US20140158324A1 - Cooling apparatus - Google Patents
Cooling apparatus Download PDFInfo
- Publication number
- US20140158324A1 US20140158324A1 US14/086,120 US201314086120A US2014158324A1 US 20140158324 A1 US20140158324 A1 US 20140158324A1 US 201314086120 A US201314086120 A US 201314086120A US 2014158324 A1 US2014158324 A1 US 2014158324A1
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- United States
- Prior art keywords
- liquid coolant
- header
- cooling apparatus
- heatsink
- upper portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20281—Thermal management, e.g. liquid flow control
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
Definitions
- the present invention relates to a cooling apparatus that cools a heat-generating element such as a central processing unit (CPU), a large-scale integrated circuit (LSI), a power semiconductor, etc.
- a heat-generating element such as a central processing unit (CPU), a large-scale integrated circuit (LSI), a power semiconductor, etc.
- one switching semiconductor element and one diode are disposed in series along the direction of circulation of the liquid coolant in the cooling flow channels on a front surface and a rear surface of the cooling substrate.
- the switching semiconductor elements or the diodes can be cooled efficiently, and cooling capacity can be increased, because the switching semiconductor elements or the diodes, which generate heat, are constantly cooled by liquid coolant from near the liquid coolant supplying flow channel that is in a sufficiently cooled state that has not risen in temperature.
- the present invention is aimed at solving such problems and an object of the present invention is to provide a cooling apparatus in which irregularities in cooling performance among respective heat-generating elements can be suppressed even if the number of heat-generating elements that are mounted is increased.
- a cooling apparatus characterized in including: a frame-shaped main body portion that has upper and lower openings; an upper portion heatsink and a lower portion heatsink that are mounted above and below the main body portion so as to cover the upper and lower openings of the main body portion; a partitioning plate that is disposed so as to divide an internal portion of the main body portion into upper and lower sections, so as to form an upper portion space with the upper portion heatsink, and so as to form a lower portion space with the lower portion heatsink; a liquid coolant supplying header that is formed between the upper portion heatsink and the partitioning plate; a liquid coolant discharging header that is formed between the lower portion heatsink and the partitioning plate so as to have a flow channel direction that is parallel to a flow channel direction of the liquid coolant supplying header; a vertical flow channel that is separated from the liquid coolant supplying header by a predetermined distance in a width direction that is perpendicular to
- the liquid coolant distributing structural body that is configured into an external shape such that the flow channel cross-sectional area of the liquid coolant supplying header becomes gradually smaller from an upstream end toward a downstream end is disposed inside the liquid coolant supplying header, the quantity of flow of liquid coolant that is distributed toward the vertical flow channel from the upstream end of the liquid coolant supplying header is greater than the quantity of flow of liquid coolant that is distributed toward the vertical flow channel from the downstream end of the liquid coolant supplying header.
- the direction of flow of the liquid coolant that flows through the liquid coolant supplying header is changed toward the vertical flow channel on the side surfaces of the liquid coolant distributing structural body, performing distribution of the liquid coolant smoothly.
- the number of heat-generating elements that are mounted is increased, the occurrence of irregularities in cooling performance among the respective heat-generating elements is suppressed.
- FIG. 1 is a plan that shows a cooling apparatus according to Embodiment 1 of the present invention
- FIG. 2 is a side elevation that shows the cooling apparatus according to Embodiment 1 of the present invention.
- FIG. 3 is an exploded perspective that explains a configuration of the cooling apparatus according to Embodiment 1 of the present invention.
- FIG. 4 is a cross section that is taken along Line IV-IV in FIG. 1 so as to be viewed in the direction of the arrows;
- FIG. 5 is a plan that is viewed from an upper portion side that shows a state of the cooling apparatus according to Embodiment 1 of the present invention in which an upper portion heatsink is removed;
- FIG. 6 is a plan that is viewed from a lower portion side that shows a state of the cooling apparatus according to Embodiment 1 of the present invention in which a lower portion heatsink is removed;
- FIG. 7 is a cross section that is taken along Line VII-VII in FIG. 1 so as to be viewed in the direction of the arrows;
- FIG. 8 is a diagram that explains an operating principle of the cooling apparatus according to the present invention.
- FIG. 9 is a diagram that explains the operating principle of the cooling apparatus according to the present invention.
- FIG. 10 is a graph that shows a relationship between flow velocity irregularity and vertical flow channel width in the cooling apparatus according to the present invention.
- FIG. 11 is a graph that shows a relationship between optimality and vertical flow channel width in the cooling apparatus according to the present invention.
- FIG. 12 is an exploded perspective that explains a configuration of a cooling apparatus according to Embodiment 2 of the present invention.
- FIG. 13 is a cross section in which the cooling apparatus according to Embodiment 2 of the present invention is cut in a plane that is perpendicular to a direction of flow of a liquid coolant at an inflow header;
- FIG. 14 is a plan that is viewed from an upper portion side that shows a state of the cooling apparatus according to Embodiment 2 of the present invention in which an upper portion heatsink is removed;
- FIG. 15 is a plan that is viewed from a lower portion side that shows a state of the cooling apparatus according to Embodiment 2 of the present invention in which a lower portion heatsink is removed;
- FIG. 16 is a plan that shows a cooling apparatus according to Embodiment 3 of the present invention.
- FIG. 17 is a side elevation that shows the cooling apparatus according to Embodiment 3 of the present invention.
- FIG. 18 is a plan that is viewed from an upper portion side that shows a state of the cooling apparatus according to Embodiment 3 of the present invention in which an upper portion heatsink is removed;
- FIG. 19 is a plan that is viewed from a lower portion side that shows a state of the cooling apparatus according to Embodiment 3 of the present invention in which a lower portion heatsink is removed;
- FIG. 20 is a cross section that is taken along Line XX-XX in FIG. 16 so as to be viewed in the direction of the arrows;
- FIG. 21 is a cross section in which a cooling apparatus according to Embodiment 4 of the present invention is cut in a plane that is perpendicular to a direction of flow of a liquid coolant at an inflow header;
- FIG. 22 is a plan that is viewed from an upper portion side that shows a state of a cooling apparatus according to Embodiment 5 of the present invention in which an upper portion heatsink is removed;
- FIG. 23 is a plan that is viewed from an upper portion side that shows a state of a cooling apparatus according to Embodiment 6 of the present invention in which an upper portion heatsink is removed;
- FIG. 24 is a cross section that is taken along Line XXIV-XXIV in FIG. 23 so as to be viewed in the direction of the arrows;
- FIG. 25 is a plan that is viewed from an upper portion side that shows a state of a cooling apparatus according to Embodiment 7 of the present invention in which an upper portion heatsink is removed;
- FIG. 26 is a plan that is viewed from an upper portion side that shows a state of a cooling apparatus according to Embodiment 8 of the present invention in which an upper portion heatsink is removed.
- FIG. 1 is a plan that shows a cooling apparatus according to Embodiment 1 of the present invention
- FIG. 2 is a side elevation that shows the cooling apparatus according to Embodiment 1 of the present invention
- FIG. 3 is an exploded perspective that explains a configuration of the cooling apparatus according to Embodiment 1 of the present invention
- FIG. 4 is a cross section that is taken along Line IV-IV in FIG. 1 so as to be viewed in the direction of the arrows
- FIG. 5 is a plan that is viewed from an upper portion side that shows a state of the cooling apparatus according to Embodiment 1 of the present invention in which an upper portion heatsink is removed
- FIG. 1 is a plan that shows a cooling apparatus according to Embodiment 1 of the present invention
- FIG. 2 is a side elevation that shows the cooling apparatus according to Embodiment 1 of the present invention
- FIG. 3 is an exploded perspective that explains a configuration of the cooling apparatus according to Embodiment 1 of the present invention
- FIG. 4 is
- FIG. 6 is a plan that is viewed from a lower portion side that shows a state of the cooling apparatus according to Embodiment 1 of the present invention in which a lower portion heatsink is removed
- FIG. 7 is a cross section that is taken along Line VII-VII in FIG. 1 so as to be viewed in the direction of the arrows.
- arrows represent liquid coolant flow.
- a cooling apparatus 100 includes: a water jacket 1 ; an upper portion heatsink 10 that is mounted onto an upper portion of the water jacket 1 ; and a lower portion heatsink 11 that is mounted onto a lower portion of the water jacket 1 , and can contribute to cooling of heat-generating elements 15 such as CPUs, LSIs, power semiconductors, etc.
- the water jacket 1 is a resin-molded body that is formed using a polyphenylene sulfide (PPS) resin, for example, and includes: a rectangular frame-shaped main body portion 2 that has a predetermined thickness; a partitioning plate 3 that is formed so as to have a flat, rectangular shape that has a thickness that is thinner than that of the main body portion 2 , that is linked to a central portion of an inner peripheral surface of the main body portion 2 in a thickness direction, and that is disposed so as to divide an internal portion of the main body portion 2 into two sections in the thickness direction; a liquid coolant supplying groove 4 a that is formed so as to extend longitudinally on the partitioning plate 3 over an entire longitudinal region of a central portion in a width direction of an upper surface of the partitioning plate 3 ; a liquid coolant discharging groove 5 a that is formed so as to extend longitudinally on the partitioning plate 3 over an entire longitudinal region of a central portion in a width direction of a lower surface of the partitioning plate 3 ; a
- a liquid coolant distributing structural body 8 is disposed so as to project from a bottom surface of the liquid coolant supplying groove 4 a so as to extend from near a first end of the liquid coolant supplying groove 4 a to a second end so as to have a predetermined height and such that a width widens gradually from near the first end of the liquid coolant supplying groove 4 a toward the second end.
- a bottom surface of the liquid coolant distributing structural body 8 is configured into a triangular prism that is an isosceles triangle, and has plane symmetry relative to a plane that passes through center in a width direction of the liquid coolant supplying groove 4 a .
- the liquid coolant supplying groove 4 a is thereby configured such that a groove cross-sectional area thereof becomes gradually smaller from near the first end of the liquid coolant supplying groove 4 a toward the second end.
- a groove cross-sectional area of the liquid coolant discharging groove 5 a is constant from near the first end of the liquid coolant supplying groove 4 a toward the second end.
- Vertical flow channels 9 are formed over entire longitudinal regions of first and second end portions in the width direction of the partitioning plate 3 so as to pass through the partitioning plate 3 in a thickness direction and extend in a longitudinal direction of the partitioning plate 3 .
- the upper portion heatsink 10 and the lower portion heatsink 11 are each formed into an approximately rectangular flat shape using a material that has good thermal conductivity such as aluminum, copper, AlSiC, etc., and radiating fins 12 are disposed so as to stand on rear surfaces thereof.
- the radiating fins 12 are cylindrical bodies that are disposed so as to stand perpendicularly on rear surfaces of the upper portion heatsink 10 and the lower portion heatsink 11 . As shown in FIG.
- a plurality of rows of radiating fins 12 that are arranged at a predetermined pitch in longitudinal directions of the upper portion heatsink 10 and the lower portion heatsink 11 are arranged so as to have a predetermined spacing in width directions of the upper portion heatsink 10 and the lower portion heatsink 11 so as to be offset by a half pitch in the longitudinal directions of the upper portion heatsink 10 and the lower portion heatsink 11 so as to be disposed in matrix patterns on the rear surfaces of the upper portion heatsink 10 and the lower portion heatsink 11 .
- a rear surface side of the upper portion heatsink 10 is first stacked on the main body portion 2 from an upper portion side, so as to interpose a sealing member, if required.
- a rear surface side of the lower portion heatsink 11 is stacked on the main body portion 2 from a lower portion side, so as to interpose a sealing member, if required.
- the main body portion 2 and the upper portion and lower portion heatsinks 10 and 11 are then fixed, and the water jacket 1 and the upper portion and lower portion heatsinks 10 and 11 are linked and integrated to assemble the cooling apparatus 100 .
- the upper portion heatsink 10 covers an upper portion opening of the main body portion 2
- the lower portion heatsink 11 covers a lower portion opening of the main body portion 2
- An upper portion space is formed by the main body portion 2 , the partitioning plate 3 , and the upper portion heatsink 10
- a lower portion space is formed by the main body portion 2 , the partitioning plate 3 , and the lower portion heatsink 11 .
- the liquid coolant distributing structural body 8 contacts the rear surface of the upper portion heatsink 10 such that a liquid coolant supplying header 4 is formed by the liquid coolant supplying groove 4 a and the upper portion heatsink 10 in a central portion in the width direction of the upper portion space.
- a flow channel cross-sectional area of this liquid coolant supplying header 4 becomes gradually smaller from near a first end of the liquid coolant supplying header 4 toward a second end.
- a liquid coolant discharging header 5 is formed by the liquid coolant discharging groove 5 a and the lower portion heatsink 11 in a central portion in the width direction of the lower portion space.
- a flow channel cross-sectional area of this liquid coolant discharging header 5 is constant from near the first end of the liquid coolant supplying header 4 toward the second end.
- an inflow direction and a discharging direction of the liquid coolant are identical directions.
- groups of the radiating fins 12 of the upper portion and lower portion heatsinks 10 and 11 are respectively housed inside the upper portion space and the lower portion space so as to avoid the liquid coolant supplying header 4 , the liquid coolant discharging header 5 , and the vertical flow channels 9 , forming cooling flow channels.
- the heat-generating elements 15 are fixed by metallic bond, grease, adhesion, etc., onto the respective front surfaces of the upper portion and lower portion heatsinks 10 and 11 so as to line up in a flow channel direction of the liquid coolant supplying header 4 .
- liquid coolant that is supplied from a pump, etc., flows in through the liquid coolant supplying port 6 toward the first end of the liquid coolant supplying header 4 , and flows through the liquid coolant supplying header 4 along the liquid coolant distributing structural body 8 toward the second end.
- the direction of flow of the liquid coolant is then changed to the width direction of the water jacket 1 by the liquid coolant distributing structural body 8 so as to flow into the groups of radiating fins 12 that are housed inside the upper portion space.
- the rows of adjacent radiating fins 12 in the groups of radiating fins 12 are offset by a half pitch in the longitudinal direction of the water jacket 1 .
- the liquid coolant meanders through the groups of radiating fins 12 while flowing toward the vertical flow channels 9 .
- the heat that is generated by the heat-generating elements 15 that are mounted onto the upper portion heatsink 10 is radiated to the liquid coolant by means of the radiating fins 12 .
- the liquid coolant that has flowed into the vertical flow channels 9 flows through the vertical flow channels 9 toward the lower portion of the water jacket 1 , and flows into the groups of radiating fins 12 that are housed inside the lower portion space.
- the liquid coolant meanders through the groups of radiating fins 12 while flowing toward the liquid coolant discharging header 5 .
- the heat that is generated by the heat-generating elements 15 that are mounted onto the lower portion heatsink 11 is radiated to the liquid coolant by means of the radiating fins 12 .
- the liquid coolant that has flowed into the liquid coolant discharging header 5 then flows through the liquid coolant discharging header 5 toward the second end, and is discharged through the liquid coolant discharging port 7 .
- cooling flow channels are constituted by: flow channels that extend from a liquid coolant supplying header 4 that extends longitudinally on a central portion in a width direction of an upper portion side to vertical flow channels 9 that extend longitudinally on first and second end portions in the width direction; and flow channels that extend from the vertical flow channels 9 to a liquid coolant discharging header 5 that extends longitudinally on a central portion in a width direction of a lower portion side.
- the heat-generating elements 15 that have greater generated heat density onto the upper portion heatsink 10
- the heat-generating elements 15 that have less generated heat density onto the lower portion heatsink 11 .
- the heat-generating elements 15 that have greater generated heat density are constantly cooled by liquid coolant from the liquid coolant supplying header 4 that is in a sufficiently cooled state that has not risen in temperature, the heat-generating elements 15 that have greater generated heat density can be cooled efficiently.
- the flow velocity upstream from the liquid coolant supplying header 4 is slower than the flow velocity downstream due to inertial force of the liquid coolant inside the liquid coolant supplying header 4 , but because the flow channel cross-sectional area of the liquid coolant supplying header 4 becomes gradually smaller from near the first end of the liquid coolant supplying header 4 toward the second end, the flow rate of the liquid coolant that flows from the liquid coolant supplying header 4 into the groups of radiating fins 12 inside the upper portion space is made uniform in the flow channel direction of the liquid coolant supplying header 4 (the longitudinal direction of the water jacket 1 ). The liquid coolant in which flow rate has been made uniform in the longitudinal direction of the water jacket 1 then flows into the groups of radiating fins 12 inside the lower portion space via the vertical flow channels 9 .
- the cooling performance of the cooling apparatus 100 can be made uniform in the flow channel direction of the liquid coolant supplying header 4 , enabling the occurrence of irregularities in cooling performance among the heat-generating elements 15 that are mounted in parallel onto the front surfaces of the upper portion and lower portion heatsinks 10 and 11 to be suppressed.
- the bottom surface of the liquid coolant distributing structural body 8 that is disposed inside the liquid coolant supplying groove 4 a is configured into a triangular prism that is an isosceles triangle, the two side surfaces of the liquid coolant distributing structural body 8 are inclined relative to the direction of flow of the liquid coolant that flows through the liquid coolant supplying header 4 , changing the direction of flow of the liquid coolant from the longitudinal direction of the water jacket 1 to the width direction.
- the liquid coolant that flows through the liquid coolant supplying header 4 flows into the groups of radiating fins 12 smoothly, cooling performance is improved.
- the liquid coolant meanders through the groups of radiating fins 12 while flowing from the liquid coolant supplying header 4 toward the vertical flow channels 9 , and also from the vertical flow channels 9 toward the liquid coolant discharging header 5 . Consequently, because the cooling flow channels that extend from the liquid coolant supplying header 4 to the liquid coolant discharging header 5 are lengthened, and the heat radiating area of the radiating fins 12 is increased, cooling performance is improved.
- the partitioning plate 3 is constituted by a resin-molded body, the lower portion heatsink 11 is separated from the upper portion heatsink 10 thermally.
- problems such as heat generated in the heat-generating elements 15 that are mounted onto the upper portion heatsink 10 (or the lower portion heatsink 11 ) being transferred to the heat-generating elements 15 that are mounted onto the lower portion heatsink 11 (or the upper portion heatsink 10 ), and increasing the temperature of the heat-generating elements 15 that are mounted onto the lower portion heatsink 11 (or the upper portion heatsink 10 ), etc., are stopped preemptively.
- the water jacket 1 is constituted by a resin-molded body, the main body portion 2 , the partitioning plate 3 , the liquid coolant supplying port 6 , and the liquid coolant discharging port 7 are formed integrally. Thus, manufacturing time can be shortened and cost reductions can be achieved compared to when the main body portion 2 , the partitioning plate 3 , the liquid coolant supplying port 6 , and the liquid coolant discharging port 7 are produced as separate members and the water jacket 1 is produced by assembly in a subsequent step.
- the partitioning plate 3 is disposed so as to divide an internal portion of the main body portion 2 into two sections in the thickness direction, the cooling flow channels that extend from the liquid coolant supplying header 4 to the liquid coolant discharging header 5 are formed into two (upper and lower) layers, and the flow channels in the two upper and lower layers are connected in series by means of the vertical flow channels 9 .
- the cooling flow channels that extend from the liquid coolant supplying header 4 to the liquid coolant discharging header 5 can be lengthened and the heat radiating area of the radiating fins 12 can be increased without increasing the cooling apparatus 100 in size, cooling performance is improved.
- FIGS. 8 and 9 are diagrams that explain an operating principle of the cooling apparatus according to the present invention, FIG. 8 being a cross section that is cut in a plane that is perpendicular to the direction of flow of a liquid coolant inside a liquid coolant supplying header that shows a state in which upper portion and lower portion heatsinks of a cooling apparatus are removed, and FIG. 9 being a plan that is viewed from a lower portion side that shows a state in which the lower portion heatsink of the cooling apparatus is removed, respectively.
- L (mm) is a width of a fin region
- L w (mm) is a length of the fin region.
- the fin region is a region that is surrounded by two inner wall surfaces of the main body portion 2 of the partitioning plate 3 in the longitudinal direction, the liquid coolant supplying groove 4 a , and the vertical flow channels 9 .
- P 1 (Pa) is an inlet pressure of the vertical flow channels 9
- P 2 (Pa) is an outlet pressure of the vertical flow channels 9 .
- a lower portion fin region is divided into n regions in the longitudinal direction, and V 1 through V n are flow velocities of the liquid coolant in the respective regions.
- the width t (mm) of the vertical flow channels 9 is widened too much, the liquid coolant is biased toward the second end of the vertical flow channels 9 (near the liquid coolant discharging port 7 ) in the process of passing through the vertical flow channels 9 , making irregularities more likely to arise in the flow of the liquid coolant.
- the width t (mm) of the vertical flow channels 9 is wide, flow channel resistance in the longitudinal direction of the vertical flow channels 9 is reduced.
- the width t (mm) of the vertical flow channels 9 is made too narrow, on the other hand, the difference between the inlet pressure P 1 (Pa) of the vertical flow channels 9 and the outlet pressure P 2 (Pa) of the vertical flow channels 9 , i.e., pressure loss, is increased, and a lot of energy is required to drive the pump that circulates the liquid coolant.
- flow velocity irregularity D of the liquid coolant is defined by Expression (1), where the lower portion fin region is divided into n regions in the longitudinal direction, and V average is the average flow velocity of flow velocities V 1 through V n of the liquid coolant in the respective regions, and ⁇ is the standard deviation of the flow velocity distribution.
- results of performing fluid simulations for flow velocity irregularity D with different widths t (mm) in the vertical flow channels 9 are shown in FIG. 10 .
- the flow velocity irregularity D increases rapidly when the width t (mm) of the vertical flow channels 9 is increased from 0.2 mm, and increases gently when the width t (mm) exceeds 0.5 mm.
- the width t (mm) of the vertical flow channels 9 at which the flow velocity irregularity D is less than or equal to 0.25 is 6.5 mm. Consequently, from the viewpoint of making the heat radiating performance uniform, it is desirable to set the width t (mm) of the vertical flow channels 9 to less than or equal to 6.5 mm.
- results of performing fluid simulations for optimality O with different widths t (mm) in the vertical flow channels 9 are shown in FIG. 11 . From FIG. 11 , it can be seen that optimality O decreases rapidly when the width t (mm) of the vertical flow channels 9 is less than 0.75 (mm), and is at an approximately constant value at greater than or equal to 0.75 (mm). Consequently, from the viewpoint of reducing energy consumption, it is desirable to set the width t (mm) of the vertical flow channels 9 to greater than or equal to 7.5 mm.
- L w (m) is a longitudinal length of the fin regions
- ⁇ (m 2 /s) is a coefficient of kinematic viscosity of the liquid coolant.
- the width t of the vertical flow channels 9 so as to satisfy 0.75 (mm) ⁇ t ⁇ 6.5 (mm). That is, flow velocity irregularity D and pressure loss can be reduced if the width t of the vertical flow channels 9 satisfies 0.75 (mm) ⁇ t ⁇ 6.5 (mm). Heat radiating performance within the planes of the upper portion heatsink 10 and the lower portion heatsink 11 of the cooling apparatus 1 can thereby be made uniform, and energy consumption of the pump that cycles the liquid coolant can also be reduced. Moreover, the optimal conditions of the width t of the vertical flow channels 9 (0.75 (mm) ⁇ t ⁇ 6.5 (mm)) are invariably satisfied if Re ⁇ 10 6 , irrespective of the value of L w and ⁇ .
- a main body portion, a partitioning plate, a liquid coolant supplying port, and a liquid coolant discharging port are formed integrally, but a main body portion and a partitioning plate may also be formed integrally, and a liquid coolant supplying port and a liquid coolant discharging port mounted in a subsequent step.
- FIG. 12 is an exploded perspective that explains a configuration of a cooling apparatus according to Embodiment 2 of the present invention
- FIG. 13 is a cross section in which the cooling apparatus according to Embodiment 2 of the present invention is cut in a plane that is perpendicular to a direction of flow of a liquid coolant at an inflow header
- FIG. 14 is a plan that is viewed from an upper portion side that shows a state of the cooling apparatus according to Embodiment 2 of the present invention in which an upper portion heatsink is removed
- FIG. 15 is a plan that is viewed from a lower portion side that shows a state of the cooling apparatus according to Embodiment 2 of the present invention in which a lower portion heatsink is removed.
- arrows represent liquid coolant flow.
- a water jacket 1 A is a resin-molded body that is formed using a polyphenylene sulfide (PPS) resin, for example, and includes: a rectangular frame-shaped main body portion 20 that has a predetermined thickness; a partitioning plate 21 that is formed so as to have a flat, rectangular shape that has a thickness that is thinner than that of the main body portion 20 , that is linked to a central portion of an inner circumferential surface of the main body portion 20 in a thickness direction, and that is disposed so as to divide an internal portion of the main body portion 20 into two sections in the thickness direction; a vertical flow channel 22 that is formed over an entire longitudinal region of a central portion in a width direction of the partitioning plate 21 so as to pass through the partitioning plate 21 in a thickness direction and extend in a longitudinal direction of the partitioning plate 21 ; liquid coolant supplying grooves 23 a that are respectively formed so as to extend longitudinally on the partitioning plate 21 over entire longitudinal regions of two end portions in a width
- PPS polyphenylene
- liquid coolant distributing structural bodies 29 are disposed so as to project from bottom surfaces of the liquid coolant supplying grooves 23 a so as to extend from near first ends of the liquid coolant supplying grooves 23 a to second ends such that widths widen gradually from near the first ends of the liquid coolant supplying grooves 23 a toward the second ends.
- bottom surfaces of the liquid coolant distributing structural bodies 29 are configured into triangular prisms that are right-angled triangles, and are formed integrally on two side portions of the main body portion 20 in the width direction.
- the liquid coolant supplying grooves 23 a are thereby configured such that groove cross-sectional areas thereof become gradually smaller from near the first ends of the liquid coolant supplying grooves 23 a toward the second ends.
- Groove cross-sectional areas of the liquid coolant discharging grooves 24 a are constant from near the first ends of the liquid coolant supplying grooves 23 a toward the second ends.
- a cooling apparatus 101 according to Embodiment 2 is configured in a similar or identical manner to that of the cooling apparatus 100 according to Embodiment 1 above except that the water jacket 1 A is used instead of the water jacket 1 .
- a rear surface side of the upper portion heatsink 10 is first stacked on the main body portion 20 from an upper portion side, so as to interpose a sealing member, if required.
- a rear surface side of the lower portion heatsink 11 is stacked on the main body portion 20 from a lower portion side, so as to interpose a sealing member, if required.
- the main body portion 20 and the upper portion and lower portion heatsinks 10 and 11 are then fixed, and the water jacket 1 A and the upper portion and lower portion heatsinks 10 and 11 are linked and integrated to assemble the cooling apparatus 101 .
- the upper portion heatsink 10 covers an upper portion opening of the main body portion 20
- the lower portion heatsink 11 covers a lower portion opening of the main body portion 20
- An upper portion space is formed by the main body portion 20 , the partitioning plate 21 , and the upper portion heatsink 10
- a lower portion space is formed by the main body portion 20 , the partitioning plate 21 , and the lower portion heatsink 11 .
- liquid coolant distributing structural bodies 29 contact the rear surface of the upper portion heatsink 10 such that liquid coolant supplying headers 23 are formed by the liquid coolant supplying grooves 23 a and the upper portion heatsink 10 on two end portions in the width direction of the upper portion space.
- Flow channel cross-sectional areas of these liquid coolant supplying headers 23 become gradually smaller from near first ends of the liquid coolant supplying headers 23 toward second ends.
- Liquid coolant discharging headers 24 are formed by the liquid coolant discharging grooves 24 a and the lower portion heatsink 11 on two end portions in the width direction of the lower portion space.
- Flow channel cross-sectional areas of these liquid coolant discharging headers 24 are constant from near the first ends of the liquid coolant supplying headers 23 toward the second ends.
- groups of the radiating fins 12 of the upper portion and lower portion heatsinks 10 and 11 are respectively housed inside the upper portion space and the lower portion space so as to avoid the liquid coolant supplying headers 23 , the liquid coolant discharging headers 24 , and the vertical flow channel 22 , forming cooling flow channels.
- the heat-generating elements 15 are fixed by metallic bond, grease, adhesion, etc., onto the respective front surfaces of the upper portion and lower portion heatsinks 10 and 11 so as to line up in a flow channel direction of the liquid coolant supplying headers 23 .
- liquid coolant that is supplied from a pump, etc., flows in through the liquid coolant supplying port 25 through the supply-side communicating passage 27 toward the first ends of the liquid coolant supplying headers 23 , and flows through the liquid coolant supplying headers 23 along the liquid coolant distributing structural bodies 29 toward the second ends.
- the directions of flow of the liquid coolant are then changed to the width direction of the water jacket 1 A by the liquid coolant distributing structural bodies 29 so as to flow into the groups of radiating fins 12 that are housed inside the upper portion space.
- the liquid coolant meanders through the groups of radiating fins 12 while flowing toward the vertical flow channel 22 . At this point, the heat that is generated by the heat-generating elements 15 that are mounted onto the upper portion heatsink 10 is radiated to the liquid coolant by means of the radiating fins 12 .
- the liquid coolant that has flowed into the vertical flow channel 22 flows through the vertical flow channel 22 toward the lower portion of the water jacket 1 A, and flows into the groups of radiating fins 12 that are housed inside the lower portion space.
- the liquid coolant meanders through the groups of radiating fins 12 while flowing toward the liquid coolant discharging headers 24 .
- the heat that is generated by the heat-generating elements 15 that are mounted onto the lower portion heatsink 11 is radiated to the liquid coolant by means of the radiating fins 12 .
- the liquid coolant that has flowed into the liquid coolant discharging headers 24 then flows through the liquid coolant discharging headers 24 toward the second end, passes through the discharge-side communicating passage 28 , and is discharged through the liquid coolant discharging port 26 .
- cooling flow channels are constituted by: flow channels that extend from liquid coolant supplying headers 23 that extend longitudinally on two side portions in a width direction of an upper portion side to a vertical flow channel 22 that extends longitudinally at a central portion in the width direction; and flow channels that extend from the vertical flow channel 22 to liquid coolant discharging headers 24 that extend longitudinally on two side portions in a width direction of a lower portion side.
- flow channels that extend from liquid coolant supplying headers 23 that extend longitudinally on two side portions in a width direction of an upper portion side to a vertical flow channel 22 that extends longitudinally at a central portion in the width direction
- flow channels that extend from the vertical flow channel 22 to liquid coolant discharging headers 24 that extend longitudinally on two side portions in a width direction of a lower portion side.
- the heat-generating elements 15 that have greater generated heat density are constantly cooled by liquid coolant from the liquid coolant supplying headers 23 that is in a sufficiently cooled state that has not risen in temperature, the heat-generating elements 15 that have greater generated heat density can be cooled efficiently.
- Embodiment 2 because the flow channel cross-sectional area of the liquid coolant supplying headers 23 also becomes gradually smaller from near the first ends of the liquid coolant supplying headers 23 toward the second ends, the occurrence of irregularities in cooling performance among heat-generating elements 15 that are mounted onto the front surfaces of the upper portion and lower portion heatsinks 10 and 11 in parallel is suppressed, and cooling performance is also improved, in a similar manner to Embodiment 1 above.
- FIG. 16 is a plan that shows a cooling apparatus according to Embodiment 3 of the present invention
- FIG. 17 is a side elevation that shows the cooling apparatus according to Embodiment 3 of the present invention
- FIG. 18 is a plan that is viewed from an upper portion side that shows a state of the cooling apparatus according to Embodiment 3 of the present invention in which an upper portion heatsink is removed
- FIG. 19 is a plan that is viewed from a lower portion side that shows a state of the cooling apparatus according to Embodiment 3 of the present invention in which a lower portion heatsink is removed
- FIG. 20 is a cross section that is taken along Line XX-XX in FIG. 16 so as to be viewed in the direction of the arrows.
- arrows represent liquid coolant flow.
- a water jacket 1 B includes: a liquid coolant supplying port 6 that is linked near an upper portion at a first longitudinal end of a main body portion 2 so as to be connected to a first end of a liquid coolant supplying groove 4 a ; and a liquid coolant discharging port 7 that is linked near a lower portion at the first longitudinal end of the main body portion 2 so as to be connected to a first end of a liquid coolant discharging groove 5 a.
- a cooling apparatus 102 according to Embodiment 3 is configured in a similar or identical manner to that of the cooling apparatus 100 according to Embodiment 1 above except that the water jacket 1 B is used instead of the water jacket 1 .
- the heat-generating elements 15 are fixed by metallic bond, grease, adhesion, etc., onto the respective front surfaces of the upper portion and lower portion heatsinks 10 and 11 so as to line up in a flow channel direction of the liquid coolant supplying header 4 .
- liquid coolant that is supplied from a pump, etc., flows in from the liquid coolant supplying port 6 toward the first end of the liquid coolant supplying header 4 , and flows through the liquid coolant supplying header 4 along the liquid coolant distributing structural body 8 toward the second end.
- the direction of flow of the liquid coolant is then changed to the width direction of the water jacket 1 B by the liquid coolant distributing structural body 8 so as to flow into the groups of radiating fins 12 that are housed inside the upper portion space.
- the liquid coolant meanders through the groups of radiating fins 12 while flowing toward the vertical flow channels 9 .
- the heat that is generated by the heat-generating elements 15 that are mounted onto the upper portion heatsink 10 is radiated to the liquid coolant by means of the radiating fins 12 .
- the liquid coolant that has flowed into the vertical flow channels 9 flows through the vertical flow channels 9 toward the lower portion of the water jacket 1 B, and flows into the groups of radiating fins 12 that are housed inside the lower portion space. As indicated by the arrows in FIG. 19 , the liquid coolant meanders through the groups of radiating fins 12 while flowing toward the liquid coolant discharging header 5 . At this point, the heat that is generated by the heat-generating elements 15 that are mounted onto the lower portion heatsink 11 is radiated to the liquid coolant by means of the radiating fins 12 .
- the liquid coolant that has flowed into the liquid coolant discharging header 5 then flows through the liquid coolant discharging header 5 toward the first end, and is discharged from the liquid coolant discharging port 7 .
- an inflow direction and a discharging direction of the liquid coolant are opposite directions.
- cooling flow channels are constituted by: flow channels that extend from a liquid coolant supplying header 4 that extends longitudinally on a central portion in a width direction of an upper portion side to vertical flow channels 9 that extend longitudinally on first and second end portions in the width direction; and flow channels that extend from the vertical flow channels 9 to a liquid coolant discharging header 5 that extends longitudinally on a central portion in a width direction of a lower portion side.
- the heat-generating elements 15 that have greater generated heat density onto the upper portion heatsink 10 , and to mount the heat-generating elements 15 that have less generated heat density onto the lower portion heatsink 11 .
- Embodiment 3 because the flow channel cross-sectional area of the liquid coolant supplying header 4 also becomes gradually smaller from near the first end of the liquid coolant supplying header 4 toward the second end, the occurrence of irregularities in cooling performance among heat-generating elements 15 that are mounted onto the front surfaces of the upper portion and lower portion heatsinks 10 and 11 in parallel is suppressed, and cooling performance is also improved, in a similar manner to Embodiment 1 above.
- Embodiment 3 because the liquid coolant supplying port 6 and the liquid coolant discharging port 7 are disposed on the first longitudinal end portion of the water jacket 1 B, and the inflow direction and the discharging direction of the liquid coolant are opposite directions, that is, the direction of flow of the liquid coolant into the liquid coolant supplying header 4 and the direction of flow of the liquid coolant into the liquid coolant discharging header 5 are opposite directions, the inertial force of the liquid coolant on the upper portion side and the inertial force of the liquid coolant on the lower portion side are canceled out in the vertical flow channel 9 , enabling bias of the liquid coolant that flows through the vertical flow channel 9 to be suppressed.
- FIG. 21 is a cross section in which a cooling apparatus according to Embodiment 4 of the present invention is cut in a plane that is perpendicular to a direction of flow of a liquid coolant at an inflow header.
- an upper portion heatsink 10 A is formed so as to have a tapered shape in which heights of radiating fins 12 that are arranged in rows near a center in a width direction become gradually lower toward the center in the width direction.
- the radiating fins 12 that are formed so as to have the tapered shape extend inside a liquid coolant supplying header 4 .
- a lower portion heatsink 11 A is formed so as to have a tapered shape in which heights of radiating fins 12 that are arranged in rows near a center in a width direction become gradually lower toward the center in the width direction.
- the radiating fins 12 that are formed so as to have the tapered shape extend inside a liquid coolant discharging header 5 .
- a cooling apparatus 103 according to Embodiment 4 is configured in a similar or identical manner to that of the cooling apparatus 100 according to Embodiment 1 above.
- the radiating fins 12 are made to extend inside the liquid coolant supplying headers 4 and the liquid coolant discharging header 5 by lowering heights thereof into a tapered shape near the center in the width direction.
- the heat radiating area of the radiating fins 12 can be expanded without reducing the flow channel cross-sectional area of the liquid coolant supplying headers 4 and the liquid coolant discharging header 5 excessively, heat generated in the heat-generating elements 15 can be radiated effectively.
- FIG. 22 is a plan that is viewed from an upper portion side that shows a state of a cooling apparatus according to Embodiment 5 of the present invention in which an upper portion heatsink is removed.
- a liquid coolant distributing structural body 8 A of a water jacket 1 C is disposed so as to project from a bottom surface of the liquid coolant supplying groove 4 a so as to extend from near a first end of the liquid coolant supplying groove 4 a to a second end so as to have a predetermined height and such that a width widens gradually from near the first end of the liquid coolant supplying groove 4 a toward the second end.
- a bottom surface of the liquid coolant distributing structural body 8 A is configured into a triangular prism that is a scalene triangle.
- a cooling apparatus 104 according to Embodiment 5 is configured in a similar or identical manner to that of the cooling apparatus 100 according to Embodiment 1 above except that the water jacket 1 C is used instead of the water jacket 1 .
- a cooling apparatus 104 that is configured in this manner, because the flow channel cross-sectional area of the liquid coolant supplying header is configured so as to become gradually smaller from near the first end toward the second end, the flow rates of the liquid coolant flowing into each of the cooling flow channels on the two sides in the width direction of the liquid coolant supplying header are all equal in the flow channel direction of the liquid coolant supplying header. Because the angle of inclination of the two side surfaces of the liquid coolant distributing structural body 8 A are different in the direction of flow of the liquid coolant that flows through the liquid coolant supplying header, the flow rates of the liquid coolant that flows into the cooling flow channels on the two sides in the width direction of the liquid coolant supplying header are different.
- this cooling apparatus 104 four regions that have different cooling capacities can be configured on the two sides in the width direction of the upper portion heatsink 10 and the two sides in the width direction of the lower portion heatsink 11 by adjusting the angle of inclination of the two side surfaces of the liquid coolant distributing structural body 8 A.
- the cooling capacity of the first side in the width direction of the liquid coolant supplying header (top of FIG. 22 ) is greater than the cooling capacity of the second side in the width direction of the liquid coolant supplying header (bottom of FIG. 22 ).
- groups of heat-generating elements 15 that have different generated heat densities can be cooled effectively by mounting the group of heat-generating elements 15 that has the greatest generated heat density onto a region on the first side in the width direction side of the upper portion heatsink 10 , mounting the group of heat-generating elements 15 that has the next greatest generated heat density onto a region on the second side in the width direction side of the upper portion heatsink 10 , mounting the group of heat-generating elements 15 that has the next greatest generated heat density onto a region on the second side in the width direction side of the lower portion heatsink 11 , and mounting the group of heat-generating elements 15 that has the least generated heat density onto a region on the first side in the width direction side of the lower portion heatsink 11 .
- FIG. 23 is a plan that is viewed from an upper portion side that shows a state of a cooling apparatus according to Embodiment 6 of the present invention in which an upper portion heatsink is removed
- FIG. 24 is a cross section that is taken along Line XXIV-XXIV in FIG. 23 so as to be viewed in the direction of the arrows.
- a liquid coolant distributing structural body 8 B of a water jacket 1 D that has a predetermined height and that has a trapezoidal cross section perpendicular to the groove direction of the liquid coolant supplying groove 4 a is disposed so as to project from a bottom surface of a liquid coolant supplying groove 4 a such that a cross-sectional area is kept constant near a first end of the liquid coolant supplying groove 4 a , and the cross-sectional area is subsequently increased gradually toward a second end.
- a cooling apparatus 105 according to Embodiment 6 is configured in a similar or identical manner to that of the cooling apparatus 100 according to Embodiment 1 above except that the water jacket 1 D is used instead of the water jacket 1 .
- the flow channel cross-sectional area near the first end (upstream end) of the liquid coolant supplying header is constant, and the flow channel cross-sectional area near the second end (downstream end) of the liquid coolant supplying header becomes gradually smaller toward the second end.
- the flow channel cross-sectional area near the second end where the inertial force of the liquid coolant inside the liquid coolant supplying header is largest, becomes gradually smaller toward the second end, the liquid coolant that flows through the liquid coolant supplying header flows into the groups of radiating fins 12 approximately uniformly in the flow channel direction of the liquid coolant supplying header.
- the cooling performance of the cooling apparatus 105 can also be made uniform in the flow channel direction of the liquid coolant supplying header, enabling the occurrence of irregularities in cooling performance among the heat-generating elements 15 that are mounted onto the front surfaces of the upper portion and lower portion heatsinks 10 and 11 in parallel to be suppressed.
- FIG. 25 is a plan that is viewed from an upper portion side that shows a state of a cooling apparatus according to Embodiment 7 of the present invention in which an upper portion heatsink is removed.
- a liquid coolant distributing structural body 8 C of a water jacket 1 E is disposed so as to project from a bottom surface of the liquid coolant supplying groove 4 a so as to extend from near a first end of the liquid coolant supplying groove 4 a to a second end so as to have a predetermined height and such that a width widens gradually from near the first end of the liquid coolant supplying groove 4 a toward the second end.
- a bottom surface of the liquid coolant distributing structural body 8 C is configured into a prism in which two side surfaces are convex curved surfaces, and has plane symmetry relative to a plane that passes through center in a width direction of the liquid coolant supplying groove 4 a .
- the liquid coolant supplying groove 4 a is thereby configured such that a groove cross-sectional area thereof becomes gradually smaller from near the first end of the liquid coolant supplying groove 4 a toward the second end.
- a cooling apparatus 106 according to Embodiment 7 is configured in a similar or identical manner to that of the cooling apparatus 100 according to Embodiment 1 above except that the water jacket 1 E is used instead of the water jacket 1 .
- a cooling apparatus 106 that is configured in this manner, because the flow channel cross-sectional area of the liquid coolant supplying header becomes gradually smaller from near the first end toward the second end, the liquid coolant that flows through the liquid coolant supplying header flows into the groups of radiating fins 12 approximately uniformly in the flow channel direction of the liquid coolant supplying header.
- the cooling performance of the cooling apparatus 106 can also be made uniform in the flow channel direction of the liquid coolant supplying header, enabling the occurrence of irregularities in cooling performance among the heat-generating elements 15 that are mounted onto the front surfaces of the upper portion and lower portion heatsinks 10 and 11 in parallel to be suppressed.
- side surfaces of the liquid coolant distributing structural body are formed into convex curved surfaces, but the side surfaces of the liquid coolant distributing structural body are not limited to convex curved surfaces and may also be concave curved surfaces, for example, provided that the flow channel cross-sectional area of the liquid coolant supplying header becomes gradually smaller from near the first end toward the second end.
- FIG. 26 is a plan that is viewed from an upper portion side that shows a state of a cooling apparatus according to Embodiment 8 of the present invention in which an upper portion heatsink is removed.
- a liquid coolant distributing structural body 8 D of a water jacket 1 F is disposed so as to project from a bottom surface of the liquid coolant supplying groove 4 a so as to extend from near a first end of the liquid coolant supplying groove 4 a to a second end so as to have a predetermined height and such that a width widens gradually from near the first end of the liquid coolant supplying groove 4 a toward the second end.
- the liquid coolant distributing structural body 8 D is configured into a prism in which a first side surface is a convex curved surface, and a second side surface is a flat surface.
- the liquid coolant supplying groove 4 a is thereby configured such that a groove cross-sectional area thereof becomes gradually smaller from near the first end of the liquid coolant supplying groove 4 a toward the second end.
- a cooling apparatus 107 according to Embodiment 8 is configured in a similar or identical manner to that of the cooling apparatus 100 according to Embodiment 1 above except that the water jacket 1 F is used instead of the water jacket 1 .
- a cooling apparatus 107 that is configured in this manner, because the flow channel cross-sectional area of the liquid coolant supplying header becomes gradually smaller from near the first end toward the second end, the liquid coolant that flows through the liquid coolant supplying header flows into the groups of radiating fins 12 on the first side in the width direction of the liquid coolant supplying header uniformly, and flows into the groups of radiating fins 12 on the second side in the width direction of the liquid coolant supplying header uniformly, in the flow channel direction of the liquid coolant supplying header.
- the quantity of flow that flows into the groups of radiating fins 12 on the first side in the width direction of the liquid coolant supplying header and the quantity of flow that flows into the groups of radiating fins 12 on the second side in the width direction of the liquid coolant supplying header are different.
- Embodiment 8 because four regions that have different cooling capacities can be configured on the two sides in the width direction of the upper portion heatsink 10 and the two sides in the width direction of the lower portion heatsink 11 by adjusting the surface shapes of the two side surfaces of the liquid coolant distributing structural body 8 D, similar effects to those in Embodiment 5 above can also be achieved.
- the water jacket is made of a resin, but the material of the water jacket is not limited to a resin, and a metal such as aluminum, for example, may also be used.
- the radiating fins are formed so as to have a cylindrical shape, but the shape of the radiating fins is not limited to a cylinder, and may also be an elliptic cylinder, a rhombic prism, a rectangular prism, a flat plate shape, or a lamination of thin plates with slits, for example.
- the radiating fins are disposed such that the liquid coolant meanders, but it is not absolutely necessary for the radiating fins to be disposed such that the liquid coolant meanders.
- liquid coolant has not been explained in detail, but a refrigerant such as water, oil, etc., can be used in the liquid coolant.
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- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
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JP2012268346A JP5523542B1 (ja) | 2012-12-07 | 2012-12-07 | 冷却装置 |
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US20140158324A1 true US20140158324A1 (en) | 2014-06-12 |
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US14/086,120 Abandoned US20140158324A1 (en) | 2012-12-07 | 2013-11-21 | Cooling apparatus |
US15/622,187 Active 2033-11-29 US10455734B2 (en) | 2012-12-07 | 2017-06-14 | Cooling apparatus having vertical flow channels |
Family Applications After (1)
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US15/622,187 Active 2033-11-29 US10455734B2 (en) | 2012-12-07 | 2017-06-14 | Cooling apparatus having vertical flow channels |
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US (2) | US20140158324A1 (ja) |
JP (1) | JP5523542B1 (ja) |
CN (1) | CN103871984B (ja) |
DE (1) | DE102013224970B4 (ja) |
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Also Published As
Publication number | Publication date |
---|---|
DE102013224970B4 (de) | 2016-05-04 |
JP2014116404A (ja) | 2014-06-26 |
CN103871984A (zh) | 2014-06-18 |
JP5523542B1 (ja) | 2014-06-18 |
US20170280589A1 (en) | 2017-09-28 |
US10455734B2 (en) | 2019-10-22 |
DE102013224970A1 (de) | 2014-06-12 |
CN103871984B (zh) | 2017-05-10 |
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