US20150253897A1 - Bonding pad structure and touch panel - Google Patents

Bonding pad structure and touch panel Download PDF

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Publication number
US20150253897A1
US20150253897A1 US14/312,693 US201414312693A US2015253897A1 US 20150253897 A1 US20150253897 A1 US 20150253897A1 US 201414312693 A US201414312693 A US 201414312693A US 2015253897 A1 US2015253897 A1 US 2015253897A1
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United States
Prior art keywords
bonding pad
sub
structures
bonding
terminal
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Abandoned
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US14/312,693
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English (en)
Inventor
Ray Liang
Zheng-Xiang Liu
Fei Teng
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Wistron Corp
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Wistron Corp
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Assigned to WISTRON CORPORATION reassignment WISTRON CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIANG, RAY, LIU, Zheng-xiang, TENG, Fei
Publication of US20150253897A1 publication Critical patent/US20150253897A1/en
Abandoned legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate

Definitions

  • the invention is related to a touch sensing device and a bonding structure thereof, and more particularly to a touch panel and a bonding pad structure thereof.
  • Touch panels are roughly grouped into resistive touch panels, capacitive touch panels, optical touch panels, acoustic wave touch panels and electromagnetic touch panels according to different sensing principles thereof.
  • the capacitive touch panel is characterized by short response speed, favorable reliability, satisfactory durability, and so on. Therefore, the capacitive touch panel is widely used in the electronic products.
  • the capacitive touch panels may be roughly categorized into self capacitance (self-type) touch panels or mutual capacitance (mutual-type) touch panels according to different capacitance sensing principles.
  • the touch panel includes a plurality of first axial (such as X axis) sensing patterns and a plurality of second axial (such as Y axis) sensing patterns.
  • the first axial sensing patterns and the second axial sensing patterns are alternately disposed with independent signals.
  • the first axial sensing patterns and the second axial sensing patterns need to be respectively electrically connected to a plurality of bonding pads that are collectively disposed in parallel at one side of the substrate where the first axis sensing patterns and/or the second axis sensing patterns are located.
  • the invention provides a touch panel, and the configuration and layout thereof provide ideal space utilization.
  • the invention provides a touch panel, and the configuration and layout of the bonding pad in the touch panel provide ideal space utilization that facilitates to ensure test accuracy.
  • a bonding pad structure includes a first sub-bonding pad and a second sub-bonding pad.
  • the first sub-bonding pad has a first connection terminal and a first end terminal respectively located at two opposite ends, wherein a width of the first connection terminal is greater than a width of the first end terminal.
  • the first sub-bonding pad is close to but separated from the second sub-bonding pad.
  • the second sub-bonding pad has a second connection terminal and a second end terminal respectively located at two opposite ends, wherein a width of the second connection terminal is greater than a width of the second end terminal.
  • the first connection terminal is close to the second end terminal while the second connection terminal is close to the first end terminal.
  • a first outline of the first sub-bonding pad and a second outline of the second sub-bonding pad are formed as a pair in a complementary manner to construct a configuration of the bonding pad structure.
  • a touch panel includes a plurality of first sensing structures, a plurality of second sensing structures, a plurality of first bonding pad structures, a plurality of second bonding pad structures, and a plurality of wire structures.
  • the first sensing structures respectively have a first terminal opposite to a second terminal.
  • the second sensing structures and the first sensing structures are alternately disposed.
  • Each of the first bonding pad structures includes a first sub-bonding pad and a second sub-bonding pad.
  • a first outline of the first sub-bonding pad and a second outline of the second sub-bonding pad are formed as a pair in a complementary manner to construct a configuration of each of the first bonding pad structures.
  • a first portion and a second portion of the wire structures respectively connect the first sub-bonding pad and the second sub-bonding pad of each of the first bonding pad structures to the first terminal and second terminal of identical or different first sensing structure respectively, and a third portion connects the second bonding pad structure to the second sensing structure.
  • another touch panel includes a substrate, a plurality of sensing structures, a plurality of bonding pad structures, and a plurality of wire structures.
  • the sensing structures are arranged on the substrate, and each of the sensing structures has a first terminal opposite to a second terminal.
  • the bonding pad structure is arranged on the substrate, and each of the bonding pad structures includes a first sub-bonding pad and a second sub-bonding pad; a first outline of the first sub-bonding pad and a second outline of the second sub-bonding pad are formed as a pair in a complementary manner to construct a configuration of each of the bonding pad structures.
  • the wire structures respectively connect the first sub-bonding pad and the second sub-bonding pad of the bonding pad structures to the first terminal and the second terminal of identical or different sensing structures respectively.
  • the width of the first sub-bonding pad of each of the first bonding pad structures gradually decreases toward the first end terminal from the first connection terminal, and the width of the second sub-bonding pad gradually decreases toward the second end terminal from the second connection terminal.
  • each of the first bonding pad structures has an extending direction which points at the second connection terminal from the first connection terminal.
  • the width variance trend of the first sub-bonding pad along the extending direction is opposite to the width variance trend of the second sub-bonding pad along the extending direction.
  • the first outline of the first sub-bonding pad and the second outline of the second sub-bonding pad are in point symmetry.
  • the first sub-bonding pad of each of the first bonding pad structures includes a first testing portion adjacent to a first bonding portion.
  • the first connection terminal is an end of the first testing portion away from the first bonding portion
  • the first end terminal is an end of the first bonding portion away from the first testing portion.
  • the first sub-bonding pad and the second sub-bonding pad respectively have the first outline and the second outline respectively in L shapes or L-like shapes that are reversely arranged to be complementary to each other.
  • the second sub-bonding pad of each of the first bonding pad structures includes a second testing portion adjacent to a second bonding portion.
  • the second connection terminal is an end of the second testing portion away from the second bonding portion, and the second end terminal is an end of the second bonding portion away from the second testing portion.
  • the first sub-bonding pad is spaced from the second sub-bonding pad by a gap, and the overall width of the first bonding portion, the gap, and the seconding bonding pad is equivalent to the width of the first testing portion and the second testing portion.
  • the gap between the first bonding portion and the second bonding portion is in a linear shape, a wave shape, or a bended shape.
  • the width of the first testing portion is equivalent to the width of the second testing portion.
  • the width of each of the first bonding pad structures is equivalent to the width of each of the second bonding pad structures.
  • the first sub-bonding pad and the second sub-bonding pad respectively have the first outline and the second outline respectively in trapezoidal shapes or trapezoid-like shapes that are reversely arranged to be complementary to each other.
  • the bonding pad structures are in a rectangular shape.
  • the length of each of the first bonding pad structures is equivalent to the length of each of the second bonding pad structures.
  • the wire structures include a plurality of first wires and a plurality of second wires.
  • the first wires are connected between the first terminal of the first sensing structures and the first connecting ten final of the first sub-bonding pad.
  • the second wires are connected between the second terminal of the first sensing structures and the second connecting terminal of the second sub-bonding pad.
  • the touch panel further includes a substrate, wherein the first sensing structures, the second sensing structures, the first bonding pad structures, the second bonding pad structures and the wire structures are disposed on the substrate.
  • Each of the second sensing structures has a third terminal opposite to a fourth terminal.
  • the first portion of the second bonding pad structures is connected to the third terminal.
  • the second portion of the second bonding structures is connected to the fourth terminal.
  • the first bonding pad structures are located between the first portion and the second portion of the second bonding pad structures.
  • the touch panel further includes a intermediate layer, and the intermediate layer has a first side opposite to a second side, wherein the first sensing structures, the first bonding pad structures, and a first portion of the wire structures are disposed at the first side.
  • the second sensing structures, the second bonding pad structures, and a second portion of the wire structures are disposed at the second side.
  • the first portion of the wire structures connects the first sensing structures to the first bonding pad structures
  • the second portion of the wire structures connects the second sensing structures to the second bonding pad structures.
  • the intermediate layer is a film substrate or an insulating layer.
  • each of the second bonding pad structures may include a third sub-bonding pad and a fourth sub-bonding pad, wherein the third sub-bonding pad and the fourth sub-bonding pad are separated from each other and respectively connected to a third terminal and a fourth terminal of one of the second sensing structures.
  • the third sub-bonding pad has a third connection terminal opposite to a third end terminal, and the width of the third connection terminal is greater than the width of the third end terminal.
  • the fourth sub-bonding pad has a fourth connection terminal opposite to a fourth end terminal. The width of the fourth connection terminal is greater than the width of the fourth end terminal.
  • the third connection terminal is closer to the fourth end terminal and farther from the fourth connection terminal.
  • the width of the third sub-bonding pad of each of the second bonding pad structures gradually decreases toward the third end terminal from third connection terminal.
  • the width of the fourth sub-bonding pad of each of the second bonding pad structures gradually decreases towards the fourth end terminal from the fourth connection terminal.
  • each of the second bonding pad structures has an extending direction which points at the fourth connection terminal from the third connection terminal.
  • the width variance trend of the third sub-bonding pad along the extending direction is opposite to the width variance trend of the fourth sub-bonding pad along the extending direction.
  • the outlines of the third sub-bonding pad and the fourth bonding pad are in point symmetry.
  • the third sub-bonding pad of each of the second bonding pad structures includes a third testing portion adjacent to a third bonding portion, wherein the third connection terminal is an end of the third testing portion away from the third bonding portion, and the third end terminal is an end of the third bonding portion away from the third testing portion.
  • the third sub-bonding pad and the fourth sub-bonding pad are respectively formed to be in an L-like shape or an L shape.
  • the fourth sub-bonding pad of each of the second bonding pad structures includes a fourth testing portion adjacent to a fourth bonding portion, wherein the fourth connection terminal is an end of the fourth testing portion away from the fourth bonding portion, and the fourth end terminal is an end of the fourth bonding portion away from the fourth testing portion.
  • the third sub-bonding pad is spaced from the fourth sub-bonding pad by a gap, and the overall width of the third bonding portion, the gap, and the fourth bonding portion is equivalent to the width of the third testing portion or the fourth testing portion.
  • the gap is in a linear shape, a wave shape, or a bended shape.
  • the width of the third testing portion is equivalent to the width of the fourth testing portion.
  • the touch panel disposes two bonding pads that are connected to both ends of one sensing structure to be adjacent to each other so as to construct a set of bonding pad structure, and the width variances of the two bonding pads are in an opposite trend.
  • the set of two bonding pads in the embodiments of the invention may be disposed to be closer, which facilitates to reduce the area for disposing the bonding pads.
  • the widths of the two bonding pads are not constant so that the wider part of each of the bonding pads provides sufficient area for being in contact with the testing probe to allow the test operation to be conducted easily.
  • the two bonding pads formed as a set respectively extend towards the other from the widest part, and therefore the two bonding pads have sufficient extending length such that the bonding pads have ideal bonding reliability when being bonded to the circuit board or external components.
  • the bonding pads are disposed to be closer and the area for disposing is further reduced, which helps to reduce the amount of bonding medium (conductive adhesive) used for bonding and the volume thereof. Since the bonding medium may change in volume due to the temperature differences during the manufacturing process, the decrease in the volume of the bonding medium may reduce the possibility of bad reliability caused by such change in volume.
  • FIG. 1A is a schematic view illustrating a first embodiment for a bonding pad structure of the invention.
  • FIG. 1B is a schematic view illustrating a second embodiment for the bonding pad structure of the invention.
  • FIG. 1C is a schematic view illustrating a third embodiment for the bonding pad structure of the invention.
  • FIG. 1D is a schematic view illustrating a fourth embodiment for the bonding pad structure of the invention.
  • FIG. 1E is a schematic view illustrating a fifth embodiment for the bonding pad structure of the invention.
  • FIG. 2 is a schematic top view illustrating a touch panel according to the first embodiment of the invention.
  • FIG. 3 is a schematic enlargement view illustrating a portion P in the touch panel according to FIG. 2 .
  • FIG. 4 is a schematic top view illustrating a touch panel according to the second embodiment of the invention.
  • FIG. 5 is a schematic side view illustrating a touch panel according to the third embodiment of the invention.
  • FIGS. 6-7 are schematic top views illustrating a first sensing layer and a second sensing layer within the touch panel according to FIG. 5 .
  • FIG. 8 is a schematic side view illustrating a touch panel according to the third embodiment of the invention.
  • FIG. 9 is a schematic side view illustrating a touch panel according to the fourth embodiment of the invention.
  • FIG. 1A is a schematic view illustrating a first embodiment for a bonding pad structure of the invention.
  • a bonding pad structure 10 includes a first sub-bonding pad 12 independent from a second sub-bonding pad 14 , and they are spaced from each other by a gap G 10 .
  • the first sub-bonding pad 12 has a first connection terminal 12 A opposite to a first end terminal 12 B.
  • a width W 12 A of the first connection terminal 12 A is greater than a width W 12 B of the first end terminal 12 B.
  • the second sub-bonding pad 14 has a second connection terminal 14 A opposite to a second end terminal 14 B, and a width 14 A of the second connection terminal 14 A is greater than a width W 14 B of the second end terminal 14 B.
  • the wider first connection terminal 12 A is closer to the narrower second end terminal 14 B and farther from the wider second connection terminal 14 A.
  • the bonding pad structure 10 is applied in an electronic device as a bonding pad for bonding, the wire in the electronic device is connected to the wider first connection terminal 12 A and the second connection terminal 14 A.
  • FIG. 1A shows that the first sub-bonding pad 12 and the second sub-bonding pad 14 in the embodiment have a trapezoid outline.
  • the bonding pad structure 10 is an elongated structure and is defined to have an extending direction E pointing at the second connection terminal 14 A from the first connection terminal 12 A.
  • the width of the first sub-bonding pad 12 gradually decreases along the extending direction E, and the width of the second sub-bonding pad 14 gradually increases along the extending direction E. That is to say, the width variance trend of the first sub-bonding pad 12 along the extending direction E is opposite to the width variance trend of the second sub-bonding pad 14 along the extending direction E.
  • an overall width W 10 of the bonding pad structure 10 is substantially constant, and therefore the overall first bonding pad structure 10 is in a rectangular shape.
  • the outline of the first sub-bonding pad 12 and the outline of the second sub-bonding pad 14 may be in point symmetry; therefore, the outlines of the first sub-bonding pad 12 and the second sub-bonding pad 14 are substantially complementary.
  • the bonding pad structure 10 is bonded to other components. Therefore, the design of the size of the bonding pad structure 10 affects the bonding yield and reliability.
  • the width W 12 B and the width W 14 B may be selectively greater than an average particle size of the conductive particle in the ACF. For example, in the ACF that is applied for bonding the touch panel to the circuit board, the average particle size of the conductive particle is about 10 ⁇ m.
  • the width W 12 B and the width W 14 B may be disposed to be selectively greater than 10 ⁇ m.
  • the width W 12 B and the width W 14 B may be disposed to be selectively greater than 3 ⁇ m. Accordingly, the width W 12 B and the width W 14 B may ensure the bonding reliability.
  • an overall length L 10 of the bonding pad structure 10 may be greater than 1 mm, for example, 1.24 mm or 1.26 mm.
  • the gap G 10 is present to maintain electrical independence of the first sub-bonding pad 12 and the second sub-bonding pad 14 , and the width thereof may be determined according to the precision of the manufacturing machine. For example, the gap G 10 may be 15 ⁇ m to 50 ⁇ m or less.
  • the widths W 12 A and W 14 A of the first connection terminal 12 A and the second connection terminal 14 A may be determined according to the size of the probe of the testing machine. In other words, the widths of W 12 A and W 14 A have to be sufficient to achieve that the probe with selected size can precisely position and have electronic contact for signal tests.
  • FIG. 1A shows that the first connection terminal 12 A of the first sub-bonding pad 12 of the bonding pad structure 10 has a greater size, and the second connection terminal 14 A of the second sub-bonding pad 14 has a greater size. Accordingly, when performing the test, the testing probe may be accurately in contact with the first sub-bonding pad 12 and the second sub-bonding pad 14 so that the test process may be more efficient. Moreover, the lengths of the first sub-bonding pad 12 and the second sub-bonding pad 14 in the extension direction E are substantially equivalent to the overall length L 10 , which facilitates the ACF to be more reliably and accurately disposed on the bonding pad structure 10 .
  • the ACF when being disposed on the bonding pad structure 10 , if the ACF causes an alignment error in the extending direction E and deviates towards the first connection terminal 12 A, the ACF may still be disposed on at least a portion of the second sub-bonding pad 14 . Likewise, when being disposed on the bonding pad structure 10 , if the ACF causes the alignment error in the extending direction E and deviates towards the second connection terminal 14 A, the ACF may still be disposed on at least a portion of the first sub-bonding pad 12 .
  • the first sub-bonding pad 12 and the second sub-bonding pad 14 may be practically in contact with the ACF, which also ensures that the ACF is reliably disposed on the bonding pad structure 10 .
  • FIG. 1B is a schematic view illustrating a second embodiment for the bonding pad structure of the invention.
  • a bonding pad structure 20 includes a first sub-bonding pad 22 independent from a second sub-bonding pad 24 , and they are spaced from each other by a gap G 20 .
  • the first sub-bonding pad 22 of the bonding pad structure 20 includes a first testing portion 22 T adjacent to a first bonding portion 22 U.
  • a first connection terminal 22 A is an end of the first testing portion 22 T away from the first bonding portion 22 U; a first end terminal 22 B is an end of the first bonding portion 22 U away from the first testing portion 22 T.
  • the second sub-bonding pad 24 includes a second testing portion 22 T adjacent to a second bonding portion 24 U.
  • the second connection terminal 22 A is an end of the second testing portion 22 T away from the second bonding portion 22 U; the second end terminal 24 B is an end of the second bonding portion 22 U away from the second testing portion 22 T.
  • FIG. 1A please refer to FIG. 1A and related descriptions for the design of the sizes of the first connection terminal 22 A, the first end terminal 22 B, the second connection terminal 22 A, and the second end terminal 24 B. No further descriptions are incorporated herein.
  • the first sub-bonding pad 22 and the second sub-bonding pad 24 respectively have outlines that are in an L-like shape or an L shape, and the two outlines are reversely arranged to be complementary to each other.
  • a width W 22 T of the first testing portion 22 T is equivalent to a width W 24 T of the second testing portion 24 T.
  • an overall width W 20 of the first bonding portion 22 U, the gap G 20 , and the second bonding portion 24 U is equivalent to the width W 22 T of the first testing portion 22 T or the width W 24 T of the second testing portion 24 T.
  • the design for the size of the first testing portion 22 T and the second testing portion 24 T may be determined according to the requirement of the testing machine. For example, when the probe of the testing machine requires a test area of 0.1 mm, a length L 22 T of the first testing portion 22 T may not be less than 0.1 mm, and a length L 24 T of the second testing portion 24 T may not be less than 0.1 mm. Accordingly, the disposition of the first testing portion 22 T and the second testing portion 24 T facilitates to enhance test accuracy.
  • the first bonding portion 22 U and the second bonding portion 24 U are the portions used for being connected to the ACF; therefore, a length L 22 U of the first bonding portion 22 U and a length L 24 U of the second bonding portion 24 U may be determined according to the requirement of the bonding process.
  • the length of the bonding pad is disposed to be 1.24 mm
  • the length L 22 U of the first bonding portion 22 U and the length L 24 U of the second bonding portion 24 U may be designed to be 1.24 mm.
  • the size of the gap G 20 may be determined according to the manufacturing precision by referring to the description for the embodiment of FIG. 1A , for example, the size may be 15 ⁇ m to 50 ⁇ m.
  • FIG. 1C is a schematic view illustrating a third embodiment for the bonding pad structure of the invention.
  • a bonding pad structure 30 includes a first sub-bonding pad 32 independent from a second sub-bonding pad 34 .
  • the first sub-bonding pad 32 includes a first testing portion 32 T and a first bonding portion 32 U
  • the second sub-bonding pad 34 includes a second testing portion 34 T and a second bonding portion 34 U.
  • the first testing portion 32 T and the first bonding portion 32 U are similar to the first testing portion 22 T and the first bonding portion 22 U of FIG. 1B
  • the second testing portion 34 T and the second bonding portion 34 U are similar to the second testing portion 24 T and the second bonding portion 24 U of FIG.
  • the two embodiments are different in that a gap G 30 between the first bonding portion 32 U and the second bonding portion 34 U of the embodiment is in a bended shape, whereas the gap G 20 between the first bonding portion 22 U and the second bonding portion 24 U in FIG. 1B is in a linear shape.
  • FIG. 1D is a schematic view illustrating a fourth embodiment for the bonding pad structure of the invention.
  • a bonding pad structure 40 includes a first sub-bonding pad 42 independent from a second sub-bonding pad 44 .
  • the first sub-bonding pad 42 includes a first testing portion 42 T and a first bonding portion 42 U.
  • the second sub-bonding pad 44 includes a second testing portion 44 T and a second bonding portion 44 U.
  • the first testing portion 42 T and the first bonding portion 42 U are similar to the first testing portion 22 T and the first bonding portion 22 U of FIG. 1B .
  • the second testing portion 44 T and the second bonding portion 44 U are similar to the second testing portion 24 T and the second bonding portion 24 U of FIG.
  • the two embodiments are different in that a gap G 40 between the first bonding portion 42 U and the second bonding portion 44 U in the embodiment is in a wave shape, whereas the gap G 20 between the first bonding portion 22 U and the second bonding portion 24 U of FIG. 1B is in a linear shape.
  • FIG. 1E is a schematic view illustrating a fifth embodiment for the bonding pad structure of the invention.
  • a bonding pad structure 50 includes a first sub-bonding pad 52 independent from a second sub-bonding pad 54 .
  • the first sub-bonding pad 52 includes a first testing portion 52 T and a first bonding portion 52 U.
  • the second sub-bonding pad 54 includes a second testing portion 54 T and a second bonding portion 54 U.
  • the first testing portion 52 T and the first bonding portion 52 U are similar to the first testing portion 52 T and the first bonding portion 52 U of FIG. 1B ;
  • the second testing portion 54 T and the second bonding portion 54 U are similar to the second testing portion 24 T and the second bonding portion 24 U of FIG.
  • the two embodiments are different in that a gap G 50 between the first bonding portion 52 U and the second bonding portion 54 U in the embodiment is in an obliquely linear shape, whereas the gap G 20 between the first bonding portion 22 U and the second bonding portion 24 U of FIG. 1B is in a linear shape.
  • the oblique angles of the gap G 50 and the gap G 20 are different.
  • FIG. 2 is a schematic top view illustrating a touch panel according to the first embodiment of the invention.
  • a touch panel 100 includes a plurality of first sensing structures 110 , a plurality of second sensing structures 120 , a plurality of first bonding pad structures 130 , a plurality of second bonding pad structures 140 , a plurality of wire structures 150 , and a substrate 160 , wherein the first sensing structures 110 , the second sensing structures 120 , the first bonding pad structures 130 , the second bonding pad structures 140 , and the wire structures 150 are disposed on the substrate 160 and located at the same side of the substrate 160 .
  • the first sensing structures 110 and the second sensing structures 120 are respectively elongated sensing structures, wherein the extending direction of each of the first sensing structures 110 is a first direction D 1 , and the extending direction of each of the second sensing structures 120 is a second direction D 2 , wherein the first direction D 1 and the second direction D 2 intersect with each other. Therefore, the second sensing structures 120 and the first sensing structures 110 are disposed to intersect with one another.
  • the first sensing structures 110 and the second sensing structures 120 may be correspondingly connected to the first bonding pad structures 130 and the second bonding pad structures 140 in a bonding pad disposing region 102 via the wire structures 150 .
  • a driving control circuit that controls the touch panel 100 may be connected to the first bonding pad structures 130 and the second bonding pad structures 140 so as to perform a touch sensing operation to the first sensing structures 110 and the second sensing structures 120 .
  • FIG. 3 is a schematic enlargement view illustrating a portion P in the touch panel according to FIG. 2 .
  • FIGS. 2-3 show that the first sensing structures 110 include a plurality of diamond-grid shaped first sensing portions 112 and a plurality of first connecting portions 114 , wherein each of the first connecting portions 114 connects two adjacent first sensing portions 112 in series in the first direction D 1 .
  • the second sensing structures 120 include a plurality of diamond-grid shaped second sensing portions 122 and a plurality of second connecting portions 124 , wherein each of the second connecting portions 124 connects two adjacent second sensing portions 122 in series in the second direction D 2 .
  • each of the first connecting portions 114 intersects with a corresponding second connecting portion 124 , and an insulating pattern SI is disposed between the connecting portion 114 and the connecting portion 124 so as to avoid short circuit generated therebetween.
  • each of the first bonding pad structures 130 includes a first sub-bonding pad 130 A and a second sub-bonding pad 130 B, and the first sub-bonding pad 130 A and the second sub-bonding pad 130 B are separated from each other.
  • Each of the first sensing structures 110 has a first terminal 110 A opposite to a second terminal 110 B. Meanwhile, the first portion (such as the first wire 150 A) of the wire structures 150 connects the first connection terminal of the first sub-bonding pad 130 A in the first bonding pad structures 130 to the first terminal 110 A of the first sensing structures 110 .
  • the second portion (such as the second wire 150 B) of the wire structures 150 connects the second terminal of the second sub-bonding pad 130 B in the first bonding pad structures 130 to the second terminal 110 B of the first sensing structures 110 .
  • the third portion (such as the third wire 150 C) of the wire structures 150 connects each of the second sensing structures 120 to the corresponding second bonding pad structures 140 .
  • the first bonding pad structures 130 may be realized by selecting any one of the bonding pad structures 10 - 50 in FIGS. 1A-1E . Therefore, the specific structure design of the first sub-bonding pad 130 A and the second sub-bonding pad 130 B is not limited to the manner illustrated in FIG. 2 .
  • the first sub-bonding pad 130 A and the second sub-bonding pad 130 B are respectively connected to the first terminal 110 A and the second terminal 110 B of the same first sensing structures 110 (i.e. so-called “double routing” type).
  • double routing the first sub-bonding pad 130 A and the second sub-bonding pad 130 B in the same first bonding pad structure 130 are separated from each other; the first sub-bonding pad 130 A, the corresponding first wire 150 A, the first sensing structures 110 , the corresponding first wire 150 B, and the second sub-bonding pad 130 B may form a loop, which facilitates the application in electrical tests.
  • the first sub-bonding pad 130 A and the second sub-bonding pad 130 B are respectively connected to the first terminal 110 A and the second terminal 110 B of two different first sensing structures 110 .
  • the wire arrangement in such embodiment is, for example, the first sensing structures 110 at the upper half of the substrate respectively connect the first wire 150 B to the second bonding pad 130 B from the left-sided second terminal 110 B, and the first sensing structures 110 at the lower half of the substrate respectively connect the first wire 150 A to the first bonding pad 130 A from the right-sided second terminal 110 A.
  • the first sensing structures 110 of the odd rows respectively connect the first wire 150 B to the second bonding pad 130 B from the left-sided second terminal 110 B
  • the first sensing structures 110 of the even rows respectively connect the first wire 150 A to the first bonding pad 130 A from the right-sided second terminal 110 A, that is, the first sensing structures 110 are routed in a left-right alternate manner from top to bottom.
  • FIGS. 1A-1E show that the design for the first sub-bonding pad 130 A and the second sub-bonding pad 130 B allows the overall size of the first bonding structures 130 to be substantially equal to the second bonding pad structures 140 .
  • the width W 130 of each of the first bonding pad structures 130 is substantially equal to the width W 140 of each of the second bonding pad structures 140
  • the length L 130 of each of the first bonding pad structures 130 is substantially equal to the length L 140 of each of the second bonding pad structures 140 .
  • the area for the bonding pad disposing region 102 is not significantly increased accordingly.
  • the design in the embodiment is that two bonding pads are disposed within the width of a single bonding pad structure so that the bonding pads may be arranged more closely. Since the volume of the bonding medium (such as ACF) in using is related to the area for the bonding pad disposition region 102 , the decrease in the area for the bonding pad disposition region 102 helps to reduce the volume of the ACF in using, thereby lowering cost and ensuring the reliability of the ACF. In addition, the descriptions for FIGS. 1A-1E show that the design for the first bonding pad structures 130 helps to enhance test accuracy and also to ensure that the ACF accurately bonds the first sub-bonding pad 130 A to the second sub-bonding pad 130 B.
  • ACF the volume of the bonding medium
  • FIG. 4 is a schematic top view illustrating a touch panel according to the second embodiment of the invention.
  • a touch panel 200 includes a plurality of first sensing structures 210 , a plurality of second sensing structures 220 , a plurality of first bonding pad structures 230 , a plurality of second bonding pad structures 240 , a plurality of wire structures 250 , and a substrate 260 , wherein the first sensing structures 210 , the second sensing structures 220 , the first bonding pad structures 230 , the second bonding pad structures 240 , and the wire structures 250 are disposed on the substrate 260 and located at the same side of the substrate 260 .
  • the design for the first sensing structures 210 and the second sensing structures 220 is the same as the design for the touch panel 100 in the first embodiment. Therefore, please refer to FIGS. 2-3 for related descriptions.
  • the first bonding pad structures 230 are divided into a first portion 232 and a second portion 234 , and the first portion 232 and the second portion 234 are respectively located at two sides of the second bonding pad structures 240 .
  • the second bonding pad structures 240 are respectively designed as any one of the bonding pad structures 10 - 50 in FIGS. 1A-1E . That is to say, the second bonding pad structures 240 respectively include the first sub-bonding pad 240 A and the second sub-bonding pad 240 B.
  • the wire structures 250 are divided into a plurality of first wires 250 A, a plurality of second wires 250 B, a plurality of third wires 250 C, and a plurality of fourth wires 250 D according to the components connected thereto.
  • a first terminal 210 A and a second terminal 210 B of each of the first sensing structures 210 are respectively connected to a first bonding pad structure 230 , wherein each of the first terminals 210 A is connected to one of the first bonding pad structures 230 of the first portion 232 via one of the first wires 250 A, and each of the second terminal 210 B is connected to one of the first bonding pad structures 230 of the second portion 234 via one of the first wires 250 B.
  • first terminal 220 A and the second terminal 220 B of each of the second sensing structures 220 are respectively connected to the first sub-bonding pad 240 A and the second sub-bonding pad 240 B of the same second bonding pad structures 240 , wherein each of the first terminals 220 A is connected to the first sub-bonding pad 240 A of one of the second bonding pad structures 240 via one of the third wires 250 C; each of the second terminals 220 B is connected to the second sub-bonding pad 240 B of one of the second bonding pad structures 240 via one of the fourth wires 250 D. Furthermore, to make the length of the wiring path to be more uniform, a portion of the third wires 250 C may pass by the outer side of the first wires 250 A, and another portion may pass by the outer side of the second wires 250 B.
  • the design for the second bonding pad structures 240 may improve the reliability of the touch panel 200 when being bonded to external components, and also increase the test accuracy of the touch panel 200 . Moreover, the design for the second bonding pad structures 240 may allow the bonding pad disposing region of the touch panel 200 to be reduced, facilitating to reduce the amount of bonding medium (such as the ACF) in using and the volume thereof, thereby lowering the cost. In the meantime, the decrease in the volume of the ACF may reduce the possibility of bad reliability caused by the change of the volume of the ACF due to temperature differences during the manufacturing process.
  • the design for the second bonding pad structures 240 may improve the reliability of the touch panel 200 when being bonded to external components, and also increase the test accuracy of the touch panel 200 . Moreover, the design for the second bonding pad structures 240 may allow the bonding pad disposing region of the touch panel 200 to be reduced, facilitating to reduce the amount of bonding medium (such as the ACF) in using and the volume thereof, thereby lowering the cost. In the meantime,
  • FIG. 5 is a schematic side view illustrating a touch panel according to the third embodiment of the invention.
  • FIGS. 6-7 are schematic top views illustrating a first sensing layer and a second sensing layer within the touch panel according to FIG. 5 . Please refer to FIG. 5 first.
  • a touch panel 300 includes a first sensing layer 300 A, a second sensing layer 300 B, and a intermediate layer 300 C, wherein the intermediate layer 300 C is sandwiched between the first sensing layer 300 A and the second sensing layer 300 B. That is to say, the intermediate layer 300 C has a first side S 1 opposite to a second side S 2 , and the first sensing layer 300 A and the second sensing layer 300 B are respectively disposed at the first side S 1 and the second side S 2 .
  • the first sensing layer 300 A includes a plurality of first sensing structures 310 , first bonding pad structures 320 , and a plurality of first wire structures 330 , wherein the first sensing structures 310 are elongated conductive patterns respectively extended in a first direction D 1 .
  • the first bonding pad structures 320 respectively have the design as any one of the bonding pad structures 10 - 50 illustrated in FIGS. 1A-1E . Therefore, the first bonding pad structures 320 respectively include a first sub-bonding pad 320 A and a second sub-bonding pad 320 B.
  • Each of the first sub-bonding pads 320 A is connected to a first terminal 310 A of one of the first sensing structures 310 via one of the first wire structures 330
  • each of the second sub-bonding pads 320 B is connected to a second terminal 310 B of one of the first sensing structures 310 via one of the first wire structures 330
  • the first terminal 310 A and the second terminal 310 B of the same first sensing structures 310 are connected to the first sub-bonding pad 320 A and the second sub-bonding pad 320 B of the same first bonding pad structure 320 .
  • the wire arrangement is, for example, the first sensing structures 310 of the upper half of the substrate respectively connect one of the left-sided first wire structures 310 to the second bonding pad 320 B from the left-sided first terminal 310 B, and the first sensing structures 310 of the lower half of the substrate respectively connect one of the right-sided first wire structures 330 to the first bonding pad 320 A from the right-sided second terminal 310 A.
  • the first sensing structures 310 of the odd rows respectively connect one of the left-sided first wire structures 330 to the second bonding pad 320 B from the left-sided first terminal 310 B
  • the first sensing structures 110 of the even rows respectively connect one of the right-sided first wire structures 330 to the first bonding pad 320 A from the right-sided second terminal 310 A; that is, the first sensing structures 310 are routed in a left-right alternate manner from top to bottom.
  • the second sensing layer 300 B includes a plurality of second sensing structures 340 , second bonding pad structures 350 , and a plurality of second wire structures 360 , wherein the second sensing structures 340 are elongated conductive patterns respectively extended in the second direction D 2 and have a third terminal 340 A opposite to a fourth terminal 340 B.
  • the second bonding pad structures 350 respectively have the design as any one of the bonding pad structures 10 - 50 as illustrated in FIGS. 1A-1E . Therefore, the second bonding pad structures 350 respectively include a third sub-bonding pad 350 A and a fourth sub-bonding pad 350 B.
  • Each of the third sub-bonding pads 350 A is connected to the third terminal 340 A of one of the second sensing structures 340 via one of the second wire structures 360
  • each of the fourth sub-bonding pads 350 B is connected to the fourth terminal 340 B of one of the second sensing structures 340 via one of the second wire structures 360
  • the third terminal 340 A and the fourth terminal 340 B of the same second sensing structure 340 are connected to the third sub-bonding pad 350 A and the fourth sub-bonding pad 350 B of the same second bonding pad structure 350 .
  • dash lines represent the outline of the first sensing structure 310 so as to show the relation between the first sensing structure 310 and the second sensing structure 340 .
  • first sensing structures 310 and the second sensing structures 340 in the embodiment are respectively in an elongated rectangular shape, however, which should not be construed as a limitation to the invention.
  • first sensing structures 310 and the second sensing structures 340 may respectively have the diamond-grid series pattern as illustrated in FIG. 2 .
  • FIGS. 5-7 show that the bonding pad structures of the touch panel 300 adopt the designs illustrated in any one of FIGS. 1A-1E , and therefore the bonding pad structures are disposed to be closer, which helps to reduce the area required for disposing the bonding pad structures.
  • the intermediate layer 300 C may be a substrate or an insulating layer.
  • the first sensing layer 300 A and the second sensing layer 300 B may be directly disposed at two opposite sides of the substrate, however, which should not be construed as a limitation to the invention.
  • FIG. 8 is a schematic side view illustrating the touch panel according to the third embodiment of the invention.
  • a touch panel 400 further includes a substrate 400 A apart from the above-mentioned first sensing layer 300 A, the second sensing layer 300 B, and the intermediate layer 300 C; please refer to FIGS. 6-7 and related descriptions in the above embodiments for the specific structures of the first sensing layer 300 A, the second sensing layer 300 B, and the intermediate layer 300 C.
  • the first sensing layer 300 A, the intermediate layer 300 C, and the second sensing layer 300 B are sequentially disposed on the substrate 400 A; that is to say, the intermediate layer 300 C is an insulating layer.
  • FIG. 9 is a schematic side view illustrating a touch panel according to the fourth embodiment of the invention.
  • a touch panel 500 further includes a first substrate 500 A and a second substrate 500 B apart from the above-mentioned first sensing layer 300 A, the second sensing layer 300 B, and the intermediate layer 300 C; please refer to FIGS. 6-7 and related descriptions in the above embodiments for the specific structures of the first sensing layer 300 A, the second sensing layer 300 B and the intermediate layer 300 C.
  • the first sensing layer 300 A is disposed on the first substrate 500 A
  • the second sensing layer 300 B is disposed on the second substrate 500 B
  • the first substrate 500 A is adhered to the second substrate 500 B via the intermediate layer 300 C.
  • the intermediate layer 300 C is an insulating adhesive layer.
  • the first sensing layer 300 A and the second sensing layer 300 B are located between the first substrate 500 A and the second substrate 500 B, however, which should not be construed as a limitation to the invention.
  • the first sensing layer 300 A and the first substrate 500 A may be upside down so that the first substrate 500 A is disposed between the first sensing layer 300 A and the intermediate layer 300 C.
  • the touch panels in each of the above embodiments are exemplified to be provided with the first sensing structures intersecting with the second sensing structures on the same layer of the same substrate, or provided with the first sensing layer and the second sensing layer that are respectively arranged on different layers of the same substrate or on different substrates.
  • the design of the bonding pad structures disclosed in the invention may also be applied in a single-layered touch panel with a single sensing structure provided with only one of the first sensing structure or the second sensing structure on the substrate.
  • the touch panel makes two sub-bonding pads that are connected to the same sensing structure to be a pair and complementary in shape so that the two paired sub-bonding pads that are complementary in shape have opposite width variance trends, and the overall size of the two sub-bonding pads is about to be equal to the size of a single independent bonding pad. Accordingly, the bonding pads are disposed to be closer and the bonding pad disposing region is further reduced, facilitating to reduce the amount of the bonding medium (such as the ACF) in using and the disposing volume. Meanwhile, the widths of each of the sub-bonding pads are not constant, wherein the wider region of the sub-bonding pads may provide sufficient area for the test operation to be carried out easily.
  • the touch panel in the embodiments of the invention may reduce the area for the bonding pad disposition, save the cost for the bonding medium, mitigate the problem caused by the bonding medium, and also maintain the accuracy of test operations.

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  • General Engineering & Computer Science (AREA)
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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)
  • Combinations Of Printed Boards (AREA)
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US11277913B2 (en) * 2018-06-01 2022-03-15 Alltop Electronics (Suzhou) Ltd. Electrical connector assembly
CN110456944A (zh) * 2019-08-15 2019-11-15 业成科技（成都）有限公司 触控面板及其制作方法
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