US20130008797A1 - Device and process for controlling the efficiency of a metal electrodeposition bath - Google Patents
Device and process for controlling the efficiency of a metal electrodeposition bath Download PDFInfo
- Publication number
- US20130008797A1 US20130008797A1 US13/637,854 US201113637854A US2013008797A1 US 20130008797 A1 US20130008797 A1 US 20130008797A1 US 201113637854 A US201113637854 A US 201113637854A US 2013008797 A1 US2013008797 A1 US 2013008797A1
- Authority
- US
- United States
- Prior art keywords
- samples
- bath
- cathode
- current
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1052373 | 2010-03-31 | ||
FR1052373A FR2958300B1 (fr) | 2010-03-31 | 2010-03-31 | Dispositif pour controler des caracteristiques physiques d'un bain d'electrodeposition metallique. |
PCT/FR2011/050715 WO2011121240A1 (fr) | 2010-03-31 | 2011-03-30 | Dispositif et procede pour controler l'efficacite d'un bain d'electrodeposition metallique |
Publications (1)
Publication Number | Publication Date |
---|---|
US20130008797A1 true US20130008797A1 (en) | 2013-01-10 |
Family
ID=42751439
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/637,854 Abandoned US20130008797A1 (en) | 2010-03-31 | 2011-03-30 | Device and process for controlling the efficiency of a metal electrodeposition bath |
Country Status (9)
Country | Link |
---|---|
US (1) | US20130008797A1 (fr) |
EP (1) | EP2553148B1 (fr) |
JP (1) | JP5764650B2 (fr) |
CN (1) | CN102822393B (fr) |
BR (1) | BR112012024387A2 (fr) |
CA (1) | CA2794579A1 (fr) |
FR (1) | FR2958300B1 (fr) |
RU (1) | RU2553161C2 (fr) |
WO (1) | WO2011121240A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020012144A (ja) * | 2018-07-17 | 2020-01-23 | 株式会社ファシリティ | 電解処理装置 |
Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2511395A (en) * | 1939-02-20 | 1950-06-13 | City Auto Stamping Co | Process for the electrodeposition of tin alloys |
US3470082A (en) * | 1965-09-22 | 1969-09-30 | Louis W Raymond | Electroplating method and system |
US4053383A (en) * | 1975-08-21 | 1977-10-11 | Siemens Aktiengesellschaft | Apparatus for electrodepositing aluminum |
US4721551A (en) * | 1986-11-06 | 1988-01-26 | The Regents Of The University Of California | Iridium treatment of neuro-stimulating electrodes |
US5102509A (en) * | 1988-09-07 | 1992-04-07 | Johnson Matthey Public Limited Company | Plating |
JPH04114566A (ja) * | 1990-09-04 | 1992-04-15 | Sharp Corp | テレビドアホン装置 |
US20020104754A1 (en) * | 2001-02-06 | 2002-08-08 | Danny Wu | Electroplating apparatus for wheel disk |
US20030226764A1 (en) * | 2000-08-30 | 2003-12-11 | Moore Scott E. | Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces |
US20040084316A1 (en) * | 2002-10-31 | 2004-05-06 | Renesas Technology Corp. | Plating apparatus and method |
JP2007262433A (ja) * | 2006-03-27 | 2007-10-11 | Teikoku Ion Kk | クロムめっき用ハイブリッド電極、それを用いたクロムメッキ方法及びクロムめっき装置 |
US20090038952A1 (en) * | 2007-08-09 | 2009-02-12 | Shinji Tachibana | Electrolytic copper plating process |
US20090050473A1 (en) * | 2007-08-20 | 2009-02-26 | Mitsutoshi Yahagi | Conducting belt for use with anode holder and anode holder |
US20090229986A1 (en) * | 2008-03-11 | 2009-09-17 | C. Uyemura & Co., Ltd. | Continuous copper electroplating method |
US20090272644A1 (en) * | 2008-04-30 | 2009-11-05 | Alcatel Lucent | Plating apparatus with direct electrolyte distribution system |
US20100006445A1 (en) * | 2008-04-18 | 2010-01-14 | Integran Technologies Inc. | Electroplating method and apparatus |
US20100041226A1 (en) * | 2008-08-18 | 2010-02-18 | Novellus Systems, Inc. | Process For Through Silicon Via Filing |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2149344A (en) | 1935-03-22 | 1939-03-07 | Du Pont | Apparatus and process for the study of plating solutions |
SU127339A1 (ru) * | 1953-04-02 | 1959-11-30 | М.А. Гинцбург | Линейный ускоритель элементарных частиц и ионов |
US3132080A (en) * | 1960-10-26 | 1964-05-05 | Thompson Ramo Wooldridge Inc | Electroplating method and apparatus |
JPS5954568U (ja) * | 1982-09-30 | 1984-04-10 | 富士通株式会社 | 電着めつき装置 |
SU1108130A1 (ru) * | 1983-04-15 | 1984-08-15 | Предприятие П/Я Г-4733 | Устройство дл контрол травильной способности растворов |
JPS63138246A (ja) * | 1986-11-29 | 1988-06-10 | Oki Electric Ind Co Ltd | メツキ液撹拌状態試験方法 |
JPH0737680B2 (ja) * | 1990-07-09 | 1995-04-26 | 株式会社アルメックス | 給電方法 |
JPH04114566U (ja) * | 1991-03-20 | 1992-10-08 | アイシン精機株式会社 | メツキ処理装置 |
JPH0741998A (ja) * | 1993-07-29 | 1995-02-10 | Kawasaki Steel Corp | 鉄系電気めっき方法 |
US20040168925A1 (en) * | 2002-10-09 | 2004-09-02 | Uziel Landau | Electrochemical system for analyzing performance and properties of electrolytic solutions |
DE10323638B4 (de) * | 2003-05-26 | 2006-11-23 | Robert Bosch Gmbh | Verfahren und Vorrichtung zur Entwicklung einer elektrochemischen Messanordnung |
DE102004056158B3 (de) * | 2004-11-17 | 2006-03-30 | Siemens Ag | Verfahren zum Überwachen eines elektrochemischen Behandlungsprozesses und für dieses Verfahren geeignete Elektrodenanordnung |
US20060289299A1 (en) * | 2005-06-22 | 2006-12-28 | 3M Innovative Properties Company | Multi-channel current probe |
EP1943832A2 (fr) * | 2005-10-24 | 2008-07-16 | Nxp B.V. | Appareil de reajustement de mouvement a champ vectoriel de mouvement |
-
2010
- 2010-03-31 FR FR1052373A patent/FR2958300B1/fr active Active
-
2011
- 2011-03-30 CN CN201180016583.1A patent/CN102822393B/zh active Active
- 2011-03-30 RU RU2012145547/02A patent/RU2553161C2/ru active
- 2011-03-30 US US13/637,854 patent/US20130008797A1/en not_active Abandoned
- 2011-03-30 JP JP2013501914A patent/JP5764650B2/ja active Active
- 2011-03-30 BR BR112012024387A patent/BR112012024387A2/pt not_active IP Right Cessation
- 2011-03-30 WO PCT/FR2011/050715 patent/WO2011121240A1/fr active Application Filing
- 2011-03-30 CA CA2794579A patent/CA2794579A1/fr not_active Abandoned
- 2011-03-30 EP EP11717696.6A patent/EP2553148B1/fr active Active
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2511395A (en) * | 1939-02-20 | 1950-06-13 | City Auto Stamping Co | Process for the electrodeposition of tin alloys |
US3470082A (en) * | 1965-09-22 | 1969-09-30 | Louis W Raymond | Electroplating method and system |
US4053383A (en) * | 1975-08-21 | 1977-10-11 | Siemens Aktiengesellschaft | Apparatus for electrodepositing aluminum |
US4721551A (en) * | 1986-11-06 | 1988-01-26 | The Regents Of The University Of California | Iridium treatment of neuro-stimulating electrodes |
US5102509A (en) * | 1988-09-07 | 1992-04-07 | Johnson Matthey Public Limited Company | Plating |
JPH04114566A (ja) * | 1990-09-04 | 1992-04-15 | Sharp Corp | テレビドアホン装置 |
US20030226764A1 (en) * | 2000-08-30 | 2003-12-11 | Moore Scott E. | Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces |
US20020104754A1 (en) * | 2001-02-06 | 2002-08-08 | Danny Wu | Electroplating apparatus for wheel disk |
US20040084316A1 (en) * | 2002-10-31 | 2004-05-06 | Renesas Technology Corp. | Plating apparatus and method |
JP2007262433A (ja) * | 2006-03-27 | 2007-10-11 | Teikoku Ion Kk | クロムめっき用ハイブリッド電極、それを用いたクロムメッキ方法及びクロムめっき装置 |
US20090038952A1 (en) * | 2007-08-09 | 2009-02-12 | Shinji Tachibana | Electrolytic copper plating process |
US20090050473A1 (en) * | 2007-08-20 | 2009-02-26 | Mitsutoshi Yahagi | Conducting belt for use with anode holder and anode holder |
US20090229986A1 (en) * | 2008-03-11 | 2009-09-17 | C. Uyemura & Co., Ltd. | Continuous copper electroplating method |
US20100006445A1 (en) * | 2008-04-18 | 2010-01-14 | Integran Technologies Inc. | Electroplating method and apparatus |
US20090272644A1 (en) * | 2008-04-30 | 2009-11-05 | Alcatel Lucent | Plating apparatus with direct electrolyte distribution system |
US20100041226A1 (en) * | 2008-08-18 | 2010-02-18 | Novellus Systems, Inc. | Process For Through Silicon Via Filing |
Non-Patent Citations (2)
Title |
---|
Hayashi, JP H04-114566, English Translation (1992). * |
Nakamura and Anpo, English abstract and Machine Translation, JP 2007-262433 A (2007). * |
Also Published As
Publication number | Publication date |
---|---|
RU2012145547A (ru) | 2014-05-10 |
EP2553148A1 (fr) | 2013-02-06 |
BR112012024387A2 (pt) | 2016-05-24 |
JP2013524011A (ja) | 2013-06-17 |
JP5764650B2 (ja) | 2015-08-19 |
RU2553161C2 (ru) | 2015-06-10 |
CA2794579A1 (fr) | 2011-10-06 |
WO2011121240A1 (fr) | 2011-10-06 |
CN102822393A (zh) | 2012-12-12 |
EP2553148B1 (fr) | 2014-01-08 |
FR2958300B1 (fr) | 2012-05-04 |
FR2958300A1 (fr) | 2011-10-07 |
CN102822393B (zh) | 2015-06-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: SNECMA, FRANCE Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LAGRANGE, FREDERIC;MOLET, HERVE;REEL/FRAME:029039/0024 Effective date: 20120816 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |
|
AS | Assignment |
Owner name: SAFRAN AIRCRAFT ENGINES, FRANCE Free format text: CHANGE OF NAME;ASSIGNOR:SNECMA;REEL/FRAME:046479/0807 Effective date: 20160803 |
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AS | Assignment |
Owner name: SAFRAN AIRCRAFT ENGINES, FRANCE Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE COVER SHEET TO REMOVE APPLICATION NOS. 10250419, 10786507, 10786409, 12416418, 12531115, 12996294, 12094637 12416422 PREVIOUSLY RECORDED ON REEL 046479 FRAME 0807. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME;ASSIGNOR:SNECMA;REEL/FRAME:046939/0336 Effective date: 20160803 |