US20150231820A1 - Molded body assembly, apparatus for manufacturing the molded body assembly, and method of manufacturing and using the molded body assembly - Google Patents

Molded body assembly, apparatus for manufacturing the molded body assembly, and method of manufacturing and using the molded body assembly Download PDF

Info

Publication number
US20150231820A1
US20150231820A1 US14/432,694 US201314432694A US2015231820A1 US 20150231820 A1 US20150231820 A1 US 20150231820A1 US 201314432694 A US201314432694 A US 201314432694A US 2015231820 A1 US2015231820 A1 US 2015231820A1
Authority
US
United States
Prior art keywords
mold
molded body
holder
raw material
uncut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/432,694
Other languages
English (en)
Inventor
Mitsunori Kokubo
Yuki Sugiura
Toru Suzuki
Terukatsu Kuboki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Machine Co Ltd
Original Assignee
Toshiba Machine Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Machine Co Ltd filed Critical Toshiba Machine Co Ltd
Assigned to TOSHIBA KIKAI KABUSHIKI KAISHA reassignment TOSHIBA KIKAI KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KOKUBO, MITSUNORI, KUBOKI, Terukatsu, SUGIURA, YUKI, SUZUKI, TORU
Publication of US20150231820A1 publication Critical patent/US20150231820A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/002—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/001—Profiled members, e.g. beams, sections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612—Composite web or sheet

Definitions

  • the present invention relates to a molded body assembly, an apparatus for manufacturing the molded body assembly, and a method of manufacturing and using the molded body assembly, and particularly to those in which a fine transfer pattern is (has been) transferred from a mold to a to-be-molded body.
  • Non Patent Literature 1 an ultrafine transfer pattern is formed on a quartz substrate or the like by electron beam lithography or the like to fabricate a template (mold) and in which the template is pressed against a to-be-molded piece with a predetermined pressure to transfer the transfer pattern formed on the template.
  • a mold 301 and a to-be-molded body 309 are disposed to face each other.
  • the mold 301 includes a mold base 303 and a transfer pattern formation body 305 , and a fine transfer pattern (hereinafter simply referred to as a transfer pattern) 307 is formed in the transfer pattern formation body 305 .
  • the to-be-molded body 309 includes a to-be-molded body base 311 and a molding material 313 .
  • the molding material 313 for example, uncured ultraviolet curable resin is employed.
  • the mold 301 is lowered. As shown in FIG. 12( b ), the mold 301 is brought into contact with the to-be-molded body 309 so that the mold 301 may press the to-be-molded body 309 , and the molding material 313 is irradiated with ultraviolet light to be cured.
  • the mold 301 is separated from the to-be-molded body 309 to obtain the to-be-molded body 309 having a transferred pattern 315 .
  • the to-be-molded body 309 having the transferred pattern 315 shown in FIG. 12( d ) is used as, for example, an optical filter for a display unit of a smartphone.
  • the to-be-molded body 309 is transported in the state shown in FIG. 12( d ) and incorporated into a product such as a smartphone, there is the problem that the transferred pattern may be damaged during transportation or incorporation.
  • the present invention has been made in view of the above-described problem, and an object of the present invention is to provide a molded body assembly, an apparatus for manufacturing the molded body assembly, and a method of manufacturing and using the molded body assembly which allow for minimizing the possibility of damage to a transferred pattern formed in a to-be-molded body by transferring.
  • a first aspect of the present invention is a molded body assembly comprising: a to-be-molded body; and a mold formed in a shape of a sheet, the mold comprising a fine transfer pattern formed on one surface thereof facing in a thickness direction thereof, the mold being caused to adhere to the to-be-molded body by transferring of the fine transfer pattern to the to-be-molded body and protecting a fine transferred pattern formed in the to-be-molded body.
  • the transferring may be performed using part of an uncut mold extending from a mold raw material roll wrapped into a roll.
  • the mold may be formed by cutting the uncut mold at a predetermined position in a longitudinal direction thereof.
  • a dimension of the mold may be larger than a dimension of the to-be-molded body in the longitudinal direction of the mold.
  • Two end portions of the mold which are opposite to each other in the longitudinal direction thereof may extend from two opposite ends of the to-be-molded body by predetermined lengths.
  • a second aspect of the present invention is a method of manufacturing and using the molded body assembly according to the first aspect, comprising the steps of: transferring the fine transfer pattern of the mold to the to-be-molded body; transporting the mold and the to-be-molded body caused to adhere to each other by the transferring in the transferring step to a predetermined place; and removing the mold from the molded body assembly transported in the transporting step.
  • a third aspect of the present invention is an apparatus for manufacturing the molded body assembly according to the first aspect, comprising: a to-be-molded body holder configured to hold a to-be-molded body placed thereon; a raw material roll placement portion in which a mold raw material roll is placed; a mold holder configured to hold a leading edge portion of an uncut mold extending from the mold raw material roll, and to move relative to the to-be-molded body holder; a transfer unit configured to transfer a fine transfer pattern of the uncut mold to the to-be-molded body placed on and held by the to-be-molded body holder; a cutting unit configured to cut the uncut mold at a predetermined position in a longitudinal direction thereof; and a controller configured to control the to-be-molded body holder, the mold holder, the transfer unit, and the cutting unit to:
  • the cutting unit causes the cutting unit to cut the uncut mold at a predetermined position spaced away from the to-be-molded body adhering thereto in a direction of the mold raw material roll placed in the raw material roll placement portion.
  • the present invention allows for minimizing the possibility of damage to a fine transferred pattern formed in a to-be-molded body by transferring.
  • FIG. 1 is a view schematically showing the configuration of an apparatus for manufacturing a molded body assembly according to an embodiment of the present invention.
  • FIG. 2 is a view showing the operation of the apparatus for manufacturing the molded body assembly according to the embodiment of the present invention.
  • FIG. 3 is a view showing the operation of the apparatus for manufacturing the molded body assembly according to the embodiment of the present invention.
  • FIG. 4 is a view showing the operation of the apparatus for manufacturing the molded body assembly according to the embodiment of the present invention.
  • FIG. 5 is a view showing the operation of the apparatus for manufacturing the molded body assembly according to the embodiment of the present invention.
  • FIG. 6 is a view showing the operation of the apparatus for manufacturing the molded body assembly according to the embodiment of the present invention.
  • FIG. 7 is a view showing the operation of the apparatus for manufacturing the molded body assembly according to the embodiment of the present invention.
  • FIG. 8 is a view showing the operation of the apparatus for manufacturing the molded body assembly according to the embodiment of the present invention.
  • FIG. 9 is a view showing the operation of the apparatus for manufacturing the molded body assembly according to the embodiment of the present invention.
  • FIG. 10 is a view showing the operation of the apparatus for manufacturing the molded body assembly according to the embodiment of the present invention.
  • FIG. 11 is a view showing the operation of the apparatus for manufacturing the molded body assembly according to the embodiment of the present invention.
  • FIGS. 12( a ) to 12 ( d ) are views for explaining transferring.
  • FIG. 12( c ) is a view schematically showing the configuration of the molded body assembly according to the embodiment of the present invention.
  • a molded body assembly 1 includes a to-be-molded body 3 and a mold 5 as shown in FIG. 12( c ).
  • Each of the to-be-molded body 3 and the mold 5 is formed in the shape of a sheet (film).
  • the mold 5 has a fine transfer pattern (hereinafter simply referred to as a transfer pattern) 7 formed on one surface thereof facing in a thickness direction thereof. Transferring the transfer pattern 7 causes, for example, the mold 5 to adhere to the to-be-molded body 3 while maintaining a state thereof at the time of transferring. By maintaining this adhesion, a fine transferred pattern (hereinafter simply referred to as a transferred pattern) 9 formed on the to-be-molded body 3 is protected.
  • a fine transfer pattern hereinafter simply referred to as a transfer pattern
  • the mold 5 can be removed from the to-be-molded body 3 . After the transferred pattern 9 is formed on the to-be-molded body 3 and when the to-be-molded body 3 is used as a product or a half-finished product, the mold 5 is removed from the to-be-molded body 3 .
  • the mold 5 adheres to the to-be-molded body 3 , and the mold 5 and the to-be-molded body 3 are superposed.
  • the thickness direction of the to-be-molded body 3 and the thickness direction of the mold 5 are the same.
  • the surface of the mold 5 on which the transfer pattern 7 is formed and the surface of the to-be-molded body 3 on which the transferred pattern 9 is transferred adhere tightly to each other.
  • the to-be-molded body 3 having the transferred pattern 9 is used as, for example, an optical element such as a filter for an image display unit of a smartphone (multifunctional mobile phone) or a tablet PC (plate-shaped mobile computer). Moreover, the to-be-molded body 3 can also be used as, for example, a wafer or a reticle substrate (e.g., 6025 reticle substrate).
  • transferring is performed using a portion (see FIG. 1 and the like) of a strip-shaped uncut mold (elongated mold) 13 extending from a mold raw material roll (raw material roll) 11 wrapped into a roll.
  • the mold 5 is formed by cutting the strip-shaped uncut mold 13 extending from the mold raw material roll 11 at a predetermined position in the longitudinal direction thereof.
  • the dimension of the mold 5 is larger than the dimension of the to-be-molded body 3 in the longitudinal direction (horizontal direction in FIG. 12( c )) of the mold 5 .
  • two end portions of the mold 5 which are opposite to each other in the longitudinal direction thereof extend (protrude) from two opposite ends of the to-be-molded body 3 by predetermined lengths.
  • the transfer pattern 7 is formed by lines and spaces having pitches and heights comparable to, for example, wavelengths of visible light.
  • the transfer pattern 7 is transferred to the to-be-molded body 3 by transferring, and the transferred pattern 9 having an inverse shape to that of the transfer pattern 7 is formed in the to-be-molded body 3 .
  • the mold 5 has flexibility.
  • the mold 5 hardly elastically deforms even when a tensile force perpendicular to the thickness direction thereof is applied thereto, and can be regarded as an approximately rigid body.
  • the mold 5 easily deforms such that the mold 5 peels off in the thickness direction thereof, like a banknote or the like.
  • the mold 5 is easily deformed by a moment about an axis extending in a direction perpendicular to the thickness direction and the longitudinal direction. Accordingly, the mold 5 can be easily peeled off from the to-be-molded body 3 when removed therefrom.
  • the mold 5 includes a sheet-shaped base (mold base) 15 and a transfer pattern formation body 17 (see FIG. 12( a )).
  • the sheet-shaped mold base 15 is plate-shaped and made of, for example, resin material such as PET resin which allows ultraviolet light to pass therethrough.
  • the transfer pattern formation body 17 is in the form of a thin film and is made of, for example, resin which allows ultraviolet light to pass therethrough.
  • the resin constituting the transfer pattern formation body 17 is ultraviolet curable resin, thermosetting resin, thermoplastic resin, or the like.
  • the transfer pattern formation body 17 is provided on one surface of the mold base 15 which faces in the thickness direction thereof, integrally with the mold base 15 , such that the thickness direction thereof is the same as the thickness direction of the mold base 15 .
  • the transfer pattern 7 is formed on a surface of the transfer pattern formation body 17 .
  • This surface is one surface of the transfer pattern formation body 17 which faces in the thickness direction thereof, and is a surface opposite to the surface in contact with the mold base 15 . It should be noted that the transfer pattern 7 is produced by transferring a fine transfer pattern formed on an unillustrated master mold.
  • the mold base 15 is formed in the shape of, for example, a rectangular plate.
  • the width dimension (dimension in a direction perpendicular to the plane of the drawing of FIG. 12( c )) and the length dimension (dimension in the horizontal direction of FIG. 12( c )) of the mold base 15 are significantly larger than the thickness dimension (dimension in the vertical direction of FIG. 12( c )) of the mold base 15 .
  • the transfer pattern formation body 17 is also formed in the shape of, for example, a rectangular plate.
  • the transfer pattern formation body 17 is provided on the mold base 15 such that the width direction thereof is the same as the width direction of the mold base 15 and that the length direction thereof is the same as the length direction of the mold base 15 .
  • the width dimension of the transfer pattern formation body 17 is smaller than the width dimension of the mold base 15 .
  • the center of the transfer pattern formation body 17 in the width direction thereof coincides with the center of the mold base 15 in the width direction thereof.
  • the length dimension of the transfer pattern formation body 17 is smaller than the length dimension of the mold base 15 .
  • the center of the transfer pattern formation body 17 in the length direction thereof coincides with the center of the mold base 15 in the length direction thereof.
  • a transfer pattern formation body absent portion (portion including only the mold base) 19 having the shape of a rectangular loop is formed in a peripheral portion of the mold 5 .
  • the to-be-molded body 3 has flexibility, but has higher rigidity than the mold 5 . Accordingly, when the mold 5 is removed from the to-be-molded body 3 after the mold 5 is transferred, the to-be-molded body 3 does not easily peel off.
  • the sheet-shaped to-be-molded body 3 includes a sheet-shaped base (to-be-molded body base) 21 and a molding material 23 .
  • the sheet-shaped to-be-molded body base 21 is plate-shaped and made of, for example, resin material such as PET resin.
  • the molding material 23 is in the form of a thin film and is made of resin such as ultraviolet curable resin, thermosetting resin, or thermoplastic resin.
  • the to-be-molded body base 21 is also formed in the shape of a rectangular plate.
  • the width dimension of the to-be-molded body base 21 is approximately equal to the width dimension of the mold base 15 .
  • the length dimension of the to-be-molded body base 21 is smaller than the length dimension of the mold base 15 .
  • the molding material 23 is also formed in the shape of a rectangular plate.
  • the molding material 23 is provided on one surface of the to-be-molded body base 21 which faces in a thickness direction thereof, such that the thickness direction thereof is the same as the thickness direction of the to-be-molded body base 21 .
  • the width direction of the molding material 23 is the same as the width direction of the to-be-molded body base 21
  • the length direction of the molding material 23 is the same as the length direction of the to-be-molded body base 21 .
  • the width dimension of the molding material 23 is smaller than the width dimension of the to-be-molded body base 21 .
  • the length dimension of the molding material 23 is also smaller than the length dimension of the to-be-molded body base 21 .
  • the center of the molding material 23 in the width direction thereof coincides with the center of the to-be-molded body base 21 in the width direction thereof.
  • the center of the molding material 23 in the length direction thereof coincides with the center of the to-be-molded body base 21 in the length direction thereof.
  • a molding material absent portion (portion including only the to-be-molded body base 21 ) 25 having the shape of a rectangular loop is formed in a peripheral portion of the molding material 23 .
  • the fine transferred pattern 9 of the molding material 23 is formed on a surface (one surface facing in the thickness direction and a surface opposite to the surface in contact with the to-be-molded body base 21 ) of the molding material 23 by transferring the transfer pattern 7 .
  • the molding material 23 before the transfer pattern 7 is transferred is in an uncured state.
  • the molding material 23 at this time is liquid (depending on the material thereof, viscous liquid). The molding material 23 starts curing when transferring is started, and fully cures when the transferring is finished.
  • the width direction of the mold base 15 is the same as the width direction of the to-be-molded body base 21 .
  • the length direction of the mold base 15 is the same as the length direction of the to-be-molded body base 21 .
  • the center of the mold base 15 in the width direction thereof coincides with the center of the to-be-molded body base 21 in the width direction thereof.
  • the center of the mold base 15 in the length direction thereof coincides with the center of the to-be-molded body base 21 in the length direction thereof.
  • a no-adhesion portion 27 which has the shape of a rectangular loop and in which the mold 5 is separated from the to-be-molded body 3 is formed in a peripheral portion of the molded body assembly 1 .
  • the mold raw material roll 11 is the strip-shaped uncut mold 13 before used in transferring which is in the state of being wrapped into a roll.
  • the mold raw material roll 11 is formed in the shape of a cylinder or a column by wrapping the strip-shaped uncut mold 13 around a columnar core such that the circumferential direction of the cylindrical core is the same as the longitudinal direction of the sheet-shaped uncut mold 13 .
  • a plurality of transfer pattern formation bodies 17 are provided on the uncut mold 13 to be spaced at intervals of a predetermined distance in the length direction of the mold base 13 (uncut mold base 15 ).
  • the uncut mold 13 is cut at a position between adjacent transfer pattern formation bodies 17 to produce the mold 5 .
  • the transfer pattern 7 of the mold 5 is transferred to the to-be-molded body 3 (see FIGS. 12( a ) and 12 ( b ); transfer step).
  • the mold 5 and the to-be-molded body 3 adhering to each other by the transferring in the transfer step are transported to a predetermined place (transporting step).
  • a state in which the mold 5 and the to-be-molded body 3 adhere to each other is maintained. For example, this state is maintained until a subsequent step is performed or even after the mold 5 and the to-be-molded body 3 are incorporated into a product.
  • the mold 5 is removed from the molded body assembly 1 transported in the transporting step to expose the transferred pattern 9 formed in the to-be-molded body 3 (see FIG. 12( d ); removal step).
  • the molded body assembly manufacturing apparatus 29 includes a to-be-molded body holder 31 , a raw material roll placement portion (mold raw material roll placement portion) 33 , a mold holder 35 , a transfer unit 37 , a cutting unit 39 , and a controller 41 .
  • the to-be-molded body 3 is placed on the to-be-molded body holder 31 .
  • the to-be-molded body holder 31 holds the to-be-molded body 3 .
  • the mold raw material roll 11 is placed in the raw material roll placement portion 33 .
  • the position of the rotation axis C 2 of the mold raw material roll (placed mold raw material roll) 11 relative to the to-be-molded body holder 31 is fixed.
  • the rotation axis C 2 of the placed mold raw material roll 11 does not move relative to the to-be-molded body holder 31 .
  • the mold holder (mold guiding body) 35 holds a leading edge portion of the uncut mold 13 extending from the mold raw material roll 11 , and moves relative to the to-be-molded body holder 31 .
  • the transfer unit 37 transfers the transfer pattern 7 of the uncut mold 13 to the to-be-molded body 3 placed on and held by the to-be-molded body holder 31 .
  • the cutting unit 39 cuts the uncut mold 13 at a predetermined position in the longitudinal direction thereof.
  • the controller 41 controls the to-be-molded body holder 31 , the raw material roll placement portion 33 , the mold holder 35 , the transfer unit 37 , and the cutting unit 39 as follows.
  • the to-be-molded body 3 is placed on and held by the to-be-molded body holder 31 .
  • the mold raw material roll 11 is placed in the raw material roll placement portion 33 .
  • the uncut mold 13 slightly extends from the mold raw material roll 11 .
  • the mold holder 35 holds the leading edge portion of the uncut mold 13 near the mold raw material roll 11 .
  • the mold holder 35 moves so as to pull out the uncut mold 13 from the mold raw material roll 11 until the transfer pattern 7 of the uncut mold 13 faces the to-be-molded body 3 on the to-be-molded body holder 31 (see FIG. 3 ).
  • the pulled-out uncut mold 13 is located across the to-be-molded body 3 from the to-be-molded body holder 31 . At this time, the uncut mold 13 is, for example, slightly separated from the to-be-molded body 3 .
  • the transfer unit 37 transfers the fine transfer pattern 7 of the uncut mold 13 to the to-be-molded body 3 on the to-be-molded body holder 31 (see FIGS. 7 to 4 ).
  • the to-be-molded body holder 31 releases the to-be-molded body 3 (see FIG. 8 ). In other words, the to-be-molded body 3 is released from the to-be-molded body holder 31 .
  • the mold holder 35 After the to-be-molded body holder 31 has released the to-be-molded body 3 , the mold holder 35 further pulls out the uncut mold 13 from the mold raw material roll 11 in a state in which the to-be-molded body 3 still adheres to the uncut mold until the to-be-molded body 3 is separated from the to-be-molded body holder 31 (see FIG. 9 ).
  • the cutting unit 39 cuts the uncut mold 13 at a predetermined position spaced away from the to-be-molded body 3 having the uncut mold 13 adhering thereto in the direction of the mold raw material roll 11 (see FIGS. 11 and 10 ).
  • a temporarily holding unit 43 and guide rollers 45 are provided in the manufacturing apparatus 29 .
  • the temporarily holding unit 43 holds the uncut mold 13 at a predetermined position in the longitudinal direction thereof under the control of the controller 41 when the cutting unit 39 cuts the uncut mold 13 .
  • the cutting unit 39 cuts the uncut mold 13 while the temporarily holding unit 43 is holding the uncut mold 13 , the to-be-molded body holder 31 (transfer unit 37 ), the temporarily holding unit 43 , the cutting unit 39 , the to-be-molded body 3 adhering to the uncut mold 13 , and the mold holder 35 are located in this order from a proximal end side (mold raw material roll 11 side) toward a distal end side (mold holder 35 side) of the uncut mold 13 extending from the mold raw material roll 11 (see FIG. 10 ).
  • the temporarily holding unit 43 holds the uncut mold 13 even after the cutting is performed by the cutting unit 39 . Accordingly, the uncut mold 13 extends between the temporarily holding unit 43 and the mold raw material roll 11 in the longitudinal direction by a predetermined tension in a no-slack state.
  • the mold holder 35 moves toward the uncut mold 13 , and holds a new leading edge portion of the uncut mold 13 (see FIG. 11 ). Then, the temporarily holding unit 43 releases the uncut mold 13 , and the mold raw material roll 11 winds up the uncut mold 13 . The winding by the mold raw material roll 11 causes the mold holder 35 to move closer to the mold raw material roll 11 . Meanwhile, a new to-be-molded body 3 is placed on the to-be-molded body holder 31 and held by the to-be-molded body holder 31 . The above-described operation causes the manufacturing apparatus 29 to return to the initial state of FIG. 2 .
  • the guide rollers 45 ( 45 A, 45 B) are provided to be separated across the to-be-molded body holder 31 in the longitudinal direction of the uncut mold 13 .
  • the guide rollers 45 are configured to be capable of being moved and positioned in directions toward and away from the to-be-molded body holder 31 under the control of the controller 41 .
  • one guide roller 45 A is slightly separated from one end of the to-be-molded body holder 31
  • the other guide roller 45 B is slightly separated from the other end of the to-be-molded body holder 31 .
  • the guide rollers 45 ( 45 A, 45 B) appropriatelymove (guide) the uncut mold 13 toward the to-be-molded body holder 31 .
  • a horizontal direction is referred to as an X-axis direction
  • another horizontal direction perpendicular to the X-axis direction is referred to as a Y-axis direction
  • a vertical direction perpendicular to the X-axis direction and the Y-axis direction is referred to as a Z-axis direction.
  • the molded body assembly manufacturing apparatus 29 includes a base body 47 .
  • the to-be-molded body holder 31 is provided integrally with the base body 47 .
  • the to-be-molded body holder 31 has a flat surface (to-be-molded body placement surface) 49 formed at a top thereof.
  • the flat surface 49 is perpendicular to the Z-axis direction.
  • the to-be-molded body 3 is held on the flat surface 49 of the to-be-molded body holder 31 by, for example, vacuum suction.
  • the molding material 23 is provided on one surface of the to-be-molded body base 21 which faces in the thickness direction thereof.
  • other surface (surface opposite to the molding material 23 ) of the to-be-molded body base 21 which faces in the thickness direction is in surface contact with the to-be-molded body placement surface 49 . Accordingly, the molding material 23 exists on an upper surface of the to-be-molded body base 21 .
  • the mold raw material roll 11 In a state in which the mold raw material roll 11 is placed in the raw material roll placement portion 33 , the mold raw material roll 11 is located above the to-be-molded body holder 31 in the Z-axis direction, and is separated from the one end of the to-be-molded body holder 31 in the X-axis direction. Moreover, the mold raw material roll 11 rotates about the axis C 2 extending in the Y-axis direction.
  • the mold holder 35 grips the leading edge of the uncut mold 13 in the thickness direction thereof to hold the uncut mold 13 .
  • the mold holder 35 is located above the to-be-molded body holder 31 in the Z-axis direction.
  • the mold holder 35 is supported by the base body 47 with an unillustrated linear guide bearing interposed therebetween.
  • the mold holder 35 is moved and positioned in the X-axis direction by an unillustrated actuator such as a servomotor.
  • the raw material roll placement portion 33 applies a rotating torque to the mold raw material roll 11 in a direction in which the uncut mold 13 is wound up, using an actuator such as a motor and a torque limiter.
  • a predetermined tension in the X-axis direction is applied to the uncut mold 13 extending between the mold holder 35 and the mold raw material roll 11 .
  • the thickness direction of the uncut mold 13 is the same as the Z-axis direction in a state in which the uncut mold 13 extends between the mold holder 35 and the mold raw material roll 11 . Moreover, the length direction (longitudinal direction) of the uncut mold 13 is the same as the X-axis direction. The width direction of the uncut mold 13 is the same as the Y-axis direction.
  • the transfer pattern formation body 17 is located on a lower surface of the mold base 15 .
  • the transfer pattern 7 of the uncut mold 13 is superposed on the molding material 23 of the to-be-molded body 3 on the to-be-molded body holder 31 when viewed in the Z-axis direction in a state in which the mold holder 35 is positioned and in which preparation for transferring is completed.
  • the guide rollers 45 ( 45 A, 45 B) are supported by unillustrated guide roller supports, and rotate about axes C 3 and C 4 extending in the Y-axis direction.
  • the guide roller supports are supported by the base body 47 with unillustrated linear guide bearings interposed therebetween, and are configured to be moved and positioned in the Z-axis direction under the control of the controller 41 .
  • the transfer unit 37 includes a pressure roller 51 and an ultraviolet light generator 53 .
  • the pressure roller 51 is supported by an unillustrated pressure roller support, and rotates about an axis C 1 extending in the Y-axis direction.
  • the pressure roller support is supported by the base body 47 with an unillustrated linear guide bearing interposed therebetween, and is configured to be moved and positioned in the Z-axis direction and the X-axis direction under the control of the controller 41 .
  • the pressure roller 51 is rotationally driven about the axis C 1 by a servomotor such as an actuator.
  • the pressure roller 51 is moved and positioned in the Z-axis direction under the control of the controller 41 , and grips the to-be-molded body 3 in cooperation with the to-be-molded body holder 31 therebetween to press the to-be-molded body 3 .
  • the pressure roller 51 moves in the X-axis direction while gripping and pressing the to-be-molded body 3 .
  • the pressure roller 51 and the uncut mold 13 constitute a rolling pair, and pressed portions on the uncut mold 13 and the to-be-molded body 3 move from the one end side to the other end side in the X-axis direction.
  • the pressure roller 51 While the pressure roller 51 is moving in the X-axis direction, the pressure roller 51 rotates at a rotational speed synchronized with the traveling speed in the X-axis direction. This prevents slip between the pressure roller 51 and the uncut mold 13 . It should be noted that a configuration may be employed in which the pressure roller 51 rotates in a free state (state in which the pressure roller 51 is not rotationally driven) to prevent the occurrence of the above-described slip.
  • the ultraviolet light generator 53 emits ultraviolet light toward the molding material 23 in the vicinity of a portion pressed by the pressure roller 51 to cure the molding material 23 .
  • the temporarily holding unit 43 includes a pair of clampers 55 .
  • the clampers 55 are moved in the Z-axis direction by an actuator such as a cylinder under the control of the controller 41 , and grip the uncut mold 13 in the thickness direction thereof to hold the uncut mold 13 .
  • clampers 55 are located across the guide roller 45 B from the to-be-molded body holder 31 in the X-axis direction.
  • the cutting unit 39 includes a pair of cutters 57 .
  • the cutters 57 are moved in the Z-axis direction by an actuator such as a cylinder under the control of the controller 41 , pinch the uncut mold 13 in the thickness direction thereof, and cut the uncut mold 13 .
  • cutters 57 are located across the clampers 55 from the guide roller 45 B in the X-axis direction.
  • the mold holder 35 is located above the to-be-molded body holder 31 and below the guide rollers 45 in the Z-axis direction. Moreover, the mold holder 35 is located between the clampers 55 and between the cutters 57 in the Z-axis direction. Further, the mold holder 35 is configured to move in the X-axis direction.
  • the to-be-molded body 3 is placed on and held by the to-be-molded body holder 31 .
  • the uncut mold 13 extends from the mold raw material roll 11 placed in the raw material roll placement portion 33 .
  • the leading edge of the uncut mold 13 is held by the mold holder 35 .
  • the guide rollers 45 are up.
  • the pressure roller 51 is up and located above the one end in the X-axis direction.
  • the ultraviolet light generator 53 is not emitting ultraviolet light.
  • the clampers 55 and the cutters 57 are open.
  • the mold holder 35 moves to a position located in the vicinity of the cutters 57 and located on the other end side of the cutters 57 in the X-axis direction under the control of the controller 41 (see FIG. 3 ).
  • the transfer pattern formation body 17 (not shown in FIGS. 1 to 11 ) of the uncut mold 13 is separated from the to-be-molded body 3 and located directly over the to-be-molded body 3 .
  • the pressure roller 51 is lowered to grip the to-be-molded body 3 and the uncut mold 13 in cooperation with the to-be-molded body holder 31 therebetween and press the to-be-molded body 3 and the uncut mold 13 . Further, the pressure roller 51 moves from the one end side to the other end side in the X-axis direction. At this time, the ultraviolet light generator 53 emits ultraviolet light to cure the molding material 23 . By the above-described series of operations, transferring is performed (see FIGS. 6 and 5 ).
  • the pressure roller 51 is raised (see FIG. 7 ), the to-be-molded body holder 31 stops holding the to-be-molded body 3 (releases the to-be-molded body 3 ).
  • the guide rollers 45 are raised, the to-be-molded body 3 is raised while adhering to the uncut mold 13 by a tension of the uncut mold 13 , and is separated from the to-be-molded body holder 31 (see FIG. 8 ).
  • the mold holder 35 moves until the to-be-molded body 3 is located on the other end side of the cutters 57 (see FIG. 9 ).
  • the temporarily holding unit 43 holds the uncut mold 13 , and the cutting unit 39 cuts the uncut mold 13 (see FIG. 10 ).
  • the mold holder 35 stops holding the mold 5 (molded body assembly 1 , see FIG. 12( c )) (releases the molded body assembly 1 ). After that, the molded body assembly 1 is taken out of the molded body assembly manufacturing apparatus 29 using an unillustrated robot or the like. The mold holder 35 holds a new edge portion of the uncut mold 13 in the vicinity of the temporarily holding unit 43 (see FIG. 11) .
  • the temporarily holding unit 43 stops holding the uncut mold 13 (releases the uncut mold 13 ). After that, the mold holder 35 moves from the other end side to the one end side in the X-axis direction, and the manufacturing apparatus 29 returns to the initial state shown in FIG. 2 .
  • the transferring of the transfer pattern 7 causes the mold 5 to adhere to the to-be-molded body 3 and protect the transferred pattern 9 formed in the to-be-molded body 3 .
  • the mold 5 adheres to the to-be-molded body 3 until the transferred pattern 9 is exposed to the outside. Accordingly, the possibility of damage to the transferred pattern 9 of the to-be-molded body 3 can be minimized without additionally providing a protective film.
  • the molded body assembly 1 is transported to a back-end process in a state in which the mold 5 adheres to the to-be-molded body 3 .
  • the molded body assembly 1 in this state is incorporated into a product as part of the product, transported, and sold. Since the to-be-molded body 3 is protected by the mold 5 adhering to the to-be-molded body 3 , there is little risk of damage to the transferred pattern 9 .
  • the mold 5 can be removed from the to-be-molded body 3 as needed.
  • transferring is performed using part of the uncut mold 13 extending from the mold raw material roll 11 , and two opposite end portions of the mold 5 extend from two opposite ends of the to-be-molded body 3 by predetermined lengths. Accordingly, transferring can be efficiently performed, and the mold 5 can be easily removed from the molded body.
  • the transfer pattern 7 of the mold 5 is not continuously provided in the embodiment, but may be continuously provided. Moreover, the mold is pressed by the pressure roller 51 in the embodiment, but the mold 5 may be pressed using a pressing device having a flat surface.
  • the present invention can provide a molded body assembly, an apparatus for manufacturing the molded body assembly, and a method of manufacturing and using the molded body assembly which allow for minimizing the possibility of damage to a fine transferred pattern formed in a to-be-molded body by transferring.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
US14/432,694 2012-10-01 2013-09-24 Molded body assembly, apparatus for manufacturing the molded body assembly, and method of manufacturing and using the molded body assembly Abandoned US20150231820A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012219044A JP6092561B2 (ja) 2012-10-01 2012-10-01 被成形体組立体、被成形体組立体の製造装置および被成形体組立体の製造方法
JP2012-219044 2012-10-01
PCT/JP2013/075697 WO2014054456A1 (ja) 2012-10-01 2013-09-24 被成形体組立体、被成形体組立体の製造装置および被成形体組立体の製造・使用方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2013/075697 A-371-Of-International WO2014054456A1 (ja) 2012-10-01 2013-09-24 被成形体組立体、被成形体組立体の製造装置および被成形体組立体の製造・使用方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US16/148,515 Division US10723063B2 (en) 2012-10-01 2018-10-01 Apparatus for manufacturing molded body assembly

Publications (1)

Publication Number Publication Date
US20150231820A1 true US20150231820A1 (en) 2015-08-20

Family

ID=50434785

Family Applications (2)

Application Number Title Priority Date Filing Date
US14/432,694 Abandoned US20150231820A1 (en) 2012-10-01 2013-09-24 Molded body assembly, apparatus for manufacturing the molded body assembly, and method of manufacturing and using the molded body assembly
US16/148,515 Active 2034-02-07 US10723063B2 (en) 2012-10-01 2018-10-01 Apparatus for manufacturing molded body assembly

Family Applications After (1)

Application Number Title Priority Date Filing Date
US16/148,515 Active 2034-02-07 US10723063B2 (en) 2012-10-01 2018-10-01 Apparatus for manufacturing molded body assembly

Country Status (6)

Country Link
US (2) US20150231820A1 (ko)
JP (1) JP6092561B2 (ko)
KR (1) KR101685316B1 (ko)
DE (1) DE112013004829B4 (ko)
TW (1) TWI608917B (ko)
WO (1) WO2014054456A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109709768A (zh) * 2017-10-25 2019-05-03 东芝机械株式会社 转印装置及转印方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6694101B1 (ja) * 2019-08-09 2020-05-13 Ａｉメカテック株式会社 微細構造転写装置及び微細構造転写方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070134362A1 (en) * 2005-12-09 2007-06-14 Bakak Heidari Apparatus for pattern replication with intermediate stamp
US20070205525A1 (en) * 2006-02-15 2007-09-06 Osram Opto Semiconductors Gmbh Method for producing structures in optoelectronic components and device for this purpose
US20080122144A1 (en) * 2006-11-28 2008-05-29 Wei Zhang Imprint lithography with improved substrate/mold separation
WO2011114855A1 (ja) * 2010-03-16 2011-09-22 東芝機械株式会社 シート状モールド移送位置決め装置
WO2012077738A1 (ja) * 2010-12-09 2012-06-14 旭化成株式会社 微細構造積層体、微細構造積層体の作製方法及び微細構造体の製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3321129B2 (ja) * 1999-11-17 2002-09-03 富士通株式会社 立体構造物転写方法及びその装置
JP4627178B2 (ja) * 2003-11-25 2011-02-09 大日本印刷株式会社 ラミネート装置
JP4778788B2 (ja) 2005-12-28 2011-09-21 東芝機械株式会社 微細パターンシート作成装置および微細パターンシート作成方法
EP1906236B1 (en) * 2006-08-01 2012-09-19 Samsung Electronics Co., Ltd. Imprinting apparatus and method for forming residual film on a substrate
DE102007016794B4 (de) 2007-04-05 2015-07-09 Hülsta-Werke Hüls Gmbh & Co. Kg Verfahren zur Herstellung eines flächigen Bauteils und Bogen aus einem Strukturpapier
JP5319326B2 (ja) 2009-02-25 2013-10-16 株式会社東芝 凹凸パターンの形成方法および凹凸パターン形成用シート
JP5469941B2 (ja) * 2009-07-13 2014-04-16 東芝機械株式会社 転写装置および転写方法
SG178580A1 (en) 2009-09-03 2012-03-29 Molecular Nanosystems Inc Methods and systems for making electrodes having at least one functional gradient therein and devices resulting therefrom
JPWO2011089836A1 (ja) * 2010-01-19 2013-05-23 株式会社日立産機システム パターン転写装置及びパターン転写方法
JP5603621B2 (ja) 2010-03-08 2014-10-08 東芝機械株式会社 シート状モールド位置検出装置、転写装置および転写方法
JP5586995B2 (ja) * 2010-03-11 2014-09-10 東芝機械株式会社 転写装置及び転写方法
KR101421910B1 (ko) * 2010-09-01 2014-07-22 도시바 기카이 가부시키가이샤 전사 시스템 및 전사 방법
TW201217153A (en) * 2010-10-25 2012-05-01 Win Optical Co Ltd having smaller imprint areas to make it easier for the control of pressure uniformity and provide a high transcription rate and reduce defect generation
TWM411347U (en) * 2011-01-28 2011-09-11 Fei Yi Co Ltd UV light-curable 3D image-to-text transcriber

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070134362A1 (en) * 2005-12-09 2007-06-14 Bakak Heidari Apparatus for pattern replication with intermediate stamp
US20070205525A1 (en) * 2006-02-15 2007-09-06 Osram Opto Semiconductors Gmbh Method for producing structures in optoelectronic components and device for this purpose
US20080122144A1 (en) * 2006-11-28 2008-05-29 Wei Zhang Imprint lithography with improved substrate/mold separation
WO2011114855A1 (ja) * 2010-03-16 2011-09-22 東芝機械株式会社 シート状モールド移送位置決め装置
US20130011507A1 (en) * 2010-03-16 2013-01-10 Toshiba Kakai Kabushiki Kaisha Sheet-shaped mold conveying/positioning device
WO2012077738A1 (ja) * 2010-12-09 2012-06-14 旭化成株式会社 微細構造積層体、微細構造積層体の作製方法及び微細構造体の製造方法
US20130319522A1 (en) * 2010-12-09 2013-12-05 Asahi Kasei Kabushiki Kaisha Fine-structure layered product, preparation method of the fine-structure layered product and manufacturing method of a fine-structure product

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109709768A (zh) * 2017-10-25 2019-05-03 东芝机械株式会社 转印装置及转印方法
KR20190046670A (ko) * 2017-10-25 2019-05-07 도시바 기카이 가부시키가이샤 전사 장치 및 전사 방법
KR102125621B1 (ko) 2017-10-25 2020-06-22 시바우라 기카이 가부시키가이샤 전사 장치 및 전사 방법
US11179876B2 (en) * 2017-10-25 2021-11-23 Shibaura Machine Co., Ltd. Transfer apparatus and transfer method

Also Published As

Publication number Publication date
TW201436974A (zh) 2014-10-01
JP6092561B2 (ja) 2017-03-08
JP2014069524A (ja) 2014-04-21
DE112013004829B4 (de) 2023-02-09
US10723063B2 (en) 2020-07-28
TWI608917B (zh) 2017-12-21
KR101685316B1 (ko) 2016-12-09
KR20150063473A (ko) 2015-06-09
US20190105830A1 (en) 2019-04-11
DE112013004829T5 (de) 2015-10-29
WO2014054456A1 (ja) 2014-04-10

Similar Documents

Publication Publication Date Title
JP5912996B2 (ja) 転写装置
KR102363106B1 (ko) 테이프 첩부 장치 및 테이프 첩부 방법
TWI436878B (zh) Mold stripping device
US11498261B2 (en) Double-sided imprinting
US10723063B2 (en) Apparatus for manufacturing molded body assembly
US9914261B2 (en) Transfer device, molded material and transfer method
JP5603621B2 (ja) シート状モールド位置検出装置、転写装置および転写方法
WO2011114855A1 (ja) シート状モールド移送位置決め装置
EP3037236B1 (en) Mounting and demolding device
KR20110050647A (ko) 마운트 장치 및 마운트 방법
JP5593092B2 (ja) 転写システムおよび転写方法
WO2011114854A1 (ja) 転写装置
JP2009126163A (ja) パターン形成装置およびパターン形成方法
US20160023399A1 (en) Method of forming aligned pattern in pattern formation region by using imprint process
JP5934578B2 (ja) 保護テープ貼着方法
TWI738049B (zh) 層膜裁切裝置、層膜裁切方法、晶圓貼膜機以及晶圓貼膜方法
CN116323475A (zh) 纳米压印压模
JP2018126929A (ja) 転写方法及び熱ナノインプリント装置
TW201446631A (zh) 捲繞製程薄膜

Legal Events

Date Code Title Description
AS Assignment

Owner name: TOSHIBA KIKAI KABUSHIKI KAISHA, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KOKUBO, MITSUNORI;SUGIURA, YUKI;SUZUKI, TORU;AND OTHERS;REEL/FRAME:035423/0151

Effective date: 20150320

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION