CN101589403A - Rfid系统的芯片模块 - Google Patents

Rfid系统的芯片模块 Download PDF

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CN101589403A
CN101589403A CNA2007800410979A CN200780041097A CN101589403A CN 101589403 A CN101589403 A CN 101589403A CN A2007800410979 A CNA2007800410979 A CN A2007800410979A CN 200780041097 A CN200780041097 A CN 200780041097A CN 101589403 A CN101589403 A CN 101589403A
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rfid
antenna
coupled
chip module
chip
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M·博恩
H·尼奇科
K·沙夫拉特
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Bielomatik Leuze GmbH and Co KG
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/04—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07756—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being non-galvanic, e.g. capacitive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Details Of Aerials (AREA)
  • Credit Cards Or The Like (AREA)
  • Support Of Aerials (AREA)

Abstract

本发明涉及一种用于RFID系统、特别是用于RFID标签的芯片模块，在RFID标签中使用的耦合标签，RFID标签的RFID内嵌件，以及在使用RFID内嵌件的情况下制造的RFID标签，在条状承载材料(5、8)上、特别是在承载薄膜上设置RFID芯片(3)和与RFID芯片(3)导电连接、特别是电流连接的耦合天线(4)。

Description

RFID系统的芯片模块
技术领域
本发明涉及一种用于RFID系统、特别是用于RFID标签的芯片模块，在RFID标签中使用的耦合标签，RFID标签的RFID内嵌件，以及在使用RFID内嵌件的情况下制造的RFID标签(智能标签)。
背景技术
在制造RFID标签时，公知使用具有RFID微芯片和导电连接触点的芯片模块，它们利用导电连接触点与RFID天线连接。WO 2005/076206介绍了一种RFID标签的连续制造方法，其中芯片模块以其远离连接触点的背面安装在粘附膜段上，其基面分别明显大于每个芯片模块的基面。芯片模块的导电连接触点与天线连接端子相接触，其中粘附膜段与天线薄膜段这样平面连接，使芯片模块相对于天线连接端子固定定位。
已知这样制造RFID标签，使所谓的RFID内嵌件设置在底面上具有粘接剂层的条状覆盖材料与可从粘接剂层上揭下、同样为条状的承载材料之间。RFID内嵌件包括固定在平面天线上并与该天线电流连接的RFID芯片，其中RFID天线设置在天线薄膜上。
已知将用于加工的芯片模块成行依次固定在条上，这样在加工时输送到RFID天线。然后将每个微芯片连同其两个连接触点从条上取下并这样固定粘贴在RFID天线上，使其连接触点与RFID天线的触点电流接触。
在该步骤中，要求将芯片模块非常精确地在RFID天线上定位，以产生电流接触。
发明内容
因此本发明的目的在于提供一种芯片模块，其按照简单的方式与RFID天线产生接触。
该目的根据本发明由此得以实现，即在条状或者弧状承载材料上、特别是在承载薄膜上设置RFID芯片和与RFID芯片导电连接、特别是电流连接的耦合天线。
耦合天线能够与RFID天线产生电感连接。电感连接可以通过耦合天线和RFID天线的相应构造简单地产生，而无需二者非常精确地彼此定位，特别是在RFID天线的耦合区宽于耦合天线的耦合区的情况下。芯片模块可以以规定的距离粘贴在RFID天线的相应位置上，该距离通过承载薄膜和粘接剂层的厚度来确定。
此外的优点是，RFID芯片可以简单地设置在耦合天线上，而无需以后与RFID天线相连接的复杂连接触点。
RFID天线可以具有优点地作为平面状、例如蚀刻或者印刷天线由常用的天线材料制造，并具有优点地设置在承载薄膜、特别是粘附材料上。
具有优点的是，用根据本发明的芯片模块可以制造所谓的耦合标签，其在以后制造RFID系统、特别是RFID标签、RFID标记或者RFID票据时使用。在耦合标签中，芯片模块承载薄膜的底面具有胶粘剂层，其由可揭下的条状或者孤状的隔离材料覆盖。
这里耦合标签具有优点的是可以用多个依次间隔设置的芯片模块制造或条形。在制造RFID系统时，将它们这样成条输送到各自的RFID天线内，以条形固定在同样成条设置的天线上，或者将其与条分开并单个粘贴在天线上。
如果用耦合标签制造RFID标签，那么优选首先制造所谓的RFID内嵌件。RFID内嵌件由平面状的RFID天线组成，其优选设置在天线薄膜上，在其上面依据本发明的芯片模块以其承载薄膜这样定位粘贴，使耦合天线和RFID天线电感耦合。优选天线薄膜在其背面上具有由隔离材料覆盖的粘接剂层。RFID标签然后这样制造，使依据本发明的RFID内嵌件设置在条状或者弧状、底面上具有粘接剂层的覆盖材料与可从粘接剂层揭下的条状或者孤状的承载材料之间，以便将其与粘贴的标签分开。覆盖材料可以印刷在其上面或者以其他图形构成。
具有优点的是，依据本发明的芯片模块也可以在其他RFID系统中使用。这样可以将耦合标签粘贴RFID天线上，RFID天线例如通过印刷安装在包装材料上。耦合天线然后与包装材料的RFID天线(6)电感耦合(智能盒)。
附图说明
下面借助简化示出的实施例对本发明进行详细说明。
图1示出单个耦合标签及各自的芯片模块及其在用于制造RFID内嵌件的天线上的定位；
图2示出RFID内嵌件，向其输送条形的耦合标签；
图3示出RFID内嵌件的剖面。
具体实施方式
图1示出两个耦合标签1，它们分别包括芯片模块2及RFID芯片3。RFID芯片3设置在耦合天线4上并与其导电连接、特别是电流连接。具有RFID芯片3的耦合天线4设置在条状或者弧状的承载材料上，特别是承载薄膜5上。如图1至3所示，优选RFID芯片3直接固定在构造成平面状的耦合天线4上并与其电流连接。为产生自粘贴的耦合标签，芯片模块2的承载薄膜5的底面具有胶粘剂层9，其由可揭下的条状或者弧状的隔离材料11覆盖。这样耦合标签1可以在揭下隔离材料11后粘贴在RFID天线6上。这里粘贴上的耦合天线4具有与RFID天线6精确确定的距离。该距离这样选择，使耦合天线4和RFID天线6电感耦合。该距离可以通过承载薄膜5及其胶粘剂层9的厚度精确调整。优选每个RFID天线6设置在天线薄膜7上。如图1和2所示，具有优点的是，多个RFID天线6彼此间隔设置在条状的天线薄膜7上，以产生相互连接的RFID内嵌件，可以简单地对其进行进一步处理。
优选RFID天线6的耦合区6.1宽于耦合天线4的耦合区4.1。由此产生一定的间隙，以使耦合天线4的耦合区4.1在RFID天线6的耦合区6.1上定位。这样在制造RFID内嵌件时，为耦合标签1在天线6上的定位形成间隙。
在图1所示的方法中，将耦合标签1及芯片模块2分别单独输送到RFID天线6。在揭下底面上各自的隔离膜后，露出承载薄膜5的胶粘剂层9，并分别将芯片模块2粘贴在RFID天线6上。
如图2所示，同样可以将一行芯片模块2彼此间隔设置在条状的承载薄膜8上。这里芯片模块2彼此的间距与承载薄膜7上RFID天线6的距离一致。在将隔离材料从底面上揭下后，露出承载薄膜8上的胶粘剂层，并将仍处于一个共用承载薄膜8上的芯片模块2连续粘贴到天线6上。分成单个的RFID内嵌件随后通过各天线6之间的截面进行，其中，在按照图1的方法中仅断开天线薄膜7。在按照图2的方法中，天线薄膜7和承载薄膜8分别共同断开。
RFID天线6同样可以直接设置在包装材料、例如折叠盒上，尤其是作为印刷的天线，将耦合标签1粘贴到该天线上(智能盒)。
图3示意示出依据本发明的RFID内嵌件的结构。RFID芯片3直接固定在耦合天线4上。耦合天线4位于承载材料5的表面，该承载材料在其底面具有胶粘剂层9。利用胶粘剂层9将承载材料5连同位于其上的耦合天线和芯片3固定粘贴在RFID天线6上。根据使用目的，RFID天线6为HF或者UHF天线。RFID天线6固定在天线薄膜7的表面上，而天线薄膜7在其底面上具有粘接剂层10，其由可揭下的隔离材料11，例如硅载体覆盖。
为制造RFID标签，将图3中所示的RFID内嵌件设置在条状或者孤状的覆盖材料与同样为条状或者弧状的承载材料之间。通常印刷在表面上的覆盖材料在其底面上具有粘接剂层，在其上面粘贴可揭下的承载材料。为了将RFID内嵌件装在覆盖材料与标签的承载材料之间，揭下承载材料并在将RFID内嵌件固定粘贴在粘接剂层上之后重新放上承载材料。事先去除RFID内嵌件的隔离材料11，从而在例如由硅纸组成的RFID标签承载材料的下面存在一个连续的粘贴层。这样构成的RFID标签在揭下承载材料后可以粘贴在物品或包装上。

Claims (8)

1.用于RFID系统、特别是用于RFID标签的芯片模块，其特征在于，在条状承载材料(5、8)上、特别是在承载薄膜上设置RFID芯片(3)和与RFID芯片(3)导电连接、特别是电流连接的耦合天线(4)。
2.如权利要求1所述的芯片模块，其特征在于，所述RFID芯片(3)直接固定在构造成平面状的耦合天线(4)上。
3.特别是在RFID标签中使用的自粘贴耦合标签，其特征在于，如权利要求1或2所述的芯片模块的承载薄膜(5、8)的底面具有胶粘剂层(9)，该胶粘剂层由可揭下的条状或者弧状的隔离材料覆盖。
4.用于FRID标签的RFID内嵌件，其特征在于，如权利要求1或2所述的芯片模块(2)以其承载薄膜(5、8)定位粘贴在平面状的RFID天线(6)上，使耦合天线(4)和RFID天线(6)电感耦合。
5.如权利要求4所述的RFID内嵌件，其特征在于，平面状的RFID天线(6)设置在天线薄膜(7)上，该天线薄膜在其背面具有由隔离材料(11)覆盖的粘接剂层(10)。
6.如权利要求4或5所述的RFID内嵌件，其特征在于，RFID天线(6)的耦合区(6.1)宽于耦合天线(4)的耦合区(4.1)。
7.FRID标签，其特征在于，如权利要求4至6中任一项所述的RFID内嵌件设置在条状或者弧状、底面上具有粘接剂层的覆盖材料与可从粘接剂层揭下的条状或者弧状的承载材料之间。
8.RFID系统，其特征在于，如权利要求3所述的耦合标签(1)被粘贴在包装材料的RFID天线(6)上，该耦合标签的耦合天线(4)与包装材料的RFID天线(6)电感耦合。
CNA2007800410979A 2006-11-06 2007-10-16 Rfid系统的芯片模块 Pending CN101589403A (zh)

Applications Claiming Priority (2)

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DE102006052517A DE102006052517A1 (de) 2006-11-06 2006-11-06 Chipmodul für ein RFID-System
DE102006052517.5 2006-11-06

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AU (1) AU2007316980A1 (zh)
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DE (1) DE102006052517A1 (zh)
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