that does not gas out or release gas.
  • the flexible printed circuit board tape can be formed from Teflon® brand polytetrafluoroethylene (PTFE).
  • the thermocouple can be a PT100 (platinum resistance thermometer) thermocouple.
  • the temperature monitoring system can include a connector at an end of the flexible printed circuit board tape.
  • the connecting lines can extend as strip conductors on the flexible printed circuit board tape, and the strip conductors can be provided with an electrically insulating coating except at electric contact points with the thermocouple.
  • the electrically insulating coating can include a resist.
  • the temperature monitoring system can include a spring element that presses the temperature sensor towards the mirror.
  • the temperature monitoring system can include a temperature monitoring device that receives a signal from the thermocouple, compares the thermocouple signal with a reference value, and issues an error signal if the signal exceeds the reference value.
  • the temperature monitoring system can include a connector provided at an end of the flexible printed circuit board tape and coupled to the temperature monitoring device.
  • the invention features gas laser resonators that include a mirror, and a system for monitoring the temperature of the mirror.
  • the system includes a temperature sensor in thermal contact with the mirror, and the temperature sensor includes a thermocouple and connecting lines.
  • the thermocouple is mounted in an electrically conducting fashion onto a flexible printed circuit board tape in which the connecting lines are integrated and the flexible printed circuit board tape is disposed as an electrical insulator between the thermocouple and the mirror.
  • the temperature sensor can be in thermal contact with a rear side or a circumferential area of the mirror.
  • the gas laser resonator can include additional mirrors, and a temperature monitoring system for each of the additional mirrors.
  • Each mirror can be associated with a temperature sensor of the temperature monitoring system.
  • the temperature monitoring systems can include a temperature monitoring device that receives a signal from the thermocouple, compares the thermocouple signal with a reference value, and issues an error signal if the signal exceeds the reference value.
  • the invention features a method for monitoring the temperature of a mirror.
  • the method includes integrating connecting lines of a temperature sensor into a flexible printed circuit board tape, mounting a thermocouple of the temperature sensor in an electrically conducting fashion onto the flexible printed circuit board tape, placing the temperature sensor in thermal contact with the mirror, and disposing the flexible printed circuit board tape as an electrical insulator between the thermocouple and the mirror.
  • thermocouple can be mounted onto the flexible printed circuit board tape by mounting the thermocouple to exposed contact surfaces of the flexible printed circuit board tape.
  • the method can also include attaching a connector at an end of the flexible printed circuit board tape.
  • the method can include providing the connecting lines with an electrically insulating coating except at electric contact points with the thermocouple.
  • the method can include pressing the temperature sensor towards the mirror.
  • the method can include comparing a signal from the thermocouple with a reference value, and issuing an error signal if the signal exceeds the reference value.
  • the invention features systems for monitoring a temperature of a component that include a temperature sensor having a thermocouple and a flexible printed circuit board.
  • the component can be a mirror and the flexible printed circuit board tape can be disposed as an electrical insulator between the thermocouple and the mirror.
  • the flexible printed circuit board tape is sufficiently thin so that the thermal insulation has no substantial influence on the temperature measurement.
  • Soiling of the mirror with a uniform coating or a single burn-in defect increases the absorption of a laser beam that impinges on the mirror, whereby more power is output through the mirror whose temperature increases.
  • a temperature monitoring device of the system When the temperature increase exceeds a predetermined limit value, a temperature monitoring device of the system generates a corresponding error signal. Since the front side of the mirror is located in the laser radiation area, a rear side of the mirror or a circumferential area of the mirror is suited as a measuring point for the system.
  • the thermocouple can be a PT100 and a surface mounted device (SMD) component that is mounted, in particular, soldered, to exposed contact surfaces of the flexible printed circuit board tape.
  • SMD surface mounted device
  • the connections of a thermocouple of SMD construction are designed as solder caps that are provided on both sides of the thermocouple.
  • the connections can produce a short-circuit or a parallel resistance if there is direct contact between the connections and the electrically conducting mirror material, and such a short-circuit or parallel resistance can prevent proper measurement of the temperature.
  • the flexible printed circuit board tape is disposed as an electrical insulator between the thermocouple and the component.
  • the flexible printed circuit board tape can be produced from a material that does not release gas, in particular, Teflon®. If the temperature sensor is arranged in a CO 2 laser, the flexible printed circuit board tape can also be produced from Teflon®, which is resistant to the gas atmosphere in the resonator.
  • the connecting lines extend as strip conductors on the flexible printed circuit board tape.
  • the strip conductors are thereby provided with an electrically insulating coating, in particular a resist, except for their electrical contact points with the thermocouple, to electrically insulate the connecting lines to the outside.
  • the temperature monitoring systems include a spring element that urges the thermocouple towards the component to ensure good thermal contact between the temperature sensor and the component.
  • deflecting mirror(s) of, e.g., a folded CO 2 laser including several deflection mirrors is/are thought to be soiled or have burn-in defects
  • all deflecting mirrors are generally replaced as a precaution.
  • the vacuum system of the gas laser resonator is opened with the consequence that particles may get into the resonator and soil it. Soiling of the resonator can, in turn, produce another mirror defect.
  • the mirror supporting surfaces are diamond milled and can be scratched by particles that get between the mirror and the support when the mirror is exchanged. These scratches can result in an undefined mirror abutment and thereby in maladjustment of the resonator.
  • a gas laser resonator in another general aspect, includes at least two mirrors and a system of the design described herein for monitoring the temperature of at least one mirror. If a mirror is soiled, an increased amount of power is absorbed on the mirror, the absorbed power increases the temperature on the mirror, and that increased temperature is detected by the temperature monitoring system.
  • the temperature sensor is in thermal contact with the rear side or the circumferential area of the monitored mirror.
  • each deflecting mirror of the gas laser resonator is associated with a temperature sensor of the temperature monitoring system.
  • this mirror can be detected and selectively replaced.
  • the vacuum system of the gas laser resonator is opened for a shorter time, thus reducing the danger of further resonator soiling.
  • the mirror supports of the remaining mirrors are not scratched because only the damaged mirrors are replaced.
  • FIG. 1 is a diagram of a temperature sensor including a flexible printed circuit board tape with detail A being a cross-sectional view of the flexible printed circuit board tape;
  • FIG. 2 is a cross-sectional view of a system for monitoring the temperature of a deflecting mirror including the temperature sensor of FIG. 1 and a temperature monitoring device;
  • FIG. 3 is a diagram of a gas laser resonator including one or more mirrors whose temperature is monitored by the system of FIG. 2 .
  • the temperature sensor 1 shown in FIG. 1 has a thermocouple 2 and a flexible printed circuit board tape (flex board) 3 .
  • the thermocouple 2 can be a platinum thermocouple (e.g., a PT100).
  • the thermocouple 2 is a surface mounted device (SMD) component and is soldered onto contacts of the flexible printed circuit board tape 3 (solder caps 4 ) in which the connecting lines (strip conductors) 3 a of the thermocouple 2 are integrated.
  • the flexible printed circuit board tape 3 consists of an electrically insulating material 3 b that does not gas out (e.g., Teflon®) and on which the strip conductors 3 a extend.
  • the printed circuit board tape 3 is electrically insulated by a solder resist 3 c . All areas of the printed circuit board tape 3 , except for the soldering caps 4 , are surrounded by this resist.
  • the flexible printed circuit board tape 3 has a connector 5 at its free end in order to connect the temperature sensor 1 to a temperature monitoring device 10 , as shown in FIG. 2 , through lines 18 .
  • the temperature monitoring device 10 monitors the temperature of a deflecting mirror 11 using the temperature sensor 1 whose thermocouple 2 is disposed in thermal contact with the deflecting mirror 11 .
  • the deflecting mirror 11 is guided in an opening 12 of a mirror receptacle 14 such that it can be axially displaced, and is pressed into abutment on a mirror holder 13 by means of an axial spring 15 that is supported on the mirror receptacle 14 .
  • the temperature sensor 1 and, in particular, the thermocouple 2 , is in thermal contact with a rear side of the mirror 11 .
  • thermocouple 2 is disposed between the rear side of the deflecting mirror 11 and a temperature sensor carrier 16 that is guided in the mirror receptacle 14 such that it can be axially displaced, and is pressed towards the deflecting mirror 11 by a spring element (e.g., a helical spring) 17 .
  • the thermocouple 2 is thereby pressed to the deflecting mirror 11 because of force applied by the spring element 17 to ensure good thermal contact between the temperature sensor 1 and the deflecting mirror 11 .
  • the flexible printed circuit board tape 3 can be clamped to the temperature sensor carrier 16 .
  • the temperature sensor carrier 16 is made from a non-conducting material (e.g., PEEK).
  • the solder caps 4 of the thermocouple 2 are provided on both sides of the thermocouple 2 .
  • the solder caps 4 would produce a short-circuit or parallel resistance if they were to come into direct contact with the electrically conducting rear side of the deflecting mirror 11 . Such a short-circuit would prevent a proper temperature measurement.
  • the flexible printed circuit board tape 3 is disposed, as an electrical insulator, between the thermocouple 2 and the deflecting mirror 11 , as shown in FIG. 1 .
  • the flexible printed circuit board tape 3 is sufficiently thin so that its thermal insulating effect has no substantial influence on the temperature measurement.
  • the flexible printed circuit board tape 3 can compensate for a motion of the deflecting mirror 11 of approximately 1 mm towards the axial spring 15 ; such displacement of the deflecting mirror 11 can be required for assembly/disassembly of the mirror 11 .
  • Soiling of the mirror with a uniform coating or a single burn-in defect increases absorption of a laser beam 19 that impinges on the deflecting mirror 11 , whereby more power is output through the deflecting mirror 11 and the temperature of the deflecting mirror 11 increases because of the increased absorption.
  • the temperature monitoring device 10 When the temperature increase exceeds a predetermined limit value, the temperature monitoring device 10 generates a corresponding error signal.
  • FIG. 3 shows a gas laser resonator 100 that is folded into a square shape, whose discharge tubes 101 are disposed in two planes.
  • the gas laser resonator 100 has a rear mirror 102 , a decoupling mirror 103 , and eight deflecting mirrors 104 for guiding a laser beam 105 .
  • the rear mirror 102 , the decoupling mirror 103 , and the deflecting mirrors 104 each have a temperature sensor 1 , which is connected to the temperature monitoring device 10 .
  • the temperature monitoring device 10 determines a spatially averaged temperature value for each mirror 102 , 103 , 104 .
  • the temperature value can be automatically or manually evaluated using the temperature monitoring device 10 .
  • the temperature monitoring device 10 compares the temperature value of a mirror with a reference value that can be pre-determined or input during the setting-up operation of the same mirror.
  • the temperature monitoring device 10 can additionally, or alternatively, compare values between two or more mirrors. If the measured temperature of a mirror 102 , 103 , 104 exceeds the predetermined reference value, the temperature monitoring device 10 issues an error signal for this mirror, which can then be selectively replaced.
  • the temperature sensor 1 is in thermal contact with the circumferential area of the deflecting mirror 11 , 102 , 103 , and 104 .
  • the temperature sensor 1 may be more suitably disposed on the circumferential area of the mirror, because the mirror rear side is not suited for temperature measurements due to the penetrating laser radiation.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Lasers (AREA)
  • Laser Beam Processing (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
US11/562,101 2004-05-21 2006-11-21 Temperature monitoring system Active US7338205B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DEDE102004024955.5 2004-05-21
DE102004024955A DE102004024955A1 (de) 2004-05-21 2004-05-21 Temperatursensor und Temperaturüberwachungsvorrichtung
PCT/EP2005/005427 WO2005114123A1 (de) 2004-05-21 2005-05-19 Temperatursensor und temperaturüberwachungsvorrichtung

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2005/005427 Continuation WO2005114123A1 (de) 2004-05-21 2005-05-19 Temperatursensor und temperaturüberwachungsvorrichtung

Publications (2)

Publication Number Publication Date
US20070147471A1 US20070147471A1 (en) 2007-06-28
US7338205B2 true US7338205B2 (en) 2008-03-04

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Application Number Title Priority Date Filing Date
US11/562,101 Active US7338205B2 (en) 2004-05-21 2006-11-21 Temperature monitoring system

Country Status (5)

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US (1) US7338205B2 (de)
EP (1) EP1747438B1 (de)
AT (1) ATE514927T1 (de)
DE (1) DE102004024955A1 (de)
WO (1) WO2005114123A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11287330B2 (en) * 2018-08-14 2022-03-29 Watlow Electric Manufacturing Company Low profile surface temperature sensor

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006060978B4 (de) * 2006-12-20 2014-09-11 Ifm Electronic Gmbh SMD-Temperaturmesselement und Vorrichtung
US11366019B2 (en) * 2019-06-28 2022-06-21 X Development Llc Enhanced ambient temperature detection

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE219282C (de)
US3395050A (en) * 1963-12-28 1968-07-30 Anritsu Keitki Kabushiki Kaish Surface contacting thermo-couple
US4242148A (en) * 1979-08-03 1980-12-30 Thermo Electric Co., Inc. Thermocouple surface probe
US4795498A (en) * 1983-12-30 1989-01-03 Damon Germanton Low cost thermocouple apparatus and methods for fabricating the same
DE3939165C1 (en) 1989-11-27 1990-10-31 Heraeus Sensor Gmbh, 6450 Hanau, De Temp. sensor with measurement resistance - has ceramic disk with thin metallic coating as resistance layer, and plastic sheet conductor plate
US5370459A (en) 1993-06-08 1994-12-06 Claud S. Gordon Company Surface temperature probe with uniform thermocouple junction
US5411600A (en) * 1992-06-03 1995-05-02 Eastman Kodak Company Ultrathin film thermocouples and method of manufacture
DE4427181A1 (de) 1994-08-01 1996-02-08 Siemens Ag Vorrichtung zur Halterung der Meßspitze eines Thermoelements an einem Bauteil
DE19913195A1 (de) 1999-03-24 2000-10-12 Techem Service Ag Meßeinsatz für Widerstandsthermometer
DE19923014A1 (de) 1999-05-03 2000-11-09 Paul Ruester & Co Uwe Flexibler Oberflächentemperaturfühler
US6152597A (en) 1997-06-27 2000-11-28 Potega; Patrick H. Apparatus for monitoring temperature of a power source
US20020071475A1 (en) 2000-12-07 2002-06-13 Betzner Timothy M. Temperature sensor with flexible circuit substrate
DE10219011A1 (de) 2002-04-27 2003-11-13 Fraunhofer Ges Forschung Temperatursensor für eine Applikation in Trennebenen

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD219282A1 (de) * 1983-11-01 1985-02-27 Sachsenwerk Elektromasch Flaches und biegsames widerstandsthermometer

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE219282C (de)
US3395050A (en) * 1963-12-28 1968-07-30 Anritsu Keitki Kabushiki Kaish Surface contacting thermo-couple
US4242148A (en) * 1979-08-03 1980-12-30 Thermo Electric Co., Inc. Thermocouple surface probe
US4795498A (en) * 1983-12-30 1989-01-03 Damon Germanton Low cost thermocouple apparatus and methods for fabricating the same
DE3939165C1 (en) 1989-11-27 1990-10-31 Heraeus Sensor Gmbh, 6450 Hanau, De Temp. sensor with measurement resistance - has ceramic disk with thin metallic coating as resistance layer, and plastic sheet conductor plate
US5411600A (en) * 1992-06-03 1995-05-02 Eastman Kodak Company Ultrathin film thermocouples and method of manufacture
US5370459A (en) 1993-06-08 1994-12-06 Claud S. Gordon Company Surface temperature probe with uniform thermocouple junction
DE4427181A1 (de) 1994-08-01 1996-02-08 Siemens Ag Vorrichtung zur Halterung der Meßspitze eines Thermoelements an einem Bauteil
US6152597A (en) 1997-06-27 2000-11-28 Potega; Patrick H. Apparatus for monitoring temperature of a power source
DE19913195A1 (de) 1999-03-24 2000-10-12 Techem Service Ag Meßeinsatz für Widerstandsthermometer
DE19923014A1 (de) 1999-05-03 2000-11-09 Paul Ruester & Co Uwe Flexibler Oberflächentemperaturfühler
US20020071475A1 (en) 2000-12-07 2002-06-13 Betzner Timothy M. Temperature sensor with flexible circuit substrate
DE10219011A1 (de) 2002-04-27 2003-11-13 Fraunhofer Ges Forschung Temperatursensor für eine Applikation in Trennebenen

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Search Report for corresponding European Application Serial No. PCT/EP2005-005427, mailed Sep. 7, 2005.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11287330B2 (en) * 2018-08-14 2022-03-29 Watlow Electric Manufacturing Company Low profile surface temperature sensor

Also Published As

Publication number Publication date
DE102004024955A1 (de) 2005-12-15
EP1747438A1 (de) 2007-01-31
ATE514927T1 (de) 2011-07-15
EP1747438B1 (de) 2011-06-29
WO2005114123A1 (de) 2005-12-01
US20070147471A1 (en) 2007-06-28

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