US20170269125A1 - Contact probe for a testing head - Google Patents

Contact probe for a testing head Download PDF

Info

Publication number
US20170269125A1
US20170269125A1 US15/309,776 US201615309776A US2017269125A1 US 20170269125 A1 US20170269125 A1 US 20170269125A1 US 201615309776 A US201615309776 A US 201615309776A US 2017269125 A1 US2017269125 A1 US 2017269125A1
Authority
US
United States
Prior art keywords
contact probe
insert
contact
section
height
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US15/309,776
Other languages
English (en)
Inventor
Roberto Crippa
Giuseppe Crippa
Raffaele Vallauri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Technoprobe SpA
Original Assignee
Technoprobe SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technoprobe SpA filed Critical Technoprobe SpA
Publication of US20170269125A1 publication Critical patent/US20170269125A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point

Definitions

  • the present disclosure refers to a contact probe for a testing head.
  • the disclosure refers in particular, but not exclusively, to a contact probe of a testing head of a testing apparatus of electronic devices integrated on wafers and the following description is made with reference to this field of application with the only purpose of simplifying its exposition.
  • a testing head is a device adapted to place a plurality of contact pads of a microstructure, in particular an electronic device that is integrated on a wafer, into electrical contact with corresponding channels of a testing machine performing the working test thereof, in particular the electrical test, or generically the test.
  • the test which is performed on integrated devices, is particularly useful to detect and isolate defective devices yet in the manufacturing step.
  • the testing heads are thus used to electrically test the devices that are integrated on a wafer before cutting and assembling them inside a chip containing package.
  • a testing head usually comprises a large number of contact elements or contact probes made of wires of special alloys having good electrical and mechanical properties and provided with at least one contact portion for a corresponding plurality of contact pads of a device to be tested.
  • a testing head comprising vertical probes, which is usually called “vertical probe head”, comprises a plurality of contact probes retained by at least one pair of plates or guides, which are substantially plate-shaped and parallel to each other. Those guides are provided with suitable holes and are arranged at a certain distance from each other so as to leave a free space or air gap for the movement and the possible deformation of the contact probes.
  • the pair of guides comprises in particular an upper guide and a lower guide, both provided with respective guide holes where the contact probes axially slide, the probes being usually made of wires of special alloys having good electrical and mechanical properties.
  • the good connection between the contact probes and the contact pads of the device to be tested is realized by pressing the testing head on the device itself, the contact probes, which are movable within the guide holes made in the upper and lower guides, undergoing a bending inside the air gap between the two guides and sliding within such guide holes during that pressing contact.
  • the bending of the contact probes in the air gap can be assisted by means of a suitable configuration of the probes themselves or of their guides, as schematically shown in FIG. 1 , wherein, for sake of illustration simplicity, only one contact probe of the plurality of probes usually included in a testing head has been shown, the shown testing head being of the so-called shifted plates type.
  • FIG. 1 schematically shows a testing head 1 comprising at least one upper plate or guide 2 and one lower plate or guide 3 , having respective upper guide hole 2 A and lower guide hole 3 A where at least one contact probe 4 slides.
  • the contact probe 4 has at least one contact end or contact tip 4 A.
  • end or tip mean an end portion, not necessarily being sharp.
  • the contact tip 4 A abuts onto a contact pad 5 A of a device to be tested 5 , realizing the mechanical and electrical contact between that device and a testing apparatus (not shown) of which such testing head is a terminal element.
  • the contact probes are fixedly fastened to the head itself in correspondence of the upper guide: in such case, the testing heads are referred to as blocked probe testing heads.
  • testing heads having probes not fixedly fastened are used, those probes being interfaced to a board by means of a micro-contact board; those testing heads are referred to as non-blocked probe testing heads.
  • the micro-contact board is usually called “space transformer” since, besides contacting the probes, it also allows to spatially redistribute the contact pads made on it with respect to the contact pads of the device to be tested, in particular relaxing the distance constraints between the centers of the pads themselves.
  • the contact probe 4 has a further contact tip 4 B, which in this technical field is referred to as contact head, towards a plurality of contact pads 6 A of such a space transformer 6 .
  • the good electrical contact between probes and space transformer is guaranteed in a similar manner to the contact with the device to be tested by pressing the contact heads 4 B of the contact probes 4 against the contact pads 6 A of the space transformer 6 .
  • the upper 2 and lower 3 guides are suitably spaced by an air gap 7 which allows the deformation of the contact probes 4 and ensures the contact of the contact tip and of the contact head of the contact probes 4 with the contact pads of the device to be tested 5 and of the space transformer 6 , respectively.
  • the upper 2 A and lower 3 A guide holes are sized so as to allow a sliding movement of the contact probe 4 therein.
  • a testing head having contact probes protruding from a support, usually made of a ceramic material, possibly suitably preformed so as to ensure a proper bending thereof during the contact with the pads of a device to be tested. Such probes are further deformed when contacting the pads of the device to be tested.
  • contact probes 4 at the contact head and contact tip 4 A and 4 B and in particular comprising the portions of the probes that are apt to slide in the guide holes 2 A and 3 A, are normally made so as to be tilted with respect to the axes of these holes (usually orthogonal to a plane defined by the device to be tested), in order to ensure the desired scrub on the contact pads.
  • the inclination of the end portions of the contact probes with respect to the axes of the guide holes then creates one or more points of contact between probes and holes, so as to realize an at least partial retention of the probes inside the holes.
  • the coating layers extend in correspondence of a terminal portion of the respective end portion, from a tip up to the full height of the respective guide hole.
  • conductive materials with high hardness have also a marked fragility and can be made only in the form of films of reduced thickness, for example between 0.01 microns and 5 microns.
  • a central portion of the contact probe is also coated with a layer of insulating material, such as parylene, apt to improve the electrical insulation of the probes, in particular avoiding short circuits in the event of accidental contacts between adjacent contact probes.
  • insulating material such as parylene
  • Noble metals coatings, in particular palladium-based noble metals coatings, of the end portions of the contact probes are also used to improve the contact of the end portions with respective contact pads, the materials forming the contact probes having in fact contact problems, in particular by varying the operating temperatures of the testing head including the contact probes.
  • An embodiment of the present disclosure is directed to a contact probe having at least one end portion made of at least one conductive material having a greater hardness value than a conductive material that forms a body of the contact probe and being able to improve the contact of the end portions with respective contact pads, and at the same time avoiding the breakage of the end portion, so as to overcome the limitations and drawbacks currently affecting the testing heads made according to the prior art.
  • the contact probe has at least one end portion provided with an insert made of a conductive material with a greater hardness value than a conductive material forming the contact probe, such an insert being supported by at least one section of the end portion made of the same material forming the contact probe.
  • the contact probe of a testing head of a testing apparatus of electronic devices comprises respective end portions adapted to contact respective contact pads and a body extended in a longitudinal direction between the end portions, at least one end portion comprising an insert made of a first conductive material having a hardness greater than a second conductive material which forms the contact probe, the insert being supported by a section of the end portion, the section being made of the second conductive material and being shaped in complementary way with respect to the insert and having respective abutting surfaces facing and adhering to respective abutting surfaces of the insert.
  • the section of the end portion is shaped in a complementary way with respect to the insert and has respective abutting surfaces facing and adhering to respective abutting surfaces of the insert
  • the insert is made of a first conductive material and the contact probe, the end portion and the section thereof are made of a second conductive material, the first conductive material having a hardness being greater than a hardness of a second conductive material;
  • the insert and the section have respective free end surfaces forming a contact area of the contact probe.
  • FIG. 1 schematically shows a contact probe for a testing head having vertical probes according to the prior art
  • FIGS. 2A and 2B schematically show an embodiment of a contact probe according to the present disclosure, in a perspective and exploded views, respectively;
  • FIGS. 3, 4A-4C, 5, 6A-6D, 7A-7B, 8 and 9 schematically show a perspective view of alternative embodiments of a contact probe according to the present disclosure.
  • a contact probe for a testing head of a testing apparatus of electronic devices integrated on wafers is described, the contact probe being globally indicated with 10 .
  • end portion 10 A of the contact probe 10 comprises at least one contact tip apt to abut onto a contact pad of a device to be tested, which is not shown.
  • the contact probe 10 has a configuration that can be used in a so called vertical probe testing head, such as the one illustrated in FIG. 1 in relation to the prior art, or any other form used in the technical field, ending with an end portion 10 A apt to make contact with a contact pad, for instance of a device to be tested, as in the case of a contact tip, or can be a contact pad of a space transformer, as in the case of a contact head.
  • the contact probe 10 of FIG. 1 also comprise a further end portion, in particular a contact head (not shown), having the same or a different shape compared to the contact tip, the contact head being intended to abut onto a contact pad of a space transformer, as in the case of non-blocked probes.
  • the contact head is fixedly associated to a ceramic support, for example by welding, as in the case of blocked probes protruding from that support.
  • the contact probe 10 also comprises a body 10 C extended in a longitudinal direction between the end portions, in particular between the contact tip and the contact head, that direction being indicated with Y in FIG. 2A .
  • At least one end portion 10 A of the contact probe 10 for example the contact tip, comprises an insert 20 , which is supported by a section 21 of such end portion 10 A.
  • the section 21 is shaped so as to have at least one first abutting surface 21 A and one second abutting surface 21 B abutting and contacting, respectively, a first abutting surface 20 A and a second abutting surface 20 B of the insert 20 .
  • the section 21 comprises a laminar portion 21 ′ (i.e. a thin plate portion) forming a support for abutting the insert 20 .
  • the insert 20 and the section 21 have respective free end surfaces 22 A and 22 B, forming a contact area 22 of the contact probe 10 , as indicated in FIG. 2A .
  • the first abutting surface 20 A of the insert 20 is a surface arranged at the bottom of the insert 20 along the longitudinal direction Y, considering as starting point the contact area 22 of the contact probe 10 , while the second abutting surface 20 B of the insert 20 is a lateral surface along a transverse direction indicated with X in FIG. 2A , in particular it is a right lateral surface according to the local reference system of the Figure.
  • the insert 20 has a length L according to the longitudinal direction Y with a value between 10 ⁇ m and 1000 ⁇ m and a height H 1 according to the orthogonal direction Z, also indicated in FIG. 2A , equal to a height H of the contact probe 10 and with a value between 20 ⁇ m and 100 ⁇ m.
  • the insert 20 is in particular positioned at one corner of the contact probe 10 and has further exposed surfaces, in particular an upper surface, a lower surface and a left lateral surface, still considering the local reference system of the Figure.
  • the insert 20 is made of a first conductive material having a hardness greater than a second conductive material, which the contact probe 10 is made of, and in particular which the body 10 C and the end portion 10 A of the contact probe 10 , more particularly the section 21 , are made of.
  • the first conductive material is a metal or a metal alloy and can be rhodium, platinum, iridium or a metal alloy thereof, or a palladium-cobalt alloy, a palladium-nickel alloy or a nickel-phosphorous alloy. In a preferred embodiment of the disclosure, the first conductive material is rhodium.
  • the second conductive material is a metal or a metal alloy, for example nickel or an alloy thereof, such as a nickel-manganese alloy, a nickel-cobalt alloy or a nickel-tungsten alloy, copper or an alloy thereof, palladium or an alloy thereof.
  • the second conductive material is nickel-tungsten.
  • the section 21 of the end portion 10 A realizes a mechanical support for the insert 20 , the second conductive material of the section 21 being less fragile than the first conductive material of the insert 20 and the section 21 being shaped so as to have a complementary shape to the insert 20 .
  • the contact probe 10 has a substantially rectangular section. Obviously the contact probe 10 could have a section of any prismatic shape.
  • the contact probe 10 further includes at least one coating layer 23 , which extends at the end portion 10 A, in order to cover at least the section 21 and the insert 20 .
  • the coating layer 23 can be such that the contact area 22 of the contact probe 10 emerges, i.e. the free end surface 22 A of the insert 20 and the free end surface 22 B and of the section 21 , respectively emerge.
  • the coating layer 23 can be made of a conductive alloy having a low internal stress, such as a nickel alloy, able to improve the mechanical performances of the end portion 10 A of the contact probe 10 .
  • the coating layer 23 also maintains the insert 20 in position, with the abutting surfaces 20 A and 20 B adhering to respective abutting surfaces 21 A and 21 B of the section 21 .
  • the coating layer 23 acts as a containment sock of the insert 20 and of the section 21 .
  • the working life of the probe is increased, thus guaranteeing its correct operation for a large number of testing operations where the end portion 10 A of the contact probe 10 is in pressing contact on the contact pads of a device to be tested and even in the presence of a large number of cleaning and reshaping operations which usually involve abrasive cloths.
  • the coating layer 23 can be made of a conductive alloy having a high wear resistance, in particular having high hardness values, so as to limit the wear of a lower guide of the testing head, in particular of respective guide holes where the contact probes axially slide.
  • the coating layer 23 is formed so as to extend for the entire thickness of the lower guide, i.e. up to its surface within the testing head, in particular within its air gap.
  • such cleaning operations performed on abrasive cloths also allow to eliminate the coating layer 23 in correspondence of the contact area 22 , letting the free end surface 22 A of the insert 20 and the free end surface 22 B of the section 21 , respectively, emerge.
  • the contact probe 10 further comprises at least one adhesion film 24 arranged on the abutting surfaces 20 A and 20 B, and 21 A and 21 B, respectively, between the insert 20 and the section 21 of the end portion 10 A of the contact probe 10 .
  • the adhesion film 24 can be made of a metal or a metal alloy, such as nickel or a nickel alloy, so as to improve the adhesion of the insert 20 on the section 21 .
  • the adhesion film 24 can be made of gold, silver, platinum or a metal alloy thereof, preferably gold.
  • film means a layer having a thickness between 0.01 and 0.5 ⁇ m.
  • the insert 20 has a height H 1 substantially corresponding to the height H of the contact probe 10 and of the section 21 supporting that contact probe 10 , in particular of its thin plate portion 21 ′.
  • the insert 20 has a height H 2 lower than the one of the contact probe 10 .
  • Such height H 2 of the insert 20 is for example equal to 20%-80% of the height H of the contact probe 10 , preferably equal to 50%. More particularly, the height H 2 can have a value from 3 ⁇ m to 50 ⁇ m.
  • the insert 20 arranged at one corner of the contact probe 10 in this case, the insert 20 and the section 21 supporting that insert 20 have at least respective third abutting surfaces 20 C and 21 C adhering to each other, as shown schematically in FIG. 4A .
  • the third abutting surface 20 C of the insert 20 is an upper surface, by considering the local reference system of the Figure.
  • the insert 20 can be arranged at only one side of the contact probe 10 ; in this case, the insert 20 and the section 21 supporting that insert 20 have at least respective fourth and fifth abutting surfaces, 20 D, 21 D and 20 E, 21 E, as shown schematically in FIG. 4B .
  • the fourth abutting surface 20 D of the insert 20 is a lower surface and the fifth abutting surface 20 E of the insert 20 is a left lateral surface, by considering the local reference system of the Figure.
  • the insert 20 can be positioned so as to be completely embedded in the contact probe 10 ; in this case, the insert 20 and the section 21 supporting the insert 20 have respective third, fourth and fifth abutting surfaces 20 C, 20 D and 20 E, as shown schematically in FIG. 4C .
  • the insert 20 has at least one free end surface 22 A, emerging in correspondence of the contact area 22 of the contact probe 10 .
  • the insert 20 and the section 21 have a lowered portion 25 , apt to reduce the area of contact area 22 of the contact probe 10 .
  • contact probes 10 with cross-section having an area greater than the contact area 22 , the latter being for example bound, in particular limited, to the dimensions of the contact pads of the device to be tested or by the scrub which the first abutting surface 20 A of the contact probe 10 perform on such pads.
  • the contact area 22 has a height H 3 less than the height of the contact probe 10 .
  • the height H 3 of the contact area 22 is equal to 20%-80% of the height H of the contact probe 10 , preferably equal to 50%. More particularly, the height H 3 can have a value ranging from 3 ⁇ m to 50 ⁇ m.
  • contact probe 10 in particular its end portion 10 A, to a lapping operation, in order to sharpen or at least round the contact area 22 , as schematically illustrated in FIGS. 6A and 6B in the case of a contact probe 10 including an insert 20 having a height H 1 equal to the height H of the contact probe 10 (referring to FIG. 6A ) and also having a lowered portion 25 (referring to FIG. 6B ).
  • the free end surface 22 A of the insert 20 and the free end surface 22 B of the section 21 forming the contact area 22 have a curvilinear shape, due to the lapping operation.
  • such a lapping operation can be carried out at the end of the manufacture of the contact probes and/or of their inclusion in the respective testing head; it is also possible to perform one or more lapping operations of the end portions of the contact probe 10 during the life of the testing head in which the probes are inserted, for example in order to “renew” the rounded or sharp shape of the end portion thereof and also in order to remove possible impurities which may have accumulated at this portion.
  • the lapping operation is able to make the section 21 thinner in correspondence of the insert 20 , in particular by substantially canceling the area of the free end surface 22 B of the section 21 in correspondence of the contact area 22 , which thus results to be formed only by the free end surface 22 A of the insert 20 .
  • the end portion 10 A can comprise also in this case a lowered portion 25 , as schematically shown in the embodiment of FIG. 6D .
  • the insert 20 due to the support realized by the section 21 , it is possible to realize the insert 20 with dimensions, in particular a length L, adapted to realize a “consumption” end portion 10 A, the fragility of the material which such insert 20 is made of no longer constituting a problem, in particular a limit to the longitudinal dimensions of the insert 20 itself, so overcoming in this way the problems affecting the known probes.
  • the end portion 10 A so as to comprise at least a first insert 20 ′ and a second insert 20 ′′, symmetrically arranged at the sides of a section 21 having a central thin plate portion 21 ′ which realizes the support for both inserts, referring to the embodiment of FIG. 7A .
  • the end portion 10 A of the contact probe 10 can also comprise a lowered portion 25 , referring to the embodiment of FIG. 7B .
  • the height H 4 of the reduced thin plate portion 21 ′′ is equal to 20%-80% of the height H of the contact probe 10 , preferably equal to 50%. More particularly, the height H 4 can have a value ranging from 3 ⁇ m to 50 ⁇ m.
  • the reduced thin plate portion 21 ′′ is positioned centrally and completely surrounded by the insert 20 , which in this case is substantially crown-shaped. It is also possible to realize the reduced thin plate portion 21 ′′ so that it has at least one emerging surface on a face of the contact probe 10 .
  • the insert 20 is substantially U-shaped, so as to surround the thin plate portion 21 ′′ on three sides.
  • the reduced thin plate portion 21 ′′ can be realized at one corner of the contact probe 10 , surrounded by an insert 20 which is substantially L-shaped.
  • inserts of the embodiments of FIGS. 5, 6A-6D and 7A-7B can be positioned differently from those illustrated by way of example in the Figures, in particular according to the alternative embodiments illustrated in FIGS. 4A-4C .
  • FIGS. 4A-4C, 5, 6A-6D and 7A-7B with a coating layer, too, which extends in correspondence of the end portion 10 A, in order to coat at least the section 21 and the insert 20 , as well as an adhesion film arranged between the insert 20 and the section 21 .
  • the contact probe 10 can comprise, between the insert 20 and the section 21 , at least one material bridge 30 , suitably a plurality of material bridges 30 , extending from inside the insert 20 into the section 21 .
  • the material bridges 30 can be realized by means of the first conductive material, which the insert 20 is made of, and are apt to improve the hold of the insert itself onto the section 21 .
  • a testing head includes a plurality of probes of the type of the contact probe 10 according to the disclosure.
  • a testing head could comprise an upper guide and a lower guide in spaced relation to each other to define an air gap and provided with respective upper and lower guide holes wherein the contact probes slide.
  • the testing head could comprise a plate-shaped support, in particular a ceramic one, to which the plurality of contact probes is fixedly fastened at the head of the probes themselves, while the tips of the probes freely protrude from the plate-shaped support so as to abut onto a corresponding plurality of contact pads of a device to be tested.
  • the contact probe 10 which is provided with an insert 20 made of a material having a greater hardness than the material forming the rest of the contact probe 10 , has an improved contact with the pads of a device to be tested or of a space transformer and also allows to realize an end portion 10 A having dimensions adapted to provide a “consumption” tip, the structure of the section 21 providing the proper support of the insert 20 due to its anchoring in correspondence of at least two abutting surfaces of the insert 20 and of the section 21 , facing and in contact with each other.
  • the insert 20 which is made of the first conductive material, also allows to penetrate possible oxide layers being on the pads of the device to be tested, the section 21 that is made of the second conductive material providing for the actual contact.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
US15/309,776 2015-03-13 2016-03-09 Contact probe for a testing head Abandoned US20170269125A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ITMI2015A000382 2015-03-13
ITMI20150382 2015-03-13
PCT/EP2016/055023 WO2016146451A1 (en) 2015-03-13 2016-03-09 Contact probe for a testing head

Publications (1)

Publication Number Publication Date
US20170269125A1 true US20170269125A1 (en) 2017-09-21

Family

ID=53052982

Family Applications (2)

Application Number Title Priority Date Filing Date
US15/309,776 Abandoned US20170269125A1 (en) 2015-03-13 2016-03-09 Contact probe for a testing head
US15/352,448 Active 2036-09-18 US10228392B2 (en) 2015-03-13 2016-11-15 Contact probe for a testing head

Family Applications After (1)

Application Number Title Priority Date Filing Date
US15/352,448 Active 2036-09-18 US10228392B2 (en) 2015-03-13 2016-11-15 Contact probe for a testing head

Country Status (10)

Country Link
US (2) US20170269125A1 (ja)
EP (1) EP3268750A1 (ja)
JP (1) JP6752828B2 (ja)
KR (1) KR102487269B1 (ja)
CN (1) CN107580680B (ja)
MY (1) MY186744A (ja)
PH (1) PH12017501671A1 (ja)
SG (1) SG11201707342TA (ja)
TW (1) TWI704352B (ja)
WO (1) WO2016146451A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7407724B2 (ja) 2018-03-22 2024-01-04 フォームファクター， インコーポレイテッド 埋め込まれたスケートを有するプローブ先端部

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017002150A1 (de) * 2017-03-06 2018-09-06 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Elektrisches Kontaktelement
TWI713939B (zh) * 2017-12-18 2020-12-21 義大利商探針科技公司 用於測試電子裝置的測試頭的接觸探針
IT201900024889A1 (it) * 2019-12-19 2021-06-19 Technoprobe Spa Sonda di contatto per applicazioni ad alta frequenza con migliorata portata di corrente
IT202000017539A1 (it) * 2020-07-20 2022-01-20 Technoprobe Spa Sonda di contatto per testa di misura
DE102020126546A1 (de) 2020-10-09 2022-04-14 Infineon Technologies Ag Ein teststift mit einer stiftspitze mit seitlich angeordneten stiftspitzenabschnitten
KR102577539B1 (ko) * 2021-04-09 2023-09-12 (주)포인트엔지니어링 전기 전도성 접촉핀 및 이의 제조방법
KR20220164899A (ko) * 2021-06-07 2022-12-14 (주)포인트엔지니어링 전기 전도성 접촉핀
KR102321083B1 (ko) * 2021-07-21 2021-11-03 (주)새한마이크로텍 접촉 프로브

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998001906A1 (en) * 1996-07-05 1998-01-15 Formfactor, Inc. Floating lateral support for ends of elongate interconnection elements
JPH10319039A (ja) * 1997-05-19 1998-12-04 Toshiba Corp プローブ用垂直ニードル、垂直ニードル型プローブおよびそれに用いられる複合細線
JP3578959B2 (ja) * 2000-02-24 2004-10-20 松下電器産業株式会社 テーブルタップおよびテーブルタップを用いた監視システム
JPWO2003005042A1 (ja) * 2001-07-02 2004-10-28 日本発条株式会社 導電性接触子
ATE376679T1 (de) * 2004-03-24 2007-11-15 Technoprobe Spa Kontaktstift für einen prüfkopf
US9476911B2 (en) * 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
JP2005351846A (ja) 2004-06-14 2005-12-22 Micronics Japan Co Ltd プローブ針
US7609080B2 (en) * 2005-03-22 2009-10-27 Formfactor, Inc. Voltage fault detection and protection
JP4684855B2 (ja) * 2005-11-08 2011-05-18 株式会社日本マイクロニクス プローブおよびその製造方法
US7759776B2 (en) * 2006-03-28 2010-07-20 Taiwan Semiconductor Manufacturing Co., Ltd. Space transformer having multi-layer pad structures
DE102006054673A1 (de) 2006-11-17 2008-05-21 Suss Microtec Test Systems Gmbh Sondenaufnahme zur Halterung einer Sonde zur Prüfung von Halbleiterbauelementen, Sondenhalterarm und Prüfvorrichtung
KR100885064B1 (ko) 2007-05-31 2009-02-25 송광석 반도체소자 검사용 접촉체
DE102007034251B4 (de) 2007-07-23 2013-12-05 Continental Automotive Gmbh Fehleranalyseverfahren für eine Lambda-Sonde, Motorsteuerung für eine Brennkraftmaschine zur Ausführung des Fehleranalyseverfahrens sowie Programmspeicher
KR100920706B1 (ko) * 2007-09-07 2009-10-07 박준언 반도체시험 장치용 커넥터 시스템
DE102008023761B9 (de) * 2008-05-09 2012-11-08 Feinmetall Gmbh Elektrisches Kontaktelement zum Berührungskontaktieren von elektrischen Prüflingen sowie entsprechende Kontaktieranordnung
US7740508B2 (en) 2008-09-08 2010-06-22 3M Innovative Properties Company Probe block assembly
CN102025416B (zh) 2009-09-22 2013-12-04 华为技术有限公司 一种定位海缆故障的方法、中继器及通信系统
US20120098518A1 (en) * 2010-04-23 2012-04-26 Panasonic Corporation Detection apparatus and detection system
JP2012233861A (ja) * 2011-05-09 2012-11-29 Japan Electronic Materials Corp プローブ
EP2574948B1 (en) * 2011-09-09 2017-08-30 GS Yuasa International Ltd. Electric storage device monitor
JP2013088389A (ja) * 2011-10-21 2013-05-13 Tokyo Electron Ltd プローブカード用接触端子及びプローブカード
US9194887B2 (en) * 2012-11-15 2015-11-24 Advantest America, Inc. Fine pitch probes for semiconductor testing, and a method to fabricate and assemble same
JP6074244B2 (ja) * 2012-12-06 2017-02-01 石福金属興業株式会社 Ａｇ基合金からなるプローブピン用材料、プローブピン、プローブピンの製造方法
US9470715B2 (en) * 2013-01-11 2016-10-18 Mpi Corporation Probe head
KR101439342B1 (ko) * 2013-04-18 2014-09-16 주식회사 아이에스시 포고핀용 탐침부재
US9329317B2 (en) * 2013-07-10 2016-05-03 Shenzhen China Star Optoelectronics Technology Co., Ltd LCD and backlight module thereof
SG10201707975VA (en) * 2013-07-11 2017-10-30 Johnstech Int Corp Testing apparatus and method for microcircuit and wafer level ic testing
US9507004B2 (en) * 2013-07-31 2016-11-29 The Government Of The United States Of America, As Represented By The Secretary Of Commerce Electron spin resonance spectrometer and method for using same
US10732201B2 (en) * 2014-04-13 2020-08-04 Infineon Technologies Ag Test probe and method of manufacturing a test probe

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7407724B2 (ja) 2018-03-22 2024-01-04 フォームファクター， インコーポレイテッド 埋め込まれたスケートを有するプローブ先端部

Also Published As

Publication number Publication date
TWI704352B (zh) 2020-09-11
KR102487269B1 (ko) 2023-01-11
TW201640122A (zh) 2016-11-16
JP6752828B2 (ja) 2020-09-09
MY186744A (en) 2021-08-16
US20170059612A1 (en) 2017-03-02
WO2016146451A1 (en) 2016-09-22
SG11201707342TA (en) 2017-10-30
KR20170128352A (ko) 2017-11-22
PH12017501671A1 (en) 2018-03-19
EP3268750A1 (en) 2018-01-17
JP2018508027A (ja) 2018-03-22
US10228392B2 (en) 2019-03-12
CN107580680B (zh) 2021-03-09
CN107580680A (zh) 2018-01-12

Similar Documents

Publication Publication Date Title
US10228392B2 (en) Contact probe for a testing head
US11131690B2 (en) Contact probe for testing head
US11307222B2 (en) Contact probe for a testing head for testing electronic devices
US20170122980A1 (en) Contact probe for a testing head and corresponding manufacturing method
EP2060921A1 (en) Contact probe for testing head having vertical probes and related testing head for testing microstructure electric performance
JP2023506654A (ja) 低減されたピッチのアプリケーション用のプローブヘッド
US20100102841A1 (en) Device, method and probe for inspecting substrate
KR20040067794A (ko) 패드를 갖는 반도체장치
JPH0837212A (ja) プローブヘッドおよびそれを用いた検査方法
JP4838658B2 (ja) 基板検査用治具及び基板検査用治具の電極部構造
IT202000017539A1 (it) Sonda di contatto per testa di misura
KR20230082598A (ko) 컨택트 프로브
ITMI20110896A1 (it) Sonda di contattatura per testa di misura

Legal Events

Date Code Title Description
STCB Information on status: application discontinuation

Free format text: ABANDONED -- INCOMPLETE APPLICATION (PRE-EXAMINATION)