Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
  • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
  • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
  • C08L83/04—Polysiloxanes
  • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
  • C08K5/0066—Flame-proofing or flame-retarding additives
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
  • C08L83/04—Polysiloxanes

Definitions

• the present invention relates to a silicone resin composition of low melt viscosity and excellent reactivity and dispersibility in organic resins.
• the present invention also relates to a curable resin composition for forming a cured resin of excellent moldability and superior flame retardant properties while having little adverse impact on the human body and the environment as a result of containing no antimony oxides or halogenated epoxy resins.
• the present invention also relates to a cured resin having little adverse impact on the human body or the environment and possessing superior flame retardant properties.
• curable resin compositions can produce cured resin of superior dielectric characteristics, volume resistivity, dielectric breakdown strength, and other electrical characteristics, as well as flexural strength, compression strength, impact strength, and other mechanical characteristics, in order to improve their flame retardant properties, they have to be combined with halogen-containing compounds and antimony oxides, such as antimony trioxide, which gives cause for concern with respect to their impact on the human body and the environment due to the toxicity of the antimony oxide powders and the toxic gases released during the burning of the resultant cured resins.
• antimony oxides such as antimony trioxide
• combining silicone resins with curable resins improves pre-curing flowability and provides for better flexibility, moisture resistance, and resistance to thermal shock.
• combining silicone resins with curable resins improves the flame retardant properties of the cured resin.
• the problem with the curable resin composition disclosed in Japanese Unexamined Patent Application Publication No. Hei 6-298897 was the insufficient flame retardant properties of the resultant cured resin.
• the problem with the curable resin compositions disclosed in Japanese Unexamined Patent Application Publication No. Hei 11-222559 and Japanese Unexamined Patent Application Publication No. Hei 11-323086 was poor moldability causing mold contamination during molding, etc.
• One embodiment of the present invention comprises a silicone resin composition comprising (A) a silicone resin with a softening point exceeding 25° C., and (B) a silicone resin that is liquid at 25° C.
• Other embodiments of the present invention include a curable resin comprising: (I) a curable resin, (II) a silicone resin with a softening point exceeding 25° C., and (III) a silicone resin that is liquid at 25° C. and the cured resin obtained by curing the above-mentioned curable resin composition.
• Component (A) is a silicone resin with a softening point exceeding 25° C., represented by the average unit formula (R 1 SiO 3/2 ) a (R 2 2 SiO 2/2 ) b (R 3 3 SiO 1/2 ) c (SiO 4/2 ) d (XO 1/2 ) e .
• R 1 , R 2 , and R 3 stand for identical or different monovalent hydrocarbon groups or epoxy-containing organic groups.
• the monovalent hydrocarbon groups are exemplified by methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, and other alkyl groups; vinyl, allyl, butenyl, heptenyl, hexenyl, and other alkenyl groups; phenyl, tolyl, xylyl, naphthyl, and other aryl groups; benzyl, phenetyl, and other aralkyl groups; chloromethyl, 3-chloropropyl, 3,3,3-trifluoropropyl, nonafluorobutylethyl, and other substituted alkyl groups.
• the epoxy-containing organic groups are exemplified by 2,3-epoxypropyl, 3,4-epoxybutyl, 4,5-epoxypentyl, and other epoxyalkyl groups; 2-glycidoxyethyl, 3-glycidoxypropyl, 4-glycidoxybutyl, and other glycidoxyalkyl groups; 2-(3,4-epoxycyclohexyl)ethyl, 3-(3,4-epoxycyclohexyl)propyl, and other epoxycyclohexylalkyl groups.
• 0.1 to 40 mol % comprises epoxy-containing organic groups. This is due to the fact that when the content of the epoxy-containing organic groups is below the lower end of the above-mentioned range, combining the resultant silicone resin composition with organic resins results in bleeding during the molding of the organic resin composition and the flexibility, moisture resistance, and thermal shock resistance of the obtained moldings have a tendency to decrease while, on the other hand, when the content exceeds the upper end of the above-mentioned range, the mechanical characteristics of the resultant moldings tend to decrease.
• not less than 10 mol % of the total number of R 1 , R 2 , and R 3 groups comprise phenyl groups.
• phenyl groups should comprise not less than 10 mol % of R 1 , and even more preferably, phenyl groups should comprise not less than 30 mol % of R 1 .
• X stands for a hydrogen atom or alkyl groups, with the alkyl groups exemplified by methyl, ethyl, propyl, butyl, pentyl, hexyl, and heptyl.
• subscript a is a positive number
• subscript b is 0 or a positive number
• subscript c is 0 or a positive number
• subscript d is 0 or a positive number
• subscript e is 0 or a positive number such that b/a is a number from 0 to 10, c/a is a number from 0 to 0.5, d/(a+b+c+d) is a number from 0 to 0.3, and e/(a+b+c+d) is a number from 0 to 0.4.
• This is due to the fact that the softening point of a silicone resin with ab/a exceeding 10 may drop below 25° C. and its affinity for organic resins may also decrease.
• a silicone resin with a c/(a+b+c) exceeding 0.3 has a tendency toward decreased dispersibility in organic resins.
• the weight-average molecular weight of component (A) Preferably, however, it should be in the range of from 500 to 50,000, and more preferably, in the range of from 500 to 10,000.
• the softening point of component (A) exceeds 25° C., preferably, it should be in the range of from 40 to 250° C. and more preferably, in the range of from 40 to 150° C. This is due to the fact that silicone resin with a softening point below the lower end of the range bleeds during the molding of the organic resin, with which it is combined, thereby contaminating the mold, and tends to decrease the mechanical characteristics of the moldings.
• silicone resin with a softening point exceeding the upper end of the range exhibits a tendency towards increased difficulty of uniform dispersion in organic resins.
• component (A′) is the primary raw material, i.e. a mixture of one, two, or more siloxanes or silanes having at least one unit selected from the group comprising units represented by the formulas (i)–(iv) above.
• Component (A′) is exemplified by siloxanes or silanes consisting only of the units represented by (i), siloxanes or silanes consisting only of the units represented by (ii), siloxanes or silanes consisting only of the units represented by (iii), siloxanes or silanes consisting only of the units represented by (iv), siloxanes consisting of units represented by (i) and units represented by (ii), siloxanes consisting of units represented by (i) and units represented by (iii), siloxanes consisting of units represented by (i) and units represented by (iv), siloxanes consisting of units represented by (i), units represented by (ii), and units represented by (iii), siloxanes consisting of units represented by (i), units represented by (ii), and units represented by (iv), and siloxanes consisting of units represented by (i), units represented by (ii), units represented by (iii), and units represented by (iv), and silox
• R 4 , R 5 , and R 6 in the formula above are identical or different monovalent hydrocarbon groups, exemplified by the same monovalent hydrocarbon groups as the above-mentioned R 1 , R 2 , or R 3 .
• phenyl groups should constitute not less than 10 mol % of R 4 and more preferably, phenyl groups should constitute not less than 30 mol % of R 4 .
• the silanes or siloxanes of component (A′) are exemplified by methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, vinyltrimethoxysilane, phenyltrimethoxysilane, 3,3,3-trifluoropropyltrimethoxysilane, dimethyldimethoxysilane, methylphenyldimethoxysilane, methylvinyldimethoxysilane, diphenyldimethoxysilane, dimethyldiethoxysilane, methylphenyldiethoxysilane, tetramethoxysilane, tetraethoxysilane, tetrapropoxysilane, dimethoxydiethoxysilane, and products of their hydrolysis and condensation.
• component (A′′) is an epoxy-containing alkoxysilane, or a partial hydrolysis product thereof, represented by the general formula R 7 R 8 f Si(OR 9 ) (3-f) .
• R 7 is an epoxy-containing organic group, exemplified by the same epoxy-containing organic groups as the above-described R 1 , R 2 , or R 3 .
• the group R 8 in the formula above is a monovalent hydrocarbon group, exemplified by the same monovalent hydrocarbon groups as the above-described R 1 , R 2 , or R 3 .
• the group R 9 in the formula above is an alkyl group, exemplified by methyl, ethyl, propyl, butyl, pentyl, hexyl, and heptyl.
• Subscript f is 0, 1, or 2, preferably, 0.
• the epoxy-containing alkoxysilanes are exemplified by 3-glycidoxypropyl(methyl)dimethoxysilane, 3-glycidoxypropyl(methyl)diethoxysilane, 3-glycidoxypropyl(methyl)dibutoxysilane, 2-(3,4-epoxycyclohexyl)ethyl(methyl)dimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyl(phenyl)diethoxysilane, 2,3-epoxypropyl(methyl)dimethoxysilane, 2,3-epoxypropyl(phenyl)dimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropyltributoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 2-(3,
• component (A′) is reacted with component (A′′) in the presence of a basic catalyst.
• the basic catalyst is a catalyst used in the co-hydrolysis, condensation reaction and equilibration reaction of component (A′) and component (A′′).
• Water may be added if needed for the reaction of co-hydrolysis and condensation of component (A′) and component (A′′).
• the concentration of solid matter in the reaction system may be adjusted using an organic solvent and the reaction may be conducted further.
• the equilibration reaction causes siloxane bonds to be severed and recombination to take place in a random fashion, with the resultant epoxy-containing silicone resin equilibrated.
• the temperature of the reaction should be preferably 80° C. to 200° C. and more preferably, 100° C. to 150° C., because if the reaction temperature is low, then the equilibration reaction does not proceed to a sufficient extent, and if the reaction temperature is excessively high, the silicon-bonded organic groups undergo thermal decomposition.
• selecting organic solvents with a boiling point of 80° C. to 200° C. makes it possible to easily carry out the equilibration reaction at the reflux temperature.
• the equilibration reaction can be terminated by neutralizing the basic catalyst. It is preferable to add carbon dioxide gas, carboxylic acid, or another weak acid to carry out the neutralization.
• the salts produced as a result of the neutralization can be easily removed by filtration or washing with water.
• Component (B) comprises a silicone resin liquid at 25° C.
• Component (B) is used to improve the dispersibility of the silicone resin composition of the present embodiment in organic resins.
• the viscosity of component (B) at 25° C. preferably, it should be in the range of from 5 to 100,000 mPa ⁇ s and more preferably, in the range of from 10 to 5,000 mPa ⁇ s.
• the number average molecular weight of component (B), preferably, as converted to standard polystyrene it should be in the range of from 500 to 5,000, and more preferably, in the range of from 1,000 to 4,000.
• component (B) is preferably a silicone resin having at least one unit selected from the group comprising units represented by the formula R 1 SiO 3/2 (T-units), units represented by the formula R 2 2 SiO 2/2 ( )-units), units represented by the formula R 3 3 SiO 1/2 (M-units), and units represented by the formula SiO 4/2 (Q-units).
• component (B) may have silanol groups or silicon-bonded alkoxy groups and other hydrolyzable groups.
• Component (B) is represented, for instance, by the average unit formula (R 1 SiO 3/2 ) a (R 2 2 SiO 2/2 ) b (R 3 3 SiO 1/2 ) c (SiO 4/2 ) d (XO 1/2 ) e .
• R 1 , R 2 , and R 3 stand for identical or different monovalent hydrocarbon groups or epoxy-containing organic groups, exemplified by the same groups as those described above.
• X is a hydrogen atom or alkyl group, exemplified by the same groups as those described above.
• subscript a is a positive number
• subscript b is 0 or a positive number
• subscript c is 0 or a positive number
• subscript d is 0 or a positive number
• the subscript e is 0 or a positive number such that b/a is a number from 0 to 10, c/a is a number from 0 to 0.5, d/(a+b+c+d) is a number from 0 to 0.3, and e/(a+b+c+d) is a number from 0 to 1.
• the method of preparing the silicone resin of component (B) It can be prepared by the same method as the one used for the above-described component (A).
• the content of component (B) there are no limitations concerning the content of component (B). It is preferable, however, that the content should be in the range of from 0.15 to 200 parts by weight per 100 parts by weight of component (A). This is due to the fact that if the content of component (B) is lower than the lower end of the range, there is a possibility that the dispersibility of the resultant silicone resin composition in organic resins may decrease, and, on the other hand, if it exceeds the upper end of the range, there is a possibility that the moldability of the organic resin containing it may decrease.
• suggested methods include a method in which component (A) and component (B) are mixed in a molten state, or a method in which after mixing component (B) with a solution of component (A) in an organic solvent, the organic solvent is removed.
• the mixing equipment used at such time is exemplified by single-spindle and double-spindle continuous mixers, two roll mills, Ross mixers, kneader-mixers, and mixers equipped with a pressure-reducing device allowing for solvent removal.
• the organic solvents are exemplified by toluene, xylene, and other aromatic hydrocarbons and by acetone, methylethylketone, and other ketone-based solvents.
• the melt viscosity of the silicone resin composition of the present invention at 100° C. preferably it should be not more than 100,000 mPa ⁇ s, and more preferably not more than 10,000 mPa ⁇ s.
• the melt viscosity of the silicone resin composition of the present invention at 160° C. preferably, it should be not more than 10,000 mPa ⁇ s.
• the silicone resin composition of the present invention should be solid at 25° C. and its melting point should be in the range of from 40° C. to 150° C.
• the above-described silicone resin composition of the present invention is useful as an additive imparting heat resistance, flame resistance, water repellency, etc. to organic resins.
• Curable resins and thermoplastic resins are suggested as the organic resins, with which the silicone resin composition of the present invention can be combined, with the curable resins exemplified by phenolic resins, formaldehyde resins, xylene resins, xylene-formaldehyde resins, ketone-formaldehyde resins, furan resins, urea resins, imide resins, melamine resins, alkyd resins, unsaturated polyester resins, aniline resins, sulfonamide resins, silicone resins, epoxy resins, their copolymer-based resins, as well as by mixtures of at least two different kinds of resin from among the above-mentioned, and the thermoplastic resins exemplified by olefinic resins, such as polyethylene, low-density polyethylene,
• the amount added should be in the range of from 0.1 to 100 parts by weight, and, especially preferably, in the range of from 0.5 to 50 parts by weight per 100 parts by weight of the organic resin.
• the curable resin of component (I) is the main ingredient of the present embodiment and is not subject to any limitations so long as it is curable.
• the methods used for curing it are exemplified by heat curing, curing with UV, ionizing radiation, and other high-energy beams, moisture curing, condensation type curing, and addition reaction curing.
• there are no limitations concerning its physical state which means that the resin may be either in a liquid or in a solid state at 25° C.
• Component (I) is exemplified by the above-described curable resins and more preferably, by epoxy resins, phenolic resins, imide resins, or silicone epoxy resins.
• the resins are exemplified by o-cresol novolak type epoxy resins, phenolic novolak type epoxy resins, biphenyl type epoxy resins, biphenylaralkyl type epoxy resins, biphenyl novolak type epoxy resins, bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol AD type epoxy resins, bisphenol-S type epoxy resins, dicyclopentadiene type epoxy resins, naphthalene type epoxy resins, anthracene type epoxy resins, naphthol aralkyl type epoxy resins, polyvinyl phenol type epoxy resins, diphenylmethane type epoxy resins, diphenylsulfone type epoxy resins, triphenol alkane type epoxy resins, cresol-naphthol co-condensation type epoxy resins, bisphenylethylene type epoxy resins
• biphenyl type epoxy resins exemplified by biphenyl type epoxy resins, bisphenol A type epoxy resins, bisphenol F type epoxy resins, stilbene type epoxy resins, biphenyl ether type epoxy resins, and biphenyl sulfone type epoxy resins, and, more specifically, by biphenyl type epoxy resins represented by the general formula:
• biphenyl type epoxy resins represented by the general formula:
• biphenyl ether type epoxy resins represented by the general formula:
• R stands for identical or different hydrogen atoms or alkyl groups, with the alkyl groups of R exemplified by methyl, ethyl, propyl, i-propyl, n-butyl, sec-butyl, and tert-butyl groups.
• subscript n in the formulas is a positive integer. Because of the excellent moldability of the composition and excellent flame retardant properties of the resultant cured products, biphenyl type epoxy resins are preferable as the crystalline epoxy resins of component (I).
• the biphenyl type epoxy resins are exemplified by 4,4′-bis(2,3-epoxypropoxy)biphenyl, 4,4′-bis(2,3-epoxypropoxy)-3,3′,5,5′-tetramethylbiphenyl, 4,4′-bis(2,3-epoxypropoxy)-3,3′,5,5′-tetraethylbiphenyl, 4,4′-bis(2,3-epoxypropoxy)-3,3′,5,5′-tetraethylbiphenyl, and by 4,4′-bis(2,3-epoxypropoxy)-3,3′,5,5′-tetrabutylbiphenyl, which can be obtained, for instance, by purchasing YX4000HK resins from Yuka Shell Epoxy Kabushiki Kaisha.
• the phenolic resins are specifically exemplified by polyvinylphenol type phenolic resins, phenol-novolak type phenolic resins, cresol-novolak type phenolic resins, biphenol type phenolic resins, biphenol aralkyl type phenolic resins, naphthol type phenolic resins, terpene type phenolic resins, phenoldicyclopentadiene type phenolic resins, phenol aralkyl type phenolic resins, naphthol aralkyl type phenolic resins, triphenol alkane type phenolic resins, dicyclopentadiene type phenolic resins, cresol-naphthol co-condensation type phenolic resins, xylene-naphthol co-condensation type phenolic resins, phenolic resins obtained from heavy oil and pitch, and, furthermore, in order to improve the water repellency of the resultant cured products and
• Phenol aralkyl type phenolic resins are preferred because of the superior flame retardant properties of the cured products obtained by curing the composition.
• Such phenol aralkyl type phenolic resins are exemplified by phenol aralkyl type phenolic resins represented by the general formula:
• n in the formulas above is a positive integer.
• Such phenol aralkyl type phenolic resins can be obtained, for instance, by purchasing the Milex XLC-3L line of products from Mitsui Chemicals, Inc.
• curable resin compositions that are combinations of epoxy resins and phenolic resins.
• crystalline biphenyl type epoxy resins are preferable as the epoxy resins, and, furthermore, their combinations with phenol aralkyl type phenolic resins are particularly preferable as far as the phenolic resins are concerned.
• the ratio of epoxy functional groups/phenol functional groups should be in the range of from 0.5 to 2.5.
• the epoxy resins and phenolic resins can be mixed in advance or added separately during mixing with component (II) and component (III).
• Component (II) which is a component used to improve the flame retardant properties of the cured resin obtained by curing the curable resin composition without decreasing the moldability of the present composition, is a silicone resin with a softening point exceeding 25° C., represented by the average unit formula (R 1 SiO 3/2 ) a (R 2 2 SiO 2/2 ) b (R 3 3 SiO 1/2 ) c (SiO 4/2 ) d (XO 1/2 ) e .
• R 1 , R 2 , and R 3 stand for identical or different monovalent hydrocarbon groups or epoxy-containing organic groups exemplified by the same groups as those described above.
• 0.1 to 40 mol % comprises epoxy-containing organic groups. This is due to the fact that when the content of the epoxy-containing organic groups is below the lower end of the above-mentioned range, bleeding occurs during the molding of the resultant curable resin composition and the flexibility, moisture resistance, and thermal shock resistance of the resultant cured resin exhibit a tendency to decrease while, on the other hand, when the content exceeds the upper end of the above-mentioned range, the mechanical characteristics of the resultant cured products tend to decrease.
• not less than 10 mol % of the total number of R 1 , R 2 , and R 3 groups has to include phenyl groups.
• phenyl groups should comprise not less than 10 mol % of R 1 , and even more preferably, phenyl groups should comprise not less than 30 mol % of R 1 .
• X in the formula above is a hydrogen atom or alkyl group, exemplified by the same groups as those mentioned above.
• subscript a is a positive number
• subscript b is 0 or a positive number
• subscript c is 0 or a positive number
• subscript d is 0 or a positive number
• subscript e is 0 or a positive number such that b/a is a number from 0 to 10, c/a is a number from 0 to 0.5, d/(a+b+c+d) is a number from 0 to 0.3, and e/(a+b+c+d) is a number from 0 to 0.4.
• This is due to the fact that the softening point of a silicone resin with a b/a exceeding 10 may drop conspicuously and its affinity for component (I) may also decrease.
• a silicone resin with a c/(a+b+c) exceeding 0.3 has a tendency toward decreased dispersibility in component (I).
• the weight-average molecular weight of component (II) Preferably, however, it should be in the range of from 500 to 50,000, and more preferably, in the range of from 500 to 10,000.
• the softening point of component (II) exceeds 25° C., preferably, it should be in the range of from 40 to 250° C. and more preferably, in the range of from 40 to 150° C. This is due to the fact that silicone resin with a softening point below the lower end of the above-mentioned range bleeds during the molding of the curable resin composition, thereby contaminating the mold, and tends to decrease the mechanical characteristics of the cured products obtained by curing the above-mentioned composition.
• silicone resin with a softening point exceeding the upper end of the above-mentioned range exhibits a tendency towards increased difficulty of uniform dispersion in component (I).
• component (II) In the curable silicone resin composition, there are no limitations concerning the content of component (II), which, preferably, should be in the range of from 0.1 to 500 parts by weight and more preferably, in the range of from 0.5 to 100 parts by weight per 100 parts by weight of component (I). This is due to the fact that if the content of component (II) is below the lower end of the above-mentioned range, it may not be possible to obtain cured resin possessing superior flexibility, moisture resistance, and thermal shock resistance, and, on the other hand, if it exceeds the upper end of the above-mentioned range, the mechanical strength of the cured resin may dramatically decrease.
• Component (III) a silicone resin liquid at 25° C.
• component (III) at 25° C. preferably, its viscosity should be in the range of from 5 to 100,000 mPa ⁇ s and more preferably, in the range of from 10 to 5,000 mPa ⁇ s.
• the number average molecular weight of component (III), preferably, as converted to standard polystyrene it should be in the range of from 500 to 5,000 and more preferably in the range of from 1,000 to 4,000.
• component (III) is preferably a silicone resin having at least one unit selected from the group comprising units represented by the formula R 1 SiO 3/2 (T-units), units represented by the formula R 2 2 SiO 2/2 (D-units), units represented by the formula R 3 3 SiO 1/2 (M-units), and units represented by the formula SiO 4/2 (Q-units).
• component (III) may have silanol groups or silicon-bonded alkoxy groups and other hydrolyzable groups.
• Such component (III) is represented, for instance, by the average unit formula (R 1 SiO 3/2 ) a (R 2 2 SiO 2/2 ) b (R 3 3 SiO 1/2 ) c (SiO 4/2 ) d (XO 1/2 ) e .
• R 1 , R 2 , and R 3 stand for identical or different monovalent hydrocarbon groups or epoxy-containing organic groups, exemplified by the same groups as those described above.
• X is a hydrogen atom or alkyl group, exemplified by the same groups as those described above.
• subscript a is a positive number
• subscript b is 0 or a positive number
• subscript c is 0 or a positive number
• subscript d is 0 or a positive number
• subscript e is 0 or a positive number such that b/a is a number from 0 to 10, c/a is a number from 0 to 0.5, d/(a+b+c+d) is a number from 0 to 0.3, and e/(a+b+c+d) is a number from 0 to 1.
• component (III) It can be prepared by the same method as the one used for the above-described component (II).
• the content of component (III) there are no limitations concerning the content of component (III), but it is preferable, however, that the content should be in the range of from 0.15 to 200 parts by weight and more preferably, in the range of from 0.5 to 100 parts by weight per 100 parts by weight of component (I). This is due to the fact that if the content of component (III) is lower than the lower end of the above-mentioned range, there is a possibility that it may be impossible to obtain cured resin possessing superior flexibility, moisture resistance, and thermal shock resistance, and, on the other hand, if it exceeds the upper end of the above-mentioned range, there is a possibility that the mechanical strength of the cured resin may conspicuously decrease.
• the curable silicone resin composition may contain (IV) inorganic fillers as other optional components.
• Component (IV) is exemplified by glass fiber, asbestos, alumina fiber, ceramic fiber including alumina and silica as ingredients, boron fiber, zirconia fiber, silicon carbonate fiber, metal fiber, and other fibrous fillers; glassy silica, crystalline silica, precipitated silica, fumed silica, calcined silica, zinc oxide, calcined clay, carbon black, glass beads, alumina, talc, calcium carbonate, clay, aluminum hydroxide, magnesium hydroxide, barium sulfate, titanium dioxide, aluminum nitride, boron nitride, silicon carbonate, aluminum oxide, magnesium oxide, titanium oxide, beryllium oxide, kaolin, mica, zircona, and other pulverulent fillers, as well as mixture of two or more of the above fillers.
• Component (IV) is exemplified by glass fiber, asbestos,
• the content of component (IV) is preferably 400 to 1,200 parts by weight per 100 parts by weight of the total of from component (I) through component (III). This is due to the fact that there may be an increase in the thermal expansion coefficient of the resultant cured resin, cracks may appear as a result of stress, and flame retardant properties may deteriorate if the content of component (IV) is less then the lower end of the above-mentioned range, and, on the other hand, the moldability of the resultant composition may decrease if it exceeds the upper end of the above-mentioned range.
• silane coupling agents can be used to form an excellent dispersion of component (IV) in component (I) and improve the affinity between component (I) and component (IV).
• the silane coupling agents are exemplified 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and other epoxy-containing alkoxysilanes; N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, and other amino-containing alkoxysilanes; 3-mercaptopropyltrimethoxysilane, and other mercapto-containing alkoxysilanes.
• the silane coupling agents are exemplified 3-glycidoxypropy
• the curable silicone resin composition preferably contains cure promoters used to promote the curing reaction of component (I).
• the curable silicone resin composition may also contain thermoplastic resins, thermoplastic elastomers, organosynthetic rubber, silicones, and other stress-reducing agents; carnauba wax, higher aliphatic acids, synthetic waxes, and other waxes; carbon black and other colorants; halogen trapping agents, etc.
• component (II) can be prepared by uniformly mixing from component (I) through component (III) and other optional components.
• the dispersibility of component (II) can be improved if component (I) is mixed with a silicone resin composition prepared by mixing component (III) with component (II) and advance.
• the method of preparation may be exemplified by a process, in which, after mixing component (IV) with component (I), component (II), component (III), and other optional components are uniformly mixed therewith, and, at such time, integral blend processes be used by adding coupling agents to component (I) and component (IV), or processes, in which, after pre-treating the surface of component (IV) with a coupling agent, it is mixed with component (I).
• the equipment used to prepare the curable silicone resin composition is exemplified by single- or double-spindle continuous mixers, two roll mills, Ross mixers, and kneader-mixers.
• the curable resin composition of the present invention has superior flowability prior to curing and the cured resin obtained after curing possesses superior flame retardant properties, it can be used for preparing electrical or electronic element sealing resin compositions, paint, coating agents, adhesives, etc. using transfer molding, injection molding, potting, casting, powder coating, and other techniques.
• the curable resin composition of the present invention is particularly suitable for semiconductor sealing applications using transfer pressing.
• the characteristics of the curable resin composition and the cured resin produced therefrom were measured by the methods described below.
• the curable resin composition was transfer press molded at 175° C. for 2 minutes under 70 kgf/cm 2 and then cured by post-curing at 180° C. for 5 hours.
• Burning time test specimens with a thickness of 1/16 inch (about 1.6 mm) were prepared and their burning times (in seconds) were measured in accordance with Standard UL94 (Standard for test for flammability of plastic material for parts in devices and appliances) established by Underwriters Laboratories, Inc.
• the characteristics of the silicone resin and silicone resin composition were measured in the following manner.
• the colorless transparent solid was a 3-glycidoxypropyl-containing silicone resin having a weight-average molecular weight of 2600, a softening point of 73° C., a melt viscosity of 540,000 mPa ⁇ s at 100° C., a melt viscosity of 70,000 mPa ⁇ s at 160° C., and an epoxy equivalent of 1620, represented, according to 29 Si-nuclear magnetic resonance spectral analysis, by the average unit formula: (PhSiO 3/2 ) 0.78 (Me 2 SiO 2/2 ) 0.14 (EpMeSiO 2/2 ) 0.08 Relative to all silicon-bonded organic groups, the content of 3-glycidoxypropyl groups in the silicone resin was 7 mol %, and the content of phenyl groups was 64 mol %.
• the resultant toluene solution was allowed to stand and the water layer was removed, whereupon it was repeatedly washed with water such until the wash liquid became neutral. After that, the toluene solution was subjected to azeotropic dehydration. After cooling, insoluble matter was removed by filtration, and 115.2 g of a colorless transparent solid was obtained by eluting the toluene by heating the filtrate under reduced pressure.
• the colorless transparent solid was a silicone resin having a weight-average molecular weight of 1600, a softening point of 80° C., a melt viscosity of 200,000 mPa ⁇ s at 100° C., a melt viscosity of 3,000 mPa ⁇ s at 160° C., represented, according to 29 Si-nuclear magnetic resonance spectral analysis, by the average unit formula: (PhSiO 3/2 ) 0.70 (PrSiO 3/2 ) 0.30 (HO 1/2 ) 0.43
• a liquid silicone resin with a number-average molecular weight of 1200 and a viscosity of 120 mPa ⁇ s, represented by the average unit formula: (PhSiO 3/2 ) 0.67 (Me 2 SiO 2/2 ) 0.33 (MeO 1/2 ) 0.74 was prepared by subjecting phenyltrimethoxysilane and dimethyldimethoxysilane to a reaction of co-hydrolysis and condensation.
• a liquid silicone resin with a number-average molecular weight of 2000 and a viscosity of 1300 mPa ⁇ s, represented by the average unit formula: (PhSiO 3/2 ) 0.62 (Me 2 SiO 2/2 ) 0.30 (EpMeSiO 2/2 ) 0.08 (MeO 1/2 ) 0.75 was prepared by subjecting phenyltrimethoxysilane, dimethyldimethoxysilane, and methyl(3-glycidoxypropyl)dimethoxysilane to a reaction of co-hydrolysis and condensation.
• Example Type Comparative Application Examples Example Parameter 1 2 1 Melt Viscosity (mPa ⁇ s) 100° C. 24,000 30,000 400,000 160° C. 1,000 1,000 4,000 External Appearance Transparent, Transparent, White, non- uniform uniform uniform
• Dispersion Particle Size of Silicone Resin Samples fabricated by molding disks with a diameter of 10 cm and a thickness of 5 mm under a pressure of 70 kgf/cm 2 at 175° C. for 3 minutes and post-curing them for 5 hours at 180° C. were cut up into pieces and cut surfaces were examined with an electron microscope.
• Mold Contamination After molding 5 disks identical to the ones described above in a row, the tarnishing of the chrome-plated surface of the mold was examined visually, designating cases, in which there was no mold contamination as ⁇ , cases, in which there was a thin tarnishing layer on the surface of the mold, as ⁇ , and cases, in which there was contamination on the surface of the mold, as x.
• the silicone resin composition of the present invention has a low melt viscosity and excellent reactivity and dispersibility in organic resins.
• the curable resin composition of the present invention possesses excellent moldability, forms cured resin of superior flame retardant properties, and does not have an adverse impact on the human body and the environment because it does not contain halogenated epoxy resins and antimony oxides.
• the cured resin of the present invention has little adverse impact on the human body and the environment and possesses superior flame retardant properties.

Landscapes

• Chemical & Material Sciences (AREA)
• Health & Medical Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Medicinal Chemistry (AREA)
• Polymers & Plastics (AREA)
• Organic Chemistry (AREA)
• Compositions Of Macromolecular Compounds (AREA)
• Silicon Polymers (AREA)
• Macromonomer-Based Addition Polymer (AREA)
• Paints Or Removers (AREA)
• Adhesives Or Adhesive Processes (AREA)

Applications Claiming Priority (3)

Publications (2)

Family

ID=27764403

Family Applications (1)

Country Status (7)

Cited By (6)

Families Citing this family (15)

Citations (4)

Family Cites Families (3)

• 2002
  • 2002-02-28 JP JP2002054544A patent/JP4050070B2/ja not_active Expired - Lifetime
• 2003
  • 2003-02-14 EP EP03705204A patent/EP1478695B1/en not_active Expired - Lifetime
  • 2003-02-14 WO PCT/JP2003/001608 patent/WO2003072656A1/en active IP Right Grant
  • 2003-02-14 AU AU2003208009A patent/AU2003208009A1/en not_active Abandoned
  • 2003-02-14 AT AT03705204T patent/ATE409208T1/de not_active IP Right Cessation
  • 2003-02-14 DE DE60323730T patent/DE60323730D1/de not_active Expired - Lifetime
  • 2003-02-14 US US10/504,338 patent/US7138467B2/en not_active Expired - Lifetime

Patent Citations (4)

Also Published As

Similar Documents

Legal Events