US5192394A - Fluid treatment apparatus and method - Google Patents

Fluid treatment apparatus and method Download PDF

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Publication number
US5192394A
US5192394A US07/808,134 US80813491A US5192394A US 5192394 A US5192394 A US 5192394A US 80813491 A US80813491 A US 80813491A US 5192394 A US5192394 A US 5192394A
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Prior art keywords
fluid
substrate
treatment apparatus
jets
nozzles
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Expired - Fee Related
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US07/808,134
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English (en)
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Steven L. Bard
Jeffrey D. Jones
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International Business Machines Corp
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International Business Machines Corp
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Priority to US07/808,134 priority Critical patent/US5192394A/en
Assigned to INTERNATIONAL BUSINESS MACHINES CORPORATION A CORP. OF NEW YORK reassignment INTERNATIONAL BUSINESS MACHINES CORPORATION A CORP. OF NEW YORK ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: BARD, STEVEN L., JONES, JEFFREY D.
Priority to JP4328825A priority patent/JP2519381B2/ja
Priority to EP92120389A priority patent/EP0547416A2/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces

Definitions

  • the invention relates to fluid treatment apparatus and methods for treating substrates or the like.
  • the invention is particularly adapted for etching metallic substrates such as might be utilized as circuit members in information handling systems (computers).
  • fluid treatment as used herein is meant to describe a capability of the invention to provide any of the aforementioned functions (coating, cleaning and chemically reacting) as well as others such as plating, etc. which are discernible from the teachings herein.
  • fluid as used herein is meant to include both liquids (e.g., etchants) and gases (e.g., air).
  • the present invention is particularly adapted for etching relatively thin metallic substrates, which substrates may be eventually used as elements of a circuitized substrate member or the like for use in an information handling system (computer) environment. It is understood, however, that the invention is not limited to this particular application, as it can be readily used in several other applications, such as coating, plating, etc. as mentioned above.
  • the invention is designed for applying fluid to at least one surface of a substrate using a plurality of fluid nozzles located adjacent this surface for directing a first fluid through a quantity of collected said fluid onto designated, spaced locations of the substrate.
  • the fluid jets from these fluid nozzles impinge on the designated areas and pass across the substrate's surface with sufficient velocity so as to substantially prevent mixing of these jets with the adjacent collected fluid prior to engagement with the oncoming fluid from the nearest, adjacent fluid jet.
  • uniform treatment e.g., etching
  • Such uniformity is considered essential in many substrates such as defined above.
  • the invention also defines a means whereby this same substrate may be treated on an opposite, second surface thereof, again using a plurality of directed fluid jets to impinge on this second surface and maintain substantial velocities to prevent mixing of the fluid jets on the substrate's other surface, this time, however, with the ambient (e.g., air) located about these second jets.
  • these second fluid jets may or may not be passed through a collected liquid such as an etchant or the like, but instead may simply be oriented adjacent this second surface and thus surrounded by the aforementioned ambient.
  • the invention as understood from the following description, is operational in a relatively simple manner and, additionally, is relatively inexpensive to produce and utilize while still assuring precisioned treatment of the selected articles.
  • a fluid treatment apparatus which comprises means for moving a substrate in a predetermined direction of travel, dam means located substantially adjacent a first surface of this moving substrate for the purpose of collecting and maintaining a first fluid at a predetermined level above the substrate's first surface, a plurality of fluid nozzles positioned adjacent the first surface and below the level of the collected first fluid to direct a plurality of fluid jets of this first fluid through the collected first fluid and onto the substrate's first surface at designated, spaced-apart locations.
  • This apparatus further includes means for providing the first fluid at a pressure sufficient to maintain the fluid jets at the required velocity across the substrate's first surface.
  • a method of fluid treating a substrate comprising the steps of moving the substrate in a predetermined direction of travel, collecting a first fluid substantially adjacent the moving substrate's first surface and maintaining this collected first fluid at a predetermined level above the first surface, and directing a plurality of fluid jets of this first fluid through the collected first fluid onto the moving substrate's first surface at designated, spaced-apart locations thereon in a such a manner that each of these directed fluid jets maintains a sufficient velocity across the first surface to prevent mixing thereof with the collected first fluid prior to engagement with oncoming fluid from the nearest adjacent fluid jet.
  • the method further comprises the step of providing the described first fluid at a pressure sufficient to maintain the fluid jet velocities needed.
  • FIG. 1 is a plan view of a fluid treatment apparatus in accordance with one embodiment of the invention, said FIG. 1 taken along the line 1--1 in FIG. 2;
  • FIG. 2 is a side-elevational view, partly in section and on a much enlarged scale over the view of FIG. 1, as taken along the line 2--2 in FIG. 1, but representing only a portion of the overall apparatus illustrated in FIG. 1;
  • FIG. 3 is a partial, perspective view of two fluid nozzle structures and associated manifold for use in the invention, in accordance with one embodiment thereof, FIG. 3 being of a much enlarged scale over the view of FIG. 2;
  • FIG. 4 is a partial, plan view, in section, of the fluid nozzles of the invention for directing the first fluid onto a first surface of the substrate being treated, this view better illustrating the fluid jets provided by these fluid nozzles;
  • FIG. 5 is a partial, plan view, in section, illustrating a fluid nozzle and resulting fluid jet therefrom wherein mixing between the fluid jet and surrounding collected first fluid is allowed to occur.
  • FIGS. 1 and 2 there is shown a fluid treatment apparatus 10 in accordance with the preferred embodiment of the invention.
  • Apparatus 10 is designed for treating a substrate 11 (FIG. 2) as this substrate moves therethrough.
  • substrate 11 comprised a thin composite member, including as part thereof, a thin layer of copper.
  • the composite had an overall thickness of about 0.060 inch and the copper had a thickness of about 0.0024 inch. Two layers of copper, one on each side, were used. In other examples, substrates as thin as about 0.005 inch were successfully treated. Substrate 11 is not shown in FIG. 1, for illustration purposes.
  • Apparatus 10 includes means 13 for moving substrate 11 through apparatus 10, a preferred embodiment of means 13 including a plurality of rollers 15 spacedly located on a corresponding plurality of elongated shafts 17 which, as shown in FIG. 1, are substantially parallel to one another.
  • each shaft 17 included a total of six such rollers 15, spaced apart at a distance of about 3.75 inches from an adjacent roller.
  • Drive means 19, illustratively represented by an electric motor 21 mechanically coupled to individual pulleys 23 at the end of each shaft 17, may be used to provide shaft rotation as desired.
  • the use of an electric motor and such pulleys, including a common belt 25, is understandably provided for illustrative purposes and not meant to limit the invention in that several other means may be successfully utilized.
  • each of the rollers 15 located within the upper portion of apparatus 10 physically engages an upper, first surface 27 of substrate 11 to effect movement of the substrate in a predetermined direction of travel (illustrated by the arrow "T" in FIG. 1). This direction is also illustrated in FIG. 3. In FIG. 2, it is understood that this direction of travel is perpendicular to the figure and away from the viewer.
  • apparatus 10 further includes a second plurality of rollers 15' spacedly located on individual shafts 17' located below substrate 11 and thus in such an arrangement that each of the rollers 15' is designed for physically engaging a lower, opposing second surface 27' of substrate 11.
  • rollers 15 and 15' engage the respective surfaces 27 and 27' directly opposite each other, as also seen in FIG. 2.
  • Each roller 15 and 15' is preferably comprised of hard rubber or similar material and located on shafts 17 and 17' of titanium. These materials are not meant to limit the invention, however, as other materials may be readily substituted therefor.
  • Apparatus 10 further includes dam means 31 located adjacent the first surface 27 of substrate 11 and designed for collecting a first fluid 33 and maintaining this first fluid at a predetermined level above surface 27.
  • first fluid 33 comprised an etchant, which etchant was preferably a aqueous solution of cupric chloride.
  • this preferred first fluid comprised of about 370 grams per liter (g/l) cupric chloride, about 106 g/l hydrochloric acid, and about 23 g/l cuprous chloride. This solution was preferably applied at a temperature of from about 110 to about 130 degrees Fahrenheit.
  • Dam means 31 as shown when comparing FIGS. 1 and 2, comprises a pair of upstanding sidewalls 35 (only one shown in FIG. 2) which, as shown in FIG. 2, are preferably vertically oriented along an outer edge of substrate 11.
  • each wall 35 is spaced a slight distance (e.g., 0.030 inch) above the upper surface 27 of substrate 11 to permit a predetermined amount of first fluid 33 escape.
  • Such escaping fluid also provides a "fluid bearing" between the substrate and lower surface of wall 35. This spacing is represented by the numeral 37 in FIG. 2.
  • first fluid 33 is also caused to overflow the sidewalls 35, such overflow considered important for the purposes of the invention (described further below).
  • apparatus 10 was capable of treating two separate substrates in a simultaneous manner.
  • One of these is preferably located internally (toward the center of apparatus 10) of the other such that the other is peripherally located thereabout.
  • a small gap e.g., about 0.030 inch
  • Such a gap is illustrated in phantom, in FIG. 2 (dimension "G").
  • Dam means 31 further includes a second pair of upstanding walls 39 which abut respective end portions of walls 35 in the manner shown in FIG. 1 to thereby define a total of four sidewalls for purposes of maintaining and collecting first fluid 33 above substrate 11. Understandably, the substantially solid substrate 11 thus serves as a bottom wall for this containment structure.
  • the first fluid 33 was maintained at a level of about one inch above the planar, first surface 27 of substrate 11.
  • each of the sidewalls 39 also preferably serve as manifolds for receiving recirculated first fluid 33 and dispensing said fluid to the fluid nozzles (defined below) of the invention.
  • Each sidewall 39 is thus preferably substantially hollow for this purpose and will be further described in greater detail below with the description of FIG. 3.
  • Apparatus 10 further includes a plurality of fluid nozzles 41 positioned substantially adjacent the upper, first surface 27 of substrate 11 and each designed for providing a plurality of fluid jets 43 (FIGS. 2 and 4) onto spaced-apart locations of the upper surface 27 of substrate 11.
  • Each fluid nozzle 41 preferably comprises an elongated pipe which extends between the opposing, parallel manifolds 39 and is operatively coupled thereto at respective end portions thereof. This is best shown in the partial view of FIG. 3 for the similar elongated pipes which constitute the lower fluid nozzles 41' as may also be provided along the substrate's lower surface 27' if fluid treatment thereof is desired. Both nozzles 41 and 41' (FIG.
  • each nozzle 41 and 41' possesses an overall length of about twelve inches and is comprised of a suitable plastic (e.g., polyvinylchloride).
  • Each aperture 51 in pipes 41 and 41' is preferably of substantially cylindrical configuration (see especially FIG. 3) and, in one embodiment, possesses a diameter of only about 0.035 inch and is spacedly positioned from about 0.05 inch to about 0.70 inch from the nearest, adjacent aperture. It is understood that the apertures 51 represented in FIG. 1 are located on the undersurface of pipes 41 and thus are not facing the viewer in FIG. 1. This is also understood from the structures illustrated in FIGS. 2 and 4.
  • each of the pipes 41 is arranged in a respective grouping 55 (one shown in FIG. 1 by the numeral 55) such that a resulting plurality (e.g., seven) of such groupings results.
  • Each grouping preferably comprises a total of four or five pipes, as also shown in FIG. 1.
  • pipes 41 (and 41') are arranged parallel to each other within the respective upper or lower portions of apparatus 10. Accordingly, each grouping of such pipes is also substantially parallel to the nearest, adjacent such grouping.
  • each grouping, including the several pipes therein is oriented at an acute angle of from about ten degrees to about thirty degrees respective to the longitudinal direction of travel "T" of substrate 11. Greater angles are also acceptable.
  • This acute angle is represented by the designation A in FIG. 3.
  • This strategic positioning of pipes 41 and 41' and the respective apertures 51 therein assures, significantly, that the entire adjacent surface (27, 27') of substrate 11 being treated by the invention will receive directed fluid jets from the defined fluid nozzles and thus assure that uniform fluid application to these surfaces will occur.
  • fluid jets (43, 43') are provided against both the upper and lower surfaces of substrate 11 and, preferably, on directly opposite sides thereof during substrate movement through apparatus 10.
  • each of the several elongated pipes 41 and 41' is operatively coupled to a pair of respective manifolds (39 for the upper part of apparatus 10 and 39' for the lower part thereof) in order to receive the desired fluids at appropriate pressures such that these fluids will pass through the provided apertures 51 within these pipes for direct impingement on the respective adjacent surface of substrate 11.
  • each of the pipes was positioned at a distance of only about 0.060 inch from the respective adjacent surface receiving the fluid jet therefrom. This distance is represented by the letter "D" in FIG. 4.
  • Reference “D” may range from about 0.065 inch to about 0.260 inch, when treating substrates of the type defined herein and using etchant solutions of the type also described.
  • the axis of each cylindrical aperture is represented by the letter “C” in FIG. 4 and is substantially perpendicular to the planar, adjacent surface of substrate 11.
  • each of the defined rollers 15 is strategically positioned within a respective spacing provided between the adjacent groupings 55 of pipes 41 (this is similarly true for the rollers 15' relative to pipes 41' located in the lower portion of apparatus 10).
  • each grouping was spaced apart at a distance of about 0.625 inch so as to accommodate each roller 15.
  • this spacing and roller provision still enables effective, uniform fluid treatment for the respective surfaces of substrate 11.
  • FIG. 2 there is shown a reservoir 61 located below the respective paired manifolds 39 and 39' for collecting the fluids impinged on substrate 11.
  • the first fluid (33) impinged on surface 27 will be the same as the second fluid impinged on the lower surface 27'.
  • Both of these impinging fluids are thus collected by reservoir 61 for eventual recirculation (e.g., using a suitable pump 63 or the like) back to the respective manifolds (e.g., using suitable piping 65).
  • Each manifold, as shown in FIG. 1, is preferably serviced by two such pipes 65, such that a total of eight such pipes are used for the four manifolds of the invention.
  • the invention is not meant to be limited to the application of only one fluid to both, opposing surfaces of a substrate. That is, it is possible in the embodiment of FIG. 2 to provide separate collection means for the respective fluids impinged on opposite surfaces 27 and 27' and accordingly to provide separate recirculation means for each such fluid to the respective pair of manifolds serving the respective, dispensing fluid nozzles.
  • the invention is thus not limited to a singular reservoir 61 or recirculation means 63 as illustrated in FIG. 2.
  • the described pump 63 used to recirculate and thus supply fluid to the respective parts of apparatus 10, thus assures that satisfactory pressure will be provided at the receiving manifolds and associated pipes in order to accomplish the objectives of the invention.
  • the pressure of the fluid at each of the four manifolds 39 and 39' preferably ranged from about four pounds per square inch (psi) to about twenty psi, when using the fluids and other dimensions (e.g., for apertures 51) defined herein.
  • the defined thin metallic substrate 11 was preferably moved in a substantially horizontal direction of travel through apparatus 10 at a rate of from about twenty inches per minute to about 140 inches per minute, resulting in a uniform etch rate of the copper substrate of about 0.0005 inches per minute to about 0.002 inches per minute.
  • FIG. 3 there is shown a partial view, in perspective, of one of the two lower manifolds 39' for use with the present invention. It is understood that the manifold and coupled pipes which form this part of the invention are substantially similar in shape and arrangement to the corresponding manifolds 39 and elongated pipes which provide fluid to the upper surface 27 of substrate 11, excluding a pair of sidewalls such as used for the purpose of collecting fluid as is done in the upper part of apparatus 10. As seen in FIG.
  • fluid is not collected along the lower surface 27' of substrate 11 but instead the directed fluid jets 43' impinge on surface 27' and the impinged fluid thereafter caused to fall (by gravity) into reservoir 61 (or a suitable separate collection means if the fluid impinged on the substrate's lower surface is to be different from that of first fluid 33). Absent such walls for this lower manifold and pipe assembly will, understandably, require positioning of the elongated shafts 17' within some suitable supporting means, such support being provided for shafts 17 by the upper walls 35. Any suitable support means can be readily provided for shafts 17', including an upstanding bracket or the like from the sidewall of reservoir 61. Further definition is thus not believed necessary.
  • each of the pipes 41' is shown as including an end portion which extends within the respective manifold 39'. Accordingly, fluid from pump 63 is directed via piping 67 into the internal chamber 71 defined within the manifold and then into the contained end portions of each pipe 41' through an opening (73) provided therein. Importantly, this arrangement assures that fluid is provided to all of the contained pipes 41' within the lower part of apparatus 10 such that the fluid dispensed from each aperture 51 is directed onto the respective adjacent surface 27' at substantially the same pressure as jets applied in all other apertures from pipes 41'. Similarly, fluid applied to the upper surface 27' is also maintained at substantially identical pressures through each aperture 51 from the upper located elongated pipes 41. As stated above, this pressure is preferably within the range of from about four psi to about twenty psi.
  • two adjacent pipes 41 are shown for providing respective fluid jets 43 onto surface 27.
  • these pipes are spaced apart (center-to-center) from about 0.20 to about 1.00 inch.
  • the lower pipes 41' of the invention are similarly positioned relative to the respective lower surface 27' of substrate 11 but are not shown herein for illustration purposes.
  • the invention provides the means whereby the fluid jets 43 from pipes 41 (as well as the fluid jets 43 from lower pipes 41') are directed onto the respective, adjacent surface of substrate 11 at such a pressure and velocity so as to maintain a sufficient fluid velocity across the respective surface of the substrate so as to substantially prevent mixing between this directed fluid and the fluid surrounding these fluid jets prior to engagement with fluid from the nearest, adjacent such fluid nozzle.
  • FIG. 5 An example of such mixing, prior to engagement with adjacent fluid jets, is illustrated in FIG. 5 wherein a directed fluid jet from an adjacent pipe is seen to mix with the surrounding fluid at a location (represented by the dimension "MZ" in FIG. 5) from the aperture's central axis "C". Understandably, the mixing illustrated in FIG. 5 is considered an undesirable occurrence which, significantly, is overcome by the teachings of the present invention.
  • each fluid jet 43 traveled across the adjacent, respective surface of substrate 11 at a rate of from about twenty-three inches per second to about 500 inches per second, such location of horizontal travel understandably occurring in a horizontal manner within a zone between the approximate location of direct, vertical fluid impingement (at axis "C") and the point or zone of collision "CZ".
  • apparatus 10 is particularly suited to serve as an etcher for etching metallic or similar substrates using appropriate etchants (e.g., cupric chloride).
  • Apparatus 10 can also be readily utilized to perform other functions and is thus not limited to use as an etcher.
  • apparatus 10 may be used to provide rinsing (e.g., using water) of etched or coated substrates to remove undesirable materials therefrom.
  • several such apparatus 10 may be located adjacent one another to form a larger, overall assembly wherein said apparatus provide sequential fluid treatment on a substrate moving through the assembly using the unique teachings herein.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
US07/808,134 1991-12-16 1991-12-16 Fluid treatment apparatus and method Expired - Fee Related US5192394A (en)

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US07/808,134 US5192394A (en) 1991-12-16 1991-12-16 Fluid treatment apparatus and method
JP4328825A JP2519381B2 (ja) 1991-12-16 1992-11-13 流体処理装置
EP92120389A EP0547416A2 (en) 1991-12-16 1992-11-28 Fluid treatment apparatus and method

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Cited By (9)

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WO1996038028A1 (de) * 1995-05-25 1996-11-28 Höllmüller Maschinenbau GmbH Verfahren zur behandlung von gegenständen, insbesondere von elektronischen leiterplatten, sowie vorrichtung zur durchführung dieses verfahrens
US5725668A (en) * 1995-09-06 1998-03-10 International Business Machines Corporation Expandable fluid treatment device for tublar surface treatments
US5824157A (en) * 1995-09-06 1998-10-20 International Business Machines Corporation Fluid jet impregnation
US5863332A (en) * 1995-09-06 1999-01-26 International Business Machines Corporation Fluid jet impregnating and coating device with thickness control capability
US6168663B1 (en) 1995-06-07 2001-01-02 Eamon P. McDonald Thin sheet handling system cross-reference to related applications
EP1067830A1 (en) * 1999-02-22 2001-01-10 Tokyo Kakoki Co., Ltd. A chemical solution treatment equipment
US20050198618A1 (en) * 2004-03-03 2005-09-08 Groupe Azur Inc. Distributed software fabrication system and process for fabricating business applications
KR100517138B1 (ko) * 1999-02-22 2005-09-28 도쿄 가코키 코포레이션 리미티드 화학용액 처리장치
US20120076933A1 (en) * 2010-09-24 2012-03-29 Ikuo Uematsu Double-sided coating apparatus and double-sided coating method

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JP4724156B2 (ja) * 2007-06-20 2011-07-13 三井金属鉱業株式会社 電子部品実装用フィルムキャリアテープの搬送装置および電子部品実装用フィルムキャリアテープの搬送方法

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996038028A1 (de) * 1995-05-25 1996-11-28 Höllmüller Maschinenbau GmbH Verfahren zur behandlung von gegenständen, insbesondere von elektronischen leiterplatten, sowie vorrichtung zur durchführung dieses verfahrens
US6168663B1 (en) 1995-06-07 2001-01-02 Eamon P. McDonald Thin sheet handling system cross-reference to related applications
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Also Published As

Publication number Publication date
JPH05237428A (ja) 1993-09-17
EP0547416A2 (en) 1993-06-23
JP2519381B2 (ja) 1996-07-31
EP0547416A3 (cs) 1994-02-09

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