US4735925A - Low-temperature sinterable ceramic composition - Google Patents
Low-temperature sinterable ceramic composition Download PDFInfo
- Publication number
- US4735925A US4735925A US06/874,184 US87418486A US4735925A US 4735925 A US4735925 A US 4735925A US 87418486 A US87418486 A US 87418486A US 4735925 A US4735925 A US 4735925A
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- US
- United States
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000000203 mixture Substances 0.000 title claims abstract description 40
- 239000000919 ceramic Substances 0.000 title claims abstract description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 19
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910018404 Al2 O3 Inorganic materials 0.000 claims abstract description 10
- 229910052845 zircon Inorganic materials 0.000 claims abstract description 10
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052681 coesite Inorganic materials 0.000 claims abstract description 9
- 229910052906 cristobalite Inorganic materials 0.000 claims abstract description 9
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 9
- 229910052682 stishovite Inorganic materials 0.000 claims abstract description 9
- 229910052905 tridymite Inorganic materials 0.000 claims abstract description 9
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims abstract description 8
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052863 mullite Inorganic materials 0.000 claims abstract description 8
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 claims abstract description 7
- KLZUFWVZNOTSEM-UHFFFAOYSA-K Aluminium flouride Chemical compound F[Al](F)F KLZUFWVZNOTSEM-UHFFFAOYSA-K 0.000 claims abstract description 6
- 229910011763 Li2 O Inorganic materials 0.000 claims abstract description 6
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 claims abstract description 5
- 229910001634 calcium fluoride Inorganic materials 0.000 claims abstract description 5
- 229910001637 strontium fluoride Inorganic materials 0.000 claims abstract description 5
- FVRNDBHWWSPNOM-UHFFFAOYSA-L strontium fluoride Chemical compound [F-].[F-].[Sr+2] FVRNDBHWWSPNOM-UHFFFAOYSA-L 0.000 claims abstract description 5
- 229910021570 Manganese(II) fluoride Inorganic materials 0.000 claims abstract description 3
- CTNMMTCXUUFYAP-UHFFFAOYSA-L difluoromanganese Chemical compound F[Mn]F CTNMMTCXUUFYAP-UHFFFAOYSA-L 0.000 claims abstract description 3
- 229910001635 magnesium fluoride Inorganic materials 0.000 claims abstract description 3
- 238000005245 sintering Methods 0.000 claims description 11
- 229910052596 spinel Inorganic materials 0.000 claims description 10
- 239000011029 spinel Substances 0.000 claims description 10
- 229910001632 barium fluoride Inorganic materials 0.000 abstract description 2
- 239000000395 magnesium oxide Substances 0.000 description 7
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 7
- 239000003153 chemical reaction reagent Substances 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- -1 acryl Chemical group 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 101100400378 Mus musculus Marveld2 gene Proteins 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical group O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000012777 electrically insulating material Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000609 methyl cellulose Polymers 0.000 description 2
- 239000001923 methylcellulose Substances 0.000 description 2
- 235000010981 methylcellulose Nutrition 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- 229920000084 Gum arabic Polymers 0.000 description 1
- 229920003115 HPC-SL Polymers 0.000 description 1
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 description 1
- 229910017309 Mo—Mn Inorganic materials 0.000 description 1
- 229910004742 Na2 O Inorganic materials 0.000 description 1
- 229910004291 O3.2SiO2 Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 241000978776 Senegalia senegal Species 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000000205 acacia gum Substances 0.000 description 1
- 235000010489 acacia gum Nutrition 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000001863 hydroxypropyl cellulose Substances 0.000 description 1
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- PAZHGORSDKKUPI-UHFFFAOYSA-N lithium metasilicate Chemical compound [Li+].[Li+].[O-][Si]([O-])=O PAZHGORSDKKUPI-UHFFFAOYSA-N 0.000 description 1
- 229910052912 lithium silicate Inorganic materials 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/44—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/16—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silicates other than clay
- C04B35/18—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silicates other than clay rich in aluminium oxide
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/48—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
- C04B35/481—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates containing silicon, e.g. zircon
Definitions
- This invention relates to a ceramic composition which can be used as an electrically insulating material in IC packages, IC boards, multilayer wiring boards, etc., and particularly to a ceramic composition that can be sintered at low temperatures.
- Alumina having an excellent insulating property, heat resistance and mechanical strength has been widely used as an electrically insulating material.
- the sintering temperature of alumina is 1300° to 1600° C. This high firing temperature leads to a high cost of production.
- boards, etc. have been made of high-melting metals, such as W and Mo-Mn as a conductive material.
- high-melting metals such as W and Mo-Mn
- conductive metals have high electrical resistance, and therefore, the speed of transmitting signals is slow.
- Crystallized glass has a relatively high mechanical strength as a material onto which a low-electric resistance metal is baked, but is of high cost.
- a sintered ceramic body is inexpensive, but has the disadvantage of low strength.
- the ceramic compositions described in the above-cited Japanese Patent applications are improved to some extent, but it is desired to develop a more improved ceramic composition.
- the present invention relates to a low-temperature sinterable ceramic composition comprising 1 to 20% by weight of Al 2 O 3 , 15 to 50% by weight of SiO 2 , 0 to 5% by weight of MgO, 3 to 18% by weight of CaO, 0 to 5% by weight of TiO 2 , 1 to 8% by weight of B 2 O 3 , 0 to 2% by weight of Li 2 O, 20 to 80% by weight of at least one of zircon, mullite and spinel, and 1 to 12% by weight of a fluoride selected from CaF 2 , MgF 2 , LiF, AlF 3 , MnF 2 , BaF 2 and SrF 2 .
- the coefficient of thermal expansion of the composition tends to become high. If the amount of Al 2 O 3 exceeds 20% by weight, the sintering temperature of the composition tends to become high. If the amount of SiO 2 is less than 15% by weight, the resulting composition tends to have a high sintering temperature and a high dielectric constant. If it exceeds 50% by weight, the coefficient of thermal expansion of the composition tends to increase. If the amount of MgO is larger than 5% by weight, the composition tends to have a high sintering temperature and a high coefficient of thermal expansion.
- the sintering temperature of the composition tends to become high, and if the amount of CaO is larger than 18% by weight, the dielectric constant of the composition tends to be high. If the amount of TiO 2 is larger than 5% by weight, the resulting composition tends to have a high dielectric constant. If the amount of B 2 O 3 is less than 1% by weight, the composition tends to have a high sintering temperature, and if it exceeds 8% by weight, the composition tends to have a low impact strength. If the amount of Li 2 O is larger than 2% by weight, the impact strength of the composition tends to become low.
- the resulting composition tends to have low impact strength and a high coefficient of thermal expansion. If the amount of any of these components exceeds 80% by weight the sintering temperature of the composition tends to become too high. In particular, if zircon is used as a ingredient, the dielectric constant of the composition also tends to become high. If the amount of the fluoride is less than 1% by weight, the flexural strength of the composition tends to become low, and if it is larger than 12% by weight, the coefficient of thermal expansion of the composition tends to become too high.
- the zircon, mullite and spinel are natural occuring products which are of more than 99% by weight in purity and have compositions of ZrO 2 .SiO 2 , 3Al 2 O 3 .2SiO 2 and MgO.Al 2 O 3 respectively. These may contain less than 0.1% by weight of total amount of Na 2 O and K 2 O as impurities.
- the most preferable composition according to the present invention comprises 2 to 4% by weight of Al 2 O 3 , 20 to 40% by weight of SiO 2 , 0.5 to 1% by weight of MgO, 5 to 10% by weight of CaO, 1 to 2% by weight of TiO 2 , 3 to 6% by weight of B 2 O 3 , 0.5 to 1% by weight of Li 2 O, 40 to 60% by weight of zircon and 4 to 8% by weight of CaF 2 or SrF 2 .
- the ceramic composition according to the present invention may be molded in a usual manner, such as press molding, sheet molding, etc, and sintered.
- a press molding an aqueous mixture of raw material of the composition and binder is mixed and ground, for example, in a ball-mill, dried by spray dry, freeze dry etc., sieved and pressed to obtain a molded product.
- polyvinylalcohol PVA
- carboxymethyl cellulose CMC
- methyl cellulose MC
- acryl emulsion and gum arabic may be used in an amount of 1 to 5% by weight based on a dry raw material as 100.
- a raw material is dispersed in a dispersant, such as toluene, ketone, etc. together with a binder, such as acrylic resin, butyral resin, etc., and a plasticizer, such as polyethylene glycohol, phthalate ester, etc., kneaded and ground, reduced form, tape casted, dried, and degreased to obtain molded product.
- a dispersant such as toluene, ketone, etc.
- a binder such as acrylic resin, butyral resin, etc.
- a plasticizer such as polyethylene glycohol, phthalate ester, etc.
- the above component were put in a 3-liter alumina ceramic ball mill together with 2 kg of alumina ceramic spheres having a diameter of 15 mm, and mixed at 84 rpm for 50 hours.
- the resulting slurry was lyophilized by a lyophilizer for 15 hours.
- the dried powder was passed through a 32-mesh sieve and then compressed in a mold into a desired shape under a pressure of 1500 kg/cm 2 .
- the molded product was examined for its sintering temperature, fluxural strength, dielectric constant, and coefficient of thermal expansion. The results are shown below.
- the ceramic composition has a sintering temperature of not more than 1000° C., the cost of firing can be curtailed, and low-resistance conductors such as Ag, Ag-Pd, Au and Cu can be baked on it. As a result, the speed of transmitting signals can be increased. Furthermore, the ceramic composition of this invention has a flexural strength of as high as about 2,000 to 2,500 kg/cm 2 and a sufficiently low dielectric constant and dielectric power factor. In addition, its coefficient of thermal expansion is not high.
- the low-temperature sinterable ceramic composition has a sintering temperature of not higher than 1,000° C., a flexural strength of at least 2,100 kg/cm 2 , a dielectric constant of not more than 8 at 1 MHz and a coefficient of thermal expansion of not more than 8 ⁇ 2 -6 /°C., more preferably a stintering temperature of 850° to 950° C., a flexural strength of at least 2,500 kg/cm 2 , a dielectric constant of not more than 6 at 1 MHz and coefficient of thermal expansion of not more than 4 to 6 ⁇ 10 -6 /°C.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Composite Materials (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60-127966 | 1985-06-14 | ||
| JP60127966A JPS61286263A (ja) | 1985-06-14 | 1985-06-14 | 低温焼結磁器組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US4735925A true US4735925A (en) | 1988-04-05 |
Family
ID=14973083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US06/874,184 Expired - Lifetime US4735925A (en) | 1985-06-14 | 1986-06-13 | Low-temperature sinterable ceramic composition |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4735925A (enrdf_load_stackoverflow) |
| JP (1) | JPS61286263A (enrdf_load_stackoverflow) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0471590A1 (en) * | 1990-08-16 | 1992-02-19 | Engelhard Corporation | Thermal shock and creep resistant porous mullite articles prepared from topaz and process for manufacture |
| US5135896A (en) * | 1989-10-31 | 1992-08-04 | North American Refractories Company | Spinel bondable ceramic composition |
| FR2724165A1 (fr) * | 1994-09-07 | 1996-03-08 | Serole Bernard | Procede d'activation du frittage de ceramiques par controle stoechiometrique |
| WO1998019977A1 (en) * | 1996-11-04 | 1998-05-14 | Rutgers, The State University | Ceramic mortar resistant to corrosive agents |
| US5807798A (en) * | 1996-12-20 | 1998-09-15 | E. I. Du Pont De Nemours And Company | Refractory compositions for use in fluid bed chlorinators |
| EP1048751A1 (de) * | 1999-04-29 | 2000-11-02 | Hort, Stefan | Verfahren zum Aufbringen einer harten Beschichtung auf einen Gegenstand und beschichteter Gegenstand |
| WO2002079114A1 (fr) * | 2001-03-28 | 2002-10-10 | Murata Manufacturing Co.,Ltd. | Composition destinee a des ceramiques d'isolation et ceramiques d'isolation contenant ces compositions |
| EP0923085A4 (en) * | 1997-06-16 | 2005-12-28 | Matsushita Electric Ind Co Ltd | CONDUCTOR PLATE FOR RESISTORS AND METHOD FOR THE PRODUCTION THEREOF |
| US20100210446A1 (en) * | 2008-01-11 | 2010-08-19 | Tsinghua University | Low temperature co-fired ceramic powder and special raw material and use thereof |
| US20110014423A1 (en) * | 2009-07-14 | 2011-01-20 | Yu-Hsin Yeh | Ceramic powder compositions and optoelectronic device substrates utilizing the same |
| CN110357597A (zh) * | 2019-08-01 | 2019-10-22 | 电子科技大学 | 一种钙硼硅系高热膨胀陶瓷基板材料及其制备方法 |
| WO2021158756A1 (en) * | 2020-02-05 | 2021-08-12 | Ferro Corporation | M7 ltcc-silver system and related dielectric compositions for high frequency applications |
| CN114874005A (zh) * | 2022-06-10 | 2022-08-09 | 安徽理工大学 | 温度稳定型钛酸镁基微波介质复合陶瓷及其制备方法 |
| CN115124329A (zh) * | 2022-06-27 | 2022-09-30 | 清华大学深圳国际研究生院 | 一种ltcc基板及其制备方法 |
| WO2024050660A1 (zh) * | 2022-09-05 | 2024-03-14 | 中国科学院深圳先进技术研究院 | 一种用于低温共烧陶瓷的玻璃/陶瓷复合材料及其制备方法和应用 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5133207B2 (ja) * | 2008-11-08 | 2013-01-30 | 住友化学株式会社 | チタン酸アルミニウム系セラミックスの製造方法 |
| JP6697910B2 (ja) * | 2016-03-17 | 2020-05-27 | 第一稀元素化学工業株式会社 | ジルコニウム質組成物及びその製造方法 |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB545239A (en) * | 1941-06-17 | 1942-05-15 | Titanium Alloy Mfg Co | Improvements relating to zircon refractories and refractory compositions and methods of making the same |
| US4102690A (en) * | 1975-04-16 | 1978-07-25 | Janusz Koper | Powder for continuous casting |
| US4104075A (en) * | 1976-01-26 | 1978-08-01 | Shinagawa Refractories Co., Ltd. | Refractories, batch for making the same and method for making the same |
| GB2031399A (en) * | 1978-08-14 | 1980-04-23 | Ngk Insulators Ltd | Polycrystalline transparent spinel sintered body |
| JPS55136171A (en) * | 1979-04-06 | 1980-10-23 | Ngk Spark Plug Co | Manufacture of fluorine mica ceramic sintered body |
| US4295892A (en) * | 1976-04-08 | 1981-10-20 | Ngk Insulators, Ltd. | Cordierite ceramic honeycomb and a method for producing the same |
| SU876610A1 (ru) * | 1979-10-12 | 1981-10-30 | Белгородский технологический институт строительных материалов | Шихта дл изготовлени теплоизол ционного огнеупорного материала |
| US4316936A (en) * | 1978-09-06 | 1982-02-23 | Thorn Electrical Industries Limited | Sealing of ceramic and cermet parts, sealing material therefor and ceramic seal obtained |
| JPS6136168A (ja) * | 1984-07-27 | 1986-02-20 | 株式会社日立製作所 | 多層回路板とその製造方法 |
| US4584151A (en) * | 1982-12-27 | 1986-04-22 | Nkg Insulators, Ltd. | Method of producing a polycrystalline transparent spinel sintered body |
| JPS61186261A (ja) * | 1985-02-14 | 1986-08-19 | 日本特殊陶業株式会社 | セラミツクス焼結体 |
| JPS61186260A (ja) * | 1985-02-14 | 1986-08-19 | 日本特殊陶業株式会社 | セラミツクス焼結体 |
-
1985
- 1985-06-14 JP JP60127966A patent/JPS61286263A/ja active Granted
-
1986
- 1986-06-13 US US06/874,184 patent/US4735925A/en not_active Expired - Lifetime
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB545239A (en) * | 1941-06-17 | 1942-05-15 | Titanium Alloy Mfg Co | Improvements relating to zircon refractories and refractory compositions and methods of making the same |
| US4102690A (en) * | 1975-04-16 | 1978-07-25 | Janusz Koper | Powder for continuous casting |
| US4104075A (en) * | 1976-01-26 | 1978-08-01 | Shinagawa Refractories Co., Ltd. | Refractories, batch for making the same and method for making the same |
| US4295892A (en) * | 1976-04-08 | 1981-10-20 | Ngk Insulators, Ltd. | Cordierite ceramic honeycomb and a method for producing the same |
| GB2031399A (en) * | 1978-08-14 | 1980-04-23 | Ngk Insulators Ltd | Polycrystalline transparent spinel sintered body |
| US4273587A (en) * | 1978-08-14 | 1981-06-16 | Ngk Insulators, Ltd. | Polycrystalline transparent spinel sintered body and a method for producing the same |
| US4316936A (en) * | 1978-09-06 | 1982-02-23 | Thorn Electrical Industries Limited | Sealing of ceramic and cermet parts, sealing material therefor and ceramic seal obtained |
| JPS55136171A (en) * | 1979-04-06 | 1980-10-23 | Ngk Spark Plug Co | Manufacture of fluorine mica ceramic sintered body |
| SU876610A1 (ru) * | 1979-10-12 | 1981-10-30 | Белгородский технологический институт строительных материалов | Шихта дл изготовлени теплоизол ционного огнеупорного материала |
| US4584151A (en) * | 1982-12-27 | 1986-04-22 | Nkg Insulators, Ltd. | Method of producing a polycrystalline transparent spinel sintered body |
| JPS6136168A (ja) * | 1984-07-27 | 1986-02-20 | 株式会社日立製作所 | 多層回路板とその製造方法 |
| JPS61186261A (ja) * | 1985-02-14 | 1986-08-19 | 日本特殊陶業株式会社 | セラミツクス焼結体 |
| JPS61186260A (ja) * | 1985-02-14 | 1986-08-19 | 日本特殊陶業株式会社 | セラミツクス焼結体 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5252272A (en) * | 1989-07-28 | 1993-10-12 | Engelhard Corporation | Thermal shock and creep resistant porous mullite articles prepared from topaz and process for manufacture |
| US5135896A (en) * | 1989-10-31 | 1992-08-04 | North American Refractories Company | Spinel bondable ceramic composition |
| AU649969B2 (en) * | 1989-10-31 | 1994-06-09 | North American Refractories Co. | Spinel bondable ceramic composition |
| EP0471590A1 (en) * | 1990-08-16 | 1992-02-19 | Engelhard Corporation | Thermal shock and creep resistant porous mullite articles prepared from topaz and process for manufacture |
| FR2724165A1 (fr) * | 1994-09-07 | 1996-03-08 | Serole Bernard | Procede d'activation du frittage de ceramiques par controle stoechiometrique |
| US5700408A (en) * | 1994-09-07 | 1997-12-23 | W.C. Heraeus Gmbh | Method of producing a ceramic component by sintering |
| WO1998019977A1 (en) * | 1996-11-04 | 1998-05-14 | Rutgers, The State University | Ceramic mortar resistant to corrosive agents |
| US5932505A (en) * | 1996-11-04 | 1999-08-03 | Rutgers, The State University | Hydrofluoric acid resistant ceramic mortar |
| US5807798A (en) * | 1996-12-20 | 1998-09-15 | E. I. Du Pont De Nemours And Company | Refractory compositions for use in fluid bed chlorinators |
| EP0923085A4 (en) * | 1997-06-16 | 2005-12-28 | Matsushita Electric Ind Co Ltd | CONDUCTOR PLATE FOR RESISTORS AND METHOD FOR THE PRODUCTION THEREOF |
| EP1048751A1 (de) * | 1999-04-29 | 2000-11-02 | Hort, Stefan | Verfahren zum Aufbringen einer harten Beschichtung auf einen Gegenstand und beschichteter Gegenstand |
| WO2002079114A1 (fr) * | 2001-03-28 | 2002-10-10 | Murata Manufacturing Co.,Ltd. | Composition destinee a des ceramiques d'isolation et ceramiques d'isolation contenant ces compositions |
| US20100210446A1 (en) * | 2008-01-11 | 2010-08-19 | Tsinghua University | Low temperature co-fired ceramic powder and special raw material and use thereof |
| US8298971B2 (en) * | 2008-01-11 | 2012-10-30 | Tsinghua University | Low temperature co-fired ceramic powder and special raw material and use thereof |
| US20110014423A1 (en) * | 2009-07-14 | 2011-01-20 | Yu-Hsin Yeh | Ceramic powder compositions and optoelectronic device substrates utilizing the same |
| CN110357597A (zh) * | 2019-08-01 | 2019-10-22 | 电子科技大学 | 一种钙硼硅系高热膨胀陶瓷基板材料及其制备方法 |
| WO2021158756A1 (en) * | 2020-02-05 | 2021-08-12 | Ferro Corporation | M7 ltcc-silver system and related dielectric compositions for high frequency applications |
| US20220119315A1 (en) * | 2020-02-05 | 2022-04-21 | Ferro Corporation | M7 LTCC-Silver System And Related Dielectric Compositions For High Frequency Applications |
| TWI785495B (zh) * | 2020-02-05 | 2022-12-01 | 美商菲洛公司 | 用於高頻應用之m7 ltcc-銀系統及相關介電組成物 |
| CN114874005A (zh) * | 2022-06-10 | 2022-08-09 | 安徽理工大学 | 温度稳定型钛酸镁基微波介质复合陶瓷及其制备方法 |
| CN115124329A (zh) * | 2022-06-27 | 2022-09-30 | 清华大学深圳国际研究生院 | 一种ltcc基板及其制备方法 |
| CN115124329B (zh) * | 2022-06-27 | 2023-08-08 | 清华大学深圳国际研究生院 | 一种ltcc基板及其制备方法 |
| WO2024050660A1 (zh) * | 2022-09-05 | 2024-03-14 | 中国科学院深圳先进技术研究院 | 一种用于低温共烧陶瓷的玻璃/陶瓷复合材料及其制备方法和应用 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0256304B2 (enrdf_load_stackoverflow) | 1990-11-29 |
| JPS61286263A (ja) | 1986-12-16 |
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