US3843373A - Bath for the electroless deposition of ductile copper - Google Patents
Bath for the electroless deposition of ductile copper Download PDFInfo
- Publication number
- US3843373A US3843373A US00400880A US40088073A US3843373A US 3843373 A US3843373 A US 3843373A US 00400880 A US00400880 A US 00400880A US 40088073 A US40088073 A US 40088073A US 3843373 A US3843373 A US 3843373A
- Authority
- US
- United States
- Prior art keywords
- mol
- copper
- bath
- thioether
- deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 33
- 239000010949 copper Substances 0.000 title claims abstract description 31
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 31
- 230000008021 deposition Effects 0.000 title claims abstract description 19
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims abstract description 45
- 150000001875 compounds Chemical class 0.000 claims abstract description 19
- 238000007747 plating Methods 0.000 claims abstract description 16
- 150000003568 thioethers Chemical class 0.000 claims abstract description 15
- 229920001515 polyalkylene glycol Polymers 0.000 claims abstract description 9
- 229910001854 alkali hydroxide Inorganic materials 0.000 claims abstract description 6
- 150000008044 alkali metal hydroxides Chemical class 0.000 claims abstract description 6
- 150000002500 ions Chemical class 0.000 claims abstract description 6
- 239000000470 constituent Substances 0.000 claims abstract description 5
- XLYOFNOQVPJJNP-PWCQTSIFSA-N Tritiated water Chemical compound [3H]O[3H] XLYOFNOQVPJJNP-PWCQTSIFSA-N 0.000 claims abstract 2
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 abstract description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical group OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 abstract 1
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 25
- 238000000151 deposition Methods 0.000 description 18
- 239000000243 solution Substances 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 6
- 229960001484 edetic acid Drugs 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- RPACBEVZENYWOL-XFULWGLBSA-M sodium;(2r)-2-[6-(4-chlorophenoxy)hexyl]oxirane-2-carboxylate Chemical compound [Na+].C=1C=C(Cl)C=CC=1OCCCCCC[C@]1(C(=O)[O-])CO1 RPACBEVZENYWOL-XFULWGLBSA-M 0.000 description 6
- 239000008367 deionised water Substances 0.000 description 5
- 229910021641 deionized water Inorganic materials 0.000 description 5
- 238000007792 addition Methods 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 150000001879 copper Chemical class 0.000 description 4
- 229910001868 water Inorganic materials 0.000 description 4
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical class [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920001281 polyalkylene Polymers 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 238000011835 investigation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- 229960004418 trolamine Drugs 0.000 description 2
- RNMCCPMYXUKHAZ-UHFFFAOYSA-N 2-[3,3-diamino-1,2,2-tris(carboxymethyl)cyclohexyl]acetic acid Chemical compound NC1(N)CCCC(CC(O)=O)(CC(O)=O)C1(CC(O)=O)CC(O)=O RNMCCPMYXUKHAZ-UHFFFAOYSA-N 0.000 description 1
- 125000002934 2-oxopropylidene group Chemical group 0.000 description 1
- HMJGQFMTANUIEW-UHFFFAOYSA-N 5-phenylsulfanyl-2h-tetrazole Chemical compound C=1C=CC=CC=1SC=1N=NNN=1 HMJGQFMTANUIEW-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 241000036313 Cupressus torulosa Species 0.000 description 1
- FCKYPQBAHLOOJQ-UHFFFAOYSA-N Cyclohexane-1,2-diaminetetraacetic acid Chemical compound OC(=O)CN(CC(O)=O)C1CCCCC1N(CC(O)=O)CC(O)=O FCKYPQBAHLOOJQ-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 101150003085 Pdcl gene Proteins 0.000 description 1
- 239000004133 Sodium thiosulphate Substances 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000011149 active material Substances 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 239000003637 basic solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- OUDSFQBUEBFSPS-UHFFFAOYSA-N ethylenediaminetriacetic acid Chemical compound OC(=O)CNCCN(CC(O)=O)CC(O)=O OUDSFQBUEBFSPS-UHFFFAOYSA-N 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000000693 micelle Substances 0.000 description 1
- WQAQPCDUOCURKW-UHFFFAOYSA-N n-butyl mercaptan Natural products CCCCS WQAQPCDUOCURKW-UHFFFAOYSA-N 0.000 description 1
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 description 1
- 125000000963 oxybis(methylene) group Chemical group [H]C([H])(*)OC([H])([H])* 0.000 description 1
- 229960003330 pentetic acid Drugs 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical group [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Chemical group 0.000 description 1
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 1
- 231100000572 poisoning Toxicity 0.000 description 1
- 230000000607 poisoning effect Effects 0.000 description 1
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 1
- 229940074439 potassium sodium tartrate Drugs 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 1
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 description 1
- 235000019345 sodium thiosulphate Nutrition 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L sulfate group Chemical group S(=O)(=O)([O-])[O-] QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Definitions
- alkali hydroxide pH 11-135
- R is an aliphatic or cyclic group and R is hydrogen, sulphate, phosphate or an acid chloride thereof, while 20 a+b+c 500.
- the invention relates to an alkaline aqueous bath for the electroless deposition of ductile copper and provides methods of operating such a bath.
- electroless copper plating is understood to mean the deposition by means of chemical reduction of an adherent copper layer on a susceptible surface in the absence of an external source of electricity.
- Such a copper-plating operation is performed, for example, on a large scale for the manufacture of printed wiring boards, conducting coatings which are subsequently further coated electrically, and for decorative purposes.
- Such an aqueous alkaline copper-plating bath is described in UK. patent appl. 48,590/ 70, US. patent appl. Ser. No. 78,740, filed Oct. 7, 1970, and now abandoned, which bath comprises as essential constituents: 0.010.15 mol of a copper salt soluble in water, a total of 0.01-0.80 mol of one or more complexing agents preventing cupric ions from being deposited from the alkaline solution, 0.05-0.50 mol of alkali hydroxide (pH approximately 11-135), 0.01-0.35 mol formaldehyde or a compound producing formaldehyde and for improving the ductility of the depositing copper an effective concentration of a soluble non-ionic or ionic polyalkylene oxidic compound constituting or not constituting micelles and comprising at least 4 alkylene oxide groups.
- the known compounds may be used as eomplexing agents such as, inter alia, potassium sodium tartrate, triethanol amine, ethylene diamine tetra-acetic acid, diethylene triamine penta-acetic acid, cyclohexane diamine tetra-acetic acid, nitrilo-triacetic acid or N-hydroethyl ethylene diamine triacetic acid.
- An effective concentration of the polyalkylene oxidic compound is understood to mean a concentration giving an improvement of the ductility and-if insuflicient ductile copper is deposited from the solution without the active compound-is at least so large that a ductility of at least 2 bends is obtained.
- An effective concentration also substantially always gives an improvement of the colour and the smoothness of the deposition and frequently a reduced blister formation in the surface of the deposited copper and an improved adhesion of the deposited coating.
- this bath contains polyalkylene oxidic compounds of the type thio- 3,843,373 Patented Oct. 22, 1974 ether of an alkyl mercaptane and polyethylene glycol defined by the formula:
- Copper-plating baths of the three latter types of bivalent sulphur compounds generally yield brittle and dark coloured copper deposits.
- these sulphur compounds can only be used in low concentrations because otherwise the copper deposition is completely discontinued owing to poisoning of the bath.
- Copper deposition is not effected in a copper-plating solution having a temperature of 50 C. and comprising 0.03 mol of a copper salt soluble in water, 0.031 mol of a compound forming complexes with cupric ions, 0.10 mol of formaldehyde or a compound producing formaldehyde and 0.15 mol of alkali hydroxide to which 3 10 by weight of thiourea, phenylmercaptotetrazol, sodium thiosulphate or butyl mercaptane is added.
- the molecule of the said thioethers consists of a part to which a stabilizing action may be ascribed and a part to which a regulating action, i.e., an action regulating the deposition rate is to be ascribed.
- EXAMPLE 1 Glass plates unilaterally roughened with carborundum and having a surface of 6 sq. cm. were activated for the electrodes copper deposition by moving them at room temperature for 2 min. in a solution of 50 g. stamous chloride and ml. concentrated HCl solution in 1 litre of deionized water, keeping them for l min. in running deionized water, moving them for 1 min. in a solution of 0.25 g. PdCl and 10 ml. concentrated HCl solution in 1 litre of deionized water and finally again for 1 min. in running deionized water.
- the plates were treated for 45 seconds at 75 C. with an aqueous solution comprising per litre 0.10 mol NaOH and 0.10 mol formaldehyde and Were subsequently rinsed for 5 seconds in deionized water of 75 C. They were then electroless intensified at 75 C. in 200 ml. of one of the copper-plating solutions comprising the following bath constituents per litre:
- the ductility is determined by removing the copper layer partly from the substrate, bending it over 180, folding it, bending it back and flattening the fold under pressure. This series of operation is repeated until the layer breaks.
- EXAMPLE 6 Glass plates were activated in the manner described in Example 1 and subsequently treated for 47 seconds at 40 C. with a solution comprising 0.10 mol Na0H+0.10 mol formaldehyde per litre. After rinsing at 40 C. a pre-intensification was carried out for 1 /2 min. with an aqueous solution heated at 40 C. and comprising per litre:
- An alkaline aqueous copper-plating bath for the deposition of ductile copper comprising as essential constituents:
- thioether of a polyalkylene glycol, characterized in that the thioether is defined by the following formula:
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NLAANVRAGE7213464,A NL171176C (nl) | 1972-10-05 | 1972-10-05 | Bad voor het stroomloos afzetten van buigbaar koper. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3843373A true US3843373A (en) | 1974-10-22 |
Family
ID=19817081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US00400880A Expired - Lifetime US3843373A (en) | 1972-10-05 | 1973-09-26 | Bath for the electroless deposition of ductile copper |
Country Status (12)
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4211564A (en) * | 1978-05-09 | 1980-07-08 | Hitachi, Ltd. | Chemical copper plating solution |
| US4301196A (en) * | 1978-09-13 | 1981-11-17 | Kollmorgen Technologies Corp. | Electroless copper deposition process having faster plating rates |
| US4303443A (en) * | 1979-06-15 | 1981-12-01 | Hitachi, Ltd. | Electroless copper plating solution |
| US4908242A (en) * | 1986-10-31 | 1990-03-13 | Kollmorgen Corporation | Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures |
| US10294569B2 (en) | 2017-10-06 | 2019-05-21 | Rohm And Haas Electronic Materials Llc | Stable electroless copper plating compositions and methods for electroless plating copper on substrates |
| US10655227B2 (en) | 2017-10-06 | 2020-05-19 | Rohm And Haas Electronic Materials Llc | Stable electroless copper plating compositions and methods for electroless plating copper on substrates |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE441530B (sv) * | 1980-12-09 | 1985-10-14 | Ericsson Telefon Ab L M | Sett och bad for att utfora stromlos forkoppring |
| US10905305B2 (en) | 2011-05-20 | 2021-02-02 | Ecolab Usa Inc. | Automated cleaning method and apparatus |
-
1972
- 1972-10-05 NL NLAANVRAGE7213464,A patent/NL171176C/xx not_active IP Right Cessation
-
1973
- 1973-09-15 DE DE2346616A patent/DE2346616C3/de not_active Expired
- 1973-09-26 US US00400880A patent/US3843373A/en not_active Expired - Lifetime
- 1973-10-02 CH CH1407373A patent/CH591565A5/xx not_active IP Right Cessation
- 1973-10-02 SE SE7313397A patent/SE390631B/xx unknown
- 1973-10-02 IT IT69892/73A patent/IT996763B/it active
- 1973-10-02 GB GB4593673A patent/GB1400120A/en not_active Expired
- 1973-10-02 AT AT840773A patent/AT321052B/de not_active IP Right Cessation
- 1973-10-02 CA CA182,389A patent/CA990006A/en not_active Expired
- 1973-10-02 JP JP11023573A patent/JPS5435584B2/ja not_active Expired
- 1973-10-03 BE BE136320A patent/BE805636A/xx not_active IP Right Cessation
- 1973-10-03 FR FR7335326A patent/FR2202168B1/fr not_active Expired
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4211564A (en) * | 1978-05-09 | 1980-07-08 | Hitachi, Ltd. | Chemical copper plating solution |
| US4301196A (en) * | 1978-09-13 | 1981-11-17 | Kollmorgen Technologies Corp. | Electroless copper deposition process having faster plating rates |
| US4303443A (en) * | 1979-06-15 | 1981-12-01 | Hitachi, Ltd. | Electroless copper plating solution |
| US4908242A (en) * | 1986-10-31 | 1990-03-13 | Kollmorgen Corporation | Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures |
| US10294569B2 (en) | 2017-10-06 | 2019-05-21 | Rohm And Haas Electronic Materials Llc | Stable electroless copper plating compositions and methods for electroless plating copper on substrates |
| US10655227B2 (en) | 2017-10-06 | 2020-05-19 | Rohm And Haas Electronic Materials Llc | Stable electroless copper plating compositions and methods for electroless plating copper on substrates |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2346616A1 (de) | 1974-04-11 |
| NL7213464A (enrdf_load_stackoverflow) | 1974-04-09 |
| FR2202168B1 (enrdf_load_stackoverflow) | 1976-10-01 |
| NL171176B (nl) | 1982-09-16 |
| BE805636A (fr) | 1974-04-03 |
| DE2346616C3 (de) | 1978-07-13 |
| AT321052B (de) | 1975-03-10 |
| CH591565A5 (enrdf_load_stackoverflow) | 1977-09-30 |
| NL171176C (nl) | 1983-02-16 |
| SE390631B (sv) | 1977-01-03 |
| IT996763B (it) | 1975-12-10 |
| FR2202168A1 (enrdf_load_stackoverflow) | 1974-05-03 |
| DE2346616B2 (de) | 1977-11-24 |
| GB1400120A (en) | 1975-07-16 |
| CA990006A (en) | 1976-06-01 |
| JPS4973338A (enrdf_load_stackoverflow) | 1974-07-16 |
| JPS5435584B2 (enrdf_load_stackoverflow) | 1979-11-02 |
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