US3824328A - Encapsulated ptc heater packages - Google Patents

Encapsulated ptc heater packages Download PDF

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Publication number
US3824328A
US3824328A US00300022A US30002272A US3824328A US 3824328 A US3824328 A US 3824328A US 00300022 A US00300022 A US 00300022A US 30002272 A US30002272 A US 30002272A US 3824328 A US3824328 A US 3824328A
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US
United States
Prior art keywords
ptc
potting
materials
ptc heater
potting material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US00300022A
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English (en)
Inventor
Y Ting
H Stoeckler
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Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Priority to US00300022A priority Critical patent/US3824328A/en
Priority to DK535573A priority patent/DK147415C/da
Priority to NL7313514A priority patent/NL7313514A/xx
Priority to JP11223573A priority patent/JPS547057B2/ja
Priority to DE2351956A priority patent/DE2351956C2/de
Application granted granted Critical
Publication of US3824328A publication Critical patent/US3824328A/en
Priority to JP1980129069U priority patent/JPS5834716Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/022—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances

Definitions

  • ABSTRACT Packaged PTC heater elements wherein the package includes an outer material such as a phenolic resin in the form of a casing and an inner potting material which is thermally conductive and electrically insulated and does not deteriorate the PTC material.
  • the potting material is one that does not include nucleophiles such as amines and the like and therefore excludes the epoxy resins.
  • the potting material used is a silicone resin, polyamides, polyimides and ceramics which are not amine initiated.
  • the PTC device can be completely potted in one of the above noted potting materials or a barrier layer of one of the above potting materials can be placed around the PTC material to separate it'from an external potting material and then the PTC material with the barrier layer therearound can be potted with the well known epoxy resin.
  • the disclosure relates to a packaging for PTC materials, and more specifically, to a potting material for use with doped PTC materials which does not include nuv cleophiles which degrade the PTC material.
  • epoxy resins have normally been used as potting materials for PTC devices. These potting materials have a tendency to degrade the PTC materials which are normally formed from doped 2arium titanate.
  • the reasonfor this is that the epoxy resins are normally made from secondary amines or acid anhydrides which are nucleophiles and react with chemabsorbed oxygen atoms on the boundaries of the PTC device. These chemabsorbed oxygen atoms act as electron traps. In the event that these electron traps become either neutralized or desorbed from the grain boundaries, the PTC effect is destroyed in the sense that electron traps are no longer available to stop the current flow. In order to eliminate this detrimental effect, it is necessary to look for classes of packaging material's which do not contain nucleophiles.
  • the degradation takes place in the form of gradual flattening of the PTC resistance-temperature curve.
  • the degradation of the resistance-temperature curve when the organic polymer, such as the epoxy, acts as a reducing agent, is caused by depletion of the oxygen supply in the grain boundary.
  • certain potting materials do not cause the above described degradation of the PTC materials and particularly the degradation of the resistance-temperature curve.
  • the prior art epoxy potting materials are replaced by potting materials which do not degrade the PTC heating materials. These include the silicone resin, polyamides, polyimides and ceramics which are not amine initiated.
  • the PTC material is coated with a barrier of a nondegrading material such as one of the above described potting materials and then the remainder of the package is potted with the well known epoxy material.
  • a case 1 which may be metallic or may be made out of a material s'uch as phenolic resin.
  • a PTC heater 3 Positioned within the case 1 is a PTC heater 3 of well known type to which has been secured a pair of lead wires 5 and 7. It is understood that the PTC material has been previously metallized in well known manner so that the leads 5 and 7 can be secured thereto by soldering or the like.
  • the wire 5 includes insulation therearound which extends outwardly out of the case I and the wire 7 includes insulation ll therearound which extends out of the case in the same manner.
  • FIG. 1 is a view in section of a first embodiment of a package in accordance with the present invention a potting or sealing compound 13 which also provides a tight seal around the PTC pill or heater, thus serving as a heat transfer medium.
  • the potting compound 13 therefore also serves as a water-tight seal for the PTC device 3.
  • the potting compound 13 is free of nucleophiles and is therefore formed from the class of compounds consisting of silicone resins, polyamides, polyimides and ceramics which are not amine initiated and which are capable of forming potted compounds of the type de-' scribed above.
  • Some materials of this type which are well known are Novalac epoxy of Dow Chemical Co. which is a silicone rubber. These materials can be used as base potting materials and do not react with the PTC element, even at elevated temperatures of as high as C.
  • a sealed potting material 15 can be added on the top of the base potting material 13 to provide a better water tight seal.
  • FIG. 2 wherein like character references denote like elements, there is shown a second embodiment of the invention.
  • the case 1 and PTC heater 3 which is metallized as-in the prior embodiment and which includes leads 5 and 7 attached thereto with insulation 9 and 11 surrounding the leads 5 and 7 respectively.
  • a layer of material which does not degrade the PTC material 3 and which is labelled 17 completely surround the PTC element.
  • the entire PTC element 3 with the coating'l7 thereon is then placed into thecase l and the entire device with coating 17 thereon is now potted with a potting material 19.
  • the potting material 19 can be the epoxy resins and the like which are specifically excluded in the first embodiment.
  • the impervious or passivating coating 17 can be formed from silicon resins, RTV silicons, polyimides, polyimide-amide, etc. These materials do not degrade the PTC element in accordance with the second embodiment.
  • a PTC heater package which comprises:
  • a potting material encapsulating said PTC device said potting material being taken from the class of potting materials which is free of nucleophiles, said potting material encapsulating said PTC device forms a layer contacting and surrounding said PTC device,
  • said PTC device is formed from doped barium titanate.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Details Of Resistors (AREA)
  • Thermistors And Varistors (AREA)
  • Resistance Heating (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
US00300022A 1972-10-24 1972-10-24 Encapsulated ptc heater packages Expired - Lifetime US3824328A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US00300022A US3824328A (en) 1972-10-24 1972-10-24 Encapsulated ptc heater packages
DK535573A DK147415C (da) 1972-10-24 1973-10-02 Indeslutning af et ptk-varmelegeme i et hus
NL7313514A NL7313514A (enrdf_load_stackoverflow) 1972-10-24 1973-10-02
JP11223573A JPS547057B2 (enrdf_load_stackoverflow) 1972-10-24 1973-10-05
DE2351956A DE2351956C2 (de) 1972-10-24 1973-10-16 Eingekapseltes Heizelement mit positivem Temperaturkoeffizient
JP1980129069U JPS5834716Y2 (ja) 1972-10-24 1980-09-10 Ｐｃｔヒ−タの包装体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00300022A US3824328A (en) 1972-10-24 1972-10-24 Encapsulated ptc heater packages

Publications (1)

Publication Number Publication Date
US3824328A true US3824328A (en) 1974-07-16

Family

ID=23157336

Family Applications (1)

Application Number Title Priority Date Filing Date
US00300022A Expired - Lifetime US3824328A (en) 1972-10-24 1972-10-24 Encapsulated ptc heater packages

Country Status (5)

Country Link
US (1) US3824328A (enrdf_load_stackoverflow)
JP (2) JPS547057B2 (enrdf_load_stackoverflow)
DE (1) DE2351956C2 (enrdf_load_stackoverflow)
DK (1) DK147415C (enrdf_load_stackoverflow)
NL (1) NL7313514A (enrdf_load_stackoverflow)

Cited By (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3940591A (en) * 1974-07-01 1976-02-24 Texas Instruments Incorporated Self-regulating electric heater
US4001655A (en) * 1974-01-10 1977-01-04 P. R. Mallory & Co., Inc. Compressible intermediate layer for encapsulated electrical devices
FR2326103A1 (fr) * 1975-09-23 1977-04-22 Philips Nv Element chauffant autoregulateur
US4039904A (en) * 1976-01-02 1977-08-02 P. R. Mallory & Co., Inc. Intermediate precoat layer of resin material for stabilizing encapsulated electric devices
US4072848A (en) * 1976-07-22 1978-02-07 Thermon Manufacturing Company Electrical heating cable with temperature self-limiting heating elements
US4086467A (en) * 1976-07-19 1978-04-25 Texas Instruments Incorporated Electronic heater for high voltage applications
DE2746342A1 (de) * 1976-10-18 1978-04-27 Rosemount Inc Messfuehler fuer luftwerte und verfahren zu dessen herstellung
US4091267A (en) * 1976-07-19 1978-05-23 Texas Instruments Incorporated Self-regulating electric heater
US4092487A (en) * 1975-02-11 1978-05-30 Nippondenso Co., Ltd. Resin-sealed electrical device
FR2381434A1 (fr) * 1977-02-21 1978-09-15 Philips Nv Element chauffant comportant un corps de resistance a coefficient de temperature positif
US4178855A (en) * 1978-03-20 1979-12-18 The United States Of America As Represented By The Secretary Of The Navy Explosive actuated arming switch device
US4206436A (en) * 1976-08-26 1980-06-03 Westinghouse Electric Corp. Electrical apparatus encapsulated with resin coated filler
US4230754A (en) * 1978-11-07 1980-10-28 Sprague Electric Company Bonding electronic component to molded package
US4315237A (en) * 1978-12-01 1982-02-09 Raychem Corporation PTC Devices comprising oxygen barrier layers
US4352008A (en) * 1979-01-26 1982-09-28 Firma Fritz Eichenauer Electric heating device for heating the interior of a switch cabinet
EP0067681A1 (en) * 1981-06-15 1982-12-22 RAYCHEM CORPORATION (a California corporation) End seal for conductive polymer devices
US4371778A (en) * 1978-09-15 1983-02-01 Siemens Aktiengesellschaft Electric heating device employing PTC heating element for preheating of heating oil
US4425497A (en) 1979-08-17 1984-01-10 Raychem Corporation PTC Heater assembly
US4426636A (en) 1979-07-23 1984-01-17 Victor Company Of Japan, Limited Method for preventing waveform distortion of a signal passing through an insulated conductor and circuit element embodying the method
US4541899A (en) * 1979-12-04 1985-09-17 Ngk Insulators, Ltd. Method of heating a solid electrolyte body
US4547659A (en) * 1979-08-17 1985-10-15 Raychem Corporation PTC Heater assembly
US4558510A (en) * 1983-03-31 1985-12-17 Tokyo Shibaura Denki Kabushiki Kaisha Method of producing a semiconductor device
US4673801A (en) * 1979-08-17 1987-06-16 Raychem Corporation PTC heater assembly
US4804805A (en) * 1987-12-21 1989-02-14 Therm-O-Disc, Incorporated Protected solder connection and method
US4823064A (en) * 1987-05-07 1989-04-18 Gte Products Corporation Quick reset motor starting device
US5057030A (en) * 1990-07-02 1991-10-15 Itt Corporation Grommet/seal member for a connector assembly
EP0589602A3 (en) * 1992-09-22 1994-07-13 Simmonds Precision Engine Syst Potted electrical components and methods of making the same
US5367282A (en) * 1992-07-21 1994-11-22 Texas Instruments Incorporated Electric motor protector sensor
US5414241A (en) * 1992-05-11 1995-05-09 Sekisui Kaseihin Kogyo Kabushiki Kaisha Heater, a method of manufacturing the same, and an anti-condensation mirror incorporating the same
US5777541A (en) * 1995-08-07 1998-07-07 U.S. Philips Corporation Multiple element PTC resistor
US5802709A (en) * 1995-08-15 1998-09-08 Bourns, Multifuse (Hong Kong), Ltd. Method for manufacturing surface mount conductive polymer devices
US5849129A (en) * 1995-08-15 1998-12-15 Bourns Multifuse (Hong Kong) Ltd. Continuous process and apparatus for manufacturing conductive polymer components
US6020808A (en) * 1997-09-03 2000-02-01 Bourns Multifuse (Hong Kong) Ltd. Multilayer conductive polymer positive temperature coefficent device
US6025556A (en) * 1996-05-20 2000-02-15 Murata Manufacturing Co., Ltd. Electronic components with resin-coated lead terminals
US6172591B1 (en) 1998-03-05 2001-01-09 Bourns, Inc. Multilayer conductive polymer device and method of manufacturing same
US6228287B1 (en) 1998-09-25 2001-05-08 Bourns, Inc. Two-step process for preparing positive temperature coefficient polymer materials
US6236302B1 (en) 1998-03-05 2001-05-22 Bourns, Inc. Multilayer conductive polymer device and method of manufacturing same
US6242997B1 (en) 1998-03-05 2001-06-05 Bourns, Inc. Conductive polymer device and method of manufacturing same
WO2001091138A1 (de) * 2000-05-26 2001-11-29 Epcos Ag Elektrisches bauelement und verfahren zu dessen herstellung
US6380840B1 (en) 1996-05-24 2002-04-30 Heraeus Electro-Nite International N.V. Temperature sensor with measuring resistor
US6429533B1 (en) 1999-11-23 2002-08-06 Bourns Inc. Conductive polymer device and method of manufacturing same
WO2002049047A3 (de) * 2000-12-14 2003-05-08 Epcos Ag Elektrisches bauelement und verfahren zu dessen herstellung
US20040026106A1 (en) * 2000-08-30 2004-02-12 Roland Peinsipp Electrical component and method for production thereof
EP1666286A1 (en) * 2004-12-02 2006-06-07 Delphi Technologies Inc. Heating device
US20060152330A1 (en) * 2005-01-12 2006-07-13 Jong-Sung Kang PTC current limiting device having molding part made of insulating material
US20090128276A1 (en) * 2007-11-19 2009-05-21 John Horowy Light weight reworkable inductor
US20120026659A1 (en) * 2010-07-30 2012-02-02 Joinset Co., Ltd. Ceramic chip assembly
US10156483B2 (en) 2014-03-07 2018-12-18 Shibaura Electronics Co., Ltd. Temperature sensor and temperature sensor manufacturing method
CN111440449A (zh) * 2020-05-14 2020-07-24 成都拓利科技股份有限公司 一种有机硅柔性包封材料及其制备方法和用途
US12123746B2 (en) 2020-06-17 2024-10-22 Tdk Electronics Ag Sensor with housing and silicone resin filler

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL58837A (en) * 1978-12-01 1984-10-31 Raychem Corp Electrical devices comprising conductive polymer ptc elements
DE2948592C2 (de) * 1979-12-03 1990-05-10 Fritz Eichenauer GmbH & Co KG, 6744 Kandel Elektrisches Widerstandsheizelement
JPH0448701A (ja) * 1990-06-15 1992-02-18 Daito Tsushinki Kk 自己復帰形過電流保護素子
JPH04298002A (ja) * 1991-03-27 1992-10-21 Taiyo Yuden Co Ltd 樹脂封止形サーミスタ
JPH0677204U (ja) 1993-03-30 1994-10-28 株式会社村田製作所 サーミスタ装置
EP2365492B1 (en) * 2008-11-07 2019-05-01 Littelfuse Japan G.K. Ptc device
DE102010042978B4 (de) * 2010-10-27 2023-06-15 Continental Automotive Technologies GmbH Düseneinrichtung und Verfahren zu deren Herstellung

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2829320A (en) * 1955-01-12 1958-04-01 Bell Telephone Labor Inc Encapsulation for electrical components and method of manufacture
US3081374A (en) * 1960-05-27 1963-03-12 Itt Encapsulated diode assembly
US3210701A (en) * 1962-05-14 1965-10-05 Automatic Elect Lab Wound toroidal core shell
US3214719A (en) * 1964-03-20 1965-10-26 Westinghouse Electric Corp Thermistor device
US3242393A (en) * 1963-05-24 1966-03-22 Int Rectifier Corp Double headed lead
US3251015A (en) * 1964-05-20 1966-05-10 Gen Electric Miniature magnetic core and component assemblies
US3254282A (en) * 1963-12-18 1966-05-31 Gen Electric Encapsulated electrical capacitor
US3375774A (en) * 1967-01-05 1968-04-02 Matsushita Electric Ind Co Ltd Fully automatic electric coffee pot
US3390226A (en) * 1964-10-19 1968-06-25 Siemens Ag Encapsulated semiconductor element
US3396315A (en) * 1966-04-06 1968-08-06 M E C Inc Electrolytic capacitor
US3437790A (en) * 1968-05-27 1969-04-08 Texas Instruments Inc Component oven
US3442014A (en) * 1966-03-04 1969-05-06 Carborundum Co Method of stabilizing resistance in semiconductor manufacture
US3504132A (en) * 1965-05-14 1970-03-31 Susquehanna Corp Memory unit for repertory dialler utilizing coded encapsulated resistors
US3517111A (en) * 1968-03-12 1970-06-23 Superior Continental Corp Encapsulated electronic components and method of making same
US3697863A (en) * 1971-01-04 1972-10-10 Texas Instruments Inc Overcurrent protection system and sensor used therewith

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4317265Y1 (enrdf_load_stackoverflow) * 1965-03-05 1968-07-17
JPS431726Y1 (enrdf_load_stackoverflow) * 1965-07-05 1968-01-25

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2829320A (en) * 1955-01-12 1958-04-01 Bell Telephone Labor Inc Encapsulation for electrical components and method of manufacture
US3081374A (en) * 1960-05-27 1963-03-12 Itt Encapsulated diode assembly
US3210701A (en) * 1962-05-14 1965-10-05 Automatic Elect Lab Wound toroidal core shell
US3242393A (en) * 1963-05-24 1966-03-22 Int Rectifier Corp Double headed lead
US3254282A (en) * 1963-12-18 1966-05-31 Gen Electric Encapsulated electrical capacitor
US3214719A (en) * 1964-03-20 1965-10-26 Westinghouse Electric Corp Thermistor device
US3251015A (en) * 1964-05-20 1966-05-10 Gen Electric Miniature magnetic core and component assemblies
US3390226A (en) * 1964-10-19 1968-06-25 Siemens Ag Encapsulated semiconductor element
US3504132A (en) * 1965-05-14 1970-03-31 Susquehanna Corp Memory unit for repertory dialler utilizing coded encapsulated resistors
US3442014A (en) * 1966-03-04 1969-05-06 Carborundum Co Method of stabilizing resistance in semiconductor manufacture
US3396315A (en) * 1966-04-06 1968-08-06 M E C Inc Electrolytic capacitor
US3375774A (en) * 1967-01-05 1968-04-02 Matsushita Electric Ind Co Ltd Fully automatic electric coffee pot
US3517111A (en) * 1968-03-12 1970-06-23 Superior Continental Corp Encapsulated electronic components and method of making same
US3437790A (en) * 1968-05-27 1969-04-08 Texas Instruments Inc Component oven
US3697863A (en) * 1971-01-04 1972-10-10 Texas Instruments Inc Overcurrent protection system and sensor used therewith

Cited By (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4001655A (en) * 1974-01-10 1977-01-04 P. R. Mallory & Co., Inc. Compressible intermediate layer for encapsulated electrical devices
US3940591A (en) * 1974-07-01 1976-02-24 Texas Instruments Incorporated Self-regulating electric heater
US4092487A (en) * 1975-02-11 1978-05-30 Nippondenso Co., Ltd. Resin-sealed electrical device
FR2326103A1 (fr) * 1975-09-23 1977-04-22 Philips Nv Element chauffant autoregulateur
US4104509A (en) * 1975-09-23 1978-08-01 U.S. Philips Corporation Self-regulating heating element
US4039904A (en) * 1976-01-02 1977-08-02 P. R. Mallory & Co., Inc. Intermediate precoat layer of resin material for stabilizing encapsulated electric devices
US4086467A (en) * 1976-07-19 1978-04-25 Texas Instruments Incorporated Electronic heater for high voltage applications
US4091267A (en) * 1976-07-19 1978-05-23 Texas Instruments Incorporated Self-regulating electric heater
US4072848A (en) * 1976-07-22 1978-02-07 Thermon Manufacturing Company Electrical heating cable with temperature self-limiting heating elements
US4206436A (en) * 1976-08-26 1980-06-03 Westinghouse Electric Corp. Electrical apparatus encapsulated with resin coated filler
DE2746342A1 (de) * 1976-10-18 1978-04-27 Rosemount Inc Messfuehler fuer luftwerte und verfahren zu dessen herstellung
US4121088A (en) * 1976-10-18 1978-10-17 Rosemount Inc. Electrically heated air data sensing device
US4210800A (en) * 1977-02-21 1980-07-01 U.S. Philips Corporation Heating element comprising a PTC-resistor body
FR2381434A1 (fr) * 1977-02-21 1978-09-15 Philips Nv Element chauffant comportant un corps de resistance a coefficient de temperature positif
US4178855A (en) * 1978-03-20 1979-12-18 The United States Of America As Represented By The Secretary Of The Navy Explosive actuated arming switch device
US4371778A (en) * 1978-09-15 1983-02-01 Siemens Aktiengesellschaft Electric heating device employing PTC heating element for preheating of heating oil
US4230754A (en) * 1978-11-07 1980-10-28 Sprague Electric Company Bonding electronic component to molded package
US4315237A (en) * 1978-12-01 1982-02-09 Raychem Corporation PTC Devices comprising oxygen barrier layers
US4352008A (en) * 1979-01-26 1982-09-28 Firma Fritz Eichenauer Electric heating device for heating the interior of a switch cabinet
US4426636A (en) 1979-07-23 1984-01-17 Victor Company Of Japan, Limited Method for preventing waveform distortion of a signal passing through an insulated conductor and circuit element embodying the method
US4425497A (en) 1979-08-17 1984-01-10 Raychem Corporation PTC Heater assembly
US4547659A (en) * 1979-08-17 1985-10-15 Raychem Corporation PTC Heater assembly
US4673801A (en) * 1979-08-17 1987-06-16 Raychem Corporation PTC heater assembly
US4541899A (en) * 1979-12-04 1985-09-17 Ngk Insulators, Ltd. Method of heating a solid electrolyte body
EP0067681A1 (en) * 1981-06-15 1982-12-22 RAYCHEM CORPORATION (a California corporation) End seal for conductive polymer devices
US4558510A (en) * 1983-03-31 1985-12-17 Tokyo Shibaura Denki Kabushiki Kaisha Method of producing a semiconductor device
US4823064A (en) * 1987-05-07 1989-04-18 Gte Products Corporation Quick reset motor starting device
US4804805A (en) * 1987-12-21 1989-02-14 Therm-O-Disc, Incorporated Protected solder connection and method
US5057030A (en) * 1990-07-02 1991-10-15 Itt Corporation Grommet/seal member for a connector assembly
US5414241A (en) * 1992-05-11 1995-05-09 Sekisui Kaseihin Kogyo Kabushiki Kaisha Heater, a method of manufacturing the same, and an anti-condensation mirror incorporating the same
US5367282A (en) * 1992-07-21 1994-11-22 Texas Instruments Incorporated Electric motor protector sensor
US5525644A (en) * 1992-09-22 1996-06-11 Simmonds Precision Engine Systems Potted electrical components and methods of making the same
EP0589602A3 (en) * 1992-09-22 1994-07-13 Simmonds Precision Engine Syst Potted electrical components and methods of making the same
US5777541A (en) * 1995-08-07 1998-07-07 U.S. Philips Corporation Multiple element PTC resistor
US5802709A (en) * 1995-08-15 1998-09-08 Bourns, Multifuse (Hong Kong), Ltd. Method for manufacturing surface mount conductive polymer devices
US5849129A (en) * 1995-08-15 1998-12-15 Bourns Multifuse (Hong Kong) Ltd. Continuous process and apparatus for manufacturing conductive polymer components
US5849137A (en) * 1995-08-15 1998-12-15 Bourns Multifuse (Hong Kong) Ltd. Continuous process and apparatus for manufacturing conductive polymer components
US6025556A (en) * 1996-05-20 2000-02-15 Murata Manufacturing Co., Ltd. Electronic components with resin-coated lead terminals
US6380840B1 (en) 1996-05-24 2002-04-30 Heraeus Electro-Nite International N.V. Temperature sensor with measuring resistor
US6020808A (en) * 1997-09-03 2000-02-01 Bourns Multifuse (Hong Kong) Ltd. Multilayer conductive polymer positive temperature coefficent device
US6223423B1 (en) 1997-09-03 2001-05-01 Bourns Multifuse (Hong Kong) Ltd. Multilayer conductive polymer positive temperature coefficient device
US6172591B1 (en) 1998-03-05 2001-01-09 Bourns, Inc. Multilayer conductive polymer device and method of manufacturing same
US6236302B1 (en) 1998-03-05 2001-05-22 Bourns, Inc. Multilayer conductive polymer device and method of manufacturing same
US6242997B1 (en) 1998-03-05 2001-06-05 Bourns, Inc. Conductive polymer device and method of manufacturing same
US6228287B1 (en) 1998-09-25 2001-05-08 Bourns, Inc. Two-step process for preparing positive temperature coefficient polymer materials
US6429533B1 (en) 1999-11-23 2002-08-06 Bourns Inc. Conductive polymer device and method of manufacturing same
WO2001091138A1 (de) * 2000-05-26 2001-11-29 Epcos Ag Elektrisches bauelement und verfahren zu dessen herstellung
US20070040646A1 (en) * 2000-08-30 2007-02-22 Epcos Ag Electrical component and method for the manufacture thereof
US7145430B2 (en) 2000-08-30 2006-12-05 Epcos Ag Electrical component and method for making the component
US20040026106A1 (en) * 2000-08-30 2004-02-12 Roland Peinsipp Electrical component and method for production thereof
US7430797B2 (en) * 2000-08-30 2008-10-07 Epcos Ag Method for making an electrical component
US20040090303A1 (en) * 2000-12-14 2004-05-13 Harald Schopf Electrical component and method for producing the same
US6933829B2 (en) 2000-12-14 2005-08-23 Epcos Ag Electrical component having a protective layer
WO2002049047A3 (de) * 2000-12-14 2003-05-08 Epcos Ag Elektrisches bauelement und verfahren zu dessen herstellung
EP1666286A1 (en) * 2004-12-02 2006-06-07 Delphi Technologies Inc. Heating device
EP1681686A1 (en) * 2005-01-12 2006-07-19 LS Cable Ltd. PTC current limiting device having molding part made of insulating material
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Also Published As

Publication number Publication date
NL7313514A (enrdf_load_stackoverflow) 1974-04-26
JPS5834716Y2 (ja) 1983-08-04
DK147415C (da) 1985-02-04
DE2351956C2 (de) 1982-12-30
JPS5652887U (enrdf_load_stackoverflow) 1981-05-09
DK147415B (da) 1984-07-23
DE2351956A1 (de) 1974-04-25
JPS547057B2 (enrdf_load_stackoverflow) 1979-04-03
JPS4976134A (enrdf_load_stackoverflow) 1974-07-23

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