US2905601A - Electroplating bright gold - Google Patents
Electroplating bright gold Download PDFInfo
- Publication number
- US2905601A US2905601A US677818A US67781857A US2905601A US 2905601 A US2905601 A US 2905601A US 677818 A US677818 A US 677818A US 67781857 A US67781857 A US 67781857A US 2905601 A US2905601 A US 2905601A
- Authority
- US
- United States
- Prior art keywords
- gold
- liter
- bath
- base metal
- cyanide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
Definitions
- acids which may be employed are formic, acetic, citric, tartaric, lactic, kojic, or similar acidsandl mixtures of these acids.
- the acid should be present in proportions of about 10 to 150 grams per liter and may be partially neutralized with ammonium or alkali hydroxide to give a pH of about 3-5. It is this weak organic acid and the procedure of maintaining the bath within a limited pH range that produces the desired eifect of a gold alloy deposition.
- the gold may be added as the double cyanide of gold and an alkali metal, potassium gold cyanide for example, and may be present in proportions of about 1 gram per liter to 15 grams per liter of gold.
- Base metal salts which may be added comprise the sulfates, sulfamates, formates, acetates, citrates, lactates, tartrates, fluoborate-s, borates, phosphates, etc., of nickel, zinc, cobalt, indium, iron, manganese, antimony, copper, etc. These metal salts are added in the proportion of from 1 to 50 grams per liter. Very satisfactory results are obtained when two of such base metal salts are included in the bath. Although the addition of base metal salt is necessary, it does not matter which salt or mixture of salts is added as long as the added salts are soluble and. compatible with all other bath ingredients.
- the bath may be operated at a current density of l to 100 amperes per square foot. Moderate to rapid agita-- tion improves the operation.
- the bath may be operatedv at normal room temperature (70 F.) which is advanta-- geous in that no themostatic regulation is necessary but: higher or lower temperatures of from 50 to 120 F.. may be employed.
- the maximum cathode/anode ratio should be about 4:1.
- the deposits obtained have a pale yellow color of pure gold, but depending upon which base metal is added the deposit may have a greenish or yellow-orange tinge.
- The: gold deposits are from about 21 to 23 karat gold.
- Citric acid plus sodium citrate Gold (as potassium gold cyanide) t 8 Nickel (as nickel sulfamate) 3 Zinc (as zinc acetate) 0.5 Water Remainder
- The. amount of sodium citrate is adjusted by adding it until the bath has a pH of 4 to 5.
- a clean and polished steel or other metal body is made the cathode in said bath, at a current density of 10 amperes per square foot, while the bath is maintained at a temperature of about 70 F.
- the deposit obtained from this bath is hard, corrosionresistant with a uniform, br'lliant, pale yellow-green coloration.
- the gold deposits assay 23 karat gold. Deposits of thicknesses of 25 to 50 microns are readily obtained from this bath.
- Example 2 An electrolytic bath is made by dissolving the following components:
- Example 3 An electrolytic bath is made by dissolving the following components:
- Citric acid and sodium citrate 80 Gold (as potassium gold cyanide) 8 Indium (as sulfate) 5 Water Remainder The pH of the bath is adjusted to 3-4 by addition of more acid or alkali.
- the deposit obtained from this bath under conditions such as specified in Example 1 is hard, corrosion-resistant, and uniformly pale yellow in color. The fineness of the deposit is 21 karat.
- tartaric acid, lactic acid, kojic acid, formic acid or similar organic acids may be substituted for the acetic or citric acid specified.
- Such baths are brought to the proper pH by the addition of an alkali or the acid in use.
- a method of electrodepositing bright gold which comprises electrolyzing a solution consisting of 10-150 g./liter of a weak, stable, organic acid, partially neutralized with alkali to provide a pH of 3-5, 1-15 g./liter of gold added as a gold cyanide, and 1-50 g./liter of at least one soluble base metal salt.
- a method as claimedinclaim 1 in which said base metal salt comprises a mixture of a cobaltsalt and an acid partially neutraliaed with alkalito provide a pH of 3-5, 1-15 g./liter of gold added as a gold cyanide and l-SOgI/litr bf at least one soluble base metal salt.
- An electrol yte for depositing bright gold coatings 'witli agreenish tinge consisting of about 80 g./liter of citrate radical neutralized with alkali to proyide apH of 4-5, about 1-15 g./liter of gold as potassium gold cyanide, about 3 g./ liter of nickel as nickel snlfamate, and
- electrolyte for depositing bright pale yellow gold coatings consisting of about 50 g./liter of weak organic acid radical partially neutralized with alkali to provide a pH of 3-4, 1-15 g./ liter of gold as cyanide gold, about 5 g./ liter of indium as indium sulfate, and about 3 g./ liter of cobalt as cobalt sulfate.
- a method of electrodepositing bright gold which comprises electrolyzing a solution consisting of -150 g./ liter of citricacid, partially neutralized with alkali to provide a pH of 3-5, 1-15 g./liter of gold added as a gold cyanide, and 1-50 g./liter of at least onesoluble base'metal salt.
- a method of electrodepositing bright gold which comprises electrolyzing a solution consisting of 10-150 g./liter of acetic' acid, partially neutralized with alkali to provide a pH of 3-5, 1-15 g./liter of gold added as a gold cyanide, and 1-50 g./ liter of at least one soluble base metal salt.
- An electrolyte for depositing bright gold coatings consisting of 10-150 g./literof citric acid partially neutralized with alkali to provide a pH of 3-5, 1-15 g./liter of gold added as a gold cyanide and 1-50 g./ liter of at least one soluble base metal salt.
- An electrolyte for depositing bright gold coatings consisting of 10-150 g./liter of acetic acid partially neutralized with alkali to provide a pH of 3-5, l-l5 g./liter of gold added as a gold cyanide and 1-50 g./1iter of at least one soluble base metal salt.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL230397D NL230397A (no) | 1957-08-13 | ||
NL112916D NL112916C (no) | 1957-08-13 | ||
BE570261D BE570261A (no) | 1957-08-13 | ||
US677818A US2905601A (en) | 1957-08-13 | 1957-08-13 | Electroplating bright gold |
FR1201185D FR1201185A (fr) | 1957-08-13 | 1958-08-07 | Procédé de galvanoplastie en or vif |
CH6272358A CH384972A (de) | 1957-08-13 | 1958-08-08 | Verfahren zum elektrolytischen Aufbringen eines glänzenden Überzuges aus Gold oder einer Goldlegierung |
DES59365A DE1111897B (de) | 1957-08-13 | 1958-08-08 | Bad zum galvanischen Abscheiden glaenzender Goldlegierungsueberzuege |
GB25764/58A GB851973A (en) | 1957-08-13 | 1958-08-11 | Electroplating bright gold |
CH1207160A CH445246A (de) | 1957-08-13 | 1960-10-28 | Verfahren zum elektrolytischen Aufbringen eines glänzenden Überzuges aus Gold oder einer Goldlegierung |
DE19611446043 DE1446043C3 (de) | 1960-07-26 | 1961-06-19 | Bad für galvanische Abscheidung von Goldlegierungen |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US677818A US2905601A (en) | 1957-08-13 | 1957-08-13 | Electroplating bright gold |
Publications (1)
Publication Number | Publication Date |
---|---|
US2905601A true US2905601A (en) | 1959-09-22 |
Family
ID=24720236
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US677818A Expired - Lifetime US2905601A (en) | 1957-08-13 | 1957-08-13 | Electroplating bright gold |
Country Status (6)
Country | Link |
---|---|
US (1) | US2905601A (no) |
BE (1) | BE570261A (no) |
CH (1) | CH384972A (no) |
FR (1) | FR1201185A (no) |
GB (1) | GB851973A (no) |
NL (2) | NL112916C (no) |
Cited By (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2967135A (en) * | 1960-06-08 | 1961-01-03 | Barnet D Ostrow | Electroplating baths for hard bright gold deposits |
US3104212A (en) * | 1959-05-21 | 1963-09-17 | Sel Rex Corp | Electroplating smooth ductile gold |
US3149058A (en) * | 1959-12-31 | 1964-09-15 | Technic | Bright gold plating process |
US3149057A (en) * | 1959-04-27 | 1964-09-15 | Technic | Acid gold plating |
US3244603A (en) * | 1962-06-08 | 1966-04-05 | Gen Electric | Electrodeposition of a nickel-manganese alloy |
DE1218248B (de) * | 1961-05-01 | 1966-06-02 | Sel Rex Corp | Saures galvanisches Goldbad fuer hochkaraetige Goldueberzuege |
US3254992A (en) * | 1962-11-08 | 1966-06-07 | Garde Mfg Company | Electrically conductive alloy |
US3373094A (en) * | 1964-08-26 | 1968-03-12 | Sel Rex Corp | Gold and gold alloy electroplating |
US3380898A (en) * | 1965-06-18 | 1968-04-30 | Sel Rex Corp | Electrolyte and method for electrodepositing a pink gold alloy |
US3380814A (en) * | 1965-06-18 | 1968-04-30 | Sel Rex Corp | Electrolyte and method for coating articles with a gold-copper-antimony alloy and article thereof |
US3397127A (en) * | 1965-04-12 | 1968-08-13 | American Chem & Refining Co | Method and bath for electroplating gold |
US3475290A (en) * | 1965-05-07 | 1969-10-28 | Suwa Seikosha Kk | Bright gold plating solution and process |
US3475292A (en) * | 1966-02-10 | 1969-10-28 | Technic | Gold plating bath and process |
US3893896A (en) * | 1973-07-02 | 1975-07-08 | Handy & Harman | Gold plating bath and process |
US3926748A (en) * | 1974-06-28 | 1975-12-16 | Amp Inc | Electrodeposition of gold-antimony alloys and compositions therefor |
US3929595A (en) * | 1973-11-07 | 1975-12-30 | Degussa | Electrolytic burnished gold bath with higher rate of deposition |
US3978302A (en) * | 1973-09-21 | 1976-08-31 | U.S. Philips Corporation | Switching element having gold-cobalt contacts |
DE2831756A1 (de) * | 1977-07-20 | 1979-02-01 | Technic | Cobalt- und nickelorganophosphonate als glanzbildner fuer die elektroplattierung |
DE3244092A1 (de) * | 1981-12-14 | 1983-06-23 | American Chemical & Refining Co., Inc., 06720 Waterbury, Conn. | Waessriges bad zur galvanischen abscheidung von gold und verfahren zur galvanischen abscheidung von hartgold unter seiner verwendung |
US4411965A (en) * | 1980-10-31 | 1983-10-25 | Occidental Chemical Corporation | Process for high speed nickel and gold electroplate system and article having improved corrosion resistance |
US4465564A (en) * | 1983-06-27 | 1984-08-14 | American Chemical & Refining Company, Inc. | Gold plating bath containing tartrate and carbonate salts |
US4670107A (en) * | 1986-03-05 | 1987-06-02 | Vanguard Research Associates, Inc. | Electrolyte solution and process for high speed gold plating |
US5575900A (en) * | 1995-07-03 | 1996-11-19 | Antelman Technologies Ltd. | Gold plating solutions |
US20080217181A1 (en) * | 2006-05-09 | 2008-09-11 | Interuniversitair Microelektronica Centrum (Imec) | Free standing single-crystal nanowire growth by electro-chemical deposition |
US20110127168A1 (en) * | 2008-08-25 | 2011-06-02 | Rie Kikuchi | Hard gold-based plating solution |
EP2458036A2 (en) | 2010-11-25 | 2012-05-30 | Rohm and Haas Electronic Materials LLC | Gold plating solution |
US20180209058A1 (en) * | 2017-01-23 | 2018-07-26 | Nitto Denko Corporation | Producing method of wired circuit board |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1065308A (en) * | 1965-10-19 | 1967-04-12 | Fred I Nobel | Improvements in electrodeposition of gold alloys |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2501737A (en) * | 1946-09-11 | 1950-03-28 | Jr Ralph W Porter | Solution for plating metals with gold |
US2724687A (en) * | 1952-05-08 | 1955-11-22 | Spreter Victor | Baths for the deposit of gold alloys by electroplating |
US2754258A (en) * | 1951-02-07 | 1956-07-10 | Platers Res Corp | Gold alloy plating |
US2765269A (en) * | 1954-11-19 | 1956-10-02 | Barnet D Ostrow | Bath for plating bright gold |
-
0
- NL NL230397D patent/NL230397A/xx unknown
- BE BE570261D patent/BE570261A/xx unknown
- NL NL112916D patent/NL112916C/xx active
-
1957
- 1957-08-13 US US677818A patent/US2905601A/en not_active Expired - Lifetime
-
1958
- 1958-08-07 FR FR1201185D patent/FR1201185A/fr not_active Expired
- 1958-08-08 CH CH6272358A patent/CH384972A/de unknown
- 1958-08-11 GB GB25764/58A patent/GB851973A/en not_active Expired
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2501737A (en) * | 1946-09-11 | 1950-03-28 | Jr Ralph W Porter | Solution for plating metals with gold |
US2754258A (en) * | 1951-02-07 | 1956-07-10 | Platers Res Corp | Gold alloy plating |
US2724687A (en) * | 1952-05-08 | 1955-11-22 | Spreter Victor | Baths for the deposit of gold alloys by electroplating |
US2765269A (en) * | 1954-11-19 | 1956-10-02 | Barnet D Ostrow | Bath for plating bright gold |
Cited By (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3149057A (en) * | 1959-04-27 | 1964-09-15 | Technic | Acid gold plating |
US3104212A (en) * | 1959-05-21 | 1963-09-17 | Sel Rex Corp | Electroplating smooth ductile gold |
US3149058A (en) * | 1959-12-31 | 1964-09-15 | Technic | Bright gold plating process |
US2967135A (en) * | 1960-06-08 | 1961-01-03 | Barnet D Ostrow | Electroplating baths for hard bright gold deposits |
DE1218248B (de) * | 1961-05-01 | 1966-06-02 | Sel Rex Corp | Saures galvanisches Goldbad fuer hochkaraetige Goldueberzuege |
DE1222347B (de) * | 1961-05-01 | 1966-08-04 | Sel Rex Corp | Vergoldungsbad |
US3244603A (en) * | 1962-06-08 | 1966-04-05 | Gen Electric | Electrodeposition of a nickel-manganese alloy |
US3254992A (en) * | 1962-11-08 | 1966-06-07 | Garde Mfg Company | Electrically conductive alloy |
US3373094A (en) * | 1964-08-26 | 1968-03-12 | Sel Rex Corp | Gold and gold alloy electroplating |
US3397127A (en) * | 1965-04-12 | 1968-08-13 | American Chem & Refining Co | Method and bath for electroplating gold |
US3475290A (en) * | 1965-05-07 | 1969-10-28 | Suwa Seikosha Kk | Bright gold plating solution and process |
US3380898A (en) * | 1965-06-18 | 1968-04-30 | Sel Rex Corp | Electrolyte and method for electrodepositing a pink gold alloy |
US3380814A (en) * | 1965-06-18 | 1968-04-30 | Sel Rex Corp | Electrolyte and method for coating articles with a gold-copper-antimony alloy and article thereof |
US3475292A (en) * | 1966-02-10 | 1969-10-28 | Technic | Gold plating bath and process |
US3893896A (en) * | 1973-07-02 | 1975-07-08 | Handy & Harman | Gold plating bath and process |
US3978302A (en) * | 1973-09-21 | 1976-08-31 | U.S. Philips Corporation | Switching element having gold-cobalt contacts |
US3929595A (en) * | 1973-11-07 | 1975-12-30 | Degussa | Electrolytic burnished gold bath with higher rate of deposition |
US3926748A (en) * | 1974-06-28 | 1975-12-16 | Amp Inc | Electrodeposition of gold-antimony alloys and compositions therefor |
DE2831756A1 (de) * | 1977-07-20 | 1979-02-01 | Technic | Cobalt- und nickelorganophosphonate als glanzbildner fuer die elektroplattierung |
US4411965A (en) * | 1980-10-31 | 1983-10-25 | Occidental Chemical Corporation | Process for high speed nickel and gold electroplate system and article having improved corrosion resistance |
DE3244092A1 (de) * | 1981-12-14 | 1983-06-23 | American Chemical & Refining Co., Inc., 06720 Waterbury, Conn. | Waessriges bad zur galvanischen abscheidung von gold und verfahren zur galvanischen abscheidung von hartgold unter seiner verwendung |
US4396471A (en) * | 1981-12-14 | 1983-08-02 | American Chemical & Refining Company, Inc. | Gold plating bath and method using maleic anhydride polymer chelate |
US4465564A (en) * | 1983-06-27 | 1984-08-14 | American Chemical & Refining Company, Inc. | Gold plating bath containing tartrate and carbonate salts |
US4670107A (en) * | 1986-03-05 | 1987-06-02 | Vanguard Research Associates, Inc. | Electrolyte solution and process for high speed gold plating |
US5575900A (en) * | 1995-07-03 | 1996-11-19 | Antelman Technologies Ltd. | Gold plating solutions |
US20080217181A1 (en) * | 2006-05-09 | 2008-09-11 | Interuniversitair Microelektronica Centrum (Imec) | Free standing single-crystal nanowire growth by electro-chemical deposition |
US7947162B2 (en) * | 2006-05-09 | 2011-05-24 | Imec | Free standing single-crystal nanowire growth by electro-chemical deposition |
US20110127168A1 (en) * | 2008-08-25 | 2011-06-02 | Rie Kikuchi | Hard gold-based plating solution |
EP2458036A2 (en) | 2010-11-25 | 2012-05-30 | Rohm and Haas Electronic Materials LLC | Gold plating solution |
US20180209058A1 (en) * | 2017-01-23 | 2018-07-26 | Nitto Denko Corporation | Producing method of wired circuit board |
JP2018119211A (ja) * | 2017-01-23 | 2018-08-02 | 日東電工株式会社 | 配線回路基板の製造方法 |
US11091850B2 (en) * | 2017-01-23 | 2021-08-17 | Nitto Denko Corporation | Producing method of wired circuit board |
Also Published As
Publication number | Publication date |
---|---|
BE570261A (no) | |
GB851973A (en) | 1960-10-19 |
NL230397A (no) | |
FR1201185A (fr) | 1959-12-29 |
CH384972A (de) | 1965-02-26 |
NL112916C (no) |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: OXY METAL INDUSTRIES CORPORATION Free format text: CHANGE OF NAME;ASSIGNOR:OXY METAL FINISHING CORPORATION;REEL/FRAME:003967/0084 Effective date: 19741220 |
|
AS | Assignment |
Owner name: HOOKER CHEMICALS & PLASTICS CORP. Free format text: MERGER;ASSIGNOR:OXY METAL INDUSTRIES CORPORATION;REEL/FRAME:004075/0885 Effective date: 19801222 |
|
AS | Assignment |
Owner name: OCCIDENTAL CHEMICAL CORPORATION Free format text: CHANGE OF NAME;ASSIGNOR:HOOKER CHEMICAS & PLASTICS CORP.;REEL/FRAME:004126/0054 Effective date: 19820330 |