US20200363135A1 - Heat dissipation device and board card - Google Patents

Heat dissipation device and board card Download PDF

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Publication number
US20200363135A1
US20200363135A1 US16/714,681 US201916714681A US2020363135A1 US 20200363135 A1 US20200363135 A1 US 20200363135A1 US 201916714681 A US201916714681 A US 201916714681A US 2020363135 A1 US2020363135 A1 US 2020363135A1
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US
United States
Prior art keywords
heat dissipation
fin
heat
edgefold
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
US16/714,681
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English (en)
Inventor
Kun HE
Huijun LAN
Chongxing ZHU
Jun He
Zhihang Zhang
Kai Ye
Deheng CHEN
Shuai Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cambricon Technologies Corp Ltd
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Cambricon Technologies Corp Ltd
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Publication date
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Assigned to CAMBRICON TECHNOLOGIES CORPORATION LIMITED reassignment CAMBRICON TECHNOLOGIES CORPORATION LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, SHUAI, CHEN, Deheng, HE, JUN, HE, Kun, LAN, Huijun, YE, Kai, ZHANG, ZHIHANG, ZHU, CHONGXING
Publication of US20200363135A1 publication Critical patent/US20200363135A1/en
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
    • F28F1/20—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means being attachable to the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/04—Assemblies of fins having different features, e.g. with different fin densities
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2240/00—Spacing means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/14—Fastening; Joining by using form fitting connection, e.g. with tongue and groove
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2280/00—Mounting arrangements; Arrangements for facilitating assembling or disassembling of heat exchanger parts
    • F28F2280/04—Means for preventing wrong assembling of parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2280/00—Mounting arrangements; Arrangements for facilitating assembling or disassembling of heat exchanger parts
    • F28F2280/08—Tolerance compensating means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks

Definitions

  • the present disclosure relates to electronic products, and specifically to a heat dissipation device and a board card.
  • heat dissipation devices dissipate heat mainly by heat dissipation fins.
  • the contact surface between an electronic element and the heat dissipation fins is generally coated with thermally conductive silicone grease, which enables the heat emitted by the electronic element to be transferred effectively to the heat dissipation fins and then dispersed in the ambient air through the heat dissipation fins.
  • thermally conductive silicone grease which enables the heat emitted by the electronic element to be transferred effectively to the heat dissipation fins and then dispersed in the ambient air through the heat dissipation fins.
  • such heat dissipation device has low heat dissipation efficiency, and it is hard to meet the requirement of heat dissipation of the board card that causes large power consumption.
  • the present disclosure provides a heat dissipation device and a board card, which have higher heat dissipation efficiency. Moreover, the heat dissipation device can do self-localization and thus has high assembling efficiency.
  • the present disclosure provides a heat dissipation device which may include:
  • a fin group including a plurality of heat dissipation fins that form a whole structure
  • a heat pipe group including at least one heat pipe
  • the fin group may be wholly located on one side of the heat pipe group in a first direction, the fin group may contact the heat pipe group in the first direction, the heat dissipation fins may include a first heat dissipation fin that contacts the heat pipe in a second direction so as to localize the heat pipe in the second direction.
  • the heat pipe group may include a plurality of heat pipes that are arranged parallelly in the second direction to form the heat pipe group.
  • the plurality of heat dissipation fins may be arranged parallelly to form the fin group.
  • the first heat dissipation fin may include a first fin body and a first fin inner edgefold.
  • the first fin body may contact the heat pipe(s) in the second direction
  • the first fin inner edgefold may protrude angularly from the first fin body
  • the first fin inner edgefold may contact the heat pipe(s) on one side of the heat pipe(s) in the first direction.
  • the first fin inner edgefold may be formed on part of the first heat dissipation fin in a length direction of the heat pipe(s).
  • the first fin inner edgefold may contact adjacent heat dissipation fins of the fin group.
  • the first heat dissipation fin may further include a first fin outer edgefold.
  • the first fin outer edgefold and the first fin inner edgefold may be located at two ends of the first fin body in the first direction.
  • the heat dissipation fins may further include a second heat dissipation fin.
  • the second heat dissipation fin and the first heat dissipation fin may form a whole structure, and the second heat dissipation fin may contact the heat pipe(s) on one side of the heat pipe(s) in the first direction.
  • the second heat dissipation fin may include a second fin body and a second fin inner edgefold.
  • the second fin inner edgefold may be bent from the second fin body and may contact the heat pipe(s) in the first direction.
  • the second fin inner edgefold may contact adjacent heat dissipation fins in the fin group.
  • the second heat dissipation fin may further include a second fin outer edgefold.
  • the second fin outer edgefold and the second fin inner edgefold may be located at two ends of the second fin body in the first direction.
  • the heat pipe(s) may be a flattening heat pipe(s), and the flattening direction of the flattening heat pipe(s) may be the first direction.
  • the heat dissipation device may further include a metal heat dissipation plate.
  • the metal heat dissipation plate may be located on the other side of the heat pipe group in the first direction, and the metal heat dissipation plate may contact the heat pipe(s).
  • the heat dissipation fins, the heat pipe group and the metal heat dissipation plate may be welded together by reflow soldering.
  • the present disclosure further provides a board card which may include the heat dissipation device in any one of the above embodiments.
  • the heat pipe(s) may receive heat and distribute the heat rapidly, and transfer the heat to the fin group.
  • the fin group may have large heat dissipation area and thus can dissipate the heat into the air rapidly.
  • relative positions of the first heat dissipation fin and the heat pipe(s) can be designed properly to obtain expected locating effect. In this way, the locating fixtures may be saved, and the assembling efficiency may be improved.
  • FIG. 1 is a side view of a board card of the present disclosure according to an embodiment, showing that a heat dissipation device, a chip, and a printed circuit board (PCB) are installed together.
  • PCB printed circuit board
  • FIG. 2 is a three-dimensional structure diagram of a fin group of the heat dissipation device as shown in FIG. 1 .
  • FIG. 3 is a three-dimensional structure diagram of the fin group from another angle of viewpoint of the heat dissipation device as shown in FIG. 1 .
  • FIG. 4 is a three-dimensional structure diagram of a first heat dissipation fin of the heat dissipation device as shown in FIG. 1 .
  • FIG. 5 is a three-dimensional structure diagram of a second heat dissipation fin of the heat dissipation device as shown in FIG. 1 .
  • FIG. 6 is a three-dimensional structure diagram of a heat pipe of the heat dissipation device as shown in FIG. 1 .
  • FIG. 7 is a three-dimensional structure diagram of a first heat dissipation fin of a board card according to another embodiment.
  • FIG. 8 is a three-dimensional structure diagram of a first heat dissipation fin of a board card according to another embodiment.
  • 9 heat dissipation device 90 fin group, 910 second heat dissipation fin, 911 second fin body, 912 second fin inner edgefold, 913 second fin outer edgefold, 920 first heat dissipation fin, 921 first fin body, 9211 first body portion, 9212 second body portion, 922 first fin inner edgefold, 923 first fin outer edgefold, 95 metal heat dissipation plate, 960 heat pipe group, 96 heat pipe, 961 main pipe wall, 962 side pipe wall;
  • T thickness direction L layout direction.
  • the present disclosure provides a heat dissipation device and a board card having the heat dissipation device.
  • the heat dissipation device may be installed in the board card to release the heat generated by a heat-generating device (such as a chip) on the board card.
  • the heat dissipation device can facilitate heat pipe self-localization in a predetermined direction, thus requiring no special locating fixtures, simplifying the welding procedures, and increasing the contact area between a heat dissipation fin and a heat pipe. In this way, the heat dissipation efficiency may be improved.
  • the heat dissipation device 9 may include a fin group 90 , a heat pipe group 960 , and a metal dissipation plate 95 that are in contact successively.
  • the heat pipe group 960 may include a plurality of heat pipes 96 arranged in parallel
  • the fin group 90 may include a plurality of heat dissipation fins arranged in parallel
  • a layout direction L (a second direction) of the plurality of heat pipes 96 is the same as the layout direction L of the plurality of heat dissipation fins.
  • the plurality of heat pipes 96 may extend along a straight line, the heat dissipation fins as a whole may extend in a plane, and the extension direction of plurality of the heat pipes 96 may be parallel to the plane where the plurality of heat dissipation fins are located.
  • the heat dissipation device 9 may not include the metal dissipation plate 95 .
  • the plurality of heat pipes 96 and the plurality of heat dissipation fins may have the same length.
  • the plurality of heat pipes 96 may have a high heat transfer efficiency from one end of the extension direction to the other end. This may help to rapidly transfer heat from one end of each of the plurality of the heat dissipation fins to the other end.
  • the plurality of heat pipes 96 may be flattening pipes, and a flattening direction of the plurality of heat pipes 96 may be a thickness direction T (a first direction) of the plurality of heat pipes 96 .
  • the fin group 90 , the heat pipe group 960 , and the metal heat dissipation plate 95 may be arranged in the thickness direction T of the plurality of heat pipes 96 . In this way, the heat can be transferred from the metal heat dissipation plate 95 to the heat pipe group 960 and then to the fin group 90 in the thickness direction T of the plurality of heat pipes 96 .
  • one side of the heat pipe group 960 and “one side of the heat pipe(s) 96 ” refer to one side of the heat pipe(s) 96 in the thickness direction T, and “the other side of the heat pipe group 960 ” and “the other side of the heat pipe(s) 96 ” refer to the other side of the heat pipe(s) 96 in the thickness direction T.
  • the fin group 90 may be located on one side of the heat pipe group 960 , and the metal heat dissipation plate 95 may be located on the other side of the heat pipe group 960 .
  • the metal heat dissipation plate 95 may be located on one side of a chip 2 , and PCB 1 may be located on other side of the chip 2 .
  • the chip 2 , the metal heat dissipation plate 95 , the heat pipe group 960 and the fin group 90 may be in contact successively.
  • the plurality of heat pipes 96 may be only arranged on a single side of the fin group 90 in the thickness direction T, thus reducing the installation space of the heat pipe group 90 , enabling the heat dissipation device to have a small size in the thickness direction T, and facilitating miniaturization of products.
  • each of the plurality of heat pipes 96 has an oblong-shaped cross section.
  • the thickness direction T of the plurality of heat pipes 96 is the direction where in a minor axis of the cross section is located, and the layout direction L of the plurality of heat pipes 96 is the direction where a major axis is located.
  • Each of the plurality of heat pipes 96 is a flattening heat pipe and thus includes main pipe walls 961 and side pipe walls 962 .
  • the main pipe walls 961 refer to pipe walls on one side and the other side of the plurality of heat pipes 96
  • the side pipe walls 962 are connected to the two main pipe walls (an upper pipe wall and a lower pipe wall) 961 .
  • One heat pipe 96 may have two main pipe walls 961 and two side pipe walls 962 , and the two main pipe walls 961 and the two side pipe walls 962 may extend along the length direction of the heat pipe 96 .
  • the main pipe walls 961 may have a plane shape, and the side pipe walls 962 may have an arcuate shape.
  • the plurality of heat pipes 96 may be shaped by pressing or flattening in opposite directions from two sides of an axis of a cylindrical heat pipe. In this way, the main pipe walls 961 of a plane shape are formed on two opposite sides that are perpendicular to the axis.
  • the main pipe wall 961 on the other side of the plurality of heat pipes 96 may contact a surface of the metal heat dissipation plate 95 . Since the plurality of heat pipes 96 and the metal heat dissipation plate 95 have a large contact area, the heat of the metal heat dissipation plate 95 can be quickly transferred to the plurality of heat pipes 96 .
  • a plurality of second heat dissipation fins 910 and a plurality of first heat dissipation fins 920 may be connected together and form the fin group 90 .
  • a first heat dissipation fin 920 may include a first fin body 921 , a first fin inner edgefold 922 , and a first fin outer edgefold 923 .
  • the first fin body 921 may extend in a plane perpendicular to the layout direction L of the plurality of heat dissipation fins (parallel to the thickness direction T).
  • the first fin inner edgefold 922 and the first fin outer edgefold 923 may be located at two ends of the first heat dissipation fin 920 in the thickness direction T of the heat pipes 96 .
  • the first fin inner edgefold 922 and the first fin outer edgefold 923 may extend in a direction perpendicular to the first fin body 921 .
  • the first fin body 921 may include a first body portion 9211 and a second body portion 9212 , and the second body portion 9212 may extend in the thickness direction T of the plurality of heat pipes 96 from the first body portion 9211 to the plurality of heat pipes 96 .
  • a second heat dissipation fin 910 may have a second fin body 911 , a second fin inner edgefold 912 , and a second fin outer edgefold 913 .
  • the second fin body 911 may extend in the plane perpendicular to the layout direction L of the plurality of heat dissipation fins (parallel to the thickness direction T).
  • the second fin inner edgefold 912 and the second fin outer edgefold 913 may be bent from two opposite edges of the second fin body 911 in the thickness direction T. Specifically, the second fin inner edgefold 912 and the second fin outer edgefold 913 may extend in a direction perpendicular to the second fin body 911 .
  • the plurality of second heat dissipation fins 910 may contact sides of the plurality of heat pipes 96 in the thickness direction T so as to receive heat from the plurality of heat pipes 96 .
  • a plurality of second fin inner edgefolds 912 may wholly contact the sides of the plurality of heat pipes 96 in the thickness direction T, or may partly contact the sides of the plurality of heat pipes 96 in the thickness direction T.
  • the second fin inner edgefolds 912 of the plurality of second heat dissipation fins 910 may contact surfaces of the plurality of heat pipes 96 . It should be understood that in some embodiments, the second fin inner edgefold 912 of only one of the second heat dissipation fins 910 may contact the surface of the plurality of heat pipes 96 .
  • Solder paste may be coated between the fin group 90 and the heat pipe group 960 and coated between the heat pipe group 960 and the metal heat dissipation plate 95 .
  • the fin group 90 , the heat pipe group 960 and the metal heat dissipation plate 95 may be welded together by reflow soldering.
  • Molten solder paste can be filled in a gap between the side pipe walls 962 of two adjacent heat pipes 96 .
  • the solder paste may contact both of the second body portion 9212 and the side pipe walls 962 .
  • the plurality of second heat dissipation fins 910 and one first heat dissipation fin 920 may be arranged alternatively and connected to form the fin group 90 .
  • the first fin inner edgefold 922 and the first fin outer edgefold 923 of the first heat dissipation fin 920 between two heat dissipation fins may contact adjacent heat dissipation fins, such as second fin bodies 911 of adjacent second heat dissipation fins 910 , or first fin bodies 921 of adjacent first heat dissipation fins 920 .
  • the first fin inner edgefold 922 may contact a side of the plurality of heat pipes 96 in the thickness direction T so that it can receive heat of the plurality of heat pipes 96 .
  • the first fin inner edgefold 922 may be connected with the second fin inner edgefold 912 to form a plane.
  • the first fin inner edgefold 922 and the second fin inner edgefold 912 may both contact the main pipe wall 961 on one side of the plurality of heat pipes 96 .
  • the heat dissipation fins can contact the sides of the heat pipes 96 in the thickness direction T in a surface-to-surface contact manner. Since the heat pipes 96 and the heat dissipation fins have a large contact area, the heat absorbed by the heat pipes 96 can be quickly transferred to the heat dissipation fins.
  • the first body portion 9211 of the first heat dissipation fin 920 is located within a span of the second heat dissipation fin 910
  • the second body portion 9212 of the first heat dissipation fin 920 is located within a span of the heat pipes 96 .
  • a span of a component in a direction refers to space that the component spans in the direction.
  • the heat dissipation device 9 may include some first heat dissipation fins 920 , each of which may be located between two adjacent second heat dissipation fins 910 .
  • the first body portion 9211 may be located between two adjacent second fin bodies 911
  • the second body portion 9212 may be located between two adjacent heat pipes 96 .
  • each of the second body portions 9212 of these first heat dissipation fins 920 may contact side pipe walls 962 of two adjacent heat pipes 96 .
  • the heat pipes 96 may transfer heat to the heat dissipation fins not only in the thickness direction T but also in the layout direction L by the second body portions 9212 , thus increasing the contact area of heat transfer of the heat dissipation device 9 .
  • the heat dissipation device 9 can facilitate self-localization of the heat pipes 96 in the layout direction L by the second body portions 9212 of the first heat dissipation fins 920 , thus requiring no locating fixtures and simplifying installation procedures before welding.
  • plate-shaped main surfaces refer to surfaces perpendicular to the thickness direction.
  • the number of and positional relationship of the first heat dissipation fins 920 and the second heat dissipation fins 910 may be adjusted according to parameters of the heat pipes 96 , such as number, size and space.
  • the number of the first heat dissipation fins 920 and the second heat dissipation fins 910 may be set flexibly.
  • one second heat dissipation fin 910 and one first heat dissipation fin 920 may be arranged alternatively, or one second heat dissipation fin 910 and a plurality of first heat dissipation fins 920 may be arranged alternatively, or a plurality of second heat dissipation fins 910 and a plurality of first heat dissipation fins 920 may be arranged alternatively, or only first heat dissipation fins 920 may be arranged but no second heat dissipation fin 910 is arranged.
  • the heat dissipation device 9 may further include some first heat dissipation fins 920 that contact the side pipe walls 962 of the heat pipes 96 at one end and/or the other end of the heat pipe group 960 , where only one main surface of each of the second body portions 9212 contacts the side pipe walls 962 of the heat pipes 96 at one end and/or the other end of the heat pipe group 960 .
  • the number of such first heat dissipation fins 920 may be two, so that the first heat dissipation fins 920 can contact two heat pipes 96 at both ends of the heat pipe group 960 .
  • Such first heat dissipation fins 920 may be heat dissipation fins located at the outermost end of fin group 90 in the layout direction L. In other words, these first heat dissipation fins 920 may be at the outermost end in the layout direction L, and the fin group 90 may not include any other heat dissipation fins. In other words, the heat pipe group 960 and the fin group 90 have roughly the same length.
  • an installation space of the heat pipes 96 may be formed, in the layout direction L, between the second body portions 9212 of every two first heat dissipation fins 920 .
  • the heat pipes 96 can be installed in the installation space and carry out self-localization. In addition, this can avoid waste of the heat dissipation fins and the heat pipes 96 .
  • One first heat dissipation fin 920 may have two second body portions 9212 , and the two second body portions 9212 may be located at both ends of the first fin body 921 in the length direction of the heat pipes 96 .
  • the first fin inner edgefold 922 may be formed on part of the first heat dissipation fin 920 in the length direction of the heat pipes 96 .
  • the first fin inner edgefold 922 may be formed on the two second body portions 9212 in the length direction of the heat pipes 96 .
  • the first fin inner edgefold 922 may extend from one second body portion 9212 to the other second body portion 9212 and contact the surface of the main pipe wall 961 on one side of the heat pipes 96 . Or, as shown in FIG. 7 , in some embodiments, the first fin inner edgefold 922 may extend between part of the two second body portions 9212 .
  • a first heat dissipation fin 920 may have three or more second body portions 9212 , and the first fin inner edgefold 922 may be formed between every two second body portions 9212 ; or, a first heat dissipation fin 920 may have a second body portion 9212 .
  • the plurality of heat dissipation fins may form the fin group 90 in several ways, such as fastening (by providing a fastening portion on each of the heat dissipation fins), welding, or the like, that are commonly seen in the prior art.
  • All of cross sections of the second heat dissipation fin 910 with the fastening portion removed have the same shape, such as a “U” shape or an “L” shape.
  • heat of the chip 2 is transferred to the metal heat dissipation plate 95 . Since the metal heat dissipation plate 95 has a high thermal conductivity, the heat can be quickly transferred to the heat pipes 96 . After the heat pipes 96 receive the heat from the metal heat dissipation plate 95 , the heat is distributed rapidly and transferred to the fin group 90 . The fin group 90 have a large heat dissipation area, so the heat can be quickly dissipated into the air.
  • the metal heat dissipation plate 95 can support the heat pipes 96 and heat dissipation fins and ensure flatness of the contact area between the heat dissipation device 9 and the chip 2 .
  • the first heat dissipation fins 920 can contact the heat pipes 96 in the layout direction L so as to locate the heat pipes. Therefore, the heat dissipation device 9 may be assembled by just abutting the heat pipes 96 on the second body portions 9212 of the first heat dissipation fins 920 . In this way, no locating fixtures is required, and the assembling efficiency can be greatly improved.
  • the heat dissipation fins installed between two heat pipes 96 may contact the heat pipes 96 through part of the bodies of the fins extending along the thickness direction T of the heat pipes 96 , thereby reducing the number of heat dissipation fins that do not contact the heat pipes 96 , or avoiding the case that the heat dissipation fins do not contact the heat pipes 96 . Therefore, inefficient heat dissipation on both sides of each of the heat pipes 96 can be reduced or avoided, the contact area between the heat pipes 96 and the heat dissipation fins can be increased, and the heat transfer efficiency of the heat dissipation device 9 can be improved.
  • the heat dissipation efficiency of the heat dissipation device may be higher if the first fin inner edgefold 922 and the second body portions 9212 of each of the first heat dissipation fins 920 all contact the heat pipes 96 .
  • the heat dissipation efficiency of the heat dissipation device may be higher if the main pipe wall 961 and the side pipe walls 962 of each of the heat pipes 96 all contact the heat dissipation fins.
  • the heat dissipation fins of the fin group 90 are arranged separately, so the heat dissipation fins can be added or removed to form fin groups 90 of different sizes for adapting to board cards having varied heat dissipation requirements.
  • the rest of parts of the heat dissipation fins may be arranged on one side of the fin group 960 in the thickness direction T.
  • the fin group 90 can wholly contact the heat pipe group 960 in the thickness direction T.
  • the present disclosure takes the thickness direction T as the first direction and takes the layout direction L as the second direction.
  • the first direction and the second direction may vary in other cases within the idea of the disclosure.
  • the board card provided in the present disclosure may include the above-mentioned heat dissipation device 9 .
  • the heat dissipation device 9 can be installed on PCB 1 by screwing.
  • screws 3 may be connected between the PCB 1 and the metal heat dissipation plate 95 to ensure close contact between the heat dissipation device and the PCB 1 .
  • the chip provided in the present disclosure may be an AI accelerating card, a sound card, a display card, a graphics card, or the like.
  • the metal heat dissipation plate 95 may be an aluminum plate or a copper plate.
  • the heat pipes 96 may have an oblong cross section after being flattened.
  • the “oblong” shape mentioned in the present disclosure may include a standard oblong shape and a shape similar to the standard oblong shape as long as planar main pipe walls 961 are formed on two opposite sides of the heat pipes 96 perpendicular to the length direction.
  • only one heat pipe may be provided, or a U-shaped heat pipe may be provided.
  • the fin group 90 may be a whole structure.
  • the fin group 90 may include a substrate and a plurality of heat dissipation fins extending along a direction perpendicular to the substrate, the plurality of heat dissipation fins and the substrate may be integrally connected, and the plurality of heat dissipation fins may contact each other by the substrate.
  • the heat dissipation 9 and the PCB 1 may be indirectly connected by an adaptor.
  • the adaptor may be fixed on the heat dissipation device 9 by welding or the like, and connected to the PCB 1 , for example, by the screws 3 .
  • the first heat dissipation fin 920 may not include the first fin inner edgefold 922 , and the complete second body portion 9212 may extend from the first body portion 9211 ; or as shown in FIG. 8 , the first fin inner edgefold 922 may be formed on the complete first heat dissipation fin 920 in the length direction of the plurality of heat pipes 96 .
  • the plurality of heat dissipation fins may not have outer edgefolds.
  • the “contact” in the present disclosure may be direct contact or indirect contact.
  • the indirect contact may include contact through heat conduction materials, such as heat conduction silicone grease, heat conduction gel, or the like.
  • first fin inner edgefold 922 may protrude angularly from the first fin body 921 .
  • the first fin inner edgefold 922 may be perpendicular or not perpendicular to the first fin body 921 ; the first fin inner edgefold 922 and the first fin body 921 may be integrally connected or separately formed.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US16/714,681 2019-05-15 2019-12-13 Heat dissipation device and board card Pending US20200363135A1 (en)

Applications Claiming Priority (2)

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CN201910406766.2 2019-05-15
CN201910406766.2A CN111954432B (zh) 2019-05-15 2019-05-15 散热装置和板卡

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EP (1) EP3739285B1 (zh)
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113810201A (zh) * 2021-09-16 2021-12-17 善悦(武汉)高新技术有限公司 一种5g加速卡通信模块、加速卡及通信传输方法
JP7082308B1 (ja) * 2021-11-30 2022-06-08 富士通クライアントコンピューティング株式会社 情報処理装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130014917A1 (en) * 2011-07-14 2013-01-17 Tsung-Hsien Huang Heat pipe-attached heat sink with bottom radiation fins
US20130025830A1 (en) * 2011-07-27 2013-01-31 Cooler Master Co., Ltd. Heat sink assembly of fin module and heat pipes

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3851875B2 (ja) * 2003-01-27 2006-11-29 株式会社東芝 冷却装置及び電子機器
US20050098300A1 (en) * 2003-09-12 2005-05-12 Kenya Kawabata Heat sink with heat pipes and method for manufacturing the same
US7753110B2 (en) * 2007-12-10 2010-07-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
CN101528018A (zh) * 2008-03-07 2009-09-09 富准精密工业(深圳)有限公司 散热装置及其制造方法
CN101594764B (zh) * 2008-05-28 2011-05-11 富准精密工业(深圳)有限公司 散热装置及其制造方法
US20110061847A1 (en) * 2009-09-11 2011-03-17 Meng-Hsiu Hsieh Heat dissipation device
US20110315365A1 (en) * 2010-06-23 2011-12-29 Shyh-Ming Chen Heat sink and method for manufacturing the same
US20130118717A1 (en) * 2011-11-16 2013-05-16 Cooler Master Co., Ltd. Heat-dissipating device and method for fabricating the same
CN104185401A (zh) * 2013-05-27 2014-12-03 纬创资通股份有限公司 散热装置
JP6117288B2 (ja) * 2015-07-14 2017-04-19 古河電気工業株式会社 冷却装置
JP6456891B2 (ja) * 2016-09-23 2019-01-23 レノボ・シンガポール・プライベート・リミテッド 電子機器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130014917A1 (en) * 2011-07-14 2013-01-17 Tsung-Hsien Huang Heat pipe-attached heat sink with bottom radiation fins
US20130025830A1 (en) * 2011-07-27 2013-01-31 Cooler Master Co., Ltd. Heat sink assembly of fin module and heat pipes

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113810201A (zh) * 2021-09-16 2021-12-17 善悦(武汉)高新技术有限公司 一种5g加速卡通信模块、加速卡及通信传输方法
JP7082308B1 (ja) * 2021-11-30 2022-06-08 富士通クライアントコンピューティング株式会社 情報処理装置

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EP3739285B1 (en) 2023-03-22
CN111954432B (zh) 2023-10-13
CN111954432A (zh) 2020-11-17

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