US3603039A - Method of and apparatus for machining articles - Google Patents

Method of and apparatus for machining articles Download PDF

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Publication number
US3603039A
US3603039A US829961A US3603039DA US3603039A US 3603039 A US3603039 A US 3603039A US 829961 A US829961 A US 829961A US 3603039D A US3603039D A US 3603039DA US 3603039 A US3603039 A US 3603039A
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United States
Prior art keywords
tool
abrasive
wafer
article
circular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US829961A
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English (en)
Inventor
Donald F Stahr
Rudolph M Yandrick
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FMC Corp
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FMC Corp
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Publication date
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02021—Edge treatment, chamfering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/02—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work
    • B24B5/14—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding conical surfaces, e.g. of centres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Definitions

  • a beveled edge is formed on a very thin, cylindrical silicon wafer by depositing a quantity of diamond lapping material on the upper peripheral edge portion of the wafer and bringing a rotating, hard steel tool down into engagement with the edge portion of the wafer, the tool having a water-engaging face which is beveled at the desired angle.
  • beveling of silicon is usually accomplished by means of the use of a stream of air-blasted abrasive, by grinding with diamond tools, or by cutting with an electric discharge machine.
  • a stream of air-blasted abrasive by grinding with diamond tools, or by cutting with an electric discharge machine.
  • Each of these methods have detrimental aspects such as rough, nonuniform surface, poor reproducibility, pitting or tearing of the silicon or exorbitant cost.
  • Another object is to provide an improved method of beveling silicon wafers by means of inexpensive tools, materials and machinery.
  • a further object is to provide a simple efficient mechanism for forming predetermined contours on relatively hard surfaces such as the surface of a silicon wafer.
  • the present invention provides a method and apparatus for forming a desired contour on a relatively hard piece of material, such as a thin cylindrical silicon wafer, by securing the wafer to a flat support; depositing a small amount of a diamond lapping material on the peripheral upper surface of the wafer; bringing a hard steel tool, that has a beveled lower surface, down onto the wafer with a light pressure so that the beveled lower surface of the tool engages the peripheral surface of the wafer; and rotating the tool, as it is moved into engagement with the wafer, at a speed in the range of approximately 2,500 to 5,000 r.p.m.
  • FIG. 1 is a diagrammatic side elevation of apparatus for carrying out the method of the present invention.
  • FIG. 2 is a diagrammatic perspective of a portion of the mechanism of FIG. 1 and particularly showing a silicon wafer before its edge has been beveled.
  • FIG. 3 is a fragmentary diagrammatic side elevation of a portion of the mechanism of FIG. I, particularly showing a circular silicon wafer, the upper peripheral edge of which has already been beveled.
  • FIG. 4 is an enlarged vertical section taken along a diameter of the circular silicon wafer and of the generally cylindrical wafer-engaging tool, showing the tool in operative engage ment with the wafer and the material disposed between the tool and the wafer.
  • FIG. 1 the reference numeral indicates a machine tool of the drill press type wherein a rigid post 12 projects upwardly from a rigid base 14.
  • a support arm 16 has one end 16a slidably disposed on the post 12 and, at its other end 16b, the arm 16 rotatably supports a vertical spindle 18.
  • An electric motor 20, which is mounted on support arm 16, is in driving engagement with a reduced diameter portion 18a of the spindle 18 through a belt and pulley drive 21.
  • the support arm 16 is connected by a rigid member 23 to a collar 24 which extends around the post 12 and is connected thereto by an elevating mechanism 25 which includes a handle 26 and a rack and pinion mechanism (not shown) which is disposed in the collar 24 and is operatively connected between the handle and the post 12 to cause the collar and the connected support arm 16 to be lowered when the handle is rotated clockwise about the pivot axis X from the FIG. I position.
  • an elevating mechanism 25 which includes a handle 26 and a rack and pinion mechanism (not shown) which is disposed in the collar 24 and is operatively connected between the handle and the post 12 to cause the collar and the connected support arm 16 to be lowered when the handle is rotated clockwise about the pivot axis X from the FIG. I position.
  • a beveling tool head 30, which is made of hard tool steel and is removably mounted in a chuck 32 carried by the spindle 18, has a recessed lower surface which is defined by a frustoconical wall 34.
  • the wall is tapered inwardly at an angle Y which is 6 or less and it is this angle that determines the angle that will be formed on the peripheral edge of the circular silicon wafer.
  • a circular silicon wafer W is attached in face-to-face contact with the flat upper surface of a rigid support plate 40 which may be made of steel or aluminum.
  • the attachment of the wafer to plate 40 is made by melting a quantity of low-melting wax on the plate 40, placing the wafer W on the wax in a predetermined location on the plate, and allowing the wax to cool.
  • the plate is then mounted by means of an alignment jig in a predetermined position on the base so that the peripheral edge of the wafer W is directly below the beveled wall 34 of the tool head 30.
  • a ribbon of diamond lapping material M is placed on the upper surface of the wafer adjacent to the outer peripheral edge.
  • the motor 20 is energized to rotate the head 30, and the handle 26 is swung clockwise to lower the head into engagement with the wafer.
  • One form of diamond lapping material that has been found to be satisfactory for beveling silicon wafers with the apparatus of the present invention is marketed by Kay Industrial Diamond Co. of Brooklyn, N.Y. under the designation of Kay Industrial Diamond 015 NBS-natural diamond8.22 micron grit size.
  • the abrasive material is prepared as an oily paste and supplied in a tube or syringe so that a ribbon of the material can be disposed on the surface to be beveled.
  • the tool head is brought into contact with the wafer under a light pressure that is sufficient to maintain a constant contact with the wafer.
  • the peripheral edge of the wafer is brought to a beveled configuration that corresponds substantially to the configuration of the wall 34 of the head 30 as indicated in FIG. 4.
  • the inner diametral dimension D (FIG. 3) of the finished wafer is known.
  • a surface gauge in the form of a cylindrical block having a diameter equal to the dimension D may be used to check the wafer. This checking is accomplished by placing the gauge on top of the wafer and comparing visually the dimension D and the diameter of the gauge. A final check can be made more precise measuring instruments. While a complete beveling operation may be accomplished by a single application of the rotating head to the wafer, a series of applications may be necessary.
  • the tool head 30, the wafer W, and the support plate 40 are wiped off with a sheet of paper to which the diamond lapping material will cling.
  • the sheets are burned and the residue from the burning is collected. From this residue diamond abrasive material is separated and it has been found that approximately percent of the original diamond material can be recovered. This recovery of the material makes the beveling operation of the present invention relatively inexpensive.
  • the wafer is mounted in a fixed predetermined position on the support 14 so that the tool will engage its peripheral portion.
  • the means for locating the circular wafer relative to the support could be a guide circle inscribed on the support 14 directly under the tool. It will be recognized that the dull-press-type structure disclosed is particularly adapted for controlling the pressure that is applied to the wafer since it is hand operated.
  • angle of bevel should not exceed 6 for silicon wafers having a thickness up to 0.015 inch, it is contemplated that greater angles can be formed on other types of articles such as articles that are thicker or are of a different material.
  • the present invention provides a simple, inexpensive method and apparatus for producing a bevel of predetermined angle on a silicon wafer, Further, it is evident that while the use of lapping material and a rotating pressure-applying tool have been used for polishing flat metal surfaces, the present invention embodies the first use of such apparatus and material for changing the configuration of an object from one geometric shape to another.
  • a method of forming a bevel on the peripheral edge of a circular article comprising the steps of mounting the article in fixed position; disposing a quantity of abrasive material on the surface extending around the periphery of the article where the bevel is to be formed; and engaging the abrasive with a rapidly moving circular tool surface, which has a configuration the reverse of the desired configuration and which is rotating about its own axis; to force the abrasive into contact with the surface of the article until the desired configuration is formed on the article surface.
  • a support for securing the article in fixed position on said support, a rotary tool mounted adjacent said support, means defining a circular inclined contact surface on said tool, said surface being generated about the axis of rotation of said tool, an abrasive adapted to be disposed on the peripheral edge portion to be beveled, means for moving said inclined contact surface into engagement with the abrasive on the article to force the abrasive into pressurized contact with said peripheral edge portion, and means for rotating said tool while said contact surface is in pressure engagement with the abrasive.
  • a support for securing the wafer on said support in fixed position, a tool having a lower circular contact surface that is beveled with an orientation reversed relative to the orientation of the bevel to be formed on the wafer, means mounting said tool above said support with the beveled surface of the tool aligned with the eripheral portion of the wafer, and with the axis of the circuar contact surface of said tool being in substantial alignment with the axis of the circular wafer, means for rotating said tool about its axis, a diamond abrasive adapted to be disposed on the peripheral portion of the wafer facing the circular tool surface, and means for moving said rotating tool surface downwardly into engagement with the abrasive on the wafer to press the abrasive into abrading contact with the wafer.
  • said means for rotating said tool includes means for maintaining the speed of said tool in the range of from approximately 2,500 r.p.m. to approximately 5,000 r.p.m.
  • a method of forming a surface of desired configuration on an article comprising the steps of mounting the article in fixed position; disposing a quantity of diamond lapping material with a pastelike consistency on the surface to be worked; engaging the abrasive with a rapidly moving tool surface having a configuration that is substantially the reverse of the desired configuration to force the abrasive into contact with the surface of the article; maintaining the pressure of said tool surface against said abrasive until the desired configuration is formed on the article surface; wiping the abrasive material from the tool surface, the workpiece and associated fixtures by means of an inflammable wiper member; and burning the wiper member to provide a residue from which diamond material may be separated.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
US829961A 1969-06-03 1969-06-03 Method of and apparatus for machining articles Expired - Lifetime US3603039A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US82996169A 1969-06-03 1969-06-03

Publications (1)

Publication Number Publication Date
US3603039A true US3603039A (en) 1971-09-07

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US829961A Expired - Lifetime US3603039A (en) 1969-06-03 1969-06-03 Method of and apparatus for machining articles

Country Status (5)

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US (1) US3603039A (enrdf_load_stackoverflow)
CA (1) CA922110A (enrdf_load_stackoverflow)
DE (2) DE7017942U (enrdf_load_stackoverflow)
ES (1) ES379540A1 (enrdf_load_stackoverflow)
GB (1) GB1258697A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3803774A (en) * 1972-12-22 1974-04-16 Bell Telephone Labor Inc Technique for correcting the crystallo-graphic orientation angle of crystals by the formation of mesas and double face lapping
US3805458A (en) * 1972-12-22 1974-04-23 Bell Telephone Labor Inc Technique for correcting the crystallographic orientation angle of crystals by double face lapping of overlapping layers
US9044812B2 (en) 2011-08-03 2015-06-02 General Electric Company Jig and method for modifying casing in turbine system

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105150088A (zh) * 2015-08-28 2015-12-16 中国空间技术研究院 一种电子器件背面开孔减薄装置及减薄方法
CN112382706B (zh) * 2020-11-13 2021-06-11 吴炜强 一种用于半导体发光元件的加工设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1048059A (en) * 1910-09-07 1912-12-24 Antonio Foppiano Machine for cutting holes in glass, marble, and like material.
US1241236A (en) * 1915-06-08 1917-09-25 Maurice Mathy Machine for grinding the rims of glass vessels.
US2395700A (en) * 1943-03-23 1946-02-26 Alncin Inc Method and apparatus for shaping optical objects and the like
US3158968A (en) * 1962-08-23 1964-12-01 Bell Telephone Labor Inc Grinding apparatus and method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1048059A (en) * 1910-09-07 1912-12-24 Antonio Foppiano Machine for cutting holes in glass, marble, and like material.
US1241236A (en) * 1915-06-08 1917-09-25 Maurice Mathy Machine for grinding the rims of glass vessels.
US2395700A (en) * 1943-03-23 1946-02-26 Alncin Inc Method and apparatus for shaping optical objects and the like
US3158968A (en) * 1962-08-23 1964-12-01 Bell Telephone Labor Inc Grinding apparatus and method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3803774A (en) * 1972-12-22 1974-04-16 Bell Telephone Labor Inc Technique for correcting the crystallo-graphic orientation angle of crystals by the formation of mesas and double face lapping
US3805458A (en) * 1972-12-22 1974-04-23 Bell Telephone Labor Inc Technique for correcting the crystallographic orientation angle of crystals by double face lapping of overlapping layers
US9044812B2 (en) 2011-08-03 2015-06-02 General Electric Company Jig and method for modifying casing in turbine system

Also Published As

Publication number Publication date
CA922110A (en) 1973-03-06
DE2023439A1 (de) 1970-12-17
DE7017942U (de) 1973-04-26
GB1258697A (enrdf_load_stackoverflow) 1971-12-30
ES379540A1 (es) 1973-04-01

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