US4427478A - Process for making an encapsulated circuit board and products made thereby - Google Patents

Process for making an encapsulated circuit board and products made thereby Download PDF

Info

Publication number
US4427478A
US4427478A US06/392,998 US39299882A US4427478A US 4427478 A US4427478 A US 4427478A US 39299882 A US39299882 A US 39299882A US 4427478 A US4427478 A US 4427478A
Authority
US
United States
Prior art keywords
adhesive
wires
circuit board
directions
mobility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US06/392,998
Other languages
English (en)
Inventor
Barbara D. Grant
Carol R. Jones
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Priority to US06/392,998 priority Critical patent/US4427478A/en
Assigned to INTERNATIONAL BUSINESS MACHINES CORPORATION reassignment INTERNATIONAL BUSINESS MACHINES CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: GRANT, BARBARA D., JONES, CAROL R.
Priority to JP58067177A priority patent/JPS596596A/ja
Priority to DE8383105167T priority patent/DE3362072D1/de
Priority to EP83105167A priority patent/EP0097817B1/en
Application granted granted Critical
Publication of US4427478A publication Critical patent/US4427478A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Definitions

  • This invention relates to a process for making encapsulated circuit boards and products made by said process.
  • a substrate preferably made of an epoxy-glass laminate, has a photochemically curable adhesive deposited on at least one side thereof.
  • This adhesive is also preferably one which is thermally curable.
  • Materials that exhibit these desirable characteristics of being both photochemically and thermally curable include photosensitive dielectric resin materials, such as of the type disclosed and claimed in U.S. Pat. No. 4,169,732 to J. F. Shipley and assigned to the assignee of the present invention. These resins can be applied either by spray coating from a solvent-based solution or by direct application from a film. The resultant films are of good quality and, even when applied as a film, display excellent adhesion to epoxy-glass substrates.
  • the adhesive is cured to only a depth preselected by controlling the intensity and duration of exposure.
  • the wires have limited mobility in the Z direction but none in the X and Y directions.
  • Single layer circuit boards fabricated in the above-described manner may be laminated together to form a multi-layered circuit board.
  • Photochemical curing enables this lamination to be successfully accomplished with only a single layer of adhesive because the extent of curing can be adjusted according to either the thickness of the adhesive or degree of photochemical exposure dosage.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Adhesives Or Adhesive Processes (AREA)
US06/392,998 1982-06-28 1982-06-28 Process for making an encapsulated circuit board and products made thereby Expired - Lifetime US4427478A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US06/392,998 US4427478A (en) 1982-06-28 1982-06-28 Process for making an encapsulated circuit board and products made thereby
JP58067177A JPS596596A (ja) 1982-06-28 1983-04-18 封入された回路板の形成方法
DE8383105167T DE3362072D1 (en) 1982-06-28 1983-05-25 Process for making encapsulated circuit boards and products made thereby
EP83105167A EP0097817B1 (en) 1982-06-28 1983-05-25 Process for making encapsulated circuit boards and products made thereby

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/392,998 US4427478A (en) 1982-06-28 1982-06-28 Process for making an encapsulated circuit board and products made thereby

Publications (1)

Publication Number Publication Date
US4427478A true US4427478A (en) 1984-01-24

Family

ID=23552882

Family Applications (1)

Application Number Title Priority Date Filing Date
US06/392,998 Expired - Lifetime US4427478A (en) 1982-06-28 1982-06-28 Process for making an encapsulated circuit board and products made thereby

Country Status (4)

Country Link
US (1) US4427478A (enrdf_load_stackoverflow)
EP (1) EP0097817B1 (enrdf_load_stackoverflow)
JP (1) JPS596596A (enrdf_load_stackoverflow)
DE (1) DE3362072D1 (enrdf_load_stackoverflow)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3520258A1 (de) * 1984-06-25 1986-01-02 Kollmorgen Technologies Corp., Dallas, Tex. Verfahren zum herstellen drahtgeschriebener schaltungen
DE3624627A1 (de) * 1985-07-19 1987-01-29 Kollmorgen Tech Corp Verfahren zum herstellen von drahtgeschriebenen leiterplatten
EP0186831A3 (en) * 1985-01-02 1987-06-03 International Business Machines Corporation Roughening surface of a substrate
WO1988000135A1 (en) * 1986-07-07 1988-01-14 Loctite Corporation Potted electrical/mechanical devices, and dual cure potting method
WO1989000374A1 (en) * 1987-06-30 1989-01-12 Svensson Lars Goeran A method for producing a circuit board and a circuit-board preform for use in carrying out the method
US4916805A (en) * 1988-03-02 1990-04-17 Espe Stiftung & Co. Produktions- Und Vertriebs Kg Method for the attachment of components to a circuit board using photoactuatable adhesive
US4952342A (en) * 1987-07-02 1990-08-28 Loctite Corproration Dual cure method for making a rotted electrical/mechanical device
US5057348A (en) * 1985-11-26 1991-10-15 Loctite Corporation Potted electrical/mechanical devices, and dual cure potting method
US5340946A (en) * 1985-12-20 1994-08-23 Advanced Interconnection Technology, Inc. Heat activatable adhesive for wire scribed circuits
EP2475233A1 (en) * 2011-01-05 2012-07-11 The Boeing Company System for depositing microwire

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3646572A (en) 1970-02-09 1972-02-29 Photocircuits Corp Electric wiring assemblies
US3658620A (en) 1968-06-17 1972-04-25 Scm Corp Irradiation lamination process for air-inhibited polymers
US3674914A (en) 1968-02-09 1972-07-04 Photocircuits Corp Wire scribed circuit boards and method of manufacture
US3674602A (en) 1969-10-09 1972-07-04 Photocircuits Corp Apparatus for making wire scribed circuit boards
US4018333A (en) 1975-05-22 1977-04-19 Stepan Chemical Company Metal fastener sticks and process of preparing same by curing polymeric binder for said under conditions of U.V. irradiation
US4115185A (en) 1977-08-05 1978-09-19 Diceon Electronics, Inc. Method of thermally dimensionally stabilizing a printed circuit board
US4180608A (en) 1977-01-07 1979-12-25 Del Joseph A Process for making multi-layer printed circuit boards, and the article resulting therefrom
US4305854A (en) 1978-07-31 1981-12-15 Polychrome Corporation Radiation curable pressure sensitive adhesive
US4358331A (en) 1979-03-05 1982-11-09 Licentia Patent-Verwaltungs-G.M.B.H. Method of embedding semiconductor components in plastics

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3674914A (en) 1968-02-09 1972-07-04 Photocircuits Corp Wire scribed circuit boards and method of manufacture
US3658620A (en) 1968-06-17 1972-04-25 Scm Corp Irradiation lamination process for air-inhibited polymers
US3674602A (en) 1969-10-09 1972-07-04 Photocircuits Corp Apparatus for making wire scribed circuit boards
US3646572A (en) 1970-02-09 1972-02-29 Photocircuits Corp Electric wiring assemblies
US4018333A (en) 1975-05-22 1977-04-19 Stepan Chemical Company Metal fastener sticks and process of preparing same by curing polymeric binder for said under conditions of U.V. irradiation
US4180608A (en) 1977-01-07 1979-12-25 Del Joseph A Process for making multi-layer printed circuit boards, and the article resulting therefrom
US4115185A (en) 1977-08-05 1978-09-19 Diceon Electronics, Inc. Method of thermally dimensionally stabilizing a printed circuit board
US4305854A (en) 1978-07-31 1981-12-15 Polychrome Corporation Radiation curable pressure sensitive adhesive
US4358331A (en) 1979-03-05 1982-11-09 Licentia Patent-Verwaltungs-G.M.B.H. Method of embedding semiconductor components in plastics

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3520258A1 (de) * 1984-06-25 1986-01-02 Kollmorgen Technologies Corp., Dallas, Tex. Verfahren zum herstellen drahtgeschriebener schaltungen
EP0186831A3 (en) * 1985-01-02 1987-06-03 International Business Machines Corporation Roughening surface of a substrate
DE3624627A1 (de) * 1985-07-19 1987-01-29 Kollmorgen Tech Corp Verfahren zum herstellen von drahtgeschriebenen leiterplatten
US5057348A (en) * 1985-11-26 1991-10-15 Loctite Corporation Potted electrical/mechanical devices, and dual cure potting method
US5340946A (en) * 1985-12-20 1994-08-23 Advanced Interconnection Technology, Inc. Heat activatable adhesive for wire scribed circuits
WO1988000135A1 (en) * 1986-07-07 1988-01-14 Loctite Corporation Potted electrical/mechanical devices, and dual cure potting method
WO1989000374A1 (en) * 1987-06-30 1989-01-12 Svensson Lars Goeran A method for producing a circuit board and a circuit-board preform for use in carrying out the method
US4952342A (en) * 1987-07-02 1990-08-28 Loctite Corproration Dual cure method for making a rotted electrical/mechanical device
US4916805A (en) * 1988-03-02 1990-04-17 Espe Stiftung & Co. Produktions- Und Vertriebs Kg Method for the attachment of components to a circuit board using photoactuatable adhesive
EP2475233A1 (en) * 2011-01-05 2012-07-11 The Boeing Company System for depositing microwire
US8635767B2 (en) 2011-01-05 2014-01-28 Thoe Boeing Company System for depositing microwire

Also Published As

Publication number Publication date
EP0097817A2 (en) 1984-01-11
EP0097817A3 (en) 1984-03-28
DE3362072D1 (en) 1986-03-20
JPS6325520B2 (enrdf_load_stackoverflow) 1988-05-25
EP0097817B1 (en) 1986-02-05
JPS596596A (ja) 1984-01-13

Similar Documents

Publication Publication Date Title
US4506004A (en) Printed wiring board
US4360570A (en) Use of photosensitive stratum to create through-hole connections in circuit boards
US4427478A (en) Process for making an encapsulated circuit board and products made thereby
US3778900A (en) Method for forming interconnections between circuit layers of a multi-layer package
US20040000427A1 (en) Process for creating vias for circuit assemblies
US3660088A (en) Photo-resist process
US4966827A (en) Polymer printing
DE69605056T2 (de) Lötstopmaske zur herstellung gedruckter schaltungen
JPS61143740A (ja) 導電回路の製造方法
GB2111313A (en) Multi-layer circuit board fabrication
JPS6381422A (ja) エポキシ樹脂をベースとする熱安定性構造化層の製造方法
US3752669A (en) Method of producing positive images from epoxy compositions and compositions therefor
US5856068A (en) Method for fabricating a printed circuit board by curing under superatmospheric pressure
JPS5758797B2 (enrdf_load_stackoverflow)
US4894317A (en) Method of forming a printed circuit and the printed circuit formed therefrom
JPS63243120A (ja) 放射線により網状化可能のポリマー系
USRE32430E (en) Printed wiring board
US6720127B2 (en) Printed circuit substrate with controlled placement covercoat layer
JPH0423391A (ja) 多層配線回路板の製造方法
JPS5816232A (ja) フォトレジスト組成物
JPS5817696A (ja) 多層印刷配線板の製造法
US4732829A (en) Polymer printing
EP0711105A3 (en) Method of forming solder mask
WO1990012482A2 (en) Printed circuit boards
JPS5824034B2 (ja) プリント配線板の製造法

Legal Events

Date Code Title Description
AS Assignment

Owner name: INTERNATIONAL BUSINESS MACHINES CORPORATION, ARMON

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNORS:GRANT, BARBARA D.;JONES, CAROL R.;REEL/FRAME:004017/0310

Effective date: 19820603

STCF Information on status: patent grant

Free format text: PATENTED CASE

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, PL 96-517 (ORIGINAL EVENT CODE: M170); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 4

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, PL 96-517 (ORIGINAL EVENT CODE: M171); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 8

FEPP Fee payment procedure

Free format text: SURCHARGE FOR LATE PAYMENT, LARGE ENTITY (ORIGINAL EVENT CODE: M186); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 12TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M185); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 12