US20100276135A1 - Cooling fin and manufacturing method of the cooling fin - Google Patents

Cooling fin and manufacturing method of the cooling fin Download PDF

Info

Publication number
US20100276135A1
US20100276135A1 US12/747,777 US74777708A US2010276135A1 US 20100276135 A1 US20100276135 A1 US 20100276135A1 US 74777708 A US74777708 A US 74777708A US 2010276135 A1 US2010276135 A1 US 2010276135A1
Authority
US
United States
Prior art keywords
fin
cooling
distal end
end portion
cooling fin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/747,777
Other languages
English (en)
Inventor
Masahiro Morino
Yasuji Taketsuna
Yuya Takano
Hirofumi Inoshita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Original Assignee
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Assigned to TOYOTA JIDOSHA KABUSHIKI KAISHA reassignment TOYOTA JIDOSHA KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: INOSHITA, HIFORUMI, MORINO, MASAHIRO, TAKANO, YUYA, TAKETSUNA, YASUJI
Assigned to TOYOTA JIDOSHA KABUSHIKI KAISHA reassignment TOYOTA JIDOSHA KABUSHIKI KAISHA CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR INFORMATION PREVIOUSLY RECORDED ON REEL 024525 FRAME 0112. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNOR'S FIRST NAME TO BE "HIROFUMI". Assignors: INOSHITA, HIROFUMI, MORINO, MASAHIRO, TAKANO, YUYA, TAKETSUNA, YASUJI
Publication of US20100276135A1 publication Critical patent/US20100276135A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/10—Heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Definitions

  • the present invention relates to a cooling fin for dissipating heat from a heat generating element such as a semiconductor device into a fluid and a manufacturing method of the cooling fin and, more particularly, to a cooling fin with high cooling performance and a manufacturing method of the cooling fin.
  • a high-pressure-resistant and large-current power module to be mounted in a hybrid electric vehicle, an electric vehicle, or the like has to include a cooling structure having high heat dissipation performance because of a large self-heating value of the semiconductor device during operation.
  • FIG. 19 shows one example of a power module having a cooler.
  • a module 90 comprises a semiconductor device 10 which is a heating element, a heat spreader 20 supporting the semiconductor device 10 , and a cooler 130 joined to the heat spreader 20 and internally provided with flow paths.
  • the cooler 130 internally includes a cooling fin 131 made of a material having high heat conductivity (e.g. aluminum).
  • the cooling fin 131 has a plurality of fin parts 131 a arranged in a row at equal intervals. Distal ends of the fin parts 131 a are connected with a cover plate 132 . In the cooler 130 , accordingly, flow paths 135 are formed between the fin parts 131 a to extend along the longitudinal direction of each fin part 131 a.
  • the aforementioned conventional cooling fins have the following disadvantages. Specifically, in a manufacturing process of the offset fin, as shown in FIG. 20 , (A) a straight fin 91 is extruded by an extruder 50 through a die 51 formed with comb-teeth-shaped through holes. Then, (B) small blocks 92 are produced from the fin 91 by cutting and slit machining the fin 91 . Finally, (C) the small blocks 92 are arranged in an offset pattern and blocked fin parts 93 are combined in a staggered configuration.
  • the above offset fin manufacturing process needs blocks in number corresponding to the desired number of offset positions.
  • the corrugated fin is made in a sine or similar curve shape, which cannot be manufactured by extrusion molding. Accordingly, casting is generally utilized for manufacturing the corrugated fin. However, this casting cannot easily produce minute fins well as compared with the extrusion molding, thus making it difficult to increase the surface area of each fin. A material available for the casting is poor in heat conductivity as compared with a material available for the extrusion molding. The cooling performance of the former material is not sufficient.
  • Both the offset fin and the corrugated fin are configured such that fin parts uniformly extend from a base part. Accordingly, a coolant will flow at high speed in the vicinity of the center of each fin in a height direction thereof and at low speed in the vicinity of a proximal end of each fin joined to the base part. A heat exchange rate is therefore poor. Furthermore, the distal end and its vicinity of each fin part far from the heating element has a small temperature difference from the coolant as compared with the proximal end and its vicinity of each fin part close to the heating element. Thus, the heat exchange rate is further low.
  • the present invention has been made to solve the above problems which may be caused by the conventional cooling fins.
  • the present invention therefore has a purpose to provide an inexpensive cooling fin with improved cooling efficiency and a manufacturing method of the cooling fin.
  • a first aspect of the present invention provides a cooling fin comprising a plurality of fin parts arranged in a row and a base part integrally continuous to one ends of the fin parts to support the fin parts, wherein each fin part has a shape in which a proximal end portion continuous to the base part is straight and a distal end portion is wavy in a flow direction of a coolant which will flow through the fin parts.
  • each fin part is integrally formed each extending from the base part and arranged in a row to flow paths therebetween.
  • Each fin part has the proximal end portion of a straight shape and the distal end portion partially slanted to provide a wave shape (corrugated shape) in the coolant flow direction (a direction from an entrance to an exit of the coolant).
  • each fin part continuously changes so that the cross section of each fin part in a direction perpendicular to the height direction on the distal end side is wavier than the cross section of each fin part on the proximal end side. Resistance between each fin part and a fluid becomes greater as a portion of each fin is closer to the distal end, so that the fluid, i.e. coolant, is not allowed to flow smoothly each flow path.
  • the coolant is allowed to flow more smoothly through each flow path as it is closer to the proximal end.
  • a flow rate of the coolant in the vicinity of the proximal end will increase. That is, the coolant will flow in larger amount on the side closer to the proximal end which is a bottom in the height direction of each fin part.
  • a heat generating element is placed near the proximal ends of the fin parts to efficiently dissipate heat.
  • the distal end portion of each fin part is formed into a wave shape (corrugated shape).
  • the fluid i.e.
  • each fin part has a wave shape designed to meet an expression (I):
  • f is a pitch of the fin parts
  • w is a thickness of each fin part
  • a is a height of the wave shape of each fin part.
  • the invention provides a manufacturing method of a cooling fin comprising a plurality of fin parts arranged in a row and a base part integrally continuous to one ends of the fin parts to support the fin parts, the method comprising the steps of: extruding a straight shaped fin including a plurality of fin parts each extending from the base part into a comb teeth shape; and partially bending a distal end portion of each straight fin part in a direction intersecting an extruding direction to shape the distal end portion into a wave shape in a flow direction of a coolant which will flow through between the fin parts.
  • the straight shaped cooling fin is produced by extrusion molding.
  • the fin parts can be formed in finer shape as compared with a cooling fin produced by casting.
  • the extrusion molding allows the use of a high heat conductive material. The cooling performance is therefore high.
  • the manufacturing method is suitable for mass production to manufacture the cooling fin at low cost.
  • each fin part is bent into a wave shape (corrugated shape).
  • a cooling fin can be formed singly in a wave shape without needing a plurality of split blocks. Accordingly, the invention can provide a simpler manufacturing process with less number of components and process steps as compared with the offset fin.
  • a wave angle (a bending angle) and a wave pitch of the fin parts can be determined to adjust the cooling performance.
  • the cooling fin with a straight proximal end portion and a wavy distal end portion is produced by the two steps, that is, the extrusion molding step and the bending step. Accordingly, the cooling fin with high cooling performance can be manufactured in simple steps.
  • the bending step includes arranging a jig in a clearance between the fin parts and bending the fin parts with the jig by cold working.
  • the bending technique in a cold condition includes for example placing the jig on one side and the other side of each fin part in a staggered pattern, and applying a load on the fin part by at least the jig placed on one side. This makes it possible to manufacture the fin parts with the proximal end portion having a straight shape and the distal end portion having a wave shape. In such cold bending in the cold working, existing facilities are available.
  • the bending step of the invention preferably, includes placing the jig in a position corresponding to clearances between the fin parts having just been extruded, and bending the fin parts with the jig by hot working.
  • the bending technique in a hot condition for example, the jig has comb teeth insertable in clearances (slits) between the fin parts, and the bending step further comprises moving the jig in a direction intersecting the extruding direction.
  • the entire cooling fin is high in temperature because of just after extrusion and hence the fin parts can be processed easily.
  • a load on the jig is small in the bending work. Because the heat deriving from the extrusion working is utilized, it is unnecessary to increase the temperature of each fin part in hot working. This makes it possible to shorten a manufacturing time and make efficient use of energy.
  • FIG. 1 is a perspective view showing a schematic configuration of a power module in a preferred embodiment
  • FIG. 2 is a perspective view showing a schematic configuration of a cooling fin in the embodiment
  • FIG. 3 is a plan view showing the schematic configuration of the cooling fin of FIG. 2 ;
  • FIG. 4 is a partial enlarged view showing the details of a portion of the cooling fin enclosed by a circle X of a dashed line in FIG. 2 ;
  • FIG. 5 is a sectional view of the cooling fin taken along a line A-A in FIG. 3 ;
  • FIG. 6 is a sectional view of the cooling fin taken along a line B-B in FIG. 3 ;
  • FIG. 7 is a sectional view of the cooling fin taken along a line C-C in FIG. 3 ;
  • FIG. 8 is a schematic view showing a flow speed distribution in a cooling fin in a conventional art
  • FIG. 9 is a schematic view showing a flow speed distribution in the cooling fin in the embodiment.
  • FIG. 10 is a view showing a shape (a straight shape) of a fin after extrusion molding
  • FIG. 11 is a schematic view showing an outline of a fin bending operation by cold working
  • FIG. 12 is a schematic view showing an outline of a fin bending operation by hot working (extrusion of a straight fin);
  • FIG. 13 is another schematic view showing the outline of the fin bending operation in hot working (bending of the straight fin);
  • FIG. 14 is a perspective view showing a schematic configuration of a jig used in the hot working
  • FIG. 15 is a view showing each size of a wavy portion of the cooling fin
  • FIG. 16 is a graph showing correlation between a wave pitch, a wave angle, and pressure loss in each cooling fin
  • FIG. 17 is a graph showing correlation between a wave pitch, a wave angle, and a heat transfer rate in each cooling fin
  • FIG. 18 is a perspective view showing a modified form of a cooler
  • FIG. 19 is a perspective view showing a schematic configuration of a power module in a conventional art.
  • FIG. 20 is a perspective view showing an outline of a manufacturing process of an offset fin.
  • a power module 100 in this embodiment includes, as shown in FIG. 1 , a semiconductor device 10 which is a heat generating element, a heat spreader 20 on which the semiconductor device 10 is placed, and a cooler 30 internally provided with flow paths for coolant. In the power module 100 , heat from the semiconductor device 10 will be dissipated into the cooler 30 through the heat spreader 20 .
  • the semiconductor device 10 is a device such as IGBT constituting an inverter circuit. It is to be noted that much more semiconductor devices are installed on a vehicle-mounted power module but only a part thereof is schematically illustrated for facilitating explanation.
  • the heat spreader 20 is made of a high heat-conductive material to dissipate heat from the semiconductor device 10 .
  • the heat spreader 20 is integrally brazed to the cooler 30 .
  • a fixing method of the heat spreader 20 to the cooler 30 is not limited to the brazing.
  • the heat spreader 20 may be fixed to the cooler 30 with a bolt.
  • the cooler 30 includes a cooling fin 31 and a cover plate 32 joined to a distal end of the cooling fin 31 .
  • the cooling fin 31 is made of a material, such as aluminum alloy, having high heat conductivity and being light in weight.
  • flow paths 35 for coolant are defined by the cooling fin 31 and the cover plate 32 .
  • the coolant may be selected either liquid or gas.
  • cooling water is supplied as the coolant to the flow paths 35 .
  • FIG. 2 is a perspective view of the cooling fin 31 and FIG. 3 is a plan view of the cooling fin 31 .
  • the cooling fin 31 is constituted of fin parts 1 arranged in a row at equal intervals and a base part 2 integral with the fin parts 1 to support the fin parts 1 .
  • Each fin part 1 has such a shape that a proximal end continuous to the base part 2 is straight in a flowing direction of the coolant (a direction from an entrance to an exit of the coolant (i.e., from IN to OUT in FIG. 1 )) and a distal end is wavier.
  • each fin part 1 of the cooling fin 31 in this embodiment is constituted of first regions 11 vertical to the base part 2 , second regions 12 each slanting at a predetermined angle with respect to the base part 2 , and third regions 13 joining the first region 11 and the second region 12 .
  • a set of the first to third regions 11 to 13 is shown in FIG. 4 (an enlarged view of a portion enclosed by a circle X of a dashed line in FIG. 2 ).
  • the first region 11 is of a nearly trapezoidal shape having a lower side at the proximal end and an upper side at the distal end so that the lower side is wider than the upper side.
  • the second region 12 is of a nearly rectangular shape.
  • the third region 13 is of a nearly triangular shape having a side corresponding to a ridge line joining between the upper side of the first region 11 and the upper side of the second region 12 .
  • the first region 11 and the second region 12 extend to form the fin part 1 from the same straight line of the base part 2 .
  • the shape of the fin part 1 is straight in the proximal end because the lower side of the first region 11 is continuous to the lower side of the second region 12 .
  • the first region 11 extends vertically with respect to the base part 2 as shown in FIG. 5 (a sectional view along a line A-A in FIG. 3 ).
  • the second region 12 is slanted at the predetermined angle with respect to the base part 2 as shown in FIG. 6 (a sectional view along a line B-B in. FIG. 3 ).
  • each fin part 1 the upper side of the first region 11 and the upper side of the second region 12 are continuous to each other via the third region 13 , so that the shape of the distal end of each fin part 1 is wavy (corrugated) in the coolant flow direction.
  • the third region 13 has a nearly triangular shape having an apex located at the proximal end of the fin part 1 and a width being wider as coming closer to the distal end. Specifically, a portion between the first region 11 and the second region 12 in FIG.
  • FIG. 3 includes a proximal-end-side portion vertically extending upward as a part of the first region 11 and a distal-end-side portion slightly slanting as the third region 13 as shown in FIG. 7 (along a line C-C in FIG. 3 ).
  • FIG. 8 shows a flow speed distribution in a straight fin of a conventional shape.
  • the flow speed of the coolant reaches a peak in an area on or around the center (within a centermost broken line in FIG. 8 ) of each flow path in the height direction of each fin part 1 (a vertical direction in FIG. 8 ) and is slow in an area on or around the proximal end.
  • the cooling performance is poor in the vicinity of the proximal end of each fin part 1 .
  • the coolant flow speed is similarly slow even in the vicinity of the distal end of each fin part 1 .
  • the distal end side is far from the semiconductor device 10 which is the heat generating element and therefore has a small temperature difference from the coolant.
  • the cooling performance is also poor in the vicinity of the proximal end.
  • FIG. 9 shows a flow speed distribution in the cooling fin in the present embodiment, having a straight proximal end and a wavy distal end.
  • the cross-section of each fin part 1 in the direction perpendicular to the height direction is shaped to be wavier on the side closer to the distal end than the proximal end. Accordingly, resistance between each fin part 1 and the coolant is larger on the distal end side than the proximal end side, thereby making the coolant hard to flow.
  • a peak (within a centermost broken line in FIG.
  • Each fin 1 is of a wave shape (corrugated shape) in the vicinity of the distal end.
  • the flow of coolant is caused to become turbulent. It is therefore expected to break the boundary layer (Second grounds). Consequently, high cooling performance can be obtained even in the vicinity of the proximal end.
  • a manufacturing process of the cooling fin 31 includes an extruding step of producing a straight fin by extrusion molding and a bending step of bending a part of each fin part into a wave shape.
  • a fin is produced in the extruding step by extrusion molding which is inexpensive and adequate for mass production.
  • a fin 310 is molded as a straight fin having a plurality of fin parts 1 as shown in FIG. 10 . This is because a final fin shape including a wavy distal end and a straight proximal end is so complicated as not to be produced by only extrusion molding. The straight fin 310 is therefore first produced.
  • each fin part 1 is shaped to be wavy.
  • a special jig 6 is placed on both sides of each fin part 1 .
  • This jig 6 is constituted of supporting jigs 61 and 62 which are disposed on one side of each fin part 1 and a loading jig 63 which is disposed on the other side.
  • the jigs 61 to 63 are arranged in a staggered pattern so that the supporting jig 61 , the loading jig 63 , and the supporting jig 62 are positioned in the order from upstream in the coolant flow direction along the fin part 1 .
  • the loading jig 63 applies a load on the fin part 1 .
  • the fin part 1 is thus plastic deformed partially in a direction intersecting the extruding direction into a wave shape as shown in FIG. 2 .
  • a slant surface contacting with the loading jig 63 forms the second region 12 of the fin part 1 and surfaces contacting with the supporting jigs 61 and 62 form the first regions 11 of the fin part 1 .
  • Each surface located between the adjacent jigs form the third region 13 of the fin part 1 .
  • the bending step may be not only the above cold working (at room temperature) but also a hot working to be performed just after the extruding step.
  • the extruding step is executed to produce a straight fin by normal extrusion molding.
  • a die 51 for producing the straight fin 310 is attached to a molding machine 50 .
  • a billet 52 is loaded in the molding machine 50 and a pressurizing member 53 presses the inside of the molding machine 50 .
  • the straight fin 310 having the straight fin parts 1 as shown in FIG. 10 is extruded out through the die 51 .
  • a special jig 7 is placed across the fin parts 1 as shown in FIG. 13 .
  • the jig 7 has a comb shape having a plurality of comb teeth 71 as shown in FIG. 14 .
  • Each of the comb teeth 71 of the jig 7 is inserted between the fin parts 1 .
  • the jig 7 is periodically moved in a direction intersecting the extruding direction in plan view seen from above in the height direction of the fin parts 1 . Accordingly, the fin parts 1 are deformed in a hot condition into the wavy or corrugated shape as shown in FIG. 2 .
  • the temperature of the fin parts 1 is high (about)600° because of just after the extruding step. Accordingly, the fin parts 1 can be bent easily and thus the jig 7 receives only a small load during working. The jig 7 therefore can have good durability. Because of just after the extruding step, furthermore, the heat deriving from the extruding step can be utilized. It is therefore unnecessary to increase the temperature of the cooling fin 31 for the bending step. This makes it possible to shorten a manufacturing time and efficiently utilize energy. On the other hand, the above cold working can be handled by existing facilities, leading to a low initial cost.
  • a material to be used in the extrusion molding is one of aluminum alloys, especially, an aluminum alloy with high heat conductivity.
  • Table 1 shows comparison in heat conductivity between materials. In Table 1, the materials are expressed based on the Japanese Industrial Standards (JIS).
  • Casting is one of the techniques for molding the cooling fin 31 .
  • a material (e.g. ADC12) to be used in the casting is also an aluminum alloy but it has lower heat conductivity than the material (e.g. A6063) to be used in the extrusion molding.
  • the cooling fin 31 in this embodiment is made by the extrusion molding and therefore can have higher cooling performance than that made by the casting.
  • FIG. 15 shows parameters of the wave shape (corrugated shape) of the cooling fin 31 on the distal end side. Each parameter represents as follows.
  • Wave angle Bending angle of a wave shape
  • Wave pitch Pitch of a wave shape (hereinafter, Wave pitch)
  • the fin bending amount “a” is equivalent to a difference (height of the wave shape of each fin part 1 ) in position in a direction perpendicular to the reference surface between one surface (a reference surface) of the first region 11 and a surface of the second region 12 continuous to the reference surface in the distal end of each fin part 1 .
  • the supporting jigs 61 and 62 are equal in width to the loading jig 63 . Accordingly, the following explanation is given assuming that the length of a straight portion of each first region 11 of the fin part 1 is equal to the length of a straight portion of each second region 12 .
  • the conditions the above parameters should satisfy are represented by expressions (1) to (4).
  • the wave pitch (P) can be represented by the following expression (1) using the length (c) of the straight portion of the fin part 1 , the bending amount (a) of the fin part 1 , and the wave angle ( ⁇ ):
  • the wave angle ( ⁇ ) in the expression (1) As the wave angle ( ⁇ ) in the expression (1) is larger, the turbulence of coolant flow is more induced, thereby enhancing the cooling performance. However, if the wave angle ( ⁇ ) is too large, the fin part 1 is likely to be broken in the bending step. Assuming a design angle regarded as a breaking limit is a, accordingly, the wave angle ( ⁇ ) has to meet the following expression (2):
  • the jig 6 (or the jig 7 , hereinafter omitted) is placed in contact with the straight portion over its length (c) in the bending step.
  • the jig 6 to be inserted between the fin parts 1 must be narrow in width. Narrower the width of the jig 6 , the strength of the jig 6 tends to be lower, which is likely to cause breakage of the jig 6 . Assuming a design length regarded as a breaking limit of the straight portion of the jig 6 is ⁇ , the length (c) of the straight portion has to meet the following expression (3):
  • each fin part 1 If the bending amount (a) of each fin part 1 is small, it is not expected to break the boundary layer. In order to break the boundary layer and enhance the cooling performance, it is preferable to cause the coolant to meander through each flow path 35 by reducing an area allowing the coolant to linearly flow in each flow path 35 . Specifically, it is desired to meet the expression (4):
  • the shape of the cooling fin 31 is determined to satisfy the desired cooling performance by changing the wave pitch (P) and the wave angle ( ⁇ ) in a range that meets the above expressions (1) to (4).
  • the size is selected to achieve the cooling performance most highly in such a range as not to break the fin parts 1 and the bending jig 6 .
  • FIG. 16 shows correlation of P and ⁇ with pressure loss.
  • FIG. 17 shows correlation of P and ⁇ with heat transfer rate. In both the figures; concrete numerals are not indicated and the cooling performance (pressure loss and heat transfer rate) is expressed as 1 by assuming an arbitrary wave angle ( ⁇ ) is 1.
  • a plot using white circles shows the cooling performance when the length (c) of the straight portion is equal but the wave angle ( ⁇ ) and the wave pitch (P) are different between the cooling fins 31 .
  • a plot using black circles shows the cooling performance when the wave pitch (P) is equal but the wave angle ( ⁇ ) and the length (c) are different between the cooling fins 31 .
  • each fin part 1 is partially formed at a slant so that the proximal end portion is straight and the distal end is wavy (corrugated).
  • Such configuration allows the coolant to flow more smoothly in the vicinity of the proximal end than in the vicinity of the distal end, thereby increasing the flow rate of the coolant flowing along the vicinity of the proximal end.
  • This makes it possible to enhance the cooling performance in the vicinity of the proximal end of each fin part 1 located close to the semiconductor device 10 .
  • the distal end portion of each fin part 1 located far from the semiconductor device 10 is wavy.
  • the coolant becomes turbulent when collides with the fin parts 1 , inducing breakage of the boundary layer. Accordingly, high cooling performance can also be obtained in the vicinity of the distal end of each fin part 1 .
  • the straight-shaped cooling fin 310 is produced by extrusion molding (the extruding step).
  • the fin parts 1 can therefore be formed in smaller or finer shape as compared with the cooling fin produced by casting.
  • a high heat conductive material can be used and hence high cooling performance can be achieved.
  • the cooling fin 310 is suitable for mass production and can be manufactured at low cost.
  • each fin part 1 is partially bent in the direction intersecting the extruding direction into a wave shape (the bending step).
  • the cooling fin can be formed singly in a wave shape without needing split blocks.
  • the present embodiment can provide a simpler manufacturing process with less number of components and process steps. Consequently, the cooling fin with reduced cost and improved cooling efficiency and the manufacturing method of the cooling fin can be achieved.
  • the present invention is not limited to the above embodiment(s) and may be embodied in other specific forms without departing from the essential characteristics thereof.
  • the coolant flow paths 35 are formed by joining the cover plate 32 to the cooling fin 31 .
  • An alternative is to provide a casing 33 that houses the cooling fin 31 in which clearances (slits) between the fin parts are closed by an inner surface of the casing 33 to form flow paths.
  • the cooling fin with reduced cost and improved cooling efficiency and the manufacturing method of the cooling fin can be achieved.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
US12/747,777 2007-12-14 2008-11-28 Cooling fin and manufacturing method of the cooling fin Abandoned US20100276135A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007-322831 2007-12-14
JP2007322831A JP2009147107A (ja) 2007-12-14 2007-12-14 冷却フィンおよび冷却フィンの製造方法
PCT/JP2008/072110 WO2009078289A2 (en) 2007-12-14 2008-11-28 Cooling fin and manufacturing method of the cooling fin

Publications (1)

Publication Number Publication Date
US20100276135A1 true US20100276135A1 (en) 2010-11-04

Family

ID=40329239

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/747,777 Abandoned US20100276135A1 (en) 2007-12-14 2008-11-28 Cooling fin and manufacturing method of the cooling fin

Country Status (6)

Country Link
US (1) US20100276135A1 (ja)
EP (1) EP2220674A2 (ja)
JP (1) JP2009147107A (ja)
KR (1) KR20100087377A (ja)
CN (1) CN101897011A (ja)
WO (1) WO2009078289A2 (ja)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110094722A1 (en) * 2009-10-26 2011-04-28 Kabushiki Kaisha Toyota Jidoshokki Liquid-cooled-type cooling device
US20110240267A1 (en) * 2008-11-18 2011-10-06 Compagnie Mediterraneenne Des Cafes Fluid circulation conduit
US20110284197A1 (en) * 2010-05-21 2011-11-24 Denso Corporation Heat Exchanger
US20130025837A1 (en) * 2011-06-07 2013-01-31 Toyota Jidosha Kabushiki Kaisha Cooler
US8365409B2 (en) 2009-05-22 2013-02-05 Toyota Jidosha Kabushiki Kaisha Heat exchanger and method of manufacturing the same
US20130068434A1 (en) * 2010-05-28 2013-03-21 Yuya Takano Heat exchanger and method for manufacturing same
US20130327508A1 (en) * 2012-06-07 2013-12-12 Mark A. Zaffetti Cold plate assembly incorporating thermal heat spreader
US20160109190A1 (en) * 2012-10-09 2016-04-21 Danfoss Silicon Power Gmbh A flow distribution module with a patterned cover plate
US20160379914A1 (en) * 2014-03-20 2016-12-29 Fuji Electric Co., Ltd. Cooler and semiconductor module using same
US20170311480A1 (en) * 2014-10-28 2017-10-26 Denso Corporation Heat exchanger
US20180024599A1 (en) * 2015-06-03 2018-01-25 Mitsubishi Electric Corporation Liquid-type cooling apparatus and manufacturing method for heat radiation fin in liquid-type cooling apparatus
US20190162483A1 (en) * 2017-11-29 2019-05-30 Honda Motor Co., Ltd. Cooling apparatus
JP2019102506A (ja) * 2017-11-29 2019-06-24 本田技研工業株式会社 ヒートシンクおよびその製造方法
CN111916410A (zh) * 2019-05-10 2020-11-10 株洲中车时代电气股份有限公司 一种散热器
WO2023030790A1 (de) * 2021-08-30 2023-03-09 Robert Bosch Gmbh Kühlrippenanordnung eines fluiddurchströmbaren kühlers zum kühlen einer leistungselektronik

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4992808B2 (ja) 2008-04-16 2012-08-08 トヨタ自動車株式会社 熱交換器の製造方法
JP2011171686A (ja) * 2010-02-22 2011-09-01 Nakamura Mfg Co Ltd 放熱部付き金属ベースプリント基板
CN103503131B (zh) * 2011-04-26 2016-07-06 富士电机株式会社 半导体模块用冷却器以及半导体模块
KR101106614B1 (ko) 2011-08-12 2012-01-20 주식회사 영동테크 발열소자용 냉각 장치 및 발열소자용 냉각 장치의 제조 방법
KR101328322B1 (ko) * 2011-12-08 2013-11-11 재단법인 포항산업과학연구원 발열부품 냉각장치 및 이를 포함하는 파워 반도체 모듈
JP2013131666A (ja) * 2011-12-22 2013-07-04 Ntn Corp パワー半導体の冷却構造
ITTO20130055A1 (it) 2013-01-23 2014-07-24 Denso Thermal Systems Spa Struttura di aletta per scambiatore di calore per applicazioni automotive, in particolare per macchine agricole e da cantiere.
CN104006696A (zh) * 2014-05-06 2014-08-27 北京理工大学 矩形与圆形通道混合式无接触热阻传热元件
CN104006694A (zh) * 2014-05-06 2014-08-27 北京理工大学 六边形与双三角形混合通道无接触热阻传热元件
JP6340610B2 (ja) * 2014-05-29 2018-06-13 株式会社高砂製作所 ヒートシンクの製造方法
JP2016004805A (ja) * 2014-06-13 2016-01-12 昭和電工株式会社 液冷式冷却装置
JP6254051B2 (ja) * 2014-08-04 2017-12-27 日本軽金属株式会社 ヒートシンク
JP6632879B2 (ja) * 2015-12-11 2020-01-22 昭和電工株式会社 液冷式冷却装置
CN105806136B (zh) * 2016-05-10 2019-05-07 广东工业大学 一种翅片及一种板翅式换热器
JP2018059678A (ja) * 2016-10-06 2018-04-12 株式会社デンソー 熱交換器
KR102013702B1 (ko) * 2017-10-11 2019-08-23 에디슨모터스 주식회사 능동형 실내외 냉각공기 복합 유동제어 방식의 배터리공조장치
JP6698111B2 (ja) * 2018-01-09 2020-05-27 日本軽金属株式会社 液冷ジャケット
JP7016054B2 (ja) * 2018-01-12 2022-02-04 パナソニックＩｐマネジメント株式会社 電源装置、前照灯、及び移動体
EP3819933A4 (en) * 2018-07-03 2022-03-30 Nippon Light Metal Company, Ltd. HEATSINK
CN109855067A (zh) * 2019-04-12 2019-06-07 刘松铭 一种新型灯具的涡轮散热体及其制作方法
CN110600444A (zh) * 2019-09-02 2019-12-20 奇鋐科技股份有限公司 液冷式散热头结构
US11039550B1 (en) * 2020-04-08 2021-06-15 Google Llc Heat sink with turbulent structures
JP7340567B2 (ja) * 2021-06-25 2023-09-07 古河電気工業株式会社 ヒートシンク
DE102021128634A1 (de) 2021-11-03 2023-05-04 BAB-Bildungsgesellschaft für angewandte Betriebswirtschaft mbH Wärmeübertragungsvorrichtung

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04269855A (ja) * 1991-02-26 1992-09-25 Nec Corp ヒートシンク付半導体パッケージ
JPH06252300A (ja) * 1992-12-28 1994-09-09 Hitachi Ltd 冷却装置を備えた集積回路チップ及びその製造方法
JPH07235623A (ja) * 1994-02-24 1995-09-05 Mitsubishi Materials Corp 電子部品用冷却装置
JPH07297583A (ja) * 1994-04-25 1995-11-10 Pfu Ltd ファン付きヒートシンク
JP3158983B2 (ja) * 1994-10-03 2001-04-23 住友精密工業株式会社 Ｌｓｉパッケージ冷却用コルゲート型放熱フィン
JPH0942883A (ja) * 1995-07-26 1997-02-14 Mitsubishi Alum Co Ltd 放熱フィンおよびその製造方法
JPH10200278A (ja) * 1997-01-13 1998-07-31 Yaskawa Electric Corp 冷却装置
JPH10263779A (ja) * 1997-03-24 1998-10-06 Fujikura Ltd ヒートシンクの製造方法
JP3577192B2 (ja) * 1997-03-27 2004-10-13 三菱電機株式会社 半導体素子用冷却装置
GB2347206A (en) 1998-12-18 2000-08-30 Alstom Uk Ltd Heatsink assembly
JP4472833B2 (ja) * 2000-04-24 2010-06-02 昭和電工株式会社 ヒートシンクおよびその製造方法
AU2002353538A1 (en) * 2001-12-19 2003-06-30 Showa Denko K.K. Extrusion tool, method for manufacturing shaped article with fins, and heat sink
TWI267337B (en) * 2003-05-14 2006-11-21 Inventor Prec Co Ltd Heat sink
GB2406442A (en) * 2003-09-24 2005-03-30 Giga Byte Tech Co Ltd Heat sink
TWM263734U (en) 2004-05-14 2005-05-01 Hung-Yi Lin Cooling fin with wind deflecting leading edge
TWI276389B (en) * 2004-11-03 2007-03-11 Quanta Comp Inc Stagger fin array
DE202005009948U1 (de) * 2005-06-23 2006-11-16 Autokühler GmbH & Co. KG Wärmeaustauschelement und damit hergestellter Wärmeaustauscher
DE102005043055B3 (de) * 2005-09-09 2006-12-21 Siemens Ag Verfahren zur Herstellung eines Kühlkörpers mit Kühlrippen für ein Elektronikgehäuse
JP4861840B2 (ja) * 2007-01-26 2012-01-25 アイシン・エィ・ダブリュ株式会社 発熱体冷却構造及び駆動装置

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110240267A1 (en) * 2008-11-18 2011-10-06 Compagnie Mediterraneenne Des Cafes Fluid circulation conduit
US10088248B2 (en) * 2008-11-18 2018-10-02 Compagnie Mediterraneenne Des Cafes Fluid circulation conduit
DE112009004795B4 (de) * 2009-05-22 2013-12-24 Toyota Jidosha Kabushiki Kaisha Verwirbelungselement und Verfahren zu dessen Herstellung
US8365409B2 (en) 2009-05-22 2013-02-05 Toyota Jidosha Kabushiki Kaisha Heat exchanger and method of manufacturing the same
US20110094722A1 (en) * 2009-10-26 2011-04-28 Kabushiki Kaisha Toyota Jidoshokki Liquid-cooled-type cooling device
US20110284197A1 (en) * 2010-05-21 2011-11-24 Denso Corporation Heat Exchanger
US9816762B2 (en) * 2010-05-21 2017-11-14 Denso Corporation Heat exchanger having a passage pipe
US20130068434A1 (en) * 2010-05-28 2013-03-21 Yuya Takano Heat exchanger and method for manufacturing same
US8944147B2 (en) * 2010-05-28 2015-02-03 Toyota Jidosha Kabushiki Kaisha Heat exchanger and method for manufacturing same
US20130025837A1 (en) * 2011-06-07 2013-01-31 Toyota Jidosha Kabushiki Kaisha Cooler
US20130327508A1 (en) * 2012-06-07 2013-12-12 Mark A. Zaffetti Cold plate assembly incorporating thermal heat spreader
US20160109190A1 (en) * 2012-10-09 2016-04-21 Danfoss Silicon Power Gmbh A flow distribution module with a patterned cover plate
US9960100B2 (en) * 2014-03-20 2018-05-01 Fuji Electric Co., Ltd Cooler and semiconductor module using same
US20160379914A1 (en) * 2014-03-20 2016-12-29 Fuji Electric Co., Ltd. Cooler and semiconductor module using same
US20170311480A1 (en) * 2014-10-28 2017-10-26 Denso Corporation Heat exchanger
US10462931B2 (en) * 2014-10-28 2019-10-29 Denso Corporation Heat exchanger
US20180024599A1 (en) * 2015-06-03 2018-01-25 Mitsubishi Electric Corporation Liquid-type cooling apparatus and manufacturing method for heat radiation fin in liquid-type cooling apparatus
US11003227B2 (en) * 2015-06-03 2021-05-11 Mitsubishi Electric Corporation Liquid-type cooling apparatus and manufacturing method for heat radiation fin in liquid-type cooling apparatus
US20190162483A1 (en) * 2017-11-29 2019-05-30 Honda Motor Co., Ltd. Cooling apparatus
JP2019102506A (ja) * 2017-11-29 2019-06-24 本田技研工業株式会社 ヒートシンクおよびその製造方法
CN111916410A (zh) * 2019-05-10 2020-11-10 株洲中车时代电气股份有限公司 一种散热器
WO2023030790A1 (de) * 2021-08-30 2023-03-09 Robert Bosch Gmbh Kühlrippenanordnung eines fluiddurchströmbaren kühlers zum kühlen einer leistungselektronik

Also Published As

Publication number Publication date
WO2009078289A2 (en) 2009-06-25
WO2009078289A3 (en) 2009-09-17
CN101897011A (zh) 2010-11-24
JP2009147107A (ja) 2009-07-02
KR20100087377A (ko) 2010-08-04
EP2220674A2 (en) 2010-08-25

Similar Documents

Publication Publication Date Title
US20100276135A1 (en) Cooling fin and manufacturing method of the cooling fin
KR100294873B1 (ko) 엘에스아이패케이지냉각용파형히트싱크휜어셈블리
US8958208B2 (en) Semiconductor device
US8593812B2 (en) Heat exchanger, semiconductor device, method for manufacturing the heat exchanger, and method for manufacturing the semiconductor device
US8365409B2 (en) Heat exchanger and method of manufacturing the same
JP5080805B2 (ja) 熱交換器および熱交換器を形成する方法
US7909087B2 (en) Heat exchanger
EP2333476A1 (en) Heat exchanger and method of manufacturing same
US20140043765A1 (en) Semiconductor module cooler and semiconductor module
JP6735664B2 (ja) 液冷式冷却装置用放熱器およびその製造方法
US20050039882A1 (en) Cooling device for a chip and method for its production
JP5498135B2 (ja) ヒートシンク
CN218959370U (zh) 一种钎焊翅片型散热器
JP5589647B2 (ja) 冷却装置
WO2023188501A1 (ja) 冷却装置
JP2014063887A (ja) ヒートシンク
JPH08241943A (ja) パワー半導体素子用の液冷式冷却体
JPH0629148U (ja) 半導体パッケージ用のヒートシンク
US20110024091A1 (en) Cooling apparatus for semiconductor component
CN215500288U (zh) 车辆的控制器和车辆
JP2013219125A (ja) 熱交換器
JP4747220B1 (ja) 複層型放熱ユニットを用いたヒートシンク
CN110461130B (zh) 一种镶嵌式散热结构及其制作方法
TWI812374B (zh) 具有不等間距鰭片組的車用水冷散熱板、以及具有其的封閉式車用水冷散熱器
JPH0942883A (ja) 放熱フィンおよびその製造方法

Legal Events

Date Code Title Description
AS Assignment

Owner name: TOYOTA JIDOSHA KABUSHIKI KAISHA, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MORINO, MASAHIRO;TAKETSUNA, YASUJI;TAKANO, YUYA;AND OTHERS;REEL/FRAME:024525/0112

Effective date: 20100330

AS Assignment

Owner name: TOYOTA JIDOSHA KABUSHIKI KAISHA, JAPAN

Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR INFORMATION PREVIOUSLY RECORDED ON REEL 024525 FRAME 0112. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNOR'S FIRST NAME TO BE "HIROFUMI";ASSIGNORS:MORINO, MASAHIRO;TAKETSUNA, YASUJI;TAKANO, YUYA;AND OTHERS;REEL/FRAME:024806/0153

Effective date: 20100330

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION