US20120250282A1 - Fastening and electroconductive connecting of a chip module to a chip card - Google Patents

Fastening and electroconductive connecting of a chip module to a chip card Download PDF

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Publication number
US20120250282A1
US20120250282A1 US13/515,306 US201013515306A US2012250282A1 US 20120250282 A1 US20120250282 A1 US 20120250282A1 US 201013515306 A US201013515306 A US 201013515306A US 2012250282 A1 US2012250282 A1 US 2012250282A1
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United States
Prior art keywords
chip
elastomeric material
card body
card
chip module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/515,306
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English (en)
Inventor
Johannes Bader
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giesecke and Devrient Mobile Security GmbH
Original Assignee
Giesecke and Devrient GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giesecke and Devrient GmbH filed Critical Giesecke and Devrient GmbH
Assigned to GIESECKE & DEVRIENT GMBH reassignment GIESECKE & DEVRIENT GMBH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BADER, JOHANNES
Publication of US20120250282A1 publication Critical patent/US20120250282A1/en
Assigned to GIESECKE+DEVRIENT MOBILE SECURITY GMBH reassignment GIESECKE+DEVRIENT MOBILE SECURITY GMBH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GIESECKE & DEVRIENT GMBH
Abandoned legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Definitions

  • the present invention relates to a method for manufacturing a chip card by electroconductively connecting a chip module to a chip-card body, and to such a chip card.
  • a further disadvantage of such connections between chip module and chip-card body is the relatively fast solidification of the silicone, by which its adhesive properties are irrevocably lost, so that the chip module can only be placed contactingly onto the card body and not be applied adhesively.
  • a simultaneous applying of the silicone to the chip-card body and of the chip module to the not yet solidified silicone is impossible for process reasons, on the other hand.
  • the object of the present invention is hence to establish a lastingly robust, electroconductive connection between chip module and chip-card body.
  • a chip card is manufactured by incorporating a chip module into a chip-card body.
  • a chip module is connected electroconductively to a chip-card body.
  • the chip module according to the invention, is connected to the chip-card body adhesively by means of a thermoplastic, electroconductive elastomeric material such that the chip module is at the same time electroconductively connected to the at least one electrical contact area of the chip-card body.
  • each contact point there can respectively be produced for each contact point to be contacted two adhesive connections, namely that between the elastomeric material and the contact area, and that between elastomeric material and the chip module.
  • These adhesive connections as well as the elastomeric material are at the same time electroconductive.
  • the chip module is connected to the chip-card body adhesively by means of the elastomeric material such that the chip module is electroconductively connected to at least one electrical contact area.
  • a less flexible elastomeric material is sufficient for ensuring a stable electroconductive connection between chip module and contact area.
  • the essential criterion for the lastingness of the electroconductive connection is the strength of the adhesive connection.
  • a silicone, in particular a thermoplastic silicone, of average or low flexibility can be employed for a both-sided adhesive connection in order to flexibly compensate mechanical stresses, such as e.g. bends and twists.
  • thermoplastic elastomers guarantee a very high flexibility over a wide temperature range and over a long time period, so that a very robust electroconductive connection can be established between the chip module and the chip-card body with thermoplastic, electroconductive elastomers.
  • the chip card is a contactless chip card, i.e. a chip card with a contactless data transfer interface, or a dual interface chip card, i.e. a chip card with a contact-type and contactless data transfer interface, e.g. with an antenna set in the chip-card body.
  • the antenna is then connected to the chip module via the electroconductive, both-sided adhesive elastomeric material.
  • heated and melted elastomeric material can first be applied adhesively at least to one contact area of the chip-card body and solidify at least partly.
  • the already solidified elastomer can be heated and melted again at least partly and thus be made adhesive, and the chip module can be applied adhesively to the elastomeric material.
  • a chip-card body in which there is located a depression into which a chip module is inserted.
  • the depression there is located at least one contact area in order to establish an electroconductive connection to a corresponding contact area of the chip module, whereby the chip module has at least one contact area.
  • the elastomeric material is first heated and melted to a temperature at which it can enter into an adhesive connection with the contact areas of the chip-card body, and is then applied to the relevant contact areas. The elastomeric material then quickly cools and thereby solidifies at least partly. Subsequently, the chip module is so inserted that the elastomeric material touches contact areas of the chip module.
  • the elastomeric material is heated and melted again up to a suitable temperature through the chip-card body and/or the chip module, at least at those places on the surface where an adhesive connection to the contact areas of the chip module is to be established, so that a further adhesive connection is formed between the elastomeric material and the contact areas of the chip module.
  • an electroconductive connection is established between the contact areas of the chip module and the contact areas of the chip-card body.
  • the heated and melted elastomeric material is first applied to the chip module and solidifies there at least partly. After the chip module has been inserted into the chip-card body, the elastomer is partly heated and melted again through the chip module and/or the chip-card body in order to establish a further adhesive connection with the contact areas of the chip-card body.
  • the elastomeric material is thus first heated and melted to a temperature at which it can enter into an adhesive connection with the chip module, and then applied to the chip module, where it quickly cools and solidifies.
  • the elastomeric material is, at an almost arbitrary later time, heated and melted again to a suitable temperature through the chip module and/or the chip-card body, at least at those places on the surface where it is to enter into an adhesive connection with the chip-card body, in order to establish a further adhesive connection to the contact areas of the chip-card body.
  • electroconductive connection between the chip module and the contact area of the chip-card body via the electroconductive elastomeric material.
  • the elastomeric material is preferably applied adhesively with a conventional metering unit for hot-melt adhesives (“hot melts”) or an injection molding machine.
  • hot melts hot-melt adhesives
  • the elastomeric material can also be made available in the form of a foil.
  • the latter is preferably heated and melted to a temperature that is suitable for forming a corresponding adhesive connection, and then first applied adhesively to the contact areas of the chip-card body or to the contact areas of the chip module.
  • the chip module is then inserted into the chip-card body, and a further adhesive connection to the contacts of the chip module or of the chip-card body is established by repeated heating and melting of the elastomeric material through the chip-card body and/or the chip module.
  • thermoplastic electroconductive elastomeric material there comes into consideration in particular an elastomeric material with electroconductive filler.
  • a thermoplastic silicone in particular a silicone of the type GENIOMER ⁇ from Wacker Chemie AG, to which an electroconductive filler is preferably added.
  • the elastomeric material provides the necessary adhesion, is sufficiently stable and long-lived and possesses a relatively uniform elasticity over a wide temperature range and a long life.
  • an elastomeric material of the GENIOMER ⁇ type possesses a wide temperature range and a very good elasticity in particular also at low temperatures.
  • an elastomeric material that can enter into an adhesive connection with the chip module and/or the chip-card body, upon adhesive connecting of the chip module on the chip-card body, at temperatures that lie below a maximum temperature load on the chip module and/or the chip-card body. This avoids damaging of the chip module or the chip-card body by the new heating and adhesive applying of the heated and melted elastomeric material.
  • an elastomeric material wherein the mechanical loading capacity of the adhesive connection between the chip module and the chip-card body is optimized.
  • an elastomeric material to which one or several suitable additives are admixed.
  • an adhesion promoter so-called primer
  • a primer can be applied on the surface of the contacts of chip module and/or chip-card body.
  • FIG. 1 a chip card according to the invention
  • FIG. 2 steps of a method sequence for manufacturing the chip card according to FIG. 1 ;
  • FIG. 3 steps of an alternative method sequence for manufacturing the chip card according to FIG. 1 .
  • FIG. 1 shows schematically such a chip card 1 with a chip module 6 which is connected adhesively to the chip-card body 2 by means of a thermoplastic, electroconductive elastomeric material 5 , whereby the chip module 6 is conductively connected by the elastomeric material 5 at the same time to the electrical contact areas 2 b of the chip-card body 2 .
  • the chip-card body 2 of the chip card 1 is constructed according to FIG. 1 from different layers indicated by parallel lines.
  • an antenna layer 2 a which can be realized e.g. as an imprinted coil, i.e. as an electroconductive imprint in the form of a coil serving as an antenna, or the like.
  • the chip-card body 2 possesses a recess 4 (cf. FIGS. 2 a to 2 c ) into which the chip module 6 is inserted.
  • the flex bumps 5 are connected adhesively and at the same time electroconductively to contact areas 2 b of the coil layer 2 a of the chip-card body 2 and the chip module 6 , and thereby simultaneously ensure an adhesive and an electroconductive connection between these two components 2 b, 6 .
  • the contact areas 2 b of the coil layer 2 a represent the accessible places of the coil layer 2 a which are formed in the chip-card body 2 by deeper recesses at various points.
  • the contact areas 2 b can also be specially configured, e.g. be provided with an especially highly electroconductive coating, or the like.
  • the contact areas 2 b, as contact areas of the chip-card body 2 need not be connected electroconductively to a coil layer 2 a, but can be connected electroconductively to arbitrary electrical components of the chip-card body 2 , e.g. to a current source.
  • the flex bumps 5 can be connected adhesively not only to the contact areas 2 b but also to further places of the chip-card body 2 in order to produce an especially robust adhesive connection.
  • the contact area 2 b forms only a part of the area with which the flex bump 5 is adhesively connected to the chip-card body 2 .
  • the chip module 6 To activate the coil layer 2 a or, in the general case, the corresponding electrical component of the chip-card body 2 , the chip module 6 likewise possesses contact areas (not represented) which are connected by the flex bumps 5 suitably to the coil layer 2 a or, in the general case, to the corresponding electrical component of the chip-card body 2 .
  • the chip-card body 2 of the chip card 1 is particularly preferably configured in a format according to ISO 7816.
  • the chip card 1 is a chip card 1 with a contactless interface, e.g. a dual interface chip card with a contactless and contact-type interface for data transfer.
  • FIG. 2 illustrates a preferred method sequence for manufacturing the chip card 1 of FIG. 1 .
  • a suitable chip-card body 2 which is of multilayer construction and comprises an antenna layer 2 a.
  • the chip-card body 2 there is provided a recess 4 for insertion of a chip module 6 , whereby via the recess 4 the contact areas 2 b of the antenna layer 2 a are accessible through deeper recesses at various points.
  • FIG. 2 b shows how the heated and melted elastomeric material 5 is applied to the contact area 2 b by means of the application tool 10 after being previously heated and melted to a temperature at which it can enter into a conductive connection with the contact areas 2 b.
  • the elastomeric material 5 is suitably metered and applied in a sufficiently precisely defined form in order to avoid e.g. short circuits.
  • the elastomeric material 5 can also be made available in the form of a foil, heated and melted and then applied. Through the applying of the heated and melted elastomeric material 5 there arises an adhesive connection of the elastomeric material 5 to the contact area 2 b.
  • the applied elastomeric material 5 cools and solidifies at least partly, so that it cannot enter into any further adhesive connection.
  • the chip module 6 is incorporated into the recess 4 such that the electroconductive elastomeric material 5 lies opposite the chip module 6 in the form of flex bumps, see FIG. 2 c.
  • the applied elastomeric material 5 is, in FIG. 2 d, heated and melted again through the chip module 6 with a heating tool 11 at an almost arbitrary later time.
  • the elastomeric material can also be heated and melted through the chip-card body 2 .
  • FIG. 3 shows an alternative method for manufacturing the chip card 1 represented in FIG. 1 .
  • This method differs from the method represented in FIG. 2 in that the heated and melted elastomeric material 5 is not applied with the application tool 10 to the contact areas 2 b of the chip-card body 2 , as in FIG. 2 b, but to the chip module 6 , as represented in FIG. 3 a.
  • the metering and shaping of the elastomeric material can be effected as described in connection with FIG. 2 b.
  • the elastomeric material can also alternatively be made available in the form of a foil, heated and melted and then applied.
  • the temperature of the heated and melted elastomeric material 5 is chosen such that it enters into an adhesive connection with the chip module 6 and does not damage the chip module 6 .
  • the chip module 6 with the elastomeric material 5 in the form of flex bumps is inserted into the chip-card body 2 , so that the flex bumps 5 and the contact areas 2 b of the coil layer 2 a oppose each other.
  • the cooled and at least partly solidified elastomeric material is heated and melted again through the chip module 6 to a suitable temperature, in order that it can enter into an adhesive connection with the contact areas 2 b of the chip-card body 2 .
  • the elastomeric material can also be heated and melted through the chip-card body 2 . This causes, in analogy to the method represented in FIG.
  • the chip card 1 produced by this alternative method is represented in FIG. 3 c and corresponds to the chip card 1 represented in FIG. 2 d and FIG. 1 .
  • an elastomeric material 5 that can enter into an adhesive connection with the chip module 6 and/or the chip-card body 2 at temperatures that lie below a maximum temperature load on the chip module 6 and/or the chip-card body 2 .
  • the maximum temperature load is normally not the same for the total chip module 6 or the total chip-card body 2 , not the total chip module 6 or the total chip-card body 2 needs to be able to withstand the temperature of the heated and melted elastomeric material 5 , but preferably only those parts that come into contact with the heated elastomeric material 5 or lie in the proximity thereof.
  • a chip protected by the housing of the chip module 6 must for example only withstand an accordingly lower temperature load, which depends on different parameters, such as e.g.
  • the amount of applied heated and melted elastomeric material 5 is the amount of applied heated and melted elastomeric material 5 .
  • the elastomeric material 5 can enter into an adhesive connection with the chip module 6 and/or the chip-card body 2 at temperatures that lie below a maximum temperature load on the chip module 6 and/or the chip-card body 2 .
  • an application tool 10 there can be used for both methods a conventional metering unit for hot-melt adhesives (“hot melts”) or an injection molding machine If such a metering unit for hot-melt adhesives is employed, one must make sure that the heated and melted elastomeric material 5 to be applied has a sufficient homogeneity in order for it to be processable without defects.
  • a conventional metering unit for hot-melt adhesives (“hot melts”) or an injection molding machine
  • an injection molding machine there is preferably employed a machine that works in the vertical direction, i.e. that applies the elastomeric material 5 in the vertical direction (in particular from above).
  • thermoplastic electroconductive elastomeric material 5 there comes into consideration in both methods in particular an elastomeric material 5 with electroconductive filler.
  • thermoplastic silicone in particular a silicone of the type GENIOMER ⁇ from Wacker Chemie AG, to which an electroconductive filler is preferably added.
  • the strength of the adhesive connection of the elastomeric material 5 to the chip module 6 and the chip-card body 2 can be optimized in both methods, in particular by optimizing the elastomeric material 5 .
  • the condition of the corresponding surfaces of the chip module 6 and of the chip-card body 2 (in particular of the contact areas 2 b of the chip-card body 2 ) can be optimized, for example again by a corresponding additive and/or by applying an adhesion promoter.
  • the chip-card bodies 2 are preferably automatically supplied with the application tool 10 and/or the heating tool 11 and/or further tools or machines, and withdrawn therefrom, either in line, i.e. e.g. by assembly line, or also individually, i.e. e.g. by means of a robot.
  • the method of the invention is suitable not only for adhesive connecting with simultaneous electroconductive contacting of a chip-card module 6 to a chip-card body 2 , but also for adhesive connecting with simultaneous electroconductive contacting of other components, in particular arbitrary portable data carriers with chip modules and/or other components.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Adhesives Or Adhesive Processes (AREA)
US13/515,306 2009-12-16 2010-12-13 Fastening and electroconductive connecting of a chip module to a chip card Abandoned US20120250282A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009058435.8 2009-12-16
DE102009058435A DE102009058435A1 (de) 2009-12-16 2009-12-16 Befestigen und elektrisch leitendes Verbinden eines Chipmoduls mit einer Chipkarte
PCT/EP2010/007580 WO2011082765A1 (fr) 2009-12-16 2010-12-13 Fixation et raccordement électroconducteur d'un module de puce à une carte à puce

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2010/007580 A-371-Of-International WO2011082765A1 (fr) 2009-12-16 2010-12-13 Fixation et raccordement électroconducteur d'un module de puce à une carte à puce

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US16/750,749 Continuation US11055596B2 (en) 2009-12-16 2020-01-23 Method of fastening and electroconductive connecting a chip module to a chip card

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Publication Number Publication Date
US20120250282A1 true US20120250282A1 (en) 2012-10-04

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US13/515,306 Abandoned US20120250282A1 (en) 2009-12-16 2010-12-13 Fastening and electroconductive connecting of a chip module to a chip card
US16/750,749 Active US11055596B2 (en) 2009-12-16 2020-01-23 Method of fastening and electroconductive connecting a chip module to a chip card

Family Applications After (1)

Application Number Title Priority Date Filing Date
US16/750,749 Active US11055596B2 (en) 2009-12-16 2020-01-23 Method of fastening and electroconductive connecting a chip module to a chip card

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US (2) US20120250282A1 (fr)
EP (1) EP2513845B1 (fr)
CN (1) CN102652320B (fr)
DE (1) DE102009058435A1 (fr)
ES (1) ES2440774T3 (fr)
WO (1) WO2011082765A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10355371B2 (en) 2017-03-03 2019-07-16 Microsoft Technology Licensing, Llc Flexible conductive bonding

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012211546B4 (de) 2012-07-03 2017-02-16 Morpho Cards Gmbh Chipkarte mit bei Raumtemperatur pastenförmiger oder flüssiger Kontaktierung
RU2607725C1 (ru) * 2015-08-06 2017-01-10 Общество с ограниченной ответственностью "Интеллектуальные Системы Управления Бизнесом" Смарт-карта с двойным интерфейсом и способ ее изготовления
RU2629143C1 (ru) * 2016-07-21 2017-08-24 Общество с ограниченной ответственностью "Интеллектуальные Системы Управления Бизнесом" Пластиковый брелок с полноцветной печатью, оснащенный встроенной RFID-меткой, и способ его изготовления

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5666270A (en) * 1993-10-18 1997-09-09 Fujitsu Limited Bump electrode, semiconductor integrated circuit device using the same, multi-chip module having the semiconductor integrated circuit devices and method for producing semicondutcor device having the bump electrode
US6161761A (en) * 1998-07-09 2000-12-19 Motorola, Inc. Card assembly having a loop antenna formed of a bare conductor and method for manufacturing the card assembly
US6390375B2 (en) * 1999-11-29 2002-05-21 Ask S.A. Contactless or hybrid contact-contactless smart card designed to limit the risks of fraud
US6403226B1 (en) * 1996-05-17 2002-06-11 3M Innovative Properties Company Electronic assemblies with elastomeric members made from cured, room temperature curable silicone compositions having improved stress relaxation resistance
US6536674B2 (en) * 1999-11-29 2003-03-25 Ask S.A. Process for manufacturing a contactless smart card with an antenna support made of fibrous material
US6568600B1 (en) * 1999-01-19 2003-05-27 Bull Cp8 Chip card equipped with a loop antenna, and associated micromodule
US20040031855A1 (en) * 2002-07-02 2004-02-19 Konica Corporation IC card
US20090090494A1 (en) * 2005-02-18 2009-04-09 Ebm-Papst St. Georgen Gmbh & Co. Kg Heat exchanger

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69426347T2 (de) * 1993-09-29 2001-05-17 Matsushita Electric Ind Co Ltd Verfahren zum Montieren einer Halbleiteranordnung auf einer Schaltungsplatte und eine Schaltungsplatte mit einer Halbleiteranordnung darauf
US5519201A (en) * 1994-04-29 1996-05-21 Us3, Inc. Electrical interconnection for structure including electronic and/or electromagnetic devices
DE4443980C2 (de) 1994-12-11 1997-07-17 Angewandte Digital Elektronik Verfahren zur Herstellung von Chipkarten und Chipkarte hergestellt nach diesem Verfahren
EP0827632B1 (fr) * 1995-05-22 2002-01-09 Hitachi Chemical Co., Ltd. Dispositif a semi-conducteurs dont la puce a semi-conducteurs est en connexion electrique avec un substrat de cablage
US6635514B1 (en) * 1996-12-12 2003-10-21 Tessera, Inc. Compliant package with conductive elastomeric posts
DE19703990A1 (de) 1997-02-03 1998-08-06 Giesecke & Devrient Gmbh Modular aufgebauter, elektronischer Datenträger
US6064120A (en) * 1997-08-21 2000-05-16 Micron Technology, Inc. Apparatus and method for face-to-face connection of a die face to a substrate with polymer electrodes
EP1102823B1 (fr) * 1998-07-04 2005-07-27 tesa AG Film adhesif electroconducteur, thermoplastique et thermo-activable
DE69927342T2 (de) * 1998-07-08 2006-06-22 Dai Nippon Printing Co., Ltd. Kontaktlose chipkarte und verfahren zu ihrer herstellung
CN1146030C (zh) * 1998-07-28 2004-04-14 精工爱普生株式会社 半导体装置及其制造方法、半导体模块、电路基板以及电子装置
EP1156520A4 (fr) * 1999-01-29 2004-08-25 Matsushita Electric Ind Co Ltd Procede et dispositif de montage de pieces electroniques
JP2001323246A (ja) * 2000-03-07 2001-11-22 Sony Chem Corp 電極接続用接着剤及びこれを用いた接着方法
EP1187518A3 (fr) * 2000-09-07 2004-09-01 Matsushita Electric Industrial Co., Ltd. Agent adhésif conducteur, structure d'empaquetage, et procédé de fabrication de cette structure
JP2002151551A (ja) * 2000-11-10 2002-05-24 Hitachi Ltd フリップチップ実装構造、その実装構造を有する半導体装置及び実装方法
JP3922882B2 (ja) * 2000-12-28 2007-05-30 東レエンジニアリング株式会社 チップの実装方法
US6800169B2 (en) * 2001-01-08 2004-10-05 Fujitsu Limited Method for joining conductive structures and an electrical conductive article
US20020189091A1 (en) * 2001-06-19 2002-12-19 Advanced Semiconductor Engineering, Inc. Method of making printed circuit board
JP2003108958A (ja) * 2001-09-28 2003-04-11 Konica Corp Ｉｃカード及びｉｃカードの製造方法
US6665193B1 (en) * 2002-07-09 2003-12-16 Amerasia International Technology, Inc. Electronic circuit construction, as for a wireless RF tag
KR20050040812A (ko) * 2002-09-18 2005-05-03 가부시키가이샤 에바라 세이사꾸쇼 본딩물질 및 본딩방법
US7524748B2 (en) 2003-02-05 2009-04-28 Senju Metal Industry Co., Ltd. Method of interconnecting terminals and method of mounting semiconductor devices
US7410825B2 (en) * 2005-09-15 2008-08-12 Eastman Kodak Company Metal and electronically conductive polymer transfer
US20080051524A1 (en) * 2006-08-28 2008-02-28 Henkel Corporation Epoxy-Based Compositions Having Improved Impact Resistance

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5666270A (en) * 1993-10-18 1997-09-09 Fujitsu Limited Bump electrode, semiconductor integrated circuit device using the same, multi-chip module having the semiconductor integrated circuit devices and method for producing semicondutcor device having the bump electrode
US6403226B1 (en) * 1996-05-17 2002-06-11 3M Innovative Properties Company Electronic assemblies with elastomeric members made from cured, room temperature curable silicone compositions having improved stress relaxation resistance
US6161761A (en) * 1998-07-09 2000-12-19 Motorola, Inc. Card assembly having a loop antenna formed of a bare conductor and method for manufacturing the card assembly
US6568600B1 (en) * 1999-01-19 2003-05-27 Bull Cp8 Chip card equipped with a loop antenna, and associated micromodule
US6390375B2 (en) * 1999-11-29 2002-05-21 Ask S.A. Contactless or hybrid contact-contactless smart card designed to limit the risks of fraud
US6536674B2 (en) * 1999-11-29 2003-03-25 Ask S.A. Process for manufacturing a contactless smart card with an antenna support made of fibrous material
US20040031855A1 (en) * 2002-07-02 2004-02-19 Konica Corporation IC card
US20090090494A1 (en) * 2005-02-18 2009-04-09 Ebm-Papst St. Georgen Gmbh & Co. Kg Heat exchanger

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10355371B2 (en) 2017-03-03 2019-07-16 Microsoft Technology Licensing, Llc Flexible conductive bonding

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US20200160138A1 (en) 2020-05-21
EP2513845B1 (fr) 2013-11-06
US11055596B2 (en) 2021-07-06
EP2513845A1 (fr) 2012-10-24
WO2011082765A1 (fr) 2011-07-14
ES2440774T3 (es) 2014-01-30
DE102009058435A1 (de) 2011-06-22
CN102652320A (zh) 2012-08-29

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