US20100307730A1 - Liquid-cooled heat dissipating device and method of making the same - Google Patents

Liquid-cooled heat dissipating device and method of making the same Download PDF

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Publication number
US20100307730A1
US20100307730A1 US12/802,214 US80221410A US2010307730A1 US 20100307730 A1 US20100307730 A1 US 20100307730A1 US 80221410 A US80221410 A US 80221410A US 2010307730 A1 US2010307730 A1 US 2010307730A1
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US
United States
Prior art keywords
liquid
chamber
cover plate
heat dissipating
surrounding wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/802,214
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English (en)
Inventor
Wen-Chung Chiang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tong Hsing Electronic Industries Ltd
Original Assignee
High Conduction Scientific Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by High Conduction Scientific Co Ltd filed Critical High Conduction Scientific Co Ltd
Assigned to HIGH CONDUCTION SCIENTIFIC CO., LTD. reassignment HIGH CONDUCTION SCIENTIFIC CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHIANG, WEN-CHUNG
Publication of US20100307730A1 publication Critical patent/US20100307730A1/en
Assigned to TONG HSING ELECTRONIC INDUSTRIES, LTD. reassignment TONG HSING ELECTRONIC INDUSTRIES, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HIGH CONDUCTION SCIENTIFIC CO., LTD.
Priority to US14/077,430 priority Critical patent/US20140090825A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/04—Constructions of heat-exchange apparatus characterised by the selection of particular materials of ceramic; of concrete; of natural stone
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/18—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes sintered
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Definitions

  • This invention relates to a liquid-cooled heat dissipating device, more particularly to a liquid-cooled heat dissipating device made by sinter-bonding and to a method of making the same.
  • a conventional liquid-cooled heat dissipating device 9 is adapted to be installed on an electronic component (not shown), such as a central processing unit (CPU) of a computer, and to dissipate heat from the same.
  • the liquid-cooled heat dissipating device 9 includes a chamber-confining body 91 , a cover plate 92 , an inflow tube 93 , an outflow tube 94 , a plurality of screws 95 , and an annular seal 96 .
  • the chamber-confining body 91 has a base wall 911 , a surrounding wall 912 that is connected to the base wall 911 and that surrounds a liquid chamber suitable for receiving a liquid coolant, a plurality of screw holes 913 that are formed with the surrounding wall 912 and that threadedly engage the screws 95 , and a plurality of dividing walls 914 that are formed on the base wall 911 , that respectively have one end connected to the surrounding wall 912 , and that divide the liquid chamber into a plurality of channels 915 which are interconnected.
  • the inflow and outflow tubes 93 , 94 are connected to the surrounding wall 912 , and are in spatial communication with the liquid chamber (i.e., the channels 915 ).
  • the cover plate 92 is formed with a plurality of through-holes 921 that correspond in position to the respective screw holes 913 of the chamber-confining body 91 .
  • the screws 95 extend through the through-holes 921 of the cover plate 92 and threadedly engage the screw holes 913 , thereby being able to fix the cover plate 92 on the chamber-confining body 91 .
  • the annular seal 96 is mounted on the surrounding wall 912 so as to prevent leakage of the liquid coolant.
  • the liquid-cooled heat dissipating device 9 is connected to a pump for transferring the liquid coolant into and out of the liquid-cooled heat dissipating device 9 , and the base wall 911 is attached to an electronic component (e.g., CPU). Heat generated by the electronic component is transferred to the liquid coolant in the liquid-cooled heat dissipating device 9 through the base wall 911 .
  • the pump that can circulate the liquid coolant, the heat absorbed by the liquid-cooled heat dissipating device 9 can be transferred. Therefore, the heat from the electronic component can be dissipated, and a temperature of the same can be lowered.
  • the screws 95 , the through-holes 921 , and the screw holes 913 are required to fix the chamber-confining body 91 and the cover plate 92 together, a production cost of the liquid-cooled heat dissipating device 9 is increased.
  • the cover plate 92 and the chamber-confining body 91 must be assembled using the screws 95 , thereby causing inconvenience.
  • the annular seal 96 may go through aging and deformation such that leakage of the liquid coolant may eventually occur. Thus, the electronic component attached to the liquid-cooled heat dissipating device 9 may be damaged.
  • the object of the present invention is to provide a liquid-cooled heat dissipating device that can overcome the aforesaid drawbacks of the prior art, and a method of making the same.
  • a liquid-cooled heat dissipating device includes a chamber-confining body confining a liquid chamber adapted to receive a liquid coolant, and having a surrounding wall that surrounds the liquid chamber, a cover plate covering the liquid chamber and sinter-bonded to the surrounding wall, a liquid inlet spatially communicating with the liquid chamber, and a liquid outlet spatially communicating with the liquid chamber.
  • a method of making a liquid-cooled heat dissipating device comprises: providing a surrounding wall surrounding a liquid chamber adapted to receive a liquid coolant; providing a cover plate having an oxide layer; and covering the liquid chamber with the cover plate and sinter-bonding the cover plate to the surrounding wall by placing the oxide layer in contact with a top open end of the surrounding wall.
  • FIG. 1 is an exploded perspective view of a conventional liquid-cooled heat dissipating device
  • FIG. 2 is a schematic perspective view of the first preferred embodiment of a liquid-cooled heat dissipating device according to the present invention
  • FIG. 3 is an exploded perspective view of the liquid-cooled heat dissipating device shown in FIG. 2 ;
  • FIG. 4 shows the steps of making the liquid-cooled heat dissipating device shown in FIG. 2 ;
  • FIG. 5 is a fragmentary sectional view of the second preferred embodiment of the liquid-cooled heat dissipating device according to the present invention.
  • FIG. 6 is a schematic perspective view of the third preferred embodiment of the liquid-cooled heat dissipating device according to the present invention.
  • FIG. 7 is an exploded perspective view of the liquid-cooled heat dissipating device shown in FIG. 6 ;
  • FIG. 8 shows the steps of making the liquid-cooled heat dissipating device shown in FIG. 6 ;
  • FIG. 9 is a fragmentary sectional view of the fourth preferred embodiment of the liquid-cooled heat dissipating device according to the present invention.
  • the first preferred embodiment of a liquid-cooled heat dissipating device 101 is adapted to lower a temperature of an electronic component (not shown) such as a CPU of a computer.
  • the liquid-cooled heat dissipating device 101 includes a chamber-confining body 22 and a cover plate 23 .
  • the chamber-confining body 22 confines a liquid chamber suitable for receiving a liquid coolant, and has a surrounding wall 221 that surrounds the liquid chamber, a base plate 21 , and a plurality of dividing walls 224 .
  • the surrounding wall 221 has a top open end 222 and a bottom open end 223 opposite to the top open end 222 , and is formed with a liquid inlet 24 and a liquid outlet 25 .
  • Each of the dividing walls 224 has one end connected to an inner wall surface of the surrounding wall 221 .
  • the dividing walls 224 divide the liquid chamber into a plurality of channels 225 that are interconnected. The liquid coolant is able to flow through the channels 225 .
  • the surrounding wall 221 , the base plate 21 , and the dividing walls 224 are made of copper.
  • the cover plate 23 covers the liquid chamber, is made of copper, and has opposite top and bottom surfaces 231 , 232 .
  • the cover plate 23 is sinter-bonded to the top open end 222 of the surrounding wall 221 .
  • the base plate 21 has opposite top and bottom surfaces 211 , 212 . In this embodiment, the base plate 21 is sinter-bonded to the bottom open end 223 of the surrounding wall 221 .
  • the liquid inlet 24 and the liquid outlet 25 spatially communicate with the liquid chamber (i.e., the channels 225 ).
  • the liquid coolant is able to flow into the liquid chamber via the liquid inlet 24 and to flow out of the liquid chamber via the liquid outlet 25 .
  • the liquid-cooled heat dissipating device 101 further includes tubes 27 that are adapted to be coupled to a pump, and that are respectively connected to the liquid inlet 24 and the liquid outlet 25 .
  • the tubes 27 may be integrally formed with the surrounding wall 221 using a die casting process, or may be attached to the surrounding wall 221 after formation of the surrounding wall 221 .
  • liquid inlet 24 and the liquid outlet 25 could be formed at other positions (e.g., on the cover plate 23 and the base plate 21 ) as long as the liquid inlet 24 and the liquid outlet 25 are able to spatially communicate with the liquid chamber (i.e., the channels 225 ). Nevertheless, the liquid inlet 24 and the liquid outlet 25 are preferably formed at proper positions that can maximize a flow distance of the liquid coolant in the liquid-cooled heat dissipating device 101 so as to maximize a contact area between the liquid coolant and the liquid-cooled heat dissipating device 101 .
  • the metal materials of the cover plate 23 and the base plate 21 , and the metal material of the surrounding wall 221 are melted to form eutectics.
  • the sinter-bonding step and a cooling step there are no gaps formed between the cover plate 23 and the surrounding wall 221 , and between the base plate 21 and the surrounding wall 221 . Therefore, fastening members, such as screws, are not required for the liquid-cooled heat dissipating device 101 of this invention.
  • the liquid coolant in the liquid-cooled heat dissipating device 101 of this invention can be prevented from leakage such that a waterproof seal is not needed.
  • the liquid-cooled heat dissipating device 101 further includes a plurality of thermally conductive elements 26 that are disposed between the dividing walls 224 and in the channels 225 .
  • the thermally conductive elements 26 can be connected to the base plate 21 or the dividing walls 224 .
  • the thermally conductive elements 26 are copper balls and are connected to the dividing walls 224 .
  • the thermally conductive elements 26 are able to increase the contact area between the liquid coolant and the liquid-cooled heat dissipating device 101 , thereby being capable of enhancing heat exchange efficiency.
  • FIG. 4 shows a method of making the first preferred embodiment of the liquid-cooled heat dissipating device 101 . The method is described as follows.
  • the aforementioned surrounding wall 221 formed with a plurality of the dividing walls 224 and a plurality of the thermally conductive elements 26 , the aforementioned cover plate 23 , and the aforementioned base plate 21 are provided.
  • Each of the cover plate 23 and the base plate 21 is subjected to an oxidation reaction so as to form an oxide layer 203 thereon.
  • the oxidation reaction can be conducted through a thermal oxidation process or a wet oxidation process.
  • the thermal oxidation process can be conducted in an atmosphere furnace, which has the oxygen content below 200 ppm, and at a temperature ranging from 400° C. to 900° C. for 5-60 minutes.
  • the wet oxidation process can be conducted using an oxidizing solution containing an oxidizing agent.
  • the oxidizing agent is selected from the group consisting of potassium persulfate, trisodium phosphate, sodium chlorite, sodium hydroxide, and combinations thereof.
  • the cover plate 23 and the base plate 21 can be disposed in the oxidizing solution so as to form the oxide layers 203 (i.e., copper oxide layers in this embodiment). Details of the wet oxidation process can be found in the applicant's Taiwanese publication no. 200927481.
  • the oxide layers 203 of the cover plate 23 and the base plate 21 are respectively placed in contact with the top and bottom open ends 222 , 223 of the surrounding wall 221 . Subsequently, the cover plate 23 and the base plate 21 are sinter-bonded to the surrounding wall 221 .
  • the sinter-bonding step is conducted at a temperature ranging from 1065° C. to 1080° C. and at the oxygen content below 200 ppm (preferably below 20 ppm) for 10-60 minutes.
  • the steps for sinter-bonding the cover plate 23 to the surrounding wall 221 and the steps for sinter-bonding the base plate 21 to the surrounding wall 221 can be conducted separately or together.
  • the oxide layers 203 (i.e., copper oxide) of the cover plate 23 and the base plate 21 , and the top and bottom open ends (i.e., copper) of the surrounding wall 221 are melted so as to form the copper-copper oxide eutectic (the eutectic temperature of the copper-copper oxide eutectic is about 1065° C.).
  • the cover plate 23 and the base plate 21 are securely bonded to the surrounding wall 221 .
  • the cover plate 23 and the base plate 21 can be sinter-bonded to the dividing walls 224 when the same are being sinter-bonded to the surrounding wall 221 .
  • the cover plate 23 and the base plate 21 can be more securely bonded to the chamber-confining body 22 , and gaps can be prevented from being formed between the dividing walls 224 , and the cover plate 23 and the base plate 21 . Accordingly, a flow direction of the liquid coolant in the liquid-cooled heat dissipating device 101 can be maintained, thereby preserving the heat dissipating efficiency of the liquid-cooled heat dissipating device 101 .
  • FIG. 5 shows the second preferred embodiment of the liquid-cooled heat dissipating device 101 .
  • the second preferred embodiment is similar to the first preferred embodiment except that each of the cover plate 23 and the base plate 21 provided in the second embodiment is a ceramic-copper plate, which includes a ceramic substrate 202 and two copper layers 201 formed on two opposite surfaces of the ceramic substrate 202 .
  • the method of making the second preferred embodiment is the same as that of making the first preferred embodiment.
  • the copper layers 201 on the ceramic substrate 202 can be patterned to form circuit patterns suitable for electronic components.
  • an electronic component is electrically connected to the patterned copper layer 201 on the cover plate 23 or on the base plate 21 , heat generated by the electronic component can be transferred to the liquid coolant in the channels 225 directly through the cover plate 23 or the base plate 21 .
  • a temperature of the electronic component can be lowered by dint of heat exchange.
  • the cover plate 23 or the base plate 21 serves as a circuit board, the heat from the electronic component can be more efficiently dissipated by the liquid-cooled heat dissipating device 101 .
  • the third preferred embodiment of the liquid-cooled heat dissipating device 102 is similar to the first preferred embodiment except that the base plate is connected integrally to the bottom open end of the surrounding wall so as to form the chamber-confining body 28 as one piece. Therefore, only the cover plate 23 is required to be sinter-bonded to the surrounding wall of the chamber-confining body 28 .
  • the chamber-confining body 28 may be made of copper or a copper alloy.
  • FIG. 8 shows a method of making the third preferred embodiment of the liquid-cooled heat dissipating device 102 .
  • the method of making the third preferred embodiment is similar to that of making the first preferred embodiment except that the aforementioned surrounding wall 221 and the base plate 21 are integrally connected. Consequently, the base plate 21 is not required to have the oxide layer 203 before the sinter-bonding step.
  • FIG. 9 shows the fourth preferred embodiment of the liquid-cooled heat dissipating device 102 .
  • the fourth preferred embodiment is similar to the third preferred embodiment except that the cover plate 23 provided in the fourth preferred embodiment is the ceramic-copper plate.
  • the method of making the fourth preferred embodiment is the same as that of making the third preferred embodiment.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Ceramic Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US12/802,214 2009-06-03 2010-06-01 Liquid-cooled heat dissipating device and method of making the same Abandoned US20100307730A1 (en)

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TW098118364 2009-06-03
TW098118364A TW201043910A (en) 2009-06-03 2009-06-03 Water-cooling device and its manufacturing method

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110173813A1 (en) * 2008-09-23 2011-07-21 Commissariat A L'energie Atomique Et Aux Energies Alternatives Method for producing a heat exchanger system, preferably of the exchanger/reactor type
WO2014026675A3 (de) * 2012-08-17 2014-04-17 Curamik Electronics Gmbh Verfahren zur herstellung von hohlkörpern, insbesondere von kühlern, und hohlkörper bzw. kühler enthaltende elektrische oder elektronische baugruppen
CN105992503A (zh) * 2015-03-02 2016-10-05 中山大洋电机股份有限公司 一种功率器件的并联冷却结构及其应用的电机控制器
JP2017062985A (ja) * 2015-09-25 2017-03-30 三洋電機株式会社 冷却装置およびこの冷却装置を有する電源装置
CN107425323A (zh) * 2017-08-28 2017-12-01 深圳市沃尔新能源电气科技股份有限公司 一种插接母端子及应用该母端子的充电枪、充电枪用插座
US20190024991A1 (en) * 2015-08-28 2019-01-24 Kyocera Corporation Flow path member
CN112469242A (zh) * 2020-11-11 2021-03-09 中国第一汽车股份有限公司 液冷式车载电源

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EP3195711A4 (en) * 2014-09-15 2018-08-29 D'Onofrio, Nicholas, Michael Liquid cooled metal core printed circuit board
TWI703317B (zh) * 2018-05-08 2020-09-01 大陸商上海綠曜能源科技有限公司 可測漏液冷傳熱裝置
US11882672B2 (en) * 2020-11-16 2024-01-23 Quanta Computer Inc. Anti-leakage liquid cooling connectors
TWI820476B (zh) * 2021-08-25 2023-11-01 均賀科技股份有限公司 熱交換器結構

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Cited By (9)

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Publication number Priority date Publication date Assignee Title
US20110173813A1 (en) * 2008-09-23 2011-07-21 Commissariat A L'energie Atomique Et Aux Energies Alternatives Method for producing a heat exchanger system, preferably of the exchanger/reactor type
US8468697B2 (en) * 2008-09-23 2013-06-25 Commissariat a l'Energie Atomique et aux Energiest Alternatives Method for producing a heat exchanger system, preferably of the exchanger/reactor type
WO2014026675A3 (de) * 2012-08-17 2014-04-17 Curamik Electronics Gmbh Verfahren zur herstellung von hohlkörpern, insbesondere von kühlern, und hohlkörper bzw. kühler enthaltende elektrische oder elektronische baugruppen
CN105992503A (zh) * 2015-03-02 2016-10-05 中山大洋电机股份有限公司 一种功率器件的并联冷却结构及其应用的电机控制器
US20190024991A1 (en) * 2015-08-28 2019-01-24 Kyocera Corporation Flow path member
US10684081B2 (en) * 2015-08-28 2020-06-16 Kyocera Corporation Flow path member
JP2017062985A (ja) * 2015-09-25 2017-03-30 三洋電機株式会社 冷却装置およびこの冷却装置を有する電源装置
CN107425323A (zh) * 2017-08-28 2017-12-01 深圳市沃尔新能源电气科技股份有限公司 一种插接母端子及应用该母端子的充电枪、充电枪用插座
CN112469242A (zh) * 2020-11-11 2021-03-09 中国第一汽车股份有限公司 液冷式车载电源

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Publication number Publication date
TWI379987B (enrdf_load_stackoverflow) 2012-12-21
TW201043910A (en) 2010-12-16
US20140090825A1 (en) 2014-04-03

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