JP7407724B2 - 埋め込まれたスケートを有するプローブ先端部 - Google Patents
埋め込まれたスケートを有するプローブ先端部 Download PDFInfo
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- JP7407724B2 JP7407724B2 JP2020547004A JP2020547004A JP7407724B2 JP 7407724 B2 JP7407724 B2 JP 7407724B2 JP 2020547004 A JP2020547004 A JP 2020547004A JP 2020547004 A JP2020547004 A JP 2020547004A JP 7407724 B2 JP7407724 B2 JP 7407724B2
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- layer
- probe
- probe tip
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- 239000000523 sample Substances 0.000 title claims description 131
- 238000012360 testing method Methods 0.000 claims description 18
- 238000005299 abrasion Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 229910003266 NiCo Inorganic materials 0.000 claims description 2
- 229910021118 PdCo Inorganic materials 0.000 claims description 2
- 238000003475 lamination Methods 0.000 claims 3
- 238000007517 polishing process Methods 0.000 description 12
- 238000004140 cleaning Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005201 scrubbing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
- G01R1/06761—Material aspects related to layers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Description
Claims (7)
- 被試験デバイスに電気的に接触させるためのプローブであって、
2以上の層から構成される積層体を含むプローブ先端部を備え、
前記プローブ先端部は、前記プローブの遠位側に位置し、
前記プローブ先端部が、接触領域を有し、
前記プローブ先端部の前記接触領域が、1つの連続した滑らかな曲面によって形成され、
前記1つの連続した滑らかな曲面は、前記2以上の層から構成される積層体の少なくとも2つの層を含み、
前記積層体を構成する前記2以上の層の各々は、前記積層体の積層方向に対して直交する平面に沿って延在し、
前記2以上の層に対応するそれぞれの平面は互いに平行で、かつ被試験デバイスをプロービングするときの前記プローブ先端部の前記被試験デバイスに対する相対的な移動方向に対して平行であり、
前記積層体を構成する層のうちの選択された層の一部または全部が、前記積層体における最大の機械的摩耗抵抗を有し、かつ、
前記プローブ先端部の前記滑らかな曲面の最も遠位に位置する領域が、前記選択された層によって形成される、プローブ。 - 請求項1に記載のプローブであって、
前記積層体は、A層、B層、C層、B層及びA層がその順に積層されたA-B-C-B-A構造を有し、
前記A層、前記B層及び前記C層は、互いに異なる材料組成を有し、
前記A層は、前記B層または前記C層よりも高い降伏強度及び極限強度を有し、
前記B層は、前記A層または前記C層よりも高い電気伝導率を有し、
前記C層は、前記A層または前記B層よりも高い機械的摩耗抵抗を有する、プローブ。 - 請求項2に記載のプローブであって、
前記A層は、PdCo合金及びNiCo合金からなる群より選択される、プローブ。 - 請求項2に記載のプローブであって、
前記B層は、Al合金及びCuからなる群から選択される、プローブ。 - 請求項2に記載のプローブであって、
前記C層は、Rh、Ru及びWからなる群から選択される、プローブ。 - 請求項1に記載のプローブであって、
前記選択された層は、前記積層体の積層方向に対して直交する方向に沿って複数の領域を有し、
前記複数の領域のなかの選択された1つの領域は、前記複数の領域における最大の機械摩耗抵抗を有する、プローブ。 - 請求項6に記載のプローブであって、
前記選択された1つの領域は、前記複数の領域のなかで、前記積層体の積層方向に対して直交する方向に沿って中央に位置する領域である、プローブ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862646840P | 2018-03-22 | 2018-03-22 | |
US62/646,840 | 2018-03-22 | ||
PCT/US2019/023690 WO2019183548A1 (en) | 2018-03-22 | 2019-03-22 | Probe tip with embedded skate |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021517244A JP2021517244A (ja) | 2021-07-15 |
JP7407724B2 true JP7407724B2 (ja) | 2024-01-04 |
Family
ID=67985026
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020547004A Active JP7407724B2 (ja) | 2018-03-22 | 2019-03-22 | 埋め込まれたスケートを有するプローブ先端部 |
Country Status (4)
Country | Link |
---|---|
US (1) | US11054443B2 (ja) |
JP (1) | JP7407724B2 (ja) |
KR (1) | KR20200135823A (ja) |
WO (1) | WO2019183548A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4234567A1 (en) | 2020-10-20 | 2023-08-30 | ST Pharm Co., Ltd. | Oligonucleotide for 5'-capped rna synthesis |
KR20220135453A (ko) * | 2021-03-30 | 2022-10-07 | (주)포인트엔지니어링 | 전기 전도성 접촉핀 및 이의 제조방법 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000174079A (ja) | 1998-12-08 | 2000-06-23 | Micronics Japan Co Ltd | プローブの清掃方法及び装置 |
US20050258844A1 (en) | 2004-05-21 | 2005-11-24 | January Kister | Freely deflecting knee probe with controlled scrub motion |
JP2005351846A (ja) | 2004-06-14 | 2005-12-22 | Micronics Japan Co Ltd | プローブ針 |
JP2008128882A (ja) | 2006-11-22 | 2008-06-05 | Sumitomo Electric Ind Ltd | コンタクトプローブおよびその製造方法 |
WO2016146451A1 (en) | 2015-03-13 | 2016-09-22 | Technoprobe S.P.A. | Contact probe for a testing head |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3445770A (en) * | 1965-12-27 | 1969-05-20 | Philco Ford Corp | Microelectronic test probe with defect marker access |
WO1996013728A1 (fr) | 1994-10-28 | 1996-05-09 | Nitto Denko Corporation | Structure de sonde |
JP3279294B2 (ja) * | 1998-08-31 | 2002-04-30 | 三菱電機株式会社 | 半導体装置のテスト方法、半導体装置のテスト用プローブ針とその製造方法およびそのプローブ針を備えたプローブカード |
US6414501B2 (en) * | 1998-10-01 | 2002-07-02 | Amst Co., Ltd. | Micro cantilever style contact pin structure for wafer probing |
US20040119485A1 (en) * | 2002-12-20 | 2004-06-24 | Koch Daniel J. | Probe finger structure and method for making a probe finger structure |
US9097740B2 (en) * | 2004-05-21 | 2015-08-04 | Formfactor, Inc. | Layered probes with core |
US7733101B2 (en) | 2004-05-21 | 2010-06-08 | Microprobe, Inc. | Knee probe having increased scrub motion |
US7759949B2 (en) * | 2004-05-21 | 2010-07-20 | Microprobe, Inc. | Probes with self-cleaning blunt skates for contacting conductive pads |
US8970240B2 (en) | 2010-11-04 | 2015-03-03 | Cascade Microtech, Inc. | Resilient electrical interposers, systems that include the interposers, and methods for using and forming the same |
JP6563317B2 (ja) * | 2015-11-25 | 2019-08-21 | 新光電気工業株式会社 | プローブガイド板及びその製造方法とプローブ装置 |
-
2019
- 2019-03-22 WO PCT/US2019/023690 patent/WO2019183548A1/en active Application Filing
- 2019-03-22 JP JP2020547004A patent/JP7407724B2/ja active Active
- 2019-03-22 US US16/362,239 patent/US11054443B2/en active Active
- 2019-03-22 KR KR1020207030017A patent/KR20200135823A/ko not_active Application Discontinuation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000174079A (ja) | 1998-12-08 | 2000-06-23 | Micronics Japan Co Ltd | プローブの清掃方法及び装置 |
US20050258844A1 (en) | 2004-05-21 | 2005-11-24 | January Kister | Freely deflecting knee probe with controlled scrub motion |
JP2005351846A (ja) | 2004-06-14 | 2005-12-22 | Micronics Japan Co Ltd | プローブ針 |
JP2008128882A (ja) | 2006-11-22 | 2008-06-05 | Sumitomo Electric Ind Ltd | コンタクトプローブおよびその製造方法 |
WO2016146451A1 (en) | 2015-03-13 | 2016-09-22 | Technoprobe S.P.A. | Contact probe for a testing head |
US20170269125A1 (en) | 2015-03-13 | 2017-09-21 | Technoprobe S.P.A. | Contact probe for a testing head |
JP2018508027A (ja) | 2015-03-13 | 2018-03-22 | テクノプローベ エス.ピー.エー. | 試験ヘッドのための接触プローブ |
Also Published As
Publication number | Publication date |
---|---|
US20190293685A1 (en) | 2019-09-26 |
US11054443B2 (en) | 2021-07-06 |
KR20200135823A (ko) | 2020-12-03 |
JP2021517244A (ja) | 2021-07-15 |
WO2019183548A1 (en) | 2019-09-26 |
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