US20200058817A1 - Bifacial tube-type perc solar cell, preparation method thereof, and production device therefor - Google Patents

Bifacial tube-type perc solar cell, preparation method thereof, and production device therefor Download PDF

Info

Publication number
US20200058817A1
US20200058817A1 US16/345,751 US201716345751A US2020058817A1 US 20200058817 A1 US20200058817 A1 US 20200058817A1 US 201716345751 A US201716345751 A US 201716345751A US 2020058817 A1 US2020058817 A1 US 2020058817A1
Authority
US
United States
Prior art keywords
film
silicon
rear surface
silicon wafer
pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US16/345,751
Other languages
English (en)
Inventor
Jiebin Fang
Kang-Cheng Lin
Chun-Wen Lai
Nailin He
Wenjie YIN
Ta-Neng Ho
Gang Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang Aiko Solar Energy Technology Co Ltd
Guangdong Aiko Solar Energy Technology Co Ltd
Original Assignee
Zhejiang Aiko Solar Energy Technology Co Ltd
Guangdong Aiko Solar Energy Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhejiang Aiko Solar Energy Technology Co Ltd, Guangdong Aiko Solar Energy Technology Co Ltd filed Critical Zhejiang Aiko Solar Energy Technology Co Ltd
Assigned to GUANGDONG AIKO SOLAR ENERGY TECHNOLOGY CO., LTD., ZHEJIANG AIKO SOLAR ENERGY TECHNOLOGY CO., LTD. reassignment GUANGDONG AIKO SOLAR ENERGY TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, GANG, FANG, Jiebin, HE, Nailin, HO, TA-NENG, LAI, CHUN-WEN, LIN, KANG-CHENG, YIN, Wenjie
Publication of US20200058817A1 publication Critical patent/US20200058817A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0236Special surface textures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
    • H01L31/068Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
    • H01L31/0684Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells double emitter cells, e.g. bifacial solar cells
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/308Oxynitrides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/34Nitrides
    • C23C16/345Silicon nitride
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40Oxides
    • C23C16/401Oxides containing silicon
    • C23C16/402Silicon dioxide
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40Oxides
    • C23C16/403Oxides of aluminium, magnesium or beryllium
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54Apparatus specially adapted for continuous coating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/56After-treatment
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32733Means for moving the material to be treated
    • H01J37/32743Means for moving the material to be treated for introducing the material into processing chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32798Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32899Multiple chambers, e.g. cluster tools
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02109Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/02164Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02109Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/0217Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02109Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02172Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
    • H01L21/02175Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
    • H01L21/02178Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing aluminium, e.g. Al2O3
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67294Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0224Electrodes
    • H01L31/022408Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0236Special surface textures
    • H01L31/02363Special surface textures of the semiconductor body itself, e.g. textured active layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/036Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/036Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
    • H01L31/0392Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
    • H01L31/068Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/186Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/186Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
    • H01L31/1868Passivation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876Particular processes or apparatus for batch treatment of the devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02225Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • H01L21/02271Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H01L21/02274Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/547Monocrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention employs tubular PECVD technology to deposit a composite film on the rear surface of a silicon wafer in order to produce a bifacial high-efficiency PERC solar cell. Due to the fact that tubular PECVD technology adopts a direct plasma method and could flexibly adjust the composition and combination of layers in a composite membrane, the passivation effect of the film is good; the photoelectric conversion efficiency of the PERC solar cell can be significantly improved.
  • the excellent passivation ability and process flexibility of tubular PECVD technology allow the thickness of an aluminum oxide film to be reduced, thus reducing the consumption of TMA.
  • tubular PERC technology can be easily maintained and has a high uptime. In view of the above, employing tubular PECVD technology to produce high-efficiency PERC cells has a significant overall cost advantage over employing plate PECVD technology.
  • the rear surface composite film forms 30-500 parallel-arranged laser grooving regions by laser grooving; each laser grooving region includes at least 1 set of laser grooving unit; the rear aluminum grid line is connected to the P-type silicon via the laser grooving regions; the rear aluminum grid line is perpendicularly connected to the rear silver major grid line.
  • depositing the rear surface composite film on the rear surface of the silicon wafer includes the following:
  • the present invention also provides a production device for the bifacial tube-type PERC solar cell, the device is the tubular PECVD device, which includes a silicon wafer loading area, a furnace body, a gas cabinet, a vacuum system, a control system, and a graphite boat; the gas cabinet is provided with a first gas line for silane, a second gas line for ammonia, a third gas line for trimethylaluminum, and a fourth gas line for nitrous oxide;
  • silicon nitride is the outer layer of the rear surface composite film; as the deposition time increases, the thickness of the film increases, which causes silicon wafer to bend.
  • the silicon nitride deposition temperature is limited to 390-410° C.
  • the deposition time is limited to 100-400s.
  • FIG. 8 is a schematic diagram of the sixth embodiment of the rear surface composite film of FIG. 1 .
  • the rear silver major grid line 1 of the present invention could also be arranged in spaced segments. The adjacent segments are connected by a connecting line. There are 2-8 rear silver major grid lines 1 , each with a width of 0.5-5 mm.
  • the tubular PECVD device is provided with four gas lines of silane, ammonia, trimethyl aluminum, and nitrous oxide; the four gas lines are used alone or in combination to form the aluminum oxide film, the silicon dioxide film, the silicon oxynitride film, and the silicon nitride film.
  • the ratio of the gas flow it is possible to obtain a silicon oxynitride film or a silicon nitride film having different composition ratios and refractive indexes.
  • the order of formation and the thickness of the aluminum oxide film, the silicon dioxide film, the silicon oxynitride film, and the silicon nitride film are adjustable; the composition and refractive index of the silicon oxynitride film and the silicon nitride film are adjustable.
  • the present invention adequately increases the angle of inclination of the inclined surface of the pin cap and the thickness of the pin cap, and adjusts the automatic wafer inserter, thereby slightly increasing the distance between the silicon wafer and the graphite boat wall, reducing scratching.
  • Increasing the angle of inclination of the inclined surface of the pin cap also reduces the impact force on the silicon wafer from the graphite boat when the silicon wafer is sliding down the inclined surface, reducing breakage rate.
  • a tubular PECVD device including:
  • nitrous oxide Depositing a silicon dioxide film using nitrous oxide.
  • the flow rate of nitrous oxide is 0.1-5 slm; the plasma power is 2000-5000 W.
  • the large distance between the silicon wafer and the graphite boat wall may prevent the silicon wafer from properly inserting into the pin slot, and the silicon wafer may fall off as a result. If the distance between the silicon wafer and the graphite boat plate were too small, the silicon wafer would be closely attached to the graphite boat plate. As a result, undesirable coating would be less likely to take place, but the possibility of scratching would increase.
  • the present invention maintains a laser power of above 14W, a laser scribing speed of above 12 m/s, and a frequency of above 500 kHZ. This allows the absorption of a sufficiently large amount of laser energy in per unit area of the rear surface composite film to effectively groove the composite film; as a result, the aluminum paste subsequently printed is in contact with the silicon substrate through the laser grooving regions.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Analytical Chemistry (AREA)
  • Photovoltaic Devices (AREA)
  • Chemical Vapour Deposition (AREA)
  • Formation Of Insulating Films (AREA)
US16/345,751 2017-05-18 2017-05-25 Bifacial tube-type perc solar cell, preparation method thereof, and production device therefor Abandoned US20200058817A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201710353392.3A CN107256898B (zh) 2017-05-18 2017-05-18 管式perc双面太阳能电池及其制备方法和专用设备
CN201710353392.3 2017-05-18
PCT/CN2017/086030 WO2018209729A1 (zh) 2017-05-18 2017-05-25 管式perc双面太阳能电池及其制备方法和专用设备

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/086030 A-371-Of-International WO2018209729A1 (zh) 2017-05-18 2017-05-25 管式perc双面太阳能电池及其制备方法和专用设备

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US17/128,494 Continuation US20210111295A1 (en) 2017-05-18 2020-12-21 Tubular pecvd device for bifacial perc solar cell
US17/128,459 Continuation US11848395B2 (en) 2017-05-18 2020-12-21 Preparation method for bifacial perc solar cell

Publications (1)

Publication Number Publication Date
US20200058817A1 true US20200058817A1 (en) 2020-02-20

Family

ID=60027586

Family Applications (3)

Application Number Title Priority Date Filing Date
US16/345,751 Abandoned US20200058817A1 (en) 2017-05-18 2017-05-25 Bifacial tube-type perc solar cell, preparation method thereof, and production device therefor
US17/128,494 Abandoned US20210111295A1 (en) 2017-05-18 2020-12-21 Tubular pecvd device for bifacial perc solar cell
US17/128,459 Active 2038-11-23 US11848395B2 (en) 2017-05-18 2020-12-21 Preparation method for bifacial perc solar cell

Family Applications After (2)

Application Number Title Priority Date Filing Date
US17/128,494 Abandoned US20210111295A1 (en) 2017-05-18 2020-12-21 Tubular pecvd device for bifacial perc solar cell
US17/128,459 Active 2038-11-23 US11848395B2 (en) 2017-05-18 2020-12-21 Preparation method for bifacial perc solar cell

Country Status (6)

Country Link
US (3) US20200058817A1 (zh)
EP (1) EP3627563A4 (zh)
JP (1) JP6825101B2 (zh)
KR (1) KR102195596B1 (zh)
CN (1) CN107256898B (zh)
WO (1) WO2018209729A1 (zh)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112921302A (zh) * 2021-01-22 2021-06-08 无锡松煜科技有限公司 光伏电池双向进气钝化沉积装置
CN113140646A (zh) * 2021-04-23 2021-07-20 南通天晟新能源科技有限公司 太阳能电池p区栅线结构及其制备方法、太阳能电池
CN113430503A (zh) * 2021-07-15 2021-09-24 大连连城数控机器股份有限公司 一种可镀多种膜的管式pecvd石墨舟结构
CN113715178A (zh) * 2021-07-26 2021-11-30 浙江华熔科技有限公司 一种石墨舟板加工辅助夹持装置
EP3866210A4 (en) * 2018-10-12 2021-12-01 Zhejiang Aiko Solar Energy Technology Co., Ltd. METHOD OF REMOVING EXCESS FILM FROM THE FRONT SURFACE OF A CRYSTALLINE SILICON SOLAR CELL
CN113981415A (zh) * 2021-10-25 2022-01-28 晶澳太阳能有限公司 管式pecvd系统的流量计异常工作的确定方法及装置
US20220102534A1 (en) * 2019-02-15 2022-03-31 Semiconductor Energy Laboratory Co., Ltd. Method for fabricating semiconductor device

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108165955A (zh) * 2017-12-06 2018-06-15 中建材浚鑫科技有限公司 一种新型石墨舟
CN108074997B (zh) * 2017-12-22 2024-09-27 广东爱旭科技股份有限公司 管式perc双面太阳电池及其制备方法和专用电镀设备
DE102018108158B4 (de) * 2018-04-06 2023-06-07 Hanwha Q Cells Gmbh Bifazial-Solarzelle, Solarmodul und Herstellungsverfahren für eine Bifazial-Solarzelle
CN109148613A (zh) * 2018-08-23 2019-01-04 宁波尤利卡太阳能科技发展有限公司 一种抗pid双面perc太阳电池的制备方法
CN109385622A (zh) * 2018-12-25 2019-02-26 南京爱通智能科技有限公司 一种适用于超大产量的原子层沉积设备的流道结构
CN109371383A (zh) * 2018-12-25 2019-02-22 南京爱通智能科技有限公司 一种适用于超大规模原子层沉积设备的载具
CN109888060A (zh) * 2019-03-15 2019-06-14 通威太阳能(合肥)有限公司 一种具有三层钝化层结构的太阳电池及其制备方法
CN109980046A (zh) * 2019-03-29 2019-07-05 山西潞安太阳能科技有限责任公司 单晶perc电池背钝化结构
CN110106493B (zh) * 2019-04-26 2021-05-14 湖南红太阳光电科技有限公司 利用管式pecvd设备制备背面钝化膜的方法
CN110299421B (zh) * 2019-07-09 2020-08-14 理想晶延半导体设备(上海)有限公司 介质膜沉积方法
CN110311015B (zh) * 2019-07-09 2020-05-22 理想晶延半导体设备上海(有限)公司 晶硅太阳能电池的薄膜沉积方法
CN110295358B (zh) * 2019-07-10 2021-01-15 平煤隆基新能源科技有限公司 一种低el黑斑的pecvd机台饱和工艺
CN110400769B (zh) * 2019-07-18 2022-02-18 晶澳太阳能有限公司 石墨框的饱和方法以及石墨框
CN110791749A (zh) * 2019-12-09 2020-02-14 苏州拓升智能装备有限公司 电极间隔离结构、气相沉积设备和石墨舟
CN111020531B (zh) * 2019-12-18 2024-03-22 常州时创能源股份有限公司 一种组合式石墨舟套管和石墨舟
CN110957378A (zh) * 2019-12-25 2020-04-03 浙江爱旭太阳能科技有限公司 一种提升p型双面电池双面率的背膜及其制备方法
CN111584666A (zh) * 2020-06-09 2020-08-25 山西潞安太阳能科技有限责任公司 一种新的p型晶硅电池结构及其制备工艺
CN114420768A (zh) * 2020-10-13 2022-04-29 意诚新能(苏州)科技有限公司 一种背面钝化膜、制备方法及晶硅太阳能电池
CN112234007A (zh) * 2020-10-27 2021-01-15 金寨嘉悦新能源科技有限公司 一种可改善片内色差的新型石墨框
CN112768552B (zh) * 2020-12-11 2023-12-22 宁波尤利卡太阳能股份有限公司 一种双面perc电池的制备方法
CN112652681A (zh) * 2020-12-23 2021-04-13 横店集团东磁股份有限公司 一种perc太阳能电池背钝化膜、其制备方法及perc太阳能电池
CN114759097B (zh) 2020-12-29 2022-10-18 浙江晶科能源有限公司 太阳能电池及其制备方法、光伏组件
CN112736145B (zh) * 2020-12-29 2022-09-13 正泰新能科技有限公司 一种太阳能电池的背面结构和含该背面结构的太阳能电池
CN113675295B (zh) * 2021-07-12 2022-07-26 深圳市捷佳伟创新能源装备股份有限公司 PECVD制备硅片复合膜的方法和TOPCon电池的制备方法
CN113621946A (zh) * 2021-08-03 2021-11-09 横店集团东磁股份有限公司 一种叠层背膜及其制备方法
CN113913788A (zh) * 2021-08-25 2022-01-11 浙江爱旭太阳能科技有限公司 一种用于产业化生产的正背面镀膜设备及方法
CN113851557A (zh) * 2021-09-17 2021-12-28 通威太阳能(安徽)有限公司 一种perc电池及其制备方法
CN116732501B (zh) * 2023-08-09 2023-10-10 福建福碳新材料科技有限公司 一种三代半导体用等静压石墨舟用支撑舟脚

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5279682A (en) * 1991-06-11 1994-01-18 Mobil Solar Energy Corporation Solar cell and method of making same
US20150179837A1 (en) * 2013-12-24 2015-06-25 Lg Electronics Inc. Solar cell and method for manufacturing the same

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201012941Y (zh) * 2007-01-29 2008-01-30 刘卓 硅片生产中使用的石墨舟
US8288645B2 (en) * 2009-03-17 2012-10-16 Sharp Laboratories Of America, Inc. Single heterojunction back contact solar cell
KR20140117420A (ko) * 2012-01-03 2014-10-07 어플라이드 머티어리얼스, 인코포레이티드 Si 태양 전지들의 표면 부동태화의 성능 및 안정성을 개선하기 위한 버퍼 층
JP6098259B2 (ja) * 2013-03-19 2017-03-22 豊田合成株式会社 半導体装置の製造方法
CN103489934B (zh) * 2013-09-25 2016-03-02 晶澳(扬州)太阳能科技有限公司 一种双面透光的局部铝背场太阳能电池及其制备方法
DE102013219603A1 (de) * 2013-09-27 2015-04-02 International Solar Energy Research Center Konstanz E.V. Verfahren zur Herstellung einer Solarzelle
CN105706245B (zh) * 2013-11-07 2017-06-16 三菱电机株式会社 太阳能电池及其制造方法、太阳能电池模块
TWM477673U (zh) * 2013-12-04 2014-05-01 Tsec Corp 具改良背結構之太陽能電池
CN103904158A (zh) * 2014-01-10 2014-07-02 浙江晶科能源有限公司 一种改善管式pecvd系统镀膜均匀性的方法
JP6176811B2 (ja) * 2014-06-25 2017-08-09 株式会社日立国際電気 半導体装置の製造方法、基板処理装置およびプログラム
KR101602782B1 (ko) * 2014-07-03 2016-03-11 주식회사 이오테크닉스 웨이퍼 마킹 방법
US20160005915A1 (en) * 2014-07-03 2016-01-07 Sino-American Silicon Products Inc. Method and apparatus for inhibiting light-induced degradation of photovoltaic device
TW201635561A (zh) * 2015-03-26 2016-10-01 新日光能源科技股份有限公司 具有背面多層抗反射鍍膜的太陽能電池
TWI542022B (zh) * 2015-04-02 2016-07-11 新日光能源科技股份有限公司 太陽能電池及其背面電極的製造方法
DE102015004419A1 (de) * 2015-04-02 2016-10-06 Centrotherm Photovoltaics Ag Waferboot und Plasma-Behandlungsvorrichtung für Wafer
CN204558431U (zh) * 2015-04-24 2015-08-12 上海弘枫实业有限公司 一种大功率太阳能电池片石墨舟
DE202015004065U1 (de) * 2015-06-09 2015-07-30 Solarworld Innovations Gmbh Solarzellenanordnung
CN106531839A (zh) * 2015-09-11 2017-03-22 镇江鹏飞光伏技术有限公司 石墨舟直型槽工艺点及其生产工艺
CN205789903U (zh) * 2016-06-02 2016-12-07 苏州阿特斯阳光电力科技有限公司 一种饱和用管式pecvd石墨舟
CN206015086U (zh) * 2016-07-25 2017-03-15 苏州阿特斯阳光电力科技有限公司 一种适用于perc电池双面管式pecvd镀膜的石墨舟
CN106449877A (zh) * 2016-10-17 2017-02-22 浙江晶科能源有限公司 一种perc电池的制备方法
CN106449876B (zh) * 2016-10-17 2017-11-10 无锡尚德太阳能电力有限公司 选择性发射极双面perc晶体硅太阳能电池的制作方法
CN106887475B (zh) * 2017-03-03 2019-07-05 广东爱旭科技股份有限公司 P型perc双面太阳能电池及其组件、系统和制备方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5279682A (en) * 1991-06-11 1994-01-18 Mobil Solar Energy Corporation Solar cell and method of making same
US20150179837A1 (en) * 2013-12-24 2015-06-25 Lg Electronics Inc. Solar cell and method for manufacturing the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3866210A4 (en) * 2018-10-12 2021-12-01 Zhejiang Aiko Solar Energy Technology Co., Ltd. METHOD OF REMOVING EXCESS FILM FROM THE FRONT SURFACE OF A CRYSTALLINE SILICON SOLAR CELL
US20220102534A1 (en) * 2019-02-15 2022-03-31 Semiconductor Energy Laboratory Co., Ltd. Method for fabricating semiconductor device
CN112921302A (zh) * 2021-01-22 2021-06-08 无锡松煜科技有限公司 光伏电池双向进气钝化沉积装置
CN113140646A (zh) * 2021-04-23 2021-07-20 南通天晟新能源科技有限公司 太阳能电池p区栅线结构及其制备方法、太阳能电池
CN113430503A (zh) * 2021-07-15 2021-09-24 大连连城数控机器股份有限公司 一种可镀多种膜的管式pecvd石墨舟结构
CN113715178A (zh) * 2021-07-26 2021-11-30 浙江华熔科技有限公司 一种石墨舟板加工辅助夹持装置
CN113981415A (zh) * 2021-10-25 2022-01-28 晶澳太阳能有限公司 管式pecvd系统的流量计异常工作的确定方法及装置

Also Published As

Publication number Publication date
US20210111295A1 (en) 2021-04-15
KR102195596B1 (ko) 2020-12-30
JP2020506529A (ja) 2020-02-27
EP3627563A1 (en) 2020-03-25
CN107256898B (zh) 2018-08-03
US11848395B2 (en) 2023-12-19
KR20190061049A (ko) 2019-06-04
WO2018209729A1 (zh) 2018-11-22
JP6825101B2 (ja) 2021-02-03
US20210226077A1 (en) 2021-07-22
EP3627563A4 (en) 2020-10-28
CN107256898A (zh) 2017-10-17

Similar Documents

Publication Publication Date Title
US11848395B2 (en) Preparation method for bifacial perc solar cell
EP3627561A1 (en) Tubular perc single-sided photovoltaic cell and method for fabrication thereof and dedicated device
WO2021031500A1 (zh) 一种复合介电钝化层结构太阳电池及其制备工艺
CN102339872B (zh) 一种晶体硅太阳能电池多层氮化硅减反射膜及其制备方法
CN110010721B (zh) 一种基于se的碱抛光高效perc电池工艺
WO2018157492A1 (zh) P型perc太阳能电池的制备方法、电池、组件和系统
CN107331730B (zh) 管式perc太阳能电池的修复工艺及制备工艺
CN102437238A (zh) 一种用于晶体硅太阳电池硼掺杂的方法
CN109192813A (zh) Perc电池背面钝化工艺
CN102534547A (zh) 一种晶体硅太阳电池的渐变减反射氮化硅薄膜的制备工艺
CN102157613A (zh) 一种hlf晶体硅太阳电池及其制备方法
CN108074998B (zh) 管式perc双面太阳电池及其制备方法和专用电镀设备
CN112071953A (zh) 一种板式设备制备钝化接触太阳能电池的方法及装置
CN108074997B (zh) 管式perc双面太阳电池及其制备方法和专用电镀设备
CN110739366A (zh) 一种修复perc太阳能电池背膜激光开槽损伤的方法
CN111403551A (zh) 一种高效单晶硅perc太阳能电池的制备方法
CN202217668U (zh) 一种晶体硅太阳能电池多层氮化硅减反射膜
Wu et al. 21.4% efficiency bifacial multi-Si PERC cells and 410W modules
CN219040488U (zh) 一种perc电池背面复合钝化膜和perc电池
CN208157425U (zh) 一种单晶掺镓太阳电池
CN202905730U (zh) 一种超低表面掺杂浓度的低方阻硅太阳电池
CN118676249A (zh) 一种TOPCon电池的制备方法及TOPCon电池
CN118507545A (zh) TOPCon电池及其制备方法
CN117239009A (zh) 一种基于pecvd工艺的电池钝化结构的制备方法
CN110943103A (zh) 一种硅基钙钛矿双二极管双面太阳电池及其制备方法

Legal Events

Date Code Title Description
AS Assignment

Owner name: GUANGDONG AIKO SOLAR ENERGY TECHNOLOGY CO., LTD., CHINA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:FANG, JIEBIN;LIN, KANG-CHENG;LAI, CHUN-WEN;AND OTHERS;REEL/FRAME:049055/0808

Effective date: 20190428

Owner name: ZHEJIANG AIKO SOLAR ENERGY TECHNOLOGY CO., LTD., CHINA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:FANG, JIEBIN;LIN, KANG-CHENG;LAI, CHUN-WEN;AND OTHERS;REEL/FRAME:049055/0808

Effective date: 20190428

STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: ADVISORY ACTION MAILED

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION