IT996763B - Bagno per la deposizione di rame duttile senza impiego dell elettri cita - Google Patents

Bagno per la deposizione di rame duttile senza impiego dell elettri cita

Info

Publication number
IT996763B
IT996763B IT69892/73A IT6989273A IT996763B IT 996763 B IT996763 B IT 996763B IT 69892/73 A IT69892/73 A IT 69892/73A IT 6989273 A IT6989273 A IT 6989273A IT 996763 B IT996763 B IT 996763B
Authority
IT
Italy
Prior art keywords
cita
bathroom
deposition
electric
ductile copper
Prior art date
Application number
IT69892/73A
Other languages
English (en)
Italian (it)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Application granted granted Critical
Publication of IT996763B publication Critical patent/IT996763B/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
IT69892/73A 1972-10-05 1973-10-02 Bagno per la deposizione di rame duttile senza impiego dell elettri cita IT996763B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NLAANVRAGE7213464,A NL171176C (nl) 1972-10-05 1972-10-05 Bad voor het stroomloos afzetten van buigbaar koper.

Publications (1)

Publication Number Publication Date
IT996763B true IT996763B (it) 1975-12-10

Family

ID=19817081

Family Applications (1)

Application Number Title Priority Date Filing Date
IT69892/73A IT996763B (it) 1972-10-05 1973-10-02 Bagno per la deposizione di rame duttile senza impiego dell elettri cita

Country Status (12)

Country Link
US (1) US3843373A (enrdf_load_stackoverflow)
JP (1) JPS5435584B2 (enrdf_load_stackoverflow)
AT (1) AT321052B (enrdf_load_stackoverflow)
BE (1) BE805636A (enrdf_load_stackoverflow)
CA (1) CA990006A (enrdf_load_stackoverflow)
CH (1) CH591565A5 (enrdf_load_stackoverflow)
DE (1) DE2346616C3 (enrdf_load_stackoverflow)
FR (1) FR2202168B1 (enrdf_load_stackoverflow)
GB (1) GB1400120A (enrdf_load_stackoverflow)
IT (1) IT996763B (enrdf_load_stackoverflow)
NL (1) NL171176C (enrdf_load_stackoverflow)
SE (1) SE390631B (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4211564A (en) * 1978-05-09 1980-07-08 Hitachi, Ltd. Chemical copper plating solution
US4301196A (en) * 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates
US4303443A (en) * 1979-06-15 1981-12-01 Hitachi, Ltd. Electroless copper plating solution
SE441530B (sv) * 1980-12-09 1985-10-14 Ericsson Telefon Ab L M Sett och bad for att utfora stromlos forkoppring
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US10905305B2 (en) 2011-05-20 2021-02-02 Ecolab Usa Inc. Automated cleaning method and apparatus
US10655227B2 (en) 2017-10-06 2020-05-19 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US10294569B2 (en) 2017-10-06 2019-05-21 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates

Also Published As

Publication number Publication date
FR2202168A1 (enrdf_load_stackoverflow) 1974-05-03
BE805636A (fr) 1974-04-03
NL7213464A (enrdf_load_stackoverflow) 1974-04-09
CA990006A (en) 1976-06-01
FR2202168B1 (enrdf_load_stackoverflow) 1976-10-01
DE2346616C3 (de) 1978-07-13
GB1400120A (en) 1975-07-16
NL171176B (nl) 1982-09-16
NL171176C (nl) 1983-02-16
DE2346616B2 (de) 1977-11-24
SE390631B (sv) 1977-01-03
DE2346616A1 (de) 1974-04-11
CH591565A5 (enrdf_load_stackoverflow) 1977-09-30
AT321052B (de) 1975-03-10
JPS5435584B2 (enrdf_load_stackoverflow) 1979-11-02
JPS4973338A (enrdf_load_stackoverflow) 1974-07-16
US3843373A (en) 1974-10-22

Similar Documents

Publication Publication Date Title
IT995275B (it) Bagno per la deposizione galvanica di oro e leghe di oro
IT1020962B (it) Bagno elettrolitico di cromatura
IT1001583B (it) Procedimento per la sintesi elettro chimica di composti di metalli organici
IT980227B (it) Bagno per la deposizione elettro litica di zinco e relativo metodo di applicaione
IT1015337B (it) Composizione e procedimento per la deposizione elettrolitica di metal li
IT1026066B (it) Bagno per il distacco elettroliti co di metalli
IT973212B (it) Bagno galvanico acido di rame
IT1050746B (it) Bagno per il rivestimento cataforetico di superfici metalliche
IT996763B (it) Bagno per la deposizione di rame duttile senza impiego dell elettri cita
IT977241B (it) Procedimento per la cementazione di pezzi
IT982717B (it) Dispositivo per il fissaggio distanziato di parti costruttive
IT987942B (it) Metodo di placcatura elettrolitica
IT991757B (it) Bagno galvanico
IT980460B (it) Bagno e procedimento per la deposi zione non elettrolitica del rame
IT1004543B (it) Procedimento per la produzione di fili metallici placcati
IT966360B (it) Struttura di caleidoscopio e metodo per la formazione dell im magine
IT995821B (it) Bagno alcalino per la deposizione galvanica di leghe d or
IT989714B (it) Bagno e procedimento per la depo sizione elettrolitica di leghe di nikel ferro brillanti
IT989353B (it) Metodo per la deposizione di ad duttori elettrodici
IT989881B (it) Procedimento per l incollamento o il rivestimento di metalli
IT1000036B (it) Procedimento per la formatura di metalli
IT1020122B (it) Procedimento per la fosfatazione di metalli
IT1001676B (it) Elettrolita per la formazione di foglie di alluminio
IT1018790B (it) Sensibilizzatori per deposizione di metallo senza elettricita
IT989840B (it) Procedimento per la produzione di 2 metil 5 etilpiridina