US20120193794A1 - Semiconductor device and method of fabricating the same - Google Patents
Semiconductor device and method of fabricating the same Download PDFInfo
- Publication number
- US20120193794A1 US20120193794A1 US13/443,442 US201213443442A US2012193794A1 US 20120193794 A1 US20120193794 A1 US 20120193794A1 US 201213443442 A US201213443442 A US 201213443442A US 2012193794 A1 US2012193794 A1 US 2012193794A1
- Authority
- US
- United States
- Prior art keywords
- conductive plate
- interconnection
- insulation layer
- electrically connected
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
- H01L21/76816—Aspects relating to the layout of the pattern or to the size of vias or trenches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
Definitions
- the present disclosure is related to a semiconductor device, more specifically, a semiconductor device including capacitors having high capacitance and method of fabricating the same.
- a method of realizing a high-capacity capacitor for an analogue circuit and radio frequency (RF) device requiring high-speed operation is being developed.
- the lower electrode and upper electrode of a capacitor are made of doped polysilicon, however, oxidation occurs in the interface between the lower electrode and the dielectric layer, and in the interface between the dielectric layer and the upper electrode, to form a natural oxide layer. This causes a decrease of capacitance.
- MIM capacitor metal-insulator-metal capacitor
- An MIM capacitor has only a small specific resistance and has no parasitic capacitance resulting from inner depletion. Therefore, the MIM capacitor is typically used in high-performance semiconductor devices.
- PIP poly-insulator-poly
- an MIM capacitor causes less difference in capacitance when varied according to frequency. Therefore, an MIM capacitor is widely used in analog-to-digital converters (ADC), high-frequency devices, switching capacitor filters, and CMOS image sensors, for example.
- ADC analog-to-digital converters
- ADC analog-to-digital converters
- switching capacitor filters switching capacitor filters
- CMOS image sensors for example.
- FIG. 1A illustrates a cross-sectional view showing a portion of a conventional MIM capacitor
- FIG. 1B illustrates a circuit diagram of the capacitor of FIG. 1A .
- a lower electrode 30 and an upper electrode 40 are disposed on a semiconductor substrate 10 having a bottom interconnection 26 .
- a dielectric 38 is interposed between the lower electrode 30 and the upper electrode 40 .
- a first insulation layer 28 is disposed between the lower electrode 30 and the semiconductor substrate 10 , and a second insulation layer 48 is disposed on the first insulation layer 28 .
- First, second and third top interconnections 52 , 54 and 56 are disposed in the second insulation layer 48 .
- the first top interconnection 52 is electrically connected to the upper electrode 40 through a first contact 53
- the second top interconnection 54 is electrically connected to the lower electrode 30 through a second contact 55 .
- the third top interconnection 56 is electrically connected to the bottom interconnection 26 through a third contact 57 .
- the first top interconnection 52 is also electrically connected to a first external terminal A
- the second top interconnection 54 is electrically connected to a second external terminal B.
- the upper electrode 40 and the lower electrode 30 constitute a capacitor C 1 shown in FIG. 1B .
- a capacitance above a predetermined level is required for stable operation of a semiconductor device.
- much area the capacitor occupies decreases due to a continuous scaling down of the semiconductor device, thereby to cause a corresponding decrease of capacitance. Accordingly, a capacitor having a high capacitance in a limited area is demanded.
- a semiconductor device may comprise: a first conductive plate, a second conductive plate, a third conductive plate, and a fourth conductive plate stacked sequentially on a semiconductor substrate with an insulation layer interposed between the first and second conductive plates, between the second and third conductive plates, and between the third and fourth conductive plates, respectively, the first to fourth plates overlapping each other, wherein at least two of the first to fourth plates are electrically connected to each other and constitute at least two capacitors.
- a semiconductor device may comprise: a semiconductor substrate having a first conductive plate; a second conductive plate disposed with a first insulation layer interposed on the first conductive plate; a third conductive plate disposed with a second insulation layer interposed on the second conductive plate; and a fourth conductive plate disposed with a third insulation layer interposed on the third conductive plate, wherein the first conductive plate and the third conductive plate are electrically connected to each other, and the second conductive plate and the fourth conductive plate are electrically connected to each other, and the first conductive plate and the second conductive plate constitute a first capacitor, the second conductive plate and the third conductive plate constitute a second capacitor, and the third conductive plate and the fourth conductive plate constitute a third capacitor.
- a semiconductor device may comprise: a semiconductor substrate having a first conductive plate; a second conductive plate disposed with a first insulation layer interposed on the first conductive plate; a third conductive plate disposed with a second insulation layer interposed on the second conductive plate; and a fourth conductive plate disposed with a third insulation layer interposed on the third conductive plate, wherein the first conductive plate, the third conductive plate, and the fourth conductive plate are electrically connected, and the first conductive plate and the second conductive plate constitute a first capacitor, and the second conductive plate and the third conductive plate constitute a second capacitor.
- a semiconductor device may comprise: a semiconductor substrate having a first conductive plate; a second conductive plate disposed with a first insulation layer interposed on the first conductive plate; a third conductive plate disposed with a second insulation layer interposed on the second conductive plate; and a fourth conductive plate disposed with a third insulation layer interposed on the third conductive plate, wherein the first conductive plate, the second conductive plate, and the fourth conductive plate are electrically connected, and the second conductive plate and the third conductive plate constitute a first capacitor, and the third conductive plate and the fourth conductive plate constitute a second capacitor.
- a method of fabricating a semiconductor device may comprise: preparing a semiconductor substrate on which are formed a first conductive plate, a first bottom interconnection electrically connected to the first conductive plate, and a second bottom interconnection insulated from the first conductive plate; forming a second conductive plate with a first insulation layer interposed on the first conductive plate; forming a third conductive plate with a second insulation layer interposed on the second conductive plate; forming a third insulation layer on the semiconductor substrate; performing an etch process to form a first groove and a second groove, the first groove exposing the second bottom interconnection and the second conductive plate, and the second groove exposing the first bottom interconnection and the third conductive plate; and filling the first groove with conductive material to form a fourth conductive plate on the third conductive plate, wherein the first conductive plate and the third conductive plate are electrically connected, and the second conductive plate and the fourth conductive plate are electrically connected.
- a method of fabricating a semiconductor device may comprise: preparing a semiconductor substrate on which are formed a first conductive plate, a first bottom interconnection electrically connected to the first conductive plate, and a second bottom interconnection insulated from the first conductive plate; forming a second conductive plate with a first insulation layer interposed on the first conductive plate; forming a third conductive plate with a second insulation layer interposed on the second conductive plate; forming a third insulation layer on the semiconductor substrate; performing an etch process to form a first groove and a second groove, the first groove exposing the second bottom interconnection and the second conductive plate, and the second groove exposing the first bottom interconnection and the third conductive plate; and filling the first groove with conductive material to form a fourth conductive plate on the third conductive plate, wherein the first conductive plate, the third conductive plate and the fourth conductive plate are electrically connected.
- a method of fabricating a semiconductor device may comprise: preparing a semiconductor substrate on which are formed a first conductive plate, a first bottom interconnection electrically connected to the first conductive plate, and a second bottom interconnection insulated from the first conductive plate; forming a second conductive plate with a first insulation layer interposed on the first conductive plate; forming a third conductive plate with a second insulation layer interposed on the second conductive plate; forming a third insulation layer on the semiconductor substrate; performing an etch process to form a first groove and a second groove, the first groove exposing the second bottom interconnection and the third conductive plate, and the second groove exposing the first bottom interconnection and the second conductive plate; and filling the first groove with conductive material to form a fourth conductive plate on the third conductive plate, wherein the first conductive plate, the second conductive plate and the fourth conductive plate are electrically connected.
- FIG. 1A is a cross-sectional view of a semiconductor showing a conventional MIM capacitor
- FIG. 1B is a circuit diagram of the capacitor shown in FIG. 1A .
- FIG. 2 is a plan view illustrating a semiconductor device according to an exemplary embodiment of the present invention.
- FIG. 3A illustrates a cross-sectional view cut along line I-I′ of FIG. 2
- FIG. 3B is a circuit diagram of the capacitor shown in FIG. 3A .
- FIG. 4A is a cross-sectional view showing a semiconductor device of an exemplary embodiment of the present invention.
- FIG. 4B is a circuit diagram of the device shown in FIG. 4A .
- FIG. 5 is a plan view illustrating a semiconductor device according to an exemplary embodiment of the present invention.
- FIG. 6A illustrates a cross-sectional view cut along line II-II′ of FIG. 5
- FIG. 6B is a circuit diagram of the device shown in FIG. 6A .
- FIG. 7A illustrates a cross-sectional view showing a semiconductor device according to an exemplary embodiment of the present invention
- FIG. 7B is a circuit diagram of the device shown in FIG. 7A .
- FIG. 8 is a plan view showing a semiconductor device according to an exemplary embodiment of the present invention.
- FIG. 9A illustrates a cross-sectional view cut along line III-III′ of FIG. 8
- FIG. 9B is a circuit diagram of the device shown in FIG. 9A .
- FIG. 10A illustrates a cross-sectional view of a semiconductor substrate showing a semiconductor device of an exemplary embodiment of the present invention
- FIG. 10B is a circuit diagram of the device shown in FIG. 10A .
- FIG. 11 to FIG. 14 illustrate cross-sectional views cut along the line I-I′ of FIG. 2 to describe a method of fabricating a semiconductor device of an exemplary embodiment of the present invention.
- FIG. 15 to FIG. 18 illustrate cross-sectional views cut along the line II-II′ of FIG. 5 to describe a method of fabricating a semiconductor device of an exemplary embodiment of the present invention.
- FIG. 19 to FIG. 22 illustrate cross-sectional views cut along the line III-III′ of FIG. 8 to describe a method of fabricating a semiconductor device of an exemplary embodiment of the present invention.
- FIG. 2 illustrates a plan view showing a semiconductor device according to an exemplary embodiment of the present invention.
- FIG. 3A illustrates a cross-sectional view cut along line I-I′ of FIG. 2 and
- FIG. 3B is a circuit diagram of the device shown in FIG. 5A .
- a second conductive plate 130 , a third conductive plate 150 and a fourth conductive plate 140 are sequentially disposed on a semiconductor substrate 110 having a first conductive plate 120 .
- the first conductive plate to the fourth conductive plate, 120 , 130 , 140 and 150 overlap with each other.
- a first insulation layer 128 is interposed between the first conductive plate 120 and the second conductive plate 130
- a second insulation layer 138 is interposed between the second conductive plate 130 and the third conductive plate 140
- a third insulation layer 148 is interposed between the third conductive plate 140 and the fourth conductive plate 150 .
- the first conductive plate 120 and the fourth conductive plate 150 may be made of metal, such as copper, and the second conductive plate 130 and the third conductive plate 140 may be made of metal, such as Ti, TiN and TaN.
- the first insulation layer 128 may function to prevent a metal from diffusing, and it may be made of a material, such as SiN, SiC or SiCN.
- the second insulation layer 138 may include a high-K dielectric material to increase its capacitance.
- the third insulation layer 148 is an interlayer dielectric or an inter-metal dielectric made of a material, such as SiO 2 , SiOF or SiOC.
- a further insulation layer (not shown) made of the same material as the first insulation layer 128 may be interposed between the third conductive layer 140 and the third insulation layer 148 .
- the semiconductor substrate 110 may include a first bottom interconnection 122 , a second bottom interconnection 124 and a third bottom interconnection 126 .
- the first, second and third bottom interconnections 122 , 124 , and 126 may be electrically connected to a transistor or an interconnection (not shown) placed under them.
- the first bottom interconnection 122 is electrically connected to the first conductive plate 120
- the second and the third bottom interconnections 124 and 126 are insulated from the first conductive plate 120 .
- a first top interconnection 152 , a second top interconnection 154 and a third top interconnection 156 may be disposed in the third insulation layer 148 on the semiconductor substrate 110 .
- the first, second and third top interconnections 152 , 154 , and 156 may be electrically connected to external terminals A and B, shown in FIG. 3B , that supply signal power to the semiconductor substrate.
- the first top interconnection 152 is electrically connected to the fourth conductive plate 150 .
- the second and the third top interconnections 154 and 156 are insulated from the fourth conductive plate 150 .
- the second bottom interconnection 124 and the first top interconnection 152 , the first bottom interconnection 122 and the second top interconnection 154 , and the first bottom interconnection 126 and the third top interconnection 156 are respectively electrically connected through a first contact 153 , a second contact 155 , and a third contact 157 .
- a second conductive plate 130 is electrically connected to the first contact 153
- a third conductive plate 140 is electrically connected to the second contact 155 . Accordingly, the second conductive plate 130 and the fourth conductive plate 150 are electrically connected to each other, and the first conductive plate 150 and the third conductive plate 140 are electrically connected to each other.
- the second conductive plate 130 and the fourth conductive plate 150 are electrically connected to the first external terminal A through the first top interconnection 152
- the first conductive plate 120 and the third conductive plate 140 are electrically connected to the second external terminal B through the second top interconnection 154 .
- the first to a fourth conductive plates 120 , 130 , 140 and 150 constitute three capacitors.
- the second conductive plate 130 and the third conductive plate 140 , the third conductive plate 140 and the fourth conductive plate 150 , and the first conductive plate 120 and the second conductive plate 130 respectively constitute a first capacitor C 1 , a second capacitor C 2 , and a third capacitor C 3 , shown in FIG. 3B .
- the first conductive plate 120 becomes a bottom electrode of the third capacitor C 3
- the second conductive plate 130 becomes a bottom electrode of the second capacitor C 2
- the third conductive plate 140 becomes a bottom electrode of the second capacitor C 2
- the fourth conductive plate 150 becomes a top electrode of the second capacitor C 2 .
- four conductive plates may constitute three capacitors connected in parallel.
- the semiconductor device may have capacitors having high capacitance.
- the capacitance may be increased further.
- FIG. 4A illustrates a cross-sectional view showing a semiconductor device according to an exemplary embodiment of the present invention.
- FIG. 4B is a circuit diagram of the device shown in FIG. 4A .
- a fifth, a sixth and a seventh conductive plate 130 ′, 140 ′ and 150 ′ may be disposed in the same construction with the construction of the second, third and fourth conductive plates 130 , 140 and 150 formed on the substrate 110 .
- a fourth to a sixth insulation layer 128 ′, 138 ′ and 148 ′ interposed between the fifth to the seventh conductive plates 130 ′, 140 ′ and 150 ′ may be further disposed in the same construction with the construction of the first to the third insulation layers 128 , 138 and 148 .
- the fifth conductive plate 130 ′ and the sixth conductive plate 140 ′ are made of metal, such as Ti, TiN and TaN.
- the seventh conductive plate 150 ′ may be made of metal, such as copper.
- the fourth insulation layer 128 ′ may function to prevent the metal from being diffused, and it may be made of a material, such as SiN, SiC and/or SiCN.
- the fifth insulation layer 138 ′ may include a high-K dielectric material to increase capacitance.
- the sixth insulation layer 148 ′ is an interlayer dielectric or inter-metal dielectric, and may be made of a material, such as SiO, SiOF and/or SiOC.
- An insulation layer made of the same material as the fourth insulation layer 128 ′ may be further interposed between the sixth conductive plate 140 ′ and the sixth insulation layer 148 ′.
- a fourth top interconnection 152 ′, a fifth top interconnection 154 ′ and a sixth top interconnection 156 ′ may be disposed in the sixth insulation layer 148 ′.
- the fourth to sixth top interconnections 152 ′, 154 ′ and 156 ′ may be respectively electrically connected to external terminals A and B, shown in FIG. 4B , that supply signal power to the semiconductor substrate.
- the fourth top interconnection 152 ′ is electrically connected to the seventh conductive plate 150 ′, and the fifth and the sixth top interconnections 154 ′ and 156 ′ are insulated from the seventh conductive plate 150 ′.
- the first top interconnection 152 and the fourth top interconnection 152 ′, the second top interconnection 154 and the fifth top interconnection 154 ′, and the third top interconnection 156 and the sixth top interconnection 156 ′ are respectively electrically connected through a fourth contact 153 ′, a fifth contact 155 ′ and a sixth contact 157 ′.
- the fifth conductive plate 130 ′ is electrically connected to the fourth contact 153 ′
- the sixth conductive plate 140 ′ is electrically connected to the fifth conductive plate 130 ′.
- the second conductive plate 130 , the fourth conductive plate 150 , the fifth conductive plate 130 ′, and the seventh conductive plate 150 ′ are electrically connected.
- first conductive plate 120 , the third conductive plate 150 , and the sixth conductive plate 140 ′ are electrically connected.
- the second conductive plate 130 , the fourth conductive plate 150 , the fifth conductive plate 130 ′, and the seventh conductive plate 150 ′ are electrically connected to the first external terminal A through the fourth top interconnection 152 ′
- the first conductive plate 120 , the third conductive plate 150 , and the sixth conductive plate 140 are electrically connected to the second external terminal B through the fifth top interconnection 154 ′.
- the first to seventh conductive plates 120 , 130 , 140 , 150 , 130 ′, 140 ′ and 150 ′ constitute five capacitors.
- the first to the fourth conductive plates 120 , 130 , 140 and 150 constitute three capacitors, as shown in FIG. 3B .
- the fifth conductive plate 130 ′ and the sixth conductive plate 140 ′, and the sixth conductive plate 140 ′ and the seventh conductive plate 140 ′ respectively further constitute a fourth capacitor C 1 ′ and a fifth capacitor C 2 ′.
- the fifth conductive plate 130 ′ becomes a bottom electrode of the fourth capacitor C 1 ′.
- the sixth conductive plate 140 ′ becomes a top electrode of the fourth capacitor C 1 ′ and becomes a bottom electrode of the fifth capacitor C 2 ′.
- the seventh conductive plate 150 ′ becomes a top electrode of the fifth capacitor C 2 ′.
- seven conductive plates may constitute five capacitors connected in parallel.
- the semiconductor device may include capacitors having high capacitance.
- the capacitance may be further increased.
- the semiconductor device of the exemplary embodiment of the present invention may further include conductive plates disposed repeatedly in the same construction with the construction of the fifth to the seventh conductive plates.
- FIG. 5 illustrates a plan view showing briefly a semiconductor device according to an exemplary embodiment of the present invention.
- FIG. 6A illustrates a cross-sectional view cut along the line II-II′ of FIG. 5 .
- FIG. 6B is a circuit diagram of the device shown in FIG. 6A .
- a second conductive plate 230 , a third conductive plate 240 , and a fourth conductive plate 250 are respectively disposed on a semiconductor substrate 210 having a first conductive plate 220 formed thereon.
- the first to fourth conductive plates 220 , 230 , 240 and 250 overlap with each other.
- a first insulation layer 228 is interposed between the first conductive plate 220 and the second conductive plate 230
- a second insulation layer 238 is interposed between the second conductive plate 230 and the third conductive plate 240
- a third insulation layer 248 is interposed between the third conductive plate 240 and the fourth conductive plate 250 .
- the first conductive plate 220 and the fourth conductive plate 250 may be made of metal, such as copper, and the second conductive plate 230 and the third conductive plate 240 may be made of metal, such as Ti, TiN, and/or TaN.
- the first insulation layer 228 may function to prevent the metal material from diffusing, and it may be made of material such as SiN, SiC, and/or SiCN.
- the second insulation layer 238 may include high-K dielectric material to increase capacitance.
- the third insulation layer 248 is an interlayer dielectric or an inter-metal dielectric, and may be made of SiO 2 , SiOF and/or SiOC.
- a further insulation layer (not shown) made of the same material as the first insulation layer 228 may be interposed between the third conductive plate 240 and the third insulation layer 248 .
- the semiconductor substrate 210 may include a first bottom interconnection 222 , a second bottom interconnection 224 , and a third bottom interconnection 226 .
- the first to third bottom interconnections 222 , 224 and 226 may be electrically connected to a transistor or an interconnection placed in the semiconductor substrate under them.
- the first bottom interconnection 222 is electrically connected to the first conductive plate 220
- the second and the third bottom interconnections 224 and 226 are insulated from the first conductive plate 120 .
- a first top interconnection 252 , a second top interconnection 254 and a third top interconnection 256 are disposed in the third insulation layer 248 .
- the first to third top interconnections 252 , 254 and 256 may be electrically connected to external terminals A and B, shown in FIG. 6B , that supply signal power to the semiconductor substrate.
- the first top interconnection 252 is electrically connected to the fourth conductive plate 250
- the second and the third top interconnections 254 and 256 are insulated from the fourth conductive plate 250 .
- the second bottom interconnection 224 and the second top interconnection 254 , the first bottom interconnection 222 and the first top interconnection 252 , and the third bottom interconnection 226 and the third top interconnection 256 are respectively electrically connected through a first contact 253 , a second contact 155 , and a third contact 257 .
- a second conductive plate 230 is electrically connected to the first contact 253
- a third conductive plate 240 is electrically connected to the second contact 155 . Accordingly, the first conductive plate 220 , the third conductive plate 240 , and the third conductive plate 240 are electrically connected to each other.
- first conductive plate 220 , the third conductive plate 240 and the fourth conductive plate 250 are electrically connected to a first external terminal A through the first top interconnection 252
- second conductive plate 230 is electrically connected to a second external terminal B through the second top interconnection 254 .
- the first to fourth conductive plates 220 , 230 , 240 and 250 constitute two capacitors.
- the second conductive plate 230 and the third conductive plate 240 , and the first conductive plate 220 and the second conductive plate 230 respectively constitute a first capacitor C 1 and a second capacitor C 2 .
- the first conductive plate 220 becomes a bottom electrode of the second capacitor C 2
- the second conductive plate 230 becomes a top electrode of the second capacitor C 2 and a bottom electrode of the first capacitor C 1
- the third conductive plate 240 becomes a top electrode of the first capacitor C 1 .
- four conductive plates may constitute two capacitors connected in parallel.
- the semiconductor device may have capacitors having high capacitance.
- the capacitance may be further increased.
- FIG. 7A illustrates a cross-sectional view of the semiconductor substrate showing a semiconductor device according to an exemplary embodiment of the present invention
- FIG. 7B is a circuit diagram of the device shown in FIG. 7A .
- the fifth to the seventh conductive plates 230 ′, 240 ′ and 250 ′ may be disposed in the same construction as the construction of the second to the fourth conductive plates 230 , 240 , and 250 formed on the substrate 210 of FIG. 6A .
- a fourth to a sixth insulation layer 118 ′, 238 ′, and 248 ′ interposed between the fifth to the seventh conductive plates 230 ′, 240 ′, and 250 ′ may be disposed in the same construction as the first to the third insulation layers 228 , 238 , and 248 .
- the fifth conductive plate 230 ′ and the sixth conductive plate 240 ′ may be made of metal, such as Ti, TiN and/or TaN.
- the seventh conductive plate 250 ′ may be made of metal, such as copper.
- the fourth insulation layer 228 ′ may function to prevent the metal material from diffusing and may be made of a material, such as SiN, SiC and/or SiCN.
- the fifth insulation layer 238 ′ may include a high-K dielectric material to increase capacitance.
- the sixth insulation layer 248 ′ is an interlayer dielectric or an inter-metal insulation layer and may be made of a material, such as SiO, SiOF and/or SiOC.
- a further insulation layer (not shown) made of the same material as the fourth insulation layer 228 ′ may be interposed between the sixth conductive plate 240 ′ and the sixth insulation layer 248 ′.
- a fourth top interconnection 252 ′, a fifth top interconnection 254 ′, and a sixth top interconnection 256 ′ may be disposed in the insulation layer 248 ′.
- the fourth to the sixth insulation layers 252 ′, 254 ′ and 256 ′ may be respectively electrically connected to external terminals A and B, shown in FIG. 7B , that supply signal power to the semiconductor substrate.
- the fourth top interconnection 252 ′ is electrically connected to the seventh conductive plate 250 ′, and the fifth and the sixth top interconnection 254 ′ and 256 ′ are insulated from the seventh conductive plate 250 ′.
- the second top interconnection 254 and the fifth top interconnection 254 ′, the first top interconnection 254 and the fourth top interconnection 252 ′, and the third top interconnection 256 and the sixth top interconnection 256 ′ are respectively electrically connected through a fourth contact 253 ′, a fifth contact 255 ′, and a sixth contact 257 ′. Also, the fifth conductive plate 230 ′ is electrically connected to the fourth contact 253 ′, and the sixth conductive plate 240 ′ is electrically connected to the fifth contact 255 ′.
- the first conductive plate 220 , the third conductive plate 240 , the fourth conductive plate 250 , the sixth conductive plate 240 ′ and the seventh conductive plate 250 ′ are electrically connected, and the second conductive plate 230 and the fifth conductive plate 230 ′ are electrically connected.
- the first conductive plate 220 , the third conductive plate 240 , the fourth conductive plate 250 , the sixth conductive plate 240 ′ and the seventh conductive plate 250 ′ are electrically connected to the first external terminal A through the fourth top interconnection 252 ′.
- the second conductive plate 230 and the fifth conductive plate 230 ′ are electrically connected to the second external terminal B through the fifth top interconnection 254 ′.
- the first to the seventh conductive plates 220 , 230 , 240 , 250 , 230 ′, 240 ′ and 250 ′ constitute four capacitors.
- the first to fourth plates 220 , 230 , 240 and 250 constitute two capacitors, as shown in FIG. 6B .
- the fifth conductive plate 230 ′ and the sixth conductive plate 240 ′ further constitute a third capacitor C 1 and the fourth conductive plate 250 and the fifth conductive plate 230 ′ constitute a fourth capacitor C 2 ′.
- the fourth conductive plate 250 becomes the bottom electrode of the fourth capacitor C 2 ′
- the fifth conductive plate 230 ′ becomes the bottom electrode of the third capacitor C 1 ′
- the sixth conductive plate 240 ′ becomes the top electrode of the third capacitor C 1 ′.
- the semiconductor device may include capacitors having high capacitance.
- the capacitance may be further increased.
- a semiconductor device according an exemplary embodiment of the present invention may further include conductive plates disposed repeatedly in the same construction as the construction of the fifth to the seventh conductive plates.
- FIG. 8 is a plan view showing a semiconductor device according to an exemplary embodiment of the present invention.
- FIG. 9A illustrates a cross-sectional view cut along the line III-III′ of FIG. 8
- FIG. 9B is a circuit diagram of the device shown in FIG. 9A .
- a second conductive plate 330 , a third conductive plate 340 , and a fourth conductive plate 350 are respectively disposed on the semiconductor substrate 310 having a first conductive plate 320 .
- the first to the fourth conductive plates 320 , 330 , 340 , and 350 overlap with each other.
- a first insulation layer 328 is interposed between the first conductive plate 320 and the second conductive plate 330
- a second insulation layer 338 is interposed between the first and the third conductive plates 330 and 340
- a third insulation layer 348 is interposed between the third and the fourth conductive plates 340 and 350 .
- the first and the fourth conductive plates 320 and 350 may be made of metal such as copper, and the second and the third conductive plates 330 and 340 may be made of metal, such as Ti, TiN and TaN.
- the first insulation layer 328 may function to prevent the metal from diffusing, and it may be made of a material such as SiN, SiC or SiCN.
- the second insulation layer 338 may include a high-K dielectric material to increase capacitance.
- the third insulation layer 348 is an interlayer dielectric or an inter-metal dielectric, made of a material, such as SiO 2 , SiOF or SiOC.
- a further insulation layer (not shown) made of the same material as the first insulation layer 328 may be interposed between the third conductive layer 340 and the third insulation layer 348 .
- the semiconductor substrate 310 may include a first bottom interconnection 322 , a second bottom interconnection 324 , and a third bottom interconnection 326 .
- the first to third bottom interconnections 322 , 324 , and 326 may be electrically connected to a transistor or an interconnection located in the semiconductor substrate 310 under them.
- the first bottom interconnection 322 is electrically connected to the first conductive plate 320
- the second and third bottom interconnection 324 and 326 are insulated from the first conductive plate 320 .
- a first top interconnection 352 , a second top interconnection 354 , and a third top interconnection 356 may be disposed in the third insulation layer 348 .
- the first, second and third top interconnections 352 , 354 , and 356 may be electrically connected to external terminals A and B, shown in FIG. 9B , that supply signal power to the semiconductor substrate.
- the first top interconnection 352 is electrically connected to the fourth conductive plate 350 .
- the second and the third top interconnections 354 and 356 are insulated from the fourth conductive plate 350 .
- the second bottom interconnection 324 and the second top interconnection 354 , the first bottom interconnection 322 and the first top interconnection 352 , and the third bottom interconnection 326 and the third top interconnection 356 are respectively electrically connected through a first contact 353 , a second contact 355 , and a third contact 357 .
- a third conductive plate 340 is electrically connected to the first contact 353
- a second conductive plate 330 is electrically connected to the second contact 355 . Accordingly, the first conductive plate 320 , the second conductive plate 330 , and the fourth conductive plate 350 are electrically connected.
- first, second, and fourth conductive plates 320 , 330 , and 350 are electrically connected to the first external terminal A through the first top interconnection 352
- the third conductive plate 340 is electrically connected to the second external terminal B through the second top interconnection 354 .
- the first to fourth conductive plates 320 , 330 , 340 , and 350 constitute two capacitors.
- the second conductive plate 330 and the third conductive player 340 , the third conductive plate 340 and the fourth conductive plate 350 respectively constitute a first capacitor C 1 and a second capacitor C 2 .
- the second conductive plate 330 becomes a bottom electrode of the first capacitor C 1
- the third conductive plate 340 becomes a top electrode of the first capacitor C 2
- the fourth conductive plate 350 becomes a top electrode of the second capacitor C 2 .
- four conductive plates may constitute two capacitors connected in parallel.
- the semiconductor device may have capacitors having high capacitance.
- the capacitance may be increased further.
- FIG. 10A illustrates a cross-sectional view of a semiconductor substrate showing a semiconductor device according to an exemplary embodiment of this invention.
- FIG. 10B is a circuit diagram of the device shown in FIG. 10A .
- the fifth to the seventh conductive plates 330 ′, 340 ′ and 350 ′ may be disposed in the same construction as the construction of the second to the fourth conductive plates 330 , 340 , and 350 on the substrate 310 shown in FIG. 6A .
- a fourth to a sixth insulation layer 318 ′, 338 ′ and 348 ′ interposed between the fifth to the seventh conductive plates 330 ′, 340 ′ and 350 ′ may be disposed in the same construction as the first to third insulation layers 328 , 338 , and 348 .
- the fifth and the sixth conductive plates 330 ′ and 340 ′ may be made of metal, such as Ti, TiN and/or TaN.
- the seventh conductive plate 350 ′ may be made of metal, such as copper.
- the fourth insulation layer 328 ′ may function to prevent the metal material from diffusing and may be made of material, such as SiN, SiC and/or SiCN.
- the fifth insulation layer 338 ′ may include a high-K dielectric material to increase capacitance.
- the sixth insulation layer 348 ′ is an interlayer dielectric or an inter-metal insulation layer and may be made of material, such as SiO, SiOF and/or SiOC.
- a further insulation layer (not shown) made of the same material as the fourth insulation layer 328 ′ may be interposed between the sixth conductive plate 340 ′ and the sixth insulation layer 348 ′.
- a fourth top interconnection 352 ′, a fifth top interconnection 354 ′, and a sixth top interconnection 356 ′ may be disposed in the sixth insulation layer 348 ′.
- the fourth to sixth top interconnections 352 ′, 354 ′ and 356 ′ may be respectively electrically connected to external terminals A and B, shown in FIG. 10B , that supply signal power to the semiconductor substrate.
- the fourth top interconnection 352 ′ is electrically connected to the seventh conductive plate 350 ′, and the fifth and sixth top interconnections 354 ′ and 356 ′ are insulated from the seventh conductive plate 350 ′.
- the second top interconnection 354 and the fifth top interconnection 354 ′, the first top interconnection 352 and the fourth top interconnection 352 ′, and the third top interconnection 356 and the sixth top interconnection 356 ′ are respectively electrically connected through a fourth contact 353 ′, a fifth contact 355 ′, and a sixth contact 357 ′.
- the fifth conductive plate 330 ′ is electrically connected to the fifth contact 355 ′
- the sixth conductive plate 340 ′ is electrically connected to the fourth contact 353 ′. Accordingly, the first conductive plate 320 , the third conductive plate 330 , the fourth conductive plate 350 , the fifth conductive plate 330 ′, and the seventh conductive plate 350 ′ are electrically connected.
- the third conductive plate 340 and the sixth conductive plate 340 ′ are electrically connected. Also, the first conductive plate 320 , the second conductive plate 330 , the fourth conductive plate 350 , the fifth conductive plate 330 ′ and the seventh conductive plate 350 ′ are electrically connected to the first external terminal A through the fourth top interconnection 352 ′. The third and the fifth conductive plates 340 and 340 ′ are electrically connected to the second external terminal B through the fifth top interconnection 354 ′.
- the first to seventh conductive plates 320 , 330 , 340 , 350 , 330 ′, 340 ′ and 350 ′ constitute four capacitors.
- the first to fourth plates 320 , 330 , 340 and 350 constitute two capacitors, as shown in FIG. 9B .
- the fifth conductive plate 330 ′ and the sixth conductive plate 340 ′ further constitute a third capacitor C 1 ′
- the sixth conductive plate 340 ′ and the seventh conductive plate 350 ′ constitute a fourth capacitor C 2 ′.
- the fifth conductive plate 330 ′ becomes the bottom electrode of the third capacitor C 1 ′
- the sixth conductive plate 340 ′ becomes the top electrode of the third capacitor C 1 ′
- the sixth conductive plate 240 ′ becomes the top electrode of the third capacitor C 1 ′.
- the semiconductor device may include capacitors having high capacitance.
- the capacitance may be further increased.
- a semiconductor device according to an exemplary embodiment of the present invention may further include conductive plates disposed repeatedly in the same construction as the construction of the fifth to the seventh conductive plates.
- the conductive plates and the interconnections may further include a barrier metal layer capable of preventing the metal from being diffused.
- FIGS. 11 to 14 illustrate cross-sectional view cut along the line I-I′ of FIG. 2 to describe a method of fabricating a semiconductor device according to an exemplary embodiment of the present invention.
- a first insulation layer 128 is formed on the semiconductor substrate 110 where a first conductive plate 120 and a first to third bottom interconnections 122 , 124 , and 126 are formed.
- the semiconductor substrate may include an active device, such as transistor.
- the first conductive plate 120 and the first to third bottom interconnections 122 , 124 , and 126 may be made of metal, such as copper.
- the first insulation layer 128 may be made of a material, such as SiN, SiC, and/or SiCN, which is capable of preventing metal from being diffused.
- a second conductive plate 130 is formed so that it overlaps with the first conductive plate 120 on the first insulation layer 128 and may be made of metal such as Ti, TiN, and/or TaN.
- a second insulation layer 138 and a third conductive plate 140 are formed on the second conductive plate 130 .
- the second insulation layer 138 may be made of a silicon insulation layer, such as SiO 2 , SiN, and/or SiON or a metal insulation layer such as Ta 2 O 5 , HfO, Al 2 O 3 .
- a high-k dielectric material may be used in order to increase capacitance.
- the third conductive plate 140 is formed so that it overlaps the second conductive plate 130 , and may be made of metal such as Ti, TiN or TaN.
- a third insulation layer 148 is formed on the entire surface of a semiconductor substrate 110 .
- the third insulation layer 148 may be made of SiO 2 , SiOF or SiOC.
- the third insulation layer 148 may be referred to as an interlayer dielectric or an inter-metal dielectric.
- an insulation layer (not shown) that functions to prevent metal from being diffused may further be formed on the conductive plate 140 .
- an etch process is performed to form a plate-type groove 160 , line-type grooves 162 , 164 , and 166 , and first to third contact holes 163 , 165 and 167 .
- a second bottom interconnection 124 and a second conductive plate 130 are exposed through the first contact hole 163 .
- a bottom interconnection 122 and a third conductive plate 140 are exposed through the second contact hole 165 , and a third bottom interconnection 126 is exposed through the third contact hole 167 .
- the first to the third bottom interconnections 122 , 124 and 126 may function as etch stop layers. Accordingly, over etching may be prevented in the etch process, and short circuits between the bottom interconnections and/or between bottom interconnection and other interconnections placed under them may be prevented. In other words, the capacitors may be formed stably.
- grooves 160 , 162 , 164 and 166 and the first to third contact holes 153 , 155 and 157 may be filled with metal to form first to third top interconnections 152 , 154 and 156 , and form first to third contacts 153 , 155 and 157 .
- the method to form interconnections by filling metal material in an etched insulation layer may be referred to as the damascene process. Material such as copper may be used for the metal material.
- a second bottom interconnection 124 , a second conductive plate 130 , a first top interconnection 152 , and a fourth conductive plate 150 are electrically connected through the first contact 153 .
- a first conductive plate 120 , a third conductive plate 140 , and a second top interconnection 154 are electrically connected through the second contact 155 .
- the first and the second contacts 153 and 155 are made of copper
- the second and the third conductive plates 130 and 140 are made of Ti, TiN, or TaN, it is possible to prevent the copper included in the first and the second contacts 153 and 155 from being diffused into the second and the third conductive plates 130 and 140 .
- a third bottom interconnection 126 and a third top interconnection 156 may be electrically connected through the third contact 157 .
- FIGS. 15 to 18 illustrate cross-sectional views cut along the line II-II′ of FIG. 5 to describe a method of fabricating a semiconductor device according to an exemplary embodiment of the present invention.
- a first insulation layer 228 is formed on a semiconductor substrate 210 where first to third bottom interconnections 222 , 224 , and 226 are formed.
- the second conductive plate 230 is formed so that it overlaps with the first conductive plate 220 on the first insulation layer 228 .
- a second insulation layer 238 and a third conductive plate 240 are formed on the second conductive plate 230 .
- the second insulation layer 238 may be made of a high-K dielectric material in order to increase capacitance.
- the third conductive plate 240 is formed so that it overlaps with the second conductive plate 230 .
- a third insulation layer 248 is formed on the entire surface of the semiconductor substrate 210 .
- an insulation layer (not shown) that functions to prevent metal from being diffused, such as the first insulation layer 128 , may further be formed on the third conductive plate 240 .
- an etching process is performed to form a plate-type groove 260 , line-type grooves 262 , 264 , and 266 , and first to third contact holes 263 , 265 , and 267 .
- a second bottom interconnection 224 and a second conductive plate 230 are exposed through the first contact hole 263 .
- a bottom interconnection 222 and a third conductive plate 240 are exposed through the second contact hole 265 , and a third bottom interconnection 226 is exposed through the third contact hole 267 .
- the first to the third bottom interconnections 222 , 224 and 226 may function as etch stop layers.
- grooves 260 , 262 , 264 , and 266 and the first to third contact holes 253 , 255 , and 257 are filled with metal to form a fourth conductive plate 250 , first to third top interconnections 252 , 254 and 256 , and form first to third contacts 253 , 255 and 257 .
- a second bottom interconnection 224 , a second conductive plate 230 , and a second top interconnection 254 are electrically connected through the first contact 253 .
- a first conductive plate 220 , a third conductive plate 240 , a first top interconnection 252 and a fourth conductive plate 250 are electrically connected through the second contact 255 .
- a third bottom interconnection 226 and a third top interconnection 256 are electrically connected through the third contact 257 .
- FIG. 19 to FIG. 22 illustrate cross-sectional views cut along the line III-III′ of FIG. 8 to describe a method of fabricating a semiconductor device according to an exemplary embodiment of the present invention.
- a first insulation layer 328 is formed on a semiconductor substrate 310 where a first conductive plate 320 and first to third bottom interconnections 322 , 324 and 326 are formed.
- a second conductive plate 330 is formed so that it overlaps with the first conductive plate 320 on the first insulation layer 328 .
- a second insulation layer 338 and a third conductive plate 340 are formed on the second conductive plate 330 .
- the second insulation layer 338 may be made of a high-K dielectric material in order to increase capacitance.
- the third conductive plate 340 is formed so that it overlaps with the second conductive plate 330 .
- a third insulation layer 348 is formed on the entire surface of a semiconductor substrate. Before forming the third insulation layer 348 , an insulation layer (not shown) functioning to prevent metal from being diffused, like the first insulation layer 128 , may further be formed on the third conductive plate 140 .
- an etch process is performed to form a plate-type groove 360 , line-type grooves 362 , 365 , and 367 , and first to third contact holes 363 , 365 and 367 .
- a second bottom interconnection 324 and a third conductive plate 340 are exposed through the first contact hole 363 .
- a bottom interconnection 322 and a second conductive plate 330 are exposed through the second contact hole 365 , and a third bottom interconnection 326 is exposed through the third contact hole 367 .
- the first to the third bottom interconnections 322 , 324 , and 326 may function as etch stop layers.
- grooves 360 , 362 , 364 , and 366 and the first to third contact holes 353 , 355 , and 357 are filled with metal to form a fourth conductive plate 350 , and first to third top interconnections 352 , 354 and 356 and to form first to third contacts 353 , 355 and 357 .
- a second bottom interconnection 324 , a third conductive plate 340 , and a second conductive plate 340 are electrically connected through the first contact 353 .
- a first conductive plate 320 , a second conductive plate 330 , a first top interconnection 352 , and a fourth conductive plate 350 are electrically connected through the second contact 355 .
- a third bottom interconnection 326 and a third top interconnection 356 may be electrically connected through the third bottom interconnection 326 .
- a barrier metal layer that prevents metal of the conductive plates and interconnections from being diffused may further be formed.
- the semiconductor device may include capacitors having high capacitance.
- the capacitors may be formed stably.
Abstract
A semiconductor device and methods of fabricating the same, wherein insulation layers are interposed to sequentially dispose the semiconductor device on a semiconductor substrate. The semiconductor device includes a first conductive plate, a second conductive plate, a third conductive plate, and a fourth conductive plate. At least two of the first, second, third and fourth conductive plates are electrically connected and constitute at least two capacitors.
Description
- This application is a Continuation Application of U.S. patent application Ser. No. 12/959,737 filed on Dec. 3, 2010, which is Divisional of U.S. application Ser. No. 11/760,092 filed on Jun. 8, 2007, which claims priority to Korean Patent Application No. 2006-0051510 filed on Jun. 8, 2006, the entirety of which is hereby incorporated by reference.
- The present disclosure is related to a semiconductor device, more specifically, a semiconductor device including capacitors having high capacitance and method of fabricating the same.
- A method of realizing a high-capacity capacitor for an analogue circuit and radio frequency (RF) device requiring high-speed operation is being developed. In case the lower electrode and upper electrode of a capacitor are made of doped polysilicon, however, oxidation occurs in the interface between the lower electrode and the dielectric layer, and in the interface between the dielectric layer and the upper electrode, to form a natural oxide layer. This causes a decrease of capacitance.
- In an attempted solution to the above problem, a metal-insulator-metal (MIM) capacitor is introduced. An MIM capacitor has only a small specific resistance and has no parasitic capacitance resulting from inner depletion. Therefore, the MIM capacitor is typically used in high-performance semiconductor devices. In addition, in an MIM capacitor it is relatively easy to control the capacitance, compared to a poly-insulator-poly (PIP) capacitor, and an MIM capacitor causes less difference in capacitance when varied according to frequency. Therefore, an MIM capacitor is widely used in analog-to-digital converters (ADC), high-frequency devices, switching capacitor filters, and CMOS image sensors, for example.
-
FIG. 1A illustrates a cross-sectional view showing a portion of a conventional MIM capacitor, andFIG. 1B illustrates a circuit diagram of the capacitor ofFIG. 1A . - Referring to
FIG. 1A andFIG. 1B , alower electrode 30 and anupper electrode 40 are disposed on asemiconductor substrate 10 having abottom interconnection 26. A dielectric 38 is interposed between thelower electrode 30 and theupper electrode 40. Afirst insulation layer 28 is disposed between thelower electrode 30 and thesemiconductor substrate 10, and asecond insulation layer 48 is disposed on thefirst insulation layer 28. First, second and thirdtop interconnections second insulation layer 48. The firsttop interconnection 52 is electrically connected to theupper electrode 40 through afirst contact 53, and the secondtop interconnection 54 is electrically connected to thelower electrode 30 through asecond contact 55. The thirdtop interconnection 56 is electrically connected to thebottom interconnection 26 through athird contact 57. As shown inFIG. 1B , the firsttop interconnection 52 is also electrically connected to a first external terminal A, and the secondtop interconnection 54 is electrically connected to a second external terminal B. Theupper electrode 40 and thelower electrode 30 constitute a capacitor C1 shown inFIG. 1B . - A capacitance above a predetermined level is required for stable operation of a semiconductor device. However much area the capacitor occupies decreases due to a continuous scaling down of the semiconductor device, thereby to cause a corresponding decrease of capacitance. Accordingly, a capacitor having a high capacitance in a limited area is demanded.
- Exemplary embodiments of the present invention are directed to semiconductor devices and methods of fabricating the same. In an exemplary embodiment of the present invention, a semiconductor device may comprise: a first conductive plate, a second conductive plate, a third conductive plate, and a fourth conductive plate stacked sequentially on a semiconductor substrate with an insulation layer interposed between the first and second conductive plates, between the second and third conductive plates, and between the third and fourth conductive plates, respectively, the first to fourth plates overlapping each other, wherein at least two of the first to fourth plates are electrically connected to each other and constitute at least two capacitors.
- In an exemplary embodiment, a semiconductor device may comprise: a semiconductor substrate having a first conductive plate; a second conductive plate disposed with a first insulation layer interposed on the first conductive plate; a third conductive plate disposed with a second insulation layer interposed on the second conductive plate; and a fourth conductive plate disposed with a third insulation layer interposed on the third conductive plate, wherein the first conductive plate and the third conductive plate are electrically connected to each other, and the second conductive plate and the fourth conductive plate are electrically connected to each other, and the first conductive plate and the second conductive plate constitute a first capacitor, the second conductive plate and the third conductive plate constitute a second capacitor, and the third conductive plate and the fourth conductive plate constitute a third capacitor.
- Also, in an exemplary embodiment, a semiconductor device may comprise: a semiconductor substrate having a first conductive plate; a second conductive plate disposed with a first insulation layer interposed on the first conductive plate; a third conductive plate disposed with a second insulation layer interposed on the second conductive plate; and a fourth conductive plate disposed with a third insulation layer interposed on the third conductive plate, wherein the first conductive plate, the third conductive plate, and the fourth conductive plate are electrically connected, and the first conductive plate and the second conductive plate constitute a first capacitor, and the second conductive plate and the third conductive plate constitute a second capacitor.
- In an exemplary embodiment, a semiconductor device may comprise: a semiconductor substrate having a first conductive plate; a second conductive plate disposed with a first insulation layer interposed on the first conductive plate; a third conductive plate disposed with a second insulation layer interposed on the second conductive plate; and a fourth conductive plate disposed with a third insulation layer interposed on the third conductive plate, wherein the first conductive plate, the second conductive plate, and the fourth conductive plate are electrically connected, and the second conductive plate and the third conductive plate constitute a first capacitor, and the third conductive plate and the fourth conductive plate constitute a second capacitor.
- In an exemplary embodiment, a method of fabricating a semiconductor device may comprise: preparing a semiconductor substrate on which are formed a first conductive plate, a first bottom interconnection electrically connected to the first conductive plate, and a second bottom interconnection insulated from the first conductive plate; forming a second conductive plate with a first insulation layer interposed on the first conductive plate; forming a third conductive plate with a second insulation layer interposed on the second conductive plate; forming a third insulation layer on the semiconductor substrate; performing an etch process to form a first groove and a second groove, the first groove exposing the second bottom interconnection and the second conductive plate, and the second groove exposing the first bottom interconnection and the third conductive plate; and filling the first groove with conductive material to form a fourth conductive plate on the third conductive plate, wherein the first conductive plate and the third conductive plate are electrically connected, and the second conductive plate and the fourth conductive plate are electrically connected.
- According to an exemplary embodiment, a method of fabricating a semiconductor device may comprise: preparing a semiconductor substrate on which are formed a first conductive plate, a first bottom interconnection electrically connected to the first conductive plate, and a second bottom interconnection insulated from the first conductive plate; forming a second conductive plate with a first insulation layer interposed on the first conductive plate; forming a third conductive plate with a second insulation layer interposed on the second conductive plate; forming a third insulation layer on the semiconductor substrate; performing an etch process to form a first groove and a second groove, the first groove exposing the second bottom interconnection and the second conductive plate, and the second groove exposing the first bottom interconnection and the third conductive plate; and filling the first groove with conductive material to form a fourth conductive plate on the third conductive plate, wherein the first conductive plate, the third conductive plate and the fourth conductive plate are electrically connected.
- In an exemplary embodiment, a method of fabricating a semiconductor device may comprise: preparing a semiconductor substrate on which are formed a first conductive plate, a first bottom interconnection electrically connected to the first conductive plate, and a second bottom interconnection insulated from the first conductive plate; forming a second conductive plate with a first insulation layer interposed on the first conductive plate; forming a third conductive plate with a second insulation layer interposed on the second conductive plate; forming a third insulation layer on the semiconductor substrate; performing an etch process to form a first groove and a second groove, the first groove exposing the second bottom interconnection and the third conductive plate, and the second groove exposing the first bottom interconnection and the second conductive plate; and filling the first groove with conductive material to form a fourth conductive plate on the third conductive plate, wherein the first conductive plate, the second conductive plate and the fourth conductive plate are electrically connected.
- Exemplary embodiments of the present invention will be understood in more detail from the following descriptions taken in conjunction with the accompanying drawings.
-
FIG. 1A is a cross-sectional view of a semiconductor showing a conventional MIM capacitor, andFIG. 1B is a circuit diagram of the capacitor shown inFIG. 1A . -
FIG. 2 is a plan view illustrating a semiconductor device according to an exemplary embodiment of the present invention. -
FIG. 3A illustrates a cross-sectional view cut along line I-I′ ofFIG. 2 , andFIG. 3B is a circuit diagram of the capacitor shown inFIG. 3A . -
FIG. 4A is a cross-sectional view showing a semiconductor device of an exemplary embodiment of the present invention.FIG. 4B is a circuit diagram of the device shown inFIG. 4A . -
FIG. 5 is a plan view illustrating a semiconductor device according to an exemplary embodiment of the present invention. -
FIG. 6A illustrates a cross-sectional view cut along line II-II′ ofFIG. 5 , andFIG. 6B is a circuit diagram of the device shown inFIG. 6A . -
FIG. 7A illustrates a cross-sectional view showing a semiconductor device according to an exemplary embodiment of the present invention, andFIG. 7B is a circuit diagram of the device shown inFIG. 7A . -
FIG. 8 is a plan view showing a semiconductor device according to an exemplary embodiment of the present invention. -
FIG. 9A illustrates a cross-sectional view cut along line III-III′ ofFIG. 8 , andFIG. 9B is a circuit diagram of the device shown inFIG. 9A . -
FIG. 10A illustrates a cross-sectional view of a semiconductor substrate showing a semiconductor device of an exemplary embodiment of the present invention, andFIG. 10B is a circuit diagram of the device shown inFIG. 10A . -
FIG. 11 toFIG. 14 illustrate cross-sectional views cut along the line I-I′ ofFIG. 2 to describe a method of fabricating a semiconductor device of an exemplary embodiment of the present invention. -
FIG. 15 toFIG. 18 illustrate cross-sectional views cut along the line II-II′ ofFIG. 5 to describe a method of fabricating a semiconductor device of an exemplary embodiment of the present invention. -
FIG. 19 toFIG. 22 illustrate cross-sectional views cut along the line III-III′ ofFIG. 8 to describe a method of fabricating a semiconductor device of an exemplary embodiment of the present invention. - Exemplary embodiments of the present invention will be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. This invention, however, may be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. Rather, these exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those of ordinary skill in the art. Like numbers refer to like elements throughout.
-
FIG. 2 illustrates a plan view showing a semiconductor device according to an exemplary embodiment of the present invention.FIG. 3A illustrates a cross-sectional view cut along line I-I′ ofFIG. 2 andFIG. 3B is a circuit diagram of the device shown inFIG. 5A . - Referring to
FIG. 2 .FIG. 3A , andFIG. 3B , a secondconductive plate 130, a thirdconductive plate 150 and a fourthconductive plate 140 are sequentially disposed on asemiconductor substrate 110 having a firstconductive plate 120. The first conductive plate to the fourth conductive plate, 120, 130, 140 and 150, overlap with each other. Afirst insulation layer 128 is interposed between the firstconductive plate 120 and the secondconductive plate 130, asecond insulation layer 138 is interposed between the secondconductive plate 130 and the thirdconductive plate 140, and athird insulation layer 148 is interposed between the thirdconductive plate 140 and the fourthconductive plate 150. - The first
conductive plate 120 and the fourthconductive plate 150 may be made of metal, such as copper, and the secondconductive plate 130 and the thirdconductive plate 140 may be made of metal, such as Ti, TiN and TaN. - The
first insulation layer 128 may function to prevent a metal from diffusing, and it may be made of a material, such as SiN, SiC or SiCN. Thesecond insulation layer 138 may include a high-K dielectric material to increase its capacitance. Thethird insulation layer 148 is an interlayer dielectric or an inter-metal dielectric made of a material, such as SiO2, SiOF or SiOC. A further insulation layer (not shown) made of the same material as thefirst insulation layer 128 may be interposed between the thirdconductive layer 140 and thethird insulation layer 148. - The
semiconductor substrate 110 may include afirst bottom interconnection 122, asecond bottom interconnection 124 and athird bottom interconnection 126. The first, second and thirdbottom interconnections first bottom interconnection 122 is electrically connected to the firstconductive plate 120, and the second and the thirdbottom interconnections conductive plate 120. - A first
top interconnection 152, a secondtop interconnection 154 and a thirdtop interconnection 156 may be disposed in thethird insulation layer 148 on thesemiconductor substrate 110. The first, second and thirdtop interconnections FIG. 3B , that supply signal power to the semiconductor substrate. The firsttop interconnection 152 is electrically connected to the fourthconductive plate 150. And the second and the thirdtop interconnections conductive plate 150. - The
second bottom interconnection 124 and the firsttop interconnection 152, thefirst bottom interconnection 122 and the secondtop interconnection 154, and thefirst bottom interconnection 126 and the thirdtop interconnection 156 are respectively electrically connected through afirst contact 153, asecond contact 155, and athird contact 157. Also, a secondconductive plate 130 is electrically connected to thefirst contact 153, and a thirdconductive plate 140 is electrically connected to thesecond contact 155. Accordingly, the secondconductive plate 130 and the fourthconductive plate 150 are electrically connected to each other, and the firstconductive plate 150 and the thirdconductive plate 140 are electrically connected to each other. Also, the secondconductive plate 130 and the fourthconductive plate 150 are electrically connected to the first external terminal A through the firsttop interconnection 152, and the firstconductive plate 120 and the thirdconductive plate 140 are electrically connected to the second external terminal B through the secondtop interconnection 154. - The first to a fourth
conductive plates conductive plate 130 and the thirdconductive plate 140, the thirdconductive plate 140 and the fourthconductive plate 150, and the firstconductive plate 120 and the secondconductive plate 130 respectively constitute a first capacitor C1, a second capacitor C2, and a third capacitor C3, shown inFIG. 3B . In other words, the firstconductive plate 120 becomes a bottom electrode of the third capacitor C3, the secondconductive plate 130 becomes a bottom electrode of the second capacitor C2, the thirdconductive plate 140 becomes a bottom electrode of the second capacitor C2, and the fourthconductive plate 150 becomes a top electrode of the second capacitor C2. - According to this exemplary embodiment, four conductive plates may constitute three capacitors connected in parallel. As a result, the semiconductor device may have capacitors having high capacitance. In case the second insulation layer is comprised of high-K dielectrics, the capacitance may be increased further.
-
FIG. 4A illustrates a cross-sectional view showing a semiconductor device according to an exemplary embodiment of the present invention.FIG. 4B is a circuit diagram of the device shown inFIG. 4A . - Referring to
FIGS. 4A and 4B , a fifth, a sixth and a seventhconductive plate 130′, 140′ and 150′ may be disposed in the same construction with the construction of the second, third and fourthconductive plates substrate 110. Also, a fourth to asixth insulation layer 128′, 138′ and 148′ interposed between the fifth to the seventhconductive plates 130′, 140′ and 150′ may be further disposed in the same construction with the construction of the first to the third insulation layers 128, 138 and 148. - The fifth
conductive plate 130′ and the sixthconductive plate 140′ are made of metal, such as Ti, TiN and TaN. The seventhconductive plate 150′ may be made of metal, such as copper. - The
fourth insulation layer 128′ may function to prevent the metal from being diffused, and it may be made of a material, such as SiN, SiC and/or SiCN. Thefifth insulation layer 138′ may include a high-K dielectric material to increase capacitance. Thesixth insulation layer 148′ is an interlayer dielectric or inter-metal dielectric, and may be made of a material, such as SiO, SiOF and/or SiOC. An insulation layer made of the same material as thefourth insulation layer 128′ may be further interposed between the sixthconductive plate 140′ and thesixth insulation layer 148′. - A fourth
top interconnection 152′, a fifthtop interconnection 154′ and a sixthtop interconnection 156′ may be disposed in thesixth insulation layer 148′. The fourth to sixthtop interconnections 152′, 154′ and 156′ may be respectively electrically connected to external terminals A and B, shown inFIG. 4B , that supply signal power to the semiconductor substrate. The fourthtop interconnection 152′ is electrically connected to the seventhconductive plate 150′, and the fifth and the sixthtop interconnections 154′ and 156′ are insulated from the seventhconductive plate 150′. - The first
top interconnection 152 and the fourthtop interconnection 152′, the secondtop interconnection 154 and the fifthtop interconnection 154′, and the thirdtop interconnection 156 and the sixthtop interconnection 156′ are respectively electrically connected through afourth contact 153′, afifth contact 155′ and asixth contact 157′. Also, the fifthconductive plate 130′ is electrically connected to thefourth contact 153′, and the sixthconductive plate 140′ is electrically connected to the fifthconductive plate 130′. Accordingly, the secondconductive plate 130, the fourthconductive plate 150, the fifthconductive plate 130′, and the seventhconductive plate 150′ are electrically connected. And the firstconductive plate 120, the thirdconductive plate 150, and the sixthconductive plate 140′ are electrically connected. Also, the secondconductive plate 130, the fourthconductive plate 150, the fifthconductive plate 130′, and the seventhconductive plate 150′ are electrically connected to the first external terminal A through the fourthtop interconnection 152′, and the firstconductive plate 120, the thirdconductive plate 150, and the sixthconductive plate 140 are electrically connected to the second external terminal B through the fifthtop interconnection 154′. - The first to seventh
conductive plates conductive plates FIG. 3B . In addition, the fifthconductive plate 130′ and the sixthconductive plate 140′, and the sixthconductive plate 140′ and the seventhconductive plate 140′ respectively further constitute a fourth capacitor C1′ and a fifth capacitor C2′. In other words, the fifthconductive plate 130′ becomes a bottom electrode of the fourth capacitor C1′. The sixthconductive plate 140′ becomes a top electrode of the fourth capacitor C1′ and becomes a bottom electrode of the fifth capacitor C2′. The seventhconductive plate 150′ becomes a top electrode of the fifth capacitor C2′. - According to this exemplary embodiment, seven conductive plates may constitute five capacitors connected in parallel. As a result, the semiconductor device may include capacitors having high capacitance. In case the second insulation layer and the fifth insulation layer are formed of high-K dielectric material, the capacitance may be further increased. Also, the semiconductor device of the exemplary embodiment of the present invention may further include conductive plates disposed repeatedly in the same construction with the construction of the fifth to the seventh conductive plates.
-
FIG. 5 illustrates a plan view showing briefly a semiconductor device according to an exemplary embodiment of the present invention.FIG. 6A illustrates a cross-sectional view cut along the line II-II′ ofFIG. 5 . AndFIG. 6B is a circuit diagram of the device shown inFIG. 6A . - Referring to
FIG. 5 ,FIG. 6A , andFIG. 6B , a secondconductive plate 230, a thirdconductive plate 240, and a fourthconductive plate 250 are respectively disposed on asemiconductor substrate 210 having a firstconductive plate 220 formed thereon. The first to fourthconductive plates first insulation layer 228 is interposed between the firstconductive plate 220 and the secondconductive plate 230, asecond insulation layer 238 is interposed between the secondconductive plate 230 and the thirdconductive plate 240, and athird insulation layer 248 is interposed between the thirdconductive plate 240 and the fourthconductive plate 250. - The first
conductive plate 220 and the fourthconductive plate 250 may be made of metal, such as copper, and the secondconductive plate 230 and the thirdconductive plate 240 may be made of metal, such as Ti, TiN, and/or TaN. - The
first insulation layer 228 may function to prevent the metal material from diffusing, and it may be made of material such as SiN, SiC, and/or SiCN. Thesecond insulation layer 238 may include high-K dielectric material to increase capacitance. Thethird insulation layer 248 is an interlayer dielectric or an inter-metal dielectric, and may be made of SiO2, SiOF and/or SiOC. A further insulation layer (not shown) made of the same material as thefirst insulation layer 228 may be interposed between the thirdconductive plate 240 and thethird insulation layer 248. - The
semiconductor substrate 210 may include afirst bottom interconnection 222, asecond bottom interconnection 224, and athird bottom interconnection 226. The first to thirdbottom interconnections first bottom interconnection 222 is electrically connected to the firstconductive plate 220, and the second and the thirdbottom interconnections conductive plate 120. - A first
top interconnection 252, a secondtop interconnection 254 and a thirdtop interconnection 256 are disposed in thethird insulation layer 248. The first to thirdtop interconnections FIG. 6B , that supply signal power to the semiconductor substrate. The firsttop interconnection 252 is electrically connected to the fourthconductive plate 250, and the second and the thirdtop interconnections conductive plate 250. - The
second bottom interconnection 224 and the secondtop interconnection 254, thefirst bottom interconnection 222 and the firsttop interconnection 252, and thethird bottom interconnection 226 and the thirdtop interconnection 256 are respectively electrically connected through afirst contact 253, asecond contact 155, and athird contact 257. Also, a secondconductive plate 230 is electrically connected to thefirst contact 253, and a thirdconductive plate 240 is electrically connected to thesecond contact 155. Accordingly, the firstconductive plate 220, the thirdconductive plate 240, and the thirdconductive plate 240 are electrically connected to each other. Also, the firstconductive plate 220, the thirdconductive plate 240 and the fourthconductive plate 250 are electrically connected to a first external terminal A through the firsttop interconnection 252, and the secondconductive plate 230 is electrically connected to a second external terminal B through the secondtop interconnection 254. - The first to fourth
conductive plates conductive plate 230 and the thirdconductive plate 240, and the firstconductive plate 220 and the secondconductive plate 230 respectively constitute a first capacitor C1 and a second capacitor C2. Namely, the firstconductive plate 220 becomes a bottom electrode of the second capacitor C2, the secondconductive plate 230 becomes a top electrode of the second capacitor C2 and a bottom electrode of the first capacitor C1. The thirdconductive plate 240 becomes a top electrode of the first capacitor C1. - According to this exemplary embodiment, four conductive plates may constitute two capacitors connected in parallel. As a result, the semiconductor device may have capacitors having high capacitance. In case the second insulation layer is formed of high-K dielectric material, the capacitance may be further increased.
-
FIG. 7A illustrates a cross-sectional view of the semiconductor substrate showing a semiconductor device according to an exemplary embodiment of the present invention, andFIG. 7B is a circuit diagram of the device shown inFIG. 7A . - Referring to
FIG. 7A andFIG. 7B , the fifth to the seventhconductive plates 230′, 240′ and 250′ may be disposed in the same construction as the construction of the second to the fourthconductive plates substrate 210 ofFIG. 6A . Also, a fourth to a sixth insulation layer 118′, 238′, and 248′ interposed between the fifth to the seventhconductive plates 230′, 240′, and 250′ may be disposed in the same construction as the first to the third insulation layers 228, 238, and 248. - The fifth
conductive plate 230′ and the sixthconductive plate 240′ may be made of metal, such as Ti, TiN and/or TaN. The seventhconductive plate 250′ may be made of metal, such as copper. - The
fourth insulation layer 228′ may function to prevent the metal material from diffusing and may be made of a material, such as SiN, SiC and/or SiCN. Thefifth insulation layer 238′ may include a high-K dielectric material to increase capacitance. Thesixth insulation layer 248′ is an interlayer dielectric or an inter-metal insulation layer and may be made of a material, such as SiO, SiOF and/or SiOC. A further insulation layer (not shown) made of the same material as thefourth insulation layer 228′ may be interposed between the sixthconductive plate 240′ and thesixth insulation layer 248′. - A fourth
top interconnection 252′, a fifthtop interconnection 254′, and a sixthtop interconnection 256′ may be disposed in theinsulation layer 248′. The fourth to the sixth insulation layers 252′, 254′ and 256′ may be respectively electrically connected to external terminals A and B, shown inFIG. 7B , that supply signal power to the semiconductor substrate. The fourthtop interconnection 252′ is electrically connected to the seventhconductive plate 250′, and the fifth and the sixthtop interconnection 254′ and 256′ are insulated from the seventhconductive plate 250′. - The second
top interconnection 254 and the fifthtop interconnection 254′, the firsttop interconnection 254 and the fourthtop interconnection 252′, and the thirdtop interconnection 256 and the sixthtop interconnection 256′ are respectively electrically connected through afourth contact 253′, afifth contact 255′, and asixth contact 257′. Also, the fifthconductive plate 230′ is electrically connected to thefourth contact 253′, and the sixthconductive plate 240′ is electrically connected to thefifth contact 255′. Accordingly, the firstconductive plate 220, the thirdconductive plate 240, the fourthconductive plate 250, the sixthconductive plate 240′ and the seventhconductive plate 250′ are electrically connected, and the secondconductive plate 230 and the fifthconductive plate 230′ are electrically connected. Also, the firstconductive plate 220, the thirdconductive plate 240, the fourthconductive plate 250, the sixthconductive plate 240′ and the seventhconductive plate 250′ are electrically connected to the first external terminal A through the fourthtop interconnection 252′. The secondconductive plate 230 and the fifthconductive plate 230′ are electrically connected to the second external terminal B through the fifthtop interconnection 254′. - The first to the seventh
conductive plates fourth plates FIG. 6B . In addition, in this exemplary embodiment, the fifthconductive plate 230′ and the sixthconductive plate 240′ further constitute a third capacitor C1 and the fourthconductive plate 250 and the fifthconductive plate 230′ constitute a fourth capacitor C2′. More specifically, the fourthconductive plate 250 becomes the bottom electrode of the fourth capacitor C2′, the fifthconductive plate 230′ becomes the bottom electrode of the third capacitor C1′, and the sixthconductive plate 240′ becomes the top electrode of the third capacitor C1′. - According to this exemplary embodiment, seven conductive plates constitute four capacitors connected in parallel. Therefore, the semiconductor device may include capacitors having high capacitance. In case the second insulation layer and the fifth insulation layer are formed of high-K dielectric material, the capacitance may be further increased. Also, a semiconductor device according an exemplary embodiment of the present invention may further include conductive plates disposed repeatedly in the same construction as the construction of the fifth to the seventh conductive plates.
-
FIG. 8 is a plan view showing a semiconductor device according to an exemplary embodiment of the present invention.FIG. 9A illustrates a cross-sectional view cut along the line III-III′ ofFIG. 8 , andFIG. 9B is a circuit diagram of the device shown inFIG. 9A . - Referring to
FIG. 8 ,FIG. 9A andFIG. 9B , a secondconductive plate 330, a thirdconductive plate 340, and a fourthconductive plate 350 are respectively disposed on thesemiconductor substrate 310 having a firstconductive plate 320. The first to the fourthconductive plates first insulation layer 328 is interposed between the firstconductive plate 320 and the secondconductive plate 330, asecond insulation layer 338 is interposed between the first and the thirdconductive plates third insulation layer 348 is interposed between the third and the fourthconductive plates - The first and the fourth
conductive plates conductive plates - The
first insulation layer 328 may function to prevent the metal from diffusing, and it may be made of a material such as SiN, SiC or SiCN. Thesecond insulation layer 338 may include a high-K dielectric material to increase capacitance. Thethird insulation layer 348 is an interlayer dielectric or an inter-metal dielectric, made of a material, such as SiO2, SiOF or SiOC. A further insulation layer (not shown) made of the same material as thefirst insulation layer 328 may be interposed between the thirdconductive layer 340 and thethird insulation layer 348. - The
semiconductor substrate 310 may include afirst bottom interconnection 322, asecond bottom interconnection 324, and athird bottom interconnection 326. The first to thirdbottom interconnections semiconductor substrate 310 under them. Thefirst bottom interconnection 322 is electrically connected to the firstconductive plate 320, and the second and thirdbottom interconnection conductive plate 320. - A first
top interconnection 352, a secondtop interconnection 354, and a thirdtop interconnection 356 may be disposed in thethird insulation layer 348. The first, second and thirdtop interconnections FIG. 9B , that supply signal power to the semiconductor substrate. The firsttop interconnection 352 is electrically connected to the fourthconductive plate 350. And the second and the thirdtop interconnections conductive plate 350. - The
second bottom interconnection 324 and the secondtop interconnection 354, thefirst bottom interconnection 322 and the firsttop interconnection 352, and thethird bottom interconnection 326 and the thirdtop interconnection 356 are respectively electrically connected through afirst contact 353, asecond contact 355, and athird contact 357. Also, a thirdconductive plate 340 is electrically connected to thefirst contact 353, and a secondconductive plate 330 is electrically connected to thesecond contact 355. Accordingly, the firstconductive plate 320, the secondconductive plate 330, and the fourthconductive plate 350 are electrically connected. Also, the first, second, and fourthconductive plates top interconnection 352, and the thirdconductive plate 340 is electrically connected to the second external terminal B through the secondtop interconnection 354. - The first to fourth
conductive plates conductive plate 330 and the thirdconductive player 340, the thirdconductive plate 340 and the fourthconductive plate 350, respectively constitute a first capacitor C1 and a second capacitor C2. In other words, the secondconductive plate 330 becomes a bottom electrode of the first capacitor C1, the thirdconductive plate 340 becomes a top electrode of the first capacitor C2, and it becomes a bottom electrode of the second capacitor C2, and the fourthconductive plate 350 becomes a top electrode of the second capacitor C2. - According to this exemplary embodiment, four conductive plates may constitute two capacitors connected in parallel. As a result, the semiconductor device may have capacitors having high capacitance. In case the second insulation layer is formed of high-K dielectric material, the capacitance may be increased further.
-
FIG. 10A illustrates a cross-sectional view of a semiconductor substrate showing a semiconductor device according to an exemplary embodiment of this invention.FIG. 10B is a circuit diagram of the device shown inFIG. 10A . - Referring to
FIG. 10A andFIG. 10B , the fifth to the seventhconductive plates 330′, 340′ and 350′ may be disposed in the same construction as the construction of the second to the fourthconductive plates substrate 310 shown inFIG. 6A . Also, a fourth to a sixth insulation layer 318′, 338′ and 348′ interposed between the fifth to the seventhconductive plates 330′, 340′ and 350′ may be disposed in the same construction as the first to third insulation layers 328, 338, and 348. - The fifth and the sixth
conductive plates 330′ and 340′ may be made of metal, such as Ti, TiN and/or TaN. The seventhconductive plate 350′ may be made of metal, such as copper. - The
fourth insulation layer 328′ may function to prevent the metal material from diffusing and may be made of material, such as SiN, SiC and/or SiCN. Thefifth insulation layer 338′ may include a high-K dielectric material to increase capacitance. Thesixth insulation layer 348′ is an interlayer dielectric or an inter-metal insulation layer and may be made of material, such as SiO, SiOF and/or SiOC. A further insulation layer (not shown) made of the same material as thefourth insulation layer 328′ may be interposed between the sixthconductive plate 340′ and thesixth insulation layer 348′. - A fourth
top interconnection 352′, a fifthtop interconnection 354′, and a sixthtop interconnection 356′ may be disposed in thesixth insulation layer 348′. The fourth to sixthtop interconnections 352′, 354′ and 356′ may be respectively electrically connected to external terminals A and B, shown inFIG. 10B , that supply signal power to the semiconductor substrate. The fourthtop interconnection 352′ is electrically connected to the seventhconductive plate 350′, and the fifth and sixthtop interconnections 354′ and 356′ are insulated from the seventhconductive plate 350′. - The second
top interconnection 354 and the fifthtop interconnection 354′, the firsttop interconnection 352 and the fourthtop interconnection 352′, and the thirdtop interconnection 356 and the sixthtop interconnection 356′ are respectively electrically connected through afourth contact 353′, afifth contact 355′, and asixth contact 357′. Also, the fifthconductive plate 330′ is electrically connected to thefifth contact 355′, and the sixthconductive plate 340′ is electrically connected to thefourth contact 353′. Accordingly, the firstconductive plate 320, the thirdconductive plate 330, the fourthconductive plate 350, the fifthconductive plate 330′, and the seventhconductive plate 350′ are electrically connected. The thirdconductive plate 340 and the sixthconductive plate 340′ are electrically connected. Also, the firstconductive plate 320, the secondconductive plate 330, the fourthconductive plate 350, the fifthconductive plate 330′ and the seventhconductive plate 350′ are electrically connected to the first external terminal A through the fourthtop interconnection 352′. The third and the fifthconductive plates top interconnection 354′. - The first to seventh
conductive plates fourth plates FIG. 9B . In addition, in this exemplary embodiment, the fifthconductive plate 330′ and the sixthconductive plate 340′ further constitute a third capacitor C1′, and the sixthconductive plate 340′ and the seventhconductive plate 350′ constitute a fourth capacitor C2′. More specifically, the fifthconductive plate 330′ becomes the bottom electrode of the third capacitor C1′, the sixthconductive plate 340′ becomes the top electrode of the third capacitor C1′, and the sixthconductive plate 240′ becomes the top electrode of the third capacitor C1′. - According to this exemplary embodiment, seven conductive plates constitute four capacitors connected in parallel. Therefore, the semiconductor device may include capacitors having high capacitance. In case the second insulation layer and the fifth insulation layer are a high-K dielectric material, the capacitance may be further increased. Also, a semiconductor device according to an exemplary embodiment of the present invention may further include conductive plates disposed repeatedly in the same construction as the construction of the fifth to the seventh conductive plates.
- In the above-described exemplary embodiments, the conductive plates and the interconnections may further include a barrier metal layer capable of preventing the metal from being diffused.
-
FIGS. 11 to 14 illustrate cross-sectional view cut along the line I-I′ ofFIG. 2 to describe a method of fabricating a semiconductor device according to an exemplary embodiment of the present invention. - Referring to
FIGS. 2 and 11 , afirst insulation layer 128 is formed on thesemiconductor substrate 110 where a firstconductive plate 120 and a first to thirdbottom interconnections conductive plate 120 and the first to thirdbottom interconnections first insulation layer 128 may be made of a material, such as SiN, SiC, and/or SiCN, which is capable of preventing metal from being diffused. A secondconductive plate 130 is formed so that it overlaps with the firstconductive plate 120 on thefirst insulation layer 128 and may be made of metal such as Ti, TiN, and/or TaN. - Referring to
FIGS. 2 and 12 , asecond insulation layer 138 and a thirdconductive plate 140 are formed on the secondconductive plate 130. Thesecond insulation layer 138 may be made of a silicon insulation layer, such as SiO2, SiN, and/or SiON or a metal insulation layer such as Ta2O5, HfO, Al2O3. A high-k dielectric material may be used in order to increase capacitance. The thirdconductive plate 140 is formed so that it overlaps the secondconductive plate 130, and may be made of metal such as Ti, TiN or TaN. - Referring to
FIGS. 2 and 13 , athird insulation layer 148 is formed on the entire surface of asemiconductor substrate 110. Thethird insulation layer 148 may be made of SiO2, SiOF or SiOC. Thethird insulation layer 148 may be referred to as an interlayer dielectric or an inter-metal dielectric. Before forming thethird insulation layer 148, an insulation layer (not shown) that functions to prevent metal from being diffused may further be formed on theconductive plate 140. - After that, an etch process is performed to form a plate-
type groove 160, line-type grooves second bottom interconnection 124 and a secondconductive plate 130 are exposed through thefirst contact hole 163. Abottom interconnection 122 and a thirdconductive plate 140 are exposed through thesecond contact hole 165, and athird bottom interconnection 126 is exposed through thethird contact hole 167. During the etching process, the first to the thirdbottom interconnections - Referring to
FIG. 2 andFIG. 14 ,grooves top interconnections third contacts - A
second bottom interconnection 124, a secondconductive plate 130, a firsttop interconnection 152, and a fourthconductive plate 150 are electrically connected through thefirst contact 153. Also, a firstconductive plate 120, a thirdconductive plate 140, and a secondtop interconnection 154 are electrically connected through thesecond contact 155. Even though the first and thesecond contacts conductive plates second contacts conductive plates third bottom interconnection 126 and a thirdtop interconnection 156 may be electrically connected through thethird contact 157. -
FIGS. 15 to 18 illustrate cross-sectional views cut along the line II-II′ ofFIG. 5 to describe a method of fabricating a semiconductor device according to an exemplary embodiment of the present invention. - Referring to
FIG. 5 andFIG. 15 , afirst insulation layer 228 is formed on asemiconductor substrate 210 where first to thirdbottom interconnections conductive plate 230 is formed so that it overlaps with the firstconductive plate 220 on thefirst insulation layer 228. - Referring to
FIG. 5 andFIG. 16 , asecond insulation layer 238 and a thirdconductive plate 240 are formed on the secondconductive plate 230. Thesecond insulation layer 238 may be made of a high-K dielectric material in order to increase capacitance. The thirdconductive plate 240 is formed so that it overlaps with the secondconductive plate 230. - Referring to
FIG. 5 andFIG. 17 , athird insulation layer 248 is formed on the entire surface of thesemiconductor substrate 210. Before forming thethird insulation layer 248, an insulation layer (not shown) that functions to prevent metal from being diffused, such as thefirst insulation layer 128, may further be formed on the thirdconductive plate 240. - Subsequently, an etching process is performed to form a plate-
type groove 260, line-type grooves second bottom interconnection 224 and a secondconductive plate 230 are exposed through thefirst contact hole 263. Abottom interconnection 222 and a thirdconductive plate 240 are exposed through thesecond contact hole 265, and athird bottom interconnection 226 is exposed through thethird contact hole 267. During the etch process, the first to the thirdbottom interconnections - Referring to
FIG. 5 andFIG. 18 ,grooves conductive plate 250, first to thirdtop interconnections third contacts - A
second bottom interconnection 224, a secondconductive plate 230, and a secondtop interconnection 254 are electrically connected through thefirst contact 253. Also, a firstconductive plate 220, a thirdconductive plate 240, a firsttop interconnection 252 and a fourthconductive plate 250 are electrically connected through thesecond contact 255. Athird bottom interconnection 226 and a thirdtop interconnection 256 are electrically connected through thethird contact 257. -
FIG. 19 toFIG. 22 illustrate cross-sectional views cut along the line III-III′ ofFIG. 8 to describe a method of fabricating a semiconductor device according to an exemplary embodiment of the present invention. - Referring to
FIG. 8 andFIG. 19 , afirst insulation layer 328 is formed on asemiconductor substrate 310 where a firstconductive plate 320 and first to thirdbottom interconnections conductive plate 330 is formed so that it overlaps with the firstconductive plate 320 on thefirst insulation layer 328. - Referring to
FIG. 8 andFIG. 20 , asecond insulation layer 338 and a thirdconductive plate 340 are formed on the secondconductive plate 330. Thesecond insulation layer 338 may be made of a high-K dielectric material in order to increase capacitance. The thirdconductive plate 340 is formed so that it overlaps with the secondconductive plate 330. - Referring to
FIG. 8 andFIG. 21 , athird insulation layer 348 is formed on the entire surface of a semiconductor substrate. Before forming thethird insulation layer 348, an insulation layer (not shown) functioning to prevent metal from being diffused, like thefirst insulation layer 128, may further be formed on the thirdconductive plate 140. - Next, an etch process is performed to form a plate-type groove 360, line-type grooves 362, 365, and 367, and first to third contact holes 363, 365 and 367. A
second bottom interconnection 324 and a thirdconductive plate 340 are exposed through thefirst contact hole 363. Abottom interconnection 322 and a secondconductive plate 330 are exposed through the second contact hole 365, and athird bottom interconnection 326 is exposed through the third contact hole 367. During the etch process, the first to the thirdbottom interconnections - Referring to
FIG. 8 andFIG. 22 ,grooves 360, 362, 364, and 366 and the first to third contact holes 353, 355, and 357 are filled with metal to form a fourthconductive plate 350, and first to thirdtop interconnections third contacts - A
second bottom interconnection 324, a thirdconductive plate 340, and a secondconductive plate 340 are electrically connected through thefirst contact 353. Also, a firstconductive plate 320, a secondconductive plate 330, a firsttop interconnection 352, and a fourthconductive plate 350 are electrically connected through thesecond contact 355. Athird bottom interconnection 326 and a thirdtop interconnection 356 may be electrically connected through thethird bottom interconnection 326. - In the above-described exemplary embodiments, before or after forming the conductive plates and interconnections, a barrier metal layer that prevents metal of the conductive plates and interconnections from being diffused may further be formed.
- Although the present invention has been described in connection with the exemplary embodiments illustrated in the accompanying drawings, it is not limited thereto. It will be apparent to those of ordinary skill in the art that various substitutions, modifications and changes may be made thereto without departing from the scope and spirit of the invention.
- According to exemplary embodiments of the present invention, the semiconductor device may include capacitors having high capacitance.
- According to exemplary embodiments of the present invention, the capacitors may be formed stably.
Claims (12)
1. A semiconductor device comprising:
a first conductive plate and a second conductive plate;
a first insulation layer interposed between the first conductive plate and the second conductive plate;
an interconnection electrically connected to one of the first conductive plate and the second conductive plate;
a third conductive plate integrally formed with the interconnection, the third conductive plate constituting a capacitor with at least one of the first or the second conductive plates.
2. The semiconductor device of claim 1 , wherein the first insulation layer comprises a high-K dielectric material.
3. The semiconductor device of claim 1 , wherein the first and the second conductive plates comprise a Ti or Ta based metal.
4. The semiconductor device of claim 1 , wherein the interconnection and the third conductive plate comprise copper.
5. The semiconductor device of claim 4 , further comprising a contact integrally formed with the interconnection.
6. A semiconductor device comprising:
a first metal electrode;
a second metal electrode;
a first insulation layer between the first metal electrode and the second metal electrode;
a first metal interconnection electrically connected to the first metal electrode;
a second metal interconnection electrically connected to the second metal electrode; and
a third metal electrode integrally formed with one of the first metal interconnection and the second interconnection.
7. The semiconductor device of claim 6 , further comprising:
a first metal contact made of the same material as the first metal interconnection; and
a second metal contact made of the same material as the second metal interconnection.
8. The semiconductor device of claim 6 , wherein the first insulation layer comprises a high-K dielectric material.
9. The semiconductor device of claim 6 , wherein the first metal electrode and the second metal electrode comprise a Ti or Ta based metal.
10. The semiconductor device of claim 6 , wherein the first metal interconnection, the second metal interconnection, and the third metal electrode comprise copper.
11. The semiconductor device of claim 10 , further comprising a second insulation layer made of a copper diffusion barrier material.
12. The semiconductor device of claim 11 , wherein the second insulation layer comprises at least one of SiN, SiC, or SiCN.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/443,442 US20120193794A1 (en) | 2006-06-08 | 2012-04-10 | Semiconductor device and method of fabricating the same |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2006-51510 | 2006-06-08 | ||
KR1020060051510A KR100764741B1 (en) | 2006-06-08 | 2006-06-08 | Semiconductor device and method for forming the same |
US11/760,092 US7884409B2 (en) | 2006-06-08 | 2007-06-08 | Semiconductor device and method of fabricating the same |
US12/959,737 US20110070718A1 (en) | 2006-06-08 | 2010-12-03 | Semiconductor device and method of fabricating the same |
US13/443,442 US20120193794A1 (en) | 2006-06-08 | 2012-04-10 | Semiconductor device and method of fabricating the same |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/959,737 Continuation US20110070718A1 (en) | 2006-06-08 | 2010-12-03 | Semiconductor device and method of fabricating the same |
Publications (1)
Publication Number | Publication Date |
---|---|
US20120193794A1 true US20120193794A1 (en) | 2012-08-02 |
Family
ID=39150270
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/760,092 Expired - Fee Related US7884409B2 (en) | 2006-06-08 | 2007-06-08 | Semiconductor device and method of fabricating the same |
US12/959,737 Abandoned US20110070718A1 (en) | 2006-06-08 | 2010-12-03 | Semiconductor device and method of fabricating the same |
US13/443,442 Abandoned US20120193794A1 (en) | 2006-06-08 | 2012-04-10 | Semiconductor device and method of fabricating the same |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/760,092 Expired - Fee Related US7884409B2 (en) | 2006-06-08 | 2007-06-08 | Semiconductor device and method of fabricating the same |
US12/959,737 Abandoned US20110070718A1 (en) | 2006-06-08 | 2010-12-03 | Semiconductor device and method of fabricating the same |
Country Status (2)
Country | Link |
---|---|
US (3) | US7884409B2 (en) |
KR (1) | KR100764741B1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20190181215A1 (en) * | 2017-12-07 | 2019-06-13 | Globalfoundries Inc. | On-chip resistors with direct wiring connections |
US20220310484A1 (en) * | 2021-03-24 | 2022-09-29 | Changxin Memory Technologies, Inc. | Semiconductor structure and fabrication method thereof |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010040797A (en) * | 2008-08-06 | 2010-02-18 | Renesas Technology Corp | Semiconductor device, and method of manufacturing the same |
US7879681B2 (en) * | 2008-10-06 | 2011-02-01 | Samsung Electronics Co., Ltd. | Methods of fabricating three-dimensional capacitor structures having planar metal-insulator-metal and vertical capacitors therein |
IT1392793B1 (en) * | 2008-12-30 | 2012-03-23 | St Microelectronics Srl | INTEGRATED CONDENSER WITH NON-UNIFORM THICKNESS PLATE |
US20100224960A1 (en) * | 2009-03-04 | 2010-09-09 | Kevin John Fischer | Embedded capacitor device and methods of fabrication |
US9331137B1 (en) * | 2012-03-27 | 2016-05-03 | Altera Corporation | Metal-insulator-metal capacitors between metal interconnect layers |
CN104103495A (en) * | 2013-04-02 | 2014-10-15 | 中芯国际集成电路制造(上海)有限公司 | Semiconductor device with MIM capacitor and formation method thereof |
US9276057B2 (en) * | 2014-01-27 | 2016-03-01 | United Microelectronics Corp. | Capacitor structure and method of manufacturing the same |
US9385079B2 (en) * | 2014-01-29 | 2016-07-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods for forming stacked capacitors with fuse protection |
US20150264813A1 (en) * | 2014-03-11 | 2015-09-17 | United Microelectronics Corp. | Chip-stack interposer structure including passive device and method for fabricating the same |
TWI709248B (en) * | 2015-12-10 | 2020-11-01 | 聯華電子股份有限公司 | Capacitor and fabrication method thereof |
US10741488B2 (en) * | 2017-09-29 | 2020-08-11 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor device with integrated capacitor and manufacturing method thereof |
US10446483B2 (en) * | 2018-01-16 | 2019-10-15 | Globalfoundries Inc. | Metal-insulator-metal capacitors with enlarged contact areas |
KR20200128315A (en) | 2019-05-03 | 2020-11-12 | 삼성전자주식회사 | Semiconductor device |
US11610999B2 (en) * | 2020-06-10 | 2023-03-21 | Globalfoundries Dresden Module One Limited Liability Company & Co. Kg | Floating-gate devices in high voltage applications |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030178666A1 (en) * | 2002-03-21 | 2003-09-25 | Ki-Young Lee | Semiconductor device with analog capacitor and method of fabricating the same |
US6933551B1 (en) * | 2002-04-05 | 2005-08-23 | Zarlink Semiconductor Limited | Large value, compact, high yielding integrated circuit capacitors |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5643804A (en) * | 1993-05-21 | 1997-07-01 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a hybrid integrated circuit component having a laminated body |
US5745333A (en) * | 1994-11-21 | 1998-04-28 | International Business Machines Corporation | Laminar stackable circuit board structure with capacitor |
US5649804A (en) * | 1995-05-12 | 1997-07-22 | Schychuck; James | Pick and place machine |
US5774326A (en) * | 1995-08-25 | 1998-06-30 | General Electric Company | Multilayer capacitors using amorphous hydrogenated carbon |
KR0183739B1 (en) * | 1995-09-19 | 1999-03-20 | 김광호 | Apparatus and method of manufacturing semiconductor device including decoupling capacitor |
KR0175277B1 (en) * | 1996-02-29 | 1999-02-01 | 김광호 | Apparatus and method for manufacturing power semiconductor device with a folding fieldplate structure |
US6115233A (en) * | 1996-06-28 | 2000-09-05 | Lsi Logic Corporation | Integrated circuit device having a capacitor with the dielectric peripheral region being greater than the dielectric central region |
US6180976B1 (en) * | 1999-02-02 | 2001-01-30 | Conexant Systems, Inc. | Thin-film capacitors and methods for forming the same |
KR100587662B1 (en) * | 1999-05-27 | 2006-06-08 | 삼성전자주식회사 | Capacitor of semicon ductor device and method for fabricating the same |
KR100356135B1 (en) * | 1999-12-08 | 2002-10-19 | 동부전자 주식회사 | Method for fabricating a semiconductor device |
KR100389032B1 (en) | 2000-11-21 | 2003-06-25 | 삼성전자주식회사 | Ferroelectric memory device and method for forming the same |
KR20020066090A (en) | 2001-02-09 | 2002-08-14 | 주식회사 하이닉스반도체 | Method of fabricating a capacitor in a semiconductor device |
KR100393975B1 (en) * | 2001-04-19 | 2003-08-06 | 주식회사 하이닉스반도체 | Method for fabricating ferroelectric capacitor of semiconductor device |
JP4226804B2 (en) * | 2001-06-25 | 2009-02-18 | 株式会社東芝 | Semiconductor device and manufacturing method thereof |
US7111179B1 (en) * | 2001-10-11 | 2006-09-19 | In-Hand Electronics, Inc. | Method and apparatus for optimizing performance and battery life of electronic devices based on system and application parameters |
JP2003234410A (en) * | 2002-02-08 | 2003-08-22 | Fujitsu Ltd | Capacitor, method for manufacturing the same, and semiconductor device |
US7229875B2 (en) * | 2002-10-17 | 2007-06-12 | Samsung Electronics Co., Ltd. | Integrated circuit capacitor structure |
JP4118202B2 (en) | 2002-10-21 | 2008-07-16 | 株式会社リコー | Semiconductor device and manufacturing method thereof |
US20040231885A1 (en) * | 2003-03-07 | 2004-11-25 | Borland William J. | Printed wiring boards having capacitors and methods of making thereof |
US7176082B2 (en) * | 2003-04-08 | 2007-02-13 | Lsi Logic Corporation | Analog capacitor in dual damascene process |
JP4342854B2 (en) * | 2003-07-09 | 2009-10-14 | 株式会社東芝 | Semiconductor device and manufacturing method thereof |
KR100532455B1 (en) * | 2003-07-29 | 2005-11-30 | 삼성전자주식회사 | Method for manufacturing semiconductor device including MIM capacitor and interconnect structure |
US20050116276A1 (en) * | 2003-11-28 | 2005-06-02 | Jing-Horng Gau | Metal-insulator-metal (MIM) capacitor and fabrication method for making the same |
US7317221B2 (en) * | 2003-12-04 | 2008-01-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | High density MIM capacitor structure and fabrication process |
KR100591148B1 (en) * | 2003-12-31 | 2006-06-19 | 동부일렉트로닉스 주식회사 | Capacitor in semiconductor device and manufacturing method thereof |
TWI314745B (en) * | 2004-02-02 | 2009-09-11 | Ind Tech Res Inst | Method and apparatus of non-symmetrical electrode of build-in capacitor |
KR100549002B1 (en) | 2004-02-04 | 2006-02-02 | 삼성전자주식회사 | Semiconductor device having a dual MIM capacitor and method of fabricating the same |
US6919244B1 (en) * | 2004-03-10 | 2005-07-19 | Motorola, Inc. | Method of making a semiconductor device, and semiconductor device made thereby |
KR100564626B1 (en) * | 2004-05-28 | 2006-03-28 | 삼성전자주식회사 | Metal-insulator-metal capacitors having high capacitance and method for manufacturing the same |
JP5038612B2 (en) * | 2005-09-29 | 2012-10-03 | 富士通セミコンダクター株式会社 | Semiconductor device |
-
2006
- 2006-06-08 KR KR1020060051510A patent/KR100764741B1/en not_active IP Right Cessation
-
2007
- 2007-06-08 US US11/760,092 patent/US7884409B2/en not_active Expired - Fee Related
-
2010
- 2010-12-03 US US12/959,737 patent/US20110070718A1/en not_active Abandoned
-
2012
- 2012-04-10 US US13/443,442 patent/US20120193794A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030178666A1 (en) * | 2002-03-21 | 2003-09-25 | Ki-Young Lee | Semiconductor device with analog capacitor and method of fabricating the same |
US6933551B1 (en) * | 2002-04-05 | 2005-08-23 | Zarlink Semiconductor Limited | Large value, compact, high yielding integrated circuit capacitors |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20190181215A1 (en) * | 2017-12-07 | 2019-06-13 | Globalfoundries Inc. | On-chip resistors with direct wiring connections |
US10566411B2 (en) * | 2017-12-07 | 2020-02-18 | Globalfoundries Inc. | On-chip resistors with direct wiring connections |
US20220310484A1 (en) * | 2021-03-24 | 2022-09-29 | Changxin Memory Technologies, Inc. | Semiconductor structure and fabrication method thereof |
Also Published As
Publication number | Publication date |
---|---|
US20110070718A1 (en) | 2011-03-24 |
KR100764741B1 (en) | 2007-10-08 |
US7884409B2 (en) | 2011-02-08 |
US20080054329A1 (en) | 2008-03-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7884409B2 (en) | Semiconductor device and method of fabricating the same | |
US6876028B1 (en) | Metal-insulator-metal capacitor and method of fabrication | |
US7307335B2 (en) | Semiconductor device having MOS varactor and methods for fabricating the same | |
JP5568494B2 (en) | Integrated circuit capacitor structure | |
US7538375B2 (en) | Capacitor structure of semiconductor device and method of fabricating the same | |
US7560795B2 (en) | Semiconductor device with a capacitor | |
US20050263848A1 (en) | Metal-insulator-metal capacitor having a large capacitance and method of manufacturing the same | |
US7323736B2 (en) | Method to form both high and low-k materials over the same dielectric region, and their application in mixed mode circuits | |
US7071057B2 (en) | Methods of fabricating MIM capacitors of semiconductor devices | |
US11152305B1 (en) | Semiconductor device and method of manufacturing the same | |
TWI755679B (en) | Capacitor structure and method of fabricating the same | |
KR101146225B1 (en) | Method for manufacturing a semiconductor device | |
KR101557871B1 (en) | Semiconductor device and method of manufacturing the semiconductor device | |
KR100650192B1 (en) | Semiconductor device and method for forming the same | |
KR100641983B1 (en) | Metal-insulator-metal capacitor having dual damascene structure and method of fabricating the same | |
US20070145599A1 (en) | Metal-insulator-metal (MIM) capacitor and methods of manufacturing the same | |
KR101044612B1 (en) | Method of manufacturing a semiconductor device | |
TWI727828B (en) | Semiconductor device and method of manufacturing the same | |
CN113838833B (en) | Semiconductor device and method for manufacturing the same | |
TWI749983B (en) | Metal-insulator-metal capacitor and method of manufacturing the same | |
US20230395649A1 (en) | Metal-insulator-metal (mim) capacitor module | |
JP2010040775A (en) | Semiconductor device and manufacturing method thereof | |
KR100734144B1 (en) | Method of fabricating MIM capacitor | |
KR100447730B1 (en) | Semiconductor device and method of manufacturing the same | |
KR20060017023A (en) | Metal-insulator-metal capacitor having high capacitance and processing thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |