US4203203A - Electrical connector and method of manufacture - Google Patents

Electrical connector and method of manufacture Download PDF

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Publication number
US4203203A
US4203203A US05/944,212 US94421278A US4203203A US 4203203 A US4203203 A US 4203203A US 94421278 A US94421278 A US 94421278A US 4203203 A US4203203 A US 4203203A
Authority
US
United States
Prior art keywords
lamina
nest
connector
elastomeric material
conductive paths
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US05/944,212
Other languages
English (en)
Inventor
Hermanus P. J. Gilissen
Petrus R. M. van Dijk
Ludovicus C. van der Sanden
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Application granted granted Critical
Publication of US4203203A publication Critical patent/US4203203A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/055—Folded back on itself
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49218—Contact or terminal manufacturing by assembling plural parts with deforming

Definitions

  • This invention relates to electrical connectors of the kind comprising an elastomeric body having spaced contacts at surfaces of the body, the contacts being interconnected in pairs or groups by conductive paths, and to their method of manufacture.
  • connectors of the kind specified are required for use in confined spaces, a typical example being in an electronic watch, and as a result they are of small size with closely spaced contacts. Difficulty is experienced in manufacturing such connectors due to the small cross section of the elastomer body required and the fragile nature of the conductive paths, resulting in uneconomic production rates if functional quality of the product is to be ensured.
  • a method of forming a connector of the kind specified comprises forming conductive paths on a lamina of elastomeric material, folding the lamina in generally U-fashion with the conductive paths externally of the fold to present opposed portions of the lamina extending from the fold with the conductive paths extending from the fold along distal surfaces of the opposed lamina portions and around the fold, and bonding the proximal surfaces of the opposed portions together.
  • the invention includes a connector of the kind specified and which comprises an elongate body of elastomeric insulating material of generally uniform cross section and presenting a pair of generally flat, parallel, opposite surfaces joined at one side by a convexly curved surface, a plurality of spaced conductive paths being on the body, each path comprising a contact portion on each of the opposite surfaces of the body and a portion extending between the contact portions around the convexly curved body surface portion.
  • the conductive paths are formed on a lamina of elastomeric insulating material when the lamina is in flat condition by printed circuit techniques, and the lamina is then folded to form the desired product.
  • the conductive paths project above the surface of the elastomer body according to the thickness of the paths.
  • the connector is suitably sandwiched between a pair of printed circuit boards or substrates which engage the opposed surface portions, contacts on the boards or substrate engaging the one or more contact portions of the conductive paths of the connector.
  • the elastomeric body is compressed elastically by bulk deformation, and relatively high contact forces are generated. This is of advantage in obtaining good electrical contact with low contact resistance between the connector for contacts and the board or substrate contacts.
  • the elastomeric material will tend to relax and extrude or creep into spaces defined initially between the generally flat surfaces of the elastomeric body and the adjacent circuit board or substrate surfaces by virtue of the thickness of the conductive paths and the thickness of contacts or conductive paths on the boards or substrates. As a result the spaces progressively become filled with elastomer, and although the contact force may relax, an environmental seal is obtained around the contact interfaces to protect and maintain the initial good electrical contact.
  • the contact portions of the connector intended to engage complementary contacts of a board or substrate are elongated and thus may present more substantial contact areas to the circuit boards or substrates than would normally be possible with engaging curved surfaces.
  • the conductive tracks are formed flush with the surface of the elastomer body.
  • the elastomeric insulating material is of a thermoplastic nature such that it will soften and flow at a temperature above that at which the eventual connector is intended to operate and below that temperature at which degradation of the elastomeric and insulating properties take place.
  • a suitable material is a thermo-plastic polyurethane rubber.
  • the conductive paths are formed on a lamina of the elastomeric thermo-plastic material when it is in flat condition by printed circuit techniques and the lamina then folded to the desired configuration in a die nest.
  • the elastomeric material is pressed into the nest and is heated while under pressure to a temperature at which the elastomeric material flows. As a result the elastomeric material fills the spaces between adjacent conductive paths and follows the configuration of the die nest.
  • the elastomeric material is then cooled to a set condition before it is removed from the nest.
  • the lamina of elastomeric material is thin to facilitate bending without imposing excessive tension or other stress on the conductive tracks, and the lamina is formed about a body of similar material to which it is bonded in homogeneous manner.
  • the lamina is placed in a nest of generally U-shape with the conductive paths facing the nest and a block of similar material is urged into the nest against the lamina to urge the lamina into the nest.
  • the lamina and the block of elastomeric material are then heated whilst maintaining the pressure until flow of elastomer takes place.
  • the body and lamina fuse together and the elastomer fills all voids within the nest.
  • the elastomer is then cooled to a set condition before removal of the formed connector from the nest.
  • FIG. 1 is an enlarged perspective view of an elastomeric insulating lamina formed on its upper face with a plurality of spaced, parallel, rectilinear conductive paths;
  • FIG. 2 comprises perspective views of successive stages of manufacture from the lamina of FIG. 1;
  • FIG. 3 comprises transverse cross sections of the connector in the successive stages of manufacture of FIG. 2;
  • FIG. 4 is a partly sectional, fragmentary view of a connector in use
  • FIG. 5 is a fragmentary sectional view on line A--A of FIG. 4 and illustrating voids
  • FIG. 6 is a fragmentary view similar to FIG. 5 after elastomeric material has filled the voids;
  • FIG. 7 is a fragmentary perspective view of an intermediate stage in the manufacture of a connector of an improved form
  • FIG. 8 is a fragmentary perspective view of a connector after completion of the manufacturing step of FIG. 7, and
  • FIG. 9 is a fragmentary longitudinal section taken on line 9-9 of the connector of FIG. 8.
  • a strip-like lamina 1 of elastomeric insulating material is as shown in FIG. 1, formed with a plurality of spaced parallel conductive paths 2 extending normally transversely of and on one surface of the strip.
  • the conductive paths suitably terminate short of side edges of the strip and, by virtue of their thickness, project above the surface of the strip, and may, for example be of copper, phosphor bronze, beryllium copper, silver, palladium, and may be plated.
  • the strip is then folded, as shown in FIG. 2A about a longitudinal median, in generally U-fashion with the conductive paths externally to present opposed lamina portions 3.
  • the lamina portions 3 at their adjacent surfaces are suitably bonded together, as shown in FIG. 2B and this may be effected, as shown in FIG. 3A, by applying pressure to the opposed lamina portions 3 to urge them together.
  • the bonding may be achieved.
  • an adhesive bond may be employed.
  • the conductive paths 2 on distal surfaces of the opposed lamina portions 3 present elongated flat contact portions 4.
  • the connector In use, as shown in FIG. 4, the connector is sandwiched between printed circuit boards 5 or substrate circuit members, which are formed with circuit paths 6.
  • the circuit paths 6 engage the contact portions 4 of conductive paths 2 to interconnect circuit paths 6 on the upper and lower boards 5, and contact pressure is established by biasing the boards 5 together to compress the elastomer 4 between them.
  • voids 7 remain between the surface of the elastomer lamina portions 3 and the adjacent circuit path faces of the printed circuit board members 5, and voids 8 remain between the surface of the elastomer lamina portions 3 and the surfaces of the boards 5 at regions between circuit paths 6.
  • the elastomeric material creeps between conductive paths 2 to fill the voids 7, and into the voids 8, substantially to seal the contact areas between circuit paths 6 and conductive paths 2.
  • the connector is formed with conductive paths which are flush with the surface of the elastomer body.
  • a lamina flexible printed circuit 10 of strip form is laid lengthwise in the trough of a U-section die nest 11.
  • the strip 10 comprises a lamina of thermo-plastic elastomeric insulating material formed on its face adjacent the nest surface with transverse conductive paths spaced longitudinally of the strip.
  • a strip-like block 12 of the same elastomeric material is laid lengthwise in the nest over the strip 10 and is urged into the nest by a ram 13.
  • the ram 13 is of les width than the nest and is slidable in a guide 14 which overlaps sides of the nest.
  • the elastomeric material within the nest is suitably heated to a temperature at which if flows under pressure between the rams 13 and the nest 11 as indicated by arrows to fill voids within the nest and is then cooled to a set condition.
  • the moulded connector may then be removed from the nest 11 and is of the form shown in FIG. 8. As shown in FIG. 9 the conductive paths 15 are embedded in the elastomeric body 16 with outer surfaces of the paths 15 and the body 16 being flush.
  • a lamina of 5 mm width and 0.1 mm thickness was used, the conductive tracks extending across the width of 5 mm, and each having a width of 0.1 mm with a spacing of 0.2 mm between tracks.
  • the resultant connector, according to FIG. 8 had a cross-sectional width and height of 2 mm, and was of length 20 mm.
  • the elastomer used was a thermo-plastic polyurethane rubber. The following materials have been found suitable:
  • the materials have been formed in the nest at temperatures between 150 and 200 degrees C. and the resulting connectors have been found suited to operational use within the range -40 to +80 degrees C.
  • partially cured elastomeric materials such as silicon rubbers may be used.
  • a preformed core portion 12 configured to match the nest is employed since the material is not mouldable in the manner of a thermo-plastic material, and further, once the lamina and core have been cured they will form a unitary elastomer body in a final form which is permanent.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Non-Insulated Conductors (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Manufacture Of Switches (AREA)
US05/944,212 1977-09-24 1978-09-20 Electrical connector and method of manufacture Expired - Lifetime US4203203A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB39854/77 1977-09-24
GB3985477 1977-09-24

Publications (1)

Publication Number Publication Date
US4203203A true US4203203A (en) 1980-05-20

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ID=10411856

Family Applications (1)

Application Number Title Priority Date Filing Date
US05/944,212 Expired - Lifetime US4203203A (en) 1977-09-24 1978-09-20 Electrical connector and method of manufacture

Country Status (16)

Country Link
US (1) US4203203A (it)
EP (1) EP0001477B1 (it)
JP (1) JPS593028B2 (it)
AR (1) AR214251A1 (it)
AT (1) AT367571B (it)
AU (1) AU516166B2 (it)
BR (1) BR7806192A (it)
CA (1) CA1090438A (it)
DE (1) DE2862215D1 (it)
DK (1) DK153261C (it)
ES (2) ES473344A1 (it)
FI (1) FI66705C (it)
HK (1) HK2187A (it)
IT (1) IT1098912B (it)
MX (1) MX145180A (it)
NO (1) NO148869C (it)

Cited By (26)

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Publication number Priority date Publication date Assignee Title
US4627676A (en) * 1981-02-27 1986-12-09 Sharp Kabushiki Kaisha Electronic assembly including integrated circuit package and liquid crystal display panel
US4834660A (en) * 1987-06-03 1989-05-30 Harris Corporation Flexible zero insertion force interconnector between circuit boards
US4897054A (en) * 1986-12-19 1990-01-30 Amp Incorporated Modular circuit board bussing connector
US4923404A (en) * 1989-10-20 1990-05-08 Amp Incorporated Sealed chip carrier
US4998885A (en) * 1989-10-27 1991-03-12 International Business Machines Corporation Elastomeric area array interposer
US5230632A (en) * 1991-12-19 1993-07-27 International Business Machines Corporation Dual element electrical contact and connector assembly utilizing same
US5427552A (en) * 1993-11-22 1995-06-27 Chrysler Corporation Electrical terminal and method of fabricating same
US5433632A (en) * 1993-01-29 1995-07-18 Minnesota Mining And Manufacturing Company Flexible circuit connector
US5479320A (en) * 1991-12-31 1995-12-26 Compaq Computer Corporation Board-to-board connector including an insulative spacer having a conducting surface and U-shaped contacts
US5510958A (en) * 1994-01-11 1996-04-23 Yokogawa Electric Corporation Electronic circuit module having improved cooling arrangement
US5635846A (en) * 1992-10-19 1997-06-03 International Business Machines Corporation Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer
US5825631A (en) * 1997-04-16 1998-10-20 Starkey Laboratories Method for connecting two substrates in a thick film hybrid circuit
EP0877250A2 (en) * 1997-04-28 1998-11-11 Bayer Corporation Dispensing instrument for fluid monitoring sensors
EP1022811A1 (en) * 1999-01-21 2000-07-26 Shin-Etsu Polymer Co., Ltd. Press-contact electrical interconnectors and method for producing the same
US6296493B1 (en) * 1999-09-16 2001-10-02 Shin-Etsu Polymer Co., Ltd. Method for electrically connecting two sets of electrode terminals in array on electronic board units
US20040147140A1 (en) * 2003-01-24 2004-07-29 Zhineng Fan Low inductance electrical contacts and lga connector system
US20050014394A1 (en) * 2003-05-28 2005-01-20 Infineon Technologies Contact-connection device for electronic circuit units and production method
US20050062492A1 (en) * 2001-08-03 2005-03-24 Beaman Brian Samuel High density integrated circuit apparatus, test probe and methods of use thereof
US20050070140A1 (en) * 2003-08-11 2005-03-31 Hirschmann Electronics Gmbh & Co. Kg Elastic contact element
US20050224762A1 (en) * 2002-03-20 2005-10-13 J.S.T. Mfg. Co., Ltd. Flexible good conductive layer and anisotropic conductive sheet comprising same
US7059867B1 (en) * 2005-03-30 2006-06-13 Artesyn Technologies, Inc. High density multi-lead surface mount interconnect and devices including same
US20060244111A1 (en) * 2005-04-28 2006-11-02 Japan Aviation Electronics Industry, Limited Electrical connecting member capable of achieving stable connection with a simple structure and connector using the same
US20080132097A1 (en) * 2006-11-30 2008-06-05 International Business Machines Corporation Interconnected apparatus utilizing metal on elastomer ring chain style
US20110239454A1 (en) * 2005-12-22 2011-10-06 Wei Shi Substrate With Raised Edge Pads
DE102008053429B4 (de) * 2007-11-19 2016-01-14 Japan Aviation Electronics Industry, Ltd. Kontaktelement und Vebinder
US10974780B2 (en) 2014-09-22 2021-04-13 Arcelormittal Methods for producing a three-dimensional vehicle door frame inner reinforcement element, for producing a vehicle door frame and for producing a vehicle reinforcement structure

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US4550959A (en) * 1983-04-13 1985-11-05 Amp Incorporated Surface mountable coefficient of expansion matching connector
EP0125780A1 (en) * 1983-04-13 1984-11-21 AMP INCORPORATED (a New Jersey corporation) Surface mountable expansion matching connector
JPS59206247A (ja) * 1983-05-10 1984-11-22 Sumitomo Electric Ind Ltd 制動圧力制御方法
GB8403388D0 (en) * 1984-02-09 1984-03-14 Lucas Ind Plc Brake adjuster
FR2572856B1 (fr) * 1984-11-06 1988-01-08 Socapex Element de connexion miniature a faible pas et procede de fabrication d'un tel element de connexion
US4741101A (en) * 1986-09-29 1988-05-03 Tektronix, Inc. Contact device
US4815990A (en) * 1987-04-10 1989-03-28 Rogers Corporation Flexible circuit having termination features and method of making the same
GB2209627A (en) * 1987-07-15 1989-05-17 Aweco Kunstofftechnik Gmbh & C Coil for electromagnetic actuator
JPH0534349Y2 (it) * 1988-07-01 1993-08-31
JP2843813B2 (ja) * 1994-01-28 1999-01-06 信越ポリマー株式会社 圧接型コネクタの製造方法
JP2015170515A (ja) * 2014-03-07 2015-09-28 矢崎総業株式会社 電子機器用コネクタ

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Cited By (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4627676A (en) * 1981-02-27 1986-12-09 Sharp Kabushiki Kaisha Electronic assembly including integrated circuit package and liquid crystal display panel
US4897054A (en) * 1986-12-19 1990-01-30 Amp Incorporated Modular circuit board bussing connector
US4834660A (en) * 1987-06-03 1989-05-30 Harris Corporation Flexible zero insertion force interconnector between circuit boards
US4923404A (en) * 1989-10-20 1990-05-08 Amp Incorporated Sealed chip carrier
US4998885A (en) * 1989-10-27 1991-03-12 International Business Machines Corporation Elastomeric area array interposer
US5230632A (en) * 1991-12-19 1993-07-27 International Business Machines Corporation Dual element electrical contact and connector assembly utilizing same
US5479320A (en) * 1991-12-31 1995-12-26 Compaq Computer Corporation Board-to-board connector including an insulative spacer having a conducting surface and U-shaped contacts
US5685073A (en) * 1991-12-31 1997-11-11 Compaq Computer Corporation Method of manufacturing board-to-board connector
US20080106282A1 (en) * 1992-10-19 2008-05-08 International Business Machines Corporation High density integrated circuit apparatus, test probe and methods of use thereof
US20080048690A1 (en) * 1992-10-19 2008-02-28 International Business Machines Corporation High density integrated circuit apparatus, test probe and methods of use thereof
US20080117612A1 (en) * 1992-10-19 2008-05-22 International Business Machines Corporation High density integrated circuit apparatus, test probe and methods of use thereof
US5635846A (en) * 1992-10-19 1997-06-03 International Business Machines Corporation Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer
US20080116912A1 (en) * 1992-10-19 2008-05-22 International Business Machines Corporation High density integrated circuit apparatus, test probe and methods of use thereof
US20080106281A1 (en) * 1992-10-19 2008-05-08 International Business Machines Corporation High density integrated circuit apparatus, test probe and methods of use thereof
US20100052715A1 (en) * 1992-10-19 2010-03-04 International Business Machines Corporation High density integrated circuit apparatus, test probe and methods of use thereof
US20100045320A1 (en) * 1992-10-19 2010-02-25 International Business Machines Corporation High density integrated circuit apparatus, test probe and methods of use thereof
US20100045324A1 (en) * 1992-10-19 2010-02-25 International Business Machines Corporation High density integrated circuit apparatus, test probe and methods of use thereof
US20100045266A1 (en) * 1992-10-19 2010-02-25 International Business Machines Corporation High density integrated circuit apparatus, test probe and methods of use thereof
US20080106285A1 (en) * 1992-10-19 2008-05-08 International Business Machines Corporation High density integrated circuit apparatus, test probe and methods of use thereof
US6334247B1 (en) 1992-10-19 2002-01-01 International Business Machines Corporation High density integrated circuit apparatus, test probe and methods of use thereof
US20020014004A1 (en) * 1992-10-19 2002-02-07 Beaman Brian Samuel High density integrated circuit apparatus, test probe and methods of use thereof
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ES473344A1 (es) 1979-05-01
EP0001477A1 (en) 1979-04-18
DK421378A (da) 1979-03-25
AU3937678A (en) 1980-03-06
JPS593028B2 (ja) 1984-01-21
IT7828016A0 (it) 1978-09-22
ATA686378A (de) 1981-11-15
NO148869B (no) 1983-09-19
MX145180A (es) 1982-01-12
NO782953L (no) 1979-03-27
AR214251A1 (es) 1979-05-15
DK153261B (da) 1988-06-27
FI66705B (fi) 1984-07-31
AT367571B (de) 1982-07-12
FI782715A (fi) 1979-03-25
HK2187A (en) 1987-01-16
IT1098912B (it) 1985-09-18
NO148869C (no) 1983-12-28
CA1090438A (en) 1980-11-25
JPS5519783A (en) 1980-02-12
FI66705C (fi) 1984-11-12
BR7806192A (pt) 1979-05-08
EP0001477B1 (en) 1983-03-30
ES238681U (es) 1978-12-16
AU516166B2 (en) 1981-05-21
DE2862215D1 (en) 1983-05-05
DK153261C (da) 1988-12-05
ES238681Y (es) 1979-05-16

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