US3853091A - Thin film coating apparatus - Google Patents

Thin film coating apparatus Download PDF

Info

Publication number
US3853091A
US3853091A US00421020A US42102073A US3853091A US 3853091 A US3853091 A US 3853091A US 00421020 A US00421020 A US 00421020A US 42102073 A US42102073 A US 42102073A US 3853091 A US3853091 A US 3853091A
Authority
US
United States
Prior art keywords
holders
platform
wafer
cup
lip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US00421020A
Other languages
English (en)
Inventor
R Christensen
R Wahl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Priority to US00421020A priority Critical patent/US3853091A/en
Priority to DE19742448023 priority patent/DE2448023B2/de
Priority to FR7434706A priority patent/FR2253270B1/fr
Priority to IT28314/74A priority patent/IT1022786B/it
Priority to GB4863074A priority patent/GB1474927A/en
Priority to CA213,557A priority patent/CA1035255A/en
Priority to SE7414445A priority patent/SE397435B/xx
Priority to CH1543174A priority patent/CH606479A5/xx
Priority to NL7415450A priority patent/NL7415450A/xx
Priority to JP13564174A priority patent/JPS5325718B2/ja
Priority to ES432508A priority patent/ES432508A1/es
Application granted granted Critical
Publication of US3853091A publication Critical patent/US3853091A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates

Definitions

  • Another object of the present invention is to provide a complex motion apparatus in which the rotation of the wafer or object to be coated occurs about three axes which are substantially parallel to one another and to the axis of at least one crucible.
  • Yet another object of the present invention is to provide thin film coating appratus including, in one embodiment, a plurality of source material holders with means to effectively and rapidly shield the holders from the wafers being coated.
  • Still another object of the present invention is to provide means for uniformly heating the wafers to be coated from the back sides thereof to aid the coating material in adherence to the irregular surface of the wafers.
  • Still another object of the present invention is to provide in an evaporator, means to adjust the distance between the source material and the wafer holder.
  • FIG. 1 is a fragmentary perspective view of apparatus constructed in accordance with the present invention
  • FIG. 2 is an enlarged fragmentary sectional view (foreshortened) of the apparatus illustrated in FIG. 1;
  • FIG. 3 is an enlarged fragmentary plan view taken along line 33 of FIG. 2;
  • FIG. 4 is an enlarged fragmentary plan view of a portion of the apparatus illustrated in FIG. 3;
  • FIG. 5 is a fragmentary sectional view taken along line 55 of FIG. 4.
  • the apparatus 12 is mounted on a base 13, and comprises a rotatable platform 15 (in the preferred embodiment horizontally disposed) including a plurality of ro tatably mounted trays 25 spaced about and mounted on the platform and in the same plane thereof.
  • Each of the trays 25 includes a plurality of rotatably mounted object of wafer holders 35, in the illustrated instance semiconductor wafers, and includes means, hereinafter described, for retaining the wafer with one surface exposed downwardly.
  • Underlying the platform 15 is a material source holder or crucible, in the illustrated instance three such holder cups 45, 46, and 47 which are radially spaced about an axis perpendicular to the platform 15 while being spaced axially therefrom.
  • Drive means 55 see FIG.
  • a plurality of adjustable, telescopically engagable stanchions 16 are spaced about the platform and mounted, as by a retaining block 16A on a .drive ring 18. At their extended or upper end the stanchions are connected to a platform ring 23 which extends about the periphery of the platform 15.
  • the stanchions 16 are made adjustable in a conventional manner as by pins 16B and apertures 16C so that the height of the platform may be adjusted relative to the source holder cups, depending upon the operation to be performed.
  • the drive means 55 is frictionally engaged to the ring and effects rotation thereof about the central axis of the apparatus, i.e., substantially perpendicular to the plane of the platform 15.
  • a shaft 56 is connected to the frustoconical, smooth surfaced drive member 57 which mates with a complementary angled surface 58 on the internal periphery of the drive ring 18.
  • the shaft 56 contains suitable thrust bearings as at 59 to support the structure, there being similar frustoconical smooth surface drive idlers 60 spaced apart from the main drive which serve to support the drive ring 18.
  • the idlers 60 are suitably mounted for rotation on pedestal mounts 61 which are connected to the base
  • the trays 25 are mounted for rotation in or on the platform 15, the platform and trays serving as a shield, in a manner which willbe more fully explained hereinafter, andseparate the source material from the heaters 75 mounted on the backside of the platform 15.
  • the platform comprises a plurality of segments 19;, each segment containing a tray 25 and including radially extending expansion joints 20 with overlapping lip termini 21. which serve to shield the heaters 75 from the source material, while allowing for expansion and contraction of the metal segments 19.
  • the expansion joints 20 are connected to braces 22 to the platform ring 23.
  • An enlarged gear or sprocket 31 is mounted intermediate the bushing 28 and the tray, and connected to the shaft 29 for rotation therewith.
  • A'drive sprocket 32 is connected to a shaft 33 which passes through the platform ring 23, the drive sprocket 32 being connected to the driven sprocket 30, and thus the shaft 29 as by a drive belt 34.
  • the shafts 33 are connected as through universal joints 34' to adjustable length drive shafts 62 (see FIG. 2).
  • a second universal joint 63 connects the drive shaft 62 to a stub shaft 64 which is mounted for rotation as by a bearing 65 in the drive ring 18.
  • the stub shaft 64 is connected, at its lower terminal end, to a gear 66 which mates with an internally toothed ring gear 67 rigidly secured as by posts 68 to the base 13.
  • the idler gear 66 are forced into rotation by the stationary teeth of the ring gear 67, thereby affecting rotation of the drive shafts 62'and causing the trays in the platform to ro tate.
  • the wafer holders 35 In order to provide further rotation of a wafer, means are provided to effect rotation of the wafer holders, the wafer holders 35 being adapted to retain a wafer in a position where a major surface thereof faces the crucibles or source material holders 45, 46 and 47.
  • the wafer holders 35 comprise a cup having an inwardly projecting circumferentially extending lip portion 36 on the lower portion thereof, and wafer retaining means 37 for retaining a wafer or workpiece on the lower side of the cup, against the lip so as to expose the surface 40A of the wafer to the source material.
  • the wafer retaining means 37 includes a plurality of clip-like retainers 37A, 37B, and 37C, each of which includes a tang 38 which is bent inwardly to overlie the lip 36 of the cup and to capture the wafer 40 and press the wafer against the lip 36.
  • the tang 38 of the clip extends through the peripheral lip 36 of the cup into the interior of the cup where it terminates in an enlarged spade-like section 38A.
  • a spring retainer 39, associated with each of the clips serves to bias the enlarged spade-like section 38 against the wall of the cup thereby forcing the tang section against the periphery of the wafer like workpiece 40. In this manner, when it is desired to remove a wafer from the lip, the spade-like section 38A may be biased away from the wall by a simple purging action.
  • a removable disk 41 of heat conductive material is provided intermediate the wafer and the heater.
  • the disk 41 is dimensioned to rest in the cup 35 against the inner surface of the lip 36 in close proximity to the wafer like workpiece 40.
  • a material such as copper obtains a uniform heat relatively quickly and therefore is a-relatively inexpensive and yet excellent medium for heat transmission to insure such uniformity of heating of the semiconductor wafer.
  • the rim of the cup 35 is provided with a plurality of teeth 42 which mesh with the teeth of the sprocket or gear 31 so that upon rotation of the sprocket, the teeth 42 I of the cups in engagement with the sprocket effect rotation of the cups.
  • the cups may be nested in a plurality of shouldered cutouts 42 in the tray 25 and held in position to ensure rotation of the cups as by stub posts 43 projecting upwardly from the tray and engaging the wall of the holders.
  • the shouldered cutouts also serve to prevent the source material from impinging on the heater 75.
  • the source material holders or crucibles 4547 are each mounted on a separate post 48 with a common conductive plate 49, joining in the illustrated instance, carbon electrodes 50 and 51. Insulators 52 through which suitable wiring may pass join the common plate 49 to the carbon electrodes which serves to heat the source material in the cricibles, located inside of the shields 45A, etc. It should be recognized, however, that the source material may be heated in any conventional manner as by low or high frequency induction heating or even E beam heating depending upon the source material. Thus the resistance heating scheme illustrated is not critical to the operation of the apparatus as above described.
  • a focal plane shutter assembly is positioned intermediate the source holders and the wafer holders, the shutter assembly being movable between a first position, wherein the source holders are shielded from the wafer holders, and a second position wherein a line of sight is provided between the waafer holders and the source holders.
  • the shutter assembly comprises a plurality of plates, in the present instance three designated 81, 82 and 83 for purposes of identification, the plates being generally arcuate in form and supported from a center shaft 87 as by radially extending arms which are connected to a hub 86.
  • the center shaft 87 is connected through the brace or support 89 to a drive plate 92, the drive plate having a plurality of pins or projections 93 depending therefrom which are engagable by a pawl 94 operatively connected as through an arm 95 to an actuator shaft 96.
  • the pawl may be energized through the shaft 96 by either air or electric solenoid control causing engagement of the pawl against the pins and therefore rotation of the drive plate 92.
  • the maximum angle of the source material with respect to the rotating wafers is when the platform lies closely adjacent the source holders 45, 46 and 47 thereby assuring maximum exposure of any undercuts in the surface of the wafer of the boiling source material.
  • the operation to be performed is one utilizing, for example, a lift off process, that is where only surface coverage of the depression or of the exposed surface is to be covered so that a peeling operation may take place and the metal or other material deposited from the source holder is in the bottom of the recess or depression in the semiconductor wafer, it is desirable to have the platform 15 spaced farther from the source holder or holders.
  • the stanchions 16 as well as the drive 62 may be positioned so as to space the wafer holders in a remote position with regard to the source material holders. Additionally, if minimum vertical wall (relative to the depressions or recesses in the wafer) coverage is desired, a central source material holder may be employed, and a more conventional type centrally located shutter assembly may be employed.
  • said apparatus comprising: a rotatable platform; a rotatably mounted plurality of trays spaced about and mounted on said platform and in the same plane as said platform; each tray including a plurality of rotatably mounted semiconductor wafer holders; said wafer holders comprising a cup, an inwardly projecting lip extending about the periphery of said cup, and wafer retaining means on said lip for receiving a wafer therein and holding said wafer against said lip; said retaining means comprising a clip including a radially projecting tang, resilient means connected to said tang, and means actuable interiorally of said cup for biasing said tank to maintain said tang in fmn engagement with a wafer held on said lip; a plurality of source material holders radially spaced about an axis perpendicular to said platform and spaced axially therefrom; and means to effect rotation of said platform, said trays and said holders in the
  • an apparatus in accordance with claim 1 including a focal plane shutter assembly intermediate said source holders and said wafer holders, said shutter assembly being movable between a first position wherein said source holders are shielded from said wafer holders and a second position wherein a line of sight is provided between said wafer holders and said source holders.
  • heating means disposed on the side opposite said platform to said source holders, to heat said wafers held by said wafer holders.
  • Apparatus in accordance with claim 1 including a removable disk of heat conductive material, said disk being dimensioned to be retained within said cup, and against said lip.
  • Apparatus for providing multiple rotation of a plurality of thin workpieces in a common plane comprising: a housing; a rotatably mounted platform in said housing, a plurality of trays spaced about and mounted on said platform and for rotation with respect thereto; a plurality of workpiece holders rotatably mounted in each of said trays, said wafer holders comprising a cup, inwardly projecting lip extending about the periphery of said cup, and wafer retaining means on said lip for receiving a wafer therein and holding said wafer against said lip; said retaining means comprising a clip including a radially projecting tang, resilient means connected to said tang, and means actuable interiorally of said cup for biasing said tang to maintain said tang in firm engagement with a wafer held on said lip; a plurality of source material holders spaced from said platform and in a plane substantially parallel to said platform; means to provide a source of heat to said workpiece holders, said means being positioned on the opposite side of said platform
  • Apparatus for providing a deposition of material on a workpiece and for providing multiple rotation of a plurality of workpieces-about three parallel axes comprising: a rotatable platform; a rotatably mounted plurality of trays spaced about and mounted on said platform and in the same plane as said platform; each tray including a plurality of rotatably mounted workpiece holders, said wafer holders comprising a cup, an inwardly projecting lip extending about the periphery of said cup, and wafer retaining means on said lip for receiving a wafer therein and holding said wafer against said lip; said retaining means comprising a clip including a radially projecting tang, resilient means connected to said tang, and means actuable interiorally of said cup for biasing said tang to maintain said tang in firm engagement .with a wafer held on said lip; at least one source material holder spaced from said workpiece holders and having an axis substantially perpendicular to the plane of said platform; and means to effect rotation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
US00421020A 1973-12-03 1973-12-03 Thin film coating apparatus Expired - Lifetime US3853091A (en)

Priority Applications (11)

Application Number Priority Date Filing Date Title
US00421020A US3853091A (en) 1973-12-03 1973-12-03 Thin film coating apparatus
DE19742448023 DE2448023B2 (de) 1973-12-03 1974-10-09 Vorrichtung zum bedampfen von werkstuecken mit duennen filmen
FR7434706A FR2253270B1 (de) 1973-12-03 1974-10-09
IT28314/74A IT1022786B (it) 1973-12-03 1974-10-11 Apparecchiatura per rivestire in modo uniforme superfici irregolari ad esempio wafer semiconduttori
GB4863074A GB1474927A (en) 1973-12-03 1974-11-11 Material deposition apparatus
CA213,557A CA1035255A (en) 1973-12-03 1974-11-13 Thin film coating apparatus
SE7414445A SE397435B (sv) 1973-12-03 1974-11-18 Apparat for vridning av halvledarskivaor kring tre parallela axlar i samband med tunnfilmbeleggning
CH1543174A CH606479A5 (de) 1973-12-03 1974-11-20
NL7415450A NL7415450A (nl) 1973-12-03 1974-11-27 Inrichting voor het opbrengen van dunne lagen.
JP13564174A JPS5325718B2 (de) 1973-12-03 1974-11-27
ES432508A ES432508A1 (es) 1973-12-03 1974-12-02 Perfeccionamientos introducidos en un aparato para depositaruna pelicula delgada de material de recubrimiento sobre piezas de trabajo.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00421020A US3853091A (en) 1973-12-03 1973-12-03 Thin film coating apparatus

Publications (1)

Publication Number Publication Date
US3853091A true US3853091A (en) 1974-12-10

Family

ID=23668864

Family Applications (1)

Application Number Title Priority Date Filing Date
US00421020A Expired - Lifetime US3853091A (en) 1973-12-03 1973-12-03 Thin film coating apparatus

Country Status (11)

Country Link
US (1) US3853091A (de)
JP (1) JPS5325718B2 (de)
CA (1) CA1035255A (de)
CH (1) CH606479A5 (de)
DE (1) DE2448023B2 (de)
ES (1) ES432508A1 (de)
FR (1) FR2253270B1 (de)
GB (1) GB1474927A (de)
IT (1) IT1022786B (de)
NL (1) NL7415450A (de)
SE (1) SE397435B (de)

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3983838A (en) * 1975-12-31 1976-10-05 International Business Machines Corporation Planetary evaporator
US4010710A (en) * 1974-09-20 1977-03-08 Rockwell International Corporation Apparatus for coating substrates
US4022939A (en) * 1975-12-18 1977-05-10 Western Electric Company, Inc. Synchronous shielding in vacuum deposition system
US4036171A (en) * 1974-03-04 1977-07-19 Ebauches S.A. Vacuum deposition through plural masks on plural substrates
US4222345A (en) * 1978-11-30 1980-09-16 Optical Coating Laboratory, Inc. Vacuum coating apparatus with rotary motion assembly
US4241698A (en) * 1979-02-09 1980-12-30 Mca Discovision, Inc. Vacuum evaporation system for the deposition of a thin evaporated layer having a high degree of uniformity
US4284033A (en) * 1979-10-31 1981-08-18 Rca Corporation Means to orbit and rotate target wafers supported on planet member
US4328763A (en) * 1979-05-03 1982-05-11 Leybold-Heraeus Vaporizer for vacuum deposition installations
US4640846A (en) * 1984-09-25 1987-02-03 Yue Kuo Semiconductor spin coating method
US4662310A (en) * 1986-07-09 1987-05-05 Deco Tools, Inc. Robotic paint masking machine
US4773843A (en) * 1987-02-25 1988-09-27 Krupp Corpoplast Maschinenbau Gmbh Apparatus for treating blanks of plastic material
US4775311A (en) * 1987-02-25 1988-10-04 Krupp Corpoplast Maschinenbau Gmbh. Apparatus for producing hollow bodies of thermoplastic material
GB2206608A (en) * 1987-04-14 1989-01-11 Toshiba Kk Vapour deposition apparatus
US5029555A (en) * 1988-03-10 1991-07-09 International Business Machines Corporation Wafer holder method and apparatus in a vacuum deposition system
US5472592A (en) * 1994-07-19 1995-12-05 American Plating Systems Electrolytic plating apparatus and method
GB2291889A (en) * 1994-07-27 1996-02-07 Gec Marconi Avionics Holdings Depositing coatings of materials on a moving substrate having a fixed orientation
US5679165A (en) * 1992-11-30 1997-10-21 Semiconductor Process Laboratory Co., Ltd. Apparatus for manufacturing semiconductor device
US5702532A (en) * 1995-05-31 1997-12-30 Hughes Aircraft Company MOCVD reactor system for indium antimonide epitaxial material
US5776256A (en) * 1996-10-01 1998-07-07 The United States Of America As Represented By The Secretary Of The Air Force Coating chamber planetary gear mirror rotating system
WO2000036178A1 (de) * 1998-12-15 2000-06-22 Unaxis Balzers Aktiengesellschaft Planetensystem-werkstückträger und verfahren zur oberflächenbehandlung von werkstücken
US6142097A (en) * 1998-01-20 2000-11-07 Nikon Corporation Optical membrane forming apparatus and optical device produced by the same
US6203619B1 (en) 1998-10-26 2001-03-20 Symetrix Corporation Multiple station apparatus for liquid source fabrication of thin films
WO2002041355A2 (en) * 2000-11-14 2002-05-23 Tru-Si Technologies, Inc. Plasma processing comprising three rotational motions of an article being processed
US6509061B1 (en) * 1995-04-24 2003-01-21 Commissariat A L'energe Atomique Apparatus for depositing a material by evaporation on large surface substrates
DE102004027989A1 (de) * 2004-06-09 2006-03-02 Esser, Stefan, Dr.-Ing. Werkstückträgervorrichtung zum Halten von Werkstücken und Behandlungsvorrichtung
US7081166B2 (en) 1999-12-15 2006-07-25 Unaxis Balzers Aktiengesellschaft Planetary system workpiece support and method for surface treatment of workpieces
WO2013189935A1 (en) * 2012-06-18 2013-12-27 Oc Oerlikon Balzers Ag Pvd apparatus for directional material deposition, methods and workpiece
US10507488B2 (en) * 2015-04-16 2019-12-17 Nalux Co., Ltd. Deposition apparatus and manufacturing process including film forming step by deposition apparatus
US11806737B2 (en) 2018-10-26 2023-11-07 Oerlikon Surface Solutions Ag, Pfaffikon Workpiece carrier device and coating arrangement

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5266756U (de) * 1975-11-13 1977-05-17
JPS5727032A (en) * 1980-07-25 1982-02-13 Hitachi Ltd Plasma cvd device
DE3306870A1 (de) * 1983-02-26 1984-08-30 Leybold-Heraeus GmbH, 5000 Köln Vorrichtung zum herstellen von schichten mit rotationssymmetrischem dickenprofil durch katodenzerstaeubung
DE3310044A1 (de) * 1983-03-19 1984-09-20 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren und anordnung zur beschichtung eines substrates
DE3422718A1 (de) * 1984-06-19 1986-01-09 Plasmainvent AG, Zug Vakuum-plasma-beschichtungsanlage
JPS61227165A (ja) * 1985-03-29 1986-10-09 Mitsubishi Electric Corp 蒸着装置
DE3702775A1 (de) * 1987-01-30 1988-08-11 Leybold Ag Vorrichtung zum quasi-kontinuierlichen behandeln von substraten
DE3705592A1 (de) * 1987-02-21 1988-09-01 Convac Gmbh Geraete Zur Halble Vorrichtung zur duennen beschichtung (belackung) scheibenfoermiger substrate fuer elektronische anwendungszwecke, bspw. leiterplatten, compact disks etc.
JPH01143211A (ja) * 1987-11-27 1989-06-05 Takatori Haitetsuku:Kk ウエハーに対する保護テープの貼付け切り抜き方法および装置
DE4025659A1 (de) * 1990-08-14 1992-02-20 Leybold Ag Umlaufraedergetriebe mit einem raedersatz, insbesondere fuer vorrichtungen zum beschichten von substraten
DE19738234C1 (de) 1997-09-02 1998-10-22 Fraunhofer Ges Forschung Einrichtung zum Aufstäuben von Hartstoffschichten

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2351537A (en) * 1942-03-05 1944-06-13 Spencer Lens Co Apparatus for treating surfaces
US3023727A (en) * 1959-09-10 1962-03-06 Ibm Substrate processing apparatus
US3352282A (en) * 1965-07-23 1967-11-14 Bendix Corp Vacuum deposit device including means to register and manipulate mask and substrate elements
US3598083A (en) * 1969-10-27 1971-08-10 Varian Associates Complex motion mechanism for thin film coating apparatuses

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2351537A (en) * 1942-03-05 1944-06-13 Spencer Lens Co Apparatus for treating surfaces
US3023727A (en) * 1959-09-10 1962-03-06 Ibm Substrate processing apparatus
US3352282A (en) * 1965-07-23 1967-11-14 Bendix Corp Vacuum deposit device including means to register and manipulate mask and substrate elements
US3598083A (en) * 1969-10-27 1971-08-10 Varian Associates Complex motion mechanism for thin film coating apparatuses

Cited By (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4036171A (en) * 1974-03-04 1977-07-19 Ebauches S.A. Vacuum deposition through plural masks on plural substrates
US4010710A (en) * 1974-09-20 1977-03-08 Rockwell International Corporation Apparatus for coating substrates
US4022939A (en) * 1975-12-18 1977-05-10 Western Electric Company, Inc. Synchronous shielding in vacuum deposition system
US3983838A (en) * 1975-12-31 1976-10-05 International Business Machines Corporation Planetary evaporator
US4222345A (en) * 1978-11-30 1980-09-16 Optical Coating Laboratory, Inc. Vacuum coating apparatus with rotary motion assembly
US4241698A (en) * 1979-02-09 1980-12-30 Mca Discovision, Inc. Vacuum evaporation system for the deposition of a thin evaporated layer having a high degree of uniformity
US4328763A (en) * 1979-05-03 1982-05-11 Leybold-Heraeus Vaporizer for vacuum deposition installations
US4284033A (en) * 1979-10-31 1981-08-18 Rca Corporation Means to orbit and rotate target wafers supported on planet member
US4640846A (en) * 1984-09-25 1987-02-03 Yue Kuo Semiconductor spin coating method
US4662310A (en) * 1986-07-09 1987-05-05 Deco Tools, Inc. Robotic paint masking machine
US4773843A (en) * 1987-02-25 1988-09-27 Krupp Corpoplast Maschinenbau Gmbh Apparatus for treating blanks of plastic material
US4775311A (en) * 1987-02-25 1988-10-04 Krupp Corpoplast Maschinenbau Gmbh. Apparatus for producing hollow bodies of thermoplastic material
GB2206608A (en) * 1987-04-14 1989-01-11 Toshiba Kk Vapour deposition apparatus
GB2206608B (en) * 1987-04-14 1990-12-19 Toshiba Kk Vapor deposition apparatus
US5002011A (en) * 1987-04-14 1991-03-26 Kabushiki Kaisha Toshiba Vapor deposition apparatus
US5029555A (en) * 1988-03-10 1991-07-09 International Business Machines Corporation Wafer holder method and apparatus in a vacuum deposition system
US5679165A (en) * 1992-11-30 1997-10-21 Semiconductor Process Laboratory Co., Ltd. Apparatus for manufacturing semiconductor device
US5472592A (en) * 1994-07-19 1995-12-05 American Plating Systems Electrolytic plating apparatus and method
GB2291889B (en) * 1994-07-27 1998-02-25 Gec Marconi Avionics Holdings Depositing coatings of materials on a substrate
GB2291889A (en) * 1994-07-27 1996-02-07 Gec Marconi Avionics Holdings Depositing coatings of materials on a moving substrate having a fixed orientation
US6509061B1 (en) * 1995-04-24 2003-01-21 Commissariat A L'energe Atomique Apparatus for depositing a material by evaporation on large surface substrates
US5702532A (en) * 1995-05-31 1997-12-30 Hughes Aircraft Company MOCVD reactor system for indium antimonide epitaxial material
US5776256A (en) * 1996-10-01 1998-07-07 The United States Of America As Represented By The Secretary Of The Air Force Coating chamber planetary gear mirror rotating system
US6142097A (en) * 1998-01-20 2000-11-07 Nikon Corporation Optical membrane forming apparatus and optical device produced by the same
US6203619B1 (en) 1998-10-26 2001-03-20 Symetrix Corporation Multiple station apparatus for liquid source fabrication of thin films
US6620254B2 (en) * 1998-12-15 2003-09-16 Unaxis Balzers Ag Planetary system workpiece support and method for surface treatment of workpieces
WO2000036178A1 (de) * 1998-12-15 2000-06-22 Unaxis Balzers Aktiengesellschaft Planetensystem-werkstückträger und verfahren zur oberflächenbehandlung von werkstücken
US7081166B2 (en) 1999-12-15 2006-07-25 Unaxis Balzers Aktiengesellschaft Planetary system workpiece support and method for surface treatment of workpieces
WO2002041355A3 (en) * 2000-11-14 2003-02-20 Tru Si Technologies Inc Plasma processing comprising three rotational motions of an article being processed
US20040016406A1 (en) * 2000-11-14 2004-01-29 Oleg Siniaguine Plasma processing comprising three rotational motions of an article being processed
US6749764B1 (en) 2000-11-14 2004-06-15 Tru-Si Technologies, Inc. Plasma processing comprising three rotational motions of an article being processed
WO2002041355A2 (en) * 2000-11-14 2002-05-23 Tru-Si Technologies, Inc. Plasma processing comprising three rotational motions of an article being processed
DE102004027989A1 (de) * 2004-06-09 2006-03-02 Esser, Stefan, Dr.-Ing. Werkstückträgervorrichtung zum Halten von Werkstücken und Behandlungsvorrichtung
DE102004027989B4 (de) * 2004-06-09 2007-05-10 Esser, Stefan, Dr.-Ing. Werkstückträgervorrichtung zum Halten von Werkstücken
WO2013189935A1 (en) * 2012-06-18 2013-12-27 Oc Oerlikon Balzers Ag Pvd apparatus for directional material deposition, methods and workpiece
US10507488B2 (en) * 2015-04-16 2019-12-17 Nalux Co., Ltd. Deposition apparatus and manufacturing process including film forming step by deposition apparatus
US11806737B2 (en) 2018-10-26 2023-11-07 Oerlikon Surface Solutions Ag, Pfaffikon Workpiece carrier device and coating arrangement
EP3870736B1 (de) * 2018-10-26 2023-11-22 Oerlikon Surface Solutions AG, Pfäffikon Werkstückträgereinrichtung und beschichtungsanordnung

Also Published As

Publication number Publication date
GB1474927A (en) 1977-05-25
ES432508A1 (es) 1977-03-01
CH606479A5 (de) 1978-10-31
FR2253270A1 (de) 1975-06-27
JPS5325718B2 (de) 1978-07-28
NL7415450A (nl) 1975-06-05
SE7414445L (de) 1975-06-04
CA1035255A (en) 1978-07-25
FR2253270B1 (de) 1977-03-25
DE2448023A1 (de) 1975-06-05
JPS5087576A (de) 1975-07-14
IT1022786B (it) 1978-04-20
DE2448023B2 (de) 1976-11-04
SE397435B (sv) 1977-10-31

Similar Documents

Publication Publication Date Title
US3853091A (en) Thin film coating apparatus
US3598083A (en) Complex motion mechanism for thin film coating apparatuses
JP3566740B2 (ja) 全ウエハデポジション用装置
JPS62116764A (ja) 工作物表面へのフイルム折出方法と装置
US3643625A (en) Thin-film deposition apparatus
US3983838A (en) Planetary evaporator
JPS59208069A (ja) 多くの物質を蒸着させるための放射加熱部を有する蒸発装置
CN108060406A (zh) 遮挡压盘组件、半导体加工装置和方法
CN111206225B (zh) 3d蒸镀的公自转镀锅结构
GB2156861A (en) Holder device for substrates in vaccum deposition apparatus
US3523517A (en) Rotating workpiece holder
US5431737A (en) Interchangeable CVD chuck surface
US3749058A (en) Rotary substrate holder assembly
US5207884A (en) Superconductor deposition system
US20090136663A1 (en) Vacuum vapor deposition apparatus and method, and vapor deposited article formed therewith
TWI664305B (zh) 3d蒸鍍之公自轉鍍鍋結構
JPH0726379A (ja) 薄膜の形成方法及びその装置
JPH05335253A (ja) 気相成長装置
JPS6352111B2 (de)
US3625180A (en) Evaporation sources
JP3808244B2 (ja) ターゲットホルダー構造
CN216738504U (zh) 一种多工件盘镀膜装置
JPS6360275A (ja) スパツタリング装置
JPS6372878A (ja) プラネタ加熱装置の構造
JPS6142920Y2 (de)