TW201043910A - Water-cooling device and its manufacturing method - Google Patents

Water-cooling device and its manufacturing method Download PDF

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Publication number
TW201043910A
TW201043910A TW098118364A TW98118364A TW201043910A TW 201043910 A TW201043910 A TW 201043910A TW 098118364 A TW098118364 A TW 098118364A TW 98118364 A TW98118364 A TW 98118364A TW 201043910 A TW201043910 A TW 201043910A
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Taiwan
Prior art keywords
water
cooling device
wall
heat
manufacturing
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TW098118364A
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Chinese (zh)
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TWI379987B (en
Inventor
wen-zhong Jiang
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High Conduction Scient Co Ltd
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Priority to TW098118364A priority Critical patent/TW201043910A/en
Priority to US12/802,214 priority patent/US20100307730A1/en
Publication of TW201043910A publication Critical patent/TW201043910A/en
Application granted granted Critical
Publication of TWI379987B publication Critical patent/TWI379987B/zh
Priority to US14/077,430 priority patent/US20140090825A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/04—Constructions of heat-exchange apparatus characterised by the selection of particular materials of ceramic; of concrete; of natural stone
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/18—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes sintered
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Abstract

This invention relates a water-cooling device, including a bottom wall and top wall, and hollow base body, an inlet and an outlet. The bottom wall has a bottom surface that faces the heat-generating element. The top wall is located above and spaced from the bottom wall. The hollow base body includes an encircling wall connected between the top wall and the bottom wall. The top wall, bottom wall, encircling wall define a flow channel space. At least one of the top wall and bottom wall is connected with the encircling wall by sintering. The inlet is located on the encircling wall and is communicated with the flow channel space so that the cooling fluid flows into the flow channel space. The outlet is located on the encircling wall and is communicated with the flow channel space so that the cooling fluid inside the flow channel space flows out.

Description

201043910 ’ 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種水冷裝置，特別是指一種改良組 接方式的水冷裝置。 【先前技術】 隨著諸多電子產品效能的提升，其内部含有的電子元 件數量亦急劇增加’以致於當電子產品運作時，所產生的 單位面積溫度增加，而提升電子產品發生過熱當機或損壞201043910 ′′. Description of the Invention: TECHNICAL FIELD The present invention relates to a water-cooling device, and more particularly to a water-cooling device with improved assembly. [Prior Art] With the improvement of the performance of many electronic products, the number of electronic components contained therein has also increased dramatically. As a result, when the electronic products operate, the temperature per unit area increases, and the electronic products are overheated or damaged.

II 的可能性’因此’散熱降低溫度對於電子產品而言，就變 成十分重要的課題。 以電腦主機内的中央處理單元（Central Processing Unit，CPU)來說，通常是裝設一風扇輔助中央處理單元散 熱，但是這樣的散熱效果是有限的，而目前已提出一種水 冷散熱裝置9供裝設於CPU上，用以輔助CPU散熱，參閱 圖卜水冷散熱裝置9包括—基座91、一蓋板92、一輸入 水管93、-輸出水管94、複數螺鎖件％及一環形塾％， 基座91具有一底壁911、一圍繞底壁911形成之圍繞壁912 、複數形成於圍繞壁912上且供蓋板92固定之螺孔部913 及複數形成於底壁911上且僅有一端連接圍繞壁912之隔板 914，而隔板914形成複數相連通且供水流動之流道915， 蓋板92具有複數與基座91之螺孔部913相配合之螺洞921 ，輸入水管93與輸出水管94係連接於基座91且分別與基 座91之流道914相連通，螺鎖件％能穿伸於蓋板μ之螺 洞921而螺鎖於基座91之螺孔部913，使蓋板92固定於基 3 201043910 座91上，環形墊96 設置於圍繞壁912上而用以防止漏水 人於οΓυ ^裝人水溶的水冷散熱裝置9連接-幫浦且貼 二Γ二 藉由與水冷散熱裝置9之基…壁 生的水循r將廢熱傳導至基座91㈣水減，透過幫浦產 ==，使得基座91之所吸收的廢熱能導出，如此的 作動方式可降低CPU的溫度達成散熱之功效。 …而’水冷散熱裝置9係透過螺鎖件％接合基座9】 、板2 U致於在開模製造基座91時’為了增設螺孔部 而增加了開模工程的成本，及在使用水冷裝置時，必 須花費人力與時間先螺鎖接合蓋板％與基座9卜此外，水 冷散熱裝置9亦會因為環形墊％的老化變形，在使用上發 ^漏水的情形，導致裝設水冷散熱裝i 9之電子產品受損 壞。 【發明内容】 口此本發明之目的，在於提供一種不必透過鎖栓件 組接之水冷裝置及其製造方法。 本發明之另一目的，在於提供一種能完全密封不漏水 的水冷裝置及其製造方法。 本發月之另一目的，在於提供一種供設置電路及電子 元件的水冷裝置及其製造方法。 於是’本發明水冷裝置包含一底壁、一頂壁、一中空 座體、一輸入口及一輸出口，底壁具有一供面向發熱元件 的底面，頂壁間隔於底壁上方，中空座體包括一連接於頂 201043910 壁與底壁之間的圍繞壁，頂壁、底壁及圍繞壁界定出一流 道空間’ 壁及底壁至少其中一者與圍多堯壁係燒結連接 ，輸入口設置於圍繞壁並連通該流道空間而可供冷卻流體 經輸入口流入流道空間，輸出口設置於圍繞壁並連通該流 道空間而可供流道空間内之冷卻流體經輸出口流出。 本發明水冷裝置的一特點在於中空座體與底壁為一體 成型且其材質為銅，頂壁為雙面覆銅金屬的陶瓷板且透過 燒結連接中空座體。 本發明水冷裝置的一特點在於頂壁與底壁為雙面覆銅 金屬的陶瓷板且透過燒結連接材質為銅的令空座體。 本發明水冷裝置之製造方法，包含下列步驟： (A) 提供一中空座體，該令空座體包括一圍繞界定出一 流道空間的圍繞壁； (B) 提供二導熱板體，每一導熱板體的一側板面形成有 一氧化層；以及 (C) 分別將該兩導熱板體以形成有該氧化層的該側板面 面向該圍繞壁地上下燒結於該圍繞壁而封閉該流道空間。 其中，兩導熱板體供形成水冷裝置之底壁與頂壁。 本發明水冷裝置之另一製造方法，包含下列步驟： (A’）提供一散熱座，該散熱座包括一底壁及一圍繞壁， 該底壁與該圍繞壁界定出一流道空間； (B’）提供一導熱板體，該導熱板體的—側板面形成有一 氧化層；以及 (C，）將該導熱板體以形成有該氧化層的該側板面面向該 201043910 圍繞壁並且間隔於該底壁上方地燒結於該圍繞壁而封閉該 流道空間。其中，導熱板體供形成水冷裝置之頂壁。 本發明水冷裝置之製造方法的一特點在於係利用將導 熱板體之-侧面浸置於-含有氧化劑的氧化用溶液中，使 導熱板體之一側面氧化形成氧化金屬層。 本發明之功效在於不必透過任何鎖栓件而形成具有完 全密封空間的水冷裝置，使於水冷裝置内之冷卻液體不= 外漏，此外，更佳的是於水冷裝置之底壁或頂壁為雙面覆 銅m ’用以於底壁底面或頂壁頂面設置電路及電子元 件’使得電子元件能直接導出廢熱而獲得更佳的散熱效果 〇 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之二個較佳實施例的詳細說明中，將可 清楚的呈現。 在本發明破詳細描述之前，要注意的是，在以下的說 明内容中，類似的元件是以相同的編號來表示。 參閱圖2與圖3 ’本發明水冷裝置之第—較佳實施例適 用於降低-發熱元件之溫度，本實施例所指的發熱元件為 一電腦主機内的中央處理單W圖未示），但並不以此為限。 該水冷裝1: 1G1包含_底壁21、—中空座體— 了貞壁μ 輸入24及—輸出口 25’底壁21、中空座體22與頂 壁23係由下而上相互連接。 底壁21的材質為鋼，包括-第-頂面211及一第-底 201043910 面212，第一底面212係供貼合於發熱元件，第一頂面211 連接於中空座體22。 中空座體22的材質為銅，包括一圍繞壁221及複數一 端連接圍繞壁221内側壁面之肋片224，圍繞壁221具有一 上端面222及一用以透過燒結而連接底壁21之第一頂面 211的下端面223,也就是說，底壁21與中空座體22的結 合是利用金屬燒結的方式相結合。 頂壁23的材質亦為銅，包括一第二頂面231及一透過 燒結而連接圍繞壁221的上端面222之第二底面232，也就 是說，頂壁23與中空座體22的結合亦是利用金屬燒結的 方式。 圍繞壁221燒結連接於頂壁23及底壁21之間而界定 出一流道空間，搭配著上述設置於中空座體22内之肋片 224，流道空間即形成供冷卻液體流通之流道225。 輸入口 24及輸出口 25設置於中空座體22的圍繞壁 221，輸入口 24係連通流道空間而可供冷卻流體經輸入口 24流入流道225，輸出口 25連通流道空間而可供流道225 内之冷卻流體經輸出口 25流出，在本實施例中，輸入口 24 與輸出口 25會分別接上一用以連接幫浦之導管27，而導管 27是與設有輸入口 24與輸出口 25的中空座體22之圍繞壁 221經由壓鑄一體成型的，或者導管27是另外加工連接。 然而，輸入口 24與輸出口 25的設置只要能與流道225相 連通即可，其設置位置並不限於圍繞壁221，亦可設置於頂 壁23，但要注意的是，輸入口 24與輸出口 25設置的位置 201043910 是要能讓水冷裝置101内之冷卻液體取得較長的流動距離 ’以增加冷卻液體在水冷裝置101内較多的接觸面積。 特別要明的是，底壁21、中空座體22與頂壁23利用 燒結方式結合成一體的優點在於相同的金屬會因燒結而相 互熔為一體’經冷卻後彼此間將不會存有任何縫隙如此 一來，水冷裝置101就不必透過任何鎖栓件之類的物件相 互連結’且也不必為了擔心連結後會產生漏水之情況而於 連結處设置一防水墊圈，更不必擔心防水墊圈會有老化變 形的問題。 此外，水冷裝置101更包含複數設置於流道225之導 熱體26，在本實施例中，導熱體26為銅球，藉由導熱體 26的设置，使得當流道225内之冷卻液體流動時，能增加 冷卻液體與水冷裝置101内部的接觸面積，進而提升熱能 交換的效率。 配合參閱圖4、圖5,本發明水冷裝置第一較佳實施例 的製造方法的較佳實施例包含下列步驟： 步驟80’提供空座體22。在本實施例中是利用 前述的銅金屬材質的中空座體22。 步驟82 ’提供二導熱板體’每一導熱板體的一侧板面 形成有一氧化層。兩導熱板體供形成上述之底壁21與頂壁 23,因此其材質為銅金屬，在本實施例中，可利用一熱氧 化處理使導熱板體的-侧板面形成有—氧化層2〇3，該熱氧 化處理是在一氧氣含量200 ppm以下的氣氛爐中，以4〇(rc 至900 C的/皿度’持續5至60分鐘’使導熱板體的一側形 201043910 成如圖5所示的氧化層2〇3β另外，亦可以利用濕式氧化的 方式，將導熱板體浸置於一含有氧化劑的氧化用溶液令來 使銅氧化層形成，該氧化劑係選自於過硫酸卸、鱗酸三納 、亞氯酸鈉、氫氧化鈉或其等之組合，有關氧化處理的詳 細内容可參見申請人已中請的台灣專利申請案號G96剛08 號該案的内容。The possibility of II 'then' heat dissipation reduces the temperature and becomes an important issue for electronic products. In the case of a central processing unit (CPU) in a computer mainframe, a fan is usually installed to assist the central processing unit to dissipate heat, but such a heat dissipating effect is limited, and a water-cooling heat dissipating device 9 has been proposed. It is disposed on the CPU to assist the CPU to dissipate heat. For example, the water cooling device 9 includes a base 91, a cover plate 92, an input water pipe 93, an output water pipe 94, a plurality of screw lock members, and a ring 塾%. The base 91 has a bottom wall 911, a surrounding wall 912 formed around the bottom wall 911, a plurality of screw holes 913 formed on the surrounding wall 912 for fixing the cover plate 92, and a plurality of ends formed on the bottom wall 911 and having only one end The partition 914 is connected to the wall 912, and the partition 914 forms a plurality of flow passages 915 which communicate with the water supply flow. The cover plate 92 has a plurality of screw holes 921 which cooperate with the screw holes 913 of the base 91, and the input water pipe 93 and The output water pipe 94 is connected to the base 91 and communicates with the flow passage 914 of the base 91 respectively. The screw lock member can extend through the screw hole 921 of the cover plate μ and is screwed to the screw hole portion 913 of the base 91. The cover plate 92 is fixed to the base 3 201043910 seat 91, and the ring 96 is disposed on the surrounding wall 912 to prevent the water leakage person from being connected to the water-cooling heat dissipating device 9 of the water-dissipating device, and is attached to the water-cooling device 9 The waste heat is transmitted to the base 91 (4) water reduction, and the waste heat energy absorbed by the base 91 is led out through the pump production ==, and the operation mode can reduce the temperature of the CPU to achieve the heat dissipation effect. ...and the 'water-cooling heat sink 9 is connected to the base 9 through the screw lock %】, and the plate 2 U is used to increase the cost of the mold opening process for the purpose of adding the screw hole when the base 91 is opened for molding. In the case of a water-cooling device, it is necessary to manually and mechanically lock the cover plate % and the base 9 in addition. The water-cooling heat sink 9 is also deformed due to the aging of the ring pad, and the water leakage is caused by the use, resulting in water cooling. The electronic products of the heat sink i 9 are damaged. SUMMARY OF THE INVENTION It is an object of the present invention to provide a water cooling device that does not have to be coupled through a bolt member and a method of manufacturing the same. Another object of the present invention is to provide a water-cooling apparatus capable of completely sealing watertight and a method of manufacturing the same. Another object of the present month is to provide a water cooling device for providing a circuit and an electronic component, and a method of manufacturing the same. Thus, the water-cooling device of the present invention comprises a bottom wall, a top wall, a hollow seat body, an input port and an output port, the bottom wall having a bottom surface facing the heat generating component, the top wall being spaced above the bottom wall, the hollow seat body The utility model comprises a surrounding wall connected between the wall of the top 201043910 and the bottom wall, and the top wall, the bottom wall and the surrounding wall define a first-class space space. At least one of the wall and the bottom wall is sintered and connected with the surrounding wall, and the input port is arranged. The cooling fluid is supplied to the flow channel space through the inlet port around the wall and communicates with the flow channel space, and the output port is disposed around the wall and communicates with the flow channel space to allow the cooling fluid in the flow channel space to flow out through the output port. A feature of the water-cooling device of the present invention is that the hollow seat body and the bottom wall are integrally formed and made of copper, and the top wall is a double-sided copper-clad metal plate and is connected to the hollow body through sintering. A feature of the water-cooling device of the present invention is that the top wall and the bottom wall are double-sided copper-clad ceramic plates and are sintered to form a hollow body made of copper. The method for manufacturing the water-cooling device of the present invention comprises the following steps: (A) providing a hollow seat body, the air-seat body comprising a surrounding wall defining a first-class track space; (B) providing two heat-conducting plates, each of which conducts heat One side of the plate body is formed with an oxide layer; and (C) the two heat conducting plate bodies are respectively sintered to the surrounding wall with the side plate surface on which the oxide layer is formed to face the surrounding wall to close the flow path space. Wherein, the two heat conducting plates are configured to form a bottom wall and a top wall of the water cooling device. Another manufacturing method of the water-cooling device of the present invention comprises the following steps: (A') providing a heat sink, the heat sink comprising a bottom wall and a surrounding wall, the bottom wall and the surrounding wall defining a first-class space; ') providing a heat conducting plate body, the side plate surface of the heat conducting plate body is formed with an oxide layer; and (C,) the heat conducting plate body facing the side plate surface having the oxide layer facing the 201043910 surrounding wall and spaced apart The surrounding wall is sintered above the surrounding wall to close the runner space. Wherein, the heat conducting plate body is formed to form a top wall of the water cooling device. A feature of the method for producing a water-cooling device of the present invention is that the side surface of the heat-conducting plate body is oxidized to form an oxidized metal layer by immersing the side surface of the heat-conducting plate body in an oxidizing solution containing an oxidizing agent. The utility model has the advantages that the water-cooling device with a completely sealed space is not required to pass through any latching member, so that the cooling liquid in the water-cooling device does not leak outside, and more preferably, the bottom wall or the top wall of the water-cooling device is The double-sided copper-clad m' is used to set the circuit and the electronic component on the bottom surface of the bottom wall or the top surface of the top wall so that the electronic component can directly derive waste heat to obtain better heat dissipation effect. [Embodiment] The foregoing and other technologies related to the present invention The details, features, and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments. Before the detailed description of the present invention, it is noted that in the following description, similar elements are denoted by the same reference numerals. Referring to FIG. 2 and FIG. 3, the first embodiment of the water-cooling device of the present invention is suitable for reducing the temperature of the heating element. The heating element referred to in this embodiment is a central processing unit in a computer mainframe (not shown). But it is not limited to this. The water-cooled package 1: 1G1 includes a bottom wall 21, a hollow seat body, a bottom wall μ input 24, and an output port 25' bottom wall 21, and the hollow seat body 22 and the top wall 23 are connected to each other from bottom to top. The bottom wall 21 is made of steel, and includes a first-top surface 211 and a first-bottom 201043910 surface 212. The first bottom surface 212 is attached to the heat generating component, and the first top surface 211 is connected to the hollow base 22. The hollow body 22 is made of copper, and includes a surrounding wall 221 and a plurality of ends connected to the inner wall surface of the wall 221. The surrounding wall 221 has an upper end surface 222 and a first connecting wall 21 for transmitting and sintering. The lower end surface 223 of the top surface 211, that is, the combination of the bottom wall 21 and the hollow seat body 22 is combined by means of metal sintering. The top wall 23 is also made of copper, and includes a second top surface 231 and a second bottom surface 232 that is connected to the upper end surface 222 of the surrounding wall 221 through sintering. That is, the combination of the top wall 23 and the hollow base 22 is also It is a way of using metal sintering. The surrounding wall 23 is sintered and connected between the top wall 23 and the bottom wall 21 to define a first-class track space, and the rib 224 disposed in the hollow seat body 22 is formed. The flow path space forms a flow path 225 for the cooling liquid to circulate. . The input port 24 and the output port 25 are disposed on the surrounding wall 221 of the hollow seat body 22. The input port 24 is connected to the flow channel space for the cooling fluid to flow into the flow channel 225 through the input port 24, and the output port 25 is connected to the flow channel space. The cooling fluid in the flow channel 225 flows out through the output port 25. In the embodiment, the input port 24 and the output port 25 are respectively connected with a conduit 27 for connecting the pump, and the conduit 27 is provided with the input port 24 The surrounding wall 221 of the hollow seat 22 of the outlet 25 is integrally formed by die casting, or the conduit 27 is additionally machined. However, the input port 24 and the output port 25 are disposed as long as they can communicate with the flow channel 225, and the installation position is not limited to the surrounding wall 221, and may be disposed on the top wall 23, but it should be noted that the input port 24 is The position 201043910 of the output port 25 is such that the cooling liquid in the water-cooling device 101 can be made to have a long flow distance 'to increase the contact area of the cooling liquid in the water-cooling device 101. In particular, the advantage that the bottom wall 21, the hollow seat body 22 and the top wall 23 are integrally joined by sintering means that the same metal is melted into one another by sintering. After cooling, there will be no any mutual In this way, the water-cooling device 101 does not have to be connected to each other through any member such as a latch member, and there is no need to provide a waterproof gasket at the joint for fear of water leakage after the connection, and there is no need to worry about the waterproof gasket. The problem of aging deformation. In addition, the water cooling device 101 further includes a plurality of heat conductors 26 disposed on the flow channel 225. In the present embodiment, the heat conductor 26 is a copper ball, and the heat conductor 26 is disposed such that the cooling liquid in the flow channel 225 flows. The contact area between the cooling liquid and the interior of the water cooling device 101 can be increased, thereby improving the efficiency of heat energy exchange. Referring to Figures 4 and 5, a preferred embodiment of the method of fabricating the first preferred embodiment of the water-cooling apparatus of the present invention comprises the following steps: Step 80' provides an empty body 22. In the present embodiment, the above-described hollow metal body 22 made of copper metal is used. Step 82' provides two heat conducting plates. An oxide layer is formed on one side of each of the heat conducting plates. The two heat conducting plates are formed to form the bottom wall 21 and the top wall 23, and thus the material thereof is copper metal. In this embodiment, a thermal oxidation treatment may be used to form the side plate surface of the heat conducting plate body with the oxide layer 2 〇3, the thermal oxidation treatment is performed in an atmosphere furnace having an oxygen content of 200 ppm or less, and the side shape of the heat-conducting plate body is 201043910 at 4 〇 (rc to 900 C/dish degree for 5 to 60 minutes). In addition, the oxide layer 2〇3β shown in FIG. 5 may be formed by immersing the heat-conducting plate body in an oxidation reaction solution containing an oxidizing agent to form a copper oxide layer selected from the group consisting of wet oxidation. For the details of the oxidation treatment, please refer to the contents of the case of Taiwan Patent Application No. G96 just 08, which has been filed by the applicant, for the details of the oxidation treatment, such as sulfuric acid unloading, sodium citrate, sodium chlorate, sodium hydroxide or the like.

步驟84’》別將導熱板體以形成有氧化層2⑽的側板 面面向圍、.堯壁221地上下燒結於圍繞壁22 i而封閉流道空 間。在本實施例中，燒結處理是在氧氣含量2〇〇卯⑺以下 (較佳為20 ppm以下）…〇65。。^聊。。的溫度，持續 1〇至60分鐘，以形成如圖5所示的水冷裝置ι〇ι。 進一步詳細解釋形成水冷裝置1〇1的細節如下，由於 上述燒結處理是在1()机至1G8(rc内進行，因此兩導熱板 體的氧化層203與材質為銅的中空座體22之圍繞壁221上 下端面貼合處會熔化（銅與氧化銅共晶溫纟福。c)形成 一嫁化液狀層’此熔化液狀層能潤濕導熱板體與中空座體 22 ’使其相互接合’當導熱板體與中空座體22冷卻至室溫 ’便可藉此形成水冷裝置1G1。更佳的是，導熱板體在貼合 ;圍、vu i 221時’也能同時貼合於肋片224的端面，這樣 的話’中空座體22與導熱板體之接觸面積增加，更能使導 ‘、、、板體與中空座體22燒結連接更加密合穩固，也使得冷卻 液體不會因肋224與導^(板體間之縫隙而影響該有的流 動方向，以致於影響散熱效果。 參閲圖6 ’在前述實施例中，頂壁23與底壁21 (亦即 201043910 兩導熱板體）的材質均為銅，但在另一種實施態樣中，參 閱圖6，底壁21與頂壁23也可以是均為雙面覆銅金屬的陶 瓷板’也就是底壁21具有二銅金屬層201以及一介於該兩 銅金屬層201之間的陶瓷層202，頂壁23具有二銅金屬層 201以及一介於該兩銅金屬層2〇丨之間的陶瓷層2〇2。 特別值得一提的是，由於陶瓷與銅皆具有良好的導熱 性’能供導熱及散熱使用，而且陶瓷更是良好的絕緣材質 ，如此一來，覆於陶瓷層202上之銅金屬層201能與印刷 電路板一般用以蝕刻出電路及設置電子元件，當底壁21底 面或頂壁23頂面之銅金屬層201設置電路及電子元件時， 由於電子元件的廢熱能夠直接透過底壁21或頂壁23導熱 至流道225内之冷卻液體，產生熱交換降低電子元件之溫 度，這樣的結構將使得水冷裝置丨0 i與電子元件間不會像 以往還存在一電路板層，而係可以利用底壁21底面或頂壁 23頂面當作電路板，以更直接的接觸達到良好的散熱效果 關於圖6頂壁23與底壁21為雙面覆銅陶瓷板的水冷 裝置101，#製造方法與前述大致相@，只是，在前述步驟 82中的氧化層203，是形成在其中一銅金屬層2〇工^ 參閱圖7與圖8，本發明水冷裝置1〇2之第二較佳實施 ^ ^ ^散熱座28、一頂壁23、一輸入口 24及一輸出口 25，散熱座28包括一底壁21及—中空座體22，在第二較 佳實施例中，底壁21與中空座體22是一體成型而成為： 冷裝置1〇2之散熱座28,因此，水冷裝置1〇2之底壁幻與 10 201043910 中空座體22本來就相連不必透過燒結過程，只有頂壁23 與散熱座28之間需要透過燒結結合，散熱座28可以是銅 或銅合金材質；對於其他構造及功能與第一較佳實施例之 水冷裝置101相同，在此即不再重述。而且，水冷裝置1 〇2 亦具有另一實施態樣，係將頂壁23置換為雙面覆銅金屬的 陶竟板；其餘構造與功能第一較佳實施例之另一實施態樣 相同，在此即不再重述。In the step 84', the heat conducting plate body is formed by the side surface of the side surface of the oxide layer 2 (10), and the wall 221 is vertically sintered to surround the wall 22 i to close the flow path space. In the present embodiment, the sintering treatment is performed at an oxygen content of 2 〇〇卯 (7) or less (preferably 20 ppm or less) 〇 65. . ^Talk. . The temperature is maintained for 1 to 60 minutes to form a water-cooling device ι〇ι as shown in FIG. The details of forming the water-cooling device 1〇1 are explained in further detail. Since the above-described sintering treatment is performed in the 1() machine to the 1G8 (rc), the oxide layer 203 of the two heat conducting plates is surrounded by the hollow body 22 made of copper. The upper and lower end faces of the wall 221 are melted together (copper and copper oxide eutectic temperature 。 。. c) form a grafted liquid layer 'this molten liquid layer can wet the heat conducting plate body and the hollow body 22 'to make each other' When the heat conducting plate body and the hollow body 22 are cooled to room temperature, the water cooling device 1G1 can be formed. More preferably, the heat conducting plate body is attached; when the wall is vu i 221, it can also be attached to the rib piece at the same time. The end surface of the 224, in this case, the contact area between the hollow seat body 22 and the heat conducting plate body is increased, and the sintering, connection between the plate body and the hollow seat body 22 is more secure and stable, and the cooling liquid is not ribbed. 224 and the gap between the plates affect the flow direction, so as to affect the heat dissipation effect. Referring to Figure 6 'In the foregoing embodiment, the top wall 23 and the bottom wall 21 (ie, 201043910 two heat conducting plates) ) the material is copper, but in another implementation, Referring to FIG. 6, the bottom wall 21 and the top wall 23 may also be ceramic plates which are both double-sided copper-clad metal, that is, the bottom wall 21 has a copper metal layer 201 and a ceramic layer interposed between the two copper metal layers 201. 202, the top wall 23 has a two-copper metal layer 201 and a ceramic layer 2〇2 interposed between the two copper metal layers 2。. It is particularly worth mentioning that both ceramic and copper have good thermal conductivity. It is used for heat conduction and heat dissipation, and the ceramic is a good insulating material. Thus, the copper metal layer 201 overlying the ceramic layer 202 can be used to etch the circuit and set the electronic components with the printed circuit board. When the copper metal layer 201 on the top surface of the bottom surface or the top wall 23 is provided with circuits and electronic components, since the waste heat of the electronic components can directly conduct heat to the cooling liquid in the flow channel 225 through the bottom wall 21 or the top wall 23, heat exchange is reduced to reduce the electronic components. The temperature, such a structure will make the water-cooling device 与0 i and the electronic components do not have a circuit board layer as in the past, but the bottom surface of the bottom wall 21 or the top surface of the top wall 23 can be used as a circuit board to be more direct. Good contact The heat dissipation effect of the water-cooling device 101 in which the top wall 23 and the bottom wall 21 of FIG. 6 are double-sided copper-clad ceramic plates, the manufacturing method is substantially the same as that described above, except that the oxide layer 203 in the foregoing step 82 is formed therein. A copper metal layer 2 is completed. Referring to Figures 7 and 8, a second preferred embodiment of the water-cooling device 1 2 of the present invention is a heat sink 28, a top wall 23, an input port 24, and an output port 25, The heat sink 28 includes a bottom wall 21 and a hollow base 22. In the second preferred embodiment, the bottom wall 21 and the hollow base 22 are integrally formed as: the heat sink 28 of the cold device 1〇2, therefore, The bottom wall of the water cooling device 1〇2 is 10 and 201043910. The hollow body 22 is originally connected without passing through the sintering process, and only the top wall 23 and the heat sink 28 need to be sintered and combined, and the heat sink 28 can be made of copper or copper alloy; Other configurations and functions are the same as those of the water-cooling device 101 of the first preferred embodiment, and will not be repeated here. Moreover, the water cooling device 1 〇 2 also has another embodiment, in which the top wall 23 is replaced by a double-sided copper-clad metal ceramic board; the rest of the structure is the same as the other embodiment of the first preferred embodiment. It will not be repeated here.

參閱圖9、圖10與圖11，本發明水冷裝置第二較佳實 施例的製造方法的較佳實施例包含下列步驟： 步驟81，提供一散熱座28。在本實施例中，是利用前 述的銅金屬材質的散熱座28。 步驟83’提供一導熱板體，將導熱板體的一側板面形 成有-氧化層203。在本實施例中，導熱板體即是用以形成 前述的㈣23,其材質可以是銅板或雙面覆銅㈣板；其 氧化過程與第一較佳實施例之步驟82相同。 ^驟85，將導熱板體以形成有氧化層2⑽的側板面貼 合於圍繞壁地燒結於圍繞壁而封閉流道空間。其燒結過程 與第一較佳實施例之步總1 』疋芡驟84相同，便可形成如圖10及圖 11所示的水冷裝置102。 ’由於只需要散熱座28與一個導 在燒結作業上，更具有不需花費 在第二較佳實施例中 熱板體進行燒結，因此， 太多時間加工的優點。 綜上所述 組裝完成，且 本發月水冷裝置不必藉由任何鎖栓件即可 形成完全密封的流道空間使於水冷裝置内 201043910 之冷卻液體不會外漏，此夕卜，更可以將水冷裝I之底壁21 或頂壁23由銅板材質改為陶瓷覆銅板材質，用以於底壁21 底面或頂壁23頂面設置電路及電子元件，使得電子元件能 直接導出廢熱而獲得更佳的散熱效果，故確實能達成本發 明之目的。 准以上所述者，僅為本發明之較佳實施例而已，當不 旎以此限定本發明實施之範圍，即大凡依本發明申請專利 範圍及發明說明内容所作之簡單的等效變化與修飾皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一立體分解圖，說明習知的水冷裝置的組裝結 構； 〜 圖2是一立體示意圖，說明本發明水冷裝置之第一較 佳實施例； 圖3是一立體分解圖’說明該水冷裝置各構件之連妹 關係； ~ 圖4是一流程圖，說明該水冷裝置的製造方法； 圖5是一製作流程示意圖，說明該水冷裝置之—杳 〜 Λ施 態樣的製作過程； 圖6是一製作流程示意圖’說明該水冷裝置之另—實 施態樣的製作過程； 圖7是一立體示意圖’說明本發明水冷裝置之第_ '一- 佳實施例； 圖8是一立體分解圖’說明該水冷裝置各構件之連妹 12 201043910 關係； 圖9是一流程圖，說明該水冷裝置的製造方法； 圖10是一製作流程示意圖，說明該水冷裝置之一實施 態樣的製作過程；及 圖11是一製作流程示意圖，說明該水冷裝置之另一實 施態樣的製作過程。 201043910 【主要元件符號說明】 101… •…水冷裝置 224 ••肋片 102… •…水冷裝置 225 ··.·. …流道 201… •…銅金屬層 23....... ••頂壁 202… •…陶瓷層 231 .·.·· ••第二頂面 203… •…氧化層 232 ..… ••第一底面 21…… …·底壁 24....... ..輸入口 211 ··· …·第一頂面 25....... ••輸出口 212 ·· …·第 底面 26....... ••導熱體 22…… …中空座體 27....... ••導管 221 ··· •…圍繞壁 28....... ••散熱座 τη···· …·上端面 80〜8 5·. ••步驟 223 ··· …下端面 14Referring to Figures 9, 10 and 11, a preferred embodiment of the method of fabricating the second preferred embodiment of the water-cooling apparatus of the present invention comprises the following steps: Step 81, providing a heat sink 28. In the present embodiment, a heat sink 28 made of a copper metal material as described above is used. Step 83' provides a heat conducting plate body, and a side surface of the heat conducting plate body is formed with an oxide layer 203. In the present embodiment, the heat conducting plate body is used to form the aforementioned (four) 23, and the material thereof may be a copper plate or a double-sided copper (four) plate; the oxidation process is the same as the step 82 of the first preferred embodiment. At step 85, the heat conducting plate body is sealed to the surrounding wall by the side plate surface on which the oxide layer 2 (10) is formed, and is bonded to the surrounding wall to close the flow path space. The sintering process is the same as that of the first step of the first preferred embodiment, so that the water-cooling device 102 shown in Figs. 10 and 11 can be formed. Since only the heat sink 28 and one of the guide sintering operations are required, there is no need to spend the heat of the hot plate body in the second preferred embodiment, so that the processing is too much time. In summary, the assembly is completed, and the monthly water cooling device does not need to form a completely sealed flow passage space by any bolt member, so that the cooling liquid in the water cooling device 201043910 is not leaked, and moreover, The bottom wall 21 or the top wall 23 of the water-cooling device I is changed from a copper plate material to a ceramic copper-clad plate material for providing circuit and electronic components on the bottom surface of the bottom wall 21 or the top surface of the top wall 23, so that the electronic components can directly derive waste heat and obtain more. The heat dissipation effect is good, so the object of the present invention can be achieved. The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention. All remain within the scope of the invention patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view showing the assembled structure of a conventional water-cooling device; FIG. 2 is a perspective view showing a first preferred embodiment of the water-cooling device of the present invention; The exploded view 'describes the connection relationship between the components of the water-cooling device; ~ Figure 4 is a flow chart illustrating the manufacturing method of the water-cooling device; Figure 5 is a schematic view of a manufacturing process illustrating the state of the water-cooling device Figure 6 is a schematic diagram of a production process illustrating the fabrication process of another embodiment of the water-cooling device; Figure 7 is a perspective view showing the first embodiment of the water-cooling device of the present invention; Is a three-dimensional exploded view 'describes the relationship between the components of the water-cooling device 12 201043910; FIG. 9 is a flow chart illustrating the manufacturing method of the water-cooling device; FIG. 10 is a schematic diagram of a manufacturing process illustrating one embodiment of the water-cooling device The production process; and FIG. 11 is a schematic diagram of a production process illustrating the fabrication process of another embodiment of the water cooling device. 201043910 [Explanation of main component symbols] 101... •...water cooling device 224 ••ribs 102... •...water cooling device 225 ····....flow path 201... •...copper metal layer 23.... •• Top wall 202... •...ceramic layer 231 . . . . . . • • second top surface 203... •...oxide layer 232 ..... ••first bottom surface 21......·bottom wall 24.... .. input port 211 ··· ...·first top surface 25....••output port 212 ····the bottom surface 26....••thermal conductor 22... Seat 27.... ••Conduit 221 ··· •...around wall 28.... •• Heat sink τη······Upper end face 80~8 5·. •• Step 223 ··· ... lower end face 14

Claims (1)

201043910 七、申請專利範圍·· 1. 一種水冷裝置，適於對一發熱元件進行散熱，該水冷裝 置包含： 一底壁，具有一供面向該發熱元件的底面； 一頂壁，間隔於該底壁上方； 一中空座體，包括一連接於該頂壁與該底壁之間的 圍繞壁，該頂壁、該底壁及該圍繞壁界定出一流道空間 ’且該頂壁及該底壁至少其中一者與該圍繞壁係燒結連 〇 接； 一輸入口，設置於該頂壁與該圍繞壁其中一者並連 通該流道空間而可供冷卻流體經該輸入口流入該流道空 間；及 一輸出口，設置於該頂壁與該圍繞壁其中—者並連 通該流道空間而可供該流道空間内之冷卻流體經該輸出 口流出。 0 2.依據申請專利範圍第i項所述之水冷裝置，其中，該頂 L玄圍·繞壁為I结連接，該巾空座體與該底壁為一體 成型地連接。 3 ·依據申„月專利範圍帛2項所述之水冷裝置，其中，該頂 壁、該底壁及該中空座體的材質為銅。 4.依據申請專利範衝# 祀固第2項所述之水冷裝置，其中，該中 空座體與該底壁的_ 黑的材質為銅，该頂壁為雙面覆銅金屬的 陶竟板而具有二全凰a,、，八# 复屬層以及一介於該兩金屬層之間的陶 瓷層* 15 201043910 5. 依據申請專利範圍第丨項所述之水冷裝置其中，： 壁與該圍繞壁為燒結連接’該頂壁與額繞壁社連 接。 、'口 6. 依據中請專利範圍第5項所述之水冷裝置，其中，該頂 壁、該底壁與該中空座體的材質為銅。 7. 依據中請專利範圍第5項所述之水冷裝置，其+，每一 該頂壁與該底壁為雙面覆銅金屬的陶瓷板而具有二金屬 層以及-介於該兩金屬層之間的陶竟層，該中^體的 材質為銅。 S 8. 依據中請專利範圍第！項至第7項其中任—項所述之水 冷裝置’其中’該中空座體更包括複數連接該圍繞壁並 且位於β亥流道空間内的肋片’該等肋片於該流道空間内 界定出一流道。 9. 依據巾請專利範圍第8項所述之水冷裝置更包含複數 容置於該流道㈣導熱體，該等導熱體用以增加冷卻液 體與該中空座體内部的接觸面積。 10. 依據中明專利圍第9項所述之水冷裝置，其中，該等 導熱體為銅球。 11_ 一種水冷裝置製造方法，包含： 步驟A.提供一中空座體，該中空座體包括一圍繞 界疋出一流道空間的圍繞壁及一設置於圍繞壁之輸入口 及輸出口； 步驟B :提供二導熱板體，每一導熱板體的一側板 面形成有一氧化層；以及 16 201043910 步驟c:分別將該兩導熱板體以形成有該氧化声的 該侧板面面向該圍繞壁地上下燒結於該圍繞壁而封二亥 流道空間。 x .依據申請專利範㈣n項所述之水冷裝置製造方法，盆 中，於該步驟B中，該等導熱板體為銅金屬板。 '、 U.依據申請專㈣圍第u項所述之水冷裝置製造方法其 中，於該步驟B巾，該等導熱板體為雙面覆銅金屬的陶 瓷板’每-導熱板體具有二金屬層以及一介於該兩金屬 層之間的陶瓷層。 I4.依據申請專利範圍第12或 法，其中，於該步驟B中， 式氧化方式將該等導熱板體 層0 13項所述之水冷裝置製造方 是利用一熱氧化處理或一濕 之一側面氧化而形成該氧化 15·依據申请專利範圍第14項所述之水冷裝置製造方法，其 中，該濕式氧化方式係將該等導熱板體之一側面浸置於 —含有氧化劑的氧化用溶液中，使該等導熱板體之一側 面氧化形成氧化層。 16·依據申請專利範圍第14項所述之水冷裝置製造方法，其 中該熱乳化處理的溫度是介於400〜9〇〇°C。 17. 依據申請專利範圍第„項所述之水冷裝置製造方法，其 中’於該步驟C中，燒結溫度是介於i〇65〜1〇8(rc。 18. —種水冷裝置製造方法，包含： 步驟A’ ：提供一散熱座，該散熱座包括一底壁、一 圍繞壁及一設置於圍繞壁之輸入口及輸出口，該底壁與 17 201043910 該圍繞壁界定出一流道空間； 步驟B .提供-導熱板體，該導熱板體的一側板面 形成有—氧化層；以及 ^驟C .將该導熱板體以形成有該氧化層的該側板 向-亥圍繞壁並且間隔於該底壁上方地燒結於該圍繞 壁而封閉該流道空間。 據申⑺專利範圍第18項所述之水冷裝置製造方法，其 ’於該步驟B’中，該導熱板體為銅金屬板。 據申凊專利範圍第丨8項所述之水冷裝置製造方法其 中於遠步冑B，中，該導熱板體為雙面覆銅金屬的陶竟 板’該導熱板體具有二金屬層以及一介於該兩金屬層之 間的陶瓷層。 據申叫專利範圍第19或20項所述之水冷裝置製造方 '紅八中，於該步驟B，中，是利用一熱氧化處理或一濕 弋氧化方式將該導熱板體之一側面氧化而形成氧化層。 據申叫專利範圍第21項所述之水冷裝置製造方法，其 ^該濕式氧化方式係將該導熱板體之一側面浸置於一 3有氧化劑的氧化用溶液中，使該導熱板體之一側面氧 化形成氧化層。 23. 依據申清專利範圍第21項所述之水冷裝置製造方法，其 中’ S亥熱氧化處理的溫度是介於400〜9001。 24. 依據申請專利範圍第μ項所述之水冷裝置製造方法，其 於§亥步驟c，中，燒結溫度是介於1065〜1080。(：。 18201043910 VII. Patent application scope·· 1. A water-cooling device suitable for dissipating heat from a heating element, the water cooling device comprising: a bottom wall having a bottom surface facing the heating element; a top wall spaced apart from the bottom Above the wall; a hollow body comprising a surrounding wall connected between the top wall and the bottom wall, the top wall, the bottom wall and the surrounding wall defining a first-class space 'and the top wall and the bottom wall At least one of the splicing joints with the surrounding wall system; an input port disposed in the one of the top wall and the surrounding wall and communicating with the flow channel space for the cooling fluid to flow into the flow channel space through the input port And an output port disposed between the top wall and the surrounding wall and communicating with the flow channel space for cooling fluid in the flow channel space to flow out through the output port. The water-cooling device according to the invention of claim 1, wherein the top wall and the wall are connected by an I junction, and the towel body is integrally connected to the bottom wall. 3. The water-cooling device according to the scope of the patent application, wherein the top wall, the bottom wall and the hollow seat are made of copper. 4. According to the patent application Fan Chong # 祀固第2 In the water-cooling device, the hollow body and the black material of the bottom wall are made of copper, and the top wall is a double-sided copper-plated ceramic tile with two full phoenix a, , and eight #复层And a ceramic layer between the two metal layers* 15 201043910 5. The water-cooling device according to the scope of the invention, wherein: the wall is sintered with the surrounding wall, the top wall is connected to the surrounding wall The water-cooling device according to the fifth aspect of the invention, wherein the top wall, the bottom wall and the hollow seat are made of copper. 7. According to the fifth item of the patent scope In the water-cooling device, the +, each of the top wall and the bottom wall are double-sided copper-clad metal plates and have two metal layers and a ceramic layer between the two metal layers, the middle body The material is copper. S 8. According to the water in the scope of the patent range from item to item 7 The cold device 'where' the hollow body further comprises a plurality of ribs connecting the surrounding wall and located in the space of the beta channel. The ribs define a first-class track in the flow channel space. The water cooling device of item 8 further comprises a plurality of heat conducting bodies accommodated in the flow channel (4), wherein the heat conducting bodies are used to increase the contact area between the cooling liquid and the interior of the hollow body. The water cooling device, wherein the heat conductor is a copper ball. 11_ A method for manufacturing a water cooling device, comprising: Step A. providing a hollow seat body, the hollow seat body comprising a surrounding wall that surrounds the first floor space And an input port and an output port disposed around the wall; Step B: providing two heat conducting plates, one side of each heat conducting plate body forming an oxide layer; and 16 201043910 Step c: respectively, respectively, the two heat conducting plates The side plate surface on which the oxidized sound is formed faces the surrounding wall and is sintered on the surrounding wall to seal the space of the second channel. x. According to the method for manufacturing a water-cooling device according to the application item (4) n, the basin In the step B, the heat conducting plate body is a copper metal plate. ', U. According to the method of manufacturing the water cooling device according to the application item (4), in the step B, the heat conducting plate body is The double-sided copper-clad metal ceramic plate has a two metal layer and a ceramic layer interposed between the two metal layers. I4. According to claim 12 or the method, wherein in the step B, The water-cooling device described in the above-mentioned heat-conducting plate body layer 13 is formed by a thermal oxidation treatment or a wet side oxidation to form the oxidation. The water-cooling device according to claim 14 In the manufacturing method, the wet oxidation method is performed by immersing one side surface of one of the heat conducting plates in an oxidation solution containing an oxidizing agent to oxidize one side surface of the heat conducting plate to form an oxide layer. The method of manufacturing a water-cooling device according to claim 14, wherein the temperature of the heat-emulsification treatment is between 400 and 9 °C. 17. The method for manufacturing a water-cooling device according to the scope of the patent application, wherein in the step C, the sintering temperature is between i〇65 and 1〇8 (rc. 18. a method for manufacturing a water-cooling device, comprising Step A': providing a heat sink, the heat sink includes a bottom wall, a surrounding wall, and an input port and an output port disposed on the surrounding wall, the bottom wall and 17 201043910 defining a first-class space of the surrounding wall; B. Providing a heat-conducting plate body, one side of the heat-conducting plate body is formed with an oxide layer; and C. The heat-conducting plate body is formed around the wall with the side plate on which the oxide layer is formed and spaced apart The method for manufacturing a water-cooling device according to the above-mentioned item (7), wherein in the step B, the heat-conducting plate body is a copper metal plate. According to the method for manufacturing a water-cooling device according to Item 8 of the patent application scope, in the step B, the heat-conducting plate body is a double-sided copper-clad metal ceramic plate. The heat-conducting plate body has a two-metal layer and a dielectric layer. Between the two metal layers According to the water-cooling device manufacturer described in claim 19 or 20, in the second step, in the step B, the heat-conducting plate body is treated by a thermal oxidation treatment or a wet oxidation method. The method of manufacturing a water-cooling device according to claim 21, wherein the wet oxidation method is to immerse one side of the heat-conducting plate body with a oxidizing agent for oxidizing In the solution, one side of the heat conducting plate body is oxidized to form an oxide layer. 23. The method for manufacturing a water cooling device according to claim 21, wherein the temperature of the 'Shai thermal oxidation treatment is between 400 and 9001. 24. The method for manufacturing a water-cooling device according to the scope of the patent application, wherein in the step c, the sintering temperature is between 1065 and 1080. (: 18)
TW098118364A 2009-06-03 2009-06-03 Water-cooling device and its manufacturing method TW201043910A (en)

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TW098118364A TW201043910A (en) 2009-06-03 2009-06-03 Water-cooling device and its manufacturing method
US12/802,214 US20100307730A1 (en) 2009-06-03 2010-06-01 Liquid-cooled heat dissipating device and method of making the same
US14/077,430 US20140090825A1 (en) 2009-06-03 2013-11-12 Liquid-cooled heat dissipating device and method of making the same

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