US20100295903A1 - Ink ejection nozzle arrangement for inkjet printer - Google Patents
Ink ejection nozzle arrangement for inkjet printer Download PDFInfo
- Publication number
- US20100295903A1 US20100295903A1 US12/848,966 US84896610A US2010295903A1 US 20100295903 A1 US20100295903 A1 US 20100295903A1 US 84896610 A US84896610 A US 84896610A US 2010295903 A1 US2010295903 A1 US 2010295903A1
- Authority
- US
- United States
- Prior art keywords
- ink
- chamber
- nozzle
- layer
- nozzle arrangement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
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- G07F7/08—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus by coded identity card or credit card or other personal identification means
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- G07F7/08—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus by coded identity card or credit card or other personal identification means
- G07F7/086—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus by coded identity card or credit card or other personal identification means by passive credit-cards adapted therefor, e.g. constructive particularities to avoid counterfeiting, e.g. by inclusion of a physical or chemical security-layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B41J2/01—Ink jet
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- B41J2/165—Prevention or detection of nozzle clogging, e.g. cleaning, capping or moistening for nozzles
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-
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- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
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- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14346—Ejection by pressure produced by thermal deformation of ink chamber, e.g. buckling
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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- B41J2002/14435—Moving nozzle made of thermal bend detached actuator
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14427—Structure of ink jet print heads with thermal bend detached actuators
- B41J2002/14443—Nozzle guard
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/21—Line printing
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- G06F2221/21—Indexing scheme relating to G06F21/00 and subgroups addressing additional information or applications relating to security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F2221/2129—Authenticate client device independently of the user
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/49082—Resistor making
- Y10T29/49083—Heater type
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
- Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
- Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Definitions
- the present invention relates to micro-electromechanical fluid ejection devices.
- printers have a variety of methods for marking the print media with relevant marking media.
- Commonly used forms of printing include offset printing, laser printing and copying devices, dot matrix type impact printers, thermal paper printers, film recorders, thermal wax printers, dye sublimation printers and ink jet printers both of the drop on demand and continuous flow type.
- Each type of printer has its own advantages and problems when considering cost, speed, quality, reliability, simplicity of construction and operation etc.
- Ink Jet printers themselves come in many different types.
- the utilisation of a continuous stream of ink in ink jet printing appears to date back to at least 1929 wherein U.S. Pat. No. 1,941,001 by Hansell discloses a simple form of continuous stream electro-static ink jet printing.
- U.S. Pat. No. 3,596,275 by Sweet also discloses a process of continuous ink jet printing including the step wherein the ink jet stream is modulated by a high frequency electrostatic field so as to cause drop separation. This technique is still utilized by several manufacturers including Elmjet and Scitex (see also U.S. Pat. No. 3,373,437 by Sweet et al)
- Piezoelectric ink jet printers are also one form of commonly utilized ink jet printing device. Piezoelectric systems are disclosed by Kyser et. al. in U.S. Pat. No. 3,946,398 (1970) which utilizes a diaphragm mode of operation, by Zolten in U.S. Pat. No. 3,683,212 (1970) which discloses a squeeze mode of operation of a piezoelectric crystal, by Stemme in U.S. Pat. No. 3,747,120 (1972) which discloses a bend mode of piezoelectric operation, Howkins in U.S. Pat. No. 4,459,601 which discloses a piezoelectric push mode actuation of the ink jet stream and by Fischbeck in U.S. Pat. No. 4,584,590 which discloses a shear mode type of piezoelectric transducer element.
- thermal ink jet printing has become an extremely popular form of ink jet printing.
- the ink jet printing techniques include those disclosed by Endo et al in GB 2007162 (1979) and by Vaught et al in U.S. Pat. No. 4,490,728. Both the aforementioned reference ink jet printing techniques rely upon the activation of an electrothermal actuator which results in the creation of a bubble in a constricted space, such as a nozzle, which thereby causes the ejection of ink from an aperture in communication with the confined space onto a relevant print media.
- Manufacturers such as Canon and Hewlett Packard manufacture printing devices utilizing the electrothermal actuator.
- a printing technology should have a number of desirable attributes. These include inexpensive construction and operation, high-speed operation, safe and continuous long-term operation etc. Each technology may have its own advantages and disadvantages in the areas of cost, speed, quality, reliability, power usage, simplicity of construction, operation, durability and consumables.
- inkjet printheads are normally constructed utilizing micro-electromechanical systems (MEMS) techniques. As such, they tend to rely upon the standard integrated circuit construction/fabrication techniques of depositing planar layers on a silicon wafer and etching certain portions of the planar layers. Within silicon circuit fabrication technology, certain techniques are better known than others. For example, the techniques associated with the creation of CMOS circuits are likely to be more readily used than those associated with the creation of exotic circuits including ferroelectrics, gallium arsenide etc. Hence, it is desirable, in any MEMS construction, to utilize well-proven semi-conductor fabrication techniques that do not require the utilization of any “exotic” processes or materials. Of course, a certain degree of trade off will be undertaken in that if the use of the exotic material far outweighs its disadvantages then it may become desirable to utilize the material anyway.
- MEMS micro-electromechanical systems
- the device constructed utilizes a low amount of energy in the ejection of ink.
- the utilization of a low amount of energy is particularly important when a large pagewidth full color printhead is constructed having a large array of individual print ejection mechanisms with each ejection mechanism, in the worst case, being fired in a rapid sequence.
- a printhead chip having a plurality of nozzle arrangements.
- These nozzle arrangements each include an actuator.
- the actuator has two pairs of actuating arms, each pair comprising an active actuating arm and a passive actuating arm.
- the active actuating arms are configured so that when heated upon receipt of an electrical signal, they deform and drive an ink displacement mechanism so that ink can be ejected from the respective nozzle chambers.
- the passive actuating arms serve to provide resilient flexibility and stability to the actuator.
- the Applicant has found that it is desirable that the actuator has a certain configuration to avoid buckling of the actuator when the active actuating arms are deformed to displace the actuator. While avoiding buckling, this configuration must also maintain efficiency of the actuator. This configuration is the subject of this invention.
- an ink ejection nozzle arrangement for an inkjet printer includes a wafer substrate with an etched ink chamber and ink channel leading to the chamber; ink ejection nozzle defined over the chamber with an ejection port etched therein; a dielectric actuator arm attached to the substrate via a post on the substrate, the arm having a heating means formed of an electrically conductive material attached at a lower portion thereof proximate the post, wherein the arm extends through a slot in the chamber; and paddle fast with the arm inside the chamber, the paddle interposed between the ink channel and the ejection port.
- the slot in the chamber defines corrugations to inhibit leaking of ink from the slot.
- FIGS. 1-3 illustrate the operational principles of the preferred embodiment
- FIG. 4 is a side perspective view of a single nozzle arrangement of the preferred embodiment
- FIG. 5 illustrates a sectional side view of a single nozzle arrangement
- FIGS. 6 and 7 illustrate operational principles of the preferred embodiment
- FIGS. 8-15 illustrate the manufacturing steps in the construction of the preferred embodiment
- FIG. 16 illustrates a top plan view of a single nozzle
- FIG. 17 illustrates a portion of a single color printhead device
- FIG. 18 illustrates a portion of a three-color printhead device
- FIG. 19 provides a legend of the materials indicated in FIGS. 20 to 29 ;
- FIG. 20 to FIG. 29 illustrate sectional views of the manufacturing steps in one form of construction of an ink jet printhead nozzle
- FIG. 30 shows a three dimensional, schematic view of a nozzle assembly for an ink jet printhead in accordance with another embodiment of the invention.
- FIGS. 31 to 33 show a three dimensional, schematic illustration of an operation of the nozzle assembly of FIG. 30 ;
- FIG. 34 shows a three dimensional view of a nozzle array constituting an ink jet printhead
- FIG. 35 shows, on an enlarged scale, part of the array of FIG. 34 ;
- FIG. 36 shows a three dimensional view of an ink jet printhead including a nozzle guard
- FIGS. 37A to 37R show three-dimensional views of steps in the manufacture of a nozzle assembly of an ink jet printhead
- FIGS. 38A to 38R show sectional side views of the manufacturing steps
- FIGS. 39A to 39K show layouts of masks used in various steps in the manufacturing process
- FIGS. 40A to 40C show three dimensional views of an operation of the nozzle assembly manufactured according to the method of FIGS. 37 and 38 ;
- FIGS. 41A to 41C show sectional side views of an operation of the nozzle assembly manufactured according to the method of FIGS. 37 and 38 .
- a nozzle chamber having ink within it and a thermal actuator device interconnected to an ink ejecting mechanism in the form of a paddle, the thermal actuator device being actuated so as to eject ink from the nozzle chamber.
- the preferred embodiment includes a particular thermal actuator structure which includes an actuator arm in the form of a tapered heater structure arm for providing positional heating of a conductive heater layer row.
- the actuator arm is connected to the paddle through a slotted wall in the nozzle chamber.
- the actuator arm has a mating shape so as to mate substantially with the surfaces of the slot in the nozzle chamber wall.
- FIGS. 1-3 there is provided schematic illustrations of the basic operation of the device.
- a nozzle chamber 1 is provided filled with ink 2 by means of an ink inlet channel 3 which can be etched through a wafer substrate on which the nozzle chamber 1 rests.
- the nozzle chamber 1 includes an ink ejection nozzle or aperture 4 around which an ink meniscus forms.
- a paddle type device 7 which is connected to an actuator arm 8 through a slot in the wall of the nozzle chamber 1 .
- the actuator arm 8 includes a heater means 9 located adjacent to a post end portion 10 of the actuator arm.
- the post 10 is fixed to a substrate.
- the heater means 9 is heated so as to undergo thermal expansion.
- the heater means itself or the other portions of the actuator arm 8 are built from materials having a high bend efficiency where the bend efficiency is defined as
- bend ⁇ ⁇ efficiency Young ’ ⁇ s ⁇ ⁇ Modulus ⁇ ( Coefficient ⁇ ⁇ of ⁇ ⁇ thermal ⁇ ⁇ Expansion ) Density ⁇ Specific ⁇ ⁇ Heat ⁇ ⁇ Capacity
- a suitable material for the heater elements is a copper nickel alloy which can be formed so as to bend a glass material.
- the heater means is ideally located adjacent the post end portion 10 such that the effects of activation are magnified at the paddle end 7 such that small thermal expansions near post 10 result in large movements of the paddle end.
- the heating 9 causes a general increase in pressure around the ink meniscus 5 which expands, as illustrated in FIG. 2 , in a rapid manner.
- the heater current is pulsed and ink is ejected out of the nozzle 4 in addition to flowing in from the ink channel 3 .
- the paddle 7 is deactivated to again return to its quiescent position.
- the deactivation causes a general reflux of the ink into the nozzle chamber.
- the forward momentum of the ink outside the nozzle rim and the corresponding backflow results in a general necking and breaking off of a drop 12 which proceeds to the print media.
- the collapsed meniscus 5 results in a general sucking of ink into the nozzle chamber 1 via the in flow channel 3 .
- the nozzle chamber is refilled such that the position in FIG. 1 is again reached and the nozzle chamber is subsequently ready for the ejection of another drop of ink.
- the arrangement includes an actuator arm 21 which includes a bottom layer 22 which is constructed from a conductive material such as a copper nickel alloy (hereinafter called cupronickel) or titanium nitride (TiN).
- the layer 22 as will become more apparent hereinafter includes a tapered end portion near the end post 24 . The tapering of the layer 22 near this end means that any conductive resistive heating occurs near the post portion 24 .
- the layer 22 is connected to the lower CMOS layers 26 which are formed in the standard manner on a silicon substrate surface 27 .
- the actuator arm 21 is connected to an ejection paddle which is located within a nozzle chamber 28 .
- the nozzle chamber 28 includes an ink ejection nozzle 29 from which ink is ejected and includes a convoluted slot arrangement 30 which is constructed such that the actuator arm 21 is able to move up and down while causing minimal pressure fluctuations in the area of the nozzle chamber 28 around the slot 30 .
- FIG. 5 illustrates a sectional view through a single nozzle.
- FIG. 5 illustrates more clearly the internal structure of the nozzle chamber which includes the paddle 32 attached to the actuator arm 21 having face 33 .
- the actuator arm 21 includes, as noted previously, a bottom conductive layer 22 . Additionally, a top layer 25 is also provided.
- FIG. 6 there is illustrated the example where a high Young's Modulus material 40 is deposited utilizing standard semiconductor deposition techniques and on top of which is further deposited a second layer 41 having a much lower Young's Modulus.
- the deposition is likely to occur at a high temperature.
- the two layers are likely to have different coefficients of thermal expansion and different Young's Moduli.
- the thermal stresses are likely to cause bending of the two layers of material as shown at 42 .
- FIG. 7 By utilizing a second deposition of the material having a high Young's Modulus, the situation in FIG. 7 is likely to result wherein the material 41 is sandwiched between the two layers 40 . Upon cooling, the two layers 40 are kept in tension with one another so as to result in a more planar structure 45 regardless of the operating temperature. This principle is utilized in the deposition of the two layers 22 , 25 of FIGS. 4-5 .
- one important attribute of the preferred embodiments includes the slotted arrangement 30 .
- the slotted arrangement results in the actuator arm 21 moving up and down thereby causing the paddle 32 to also move up and down resulting in the ejection of ink.
- the slotted arrangement 30 results in minimum ink outflow through the actuator arm connection and also results in minimal pressure increases in this area.
- the face 33 of the actuator arm is extended out so as to form an extended interconnect with the paddle surface thereby providing for better attachment.
- the face 33 is connected to a block portion 36 which is provided to provide a high degree of rigidity.
- the actuator arm 21 and the wall of the nozzle chamber 28 have a generally corrugated nature so as to reduce any flow of ink through the slot 30 .
- the exterior surface of the nozzle chamber adjacent the block portion 36 has a rim eg. 38 so to minimize wicking of ink outside of the nozzle chamber.
- a pit 37 is also provided for this purpose.
- the pit 37 is formed in the lower CMOS layers 26 .
- An ink supply channel 39 is provided by means of back etching through the wafer to the back surface of the nozzle.
- FIGS. 8-15 there will now be described fabrication steps utilized in the construction of a single nozzle in accordance with the preferred embodiment.
- MEMS micro-electromechanical systems
- the heater element has a tapered portion adjacent the post 73 so as to ensure maximum heating occurs near the post.
- inkjet printhead structures can be formed.
- a portion of a single color printhead having two spaced apart rows 90 , 91 , with the two rows being interleaved so as to provide for a complete line of ink to be ejected in two stages.
- a guide rail 92 is provided for proper alignment of a TAB film with bond pads 93 .
- a second protective barrier 94 can also preferably be provided.
- adjacent actuator arms are interleaved and reversed.
- FIG. 18 there is illustrated a full color printhead arrangement which includes three series of inkjet nozzles 95 , 96 , 97 one each devoted to a separate color. Again, guide rails 98 , 99 are provided in addition to bond pads, eg. 100 .
- FIG. 18 there is illustrated a general plan of the layout of a portion of a full color printhead which clearly illustrates the interleaved nature of the actuator arms.
- the presently disclosed ink jet printing technology is potentially suited to a wide range of printing system including: color and monochrome office printers, short run digital printers, high speed digital printers, offset press supplemental printers, low cost scanning printers high speed pagewidth printers, notebook computers with inbuilt pagewidth printers, portable color and monochrome printers, color and monochrome copiers, color and monochrome facsimile machines, combined printer, facsimile and copying machines, label printers, large format plotters, photograph copiers, printers for digital photographic “minilabs”, video printers, PHOTO CD (PHOTO CD is a registered trademark of the Eastman Kodak Company) printers, portable printers for PDAs, wallpaper printers, indoor sign printers, billboard printers, fabric printers, camera printers and fault tolerant commercial printer arrays.
- PHOTO CD PHOTO CD is a registered trademark of the Eastman Kodak Company
- a nozzle assembly in accordance with a further embodiment of the invention is designated generally by the reference numeral 110 .
- An ink jet printhead has a plurality of nozzle assemblies 110 arranged in an array 114 ( FIGS. 34 and 35 ) on a silicon substrate 116 .
- the array 114 will be described in greater detail below.
- the assembly 110 includes a silicon substrate or wafer 116 on which a dielectric layer 118 is deposited.
- a CMOS passivation layer 120 is deposited on the dielectric layer 118 .
- Each nozzle assembly 110 includes a nozzle 122 defining a nozzle opening 124 , a connecting member in the form of a lever arm 126 and an actuator 128 .
- the lever arm 126 connects the actuator 128 to the nozzle 122 .
- the nozzle 122 comprises a crown portion 130 with a skirt portion 132 depending from the crown portion 130 .
- the skirt portion 132 forms part of a peripheral wall of a nozzle chamber 134 ( FIGS. 31 to 33 of the drawings).
- the nozzle opening 124 is in fluid communication with the nozzle chamber 134 . It is to be noted that the nozzle opening 124 is surrounded by a raised rim 136 which “pins” a meniscus 138 ( FIG. 31 ) of a body of ink 140 in the nozzle chamber 134 .
- An ink inlet aperture 142 (shown most clearly in FIG. 35 of the drawing) is defined in a floor 146 of the nozzle chamber 134 .
- the aperture 142 is in fluid communication with an ink inlet channel 148 defined through the substrate 116 .
- a wall portion 150 bounds the aperture 142 and extends upwardly from the floor portion 146 .
- the skirt portion 132 , as indicated above, of the nozzle 122 defines a first part of a peripheral wall of the nozzle chamber 134 and the wall portion 150 defines a second part of the peripheral wall of the nozzle chamber 134 .
- the wall 150 has an inwardly directed lip 152 at its free end which serves as a fluidic seal which inhibits the escape of ink when the nozzle 122 is displaced, as will be described in greater detail below. It will be appreciated that, due to the viscosity of the ink 140 and the small dimensions of the spacing between the lip 152 and the skirt portion 132 , the inwardly directed lip 152 and surface tension function as a seal for inhibiting the escape of ink from the nozzle chamber 134 .
- the actuator 128 is a thermal bend actuator and is connected to an anchor 154 extending upwardly from the substrate 116 or, more particularly, from the CMOS passivation layer 120 .
- the anchor 154 is mounted on conductive pads 156 which form an electrical connection with the actuator 128 .
- the actuator 128 comprises an actuator arm in the form of a pair of active beams 158 arranged above a pair of passive beams 160 .
- both beams 158 and 160 are of, or include, a conductive ceramic material such as titanium nitride (TiN).
- the beams 158 and 160 have their first ends anchored to the anchor 154 and their opposed ends connected to the arm 126 .
- thermal expansion of the beams 158 results.
- the passive beams 160 through which there is no current flow, do not expand at the same rate, a bending moment is created causing the arm 126 and, hence, the nozzle 122 to be displaced downwardly towards the substrate 116 as shown in FIG. 32 of the drawings.
- This causes an ejection of ink through the nozzle opening 124 as shown at 162 in FIG. 32 of the drawings.
- the nozzle 122 and the arm 126 define an ink ejecting mechanism.
- the nozzle 122 When the source of heat is removed from the active beams 158 , i.e. by stopping current flow, the nozzle 122 returns to its quiescent position as shown in FIG. 33 of the drawings.
- an ink droplet 164 is formed as a result of the breaking of an ink droplet neck as illustrated at 166 in FIG. 33 of the drawings.
- the ink droplet 164 then travels on to the print media such as a sheet of paper.
- a “negative” meniscus is formed as shown at 168 in FIG. 33 of the drawings.
- This “negative” meniscus 168 results in an inflow of ink 140 into the nozzle chamber 134 such that a new meniscus 138 ( FIG. 31 ) is formed in readiness for the next ink drop ejection from the nozzle assembly 110 .
- Each active beam 158 corresponds with one passive beam 160 to form two pairs of beams comprising an active beam 158 and a corresponding passive beam 160 .
- Each active beam 158 is spaced from its corresponding passive beam 160 in a plane that is substantially parallel to the substrate.
- the spacing between each active beam 158 and its respective passive beam 160 is suitably between 1 percent and 20 percent of the length of the beams. Preferably the spacing is between 5 percent and 10 percent of the length of the beams.
- This configuration provides the best protection against mutual buckling while maintaining efficiency of operation. In particular, Applicant has found that if the spacing is less than 1 percent of the length of the beams there is an unacceptable risk of mutual buckling and if the spacing is greater than 20 percent of the length of the beams the efficiency of the actuators 128 is compromised.
- the array 114 is for a four-color printhead. Accordingly, the array 114 includes four groups 170 of nozzle assemblies, one for each color. Each group 170 has its nozzle assemblies 110 arranged in two rows 172 and 174 . One of the groups 170 is shown in greater detail in FIG. 35 of the drawings.
- each nozzle assembly 110 in the row 174 is offset or staggered with respect to the nozzle assemblies 110 in the row 172 .
- the nozzle assemblies 110 in the row 172 are spaced apart sufficiently far from each other to enable the lever arms 126 of the nozzle assemblies 110 in the row 174 to pass between adjacent nozzles 122 of the assemblies 110 in the row 172 .
- each nozzle assembly 110 is substantially dumbbell shaped so that the nozzles 122 in the row 172 nest between the nozzles 122 and the actuators 128 of adjacent nozzle assemblies 110 in the row 174 .
- each nozzle 122 is substantially hexagonally shaped.
- the substrate 116 has bond pads 176 arranged thereon which provide the electrical connections, via the pads 156 , to the actuators 128 of the nozzle assemblies 110 . These electrical connections are formed via the CMOS layer (not shown).
- FIG. 36 of the drawings a development of the invention is shown. With reference to the previous drawings, like reference numerals refer to like parts, unless otherwise specified.
- a nozzle guard 180 is mounted on the substrate 116 of the array 114 .
- the nozzle guard 180 includes a body member 182 having a plurality of passages 184 defined therethrough.
- the passages 184 are in register with the nozzle openings 124 of the nozzle assemblies 110 of the array 114 such that, when ink is ejected from any one of the nozzle openings 124 , the ink passes through the associated passage 184 before striking the print media.
- the body member 182 is mounted in spaced relationship relative to the nozzle assemblies 110 by limbs or struts 186 .
- One of the struts 186 has air inlet openings 188 defined therein.
- the ink is not entrained in the air as the air is charged through the passages 184 at a different velocity from that of the ink droplets 164 .
- the ink droplets 164 are ejected from the nozzles 122 at a velocity of approximately 3 m/s.
- the air is charged through the passages 184 at a velocity of approximately 1 m/s.
- the purpose of the air is to maintain the passages 184 clear of foreign particles. A danger exists that these foreign particles, such as dust particles, could fall onto the nozzle assemblies 110 adversely affecting their operation. With the provision of the air inlet openings 88 in the nozzle guard 180 this problem is, to a large extent, obviated.
- FIGS. 37 to 39 of the drawings a process for manufacturing the nozzle assemblies 110 is described.
- the dielectric layer 118 is deposited on a surface of the wafer 116 .
- the dielectric layer 118 is in the form of approximately 1.5 microns of CVD oxide. Resist is spun on to the layer 118 and the layer 118 is exposed to mask 200 and is subsequently developed.
- the layer 118 is plasma etched down to the silicon layer 116 .
- the resist is then stripped and the layer 118 is cleaned. This step defines the ink inlet aperture 142 .
- approximately 0.8 microns of aluminum 202 is deposited on the layer 118 .
- Resist is spun on and the aluminum 202 is exposed to mask 204 and developed.
- the aluminum 202 is plasma etched down to the oxide layer 118 , the resist is stripped and the device is cleaned. This step provides the bond pads and interconnects to the ink jet actuator 128 .
- This interconnect is to an NMOS drive transistor and a power plane with connections made in the CMOS layer (not shown).
- CMOS passivation layer 120 Approximately 0.5 microns of PECVD nitride is deposited as the CMOS passivation layer 120 . Resist is spun on and the layer 120 is exposed to mask 206 whereafter it is developed. After development, the nitride is plasma etched down to the aluminum layer 202 and the silicon layer 116 in the region of the inlet aperture 142 . The resist is stripped and the device cleaned.
- a layer 208 of a sacrificial material is spun on to the layer 120 .
- the layer 208 is 6 microns of photo-sensitive polyimide or approximately 4 ⁇ m of high temperature resist.
- the layer 208 is softbaked and is then exposed to mask 210 whereafter it is developed.
- the layer 208 is then hardbaked at 400° C. for one hour where the layer 208 is comprised of polyimide or at greater than 300° C. where the layer 208 is high temperature resist. It is to be noted in the drawings that the pattern-dependent distortion of the polyimide layer 208 caused by shrinkage is taken into account in the design of the mask 210 .
- a second sacrificial layer 212 is applied.
- the layer 212 is either 2 ⁇ m of photosensitive polyimide, which is spun on, or approximately 1.3 ⁇ m of high temperature resist.
- the layer 212 is softbaked and exposed to mask 214 .
- the layer 212 is developed. In the case of the layer 212 being polyimide, the layer 212 is hardbaked at 400° C. for approximately one hour. Where the layer 212 is resist, it is hardbaked at greater than 300° C. for approximately one hour.
- a 0.2 micron multi-layer metal layer 216 is then deposited. Part of this layer 216 forms the passive beam 160 of the actuator 128 .
- the layer 216 is formed by sputtering 1,000 ⁇ of titanium nitride (TiN) at around 300° C. followed by sputtering 50 ⁇ of tantalum nitride (TaN). A further 1,000 ⁇ of TiN is sputtered on followed by 50 ⁇ of TaN and a further 1,000 ⁇ of TiN.
- TiN titanium nitride
- TaN tantalum nitride
- TiN titanium-oxide-semiconductor
- Other materials which can be used instead of TiN are TiB 2 , MoSi 2 or (Ti, Al)N.
- the layer 216 is then exposed to mask 218 , developed and plasma etched down to the layer 212 whereafter resist, applied for the layer 216 , is wet stripped taking care not to remove the cured layers 208 or 212 .
- a third sacrificial layer 220 is applied by spinning on 4 ⁇ m of photosensitive polyimide or approximately 2.6 ⁇ m high temperature resist.
- the layer 220 is softbaked whereafter it is exposed to mask 222 .
- the exposed layer is then developed followed by hardbaking.
- the layer 220 is hardbaked at 400° C. for approximately one hour or at greater than 300° C. where the layer 220 comprises resist.
- a second multi-layer metal layer 224 is applied to the layer 220 .
- the constituents of the layer 224 are the same as the layer 216 and are applied in the same manner. It will be appreciated that both layers 216 and 224 are electrically conductive layers.
- the layer 224 is exposed to mask 226 and is then developed.
- the layer 224 is plasma etched down to the polyimide or resist layer 220 whereafter resist applied for the layer 224 is wet stripped taking care not to remove the cured layers 208 , 212 or 220 . It will be noted that the remaining part of the layer 224 defines the active beam 158 of the actuator 128 .
- a fourth sacrificial layer 228 is applied by spinning on 4 ⁇ m of photosensitive polyimide or approximately 2.6 ⁇ m of high temperature resist.
- the layer 228 is softbaked, exposed to the mask 230 and is then developed to leave the island portions as shown in FIG. 9 k of the drawings.
- the remaining portions of the layer 228 are hardbaked at 400° C. for approximately one hour in the case of polyimide or at greater than 300° C. for resist.
- a high Young's modulus dielectric layer 232 is deposited.
- the layer 232 is constituted by approximately 1 ⁇ m of silicon nitride or aluminum oxide.
- the layer 232 is deposited at a temperature below the hardbaked temperature of the sacrificial layers 208 , 212 , 220 , 228 .
- the primary characteristics required for this dielectric layer 232 are a high elastic modulus, chemical inertness and good adhesion to TiN.
- a fifth sacrificial layer 234 is applied by spinning on 2 ⁇ m of photosensitive polyimide or approximately 1.3 ⁇ m of high temperature resist.
- the layer 234 is softbaked, exposed to mask 236 and developed.
- the remaining portion of the layer 234 is then hardbaked at 400° C. for one hour in the case of the polyimide or at greater than 300° C. for the resist.
- the dielectric layer 232 is plasma etched down to the sacrificial layer 228 taking care not to remove any of the sacrificial layer 234 .
- This step defines the nozzle opening 124 , the lever arm 126 and the anchor 154 of the nozzle assembly 110 .
- a high Young's modulus dielectric layer 238 is deposited. This layer 238 is formed by depositing 0.2 ⁇ m of silicon nitride or aluminum nitride at a temperature below the hardbaked temperature of the sacrificial layers 208 , 212 , 220 and 228 .
- the layer 238 is anisotropically plasma etched to a depth of 0.35 microns. This etch is intended to clear the dielectric from the entire surface except the side walls of the dielectric layer 232 and the sacrificial layer 234 . This step creates the nozzle rim 136 around the nozzle opening 124 which “pins” the meniscus of ink, as described above.
- UV release tape 240 is applied. 4 ⁇ m of resist is spun on to a rear of the silicon wafer 116 . The wafer 116 is exposed to mask 242 to back etch the wafer 116 to define the ink inlet channel 148 . The resist is then stripped from the wafer 116 .
- FIGS. 37 r and 38 r of the drawings show the reference numerals illustrated in these two drawings.
- FIGS. 40 and 41 show the operation of the nozzle assembly 110 , manufactured in accordance with the process described above with reference to FIGS. 37 and 38 , and these figures correspond to FIGS. 31 to 34 of the drawings.
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Abstract
An ink ejection nozzle arrangement for an inkjet printer includes a wafer substrate with an etched ink chamber and ink channel leading to the chamber; ink ejection nozzle defined over the chamber with an ejection port etched therein; a dielectric actuator arm attached to the substrate via a post on the substrate, the arm having a heating means formed of an electrically conductive material attached at a lower portion thereof proximate the post, wherein the arm extends through a slot in the chamber; and paddle fast with the arm inside the chamber, the paddle interposed between the ink channel and the ejection port. The slot in the chamber defines corrugations to inhibit leaking of ink from the slot.
Description
- This is a Continuation of Ser. No. 12/139,485 filed Jun. 15, 1008, which is a Continuation of Ser. No. 11/026,046 filed on Jan. 3, 2005, now issued U.S. Pat. No. 7,398,597, which is a Continuation of Ser. No. 10/968,922 filed on Oct. 21, 2004 now issued U.S. Pat. No. 7,066,575, which is a continuation of Ser. No. 10/728,887 filed on Dec. 8, 2003, now issued U.S. Pat. No. 6,824,252, which is a continuation of Ser. No. 10/309,080 filed on Dec. 4, 2002, now issued U.S. Pat. No. 6,682,176 which is a continuation in part of 09/113,122 filed Jul. 10, 1998, now issued U.S. Pat. No. 6,557,977 all of which are herein incorporated by reference.
- The present invention relates to micro-electromechanical fluid ejection devices.
- Many different types of printing have been invented, a large number of which are presently in use. The known forms of printers have a variety of methods for marking the print media with relevant marking media. Commonly used forms of printing include offset printing, laser printing and copying devices, dot matrix type impact printers, thermal paper printers, film recorders, thermal wax printers, dye sublimation printers and ink jet printers both of the drop on demand and continuous flow type. Each type of printer has its own advantages and problems when considering cost, speed, quality, reliability, simplicity of construction and operation etc.
- In recent years, the field of ink jet printing, wherein each individual pixel of ink is derived from one or more ink nozzles has become increasingly popular primarily due to its inexpensive and versatile nature.
- Many different techniques on ink jet printing have been invented. For a survey of the field, reference is made to an article by J Moore, “Non-Impact Printing: Introduction and Historical Perspective”, Output Hard Copy Devices, Editors R Dubeck and S Sherr, pages 207-220 (1988).
- Ink Jet printers themselves come in many different types. The utilisation of a continuous stream of ink in ink jet printing appears to date back to at least 1929 wherein U.S. Pat. No. 1,941,001 by Hansell discloses a simple form of continuous stream electro-static ink jet printing.
- U.S. Pat. No. 3,596,275 by Sweet also discloses a process of continuous ink jet printing including the step wherein the ink jet stream is modulated by a high frequency electrostatic field so as to cause drop separation. This technique is still utilized by several manufacturers including Elmjet and Scitex (see also U.S. Pat. No. 3,373,437 by Sweet et al)
- Piezoelectric ink jet printers are also one form of commonly utilized ink jet printing device. Piezoelectric systems are disclosed by Kyser et. al. in U.S. Pat. No. 3,946,398 (1970) which utilizes a diaphragm mode of operation, by Zolten in U.S. Pat. No. 3,683,212 (1970) which discloses a squeeze mode of operation of a piezoelectric crystal, by Stemme in U.S. Pat. No. 3,747,120 (1972) which discloses a bend mode of piezoelectric operation, Howkins in U.S. Pat. No. 4,459,601 which discloses a piezoelectric push mode actuation of the ink jet stream and by Fischbeck in U.S. Pat. No. 4,584,590 which discloses a shear mode type of piezoelectric transducer element.
- Recently, thermal ink jet printing has become an extremely popular form of ink jet printing. The ink jet printing techniques include those disclosed by Endo et al in GB 2007162 (1979) and by Vaught et al in U.S. Pat. No. 4,490,728. Both the aforementioned reference ink jet printing techniques rely upon the activation of an electrothermal actuator which results in the creation of a bubble in a constricted space, such as a nozzle, which thereby causes the ejection of ink from an aperture in communication with the confined space onto a relevant print media. Manufacturers such as Canon and Hewlett Packard manufacture printing devices utilizing the electrothermal actuator.
- As can be seen from the foregoing, many different types of printing technologies are available. Ideally, a printing technology should have a number of desirable attributes. These include inexpensive construction and operation, high-speed operation, safe and continuous long-term operation etc. Each technology may have its own advantages and disadvantages in the areas of cost, speed, quality, reliability, power usage, simplicity of construction, operation, durability and consumables.
- In the construction of any inkjet printing system, there are a considerable number of important factors which must be traded off against one another especially as large scale printheads are constructed, especially those of a pagewidth type. A number of these factors are outlined in the following paragraphs.
- Firstly, inkjet printheads are normally constructed utilizing micro-electromechanical systems (MEMS) techniques. As such, they tend to rely upon the standard integrated circuit construction/fabrication techniques of depositing planar layers on a silicon wafer and etching certain portions of the planar layers. Within silicon circuit fabrication technology, certain techniques are better known than others. For example, the techniques associated with the creation of CMOS circuits are likely to be more readily used than those associated with the creation of exotic circuits including ferroelectrics, gallium arsenide etc. Hence, it is desirable, in any MEMS construction, to utilize well-proven semi-conductor fabrication techniques that do not require the utilization of any “exotic” processes or materials. Of course, a certain degree of trade off will be undertaken in that if the use of the exotic material far outweighs its disadvantages then it may become desirable to utilize the material anyway.
- With a large array of ink ejection nozzles, it is desirable to provide for a highly automated form of manufacturing which results in an inexpensive production of multiple printhead devices.
- Preferably, the device constructed utilizes a low amount of energy in the ejection of ink. The utilization of a low amount of energy is particularly important when a large pagewidth full color printhead is constructed having a large array of individual print ejection mechanisms with each ejection mechanism, in the worst case, being fired in a rapid sequence.
- In the parent application, namely U.S. application Ser. No. 09/113,122 there is disclosed a printhead chip having a plurality of nozzle arrangements. These nozzle arrangements each include an actuator. The actuator has two pairs of actuating arms, each pair comprising an active actuating arm and a passive actuating arm. The active actuating arms are configured so that when heated upon receipt of an electrical signal, they deform and drive an ink displacement mechanism so that ink can be ejected from the respective nozzle chambers. The passive actuating arms serve to provide resilient flexibility and stability to the actuator.
- The Applicant has found that it is desirable that the actuator has a certain configuration to avoid buckling of the actuator when the active actuating arms are deformed to displace the actuator. While avoiding buckling, this configuration must also maintain efficiency of the actuator. This configuration is the subject of this invention.
- According to an aspect of the disclosure, an ink ejection nozzle arrangement for an inkjet printer includes a wafer substrate with an etched ink chamber and ink channel leading to the chamber; ink ejection nozzle defined over the chamber with an ejection port etched therein; a dielectric actuator arm attached to the substrate via a post on the substrate, the arm having a heating means formed of an electrically conductive material attached at a lower portion thereof proximate the post, wherein the arm extends through a slot in the chamber; and paddle fast with the arm inside the chamber, the paddle interposed between the ink channel and the ejection port. The slot in the chamber defines corrugations to inhibit leaking of ink from the slot.
- Notwithstanding any other forms, which may fall within the scope of the present invention, preferred forms of the invention will now be described, by way of example only, with reference to the accompanying drawings in which:
-
FIGS. 1-3 illustrate the operational principles of the preferred embodiment; -
FIG. 4 is a side perspective view of a single nozzle arrangement of the preferred embodiment; -
FIG. 5 illustrates a sectional side view of a single nozzle arrangement; -
FIGS. 6 and 7 illustrate operational principles of the preferred embodiment; -
FIGS. 8-15 illustrate the manufacturing steps in the construction of the preferred embodiment; -
FIG. 16 illustrates a top plan view of a single nozzle; -
FIG. 17 illustrates a portion of a single color printhead device; -
FIG. 18 illustrates a portion of a three-color printhead device; -
FIG. 19 provides a legend of the materials indicated inFIGS. 20 to 29 ; -
FIG. 20 toFIG. 29 illustrate sectional views of the manufacturing steps in one form of construction of an ink jet printhead nozzle; -
FIG. 30 shows a three dimensional, schematic view of a nozzle assembly for an ink jet printhead in accordance with another embodiment of the invention; -
FIGS. 31 to 33 show a three dimensional, schematic illustration of an operation of the nozzle assembly ofFIG. 30 ; -
FIG. 34 shows a three dimensional view of a nozzle array constituting an ink jet printhead; -
FIG. 35 shows, on an enlarged scale, part of the array ofFIG. 34 ; -
FIG. 36 shows a three dimensional view of an ink jet printhead including a nozzle guard; -
FIGS. 37A to 37R show three-dimensional views of steps in the manufacture of a nozzle assembly of an ink jet printhead; -
FIGS. 38A to 38R show sectional side views of the manufacturing steps; -
FIGS. 39A to 39K show layouts of masks used in various steps in the manufacturing process; -
FIGS. 40A to 40C show three dimensional views of an operation of the nozzle assembly manufactured according to the method ofFIGS. 37 and 38 ; and -
FIGS. 41A to 41C show sectional side views of an operation of the nozzle assembly manufactured according to the method ofFIGS. 37 and 38 . - In the preferred embodiment, there is provided a nozzle chamber having ink within it and a thermal actuator device interconnected to an ink ejecting mechanism in the form of a paddle, the thermal actuator device being actuated so as to eject ink from the nozzle chamber. The preferred embodiment includes a particular thermal actuator structure which includes an actuator arm in the form of a tapered heater structure arm for providing positional heating of a conductive heater layer row. The actuator arm is connected to the paddle through a slotted wall in the nozzle chamber. The actuator arm has a mating shape so as to mate substantially with the surfaces of the slot in the nozzle chamber wall.
- Turning initially to
FIGS. 1-3 , there is provided schematic illustrations of the basic operation of the device. Anozzle chamber 1 is provided filled withink 2 by means of anink inlet channel 3 which can be etched through a wafer substrate on which thenozzle chamber 1 rests. Thenozzle chamber 1 includes an ink ejection nozzle oraperture 4 around which an ink meniscus forms. - Inside the
nozzle chamber 1 is apaddle type device 7 which is connected to anactuator arm 8 through a slot in the wall of thenozzle chamber 1. Theactuator arm 8 includes a heater means 9 located adjacent to apost end portion 10 of the actuator arm. Thepost 10 is fixed to a substrate. - When it is desired to eject a drop from the nozzle chamber, as illustrated in
FIG. 2 , the heater means 9 is heated so as to undergo thermal expansion. Preferably, the heater means itself or the other portions of theactuator arm 8 are built from materials having a high bend efficiency where the bend efficiency is defined as -
- A suitable material for the heater elements is a copper nickel alloy which can be formed so as to bend a glass material.
- The heater means is ideally located adjacent the
post end portion 10 such that the effects of activation are magnified at thepaddle end 7 such that small thermal expansions nearpost 10 result in large movements of the paddle end. Theheating 9 causes a general increase in pressure around theink meniscus 5 which expands, as illustrated inFIG. 2 , in a rapid manner. The heater current is pulsed and ink is ejected out of thenozzle 4 in addition to flowing in from theink channel 3. Subsequently, thepaddle 7 is deactivated to again return to its quiescent position. The deactivation causes a general reflux of the ink into the nozzle chamber. The forward momentum of the ink outside the nozzle rim and the corresponding backflow results in a general necking and breaking off of adrop 12 which proceeds to the print media. Thecollapsed meniscus 5 results in a general sucking of ink into thenozzle chamber 1 via the inflow channel 3. In time, the nozzle chamber is refilled such that the position inFIG. 1 is again reached and the nozzle chamber is subsequently ready for the ejection of another drop of ink. - Turning now to
FIG. 4 , there is illustrated asingle nozzle arrangement 20 of the preferred embodiment. The arrangement includes anactuator arm 21 which includes abottom layer 22 which is constructed from a conductive material such as a copper nickel alloy (hereinafter called cupronickel) or titanium nitride (TiN). Thelayer 22, as will become more apparent hereinafter includes a tapered end portion near theend post 24. The tapering of thelayer 22 near this end means that any conductive resistive heating occurs near thepost portion 24. - The
layer 22 is connected to the lower CMOS layers 26 which are formed in the standard manner on asilicon substrate surface 27. Theactuator arm 21 is connected to an ejection paddle which is located within anozzle chamber 28. Thenozzle chamber 28 includes anink ejection nozzle 29 from which ink is ejected and includes aconvoluted slot arrangement 30 which is constructed such that theactuator arm 21 is able to move up and down while causing minimal pressure fluctuations in the area of thenozzle chamber 28 around theslot 30. -
FIG. 5 illustrates a sectional view through a single nozzle.FIG. 5 illustrates more clearly the internal structure of the nozzle chamber which includes thepaddle 32 attached to theactuator arm 21 havingface 33. Importantly, theactuator arm 21 includes, as noted previously, a bottomconductive layer 22. Additionally, atop layer 25 is also provided. - The utilization of a
second layer 25 of the same material as thefirst layer 22 allows for more accurate control of the actuator position as will be described with reference toFIGS. 6 and 7 . InFIG. 6 , there is illustrated the example where a high Young'sModulus material 40 is deposited utilizing standard semiconductor deposition techniques and on top of which is further deposited asecond layer 41 having a much lower Young's Modulus. Unfortunately, the deposition is likely to occur at a high temperature. Upon cooling, the two layers are likely to have different coefficients of thermal expansion and different Young's Moduli. Hence, in ambient room temperature, the thermal stresses are likely to cause bending of the two layers of material as shown at 42. - By utilizing a second deposition of the material having a high Young's Modulus, the situation in
FIG. 7 is likely to result wherein thematerial 41 is sandwiched between the twolayers 40. Upon cooling, the twolayers 40 are kept in tension with one another so as to result in a moreplanar structure 45 regardless of the operating temperature. This principle is utilized in the deposition of the twolayers FIGS. 4-5 . - Turning again to
FIGS. 4 and 5 , one important attribute of the preferred embodiments includes the slottedarrangement 30. The slotted arrangement results in theactuator arm 21 moving up and down thereby causing thepaddle 32 to also move up and down resulting in the ejection of ink. The slottedarrangement 30 results in minimum ink outflow through the actuator arm connection and also results in minimal pressure increases in this area. Theface 33 of the actuator arm is extended out so as to form an extended interconnect with the paddle surface thereby providing for better attachment. Theface 33 is connected to ablock portion 36 which is provided to provide a high degree of rigidity. Theactuator arm 21 and the wall of thenozzle chamber 28 have a generally corrugated nature so as to reduce any flow of ink through theslot 30. The exterior surface of the nozzle chamber adjacent theblock portion 36 has a rim eg. 38 so to minimize wicking of ink outside of the nozzle chamber. Apit 37 is also provided for this purpose. Thepit 37 is formed in the lower CMOS layers 26. Anink supply channel 39 is provided by means of back etching through the wafer to the back surface of the nozzle. - Turning to
FIGS. 8-15 there will now be described fabrication steps utilized in the construction of a single nozzle in accordance with the preferred embodiment. - The fabrication uses standard micro-electromechanical techniques. For a general introduction to a micro-electromechanical systems (MEMS) reference is made to standard proceedings in this field including the proceeding of the SPIE (International Society for Optical Engineering) including volumes 2642 and 2882 which contain the proceedings of recent advances and conferences in this field.
-
- 1. The preferred embodiment starts with a double sided polished wafer complete with, say, a 0.2
μm 1poly 2 metal CMOS process providing for all the electrical interconnects necessary to drive the inkjet nozzle. - 2. As shown in
FIG. 8 , theCMOS wafer 26 is etched at 50 down to thesilicon layer 27. The etching includes etching down to analuminum CMOS layer - 3. Next, as illustrated in
FIG. 9 , a 1 μm layer ofsacrificial material 55 is deposited. The sacrificial material can be aluminum or photosensitive polyimide. - 4. The sacrificial material is etched in the case of aluminum or exposed and developed in the case of polyimide in the area of the
nozzle rim 56 and including a dishedpaddle area 57. - 5. Next, a 1 μm layer of heater material 60 (cupronickel or TiN) is deposited.
- 6. A 3.4 μm layer of
PECVD glass 61 is then deposited. - 7. A
second layer 62 equivalent to thefirst layer 60 is then deposited. - 8. All three layers 60-62 are then etched utilizing the same mask. The utilization of a single mask substantially reduces the complexity in the processing steps involved in creation of the actuator paddle structure and the resulting structure is as illustrated in
FIG. 10 . Importantly, abreak 63 is provided so as to ensure electrical isolation of the heater portion from the paddle portion. - 9. Next, as illustrated in
FIG. 11 , a 10 μm layer ofsacrificial material 70 is deposited. - 10. The deposited layer is etched (or just developed if polyimide) utilizing a fourth mask which includes nozzle rim etchant holes 71, block portion holes 72 and
post portion 73. - 11. Next a 10 μm layer of PECVD glass is deposited so as to form the
nozzle rim 71,arm portions 72 and postportions 73. - 12. The glass layer is then planarized utilizing chemical mechanical planarization (CMP) with the resulting structure as illustrated in
FIG. 11 . - 13. Next, a 3 μm layer of PECVD glass is deposited.
- 14. The deposited glass is then etched as shown in
FIG. 12 , to a depth of approximately 1 μm so as to formnozzle rim portion 81 andactuator interconnect portion 82. - 15. Next, as illustrated in
FIG. 13 , the glass layer is etched utilizing a 6th mask so as to form finalnozzle rim portion 81 andactuator guide portion 82. - 16. Next, as illustrated in
FIG. 14 , the ink supply channel is back etched 85 from the back of the wafer utilizing a 7th mask. The etch can be performed utilizing a high precision deep silicon trench etcher such as the STS Advanced Silicon Etcher (ASE). This step can also be utilized to nearly completely dice the wafer. - 17. Next, as illustrated in
FIG. 15 the sacrificial material can be stripped or dissolved to also complete dicing of the wafer in accordance with requirements. - 18. Next, the printheads can be individually mounted on attached molded plastic ink channels to supply ink to the ink supply channels.
- 19. The electrical control circuitry and power supply can then be bonded to an etch of the printhead with a TAB film.
- 20. Generally, if necessary, the surface of the printhead is then hydrophobized so as to ensure minimal wicking of the ink along external surfaces. Subsequent testing can determine operational characteristics.
- 1. The preferred embodiment starts with a double sided polished wafer complete with, say, a 0.2
- Importantly, as shown in the plan view of
FIG. 16 , the heater element has a tapered portion adjacent thepost 73 so as to ensure maximum heating occurs near the post. - Of course, different forms of inkjet printhead structures can be formed. For example, there is illustrated in
FIG. 17 , a portion of a single color printhead having two spaced apartrows guide rail 92 is provided for proper alignment of a TAB film withbond pads 93. A secondprotective barrier 94 can also preferably be provided. Preferably, as will become more apparent with reference to the description ofFIG. 18 adjacent actuator arms are interleaved and reversed. - Turning now to
FIG. 18 , there is illustrated a full color printhead arrangement which includes three series ofinkjet nozzles guide rails FIG. 18 , there is illustrated a general plan of the layout of a portion of a full color printhead which clearly illustrates the interleaved nature of the actuator arms. - The presently disclosed ink jet printing technology is potentially suited to a wide range of printing system including: color and monochrome office printers, short run digital printers, high speed digital printers, offset press supplemental printers, low cost scanning printers high speed pagewidth printers, notebook computers with inbuilt pagewidth printers, portable color and monochrome printers, color and monochrome copiers, color and monochrome facsimile machines, combined printer, facsimile and copying machines, label printers, large format plotters, photograph copiers, printers for digital photographic “minilabs”, video printers, PHOTO CD (PHOTO CD is a registered trademark of the Eastman Kodak Company) printers, portable printers for PDAs, wallpaper printers, indoor sign printers, billboard printers, fabric printers, camera printers and fault tolerant commercial printer arrays.
- One alternative form of detailed manufacturing process which can be used to fabricate monolithic ink jet printheads operating in accordance with the principles taught by the present embodiment can proceed utilizing the following steps:
-
- 1. Using a double sided
polished wafer 27, complete drive transistors, data distribution, and timing circuits using a 0.5 micron, one poly, 2 metal CMOS process to formlayer 26. Relevant features of the wafer at this step are shown inFIG. 20 . For clarity, these diagrams may not be to scale, and may not represent a cross section though any single plane of the nozzle.FIG. 19 is a key to representations of various materials in these manufacturing diagrams, and those of other cross-referenced ink jet configurations. - 2. Etch oxide down to silicon or
aluminum using Mask 1. This mask defines the nozzle chamber, thesurface anti-wicking notch 37, and theheater contacts 110. This step is shown inFIG. 21 . - 3.
Deposit 1 micron of sacrificial material 55 (e.g. aluminum or photosensitive polyimide) - 4. Etch (if aluminum) or develop (if photosensitive polyimide) the sacrificial
layer using Mask 2. This mask defines thenozzle chamber walls 112 and the actuator anchor point. This step is shown inFIG. 22 . - 5.
Deposit 1 micron of heater material 60 (e.g. cupronickel or TiN). If cupronickel, then deposition can consist of three steps—a thin anti-corrosion layer of, for example, TiN, followed by a seed layer, followed by electroplating of the 1 micron of cupronickel. - 6. Deposit 3.4 microns of
PECVD glass 61. - 7. Deposit a
layer 62 identical to step 5. - 8. Etch both layers of heater material, and glass layer, using
Mask 3. This mask defines the actuator, paddle, and nozzle chamber walls. This step is shown inFIG. 23 . - 9. Wafer probe. All electrical connections are complete at this point, bond pads are accessible, and the chips are not yet separated.
- 10.
Deposit 10 microns ofsacrificial material 70. - 11. Etch or develop sacrificial
material using Mask 4. This mask defines thenozzle chamber wall 112. This step is shown inFIG. 24 . - 12.
Deposit 3 microns ofPECVD glass 113. - 13. Etch to a depth of (approx.) 1
micron using Mask 5. This mask defines thenozzle rim 81. This step is shown inFIG. 25 . - 14. Etch down to the sacrificial layer using Mask 6. This mask defines the
roof 114 of the nozzle chamber, and the nozzle itself. This step is shown inFIG. 26 . - 15. Back-etch completely through the silicon wafer (with, for example, an ASE Advanced Silicon Etcher from Surface Technology Systems) using
Mask 7. This mask defines theink inlets 30 which are etched through the wafer. The wafer is also diced by this etch. This step is shown inFIG. 27 . - 16. Etch the sacrificial material. The nozzle chambers are cleared, the actuators freed, and the chips are separated by this etch. This step is shown in
FIG. 28 . - 17. Mount the printheads in their packaging, which may be a molded plastic former incorporating ink channels which supply the appropriate color ink to the ink inlets at the back of the wafer.
- 18. Connect the printheads to their interconnect systems. For a low profile connection with minimum disruption of airflow, TAB may be used. Wire bonding may also be used if the printer is to be operated with sufficient clearance to the paper.
- 19. Hydrophobize the front surface of the printheads.
- 20. Fill the completed printheads with
ink 115 and test them. A filled nozzle is shown inFIG. 29 .
- 1. Using a double sided
- Referring now to
FIG. 30 of the drawings, a nozzle assembly, in accordance with a further embodiment of the invention is designated generally by thereference numeral 110. An ink jet printhead has a plurality ofnozzle assemblies 110 arranged in an array 114 (FIGS. 34 and 35 ) on asilicon substrate 116. Thearray 114 will be described in greater detail below. - The
assembly 110 includes a silicon substrate orwafer 116 on which adielectric layer 118 is deposited. ACMOS passivation layer 120 is deposited on thedielectric layer 118. - Each
nozzle assembly 110 includes anozzle 122 defining anozzle opening 124, a connecting member in the form of alever arm 126 and anactuator 128. Thelever arm 126 connects theactuator 128 to thenozzle 122. - As shown in greater detail in
FIGS. 31 to 33 of the drawings, thenozzle 122 comprises acrown portion 130 with askirt portion 132 depending from thecrown portion 130. Theskirt portion 132 forms part of a peripheral wall of a nozzle chamber 134 (FIGS. 31 to 33 of the drawings). Thenozzle opening 124 is in fluid communication with thenozzle chamber 134. It is to be noted that thenozzle opening 124 is surrounded by a raisedrim 136 which “pins” a meniscus 138 (FIG. 31 ) of a body ofink 140 in thenozzle chamber 134. - An ink inlet aperture 142 (shown most clearly in
FIG. 35 of the drawing) is defined in afloor 146 of thenozzle chamber 134. Theaperture 142 is in fluid communication with anink inlet channel 148 defined through thesubstrate 116. - A
wall portion 150 bounds theaperture 142 and extends upwardly from thefloor portion 146. Theskirt portion 132, as indicated above, of thenozzle 122 defines a first part of a peripheral wall of thenozzle chamber 134 and thewall portion 150 defines a second part of the peripheral wall of thenozzle chamber 134. - The
wall 150 has an inwardly directedlip 152 at its free end which serves as a fluidic seal which inhibits the escape of ink when thenozzle 122 is displaced, as will be described in greater detail below. It will be appreciated that, due to the viscosity of theink 140 and the small dimensions of the spacing between thelip 152 and theskirt portion 132, the inwardly directedlip 152 and surface tension function as a seal for inhibiting the escape of ink from thenozzle chamber 134. - The
actuator 128 is a thermal bend actuator and is connected to ananchor 154 extending upwardly from thesubstrate 116 or, more particularly, from theCMOS passivation layer 120. Theanchor 154 is mounted onconductive pads 156 which form an electrical connection with theactuator 128. - The
actuator 128 comprises an actuator arm in the form of a pair ofactive beams 158 arranged above a pair ofpassive beams 160. In a preferred embodiment, bothbeams - The
beams anchor 154 and their opposed ends connected to thearm 126. When a current is caused to flow through theactive beams 158 thermal expansion of thebeams 158 results. As thepassive beams 160, through which there is no current flow, do not expand at the same rate, a bending moment is created causing thearm 126 and, hence, thenozzle 122 to be displaced downwardly towards thesubstrate 116 as shown inFIG. 32 of the drawings. This causes an ejection of ink through thenozzle opening 124 as shown at 162 inFIG. 32 of the drawings. Thus, thenozzle 122 and thearm 126 define an ink ejecting mechanism. When the source of heat is removed from theactive beams 158, i.e. by stopping current flow, thenozzle 122 returns to its quiescent position as shown inFIG. 33 of the drawings. When thenozzle 122 returns to its quiescent position, anink droplet 164 is formed as a result of the breaking of an ink droplet neck as illustrated at 166 inFIG. 33 of the drawings. Theink droplet 164 then travels on to the print media such as a sheet of paper. As a result of the formation of theink droplet 164, a “negative” meniscus is formed as shown at 168 inFIG. 33 of the drawings. This “negative”meniscus 168 results in an inflow ofink 140 into thenozzle chamber 134 such that a new meniscus 138 (FIG. 31 ) is formed in readiness for the next ink drop ejection from thenozzle assembly 110. - Each
active beam 158 corresponds with onepassive beam 160 to form two pairs of beams comprising anactive beam 158 and a correspondingpassive beam 160. Eachactive beam 158 is spaced from its correspondingpassive beam 160 in a plane that is substantially parallel to the substrate. The spacing between eachactive beam 158 and its respectivepassive beam 160 is suitably between 1 percent and 20 percent of the length of the beams. Preferably the spacing is between 5 percent and 10 percent of the length of the beams. The Applicant has found that this configuration provides the best protection against mutual buckling while maintaining efficiency of operation. In particular, Applicant has found that if the spacing is less than 1 percent of the length of the beams there is an unacceptable risk of mutual buckling and if the spacing is greater than 20 percent of the length of the beams the efficiency of theactuators 128 is compromised. - Referring now to
FIGS. 34 and 35 of the drawings, thenozzle array 114 is described in greater detail. Thearray 114 is for a four-color printhead. Accordingly, thearray 114 includes fourgroups 170 of nozzle assemblies, one for each color. Eachgroup 170 has itsnozzle assemblies 110 arranged in tworows groups 170 is shown in greater detail inFIG. 35 of the drawings. - To facilitate close packing of the
nozzle assemblies 110 in therows nozzle assemblies 110 in therow 174 are offset or staggered with respect to thenozzle assemblies 110 in therow 172. Also, thenozzle assemblies 110 in therow 172 are spaced apart sufficiently far from each other to enable thelever arms 126 of thenozzle assemblies 110 in therow 174 to pass betweenadjacent nozzles 122 of theassemblies 110 in therow 172. It is to be noted that eachnozzle assembly 110 is substantially dumbbell shaped so that thenozzles 122 in therow 172 nest between thenozzles 122 and theactuators 128 ofadjacent nozzle assemblies 110 in therow 174. - Further, to facilitate close packing of the
nozzles 122 in therows nozzle 122 is substantially hexagonally shaped. - It will be appreciated by those skilled in the art that, when the
nozzles 122 are displaced towards thesubstrate 116, in use, due to thenozzle opening 124 being at a slight angle with respect to thenozzle chamber 134 ink is ejected slightly off the perpendicular. It is an advantage of the arrangement shown inFIGS. 34 and 35 of the drawings that theactuators 128 of thenozzle assemblies 110 in therows rows nozzles 122 in therow 172 and the ink droplets ejected from thenozzles 122 in therow 174 are parallel to one another resulting in an improved print quality. - Also, as shown in
FIG. 34 of the drawings, thesubstrate 116 hasbond pads 176 arranged thereon which provide the electrical connections, via thepads 156, to theactuators 128 of thenozzle assemblies 110. These electrical connections are formed via the CMOS layer (not shown). - Referring to
FIG. 36 of the drawings, a development of the invention is shown. With reference to the previous drawings, like reference numerals refer to like parts, unless otherwise specified. - In this development, a
nozzle guard 180 is mounted on thesubstrate 116 of thearray 114. Thenozzle guard 180 includes abody member 182 having a plurality ofpassages 184 defined therethrough. Thepassages 184 are in register with thenozzle openings 124 of thenozzle assemblies 110 of thearray 114 such that, when ink is ejected from any one of thenozzle openings 124, the ink passes through the associatedpassage 184 before striking the print media. - The
body member 182 is mounted in spaced relationship relative to thenozzle assemblies 110 by limbs or struts 186. One of thestruts 186 hasair inlet openings 188 defined therein. - In use, when the
array 114 is in operation, air is charged through theinlet openings 188 to be forced through thepassages 184 together with ink travelling through thepassages 184. - The ink is not entrained in the air as the air is charged through the
passages 184 at a different velocity from that of theink droplets 164. For example, theink droplets 164 are ejected from thenozzles 122 at a velocity of approximately 3 m/s. The air is charged through thepassages 184 at a velocity of approximately 1 m/s. - The purpose of the air is to maintain the
passages 184 clear of foreign particles. A danger exists that these foreign particles, such as dust particles, could fall onto thenozzle assemblies 110 adversely affecting their operation. With the provision of the air inlet openings 88 in thenozzle guard 180 this problem is, to a large extent, obviated. - Referring now to
FIGS. 37 to 39 of the drawings, a process for manufacturing thenozzle assemblies 110 is described. - Starting with the silicon substrate or
wafer 116, thedielectric layer 118 is deposited on a surface of thewafer 116. Thedielectric layer 118 is in the form of approximately 1.5 microns of CVD oxide. Resist is spun on to thelayer 118 and thelayer 118 is exposed tomask 200 and is subsequently developed. - After being developed, the
layer 118 is plasma etched down to thesilicon layer 116. The resist is then stripped and thelayer 118 is cleaned. This step defines theink inlet aperture 142. - In
FIG. 37 b of the drawings, approximately 0.8 microns ofaluminum 202 is deposited on thelayer 118. Resist is spun on and thealuminum 202 is exposed tomask 204 and developed. Thealuminum 202 is plasma etched down to theoxide layer 118, the resist is stripped and the device is cleaned. This step provides the bond pads and interconnects to theink jet actuator 128. This interconnect is to an NMOS drive transistor and a power plane with connections made in the CMOS layer (not shown). - Approximately 0.5 microns of PECVD nitride is deposited as the
CMOS passivation layer 120. Resist is spun on and thelayer 120 is exposed to mask 206 whereafter it is developed. After development, the nitride is plasma etched down to thealuminum layer 202 and thesilicon layer 116 in the region of theinlet aperture 142. The resist is stripped and the device cleaned. - A
layer 208 of a sacrificial material is spun on to thelayer 120. Thelayer 208 is 6 microns of photo-sensitive polyimide or approximately 4 μm of high temperature resist. Thelayer 208 is softbaked and is then exposed tomask 210 whereafter it is developed. Thelayer 208 is then hardbaked at 400° C. for one hour where thelayer 208 is comprised of polyimide or at greater than 300° C. where thelayer 208 is high temperature resist. It is to be noted in the drawings that the pattern-dependent distortion of thepolyimide layer 208 caused by shrinkage is taken into account in the design of themask 210. - In the next step, shown in
FIG. 37 e of the drawings, a secondsacrificial layer 212 is applied. Thelayer 212 is either 2 μm of photosensitive polyimide, which is spun on, or approximately 1.3 μm of high temperature resist. Thelayer 212 is softbaked and exposed tomask 214. After exposure to themask 214, thelayer 212 is developed. In the case of thelayer 212 being polyimide, thelayer 212 is hardbaked at 400° C. for approximately one hour. Where thelayer 212 is resist, it is hardbaked at greater than 300° C. for approximately one hour. - A 0.2 micron
multi-layer metal layer 216 is then deposited. Part of thislayer 216 forms thepassive beam 160 of theactuator 128. - The
layer 216 is formed by sputtering 1,000 Å of titanium nitride (TiN) at around 300° C. followed by sputtering 50 Å of tantalum nitride (TaN). A further 1,000 Å of TiN is sputtered on followed by 50 Å of TaN and a further 1,000 Å of TiN. - Other materials which can be used instead of TiN are TiB2, MoSi2 or (Ti, Al)N.
- The
layer 216 is then exposed tomask 218, developed and plasma etched down to thelayer 212 whereafter resist, applied for thelayer 216, is wet stripped taking care not to remove the curedlayers - A third
sacrificial layer 220 is applied by spinning on 4 μm of photosensitive polyimide or approximately 2.6 μm high temperature resist. Thelayer 220 is softbaked whereafter it is exposed tomask 222. The exposed layer is then developed followed by hardbaking. In the case of polyimide, thelayer 220 is hardbaked at 400° C. for approximately one hour or at greater than 300° C. where thelayer 220 comprises resist. - A second
multi-layer metal layer 224 is applied to thelayer 220. The constituents of thelayer 224 are the same as thelayer 216 and are applied in the same manner. It will be appreciated that bothlayers - The
layer 224 is exposed tomask 226 and is then developed. Thelayer 224 is plasma etched down to the polyimide or resistlayer 220 whereafter resist applied for thelayer 224 is wet stripped taking care not to remove the curedlayers layer 224 defines theactive beam 158 of theactuator 128. - A fourth
sacrificial layer 228 is applied by spinning on 4 μm of photosensitive polyimide or approximately 2.6 μm of high temperature resist. Thelayer 228 is softbaked, exposed to themask 230 and is then developed to leave the island portions as shown inFIG. 9 k of the drawings. The remaining portions of thelayer 228 are hardbaked at 400° C. for approximately one hour in the case of polyimide or at greater than 300° C. for resist. - As shown in
FIG. 371 of the drawing a high Young'smodulus dielectric layer 232 is deposited. Thelayer 232 is constituted by approximately 1 μm of silicon nitride or aluminum oxide. Thelayer 232 is deposited at a temperature below the hardbaked temperature of thesacrificial layers dielectric layer 232 are a high elastic modulus, chemical inertness and good adhesion to TiN. - A fifth
sacrificial layer 234 is applied by spinning on 2 μm of photosensitive polyimide or approximately 1.3 μm of high temperature resist. Thelayer 234 is softbaked, exposed to mask 236 and developed. The remaining portion of thelayer 234 is then hardbaked at 400° C. for one hour in the case of the polyimide or at greater than 300° C. for the resist. - The
dielectric layer 232 is plasma etched down to thesacrificial layer 228 taking care not to remove any of thesacrificial layer 234. - This step defines the
nozzle opening 124, thelever arm 126 and theanchor 154 of thenozzle assembly 110. - A high Young's
modulus dielectric layer 238 is deposited. Thislayer 238 is formed by depositing 0.2 μm of silicon nitride or aluminum nitride at a temperature below the hardbaked temperature of thesacrificial layers - Then, as shown in
FIG. 37 p of the drawings, thelayer 238 is anisotropically plasma etched to a depth of 0.35 microns. This etch is intended to clear the dielectric from the entire surface except the side walls of thedielectric layer 232 and thesacrificial layer 234. This step creates thenozzle rim 136 around thenozzle opening 124 which “pins” the meniscus of ink, as described above. - An ultraviolet (UV)
release tape 240 is applied. 4 μm of resist is spun on to a rear of thesilicon wafer 116. Thewafer 116 is exposed to mask 242 to back etch thewafer 116 to define theink inlet channel 148. The resist is then stripped from thewafer 116. - A further UV release tape (not shown) is applied to a rear of the wafer 16 and the
tape 240 is removed. Thesacrificial layers final nozzle assembly 110 as shown inFIGS. 37 r and 38 r of the drawings. For ease of reference, the reference numerals illustrated in these two drawings are the same as those inFIG. 30 of the drawings to indicate the relevant parts of thenozzle assembly 110.FIGS. 40 and 41 show the operation of thenozzle assembly 110, manufactured in accordance with the process described above with reference toFIGS. 37 and 38 , and these figures correspond toFIGS. 31 to 34 of the drawings. - It would be appreciated by a person skilled in the art that numerous variations and/or modifications may be made to the present invention as shown in the specific embodiments without departing from the spirit or scope of the invention as broadly described. The present embodiments are, therefore, to be considered in all respects to be illustrative and not restrictive.
Claims (7)
1. An ink ejection nozzle arrangement for an inkjet printer, the nozzle arrangement comprising:
a wafer substrate with an etched ink chamber and ink channel leading to the chamber;
an ink ejection nozzle defined over the chamber with an ejection port etched therein;
a dielectric actuator arm attached to the substrate via a post on the substrate, the arm having a heating means formed of an electrically conductive material attached at a lower portion thereof proximate the post, wherein the arm extends through a slot in the chamber; and
a paddle fast with the arm inside the chamber, the paddle interposed between the ink channel and the ejection port, wherein
the slot in the chamber defines corrugations to inhibit leaking of ink from the slot.
2. The nozzle arrangement of claim 1 , wherein the electrically conductive material is a copper-nickel alloy.
3. The nozzle arrangement of claim 1 , wherein the wafer substrate includes a CMOS layer with circuitry configured to supply current to the heating means.
4. The nozzle arrangement of claim 3 , wherein the heating means is arranged in electrical communication with the CMOS layer via suitable channels in the post.
5. The nozzle arrangement of claim 1 , wherein the paddle is substantially bowl shaped with a depression portion of such bowl distal from the ejection port to facilitate the ejection of ink from the ink chamber
6. The nozzle arrangement of claim 3 , wherein the substrate includes bond pads via which the heating means is connected to the CMOS layer.
7. The nozzle arrangement of claim 1 , wherein the nozzle includes a crown portion with a skirt portion depending from the crown portion, the skirt portion forming part of a peripheral wall of the chamber, the port having a raised rim to facilitate supporting a meniscus formed by ink in the chamber.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/848,966 US20100295903A1 (en) | 1997-07-15 | 2010-08-02 | Ink ejection nozzle arrangement for inkjet printer |
Applications Claiming Priority (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AUPO7991 | 1997-07-15 | ||
AUPO7991A AUPO799197A0 (en) | 1997-07-15 | 1997-07-15 | Image processing method and apparatus (ART01) |
AUPO8004A AUPO800497A0 (en) | 1997-07-15 | 1997-07-15 | Image creation method and apparatus (IJ26) |
AUPO8004 | 1997-07-15 | ||
US09/113,122 US6557977B1 (en) | 1997-07-15 | 1998-07-10 | Shape memory alloy ink jet printing mechanism |
US10/309,080 US6682176B2 (en) | 1997-07-15 | 2002-12-04 | Ink jet printhead chip with nozzle arrangements incorporating spaced actuating arms |
US10/728,887 US6824252B2 (en) | 1997-07-15 | 2003-12-08 | Micro-electromechanical fluid ejection device having a nozzle guard |
US10/968,922 US7066575B2 (en) | 1997-07-15 | 2004-10-21 | Micro-electromechanical fluid ejection device having a buckle-resistant actuator |
US11/026,046 US7398597B2 (en) | 1997-07-15 | 2005-01-03 | Method of fabricating monolithic microelectromechanical fluid ejection device |
US12/139,485 US7771018B2 (en) | 1997-07-15 | 2008-06-15 | Ink ejection nozzle arrangement for an inkjet printer |
US12/848,966 US20100295903A1 (en) | 1997-07-15 | 2010-08-02 | Ink ejection nozzle arrangement for inkjet printer |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/139,485 Continuation US7771018B2 (en) | 1997-07-15 | 2008-06-15 | Ink ejection nozzle arrangement for an inkjet printer |
Publications (1)
Publication Number | Publication Date |
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US20100295903A1 true US20100295903A1 (en) | 2010-11-25 |
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ID=25645485
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US09/113,122 Expired - Fee Related US6557977B1 (en) | 1997-07-15 | 1998-07-10 | Shape memory alloy ink jet printing mechanism |
US10/307,348 Expired - Fee Related US6764166B2 (en) | 1997-07-15 | 2002-12-02 | Ejecting ink using shape memory alloys |
US10/407,212 Expired - Fee Related US7416280B2 (en) | 1997-07-15 | 2003-04-07 | Inkjet printhead with hollow drop ejection chamber formed partly of actuator material |
US10/407,207 Expired - Fee Related US7252366B2 (en) | 1997-07-15 | 2003-04-07 | Inkjet printhead with high nozzle area density |
US10/421,822 Expired - Fee Related US6723575B2 (en) | 1997-07-15 | 2003-04-24 | Method of fabricating a shape memory alloy ink jet printing mechanism |
US10/421,823 Expired - Fee Related US6830316B2 (en) | 1997-07-15 | 2003-04-24 | Ink jet printing mechanism that incorporates a shape memory alloy |
US10/893,380 Expired - Fee Related US6938992B2 (en) | 1997-07-15 | 2004-07-19 | Nozzle arrangement with an electrically heated actuator |
US10/968,922 Expired - Fee Related US7066575B2 (en) | 1997-07-15 | 2004-10-21 | Micro-electromechanical fluid ejection device having a buckle-resistant actuator |
US10/982,789 Expired - Fee Related US7086720B2 (en) | 1997-07-15 | 2004-11-08 | Micro-electromechanical fluid ejection device that incorporates a shape memory alloy based actuator |
US11/026,046 Expired - Fee Related US7398597B2 (en) | 1997-07-15 | 2005-01-03 | Method of fabricating monolithic microelectromechanical fluid ejection device |
US10/882,774 Expired - Fee Related US7275811B2 (en) | 1997-07-15 | 2005-02-02 | High nozzle density inkjet printhead |
US11/064,011 Expired - Fee Related US7178903B2 (en) | 1997-07-15 | 2005-02-24 | Ink jet nozzle to eject ink |
US11/071,251 Expired - Fee Related US7147792B2 (en) | 1997-07-15 | 2005-03-04 | Method of fabricating inkjet nozzle chambers |
US11/071,261 Expired - Fee Related US7175774B2 (en) | 1997-07-15 | 2005-03-04 | Method of fabricating inkjet nozzles |
US11/080,496 Expired - Fee Related US7192119B2 (en) | 1997-07-15 | 2005-03-16 | Printhead nozzle arrangement with a micro-electromechanical shape memory alloy based actuator |
US11/159,193 Expired - Fee Related US7404625B2 (en) | 1997-07-15 | 2005-06-23 | Ink jet nozzle arrangement having paddle forming a portion of a wall |
US11/231,876 Expired - Fee Related US7284837B2 (en) | 1997-07-15 | 2005-09-22 | Fluid ejection device with micro-electromechanical fluid ejection actuators |
US11/298,635 Expired - Fee Related US7364270B2 (en) | 1997-07-15 | 2005-12-12 | Fluid ejection device having an elongate micro-electromechanical actuator |
US11/349,074 Expired - Fee Related US7255424B2 (en) | 1997-07-15 | 2006-02-08 | Ink nozzle |
US11/491,378 Expired - Fee Related US7350903B2 (en) | 1997-07-15 | 2006-07-24 | Inkjet printhead with common chamber and actuator material |
US11/540,569 Expired - Fee Related US7540592B2 (en) | 1997-07-15 | 2006-10-02 | Micro-electromechanical nozzle assembly with an arcuate actuator |
US11/766,713 Expired - Fee Related US7794053B2 (en) | 1997-07-15 | 2007-06-21 | Inkjet printhead with high nozzle area density |
US11/778,572 Expired - Fee Related US7566113B2 (en) | 1997-07-15 | 2007-07-16 | Inkjet nozzle incorporating serpentine actuator |
US11/841,647 Expired - Fee Related US7631956B2 (en) | 1997-07-15 | 2007-08-20 | Ink jet printhead with glass nozzle chambers |
US11/926,109 Expired - Fee Related US7568788B2 (en) | 1997-07-15 | 2007-10-28 | Printhead with barrier at chamber inlet |
US12/035,410 Expired - Fee Related US7635178B2 (en) | 1997-07-15 | 2008-02-21 | Nozzle apparatus for an inkjet printhead with a solenoid piston |
US12/037,054 Expired - Fee Related US7775632B2 (en) | 1997-07-15 | 2008-02-25 | Nozzle arrangement with expandable actuator |
US12/139,485 Expired - Fee Related US7771018B2 (en) | 1997-07-15 | 2008-06-15 | Ink ejection nozzle arrangement for an inkjet printer |
US12/493,241 Expired - Fee Related US7934806B2 (en) | 1997-07-15 | 2009-06-29 | Inkjet nozzle incorporating piston actuator |
US12/501,459 Expired - Fee Related US7914119B2 (en) | 1997-07-15 | 2009-07-12 | Printhead with columns extending across chamber inlet |
US12/620,527 Expired - Fee Related US7959263B2 (en) | 1997-07-15 | 2009-11-17 | Printhead integrated circuit with a solenoid piston |
US12/620,574 Expired - Fee Related US7950775B2 (en) | 1997-07-15 | 2009-11-17 | Printhead integrated circuit having glass nozzle chambers |
US12/848,966 Abandoned US20100295903A1 (en) | 1997-07-15 | 2010-08-02 | Ink ejection nozzle arrangement for inkjet printer |
US13/052,995 Abandoned US20110169892A1 (en) | 1997-07-15 | 2011-03-21 | Inkjet nozzle incorporating actuator with magnetic poles |
Family Applications Before (32)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/113,122 Expired - Fee Related US6557977B1 (en) | 1997-07-15 | 1998-07-10 | Shape memory alloy ink jet printing mechanism |
US10/307,348 Expired - Fee Related US6764166B2 (en) | 1997-07-15 | 2002-12-02 | Ejecting ink using shape memory alloys |
US10/407,212 Expired - Fee Related US7416280B2 (en) | 1997-07-15 | 2003-04-07 | Inkjet printhead with hollow drop ejection chamber formed partly of actuator material |
US10/407,207 Expired - Fee Related US7252366B2 (en) | 1997-07-15 | 2003-04-07 | Inkjet printhead with high nozzle area density |
US10/421,822 Expired - Fee Related US6723575B2 (en) | 1997-07-15 | 2003-04-24 | Method of fabricating a shape memory alloy ink jet printing mechanism |
US10/421,823 Expired - Fee Related US6830316B2 (en) | 1997-07-15 | 2003-04-24 | Ink jet printing mechanism that incorporates a shape memory alloy |
US10/893,380 Expired - Fee Related US6938992B2 (en) | 1997-07-15 | 2004-07-19 | Nozzle arrangement with an electrically heated actuator |
US10/968,922 Expired - Fee Related US7066575B2 (en) | 1997-07-15 | 2004-10-21 | Micro-electromechanical fluid ejection device having a buckle-resistant actuator |
US10/982,789 Expired - Fee Related US7086720B2 (en) | 1997-07-15 | 2004-11-08 | Micro-electromechanical fluid ejection device that incorporates a shape memory alloy based actuator |
US11/026,046 Expired - Fee Related US7398597B2 (en) | 1997-07-15 | 2005-01-03 | Method of fabricating monolithic microelectromechanical fluid ejection device |
US10/882,774 Expired - Fee Related US7275811B2 (en) | 1997-07-15 | 2005-02-02 | High nozzle density inkjet printhead |
US11/064,011 Expired - Fee Related US7178903B2 (en) | 1997-07-15 | 2005-02-24 | Ink jet nozzle to eject ink |
US11/071,251 Expired - Fee Related US7147792B2 (en) | 1997-07-15 | 2005-03-04 | Method of fabricating inkjet nozzle chambers |
US11/071,261 Expired - Fee Related US7175774B2 (en) | 1997-07-15 | 2005-03-04 | Method of fabricating inkjet nozzles |
US11/080,496 Expired - Fee Related US7192119B2 (en) | 1997-07-15 | 2005-03-16 | Printhead nozzle arrangement with a micro-electromechanical shape memory alloy based actuator |
US11/159,193 Expired - Fee Related US7404625B2 (en) | 1997-07-15 | 2005-06-23 | Ink jet nozzle arrangement having paddle forming a portion of a wall |
US11/231,876 Expired - Fee Related US7284837B2 (en) | 1997-07-15 | 2005-09-22 | Fluid ejection device with micro-electromechanical fluid ejection actuators |
US11/298,635 Expired - Fee Related US7364270B2 (en) | 1997-07-15 | 2005-12-12 | Fluid ejection device having an elongate micro-electromechanical actuator |
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