US20140211587A1 - Ultrasonic device, ultrasonic probe, electronic equipment, and ultrasonic imaging apparatus - Google Patents

Ultrasonic device, ultrasonic probe, electronic equipment, and ultrasonic imaging apparatus Download PDF

Info

Publication number
US20140211587A1
US20140211587A1 US14/164,631 US201414164631A US2014211587A1 US 20140211587 A1 US20140211587 A1 US 20140211587A1 US 201414164631 A US201414164631 A US 201414164631A US 2014211587 A1 US2014211587 A1 US 2014211587A1
Authority
US
United States
Prior art keywords
ultrasonic
ultrasonic device
array substrate
element array
acoustic lens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/164,631
Other languages
English (en)
Inventor
Kanechika Kiyose
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Assigned to SEIKO EPSON CORPORATION reassignment SEIKO EPSON CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIYOSE, KANECHIKA
Publication of US20140211587A1 publication Critical patent/US20140211587A1/en
Priority to US15/455,545 priority Critical patent/US10514449B2/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
    • G01S7/52017—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00 particularly adapted to short-range imaging
    • G01S7/52079—Constructional features
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • B06B1/0629—Square array
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
    • G01S15/02—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems using reflection of acoustic waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
    • G01S15/88—Sonar systems specially adapted for specific applications
    • G01S15/89—Sonar systems specially adapted for specific applications for mapping or imaging
    • G01S15/8906—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques
    • G01S15/8909—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques using a static transducer configuration
    • G01S15/8915—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques using a static transducer configuration using a transducer array
    • G01S15/8925—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques using a static transducer configuration using a transducer array the array being a two-dimensional transducer configuration, i.e. matrix or orthogonal linear arrays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
    • G01S7/52017—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00 particularly adapted to short-range imaging
    • G01S7/52053—Display arrangements
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/02—Mechanical acoustic impedances; Impedance matching, e.g. by horns; Acoustic resonators
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/18—Methods or devices for transmitting, conducting or directing sound
    • G10K11/26—Sound-focusing or directing, e.g. scanning
    • G10K11/30—Sound-focusing or directing, e.g. scanning using refraction, e.g. acoustic lenses
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
    • G01S7/52017—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00 particularly adapted to short-range imaging
    • G01S7/52079—Constructional features
    • G01S7/5208—Constructional features with integration of processing functions inside probe or scanhead

Definitions

  • the present invention relates to an ultrasonic device, an ultrasonic probe, electronic equipment, and an ultrasonic imaging apparatus.
  • ultrasonic elements that transmit and receive ultrasound have been known. Ultrasonic devices using such ultrasonic elements are used for various applications.
  • JP-A-2012-100994 which is an example of related art, discloses an ultrasonic device used, for example, for an ultrasonic probe provided with: ultrasonic transducers (ultrasonic elements) that transmit and receive ultrasound; an acoustic lens that focuses the ultrasound; and an acoustic matching layer provided between the acoustic lens and the ultrasonic transducers.
  • ultrasonic transducers ultrasonic elements
  • acoustic lens that focuses the ultrasound
  • acoustic matching layer provided between the acoustic lens and the ultrasonic transducers.
  • the acoustic matching layer is formed to have a specific thickness, in order to prevent the ultrasound from being reflected by an interface through which the ultrasound passes.
  • the thickness of the acoustic matching layer is required to be adjusted with high accuracy for efficient transmission and reception of ultrasound.
  • An ultrasonic device includes: an ultrasonic element array substrate having a plurality of ultrasonic elements that each include a piezoelectric body and perform at least one of transmission and reception of ultrasound; a fixing frame having a recess to which the ultrasonic element array substrate is fixed, and a perforated portion formed with a through hole by opening a part of the bottom face of the recess, wherein an element-formed surface of the ultrasonic element array substrate faces the perforated portion; an acoustic lens secured to the fixing frame so as to cover the perforated portion of the fixing frame, the acoustic lens having a lens portion that focuses the ultrasound; and an acoustic matching layer arranged between the ultrasonic element array substrate and the acoustic lens, the acoustic matching layer being formed of a resin that secures the ultrasonic element array substrate and the acoustic lens to each other.
  • the acoustic lens and the fixing frame are in contact with each other, and the thickness of the ultrasonic
  • the element-formed surface of the ultrasonic element array substrate is fixed to the fixing frame within the recess so as to be exposed through the perforated portion. Then, the acoustic lens comes into contact with the fixing frame so as to be secured thereto, while covering the perforated portion of the fixing frame.
  • the acoustic matching layer can be formed to have a thickness with good accuracy, it is possible to transmit and receive ultrasound efficiently.
  • the acoustic matching layer is preferably a resin filled between the ultrasonic element array substrate and the acoustic lens, so as to be secured to the ultrasonic element array substrate and the acoustic lens.
  • the acoustic matching layer is composed of a resin, and the ultrasonic element array substrate and the acoustic lens can be secured to each other with a resin (adhesive).
  • the cured resin allows the ultrasonic element array substrate and the acoustic lens to be bonded to each other, and can function also as an acoustic matching layer.
  • a first projection is formed in a part of the fixing frame, and the distance between the ultrasonic element array substrate and the acoustic lens is specified by contact of the first projection with the acoustic lens.
  • the first projection is formed in a part of the fixing frame that is contact with the acoustic lens.
  • the acoustic lens is received by the first projection, which enables the acoustic lens to be fixed to the fixing frame with good accuracy without disadvantages such as inclination on the fixed surface.
  • a second projection is formed in a part of the acoustic lens, and the distance between the ultrasonic element array substrate and the acoustic lens is specified by contact of the second projection with the fixing frame.
  • the second projection is formed in a part of the acoustic lens that is in contact with the fixing frame.
  • the fixing frame is received by the second projection, which enables the acoustic lens to be fixed to the fixing frame with good accuracy without disadvantages such as inclination on the fixed surface.
  • a back plate is fixed to a surface opposite to the element-formed surface of the ultrasonic element array substrate, and that a resin is filled in the recess of the fixing frame so as to cover the back plate.
  • the back plate is fixed to the surface opposite to the element-formed surface of the ultrasonic element array substrate, and the resin is filled in the recess of the fixing frame.
  • the ultrasonic element array substrate include: a base substrate provided with a plurality of openings arranged in an array; a vibrating membrane formed to cover the openings, the vibrating membrane being displaceable in a film thickness direction; and a piezoelectric body provided on the vibrating membrane.
  • the piezoelectric body includes a first electrode provided on the vibrating membrane; a piezoelectric layer provided to cover at least part of the first electrode; and a second electrode provided to cover at least part of the piezoelectric layer.
  • the ultrasonic element array substrate includes the base substrate provided with the plurality of openings arranged in an array; the vibrating membrane formed to cover the openings, the vibrating membrane being displaceable in the film thickness direction; and the piezoelectric body provided on the vibrating membrane, the piezoelectric body being formed by layering the first electrode, the piezoelectric layer, and the second electrode on the vibrating membrane.
  • the ultrasonic element array substrate can be downsized, leading to a reduction in size of the ultrasonic device.
  • An ultrasonic probe according to this application example includes: the ultrasonic device described in any one of the above application examples; and a housing supporting the ultrasonic device.
  • the ultrasonic device described above and the housing supporting the ultrasonic device are provided.
  • the ultrasonic probe of this application example includes the ultrasonic device that can set an appropriate thickness of the acoustic matching layer and performs efficient transmission and reception of ultrasound. Thus, it is possible to provide an ultrasonic probe with high accuracy.
  • Electronic equipment includes: the ultrasonic device described above; and a processing circuit that is connected to the ultrasonic device and processes an output of the ultrasonic device.
  • the ultrasonic device described above and the processing circuit that processes the output of the ultrasonic device are provided.
  • the electronic equipment of this application example includes the ultrasonic device that can set an appropriate thickness of the acoustic matching layer and performs efficient transmission and reception of ultrasound. Thus, it is possible to provide electronic equipment with high accuracy.
  • An ultrasonic imaging apparatus includes: the ultrasonic device described above; a processing circuit that is connected to the ultrasonic device and processes an output of the ultrasonic device so as to generate an image; and a display that displays the image.
  • the ultrasonic device described above the processing circuit that processes an output of the ultrasonic device so as to generate an image, and the display that displays the image are provided.
  • the ultrasonic imaging apparatus of this application example includes the ultrasonic device that can set an appropriate thickness of the acoustic matching layer and performs efficient transmission and reception of ultrasound. Thus, it is possible to provide an ultrasonic imaging apparatus with high accuracy.
  • FIG. 1 is a schematic outline showing a configuration of an ultrasonic imaging apparatus of a first embodiment.
  • FIG. 2 is a partial sectional view of an ultrasonic probe according to the first embodiment.
  • FIG. 3 is an enlarged sectional view of a head portion of the ultrasonic probe according to the first embodiment.
  • FIG. 4 is a control block diagram of an ultrasonic imaging apparatus according to the first embodiment.
  • FIG. 5 is a plan view of an ultrasonic device according to the first embodiment.
  • FIG. 6 is a sectional view of the ultrasonic device according to the first embodiment.
  • FIG. 7 is a sectional view of the ultrasonic device according to the first embodiment.
  • FIG. 8 is a plan view in which the acoustic lens and the acoustic matching layer are omitted from the components of the ultrasonic device according to the first embodiment.
  • FIGS. 9A to 9D are views showing a configuration of the fixing frame of an ultrasonic element according to the first embodiment.
  • FIGS. 10A to 10C are explanatory diagrams illustrating a configuration of an acoustic lens of the ultrasonic device according to the first embodiment.
  • FIG. 11 is a plan view showing a schematic configuration of an ultrasonic element according to the first embodiment.
  • FIG. 12 is a sectional view showing the schematic configuration of the ultrasonic element according to the first embodiment.
  • FIG. 13 is a conceptual diagram illustrating a schematic configuration of an ultrasonic element array substrate according to the first embodiment.
  • FIG. 14 is a sectional view showing a modification of the ultrasonic device according to the first embodiment.
  • FIG. 15 is a sectional view showing a modification of the ultrasonic device according to the first embodiment.
  • FIG. 16 is a sectional view showing the ultrasonic device according to a second embodiment.
  • FIG. 17 is a plan view showing the fixing frame according to the second embodiment.
  • FIG. 18 is a sectional view showing a configuration of an ultrasonic device according to a third embodiment.
  • FIG. 19 is a plan view of the acoustic lens according to the third embodiment.
  • FIG. 20 is a schematic outline showing a configuration of another ultrasonic imaging apparatus.
  • an ultrasonic imaging apparatus for inspecting the inside of the human body is described as an example of electronic equipment.
  • FIG. 1 shows a schematic outline of an ultrasonic imaging apparatus of this embodiment.
  • FIG. 2 is a partial sectional view of an ultrasonic probe.
  • FIG. 3 is an enlarged sectional view of a head portion of the ultrasonic probe.
  • an ultrasonic imaging apparatus 100 includes an apparatus body 110 and an ultrasonic probe 130 .
  • the apparatus body 110 and the ultrasonic probe 130 are connected to each other by a cable 120 .
  • the apparatus body 110 and the ultrasonic probe 130 can exchange electrical signals via the cable 120 .
  • the apparatus body 110 incorporates a display panel or the like as a display 112 .
  • the display 112 is a touch panel display, and serves also as a user-interface unit (UI unit).
  • UI unit user-interface unit
  • images are produced on the basis of ultrasound detected by the ultrasonic probe 130 , and the thus produced images of the detection results are displayed on the screen of the display 112 .
  • the ultrasonic probe 130 includes a housing 132 having a rectangular parallelepiped shape.
  • the cable 120 is connected to one end in the longitudinal direction of the housing 132 .
  • a head portion 134 that transmits and receives ultrasound is provided.
  • the ultrasonic imaging apparatus 100 of this embodiment is realized so that the apparatus body 110 and the ultrasonic probe 130 are connected by the cable 120 . However, it may be realized so that the apparatus body 110 and the ultrasonic probe 130 wirelessly exchange signals without using the cable 120 .
  • an ultrasonic device 1 fixed to a support member 30 is accommodated within the housing 132 .
  • the surface of the ultrasonic device 1 is exposed on the surface of the head portion 134 of the housing 132 , so that ultrasound can be output from the surface of the head portion 134 toward a target object, and reflected waves of the ultrasound (echo waves) can be received from the object.
  • the ultrasonic probe 130 has a gap between the ultrasonic device 1 and the head portion 134 of the housing 132 .
  • a sealing portion 136 filled with a silicone-based sealing material is provided in the gap. This sealing portion 136 prevents water, etc., from entering the ultrasonic device 1 in the housing 132 of the ultrasonic probe 130 .
  • the ultrasonic probe 130 has a sealing structure for forming a seal with the support member 30 of the ultrasonic device 1 , which will be mentioned later.
  • This sealing structure maintains pressure contact between an adhesive member 35 , such as double-sided adhesive tape, which has elasticity and is attached to the peripheral portion of the support member 30 of the ultrasonic device 1 , and an adhesive member 135 , such as double-sided adhesive tape, which has elasticity and is attached to the housing 132 .
  • a flexible printed circuit board (hereinafter, which may be referred to also as an FPC (Flexible Printed Circuit)) 60 for connection between the ultrasonic device 1 and a processing circuit is interposed in a part of this sealing structure.
  • FPC Flexible Printed Circuit
  • a double-sided adhesive tape formed of a closed cell material, such as polyethylene and urethane, coated with an acrylic adhesive is used as the adhesive members 35 and 135 .
  • the ultrasonic probe 130 of this embodiment employs a double sealing structure, thereby preventing water, etc., from entering the housing 132 .
  • FIG. 4 is a control block diagram of the ultrasonic imaging apparatus 100 .
  • the ultrasonic imaging apparatus 100 includes the apparatus body 110 and the ultrasonic probe 130 as mentioned above.
  • the ultrasonic probe 130 includes the ultrasonic device 1 and a processing circuit 150 .
  • the processing circuit 150 has a selection circuit 152 , a transmitting circuit 153 , a receiving circuit 154 , and a control unit 155 . This processing circuit 150 performs transmission processing and reception processing for the ultrasonic device 1 .
  • the transmitting circuit 153 outputs transmission signals VT to the ultrasonic device 1 via the selection circuit 152 in a transmission period. Specifically, the transmitting circuit 153 generates the transmission signals VT, on the basis of control by the control unit 155 , and outputs them to the selection circuit 152 . Then, the selection circuit 152 outputs the transmission signals VT from the transmitting circuit 153 , on the basis of control by the control unit 155 .
  • the frequency and amplitude voltage of the transmission signals VT can be set by the control unit 155 .
  • the receiving circuit 154 performs reception processing on reception signals VR from the ultrasonic device 1 . Specifically, the receiving circuit 154 receives the reception signals VR from the ultrasonic device 1 via the selection circuit 152 in a reception period, and performs reception processing such as amplification of the reception signals, gain setting, frequency setting, and A/D conversion (analog/digital conversion). The results of reception processing are output as detected data (detected information) to a processing unit 116 of the apparatus body 110 .
  • the receiving circuit 154 for example, can be composed of a low-noise amplifier, a voltage-controlled attenuator, a programmable gain amplifier, a low-pass filter, an A/D converter, and the like.
  • the control unit 155 controls the transmitting circuit 153 and the receiving circuit 154 . Specifically, the control unit 155 controls the transmitting circuit 153 for generation of the transmission signals VT and the output processing, and controls the receiving circuit 154 for frequency setting of the reception signals VR, gain, or the like.
  • the selection circuit 152 outputs the selected transmission signals VT on the basis of control by the control unit 155 .
  • the apparatus body 110 includes the display 112 , a main control unit 115 , the processing unit 116 , and a UI unit (user-interface unit) 117 .
  • the main control unit 115 controls the ultrasonic probe 130 for transmission and reception of ultrasound, and controls the processing unit 116 for image processing of detected data, or the like.
  • the processing unit 116 receives detected data from the receiving circuit 154 , and performs necessary image processing, generation of image data to be displayed, or the like.
  • the UI unit 117 outputs necessary instruction (command) to the main control unit 115 on the basis of user operation (e.g., touch panel operation).
  • the display 112 for example, is a liquid crystal display, and displays the image data to be displayed from the processing unit 116 .
  • part of control by the main control unit 115 may be performed by the control unit 155 of the processing circuit 150 , or part of control by the control unit 155 may be performed by the main control unit 115 .
  • FIG. 5 is a plan view showing the configuration of the ultrasonic device, which corresponds to a view, as viewed in the direction of the arrow H in FIG. 3 , of the ultrasonic probe.
  • FIG. 6 is a sectional view taken along the broken line A-A of FIG. 5 .
  • FIG. 7 is a sectional view taken along the broken line B-B of FIG. 5 .
  • FIG. 8 is a plan view in which the acoustic lens and the acoustic matching layer are omitted from the components shown in FIG. 5 .
  • the ultrasonic device 1 includes an ultrasonic element array substrate 20 , an acoustic matching layer 40 , an acoustic lens 50 , and a fixing frame 70 , and may further include the flexible printed circuit board (hereinafter, may be referred to also as a FPC) 60 that is connected to the ultrasonic element array substrate 20 so as to establish a connection with circuits.
  • a FPC flexible printed circuit board
  • the ultrasonic element array substrate 20 is a substrate on which a plurality of ultrasonic elements are arranged in an array, and has a rectangular shape in plan view.
  • This ultrasonic element array substrate 20 is formed using a silicon substrate with a thickness of about 150 ⁇ m to 200 ⁇ m.
  • a back plate 22 formed to have the same flat shape as the ultrasonic element array substrate 20 , is bonded to a surface opposite to the element-formed surface of the ultrasonic element array substrate 20 .
  • the back plate 22 serves to suppress excessive vibration of the ultrasonic element array substrate 20 , and a silicon substrate having a thickness of about 500 ⁇ m to 600 ⁇ m is used therefor.
  • a metal plate may be used other than such a silicon substrate.
  • the back plate 22 may be prepared by mixing a filler for acoustic matching and ultrasound attenuation with a resin material such as an epoxy resin. At this time, the back plate 22 preferably has a thickness of at least 5 mm.
  • the ultrasonic device 1 may be formed without using the back plate 22 .
  • the ultrasonic element array substrate 20 will be described later in detail.
  • the ultrasonic element array substrate 20 fixed to the back plate 22 is fixed to the fixing frame 70 via an adhesive member 65 as shown in FIG. 7 .
  • FIGS. 9A to 9D show a configuration of the fixing frame.
  • FIG. 9A is a top plan view
  • FIG. 9B is a sectional view taken along the line C-C of FIG. 9A
  • FIG. 9C is a sectional view taken along the line D-D of FIG. 9A
  • FIG. 9D is a bottom plan view.
  • the fixing frame 70 has a rectangular profile that is one size larger in plan view than that of the ultrasonic element array substrate 20 .
  • the fixing frame 70 has a recess 71 hollowed downward from its one surface, and the recess 71 is formed to have a size that allows a planar arrangement of the ultrasonic element array substrate 20 on a bottom face 74 .
  • the recess 71 is preferably formed to have a size, in plan view, slightly larger than the outer dimensions of the ultrasonic element array substrate 20 . In this way, the ultrasonic element array substrate 20 can be positioned within the recess 71 , which facilitates assembly work of the ultrasonic device 1 .
  • the fixing frame 70 has a perforated portion 72 formed with a through hole by opening a part of the bottom face 74 .
  • the perforated portion 72 is open with both ends, in the longitudinal direction of the fixing frame 70 , of the bottom face 74 left closed.
  • the thus left bottom face 74 serves as a fixing portion to which the ultrasonic element array substrate 20 is fixed by bonding.
  • the ultrasonic elements of the ultrasonic element array substrate 20 can be arranged so as to be exposed through the perforated portion 72 by fixation of the element-formed surface of the ultrasonic element array substrate 20 to the bottom face 74 .
  • an escape portion 73 hollowed downward from the top surface is formed on each of the two sides in the short direction of the top face of the fixing frame 70 .
  • the escape portion 73 is formed to facilitate mounting of the flexible printed circuit board (FPC) 60 to be connected to the ultrasonic element array substrate 20 , and is hollowed downward to a dimension equivalent to the thickness of the flexible printed circuit board 60 (for example, about 120 to 150 ⁇ m).
  • a metal such as stainless steel, an acrylic resin, or the like, can be used.
  • a plurality of terminals (not shown in the figure) connected to the plurality of ultrasonic elements are exposed, along opposite long sides in plan view. As shown in FIG. 6 and FIG. 8 , these terminals are connected to the terminals of the FPC 60 (not shown in the figure), thus establishing electrical connection.
  • an anisotropic conductive adhesive, an anisotropic conductive film, or the like is used for connection between the two. Electrical connection can be easily established between the terminals of the ultrasonic element array substrate 20 and the terminals of the FPC 60 by applying heat and pressure thereto.
  • the FPC 60 is used herein for connection of the terminals of the ultrasonic element array substrate 20 to an external circuit, which however is not restrictive. Other connection methods such as wire bonding may be employed therefor.
  • the acoustic lens 50 is arranged in contact with the fixing frame 70 so as to cover the perforated portion 72 on the side, formed with the perforated portion 72 , of the fixing frame 70 .
  • FIGS. 10A to 10C show a configuration of the acoustic lens.
  • FIG. 10A is a plan view
  • FIG. 10B is a sectional view taken along the line E-E of FIG. 10A
  • FIG. 10C is a sectional view taken along the line G-G of FIG. 10A .
  • the acoustic lens 50 has a rectangular shape in plan view, and includes a lens portion 51 at its center.
  • the lens portion 51 is provided on one surface of the acoustic lens 50 so as to be convex with a specific curvature in the thickness direction.
  • This lens portion 51 is provided so as to cover an area corresponding to a large number of ultrasonic elements of the ultrasonic element array substrate 20 to be described later. Further, the other surface of the acoustic lens 50 is formed to be flat.
  • This acoustic lens 50 serves to guide ultrasound transmitted from the ultrasonic elements of the ultrasonic element array substrate 20 efficiently to a target object, and to further guide echo waves reflected back from the object efficiently to the ultrasonic elements.
  • the acoustic lens 50 is formed of a resin such as a silicone resin. It is possible to adjust the acoustic impedance by changing the specific gravity of such a silicone resin through addition of silica, or the like, to the silicone resin.
  • the acoustic matching layer 40 is formed between the ultrasonic element array substrate 20 and the acoustic lens 50 .
  • a silicone-based adhesive is used for the acoustic matching layer 40 , and curing of the adhesive causes the ultrasonic element array substrate 20 and the acoustic lens 50 to be secured (bonded) to each other.
  • the thus cured adhesive (resin) functions as an acoustic matching layer.
  • the thickness of the acoustic matching layer 40 is set, for example, to 1 ⁇ 4 ⁇ where ⁇ denotes the wavelength of the ultrasound to be used.
  • the acoustic matching layer 40 serves to relax the acoustic impedance mismatch between the acoustic lens 50 and the ultrasonic elements.
  • the acoustic lens 50 may have a structure in which polyimide is thermally pressure bonded thereto on the side facing the ultrasonic elements for improving the moisture resistance.
  • the acoustic lens 50 may have a structure including a second acoustic matching layer provided on the side facing the ultrasonic elements.
  • the thickness T of the acoustic matching layer 40 in the ultrasonic device 1 of this embodiment can be appropriately set by the contact between the fixing frame 70 and the acoustic lens 50 , and thus the setting thereof is easy. Since the thickness of the acoustic matching layer 40 can be appropriately set, it is possible to transmit and receive ultrasound efficiently.
  • the ultrasonic device 1 of this embodiment has the ultrasonic element array substrate 20 fixed to the fixing frame 70 . Therefore, even when a significant impact such as dropping is applied to the ultrasonic device 1 , the ultrasonic element array substrate 20 is prevented from being damaged, in which manner the impact resistance of the ultrasonic device 1 can be improved.
  • the acoustic matching layer 40 formed of a resin is arranged between the ultrasonic element array substrate 20 and the acoustic lens 50 , so as to absorb impact forces from the acoustic lens 50 . Thus, the impact resistance can be further improved.
  • the acoustic matching layer 40 may be composed of multiple layers.
  • the recess 71 of the fixing frame 70 is filled with a resin 24 covering the back plate 22 secured to the ultrasonic element array substrate 20 .
  • This resin 24 serve to protect and fix the ultrasonic element array substrate 20 and the back plate 22 to the recess 71 , and also to attenuate the vibration coming through the ultrasonic element array substrate 20 when used together with the back plate 22 .
  • Any resin can be used as the resin 24 , as long as the acoustic impedance matching with the back plate 22 is ensured.
  • the material for the resin 24 is not particularly limited.
  • the resin 24 need not be used.
  • the ultrasonic elements and the ultrasonic element array substrate of this embodiment are described by taking an ultrasonic element configured with a thin film piezoelectric element as an example.
  • FIG. 11 is a schematic plan view of the ultrasonic elements of this embodiment.
  • FIG. 12 is a schematic sectional view showing a cross section taken along the broken line H-H of FIG. 11 .
  • FIG. 13 is an explanatory diagram illustrating a schematic configuration of the ultrasonic element array substrate of this embodiment.
  • each ultrasonic element 10 has a base substrate 11 , a vibrating membrane (membrane) 13 formed on the base substrate 11 , and a piezoelectric body 18 provided on the vibrating membrane 13 .
  • the piezoelectric body 18 has a first electrode 14 , a piezoelectric layer 15 , and a second electrode 16 .
  • the ultrasonic element 10 has an opening 12 in the base substrate 11 such as silicon, and includes the vibrating membrane 13 that covers and closes the opening 12 .
  • the opening 12 is formed by subjecting the back side (surface on which the elements are not to be formed) of the base substrate 11 to etching such as reactive ion etching (RIE).
  • etching such as reactive ion etching (RIE).
  • the vibrating membrane 13 has a double layer structure, for example, of a SiO 2 layer and a ZrO 2 layer.
  • the SiO 2 layer can be formed by subjecting the surface of the substrate to thermal oxidation treatment.
  • the ZrO 2 layer can be formed on the SiO 2 layer by a technique such as sputtering.
  • PZT for example, is used as the piezoelectric layer 15 , which will be described later
  • the ZrO 2 layer serves to prevent Pb that constitutes the PZT from diffusing into the SiO 2 layer. Further, the ZrO 2 layer also has an effect of improving the warpage efficiency corresponding to distortion of the piezoelectric layer.
  • the first electrode 14 is formed on the vibrating membrane 13 .
  • the piezoelectric layer 15 is formed on the first electrode 14 .
  • the second electrode 16 is further formed on the piezoelectric layer 15 .
  • the piezoelectric body 18 has a structure in which the piezoelectric layer 15 is interposed between the first electrode 14 and the second electrode 16 .
  • the first electrode 14 is formed of a metal thin film. In the case where a plurality of ultrasonic elements are provided, the first electrode 14 may be wired so as to be extended to the outside of the element-formed region and connected to an adjacent ultrasonic element, as shown in FIG. 11 .
  • the piezoelectric layer 15 for example, is formed of a PZT (lead zirconate titanate) thin film, and is provided to cover at least part of the first electrode 14 .
  • PZT lead zirconate titanate
  • the material for the piezoelectric layer 15 is not limited to PZT.
  • lead titanate (PbTiO 3 ), lead zirconate (PbZrO 3 ), lead lanthanum titanate ((Pb, La)TiO 3 ), or the like, may be used therefor.
  • the second electrode 16 is formed of a metal thin film, and is provided to cover at least part of the piezoelectric layer 15 .
  • the second electrode 16 may be wired so as to be extended to the outside of the element-formed region and connected to an adjacent ultrasonic element, as shown in FIG. 11 .
  • a moisture-proof layer 19 that covers the ultrasonic element 10 so as to prevent moisture permeation from the outside is provided.
  • This moisture-proof layer 19 is formed of a material such as alumina, and is provided over the entire surface or a part of the ultrasonic element 10 . It should be noted that the moisture-proof layer 19 may be appropriately provided depending on use conditions or environment, and a structure without including the moisture-proof layer 19 is also possible.
  • the piezoelectric layer 15 expands and contracts in the in-plane direction by application of a voltage to the piezoelectric layer 15 , that is, between the first electrode 14 and the second electrode 16 . Accordingly, upon the application of a voltage to the piezoelectric layer 15 , warpage that is convex on the opening 12 side occurs, which causes the vibrating membrane 13 to warp. Upon application of an AC voltage to the piezoelectric layer 15 , the vibrating membrane 13 vibrates in the film thickness direction, and this vibration of the vibrating membrane 13 causes ultrasound to be emitted from the opening 12 .
  • the voltage (drive voltage) applied to the piezoelectric layer 15 for example, is 10 to 30 V peak to peak, and the frequency thereof is 1 to 10 MHz, for example.
  • the ultrasonic element 10 acts also as a receiving element to receive echo waves that are generated by reflection of the emitted ultrasound on the target object and returns back thereto.
  • the echo waves vibrate the vibrating membrane 13 , during which vibration causes a stress to be applied to the piezoelectric layer 15 , resulting in generation of a voltage between the first electrode 14 and the second electrode 16 .
  • This voltage can be output as a reception signal.
  • an ultrasonic element array substrate including the aforementioned ultrasonic elements 10 arranged in an array is described below.
  • FIG. 13 shows a configuration of the ultrasonic element array substrate of this embodiment.
  • the ultrasonic element array substrate 20 includes a plurality of ultrasonic elements 10 arranged in an array, drive electrode lines DL, and common electrode lines CL.
  • the plurality of ultrasonic elements 10 are arranged into a matrix with m rows and n columns. In this embodiment, eight rows along a first direction D 1 and twelve columns along a second direction D 2 intersecting the first direction D 1 are arranged.
  • the drive electrode lines DL 1 to DL 12 are each formed along the first direction D 1 .
  • the transmission signals VT 1 to VT 12 output by the aforementioned processing circuit 150 are supplied to the respective ultrasonic elements 10 via the drive electrode lines DL 1 to DL 12 .
  • the reception signals VR 1 to VR 12 from the ultrasonic elements 10 are output to the processing circuit 150 via the drive electrode lines DL 1 to DL 12 .
  • Common electrode lines CL 1 to CL 8 are each formed along the second direction D 2 .
  • the common electrode lines CL 1 to CL 8 are supplied with a common voltage VCOM.
  • This common voltage only needs to be a constant direct current voltage, and is not necessarily 0 V, namely, a ground potential.
  • the arrangement of the ultrasonic elements 10 is not limited to the matrix arrangement with m rows and n columns shown in FIG. 13 .
  • a voltage that is the difference between the transmission signal voltage and the common voltage is applied to each of the ultrasonic elements 10 , and ultrasound is emitted at a specific frequency.
  • the ultrasonic imaging apparatus 100 and the ultrasonic probe 130 of this embodiment include the ultrasonic device 1 that can set an appropriate thickness of the acoustic matching layer and efficient transmission and reception of ultrasound, which allows the ultrasonic imaging apparatus 100 and the ultrasonic probe 130 with high accuracy to be provided.
  • FIG. 14 and FIG. 15 are each a sectional view showing a configuration of a modification of the ultrasonic device.
  • the same components as in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.
  • An ultrasonic device 2 shown in FIG. 14 has a moisture-proof layer 66 between the acoustic matching layer 40 and the acoustic lens 50 .
  • the moisture-proof layer 66 can prevent moisture permeating from the outside from reaching the ultrasonic element array substrate 20 , so as to enhance the reliability of the ultrasonic device 2 .
  • a film material such as polyphenylene sulfide (PPS) is used.
  • PPS polyphenylene sulfide
  • the material for the moisture-proof layer 66 is not limited to this.
  • An ultrasonic device 3 shown in FIG. 15 is provided with a step 75 in a portion, facing the acoustic lens 50 , of the fixing frame 70 .
  • the step 75 is formed by hollowing out a part of the contact portion between the fixing frame and the acoustic lens shown in FIG. 7 of the first embodiment.
  • the adhesive before curing may possibly overflow. Then, this step 75 can absorb the overflow of the adhesive. Further, in the case where air bubbles are contained in the adhesive, the step 75 provides an escape for the air bubbles, thereby separating the air bubbles from the effective portion of the acoustic matching layer 40 .
  • FIG. 16 is a sectional view showing a configuration of the ultrasonic device of this embodiment.
  • FIG. 17 is a plan view showing a configuration of a fixing frame, as viewed from the back surface (surface in contact with the ultrasonic element array substrate).
  • This embodiment has the same configuration as the first embodiment, except that the fixing frame has a different structure from the first embodiment. Therefore, the same components as in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.
  • An ultrasonic device 4 shown in FIG. 16 is provided with a plurality of first projections 76 in portions, which come into contact with the acoustic lens 50 , of the fixing frame 70 a .
  • the first projections 76 are provided on each of both sides in the longitudinal direction of the fixing frame 70 a , as shown in FIG. 17 .
  • the first projections 76 are formed at positions slightly lower than the top surface of the fixing frame 70 a , and a step 77 is further formed by hollowing out the periphery of the first projections 76 downward from the first projections 76 .
  • the step 77 is provided to have a shape such that the acoustic lens 50 is fitted thereinto so as to be positioned.
  • the acoustic lens 50 comes into contact with the first projections 76 of the fixing frame 70 a , so that the acoustic lens 50 is fixed to the fixing frame 70 a.
  • the thickness T of the acoustic matching layer 40 in the ultrasonic device 4 of this embodiment can be appropriately set by the contact between the fixing frame 70 a and the acoustic lens 50 , and thus the setting thereof is easy. Since the thickness of the acoustic matching layer 40 can be appropriately set, it is possible to transmit and receive ultrasound efficiently.
  • the acoustic lens 50 is received by the first projections 76 , which enables the acoustic lens 50 to be fixed to the fixing frame 70 a with good accuracy without inclination on the fixed surface.
  • the step 77 is formed in the periphery of the first projections 76 of the fixing frame 70 a .
  • the step 77 can absorb the overflow of the adhesive.
  • the step 77 provides an escape for the air bubbles, thereby separating the air bubbles from the effective portion of the acoustic matching layer 40 .
  • FIG. 18 is a sectional view showing a configuration of the ultrasonic device of this embodiment.
  • FIG. 19 is a plan view showing a configuration of an acoustic lens.
  • This embodiment has the same configuration as the first embodiment, except that the acoustic lens and the fixing frame each have a different structure from the first embodiment. Therefore, the same components as in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.
  • An ultrasonic device 5 shown in FIG. 18 is provided with a plurality of second projections 52 in portions of the acoustic lens 50 a that come into contact with the fixing frame 70 b .
  • the second projections 52 are provided on each of both sides in the longitudinal direction of the acoustic lens 50 a , as shown in FIG. 19 .
  • the portions of the fixing frame 70 b that come into contact with the second projections 52 are formed at positions slightly lower than the top surface of the fixing frame 70 b .
  • the fixing frame 70 b is formed to have the top surface hollowed downward so that the acoustic lens 50 a is fitted into the fixing frame 70 b so as to be positioned.
  • the second projections 52 of the acoustic lens 50 a come into contact with the fixing frame 70 b , so that the acoustic lens 50 a is fixed to the fixing frame 70 b.
  • the thickness T of the acoustic matching layer 40 in the ultrasonic device 5 of this embodiment can be appropriately set by the contact between the fixing frame 70 b and the acoustic lens 50 a , and thus the setting thereof is easy. Since the thickness of the acoustic matching layer 40 can be appropriately set, it is possible to transmit and receive ultrasound efficiently.
  • the fixing frame 70 b is received by the second projections 52 , which enables the acoustic lens 50 a to be fixed to the fixing frame 70 b with good accuracy without disadvantages such as inclination on the fixed surface.
  • FIG. 20 shows a specific configuration example of an ultrasonic imaging apparatus of another embodiment.
  • An ultrasonic imaging apparatus 101 is a stationary ultrasonic imaging apparatus, and includes the ultrasonic probe 130 .
  • the ultrasonic imaging apparatus 101 has an apparatus body (electronic equipment body) 111 , a display 113 that displays image data to be displayed, a user-interface unit (UI unit) 117 , the ultrasonic probe 130 , and the cable 120 .
  • apparatus body electronic equipment body
  • display 113 that displays image data to be displayed
  • UI unit user-interface unit
  • Effects of the invention can be exerted by employing such a stationary ultrasonic imaging apparatus.
  • the ultrasonic imaging apparatus of this embodiment can be used for in-vivo measurements of fat thickness, muscle thickness, bloodstream, bone density, etc.
US14/164,631 2013-01-28 2014-01-27 Ultrasonic device, ultrasonic probe, electronic equipment, and ultrasonic imaging apparatus Abandoned US20140211587A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US15/455,545 US10514449B2 (en) 2013-01-28 2017-03-10 Ultrasonic device, ultrasonic probe, electronic equipment, and ultrasonic imaging apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013012950A JP6175780B2 (ja) 2013-01-28 2013-01-28 超音波デバイス、超音波プローブ、電子機器および超音波画像装置
JP2013-012950 2013-01-28

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US15/455,545 Continuation US10514449B2 (en) 2013-01-28 2017-03-10 Ultrasonic device, ultrasonic probe, electronic equipment, and ultrasonic imaging apparatus

Publications (1)

Publication Number Publication Date
US20140211587A1 true US20140211587A1 (en) 2014-07-31

Family

ID=51222821

Family Applications (2)

Application Number Title Priority Date Filing Date
US14/164,631 Abandoned US20140211587A1 (en) 2013-01-28 2014-01-27 Ultrasonic device, ultrasonic probe, electronic equipment, and ultrasonic imaging apparatus
US15/455,545 Active 2035-03-17 US10514449B2 (en) 2013-01-28 2017-03-10 Ultrasonic device, ultrasonic probe, electronic equipment, and ultrasonic imaging apparatus

Family Applications After (1)

Application Number Title Priority Date Filing Date
US15/455,545 Active 2035-03-17 US10514449B2 (en) 2013-01-28 2017-03-10 Ultrasonic device, ultrasonic probe, electronic equipment, and ultrasonic imaging apparatus

Country Status (3)

Country Link
US (2) US20140211587A1 (ja)
JP (1) JP6175780B2 (ja)
CN (1) CN103961136A (ja)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140208853A1 (en) * 2013-01-28 2014-07-31 Seiko Epson Corporation Ultrasonic device, ultrasonic probe, electronic equipment, and ultrasonic imaging apparatus
US20170184715A1 (en) * 2013-01-28 2017-06-29 Seiko Epson Corporation Ultrasonic device, ultrasonic probe, electronic equipment, and ultrasonic imaging apparatus
US20170227502A1 (en) * 2016-02-04 2017-08-10 Seiko Epson Corporation Ultrasonic transducer, ultrasonic probe, ultrasonic apparatus, ultrasonic transducer manufacturing method, and vibration device
CN109394266A (zh) * 2018-11-14 2019-03-01 深圳市太空科技南方研究院 一种辅助支具以及超声波检测装置
EP3510935A1 (en) * 2018-01-15 2019-07-17 Samsung Medison Co., Ltd. Ultrasonic probe
EP3420912A4 (en) * 2016-02-22 2019-08-28 Samsung Medison Co., Ltd. ULTRASONIC PROBE
US20190307422A1 (en) * 2018-02-15 2019-10-10 Canon Medical Systems Corporation Ultrasonic probe and probe head for ultrasonic probe
US10653390B2 (en) 2014-01-06 2020-05-19 Seiko Epson Corporation Ultrasonic device, ultrasonic probe, electronic apparatus, and method for manufacturing ultrasonic device
CN111656799A (zh) * 2018-01-16 2020-09-11 奥林巴斯株式会社 超声波探头

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6402983B2 (ja) * 2014-08-29 2018-10-10 セイコーエプソン株式会社 超音波デバイス、超音波デバイスの製造方法、超音波プローブ、超音波測定装置、電子機器
JP6536792B2 (ja) * 2015-03-25 2019-07-03 セイコーエプソン株式会社 超音波センサー及びその製造方法
JP2017046811A (ja) * 2015-08-31 2017-03-09 セイコーエプソン株式会社 超音波デバイス、超音波モジュール、及び超音波測定機
JP6500713B2 (ja) * 2015-09-07 2019-04-17 Tdk株式会社 加速度センサ
JP6448055B2 (ja) * 2015-11-09 2019-01-09 富士フイルム株式会社 超音波内視鏡及び超音波内視鏡の製造方法
JP2017163331A (ja) * 2016-03-09 2017-09-14 セイコーエプソン株式会社 超音波デバイス、超音波モジュール、及び超音波測定装置
CN105842703A (zh) * 2016-05-05 2016-08-10 珠海上富电技股份有限公司 一种超声波传感头
EP3273210B1 (de) * 2016-07-18 2022-05-18 VEGA Grieshaber KG Vibrationsgrenzstandsschalter und verfahren zur herstellung eines vibrationsgrenzstandsschalter
JP6939219B2 (ja) * 2017-08-03 2021-09-22 セイコーエプソン株式会社 超音波装置
CN109492491B (zh) * 2017-09-12 2023-09-08 江西欧迈斯微电子有限公司 超声波指纹识别模组及电子设备制造方法
CN110743768B (zh) * 2019-09-27 2021-07-02 苏州佳世达电通有限公司 超音波探头

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5577507A (en) * 1994-11-21 1996-11-26 General Electric Company Compound lens for ultrasound transducer probe
US20020156373A1 (en) * 2000-11-29 2002-10-24 Olympus Optical Co., Ltd. Ultrasound transducer array
US20070239017A1 (en) * 2004-04-08 2007-10-11 Koninklijke Philips Electronics, N.V. Ultrasound Probes with Improved Electrical Isolation
US7622849B2 (en) * 2006-03-06 2009-11-24 Denso Corporation Ultrasonic sensor having vibrator mounted on substrate
US20110074246A1 (en) * 2009-09-30 2011-03-31 Murata Manufacturing Co., Ltd. Ultrasonic transducer
US20110115337A1 (en) * 2009-11-16 2011-05-19 Seiko Epson Corporation Ultrasonic transducer, ultrasonic sensor, method of manufacturing ultrasonic transducer, and method of manufacturing ultrasonic sensor
US8169855B2 (en) * 2009-02-06 2012-05-01 Seiko Epson Corporation Ultrasonic sensor unit and electronic device
US9079220B2 (en) * 2012-03-30 2015-07-14 Seiko Epson Corporation Ultrasonic transducer element chip, probe, electronic instrument, and ultrasonic diagnostic device
US9089872B2 (en) * 2012-03-30 2015-07-28 Seiko Epson Corporation Ultrasonic transducer element chip, probe, electronic instrument, and ultrasonic diagnostic device
US9099635B2 (en) * 2012-02-24 2015-08-04 Seiko Epson Corporation Ultrasonic transducer element chip, probe, electronic instrument, and ultrasonic diagnostic device

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5989258U (ja) * 1982-12-07 1984-06-16 株式会社日立メデイコ 電子走査形超音波検査装置の探触子
JPH01293851A (ja) 1988-05-23 1989-11-27 Yokogawa Medical Syst Ltd 超音波探触子
JPH02141421U (ja) * 1989-04-28 1990-11-28
JP3201079B2 (ja) 1992-07-03 2001-08-20 ケイディーディーアイ株式会社 インターレース動画像信号の動き補償予測方法、符号化方法及び装置
JPH0678398A (ja) * 1992-08-27 1994-03-18 Toshiba Ceramics Co Ltd 超音波トランスデューサ
JPH0739548A (ja) * 1993-08-02 1995-02-10 Hitachi Medical Corp 超音波探触子
JP3488102B2 (ja) * 1998-11-06 2004-01-19 オリンパス株式会社 超音波探触子
US6515402B2 (en) 2001-01-24 2003-02-04 Koninklijke Philips Electronics N.V. Array of ultrasound transducers
JP2005027752A (ja) * 2003-07-08 2005-02-03 Toshiba Corp 圧電振動子、圧電振動子の製造方法、超音波探触子および超音波診断装置
JP4256309B2 (ja) * 2003-09-29 2009-04-22 株式会社東芝 超音波プローブおよび超音波診断装置
US7224104B2 (en) * 2003-12-09 2007-05-29 Kabushiki Kaisha Toshiba Ultrasonic probe and ultrasonic diagnostic apparatus
DE602005025257D1 (de) * 2005-01-18 2011-01-20 Esaote Spa Ultraschallsonde, insbesondere zur diagnostischen Bilderzeugung
RU2419388C2 (ru) * 2006-01-31 2011-05-27 Панасоник Корпорэйшн Ультразвуковой зонд
CN101536547B (zh) * 2006-11-08 2013-05-22 株式会社日立医药 超声波探头及使用了其的超声波诊断装置
JP2009177302A (ja) * 2008-01-22 2009-08-06 Konica Minolta Medical & Graphic Inc 超音波探触子およびそれを用いる超音波診断装置
JP2012100994A (ja) 2010-11-12 2012-05-31 Panasonic Corp 超音波プローブ
KR20130128428A (ko) * 2010-12-03 2013-11-26 리써치 트라이앵글 인스티튜트 초음파 장치의 형성 방법 및 관련 장치
JP6212870B2 (ja) 2013-01-28 2017-10-18 セイコーエプソン株式会社 超音波デバイス、超音波プローブ、電子機器および超音波画像装置
JP6175780B2 (ja) * 2013-01-28 2017-08-09 セイコーエプソン株式会社 超音波デバイス、超音波プローブ、電子機器および超音波画像装置

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5577507A (en) * 1994-11-21 1996-11-26 General Electric Company Compound lens for ultrasound transducer probe
US20020156373A1 (en) * 2000-11-29 2002-10-24 Olympus Optical Co., Ltd. Ultrasound transducer array
US20070239017A1 (en) * 2004-04-08 2007-10-11 Koninklijke Philips Electronics, N.V. Ultrasound Probes with Improved Electrical Isolation
US7622849B2 (en) * 2006-03-06 2009-11-24 Denso Corporation Ultrasonic sensor having vibrator mounted on substrate
US8169855B2 (en) * 2009-02-06 2012-05-01 Seiko Epson Corporation Ultrasonic sensor unit and electronic device
US20120188850A1 (en) * 2009-02-06 2012-07-26 Seiko Epson Corporation Ultrasonic sensor unit and electronic device
US20110074246A1 (en) * 2009-09-30 2011-03-31 Murata Manufacturing Co., Ltd. Ultrasonic transducer
US20110115337A1 (en) * 2009-11-16 2011-05-19 Seiko Epson Corporation Ultrasonic transducer, ultrasonic sensor, method of manufacturing ultrasonic transducer, and method of manufacturing ultrasonic sensor
US9099635B2 (en) * 2012-02-24 2015-08-04 Seiko Epson Corporation Ultrasonic transducer element chip, probe, electronic instrument, and ultrasonic diagnostic device
US9079220B2 (en) * 2012-03-30 2015-07-14 Seiko Epson Corporation Ultrasonic transducer element chip, probe, electronic instrument, and ultrasonic diagnostic device
US9089872B2 (en) * 2012-03-30 2015-07-28 Seiko Epson Corporation Ultrasonic transducer element chip, probe, electronic instrument, and ultrasonic diagnostic device

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140208853A1 (en) * 2013-01-28 2014-07-31 Seiko Epson Corporation Ultrasonic device, ultrasonic probe, electronic equipment, and ultrasonic imaging apparatus
US9409207B2 (en) * 2013-01-28 2016-08-09 Seiko Epson Corporation Ultrasonic device, ultrasonic probe, electronic equipment, and ultrasonic imaging apparatus
US20170184715A1 (en) * 2013-01-28 2017-06-29 Seiko Epson Corporation Ultrasonic device, ultrasonic probe, electronic equipment, and ultrasonic imaging apparatus
US10086404B2 (en) 2013-01-28 2018-10-02 Seiko Epson Corporation Ultrasonic device, ultrasonic probe, electronic equipment, and ultrasonic imaging apparatus
US10514449B2 (en) * 2013-01-28 2019-12-24 Seiko Epson Corporation Ultrasonic device, ultrasonic probe, electronic equipment, and ultrasonic imaging apparatus
US10653390B2 (en) 2014-01-06 2020-05-19 Seiko Epson Corporation Ultrasonic device, ultrasonic probe, electronic apparatus, and method for manufacturing ultrasonic device
US20170227502A1 (en) * 2016-02-04 2017-08-10 Seiko Epson Corporation Ultrasonic transducer, ultrasonic probe, ultrasonic apparatus, ultrasonic transducer manufacturing method, and vibration device
US10317371B2 (en) * 2016-02-04 2019-06-11 Seiko Epson Corporation Ultrasonic transducer, ultrasonic probe, ultrasonic apparatus, ultrasonic transducer manufacturing method, and vibration device
EP3420912A4 (en) * 2016-02-22 2019-08-28 Samsung Medison Co., Ltd. ULTRASONIC PROBE
US11406358B2 (en) 2016-02-22 2022-08-09 Samsung Medison Co., Ltd. Ultrasonic probe
EP3510935A1 (en) * 2018-01-15 2019-07-17 Samsung Medison Co., Ltd. Ultrasonic probe
US11607193B2 (en) 2018-01-15 2023-03-21 Samsung Medison Co., Ltd. Ultrasonic probe
CN111656799A (zh) * 2018-01-16 2020-09-11 奥林巴斯株式会社 超声波探头
US20190307422A1 (en) * 2018-02-15 2019-10-10 Canon Medical Systems Corporation Ultrasonic probe and probe head for ultrasonic probe
US11707257B2 (en) * 2018-02-15 2023-07-25 Canon Medical Systems Corporation Ultrasonic probe and probe head for ultrasonic probe
CN109394266A (zh) * 2018-11-14 2019-03-01 深圳市太空科技南方研究院 一种辅助支具以及超声波检测装置

Also Published As

Publication number Publication date
US10514449B2 (en) 2019-12-24
CN103961136A (zh) 2014-08-06
JP6175780B2 (ja) 2017-08-09
JP2014146885A (ja) 2014-08-14
US20170184715A1 (en) 2017-06-29

Similar Documents

Publication Publication Date Title
US10514449B2 (en) Ultrasonic device, ultrasonic probe, electronic equipment, and ultrasonic imaging apparatus
US10086404B2 (en) Ultrasonic device, ultrasonic probe, electronic equipment, and ultrasonic imaging apparatus
US20150119717A1 (en) Ultrasonic device, ultrasonic probe head, ultrasonic probe, electronic apparatus, and ultrasonic imaging apparatus
US10085720B2 (en) Ultrasonic device, method for producing ultrasonic device, ultrasonic probe, ultrasonic measurement apparatus, and electronic device
JP6135088B2 (ja) 超音波トランスデューサーデバイス、プローブヘッド、超音波プローブ、電子機器及び超音波診断装置
US9513263B2 (en) Ultrasonic measurement apparatus, ultrasonic head unit, ultrasonic probe, and ultrasonic imaging apparatus
US9788814B2 (en) Ultrasonic measurement apparatus, ultrasonic head unit, ultrasonic probe, and ultrasonic imaging apparatus
US10722214B2 (en) Ultrasonic device, ultrasonic probe, and ultrasonic apparatus
JP2014083282A (ja) 超音波測定装置、ヘッドユニット、プローブ及び診断装置
JP6175779B2 (ja) 超音波デバイス、超音波プローブ、電子機器および超音波画像装置
JP6248535B2 (ja) 超音波デバイス、超音波プローブヘッド、超音波プローブ、電子機器、超音波画像装置および超音波デバイスの製造方法
US20160031128A1 (en) Method for manufacturing acoustic coupling member
US10429497B2 (en) Ultrasonic device, ultrasonic probe, electronic apparatus, and ultrasonic imaging apparatus
CN107027086B (zh) 超声波器件、超声波探头、电子设备及超声波图像装置
JP2016101317A (ja) 音響プローブ
WO2022210887A1 (ja) 超音波プローブヘッド、超音波プローブ、及び超音波診断装置
JP6451216B2 (ja) 超音波プローブ、電子機器および超音波画像装置
JP2024019809A (ja) 超音波プローブ
JP2022079132A (ja) 圧電アクチュエーター、超音波素子、超音波探触子、超音波装置、及び電子デバイス
JP2017176770A (ja) 音響波プローブ、及び情報取得装置

Legal Events

Date Code Title Description
AS Assignment

Owner name: SEIKO EPSON CORPORATION, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:KIYOSE, KANECHIKA;REEL/FRAME:032051/0087

Effective date: 20140114

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION