US20130008797A1 - Device and process for controlling the efficiency of a metal electrodeposition bath - Google Patents

Device and process for controlling the efficiency of a metal electrodeposition bath Download PDF

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Publication number
US20130008797A1
US20130008797A1 US13/637,854 US201113637854A US2013008797A1 US 20130008797 A1 US20130008797 A1 US 20130008797A1 US 201113637854 A US201113637854 A US 201113637854A US 2013008797 A1 US2013008797 A1 US 2013008797A1
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United States
Prior art keywords
samples
bath
cathode
current
tank
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Abandoned
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US13/637,854
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English (en)
Inventor
Frederic Lagrange
Herve Molet
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Safran Aircraft Engines SAS
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SNECMA SAS
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Assigned to SNECMA reassignment SNECMA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LAGRANGE, FREDERIC, MOLET, HERVE
Publication of US20130008797A1 publication Critical patent/US20130008797A1/en
Assigned to SAFRAN AIRCRAFT ENGINES reassignment SAFRAN AIRCRAFT ENGINES CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: SNECMA
Assigned to SAFRAN AIRCRAFT ENGINES reassignment SAFRAN AIRCRAFT ENGINES CORRECTIVE ASSIGNMENT TO CORRECT THE COVER SHEET TO REMOVE APPLICATION NOS. 10250419, 10786507, 10786409, 12416418, 12531115, 12996294, 12094637 12416422 PREVIOUSLY RECORDED ON REEL 046479 FRAME 0807. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Assignors: SNECMA
Abandoned legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10Electrodes, e.g. composition, counter electrode
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10Electrodes, e.g. composition, counter electrode
    • C25D17/12Shape or form
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/12Process control or regulation
US13/637,854 2010-03-31 2011-03-30 Device and process for controlling the efficiency of a metal electrodeposition bath Abandoned US20130008797A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1052373 2010-03-31
FR1052373A FR2958300B1 (fr) 2010-03-31 2010-03-31 Dispositif pour controler des caracteristiques physiques d'un bain d'electrodeposition metallique.
PCT/FR2011/050715 WO2011121240A1 (fr) 2010-03-31 2011-03-30 Dispositif et procede pour controler l'efficacite d'un bain d'electrodeposition metallique

Publications (1)

Publication Number Publication Date
US20130008797A1 true US20130008797A1 (en) 2013-01-10

Family

ID=42751439

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/637,854 Abandoned US20130008797A1 (en) 2010-03-31 2011-03-30 Device and process for controlling the efficiency of a metal electrodeposition bath

Country Status (9)

Country Link
US (1) US20130008797A1 (fr)
EP (1) EP2553148B1 (fr)
JP (1) JP5764650B2 (fr)
CN (1) CN102822393B (fr)
BR (1) BR112012024387A2 (fr)
CA (1) CA2794579A1 (fr)
FR (1) FR2958300B1 (fr)
RU (1) RU2553161C2 (fr)
WO (1) WO2011121240A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020012144A (ja) * 2018-07-17 2020-01-23 株式会社ファシリティ 電解処理装置

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2511395A (en) * 1939-02-20 1950-06-13 City Auto Stamping Co Process for the electrodeposition of tin alloys
US3470082A (en) * 1965-09-22 1969-09-30 Louis W Raymond Electroplating method and system
US4053383A (en) * 1975-08-21 1977-10-11 Siemens Aktiengesellschaft Apparatus for electrodepositing aluminum
US4721551A (en) * 1986-11-06 1988-01-26 The Regents Of The University Of California Iridium treatment of neuro-stimulating electrodes
US5102509A (en) * 1988-09-07 1992-04-07 Johnson Matthey Public Limited Company Plating
JPH04114566A (ja) * 1990-09-04 1992-04-15 Sharp Corp テレビドアホン装置
US20020104754A1 (en) * 2001-02-06 2002-08-08 Danny Wu Electroplating apparatus for wheel disk
US20030226764A1 (en) * 2000-08-30 2003-12-11 Moore Scott E. Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
US20040084316A1 (en) * 2002-10-31 2004-05-06 Renesas Technology Corp. Plating apparatus and method
JP2007262433A (ja) * 2006-03-27 2007-10-11 Teikoku Ion Kk クロムめっき用ハイブリッド電極、それを用いたクロムメッキ方法及びクロムめっき装置
US20090038952A1 (en) * 2007-08-09 2009-02-12 Shinji Tachibana Electrolytic copper plating process
US20090050473A1 (en) * 2007-08-20 2009-02-26 Mitsutoshi Yahagi Conducting belt for use with anode holder and anode holder
US20090229986A1 (en) * 2008-03-11 2009-09-17 C. Uyemura & Co., Ltd. Continuous copper electroplating method
US20090272644A1 (en) * 2008-04-30 2009-11-05 Alcatel Lucent Plating apparatus with direct electrolyte distribution system
US20100006445A1 (en) * 2008-04-18 2010-01-14 Integran Technologies Inc. Electroplating method and apparatus
US20100041226A1 (en) * 2008-08-18 2010-02-18 Novellus Systems, Inc. Process For Through Silicon Via Filing

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2149344A (en) 1935-03-22 1939-03-07 Du Pont Apparatus and process for the study of plating solutions
SU127339A1 (ru) * 1953-04-02 1959-11-30 М.А. Гинцбург Линейный ускоритель элементарных частиц и ионов
US3132080A (en) * 1960-10-26 1964-05-05 Thompson Ramo Wooldridge Inc Electroplating method and apparatus
JPS5954568U (ja) * 1982-09-30 1984-04-10 富士通株式会社 電着めつき装置
SU1108130A1 (ru) * 1983-04-15 1984-08-15 Предприятие П/Я Г-4733 Устройство дл контрол травильной способности растворов
JPS63138246A (ja) * 1986-11-29 1988-06-10 Oki Electric Ind Co Ltd メツキ液撹拌状態試験方法
JPH0737680B2 (ja) * 1990-07-09 1995-04-26 株式会社アルメックス 給電方法
JPH04114566U (ja) * 1991-03-20 1992-10-08 アイシン精機株式会社 メツキ処理装置
JPH0741998A (ja) * 1993-07-29 1995-02-10 Kawasaki Steel Corp 鉄系電気めっき方法
US20040168925A1 (en) * 2002-10-09 2004-09-02 Uziel Landau Electrochemical system for analyzing performance and properties of electrolytic solutions
DE10323638B4 (de) * 2003-05-26 2006-11-23 Robert Bosch Gmbh Verfahren und Vorrichtung zur Entwicklung einer elektrochemischen Messanordnung
DE102004056158B3 (de) * 2004-11-17 2006-03-30 Siemens Ag Verfahren zum Überwachen eines elektrochemischen Behandlungsprozesses und für dieses Verfahren geeignete Elektrodenanordnung
US20060289299A1 (en) * 2005-06-22 2006-12-28 3M Innovative Properties Company Multi-channel current probe
EP1943832A2 (fr) * 2005-10-24 2008-07-16 Nxp B.V. Appareil de reajustement de mouvement a champ vectoriel de mouvement

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2511395A (en) * 1939-02-20 1950-06-13 City Auto Stamping Co Process for the electrodeposition of tin alloys
US3470082A (en) * 1965-09-22 1969-09-30 Louis W Raymond Electroplating method and system
US4053383A (en) * 1975-08-21 1977-10-11 Siemens Aktiengesellschaft Apparatus for electrodepositing aluminum
US4721551A (en) * 1986-11-06 1988-01-26 The Regents Of The University Of California Iridium treatment of neuro-stimulating electrodes
US5102509A (en) * 1988-09-07 1992-04-07 Johnson Matthey Public Limited Company Plating
JPH04114566A (ja) * 1990-09-04 1992-04-15 Sharp Corp テレビドアホン装置
US20030226764A1 (en) * 2000-08-30 2003-12-11 Moore Scott E. Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
US20020104754A1 (en) * 2001-02-06 2002-08-08 Danny Wu Electroplating apparatus for wheel disk
US20040084316A1 (en) * 2002-10-31 2004-05-06 Renesas Technology Corp. Plating apparatus and method
JP2007262433A (ja) * 2006-03-27 2007-10-11 Teikoku Ion Kk クロムめっき用ハイブリッド電極、それを用いたクロムメッキ方法及びクロムめっき装置
US20090038952A1 (en) * 2007-08-09 2009-02-12 Shinji Tachibana Electrolytic copper plating process
US20090050473A1 (en) * 2007-08-20 2009-02-26 Mitsutoshi Yahagi Conducting belt for use with anode holder and anode holder
US20090229986A1 (en) * 2008-03-11 2009-09-17 C. Uyemura & Co., Ltd. Continuous copper electroplating method
US20100006445A1 (en) * 2008-04-18 2010-01-14 Integran Technologies Inc. Electroplating method and apparatus
US20090272644A1 (en) * 2008-04-30 2009-11-05 Alcatel Lucent Plating apparatus with direct electrolyte distribution system
US20100041226A1 (en) * 2008-08-18 2010-02-18 Novellus Systems, Inc. Process For Through Silicon Via Filing

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Hayashi, JP H04-114566, English Translation (1992). *
Nakamura and Anpo, English abstract and Machine Translation, JP 2007-262433 A (2007). *

Also Published As

Publication number Publication date
RU2012145547A (ru) 2014-05-10
EP2553148A1 (fr) 2013-02-06
BR112012024387A2 (pt) 2016-05-24
JP2013524011A (ja) 2013-06-17
JP5764650B2 (ja) 2015-08-19
RU2553161C2 (ru) 2015-06-10
CA2794579A1 (fr) 2011-10-06
WO2011121240A1 (fr) 2011-10-06
CN102822393A (zh) 2012-12-12
EP2553148B1 (fr) 2014-01-08
FR2958300B1 (fr) 2012-05-04
FR2958300A1 (fr) 2011-10-07
CN102822393B (zh) 2015-06-10

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Owner name: SNECMA, FRANCE

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LAGRANGE, FREDERIC;MOLET, HERVE;REEL/FRAME:029039/0024

Effective date: 20120816

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION

AS Assignment

Owner name: SAFRAN AIRCRAFT ENGINES, FRANCE

Free format text: CHANGE OF NAME;ASSIGNOR:SNECMA;REEL/FRAME:046479/0807

Effective date: 20160803

AS Assignment

Owner name: SAFRAN AIRCRAFT ENGINES, FRANCE

Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE COVER SHEET TO REMOVE APPLICATION NOS. 10250419, 10786507, 10786409, 12416418, 12531115, 12996294, 12094637 12416422 PREVIOUSLY RECORDED ON REEL 046479 FRAME 0807. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME;ASSIGNOR:SNECMA;REEL/FRAME:046939/0336

Effective date: 20160803