US6208213B1 - Thermostatically controlled crystal oscillator - Google Patents

Thermostatically controlled crystal oscillator Download PDF

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Publication number
US6208213B1
US6208213B1 US09/479,417 US47941700A US6208213B1 US 6208213 B1 US6208213 B1 US 6208213B1 US 47941700 A US47941700 A US 47941700A US 6208213 B1 US6208213 B1 US 6208213B1
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United States
Prior art keywords
circuit board
thermostatically controlled
cover
heat
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US09/479,417
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English (en)
Inventor
Sergej Vladimirovich Anastasyev
Alexander Anatolyevich Volkov
Yakov Leonidovich Vorokhovsky
Anatoly Ivanovich Dubinchik
Eduard Leontyevich Kitanin
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Otkrytoe Aktsionernoe Obschestvo Morion
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Otkrytoe Aktsionernoe Obschestvo Morion
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Publication date
Priority to RU97111764A priority Critical patent/RU2122278C1/ru
Priority to PCT/RU1998/000211 priority patent/WO1999003194A2/ru
Priority to CN98806936.9A priority patent/CN1261994A/zh
Priority to EP98940705A priority patent/EP0998021A4/en
Application filed by Otkrytoe Aktsionernoe Obschestvo Morion filed Critical Otkrytoe Aktsionernoe Obschestvo Morion
Priority to US09/479,417 priority patent/US6208213B1/en
Assigned to OTKRYTOE AKTSIONERNOE OBSCHESTVO "MORION" reassignment OTKRYTOE AKTSIONERNOE OBSCHESTVO "MORION" ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ANASTASYEV, SERGEJ VLADIMIROVICH, DUBINCHIK, ANATOLY IVANEVICH, KITANIN, EDUARD LEONTYEVICH, VOLKOV, ALEXANDER ANATOLYEVICH, VOROKHOVSKY, YAKOV LEONIDOVISH
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Publication of US6208213B1 publication Critical patent/US6208213B1/en
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
    • H03L1/00—Stabilisation of generator output against variations of physical values, e.g. power supply
    • H03L1/02—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only
    • H03L1/04—Constructional details for maintaining temperature constant
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/08—Holders with means for regulating temperature

Definitions

  • This invention relates to radio electronics and more particular to frequency oscillators with piezoelectric crystal resonators.
  • RU 2081506 describes a crystal oscillator with a one-stepped thermostatic circuit, which circuit contains a circuit board with elements of the oscillator system mounted thereon.
  • the circuit board is installed in a hermetically sealed outer housing. All temperature controlled elements of the system, including a thermostat with built-in crystal resonator, heating elements, a temperature detector and a thermostatic regulator with a thermosensitive bridge circuit are located in the central part of the circuit board.
  • the central part of the circuit.board is separated from its peripheral part by means of through cuts, both parts being connected at the ends of the cuts by narrow bridging strips.
  • This oscillator has obvious advantages, such as a simple design, small size and low cost, but it does not allow temperature stability of ⁇ 1 ⁇ 10 ⁇ 9 to be achieved. This limitation is explained by insufficient uniformity of temperature distribution and insufficient precision in maintaining a constant temperature.
  • the main object of the present invention is to provide a thermostatically controlled crystal oscillator attaining a high temperature stability of the frequency without use of a double thermostatic circuit.
  • a more specific object of the present invention is to resolve a technical contradiction between a necessity for uniform temperature distribution at the crystal resonator, which requires placing the resonator out of a thermal flow field, for example by increasing the distance between a crystal resonator and a heater and a necessity for very accurate control of temperature, which requires a temperature detector and the heater being placed as close to the resonator as possible.
  • the required uniformity of the temperature field at the crystal resonator is achieved in a thermostatically controlled crystal oscillator with a circuit board divided into central and a peripheral part by means of through cuts (similar to those employed in the oscillator disclosed in RU 2081506). These parts are joined together at the end of each cut with narrow bridging strips. All thermostatically controlled elements of the oscillator are located in the central part of the circuit board. They include a crystal resonator in a separate casing, and a thermostatic regulator with heating elements.
  • the circuit board is installed in a hermetically sealed outer housing.
  • the crystal resonator in the separate casing is tightly adjoined to the bottom of an inner case.
  • This inner case is shaped as an inverted open box made of material that is an excellent heat conductor (or, in other words, possesses a high thermal conductivity).
  • the inner case is fixed to the circuit board using heat-conductive rods, that go through the central part of the circuit board in close proximity to the narrow bridging strips.
  • the bottom of the inner case is tightly adjoined to the circuit board, preferably by a layer of highly heat-conductive glue.
  • the heating elements and a temperature detector are mounted on the outer side walls of the inner case.
  • the open side of the box is covered by a thin cover that is made of material that is an excellent heat conductor, and there is a heat-insulating space between the cover and the body of the crystal resonator.
  • a cover is attached to the those ends of the heat-conducting rods which extend from the opposite side of the circuit board.
  • a heat-insulating space is provided between said cover and the thermostatically controlled elements located in the central part of the circuit board, while the cover is made from material of a high thermal conductivity.
  • a certain matching point can be found along the path of the heat flow being dispersed into the surrounding medium in any possible direction.
  • Said matching point while having virtually the same temperature as the selected one, is separated from it by a heat-insulating space possessing a large heat resistance.
  • the crystal oscillator as well as other thermostatically controlled elements of the circuit are in a zone of uniform temperature distribution, outside of the heat flow path. This constitutes one of the major preconditions of achieving a high temperature stability.
  • the described embodiment of the present invention ensures minimum heat loss directly from the surface of the thermostatically controlled elements, and consequently minimises temperature variations through the volume of these elements, especially of the resonator.
  • the circuit board of a thermostatically controlled crystal oscillator is divided into a central part and a peripheral part by means of through cuts (similar to those described in RU 2081506). Both parts are joined together at the end of each cut with narrow bridging strips. All thermostatically controlled elements of the oscillator are located in the central part of the circuit board. These elements include a crystal resonator in its own casing, a thermostatic regulator with heating elements and a thermosensitive bridge circuit having a reference arm and a main thermosensitive arm with a main temperature detector.
  • the circuit board is installed in a hermetically sealed outer housing. According to the present invention, the thermosensitive bridge circuit is provided with an additional thermosensitive arm with an additional temperature detector.
  • This additional arm is coupled to the main thermosensitive arm by means of a coupling resistor.
  • the aforementioned additional temperature detector can be installed at any location in the oscillator, as long as the temperature at this location (taken under normal outside conditions) is lower than the temperature of the crystal resonator, at least by 0.5° C.
  • the additional temperature detector makes it possible to minimise the inherent design static error of the thermostatic regulator which is caused by that the heaters are physically remote from the thermostatically controlled elements of the circuit. Moreover, the above-specified temperature difference between the crystal resonator and the additional temperature detector provides the opportunity for the effective tuning of the thermostatic regulator.
  • FIG. 1 a simplified general presentation of the crystal oscillator in a cross-sectional view
  • FIG. 2 a front elevation of the circuit board
  • FIG. 3 an electric circuitry of the thermosensitive bridge.
  • FIG. 1 shows the crystal oscillator design of the preferred embodiment of the invention. It comprises a hermetically sealed outer housing 1 inside which a circuit board 2 bearing all elements of the oscillator is located. A central part 3 of the circuit board 2 is separated from a peripheral part thereof by means of through cuts 4 , both parts being connected at the ends of the cuts with narrow bridging strips 5 (shown in FIG. 2 ). All thermostatically controlled elements 16 of the oscillator are concentrated in the central part 3 of the circuit board 2 .
  • the outer housing 1 holds inside an inner case 6 .
  • the inner case 6 is shaped as an inverted open box and is made of material that is an excellent heat conductor, such as copper or aluminium alloy.
  • the bottom of the inner case 6 is tightly adjoined to the central part 3 of the circuit board 2 .
  • a layer 7 of a heat conductive glue is placed therebetween.
  • the inner case 6 is fixed to the circuit board 2 by rods 8 .
  • Material of the rods 8 must be an excellent heat conductor, such as copper.
  • These heat-conducting rods 8 go through the central part 3 of the circuit board 2 in close proximity to each bridging strip 5 (as can be seen from FIG. 2 ).
  • the ends of the heat-conducting rods 8 extend from the opposite side of the central part 3 of the circuit board 2 .
  • a crystal resonator in a separate casing 9 is fixed to the inner side on the bottom of inner case 6 .
  • Heating elements 10 such as transistors, and a first, main, temperature detector 11 are attached to the side walls of the inner case 6 .
  • the open side of the inner case 6 is preferably covered with a thin cover 12 .
  • the cover is made of a heat conducting material, preferably copper, and the thickness of this cover does not exceed 0.5 mm. This cover is fixed with screws that hold the heating elements 10 .
  • a thin copper cover 13 is attached to those ends of the heat-conducting rods 8 that extend from the opposite side of the central part 3 of the circuit board 2 . All the thermostatically controlled elements 16 of the oscillator system are located in the central part 3 of the circuit board 2 . There is a heat-insulating space between the cover 13 and the elements 16 of the oscillator system.
  • the empty space inside the outer housing 1 and the inner case 6 is filled with heat insulation 14 .
  • thermosensitive bridge circuit of the thermostatic regulator consists of:
  • thermosensitive arm with a first, main temperature detector 11 constituted by a temperature-sensitive resistor (thermistor) R 5 (see FIG. 3) and with a specially selected resistor R* 4 , and
  • thermosensitive arm with an additional temperature detector 15 constituted by a thermistor marked as R 2 in the FIG. 3 and a fixed value resistor R 1 .
  • the additional thermosensitive arm is coupled to the main thermosensitive arm by a coupling resistor R* 3 having a fixed resistance.
  • the additional temperature detector 15 is mounted on the peripheral part of the circuit board 2 .
  • the through cuts 4 in the circuit board 2 thermally insulate the central part 3 of the circuit board 2 from its peripheral part, which guarantees temperature difference of more than 0.5° C. between these parts.
  • the thermostatically controlled oscillator functions as follows.
  • the main part of total heat flow generated by the transistor heaters 10 is spreading by the following route: the heater 10 —a side wall of the case 6 —the rods 8 —the bridging strips 5 —the peripheral part of the circuit board 2 —the outer housing 1 —surrounding medium.
  • all rods 8 have the same temperature. Consequently, the bottom of the inner case 6 is only subject to that part of the heat flow which travels as follows: the bottom of the inner case 6 —the central part 3 of the circuit board 2 —the heat insulation 14 —the outer housing 1 —surrounding medium.
  • the heat can also travel along another route: the bottom of the inner case 6 —the resonator casing 9 —the heat insulation 14 —the outer housing 1 —surrounding medium. In both latter instances, there is the heat insulation 14 in the way of the heat flow, so the heat flow along corresponding routes will be quite insignificant. Installation of the covers 12 and 13 will further decrease those flows.
  • Temperature stability ⁇ 4 ⁇ 10 ⁇ 10 Accuracy of thermostatic stabilisation +0,02° C. (evaluated by measuring a frequency in the B mode) ⁇ 0,01° C. within temperature interval from ⁇ 20° C. to +70° C. Power consumption (at 25° C.) 1,5 V Overall size 51 ⁇ 41 ⁇ 19 mm
  • the temperature stability of the order of ⁇ 1 ⁇ 10 ⁇ 9 and higher can be provided with the oscillator of the invention without using a double thermostatic circuit.
  • the thermostatically controlled oscillator of the invention is built with use of only one main temperature detector provided in the main thermosensitive arm of the thermosensitive bridge circuit.
  • the oscillator can be designed without the use of the heat conductive covers 12 and 13 , or the layer 7 of glue could be substituted with another suitable material with a high thermal (or heat) conductivity, and so on.

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Nitrogen And Oxygen Or Sulfur-Condensed Heterocyclic Ring Systems (AREA)
  • Control Of Resistance Heating (AREA)
US09/479,417 1997-07-09 2000-01-07 Thermostatically controlled crystal oscillator Expired - Fee Related US6208213B1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
RU97111764A RU2122278C1 (ru) 1997-07-09 1997-07-09 Термостатированный кварцевый генератор и способ настройки его терморегулятора
PCT/RU1998/000211 WO1999003194A2 (fr) 1997-07-09 1998-06-30 Generateur a quartz et a regulation thermique
CN98806936.9A CN1261994A (zh) 1997-07-09 1998-06-30 恒温控制石英晶体振荡器
EP98940705A EP0998021A4 (en) 1997-07-09 1998-06-30 THERMOSTATICALLY CONTROLLED QUARTZ GENERATOR
US09/479,417 US6208213B1 (en) 1997-07-09 2000-01-07 Thermostatically controlled crystal oscillator

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
RU97111764A RU2122278C1 (ru) 1997-07-09 1997-07-09 Термостатированный кварцевый генератор и способ настройки его терморегулятора
US09/479,417 US6208213B1 (en) 1997-07-09 2000-01-07 Thermostatically controlled crystal oscillator

Publications (1)

Publication Number Publication Date
US6208213B1 true US6208213B1 (en) 2001-03-27

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Family Applications (1)

Application Number Title Priority Date Filing Date
US09/479,417 Expired - Fee Related US6208213B1 (en) 1997-07-09 2000-01-07 Thermostatically controlled crystal oscillator

Country Status (5)

Country Link
US (1) US6208213B1 (ru)
EP (1) EP0998021A4 (ru)
CN (1) CN1261994A (ru)
RU (1) RU2122278C1 (ru)
WO (1) WO1999003194A2 (ru)

Cited By (21)

* Cited by examiner, † Cited by third party
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US6559728B1 (en) 2001-12-19 2003-05-06 Cts Corporation Miniature ovenized crystal oscillator
US20030112710A1 (en) * 2001-12-18 2003-06-19 Eidson John C. Reducing thermal drift in electronic components
US20030152130A1 (en) * 2000-12-29 2003-08-14 Frank Heine Arrangement for temperature monitoring and regulation
US20050258913A1 (en) * 2004-05-19 2005-11-24 Manabu Ito Constant temperature type crystal oscillator
US20060051883A1 (en) * 2004-07-13 2006-03-09 Mescher Mark J Apparatus and system for suspending a chip-scale device and related methods
US20060267702A1 (en) * 2003-04-11 2006-11-30 Koninklijke Philips Electronics N.V. Device for detecting the temperature of an oscillator crystal
US20070007612A1 (en) * 1998-03-10 2007-01-11 Mills Michael A Method of providing an optoelectronic element with a non-protruding lens
US20070268078A1 (en) * 2006-05-18 2007-11-22 Taitien Electronics Co., Ltd. Crystal oscillator device capable of maintaining constant temperature condition
US20080137309A1 (en) * 2006-08-22 2008-06-12 Brilliant Telecommunications, Inc. Apparatus and method for thermal stabilization of pcb-mounted electronic components within an enclosed housing
US7511590B1 (en) * 2002-08-21 2009-03-31 Cypress Semiconductor Corporation Differential crystal oscillator
US20090102567A1 (en) * 2007-10-23 2009-04-23 Delaware Capital Formation, Inc. Heating system for a double-ovenized oscillator on a single printed circuit board
US20090296361A1 (en) * 2008-05-28 2009-12-03 Huang Chung-Er Integrated circuit module with temperature compensation crystal oscillator
US20100289589A1 (en) * 2009-05-18 2010-11-18 Nihon Dempa Kogyo Co., Ltd. Temperature controlled crystal oscillator
US20120086516A1 (en) * 2010-10-08 2012-04-12 Hiroyuki Murakoshi Oven controlled crystal oscillator
JP2012085046A (ja) * 2010-10-08 2012-04-26 Nippon Dempa Kogyo Co Ltd 恒温槽付水晶発振器
JP2012085045A (ja) * 2010-10-08 2012-04-26 Nippon Dempa Kogyo Co Ltd 恒温槽付水晶発振器
EP2634793A3 (en) * 2002-05-31 2014-03-26 Thermo Finnigan LLC Mass spectrometer with improved mass accuracy
JP2014161132A (ja) * 2014-06-12 2014-09-04 Daishinku Corp 恒温槽型圧電発振器
US20150061783A1 (en) * 2013-08-27 2015-03-05 Nihon Dempa Kogyo Co., Ltd. Crystal controlled oscillator
CN103944559B (zh) * 2014-04-24 2018-04-27 广东大普通信技术有限公司 油导热型恒温晶体振荡器加热槽
US20240072729A1 (en) * 2022-08-29 2024-02-29 Txc Corporation Crystal oscillator and oscillating device

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US6049256A (en) * 1998-09-10 2000-04-11 Cts Corporation Low profile ovenized oscillator packing having a high thermal conductivity substrate
CN1333523C (zh) * 2002-11-22 2007-08-22 泰艺电子股份有限公司 时频元件的制造方法及其制品
JP4426375B2 (ja) * 2004-05-19 2010-03-03 日本電波工業株式会社 恒温槽を用いた高安定用の水晶発振器
RU2463700C1 (ru) * 2011-04-20 2012-10-10 Государственное Образовательное Учреждение Высшего Профессионального Образования "Омский Государственный Технический Университет" Терморегулятор термостатированного генератора и способ настройки данного терморегулятора
CN102489431B (zh) * 2011-11-22 2015-09-09 杭州康得新机械有限公司 一种立式覆膜机涂胶分体结构
CN102902288B (zh) * 2012-09-26 2015-12-02 广东大普通信技术有限公司 一种恒温控制晶体振荡器及其恒温槽温度控制方法
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JP6307869B2 (ja) * 2013-12-24 2018-04-11 セイコーエプソン株式会社 電子部品、恒温槽付水晶発振器、電子機器および移動体
JP6376330B2 (ja) * 2014-03-25 2018-08-22 セイコーエプソン株式会社 電子部品、電子機器および移動体
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CN106559070A (zh) * 2016-10-18 2017-04-05 北京无线电计量测试研究所 一种恒温晶体振荡器
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CN109921744B (zh) * 2019-02-22 2023-06-06 深圳市凯越翔电子有限公司 一种设有控温结构且弹簧抗震的单槽恒温晶振
CN109743056B (zh) * 2019-02-26 2024-06-11 泰斗微电子科技有限公司 卫星授时装置
CN113659956B (zh) * 2021-08-12 2024-01-30 深圳市聚强晶体有限公司 一种石英晶体谐振器
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US5025228A (en) 1988-06-24 1991-06-18 Compagnie D'electronique Et De Piezo-Electricite D.E.P.E. Ultrastable oscillator functioning at atmospheric pressure and under vacuum
US5041800A (en) 1989-05-19 1991-08-20 Ppa Industries, Inc. Lower power oscillator with heated resonator (S), with dual mode or other temperature sensing, possibly with an insulative support structure disposed between the resonator (S) and a resonator enclosure
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US5729181A (en) * 1996-08-23 1998-03-17 Hewlett-Packard Company High thermal gain oven with reduced probability of temperature gradient formation for the operation of a thermally stable oscillator

Cited By (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070007612A1 (en) * 1998-03-10 2007-01-11 Mills Michael A Method of providing an optoelectronic element with a non-protruding lens
US7674038B2 (en) * 2000-12-29 2010-03-09 Tesat-Spacecom Gmbh & Co. Kg Arrangement for temperature monitoring and regulation
US20030152130A1 (en) * 2000-12-29 2003-08-14 Frank Heine Arrangement for temperature monitoring and regulation
US20030112710A1 (en) * 2001-12-18 2003-06-19 Eidson John C. Reducing thermal drift in electronic components
US6559728B1 (en) 2001-12-19 2003-05-06 Cts Corporation Miniature ovenized crystal oscillator
EP2634793A3 (en) * 2002-05-31 2014-03-26 Thermo Finnigan LLC Mass spectrometer with improved mass accuracy
US7511590B1 (en) * 2002-08-21 2009-03-31 Cypress Semiconductor Corporation Differential crystal oscillator
US7321272B2 (en) * 2003-04-11 2008-01-22 Nxp B.V. Device for detecting the temperature of an oscillator crystal
US20060267702A1 (en) * 2003-04-11 2006-11-30 Koninklijke Philips Electronics N.V. Device for detecting the temperature of an oscillator crystal
US7737796B2 (en) * 2004-05-19 2010-06-15 Nihon Dempa Kogyo Co., Ltd. Constant temperature type crystal oscillator
US7345552B2 (en) * 2004-05-19 2008-03-18 Nihon Dempa Kogyo Co., Ltd. Constant temperature type crystal oscillator
US20080122547A1 (en) * 2004-05-19 2008-05-29 Nihon Dempa Kogyo Co., Ltd. Constant temperature type crystal oscillator
US20050258913A1 (en) * 2004-05-19 2005-11-24 Manabu Ito Constant temperature type crystal oscillator
US20060051883A1 (en) * 2004-07-13 2006-03-09 Mescher Mark J Apparatus and system for suspending a chip-scale device and related methods
US7215213B2 (en) 2004-07-13 2007-05-08 Charles Stark Draper Laboratory, Inc., The Apparatus and system for suspending a chip-scale device and related methods
US20070268078A1 (en) * 2006-05-18 2007-11-22 Taitien Electronics Co., Ltd. Crystal oscillator device capable of maintaining constant temperature condition
US20090312887A1 (en) * 2006-08-22 2009-12-17 Barry Charles F Apparatus and method for thermal stabilization of pcb-mounted electronic components within an enclosed housing
US7603205B2 (en) 2006-08-22 2009-10-13 Brilliant Telecommmunications, Inc. Apparatus and method for thermal stabilization of PCB-mounted electronic components within an enclosed housing
US7698023B2 (en) 2006-08-22 2010-04-13 Brilliant Telecommunications, Inc. Apparatus and method for thermal stabilization of PCB-mounted electronic components within an enclosed housing
US20080137309A1 (en) * 2006-08-22 2008-06-12 Brilliant Telecommunications, Inc. Apparatus and method for thermal stabilization of pcb-mounted electronic components within an enclosed housing
US7589599B2 (en) * 2007-10-23 2009-09-15 Vectron International, Inc. Heating system for a double-ovenized oscillator on a single printed circuit board
US20090102567A1 (en) * 2007-10-23 2009-04-23 Delaware Capital Formation, Inc. Heating system for a double-ovenized oscillator on a single printed circuit board
JP2011501620A (ja) * 2007-10-23 2011-01-06 ベクトロン・インターナショナル・インコーポレーテッド 単一のプリント基板上のダブルオーブン発振器のための加熱システム
US20090296361A1 (en) * 2008-05-28 2009-12-03 Huang Chung-Er Integrated circuit module with temperature compensation crystal oscillator
US8059425B2 (en) * 2008-05-28 2011-11-15 Azurewave Technologies, Inc. Integrated circuit module with temperature compensation crystal oscillator
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WO1999003194A9 (fr) 1999-04-15
RU2122278C1 (ru) 1998-11-20
WO1999003194A2 (fr) 1999-01-21
CN1261994A (zh) 2000-08-02
EP0998021A4 (en) 2000-11-02
WO1999003194A3 (fr) 1999-07-08
EP0998021A1 (en) 2000-05-03

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