US20210222007A1 - Polyamide resin film and resin laminate using the same - Google Patents

Polyamide resin film and resin laminate using the same Download PDF

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US20210222007A1
US20210222007A1 US17/256,055 US201917256055A US2021222007A1 US 20210222007 A1 US20210222007 A1 US 20210222007A1 US 201917256055 A US201917256055 A US 201917256055A US 2021222007 A1 US2021222007 A1 US 2021222007A1
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polyamide resin
chemical formula
repeating unit
resin film
mol
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Il Hwan Choi
Young Ji Tae
Soonyong PARK
Youngseok Park
Bi Oh RYU
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LG Chem Ltd
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LG Chem Ltd
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Priority claimed from KR1020190173086A external-priority patent/KR20200096107A/ko
Priority claimed from KR1020190174355A external-priority patent/KR20200096111A/ko
Application filed by LG Chem Ltd filed Critical LG Chem Ltd
Assigned to LG CHEM, LTD. reassignment LG CHEM, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHOI, IL HWAN, PARK, Soonyong, PARK, YOUNGSEOK, RYU, BI OH, TAE, YOUNG JI
Publication of US20210222007A1 publication Critical patent/US20210222007A1/en
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/42—Polyamides containing atoms other than carbon, hydrogen, oxygen, and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/0427—Coating with only one layer of a composition containing a polymer binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/046—Forming abrasion-resistant coatings; Forming surface-hardening coatings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C08K5/3475—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/03—3 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/71—Resistive to light or to UV
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
    • C08J2377/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2433/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
    • C08J2433/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
    • C08J2433/06—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/10—Transparent films; Clear coatings; Transparent materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

Definitions

  • the present invention relates to a polyamide resin film that can secure at least an adequate level of mechanical properties and excellent transparency while improving the UV shielding function and a resin laminate using the same.
  • Aromatic polyimide resins are polymers mostly having an amorphous structure, and exhibits excellent heat resistance, chemical resistance, electrical properties, and dimensional stability due to their rigid chain structure. Thus, these polyimide resins are widely used as materials for electric/electronics.
  • the polyimide resins have many limitations in their use because they may appear dark brown in color due to charge transfer complex (CTC) formation of Pi-electrons present in the imide chain, and it is difficult to secure transparency.
  • CTC charge transfer complex
  • the polyimide film including the same it has a drawback in that the surface is easily scratched and scratch resistance is very weak.
  • amide repeating units derived from terephthaloyl chloride and amide repeating units derived from isophthaloyl chloride do not form a block, and are hardly polymerized ideally or alternatively.
  • the monomers used for the synthesis of the polyamide resin perform the polymerization reaction in a state dissolved in a solvent, the molecular weight of the finally synthesized polyamide resin is difficult to be ensured to a sufficient level due to deterioration by moisture or hybridization with a solvent.
  • the present invention provides a polyamide resin film that can secure at least an adequate level of mechanical properties and excellent transparency while improving the UV shielding function.
  • the present invention provides a resin laminate using the aforementioned polyamide resin film.
  • one aspect of the present invention provides a polyamide resin film including: a polyamide resin containing a backbone chain formed by alternative bonding of a first polyamide segment containing a first aromatic amide repeating unit, and a second polyamide segment containing a second aromatic amide repeating unit having a structure different from the first aromatic amide repeating unit, wherein a transmittance of ultraviolet light with a wavelength of 388 nm for a specimen having a thickness of 45 ⁇ m or more and 55 ⁇ m or less is 15% or less, and wherein a UV-cut slope (dT/d ⁇ ) measured for a specimen having a thickness of 45 ⁇ m or more and 55 ⁇ m or less according to ASTM E424 is (12.5 or more in the range of 10% to 80% transmittance.
  • Another aspect of the present invention provides a resin laminate including a substrate including the polyamide resin film; and a hard coating layer formed on at least one side of the substrate.
  • substituted means that other functional groups instead of a hydrogen atom in the compound are bonded, and a position to be substituted is not limited as long as the position is a position at which the hydrogen atom is substituted, that is, a position at which the substituent can be substituted, and when two or more are substituted, the two or more substituents may be the same as or different from each other.
  • substituted or unsubstituted means being unsubstituted or substituted with one or more substituents selected from the group consisting of deuterium; a halogen group; a cyano group; a nitro group; a hydroxyl group; a carbonyl group; an ester group; an imide group; an amide group; a primary amino group; a carboxy group; a sulfonic acid group; a sulfonamide group; a phosphine oxide group; an alkoxy group; an aryloxy group; art alkylthioxy group; an arylthioxy group; an alkylsulfoxy group; an arylsulfoxy group; a silyl group; a boron group; an alkyl group; a haloalkyl group; a cycloalkyl group; an alkenyl group; an aryl group; an aralkyl group; an aral
  • the substituent to which two or more substituents are linked may be a biphenyl group. That is, the biphenyl group may also be an aryl group, and may be interpreted as a substituent to which two phenyl groups are linked.
  • a haloalkyl group can be used as the substituent, and examples of the haloalkyl group include trifluoromethyl group.
  • the alkyl group is a monovalent functional group derived from an alkane, and may be a straight-chain or a branched-chain.
  • the number of carbon atoms of the straight chain alkyl group is not particularly limited, but is preferably 1 to 20. Also, the number of carbon atoms of the branched chain alkyl group is 3 to 20.
  • alkyl group examples include methyl, ethyl, propyl, n-propyl, isopropyl, butyl, n-butyl, isobutyl, tert-butyl, sec-butyl, 1-methyl-butyl, 1-ethyl-butyl, pentyl, n-pentyl, isopentyl, neopentyl, tert-pentyl, hexyl, n-hexyl, 1-methylpentyl, 2-methylpentyl, 4-methyl-2-pentyl, 3,3-dimethylbutyl, 2-ethylbutyl, heptyl, n-heptyl, 1-methylhexyl, octyl, n-octyl, tert-octyl, 1-methylheptyl, 2-ethylhexyl, 2-propylpentyl, n-nonyl
  • the aryl group is a monovalent functional group derived from an arene, and is not particularly limited, but preferably has 6 to 20 carbon atoms, and may be a monocyclic aryl group or a polycyclic aryl group.
  • the monocyclic aryl group may include, but not limited to, a phenyl group, a biphenyl group, a terphenyl group, or the like.
  • the polycyclic aryl group may include, but not limited to, a naphthyl group, an anthracenyl group, a phenanthryl group, a pyrenyl group, a perylenyl group, a chrysenyl group, a fluorenyl group or the like.
  • the aryl group may be substituted or unsubstituted.
  • the arylene group is a bivalent functional group derived from an arene, and the description of the aryl group as defined above may be applied, except that it is a divalent functional group.
  • it may be a phenylene group, a biphenylene group, a terphenylene group, a naphthalenediyl group, a fluorenylene group, a pyrenylene group, a phenanthrenylene group, a perylenediyl group, a tetracenylene group, an anthracenylene group and the like.
  • the arylene group may be substituted or unsubstituted,
  • a heteroaryl group includes one or more atoms other than carbon, that is, one or more heteroatoms, and specifically, the heteroatom may include one or more atoms selected from the group consisting of O, N, Se, and S, and the like.
  • the number of carbon atoms thereof is not particularly limited, but is preferably 4 to 20, and the heteroaryl group may be monocyclic or polycyclic.
  • Examples of a heteroaryl group include a thiophene group, a furanyl group, a pyrrole group, an imidazolyl group, a thiazolyl group, an oxazolyl group, an oxadiazolyl group, a pyridyl group, a bipyridyl group, a pyrimidyl group, a triazinyl group, a triazolyl group, an acridyl group, a pyridazinyl group, a pyrazinyl group, a quinolinyl group, a quinazolinyl group, a quinoxalinyl group, a phthalazinyl group, a pyridopyrimidinyl group, a pyridopyrazinyl group, a pyrazinopyrazinyl group, an isoquinolinyl group, an indolyl group, a carbazolyl group
  • the hetero arylene group has 2 to 20, or 2 to 10, or 6 to 20 carbon atoms.
  • the description of the heteroaryl group as defined above can be applied except that it is a divalent functional group.
  • the hetero arylene group may be substituted or unsubstituted.
  • halogen examples include fluorine, chlorine, bromine or iodine.
  • a polyamide resin film including a polyamide resin containing a backbone chain formed by alternative bonding of a first polyamide segment containing a first aromatic amide repeating unit, and a second polyamide segment containing a second aromatic amide repeating unit having a structure different from the first aromatic amide repeating unit, wherein a transmittance of ultraviolet light with a wavelength of 388 nm for a specimen having a thickness of 45 ⁇ m or more and 55 ⁇ m or less is 15% or less, and wherein a UV-cut slope (dT/d ⁇ ) measured for a specimen having a thickness of 45 ⁇ m or more and 55 ⁇ m or less according to ASTM E424 is 0.25 or more in the range of 10% to 80% transmittance.
  • the polyamide resin film includes a specific polyamide resin and also satisfies the conditions in which a transmittance of ultraviolet light with a wavelength of 388 nm for a specimen having a thickness of 45 ⁇ m or more and 55 ⁇ m or less is 15% or less and a UV-cut slope (dT/d ⁇ ) measured for a specimen having a thickness of 45 ⁇ m or more and 55 ⁇ m or less according to ASTM E424 is 0.25 or more in the range of 10% to 80% transmittance, the characteristics of blocking the light of the wavelength of the external ultraviolet region and protecting the material inside the electronic equipment are strengthened, and it can secure at least an adequate level of mechanical properties and excellent transparency while realizing excellent UV shielding function when applied to the cover window film or the like, thereby completing the present invention.
  • the polyamide resin film of one embodiment includes a polyamide resin containing a backbone chain formed by alternative bonding of a first polyamide segment containing a first aromatic amide repeating unit, and a second polyamide segment containing a second aromatic amide repeating unit having a structure different from the first aromatic amide repeating unit, it is possible to minimize the growth of the length of the first polyamide segment in the polyamide resin and lower the crystallinity of the polyamide resin, thus implementing a transparent polyamide resin film.
  • the backbone chain of the polyamide resin may form a polymer chain consisting of alternating structure of the first polyamide segment and the second polyamide segment. That is, the second polyamide segment is positioned between the first polyamide segments, and may serve to suppress the growth of the length of the first polyamide segment.
  • the haze value of the polyamide resin film can be remarkably lowered while the crystal properties of the first polyamide segment are reduced, thereby achieving excellent transparency.
  • the backbone chain of the polyamide resin forms a polymer chain consisting of alternating structure of a first polyamide segment and a second polyamide segment” is considered to be due to the formation of a melt-kneaded complex in the preparation method of the polyamide resin.
  • the polyamide resin film may have a transmittance (T, @388 nm) of ultraviolet light with a wavelength of 388 nm for a specimen having a thickness of 45 ⁇ m or more and 55 ⁇ m or less, or 48 ⁇ m or more and 52 ⁇ m or less of 15% or less, or 14% or less, or 0.1% or more and 15% or less, or 1% or more and 15% or less, or 10% or more and 15% or less, or 10% or more and 14% or less, or 11% or more and 13.5% or less.
  • T, @388 nm transmittance of ultraviolet light with a wavelength of 388 nm for a specimen having a thickness of 45 ⁇ m or more and 55 ⁇ m or less, or 48 ⁇ m or more and 52 ⁇ m or less of 15% or less, or 14% or less, or 0.1% or more and 15% or less, or 1% or more and 15% or less, or 10% or more and 15% or less, or 10% or more and 14% or less, or 11% or more and 13.5%
  • the transmittance of the polyamide resin film with respect to ultraviolet light having a wavelength of 388 nm can be confirmed through commonly known measuring methods and measuring devices. For example, a method of measuring the total light transmittance of the polyamide resin film using a Shimadzu UV-2600 UV-vis spectrometer can be used.
  • the transmittance (transmittance, @388 nm) of ultraviolet light with a wavelength of 388 nm for a specimen having a thickness of 45 ⁇ m or more and 55 ⁇ m or less, or 48 ⁇ m or more and 52 ⁇ m or less is excessively increased to more than 15%, it is difficult to implement a UV shielding function at a level applicable to the cover window film, and thus, light having a wavelength in the external ultraviolet region penetrates into the electronic device, which may cause problems such as deformation and discoloration of the internal material.
  • the polyamide resin film may have an UV-cut slope (dT/d ⁇ ) measured for a specimen having a thickness of 45 ⁇ m or more and 55 ⁇ m or less, or 48 ⁇ m or more and 52 ⁇ m or less according to ASTM E424, of 0.25 or more, or 0.5 or more, or 1.0 or more, or 0.25 or more and 10 or less, or 0.25 or more and 8 or less, or 0.25 or more and 6 or less, or 0.5 or more and 10 or less, or 0.5 or more and 8 or less, or 0.5 or more and 6 or less, or 0.6 or more and 6 or less, or 0.68 or more and 5.5 or less, or 1 or more and 10 or less, or 1 or more and 8 or less, or 1 or more and 6 or less in the range of 10% to 80% transmittance.
  • dT/d ⁇ UV-cut slope
  • the UV-cut slope (dT/d ⁇ ) of the polyamide resin film may mean an instantaneous slope, that is, a differential coefficient, on the x-y graph where the x-axis is wavelength ( ⁇ ) and the y-axis is transmittance.
  • the polyamide resin film has a relatively high UV-cut slope, it can have colorless and transparent optical properties together with excellent UV shielding function.
  • the UV-cut slope (dT/d ⁇ ) of the polyamide resin film which is measured for a specimen having a thickness of 45 ⁇ m or more and 55 ⁇ m or less, or 48 ⁇ m or more and 52 ⁇ m or less according to ASTM E424, is excessively reduced by less than 0.25 in the range of 10% to 80% transmittance, it has a low UV-cut slope, which may lead to degradation of UV shielding function, etc.
  • the UV-cut off wavelength (wavelength when transmittance is less than 1%) may be 350 nm to 385 nm.
  • the UV-cut slope of the polyamide resin film can be confirmed through commonly known measuring methods and measuring devices. For example, a method of measuring the UV-cut off wavelength ( ⁇ ) and UV-cut slope (dT/d ⁇ ) of the polyamide resin film according to the ASTM E424 test method using a UV-Vis spectrophotometer (manufacturer: Shimadzu, model: UV2600) can be used.
  • the polyamide resin film may have an UV-cut slope (dT/d ⁇ ) measured for a specimen having a thickness of 45 ⁇ m or more and 55 ⁇ m or less, or 48 ⁇ m or more and 52 ⁇ m or less according to ASTM E424, of 0.5 or more, or 0.8 or more, or 0.5 or more and 2.0 or less, or 0.8 or more and 2.0 or less at 80% transmittance.
  • dT/d ⁇ UV-cut slope measured for a specimen having a thickness of 45 ⁇ m or more and 55 ⁇ m or less, or 48 ⁇ m or more and 52 ⁇ m or less according to ASTM E424, of 0.5 or more, or 0.8 or more, or 0.5 or more and 2.0 or less, or 0.8 or more and 2.0 or less at 80% transmittance.
  • the polyamide resin film may have an UV-cut slope (dT/d ⁇ ) measured for a specimen having a thickness of 45 ⁇ m or more and 55 ⁇ m or less, or 48 ⁇ m or more and 52 ⁇ m or less according to ASTM E424, of 2 or more, or 3 or more, or 2 or more and 5 or less, or 3 or more and 5 or less at 10% transmittance,
  • the thickness of the polyamide resin film is not particularly limited, but for example, it can be freely adjusted within the range of 0.01 ⁇ m to 1000 ⁇ m.
  • the thickness of the polyamide resin film increases or decreases by a specific value, the physical properties measured in the polyamide resin film may also change by a certain value.
  • the polyamide resin film may be prepared by a conventional method such as a dry method or a wet method using the polyamide resin of the one embodiment.
  • the polyamide resin film may be formed by a method of coating a solution containing the polyamide resin of one embodiment onto an arbitrary support to form a film, evaporating the solvent from the film and drying it. If necessary, stretching and heat treatment of the polyamide resin film may be further performed.
  • polyamide resin film is produced using the polyamide resin of one embodiment, it is possible to exhibit excellent mechanical properties while being colorless and transparent.
  • the haze measured according to ASTM D1003 for a specimen having a thickness of 50 ⁇ 2 ⁇ m may be 3.0% or less, or 1.5% or less, or 1.00% or less, or 0.85% or less, or 0.10% to 3.0%, or 0.10% to 1.5%, or 0.10% to 1.00%, or 0.40% to 1.00%, or 0.40% to 0.90%, or 0.40% to 0.80%.
  • the haze of the polyamide resin film measured according to ASTM D1003 is increased by more than 3.0%, the opacity is increased and thus, it is difficult to secure a sufficient level of transparency.
  • the polyamide resin film has a yellowness index (YI) measured for a specimen having a thickness of 45 ⁇ m or more and 55 ⁇ m or less, or 48 ⁇ m or more and 52 ⁇ m or less according to ASTM E313 of 4.0 or less, or 3.1 or less, or 0.5 to 4.0, or 0.5 to 3.1, or 2.5 to 3.1.
  • YI yellowness index
  • the polyamide resin film may have a transmittance (T, @550 nm) of visible light with a wavelength of 550 nm for a specimen having a thickness of 45 ⁇ m or more and 55 ⁇ m or less, or 48 ⁇ m or more and 52 ⁇ m or less of 86% or less, or 86% or more and 90% or less.
  • T transmittance
  • the polyamide resin film may have a folding endurance measured for a specimen having a thickness of 45 ⁇ m or more and 55 ⁇ m or less, or 48 ⁇ m or more and 52 gm or less (the number of reciprocating bending cycles at an angle of 135°, a rate of 175 rpm, a radius of curvature of 0.8 mm and a load of 250 g) of 4000 cycles or more, or 7000 cycles or more, or 9000 cycles or more, or 4000 cycles to 20000 cycles, or 7000 cycles to 20000 cycles, or 9000 cycles to 20000 cycles, or 10000 cycles or more and 15000 cycles or less, or 10000 cycles or more and 14000 cycles or less.
  • the polyamide resin film may have a pencil hardness value measured for a specimen having a thickness of 45 ⁇ m or more and 55 ⁇ m or less, or 48 ⁇ m or more and 52 ⁇ m or less according to ASTM D3363 of 1H or more, or 3H or more, or 1H to 4H, or 3H to 4H.
  • the polyamide resin film may include a polyamide resin composition including the polyamide resin and the ultraviolet light stabilizer, or a cured product thereof.
  • the cured product means a material obtained through a curing process of the polyamide resin composition.
  • the polyamide resin film may be prepared by a conventional method such as a dry method or a wet method using the above-mentioned polyamide resin composition.
  • the polyamide resin film may be formed by a method of coating a solution containing the polyamide resin and the ultraviolet light stabilizer onto an arbitrary support to form a film, evaporating the solvent from the film and drying it. If necessary, stretching and heat treatment of the polyamide resin film may be further performed.
  • the polyamide resin film When the polyamide resin film is produced using the polyamide resin composition, it can realize excellent optical and mechanical properties and at the same time have flexibility and thus, can be used as a material of various molded articles.
  • the polyamide resin film may be applied to a display substrate, a display protective film, a touch panel, a window cover of a foldable device, and the like.
  • the polyamide resin may include a first polyamide segment containing a first aromatic amide repeating unit, and a second polyamide segment containing a second aromatic amide repeating unit having a structure different from the first aromatic amide repeating unit.
  • the first aromatic amide repeating unit may be a repeating unit represented by the following Chemical Formula 1.
  • Ar 1 is a substituted or unsubstituted arylene group having 6 to 20 carbon atoms, or a substituted or unsubstituted heteroarylene group having 2 to 20 carbon atoms.
  • the second aromatic amide repeating unit may be a repeating unit represented by the following Chemical Formula 2.
  • Ar 2 is a substituted or unsubstituted arylene group having 6 to 20 carbon atoms, or a substituted or unsubstituted heteroarylene group having 2 to 20 carbon atoms.
  • Ar 1 and Ar 2 are the same as or different from each other and are each independently an arylene group having 6 to 20 carbon atoms that is substituted with one or more substituents selected from the group consisting of an alkyl group, a haloalkyl group and an amino group, and more preferably, it may be a 2,2′-bis(trifluoromethyl)-4,4′-biphenylene group.
  • Ar 1 and Ar 2 may be a divalent organic functional group derived from an aromatic diamine monomer, and specific examples of the aromatic diamine monomer may include at least one selected from the group consisting of 2,2′-bis(trifluoromethyl)-4,4′-biphenyldiamine, 2,2′-dimethyl-4,4′-diaminobenzidine, 4,4′-diaminodiphenyl sulfone, 4,4′-(9-fluorenylidene)dianiline, bis(4-(4-aminophenoxy)phenyl)sulfone, 2,2′,5,5′-tetrachlorobenzidine, 2,7-diaminofluorene, 4,4-diaminooctafluorobiphenyl, m-phenylenediamine, p-phenylenediamine, 4,4′-oxydianiline, 2,2′-dimethyl-4,4′-di
  • the first polyamide segment may include a first aromatic amide repeating unit or a block composed thereof
  • the second polyamide segment may include a second aromatic amide repeating unit or a block composed thereof.
  • the first polyamide segment may include a repeating unit represented by Chemical Formula 1, or a block composed thereof
  • the second polyamide segment may include a repeating unit represented by Chemical Formula 2, or a block composed thereof.
  • repeating unit represented by Chemical Formula 1 include a repeating unit represented by the following Chemical Formula 1-1.
  • the first polyamide segment is an amide repeating unit derived from a combination of a 1,4-aromatic diacyl compound and an aromatic diamine compound. Due to the linear molecular structure, the chain packing and alignment can be kept constant in the polymer, and the surface hardness and mechanical properties of the polyamide resin film can be improved.
  • 1,4-aromatic diacyl compound examples include terephthaloyl chloride or terephthalic acid.
  • aromatic diamine monomer may include at least one selected from the group consisting of 2,2′-bis(trifluoromethyl)-4,4′-biphenyldiamine, 2,2′-dimethyl-4,4′-diaminobenzidine, 4,4′-diaminodiphenyl sulfone, 4,4′-(9-fluorenylidene)dianiline, bis(4-(4-aminophenoxy)phenyl)sulfone, 2,2′,5,5 tetrachlorobenzidine, 2,7-diaminofluorene, 4,4-diaminooctafluorobiphenyl, m-phenylenediamine, p-phenylenediamine, 4,4′-oxydianiline, 2,2′-dimethyl-4,4′-diaminobi
  • the 1,4-aromatic diacyl compound may include terephthaloyl chloride, or terephthalic acid
  • the aromatic diamine compound may include 2,2′-bis(trifluoromethyl)-4,4′-biphenyldiamine
  • the first polyamide segment may have a number average molecular weight of 100 g/mol or more and 5000 g/mol or less, or 100 g/mol or more and 3000 g/mol or less, or 100 g/mol or more and 2500 g/mol or less, or 100 g/mol or more and 2450 g/mol or less.
  • the number average molecular weight of the first polyamide segment is increased by more than 5000 g/mol, the chains of the first polyamide segment become excessively long and thus the crystallinity of the polyamide resin can be increased. Consequently, it may have a high haze value and it may be difficult to secure transparency.
  • Examples of the measuring method of the number average molecular weight of the first polyamide segment is not limited, but for example, it can be confirmed through a small-angle X-ray scattering (SAXS) analysis.
  • SAXS small-angle X-ray scattering
  • the first polyamide segment may be represented by the following Chemical Formula 5.
  • Ar 1 is a substituted or unsubstituted arylene group having 6 to 20 carbon atoms, or a substituted or unsubstituted heteroarylene group having 2 to 20 carbon atoms, and a is an integer of 1 to 5.
  • the Formula 5 when a is 1, the Formula 5 may be a repeating unit represented by Chemical Formula 1.
  • the Formula 5 when a is 2 to 5, the Formula 5 may be a block composed of repeating units represented by Chemical Formula 1.
  • the details concerning Ar 1 includes those described above in Chemical Formula 1.
  • the ratio of the first aromatic amide repeating units may be 40 mol % to 95 mol %, 50 mol % to 95 mol %, or 60 mol % to 95 mol %, or 70 mol % to 95 mol %, or 50 mol % to 90 mol %, or 50 mol % to 85 mol %, or 60 mol % to 85 mol %, or 70 mol % to 85 mol %, or 80 mol % to 85 mol %, or 82 mol % to 85 mol %.
  • the polyamide resin in which the first aromatic amide repeating unit is contained in the above-described content can ensure a sufficient level of molecular weight, thereby ensuring excellent mechanical properties.
  • the repeating unit represented by Chemical Formula 2 may include an amide repeating unit derived from a combination of a 1,3-aromatic diacyl compound and an aromatic diamine compound, or a repeating unit derived from a combination of a 1,2-aromatic diacyl compound and an aromatic diamine compound, or mixtures thereof, and it may include one type of repeating unit selected from a repeating unit represented by the following Chemical Formula 2-1; or a repeating unit represented by Chemical Formula 2-2.
  • Ar 2 is a substituted or unsubstituted arylene group having 6 to 20 carbon atoms, or a substituted or unsubstituted heteroarylene group having 2 to 20 carbon atoms.
  • the details concerning Ar 2 includes those described above in Chemical Formula 2.
  • the second aromatic amide repeating unit may include an amide repeating unit derived from a combination of a 1,3-aromatic diacyl compound and an aromatic diamine compound, or a repeating unit derived from a combination of a 1,2-aromatic diacyl compound and an aromatic diamine compound.
  • the repeating unit represented by Chemical Formula 2-1 is an amide repeating unit derived from a combination of a 1,3-aromatic diacyl compound and an aromatic diamine compound
  • the repeating unit represented by Chemical Formula 2-2 is an amide repeating unit derived from a combination of a 1,2-aromatic diacyl compound and an aromatic diamine compound.
  • 1,2-aromatic diacyl compound examples include phthaloyl chloride or phthalic acid.
  • specific examples of the 1,3-aromatic diacyl compound include isophthaloyl chloride or isophthalic acid.
  • aromatic diamine monomer examples include at least one selected from the group consisting of 2,2′-bis(trifluoromethyl)-4,4′-biphenyldiamine, 2,2′-dimethyl-4,4′-diaminobenzidine, 4,4′-diaminodiphenyl sulfone, 4,4′-(9-fluorenylidene)dianiline, bis(4-(4-aminophenoxy)phenyl)sulfone, 2,2′,5,5′-tetrachlorobenzidine, 2,7-diaminofluorene, 4,4-diaminooctafluorobiphenyl, m-phenylenediamine, p-phenylenediamine, 4,
  • the 1,2-aromatic diacyl compound may include phthaloyl chloride, or phthalic acid
  • the 1,3-aromatic diacyl compound may include isophthaloyl chloride or isophthalic acid
  • the aromatic diamine compound may include 2,2′-bis(trifluoromethyl)-4,4′-biphenyldiamine
  • repeating unit represented by Chemical Formula 2-1 include a repeating unit represented by the following Chemical Formula 2-4.
  • repeating unit represented by Chemical Formula 2-2 include a repeating unit represented by the following Chemical Formula 2-5.
  • the second polyamide segment may be represented by the following Chemical Formula 6.
  • Ar 2 is a substituted or unsubstituted arylene group having 6 to 20 carbon atoms, or a substituted or unsubstituted heteroarylene group having 2 to 20 carbon atoms, and b is an integer of 1 to 3, or 1 to 2.
  • the Chemical Formula 6 when b is 1, the Chemical Formula 6 may be a repeating unit represented by Chemical Formula 2.
  • the Chemical Formula 6 when b is 2 to 3, the Chemical Formula 6 may be a block composed of repeating units represented by Chemical Formula 2.
  • the second aromatic amide repeating unit is a repeating unit formed by an amidation reaction of isophthaloyl chloride, isophthalic acid or phthaloyl chloride, phthalic acid and an aromatic diamine monomer. Due to the curved molecular structure, it has the property of interfering with chain packing and alignment within the polymer, and it is possible to increase the amorphous region in the polyamide resin and thus improve the optical properties and the folding endurance of the polyamide resin film. In addition, as this is included in the polyamide resin together with the repeating unit represented by Chemical Formula 1, it is possible to increase the molecular weight of the polyamide resin.
  • the ratio of the second aromatic amide repeating unit may be 5 mol % to 60 mol %, or 5 mol % to 50 mol %, or 5 mol % to 40 mol %, or 5 mol % to 30 mol %, or 10 mol % to 50 mol %, or 15 mol % to 50 mol %, or 15 mol % to 40 mol %, or 15 mol % to 30 mol %, or 15 mol % to 20 mol %, or 15 mol % to 18 mol %.
  • the polyamide resin in which the second aromatic amide repeating unit is contained in the above-described content can suppress the growth of the length of the chains consisting of only the first aromatic amide repeating unit and thus lower the crystallinity of the resin. Consequently, it is possible to have a low haze value and thus secure excellent transparency.
  • the content of the repeating unit represented by Chemical Formula 1 may be 60 mol % to 95 mol %, or 70 mol % to 95 mol %, or 50 mol % to 90 mol %, or 50 mol % to 85 mol %, or 60 mol % to 85 mol %, or 70 mol % to 85 mol %, or 80 mol % to 85 mol %, or 82 mol % to 85 mol %
  • the content of the repeating unit represented by Chemical Formula 2 may be 5 mol % to 40 mol %, or 5 mol % to 30 mol %, or 10 mol % to 50 mol %, or 15 mol % to 50 mol %, or 15 mol % to 40 mol %, or 15 mol % to 30 mol %, or 15 mol % to 20 mol %, or 15 mol % to 18 mol %.
  • the polyamide resin can increase the molar content of the repeating unit represented by Chemical Formula 1 and thus maximize the effect of improving the surface hardness and mechanical properties of the polyamide film according to the chain packing and alignment within the polymer due to the linear molecular structure of the repeating unit represented by Chemical Formula 1.
  • the repeating unit represented by Chemical Formula 1 can increase the molar content of the repeating unit represented by Chemical Formula 1 and thus maximize the effect of improving the surface hardness and mechanical properties of the polyamide film according to the chain packing and alignment within the polymer due to the linear molecular structure of the repeating unit represented by Chemical Formula 1.
  • Chemical Formula 2 has a relatively low molar content, it may suppress the length growth of the chain consisting of only the specific repeating unit represented by Chemical Formula 1, thereby lowering the crystallinity of the resin. Consequently, it is possible to have a low haze value and thus secure excellent transparency.
  • the polyamide resin may include a backbone chain formed by alternative bonding of the first polyamide segment and the second polyamide segment.
  • the backbone chain of the polyamide resin may form a polymer chain consisting of alternating structure of the first polyamide segment and the second polyamide segment.
  • the second polyamide segment is positioned between the first polyamide segments, and may serve to suppress the growth of the length of the first polyamide segment.
  • the haze value of the polyamide resin can be remarkably lowered while the crystal properties of the first polyamide segment are reduced, thereby achieving excellent transparency.
  • the backbone chain of the polyamide resin forms a polymer chain consisting of alternating structure of a first polyamide segment and a second polyamide segment” is considered to be due to the formation of a melt-kneaded complex in the preparation method of the polyamide resin.
  • the backbone chain of the polyamide resin may include an alternating repeating unit represented by the following Chemical Formula 3.
  • A is the first polyamide segment
  • B is the second polyamide segment
  • first polyamide segment and the second polyamide segment may form a backbone chain including an alternating repeating unit represented by the following Chemical Formula 3.
  • the alternating repeating unit represented by Chemical Formula 3 may be a repeating unit represented by the following Chemical Formula 4.
  • Ar 1 and Ar 2 are each independently a substituted or unsubstituted arylene group having 6 to 20 carbon atoms, or a substituted or unsubstituted heteroarylene group having 2 to 20 carbon atoms
  • a1 and a2 are the same as or different from each other and are each independently an integer of 1 to 10, or 1 to 5
  • b1 and b2 are the same as or different from each other and are each independently an integer of 1 to 5, or 1 to 3.
  • Including the alternating repeating unit represented by Chemical Formula 3 in the backbone chain of the polyamide resin can be confirmed through the haze value of the polyamide resin, and more specifically, it can be confirmed through a small-angle X-ray scattering (SAXS) analysis.
  • SAXS small-angle X-ray scattering
  • the polyamide resin may include a first polyamide segment containing a repeating unit represented by Chemical Formula 1 or a block comprised thereof; and a second polyamide segment containing a repeating unit represented by Chemical Formula 2, or a block comprised thereof, wherein the first polyamide segment and the second polyamide segment may form a backbone chain containing the alternating repeating unit represented by Chemical Formula 3.
  • the polyamide resin may have a weight average molecular weight of 330000 g/mol or more, 420000 g/mol or more, or 500000 g/mol or more, or 330000 g/mol to 1000000 g/mol, or 420000 g/mol to 1000000 g/mol, or 500000 g/mol to 1000000 g/mol, or 420000 g/mol to 800000 g/mol, or 420000 g/mol to 600000 g/mol, or 450000 g/mol to 550000 g/mol.
  • the reason why the weight average molecular weight of the polyamide resin is measured to be high is considered to be due to the formation of a melt-kneaded complex in the preparation method of the polyamide resin of another embodiment of the present invention described hereinafter.
  • the weight average molecular weight is reduced to less than 330,000 g/mol, the polyamide resin has a problem that mechanical properties such as flexibility and pencil hardness are lowered.
  • the polydispersity index of the polyamide resin may be 3.0 or less, or 2.9 or less, or 2.8 or less, or 1.5 to 3.0, or 1.5 to 2.9, or 1.6 to 2.8, or 1.8 to 2.8.
  • the polyamide resin can improve mechanical properties such as bending properties or hardness properties.
  • the polydispersity index of the polyamide resin becomes too wide by more than 3.0, there is a limit that it is difficult to improve the above-described mechanical properties to a sufficient level.
  • the haze of the polyamide resin measured according to ASTM D1003 may be 3.0% or less, or 1.5% or less, 1.00% or less, or 0.85% or less, or 0.10% to 3.0%, or 0.10% to 1.5%, or 0.10% to 1.00%, or 0.50% to 1.00%, or 0.80% to 1.00%, or 0.81% to 0.97%.
  • the haze of the polyamide resin measured according to ASTM D1003 is increased by more than 3.0%, the opacity is increased and thus it is difficult to secure a sufficient level of transparency.
  • the polyamide resin satisfies the weight average molecular weight of 330000 g/mol or more, 420000 g/mol or more, or 500000 g/mol or more, or 330000 g/mol to 1000000 g/mol, or 420000 g/mol to 1000000 g/mol, or 500000 g/mol to 1000000 g/mol, or 420000 g/mol to 800000 g/mol, or 420000 g/mol to 600000 g/mol, or 450000 g/mol to 550000 g/mol, and simultaneously it may have the haze measured according to ASTM D1003 of 3.0% or less, or 1.5% or less, 1.00% or less, or 0.85% or less, or 0.10% to 3.0%, or 0.10% to 1.5%, or 0.10% to 1.00%, or 0.50% to 1.00%, or 0.80% to 1.00%, or 0.81% to 0.97%.
  • the relative viscosity of the polyamide resin may be 45000 cps or more, or 60000 cps or more, or 45000 cps to 500000 cps, or 60000 cps to 500000 cps, or 70000 cps to 400000 cps, or 80000 cps to 300000 cps, or 100000 cps to 200000 cps, or 110000 cps to 174000 cps.
  • a method for preparing a polyamide resin including a step of melt-kneading a compound represented by the following Chemical Formula 7 and a compound represented by the following Chemical Formula 8, and solidifying the melt-kneaded product to form a complex; and a step of reacting the complex with an aromatic diamine monomer can be used.
  • X is a halogen or a hydroxyl group.
  • the present inventors have found through experiments that when the compound represented by Chemical Formula 7 and the compound represented by Chemical Formula 8 are mixed at a temperature equal to or higher than the melting point as in the method for preparing the polyamide resin, it is possible to prepare a complex of monomers mixed uniformly through the melting of the compound represented by Chemical Formula 7 and the compound represented by Chemical Formula 8, and that as this complex is reacted with an aromatic diamine monomer, an amide repeating unit derived from the compound represented by Chemical Formula 7, or a block composed thereof, and an amide repeating uniting derived from the compound represented by Chemical Formula 8, or a block composed thereof can be alternatively polymerized, thereby completing the present invention.
  • the polyamide resin of one embodiment can be obtained by the preparation method of the polyamide resin.
  • each of the compound represented by Chemical Formula 7 and the compound represented by Chemical Formula 8 exhibits different aspects in solubility and reactivity due to chemical structural differences. Therefore, even when they are added simultaneously, there is a limit in that the amide repeating unit derived from the compound represented by Chemical Formula 7 is predominantly formed and simultaneously long blocks are formed, thereby increasing the crystallinity of the polyamide resin and making it difficult to secure transparency.
  • the compound represented by Chemical Formula 7 and the compound represented by Chemical Formula 8 are not simply physically mixed, but through the formation of a complex by melt-kneading at a temperature higher than each melting point, each monomer was induced to react relatively evenly with the aromatic diamine monomer.
  • the method for preparing the polyamide resin may include melt-kneading the compound represented by Chemical Formula 7 and the compound represented by Chemical Formula 8, and solidifying the melt-kneaded product to form a complex.
  • X is a halogen or a hydroxyl group.
  • X is chlorine.
  • Specific examples of the compound represented by Chemical Formula 7 include terephthaloyl chloride or terephthalic acid.
  • the compound represented by Chemical Formula 7 may form a repeating unit represented by Chemical Formula 1 by an amidation reaction of an aromatic diamine monomer. Due to the linear molecular structure, the chain packing and alignment can be kept constant in the polymer, and the surface hardness and mechanical properties of the polyamide resin film can be improved.
  • X is a halogen or a hydroxyl group.
  • X is chlorine.
  • Specific examples of the compound represented by Chemical Formula 8 include phthaloyl chloride, phthalic acid, isophthaloyl chloride, or isophthalic acid.
  • the compound represented by Chemical Formula 8 may form a repeating unit represented by Chemical Formula 2 by an amidation reaction of an aromatic diamine monomer. Due to the curved molecular structure, it has the property of interfering with chain packing and alignment within the polymer, and it is possible to increase the amorphous region in the polyamide resin and thus improve the optical properties and the folding endurance of the polyamide resin film.
  • the repeating unit represented by Chemical Formula 2 derived from the compound represented by Chemical Formula 8 is included in the polyamide resin together with the repeating unit represented by Chemical Formula 1, it is possible to increase the molecular weight of the polyamide resin.
  • the melt-kneading means mixing the compound represented by Chemical Formula 7 and the compound represented by Chemical Formula 8 at a temperature equal to or higher than the melting point.
  • each monomer can be induced to react relatively evenly with the aromatic diamine monomer.
  • the first polyamide segment and the second polyamide segment can alternately form a backbone chain including the alternating repeating units represented by Chemical Formula 3 as in one embodiment.
  • the compound represented by Chemical Formula 8 may be mixed at 5 parts by weight to 60 parts by weight, or 5 parts by weight to 50 parts by weight, or 5 parts by weight to 25 parts by weight, or 10 parts by weight to 30 parts by weight, or 15 parts by weight to 25 parts by weight.
  • the technical effect of increasing transmittance and clarity can be realized.
  • the compound represented by Chemical Formula 8 is mixed in an excessively small amount of less than 5 parts by weight with respect to 100 parts by weight of the compound represented by Chemical Formula 7, the technical problems such as becoming opaque and the increase of haze may occur.
  • the solidifying means a physical change in which the melt-kneaded product in a molten state is cooled to a temperature equal to or less than the melting point and solidified. Consequently, the formed complex may be in a solid state. More preferably, the complex may be a solid powder obtained through an additional grinding process or the like.
  • the step of melt-kneading a compound represented by Chemical Formula 7 and a compound represented by Chemical Formula 8, and solidifying the melt-kneaded product to form a complex may include a step of mixing the compound represented by Chemical Formula 7 and the compound represented by Chemical Formula 8 at a temperature of 50° C. or higher; and a step of cooling the result of the mixing step.
  • the terephthaloyl chloride has a melting point of 81.3° C. to 83° C.
  • the isophthaloyl chloride has a melting point of 43° C. to 44° C.
  • the phthaloyl chloride may have a melting point of 6° C. to 12° C.
  • these are the temperature condition higher than the melting point of both the compound represented by Chemical Formula 7 and the compound represented by Chemical Formula 8 and thus, melt-kneading may be performed.
  • the result of the melt-kneading step is left at plus 5° C. or below, or minus 10° C. to plus 5° C., or minus 5° C. to plus 5° C., which is a temperature condition lower than the melting point of both the compound represented by Chemical Formula 7 and the compound represented by Chemical Formula 8, so that a more uniform solid powder can be obtained through cooling.
  • the method may further include a step of grinding the result of the cooling step.
  • a solid complex can be prepared in powder form, and the powder obtained after the grinding step may have an average particle size of 1 mm to 10 mm
  • Grinders used for grinding with such particle sizes specifically include a pin mill, a hammer mill, a screw mill, a roll mill, a disc mill, a jog mill or sieve, a jaw crusher, and the like, but are not limited to the examples described above.
  • the method for preparing the polyamide resin may include a step of reacting the complex with an aromatic diamine monomer.
  • the reaction in the step of reacting the complex with an aromatic diamine monomer may be performed under an inert gas atmosphere at a temperature condition of minus 25° C. to plus 25° C. or a temperature condition of minus 25° C. to 0° C.
  • aromatic diamine monomer examples include at least one selected from the group consisting of 2,2′-bis(trifluoromethyl)-4,4′-biphenyldiamine, 2,2′-dimethyl-4,4′-diaminobenzidine, 4,4′-diaminodiphenyl sulfone, 4,4′-(9-fluorenylidene)dianiline, bis(4-(4-aminophenoxy)phenyl)sulfone, 2,2′,5,5′-tetrachlorobenzidine, 2,7-diaminofluorene, 4,4-diaminooctafluorobiphenyl, m-phenylenediamine, p-phenylenediamine, 4,4′-oxydianiline, 2,2′-dimethyl-4,4′-diaminobiphenyl, 2,2-bis [4-(4-aminophenoxy)phenyl]propane, 1,3-bis(4-bis(
  • aromatic diamine monomer 2,2′-bis(trifluoromethyl)-4,4′-biphenyldiamine (TFDB), 2,2′-dimethyl-4,4′-diaminobenzidine, m-xylylenediamine, or p-xylylenediamine can be used.
  • TFDB 2,2′-bis(trifluoromethyl)-4,4′-biphenyldiamine
  • 2,2′-dimethyl-4,4′-diaminobenzidine 2,2′-dimethyl-4,4′-diaminobenzidine
  • m-xylylenediamine 2,2′-dimethyl-4,4′-diaminobenzidine
  • m-xylylenediamine 2,2′-dimethyl-4,4′-diaminobenzidine
  • the step of reacting the complex with an aromatic diamine monomer may include a step of dissolving the aromatic diamine monomer in an organic solvent to prepare a diamine solution; and a step of adding a complex powder to the diamine solution.
  • the aromatic diamine monomer included in the diamine solution may be present in a state dissolved in an organic solvent.
  • the solvent are not particularly limited, but for example, common general-purpose organic solvents such as N-methylformamide, N,N-dimethylformamide, N,N-diethylformamide, N,N-dimethylacetamide, N,N-diethylacetamide, N,N-dimethylpropionamide, 3-methoxy-N,N-dimethylpropionamide, dimethyl sulfoxide, acetone, N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone, tetrahydrofuran, chloroform, gamma-butyrolactone, ethyl lactate, methyl 3-methoxypropionate, methyl isobutyl ketone, toluene, xylene, methanol,
  • the complex powder will react with the aromatic diamine monomer dissolved in the diamine solution.
  • the deterioration of the compound represented by Chemical Formula 7 and the compound represented by Chemical Formula 8 due to moisture, or their mixing in solvents is minimized, the molecular weight of the finally synthesized polyamide resin is increased, and thereby excellent mechanical properties of the polyamide resin can be ensured.
  • the complex powder can be prepared into a complex of solids in the form of powder through the step of grinding the result of the cooling step.
  • the powder obtained after the grinding step may have an average particle size of 1 mm to 10 mm
  • the polyamide resin film of one embodiment may further include an ultraviolet light stabilizer dispersed in the polyamide resin.
  • the ultraviolet light stabilizer is a material added for the UV stability, and various substances that are commercially available, such as Tinuvin 144, Tinuvin 292, Tinuvin 327, Tinuvin 329, Tinuvin 5050, Tinuvin 5151 from BASF Corporation, and LOWILITE 22 and LOWILITE 26, LOWILITE 55, LOWILITE 62, LOWILITE 94 from Miwon Commercial Co., etc. can be used, but the present invention is not limited thereto.
  • a triazine-based UV absorber a triazole-based UV absorber, and a HALS (hindered amine light stabilizer)-based UV absorber and the like may be used as the ultraviolet light stabilizer, or two or more types may be used together.
  • a triazine-based UV absorber a triazole-based UV absorber
  • a HALS (hindered amine light stabilizer)-based UV absorber and the like may be used as the ultraviolet light stabilizer, or two or more types may be used together.
  • the triazine-based UV absorber may include commercially available Tinuvin 360, Tinuvin 1577 (Ciba Chemicals), Cyasorb UV-1164, Cyasorb UV-2908, Cyasorb UV-3346 (Cytec), Tinuvin T1600 (BASF), LA-F70 (ADEKA), and the like
  • the triazole-based UV absorber may include Tinuvin 329, Tinuvin 384, Tinuvin 1130, Cyasorb UV-2337, Cyasorb UV-5411, Eversorb 109 (Everlight Chemical), and the like
  • the HALS-based UV absorber may include Cyasorb UV-3853 and the like.
  • the triazole-based UV absorber when using a triazole-based UV absorber, not only excellent light resistance but also stable optical properties can be achieved, and the triazole-based UV absorber may include a compound represented by the following Chemical Formula 11.
  • R 1 and R 2 are each independently hydrogen or an alkyl group having 1 to 20 carbon atoms. More preferably, in Chemical Formula 1, Tinuvin 329 (BASF) wherein R 1 is 2,4,4-trimethylpentan-2-yl and R 2 is hydrogen, may be mentioned.
  • BASF Tinuvin 329
  • the ultraviolet light stabilizer may be added in an amount of about 0.1 part by weight to about 20 parts by weight or about 1 part by weight to about 10 parts by weight based on 100 parts by weight of the polyamide resin. This is because when the content of the ultraviolet light stabilizer satisfies the above range, both the optical properties of the film and the UV-shielding effect are excellent.
  • the ultraviolet light stabilizer When the ultraviolet light stabilizer is added in an excessively small amount compared to the polyamide resin, it is difficult to sufficiently realize UV light resistance by the ultraviolet light stabilizer, When the ultraviolet light stabilizer is added in an excessive amount compared to the polyamide resin, the initial yellowness index of the polyamide resin film is higher than the reference value and simultaneously, transparency of the film can be decreased.
  • a resin laminate including a substrate including the polyamide resin film of one embodiment; and a hard coating layer formed on at least one side of the substrate.
  • the substrate may include the polyamide resin film of one embodiment, and the details concerning the polyamide resin film may include all of those described in the one embodiment.
  • a hard coating layer may be formed on at least one side of the substrate.
  • a hard coating layer may be formed on one side or both sides of the substrate.
  • a polyamide resin film including one or more polymers selected from the group consisting of polyimide-based, polycarbonate-based, polyester-based, polyalkyl(meth)acrylate-based, polyolefin-based and polycyclic olefin-based polymers may formed on the opposite side of the substrate.
  • the hard coating layer may have a thickness of 0.1 ⁇ m to 100 ⁇ m.
  • the hard coating layer can be used without particular limitation as long as it is a material known in the field of hard coating.
  • the hard coating layer may include a binder resin of photocurable resin; and inorganic particles or organic particles dispersed in the binder resin.
  • the photocurable resin contained in the hard coating layer is a polymer of a photocurable compound which can cause a polymerization reaction when irradiated with light such as ultraviolet rays, and may be one conventionally used in the art. However, preferably, the photocurable compound may be a polyfunctional (meth)acrylate-based monomer or oligomer. At this time, it is advantageous in terms of ensuring the physical properties of the hard coating layer that the number of (meth)acrylate-based functional groups is 2 to 10, 2 to 8, or 2 to 7.
  • the photocurable compound may be at least one selected from the group consisting of pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, dipentaerythritol hepta(meth)acrylate, tripentaerythritol hepta(meth)acrylate, trilene diisocyanate, xylene diisocyanate, hexamethylene diisocyanate, trimethylolpropane tri(meth)acrylate, and trimethylolpropane polyethoxy tri(meth)acrylate.
  • the inorganic particles may be, for example, silica, metal atoms such as aluminum, titanium, or zinc, or oxides or nitrides thereof. Silica fine particles, aluminum oxide particles, titanium oxide particles, zinc oxide particles, and the like can be used independently of each other.
  • the inorganic particles may have an average radius of 100 nm or less, or 5 to 100 nm.
  • the type of the organic particles is not limited, and for example, polymer particles having an average particle size of 10 nm to 100 ⁇ m may be used.
  • the resin laminate can be used as a substrate or a cover window of a display device, or the like. It has high flexibility and bending durability together with high transmittance and low haze properties, so that it can be used as a substrate or cover window of a flexible display device. That is, the display device including the resin laminate, or the flexible display device including the resin laminate may be implemented.
  • a polyamide resin film that can secure at least an adequate level of mechanical properties and transparency while improving the UV shielding function, and a resin laminate using the same.
  • FIG. 1 shows a 13 C-NMR spectrum of the polyamide resin obtained in (1) of Example 1.
  • FIG. 2 shows a 13 C-NMR spectrum of the polyamide resin obtained in (1) of Example 2.
  • TPC terephthaloyl chloride
  • IPC isophthaloyl chloride
  • acyl chloride complex was grinded with a jaw crusher o prepare powder having an average particle size of 5 mm.
  • An acylchloride complex was prepared in the same manner as in Preparation Example 1, except that 569.5 g (2.803 mol) of terephthaloyl chloride (TPC; melting point: 83° C.) and 100.5 g (0.495 mol) of isophthaloyl chloride (IPC; melting point: 44° C.) were added.
  • TPC terephthaloyl chloride
  • IPC isophthaloyl chloride
  • N,N-dimethylacetamide (DMAc) was filled into a 500 mL 4-neck round flask (reactor) equipped with a stirrer, a nitrogen injection device, a dropping funnel and a temperature controller while slowly blowing nitrogen into the reactor. Then, the temperature of the reactor was adjusted to 0° C., and 14.153 g (0.0442 mol) of 2,2′-bis(trifluoromethyl)-4,4′-biphenyldiamine (TFDB) was added and dissolved.
  • DMAc N,N-dimethylacetamide
  • N,N-dimethylacetamide (DMAc) was added to dilute the solution to a solid content of 5% or less, and the resultant was precipitated with 1 L of methanol. The precipitated solids were filtered and then dried at 100° C. under vacuum for 6 hours or more to prepare a solid-state polyamide resin.
  • DMAc N,N-dimethylacetamide
  • the polyamide resin obtained in (1) of Example 1 contained 82 mol % of the first repeating unit obtained by an amide reaction of terephthaloyl chloride (TPC) and 2,2′-bis(trifluoromethyl)-4,4′-biphenyldiamine (TFDB) and 18 mol % of the second repeating unit obtained by an amide reaction of isophthaloyl chloride (IPC) and 2,2′-bis(trifluoromethyl)-4,4′-biphenyldiamine (TFDB).
  • TPC terephthaloyl chloride
  • TFDB 2,2′-bis(trifluoromethyl)-4,4′-biphenyldiamine
  • the polyamide resin obtained in (1) of Example 1, and Tinuvin 329 (UV blocking agent) 5 phr (5 parts by weight relative to 100 parts by weight of polyamide resin) were dissolved in N,N-dimethylacetamide to prepare about 10% (w/v) polymer solution.
  • the polymer solution was applied onto a polyimide substrate film (UPILEX-75s, UBE), and the thickness of the polymer solution was uniformly adjusted using a film applicator.
  • a polyamide resin was prepared in the same manner as in (1) of Example 1, except that the acyl chloride complex powder obtained in Preparation Example 2 was used instead of the acyl chloride complex powder obtained in Preparation Example 1.
  • the polyamide resin obtained in (1) of Example 2 contained 85 mol % of the first repeating unit obtained by an amide reaction of terephthaloyl chloride (TPC) and 2,2′-bis(trifluoromethyl)-4,4′-biphenyldiamine (TFDB), and 15 mol % of the second repeating unit obtained by an amide reaction of isophthaloyl chloride (IPC) and 2,2′-bis(trifluoromethyl)-4,4′-biphenyldiamine (TFDB).
  • TPC terephthaloyl chloride
  • TFDB 2,2′-bis(trifluoromethyl)-4,4′-biphenyldiamine
  • a polyamide resin film (thickness: 50 ⁇ m) was prepared in the same manner as in of Example 1, except that the polyamide resin obtained in (1) of Example 2 was used instead of the polyamide resin obtained in (1) of Example 1.
  • a polyamide resin film (thickness: 50 ⁇ m) was prepared in the same manner as in Example 2, except that Tinuvin 329 as a UV blocking agent was used at 4 phr (4 parts by weight relative to 100 parts by weight of polyamide resin).
  • a polyamide resin and a polyamide resin film were prepared in the same manner as in Example 1, except that Tinuvin 329 was not added as the UV blocking agent.
  • a polyamide resin and a polyamide resin film were prepared in the same manner as in Example 2, except that Tinuvin 329 was not added as the UV blocking agent.
  • a polyamide resin was prepared in the same manner as in (1) of Example 1, except that instead of the acyl chloride complex powder obtained in Preparation Example 1, 7.358 g (0.0362 mol) of terephthaloyl chloride (TPC) and 1.615 g (0.0080 mol) of isophthaloyl chloride (IPC) were added simultaneously to perform an amide formation reaction.
  • TPC terephthaloyl chloride
  • IPC isophthaloyl chloride
  • a polyamide resin was prepared in the same manner as in (1) of Example 1, except that instead of the acyl chloride complex powder obtained in Preparation Example 1, 7.358 g (0.0362 mol) of terephthaloyl chloride (TPC) was first added, and then 1.615 g (0.0080 mol) of isophthaloyl chloride (IPC) was added sequentially at about 5 minute intervals to perform an amide formation reaction.
  • TPC terephthaloyl chloride
  • IPC isophthaloyl chloride
  • a polyamide resin was prepared in the same manner as in (1) of Example 1, except that instead of the acyl chloride complex powder obtained in Preparation Example 1, 1.615 g (0.0080 mol) of isophthaloyl chloride (IPC) was first added, and then 7.358 g (0.0362 mole of terephthaloyl chloride (TPC) was added sequentially at about 5 minute intervals to perform art amide formation reaction.
  • IPC isophthaloyl chloride
  • TPC terephthaloyl chloride
  • N,N-dimethylacetamide (DMAc) was filled into a 500 mL 4-neck round flask (reactor) equipped with a stirrer, a nitrogen injection device, a dropping funnel and a temperature controller while slowly blowing nitrogen into the reactor. Then, the temperature of the reactor was adjusted to 0° C., and then 7.358 g(0.0362 mol) of terephthaloyl chloride (TPC) and 1.615 g(0.0080 mol) of isophthaloyl chloride (IPC) were added and dissolved.
  • TPC terephthaloyl chloride
  • IPC isophthaloyl chloride
  • N,N-dimethylacetamide (DMAc) was added to dilute the solution to a solid content of 5% or less, and the resultant was precipitated with 1 L of methanol. The precipitated solids were filtered and then dried at 100° C. under vacuum for 6 hours or more to prepare a solid-state polyamide resin.
  • DMAc N,N-dimethylacetamide
  • Thickness The thickness of the polyamide resin film was measured using a thickness measuring device.
  • Yellowness index (Y.I.): The yellowness index of the polyamide resin film was measured according to the measurement method of ASTM E313 using a COH-400 Spectrophotometer (NIPPON DENSHOKU INDUSTRIES).
  • the folding endurance of the polyamide resin film was evaluated using an MIT type folding endurance tester. Specifically, a specimen (1 cm*7 cm) of the polyamide resin film was loaded into the folding endurance tester, and folded to an angle of 135° at a rate of 175 rpm on the left and right sides of the specimen, with a radius of curvature of 0.8 mm and a load of 250 g, until the specimen was bended and fractured. The number of reciprocating bending cycles was measured as the folding endurance.
  • Pencil Hardness The pencil hardness of the polyamide resin film was measured according to the ASTM D3363 test method using a Pencil Hardness Tester. Specifically, varying hardness values of pencils were fixed to the tester and scratched on the polyamide resin film, and the degree of occurrence of a scratch on the polyamide resin film was observed with the naked eye or with a microscope. When more than 70% of the total number of scratches were not observed, a value corresponding to the hardness of the pencil was evaluated as the pencil hardness of the polyamide resin film.
  • the pencil hardness is increased in the order of B grade, F grade and H grade. Within the same grade, the higher the number, the higher the hardness. Within the grade, the higher the number, the higher the hardness.
  • UV-cut off wavelength ( ⁇ ) and UV-cut slope (dT/d ⁇ ) The UV-cut off wavelength ( ⁇ ) and UV-cut slope (dT/d ⁇ ) of the polyamide resin film were measured according to the ASTM E424 test method using a UV-Vis spectrophotometer (manufacturer: Shimadzu, model: UV2600). The UV-cut slope (dT/d ⁇ ) was measured in the range of 10% to 80% transmittance, and the UV-cut off wavelength was expressed as the wavelength when the transmittance was less than 1%.
  • Thickness The thickness of the film was measured using a thickness measuring device.
  • Molecular weight and polydispersity index (PDI) The weight average molecular weight (Mw) and the number average molecular weight (Mn) of the polyamide resin were measured by gel permeation chromatography (GPC, manufactured by Waters), and the polydispersity index (PDI) was calculated by dividing the weight average molecular weight by the number average molecular weight. Specifically, the measurement was performed using a 600 mm long column connecting two Polymer Laboratories PLgel MIX-B Columns (300 mm in length), through Waters 2605 Refractive Index (RI) Detector, wherein the evaluation temperature was 50 to 75° C.
  • GPC gel permeation chromatography
  • the molecular weights could be determined using calibration curves formed using polystyrene standards. As the molecular weight of polystyrene standard products, 7 types of 3940/9600/31420/113300/327300/1270000/4230000 were used.
  • the folding endurance of the films obtained from the polyamide resins was evaluated using an MIT type folding endurance tester. Specifically, a specimen (1 cm*7 cm) of the films obtained from the polyamide resins was loaded into the folding endurance tester, and folded to an angle of 135° at a rate of 175 rpm on the left and right sides of the specimen, with a radius of curvature of 0.8 mm and a load of 250 g, until the specimen was bended and fractured. The number of reciprocating bending cycles was measured as the folding endurance.
  • Viscosity Under a constant reflux system at 25 ⁇ 0.2° C., the viscosity of the solution containing polyamide resin (solvent: dimethylacetamide (DMAc), solid content: 10 wt %) was measured according to ASTM D 2196: test method of non-Newtonian materials by
  • Brookfield DV-2T Rotational Viscometer As Brookfield silicone standard oil, a number of standard solutions having a viscosity range of 5000 cps to 200000 cps was used. The measurement was performed with a spindle LV-4 (64), 0.3-100 RPM, and the unit was cps (mPa.$).
  • Pencil Hardness The pencil hardness of the films obtained from the polyamide resins was measured according to the ASTM D3363 test method using a Pencil Hardness Tester. Specifically, varying hardness values of pencils were fixed to the tester and scratched on the polyamide resin film, and the degree of occurrence of a scratch on the films obtained from the polyamide resins was observed with the naked eye or with a microscope. When more than 70% of the total number of scratches were not observed, a value corresponding to the hardness of the pencil was evaluated as the pencil hardness of the polyamide resin film.
  • the pencil hardness is increased in the order of B grade, F grade and H grade. Within the same grade, the higher the number, the higher the hardness. Within the grade, the higher the number, the higher the hardness.
  • Example 1 Example 2
  • Example 2 Example 3
  • Thickness( ⁇ m) 50 49 51 51 50 50 Y.I. 2.68 2.89 8.55 25.10 4.59 2.28 T (%) @ 550 nm 88.75 88.50 85.63 75.94 87.57 88.82 T (%) @ 388 nm 75.3 71.0 51.01 31.62 65.04 74.24 Haze(%) 0.81 0.97 3.43 24.21 1.61 0.40 Mw(g/mol) 512000 463000 412000 350000 382000 321000 Bending property 12022 9785 5210 785 4513 6351 (Cycle) PDI 1.84 2.71 2.05 2.02 1.98 2.00 Viscosity (cps) 110000 174000 54000 24000 28000 18000 Pencil hardness 3H 4H 1H F 1H 2H
  • the polyamide resin of Examples prepared using the acyl chloride composite powder according to Preparation Examples 1 to 2 had a high weight average molecular weight of 463000 g/mol to 512000 g/mol, and the relative viscosity was measured to be as high as 110000 cps to 174000 cps. Moreover, it was confirmed that the polymer resin film obtained from the polyamide resin of Examples had a low yellowness index of 2.68 to 2.89 and a low haze value of 0.81% to 0.97% at a thickness of about 50 ⁇ m, thereby exhibiting excellent transparency. It was also confirmed that it had a high pencil hardness of 3H to 4H grade and a folding endurance that was broken at the number of reciprocating bending cycles from 9785 to 12022, thereby securing excellent mechanical properties (scratch resistance and folding endurance).

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210230425A1 (en) * 2019-02-01 2021-07-29 Lg Chem, Ltd. Polyamide resin film and resin laminate using the same
US11731410B2 (en) 2021-05-28 2023-08-22 Sk Microworks Co., Ltd. Polyamide-based composite film and display device comprising the same

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113451577B (zh) * 2021-05-12 2023-03-28 浙江中科玖源新材料有限公司 一种磺化芳香聚酰胺粘结剂及其制备方法、锂硫电池正极片
US20220403104A1 (en) * 2021-05-20 2022-12-22 Skc Co., Ltd. Polyamide-based film, method of preparing polyamide-based film, cover window and display device comprising the same
KR20240060611A (ko) * 2021-09-03 2024-05-08 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 수지 조성물 및 성형품

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160032052A1 (en) * 2014-08-01 2016-02-04 Sumitomo Bakelite Company Limited Process for manufacturing polyamide

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR940002184B1 (ko) * 1990-07-10 1994-03-18 한국과학기술연구원 전방향족 폴리아미드 중합체, 그의 제조방법 및 이 중합체로부터 제조된 필름
US5076817A (en) 1990-11-30 1991-12-31 E. I. Du Pont De Nemours And Company Polyamide gas separation membranes and process of using same
CA2474779A1 (en) * 2002-02-19 2003-08-28 Ciba Specialty Chemicals Holding Inc. Containers or films comprising hydroxyphenlbenzotriazole uv absorbers for protecting contents against the effects of uv radiation
CN101003624B (zh) * 2002-10-31 2011-06-08 东丽株式会社 脂环式或芳族聚酰胺、聚酰胺膜、使用所述聚酰胺或聚酰胺膜的光学部件以及聚酰胺的共聚物
JP2005146133A (ja) 2003-11-17 2005-06-09 Toray Ind Inc 芳香族ポリアミドフィルム
JP2006077185A (ja) * 2004-09-13 2006-03-23 Fuji Photo Film Co Ltd ポリアミドおよび前記ポリアミドからなるフィルム
JP2006213812A (ja) * 2005-02-03 2006-08-17 Teijin Techno Products Ltd 芳香族ポリアミド及びそれからなる繊維
JP5500675B2 (ja) 2009-12-14 2014-05-21 日本化薬株式会社 電池電極形成用バインダー及び電極合材
US9457496B2 (en) * 2011-03-23 2016-10-04 Akron Polymer Systems, Inc. Aromatic polyamide films for transparent flexible substrates
CN103648624B (zh) * 2011-04-29 2016-02-24 巴斯夫欧洲公司 含有磺化聚芳醚的复合膜及其在正向渗透方法中的应用
KR101796174B1 (ko) 2011-05-19 2017-11-10 삼성전자주식회사 폴리아미드 블록 코폴리머, 이의 제조 방법, 이를 포함하는 성형품 및 상기 성형품을 포함하는 디스플레이 장치
US9856376B2 (en) * 2011-07-05 2018-01-02 Akron Polymer Systems, Inc. Aromatic polyamide films for solvent resistant flexible substrates
US9963548B1 (en) * 2012-04-24 2018-05-08 Akron Polymer Systems, Inc. Solvent resistant, aromatic polyamide films for transparent flexible substrates
US9161219B2 (en) * 2012-06-22 2015-10-13 Guest Tek Interactive Entertainment Ltd. Authorizing secured wireless access at hotspot having open wireless network and secure wireless network
JP6243107B2 (ja) 2012-09-10 2017-12-06 株式会社日本触媒 光選択透過フィルター、その基材及び用途
CN104718239B (zh) * 2012-09-24 2018-06-19 艾克伦聚合物系统公司 用于制造显示、光学或照明元件的芳香族聚酰胺
TW201425468A (zh) * 2012-09-24 2014-07-01 Akron Polymer Systems Inc 用於製造顯示元件、光學元件或發光元件的芳香族聚醯胺溶液
KR20160068798A (ko) * 2013-10-04 2016-06-15 아크론 폴리머 시스템즈, 인코포레이티드 수지 조성물, 기판, 전자장치를 제조하는 방법 및 전자장치
JP2015120886A (ja) 2013-11-19 2015-07-02 東レ株式会社 芳香族ポリアミドフィルムおよび積層体
KR101870341B1 (ko) * 2013-12-26 2018-06-22 코오롱인더스트리 주식회사 투명 폴리아마이드―이미드 수지 및 이를 이용한 필름
KR102227672B1 (ko) * 2014-12-31 2021-03-16 코오롱인더스트리 주식회사 폴리아마이드-이미드 전구체, 폴리아마이드-이미드 필름 및 이를 포함하는 표시소자
JP2016145332A (ja) * 2015-01-20 2016-08-12 住友ベークライト株式会社 ディスプレイ用素子、光学用素子、照明用素子又はセンサ素子の製造のための芳香族ポリアミド溶液
KR102417461B1 (ko) * 2016-06-24 2022-07-06 도레이 카부시키가이샤 적층 필름
KR102078762B1 (ko) 2017-02-24 2020-02-19 주식회사 엘지화학 폴리아미드이미드 공중합체 및 이를 포함하는 폴리아미드이미드 필름
KR102265389B1 (ko) * 2018-05-04 2021-06-14 주식회사 엘지화학 폴리아미드 필름 적층체
JP7222459B2 (ja) 2018-11-05 2023-02-15 エルジー・ケム・リミテッド ポリアミド樹脂、およびそれを用いた高分子フィルムおよび樹脂積層体
US20210230425A1 (en) * 2019-02-01 2021-07-29 Lg Chem, Ltd. Polyamide resin film and resin laminate using the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160032052A1 (en) * 2014-08-01 2016-02-04 Sumitomo Bakelite Company Limited Process for manufacturing polyamide

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210230425A1 (en) * 2019-02-01 2021-07-29 Lg Chem, Ltd. Polyamide resin film and resin laminate using the same
US11731410B2 (en) 2021-05-28 2023-08-22 Sk Microworks Co., Ltd. Polyamide-based composite film and display device comprising the same

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US20210230425A1 (en) 2021-07-29
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EP3792299B1 (en) 2024-03-06
CN112204083A (zh) 2021-01-08
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