US20130025837A1 - Cooler - Google Patents
Cooler Download PDFInfo
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- US20130025837A1 US20130025837A1 US13/581,718 US201113581718A US2013025837A1 US 20130025837 A1 US20130025837 A1 US 20130025837A1 US 201113581718 A US201113581718 A US 201113581718A US 2013025837 A1 US2013025837 A1 US 2013025837A1
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- Prior art keywords
- coolant
- curved portion
- cooler
- lowered
- raised
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a cooler in which a coolant flows along wavy fins arranged between a plate and a cooling case, and more particularly to a cooler with improved cooling performance.
- an inverter device performs power conversion.
- the inverter device having a semiconductor device mounted therein is equipped with a cooler for cooling the heat generated by switching the semiconductor device.
- the amount of heat the semiconductor device generates has been increasing since such an inverter device is required to be small and lightweight and yet to provide high power output. Accordingly, a cooler with improved cooling performance (heat transfer coefficient) to keep stable operation of the inverter device is being sought after.
- Patent Literature 1 specified below describes a cooler with improved cooling performance.
- the cooler described in Patent Literature 1 specified below includes a plate connected to a semiconductor device and a cooling case covered with the plate and containing a coolant flowing therein.
- To the plate are connected, as shown in FIG. 19 , a plurality of wavy fins 130 extending in a flow direction (direction indicated by an arrow in FIG. 19 ) in which coolant 140 flows, the wavy fins 130 each having raised curved portions 131 and lowered curved portions 132 formed alternately in the flow direction on both sides thereof.
- the coolant 140 thus flows through between the raised curved portions 131 and lowered curved portions 132 opposite to each other in a meandering manner. This helps to create turbulence more easily and results in improved cooling performance.
- the cooler described above had the following problem. Namely, the coolant 140 generally tends to flow straight, because of which the coolant 140 does not flow smoothly near the lowered curved portions 132 (parts Q indicated by imaginary lines in FIG. 19 ) when the coolant 140 passes through between the raised curved portions 131 and the lowered curved portions 132 opposite to each other as shown in FIG. 19 . In other words, the flow of coolant 140 can hardly bend along the lowered curved portion 132 . This led to stagnation (stagnation points) of the coolant 140 near the lowered curved portions 132 , resulting in the cooling function of the coolant 140 not being fully exploited.
- the present invention has been devised to solve the above-described problem and it is an object of the invention to provide a cooler that prevents stagnation of coolant near lowered curved portions to improve the cooling performance.
- a cooler includes a plate connected to a semiconductor device, a cooling case covered with the plate and having a coolant flowing therein, and wavy fins connected to the plate, each wavy fin having a raised curved portion and a lowered curved portion formed alternately on a side face of the wavy fin in a flow direction of the coolant, the coolant flowing through between the raised curved portion and lowered curved portion opposite to each other in a meandering manner, wherein the raised curved portion is provided with a stagnation preventing member for creating a flow of coolant from the raised curved portion toward an opposite lowered curved portion.
- the stagnation preventing member is provided preferably at a base portion of the raised curved portion on a semiconductor device side in a thickness direction of the wavy fins.
- the stagnation preventing member is preferably a tapered bank tapering toward a bottom wall of the cooling case.
- the stagnation preventing member may be a protrusion protruding from the raised curved portion toward the opposite lowered curved portion.
- a second stagnation preventing member for creating a flow of coolant from the raised curved portion toward the opposite lowered curved portion may be provided, the second stagnation preventing member being positioned at a distal portion of the raised curved portion on a side of the bottom wall of the cooling case in a thickness direction of the wavy fins.
- the stagnation preventing member creates a flow of coolant from the raised curved portion toward an opposite lowered curved portion.
- the main stream of the coolant that tends to flow straight can be mixed with the coolant stagnating near the lowered curved portion, whereby the heat transfer coefficient of the wavy fins can be improved.
- stagnation of the coolant near the lowered curved portion can be prevented, so that the cooler can have enhanced cooling performance.
- the tapered bank creates a flow of the coolant from the bank toward the bottom wall of the cooling case in addition to the flow of coolant from the bank toward the lowered curved portion. Therefore, the coolant can be disturbed largely near the bank, so that the heat exchange rate of the wavy fins can be effectively improved.
- the stagnation preventing member is a protrusion, i.e., the stagnation preventing member can be provided with a very simple configuration.
- the protrusion can be configured small, so that pressure fluctuations of the coolant caused by the protrusion are reduced, and there will be almost no increase in the pressure loss in the cooler.
- the stagnation preventing member and the second stagnation preventing member create flow of the coolant from the raised curved portion toward the opposite lowered curved portion.
- the main stream of the coolant that tends to flow straight can be mixed substantially with the coolant stagnating near the lowered curved portion, whereby the heat transfer coefficient of the wavy fins can be largely improved.
- FIG. 1 shows an overall configuration diagram of an inverter device
- FIG. 2 shows a longitudinal end view of a cooler in FIG. 1 ;
- FIG. 3 shows a perspective view of wavy fins in FIG. 2 ;
- FIG. 4 shows a plan view of the wavy fins in FIG. 3 ;
- FIG. 5 shows an end view of the cooler taken along a line V-V in FIG. 4 ;
- FIG. 6 shows an end view of the cooler taken along a line W-W in FIG. 4 ;
- FIG. 7 shows an enlarged view of a part X in FIG. 5 ;
- FIG. 8 shows a schematic view illustrating flow of coolant when there are no banks provided on a raised curved portion
- FIG. 9 shows a schematic view illustrating the flow of the coolant when there are banks provided on the raised curved portion
- FIG. 10 is a schematic graph showing a relationship between a distance from a base portion and a temperature of the wavy fins and the coolant when there are no banks provided on a base portion;
- FIG. 11 is a schematic graph showing a relationship between the distance from the base portion and the temperature of the wavy fins and the coolant when there are banks provided on the base portion;
- FIG. 12 is a diagram indicating measured values of the heat transfer coefficient of the wavy fins and the pressure loss of the cooler when the coolant flows in the cooler;
- FIG. 13 is an end view of the cooler corresponding to FIG. 2 in a case where a sheet member is interposed between an end portion of the wavy fins and a bottom wall of the cooling case;
- FIG. 14 is a schematic view illustrating the flow of the coolant when there are protrusions provided on the raised curved portion in a second embodiment
- FIG. 15 is an enlarged view of a part Yin FIG. 14 ;
- FIG. 16 is an end view corresponding to FIG. 5 , illustrating a second bank is provided on a bottom wall of a cooling case in a third embodiment
- FIG. 17 is an enlarged view of a part Z in FIG. 16 ;
- FIG. 18 is an end view corresponding to FIG. 5 , illustrating a second bank is provided on a sheet member in a forth embodiment
- FIG. 19 is an explanatory view explaining how stagnation of coolant is created near a lowered curved portion of a wavy fin in a prior art.
- FIG. 1 is an overall configuration diagram schematically illustrating an inverter device 1 to which a cooler 4 is applied.
- This inverter device 1 is mounted in hybrid electric vehicles or electric vehicles, for example, and includes a semiconductor device 2 , an insulating substrate 3 , and the cooler 4 , as shown in FIG. 1 .
- the semiconductor device 2 is an electronic component that forms an inverter circuit.
- This semiconductor device 2 is, for example, an IGBT or a diode and it is a heat generating element that generates heat by its switching operation.
- the semiconductor device 2 is joined onto the insulating substrate 3 by soldering.
- the insulating substrate 3 provides electrical insulation between the semiconductor device 2 and the cooler 4 .
- This insulating substrate 3 is, for example, a DBA substrate.
- the insulating substrate 3 is joined onto the cooler 4 by brazing.
- the cooler 4 includes one each semiconductor device 2 and insulating substrate 3 mounted thereon, there may be provided a plurality of them.
- FIG. 2 is a longitudinal end view of the cooler 4 shown in FIG. 1 ; it is viewed in a direction in which the coolant flows.
- the cooler 4 includes a plate 10 , a cooling case 20 , and a plurality of wavy fins 30 as shown in FIG. 2 .
- the plate 10 functions as a lid member to the cooling case 20 .
- the plate 10 is formed of aluminum, for example, which has good thermal conductivity.
- This plate 10 is planar, and the wavy fins 30 are each integrally connected to the plate 10 at one side facing the cooling case 20 .
- the plate 10 is connected to the semiconductor device 2 via the insulating substrate 3 .
- the cooling case 20 is a case for the coolant 40 to flow inside.
- the cooling case 20 is formed of aluminum, for example, which has good thermal conductivity.
- This cooling case 20 is an open-end box as shown in FIG. 2 and includes a rectangular bottom wall 21 and side walls 22 extending vertically upwards in FIG. 2 from peripheral edges of this bottom wall 21 .
- the side walls 22 are formed with a recess 22 a for an O-ring 50 to be fitted in, and insertion holes 22 b for bolts 51 to be threaded in as shown in FIG. 2 .
- the plate 10 is assembled to the side walls 22 of the cooling case 20 by the bolts 51 .
- the plate 10 and the cooling case 20 may be assembled together by welding instead.
- An inlet pipe 61 is connected to the side wall 22 on the front side in FIG. 1 , while an outlet pipe 62 is connected to the side wall 22 on the back side in FIG. 1 .
- the inlet pipe 61 is connected to a discharge pump 63 via a discharge flow path 71 .
- the outlet pipe 62 is connected to a heat exchanger 64 via a return flow path 72 .
- the discharge pump 63 and the heat exchanger 64 are connected to each other via an intake flow path 73 .
- the coolant 40 flows into the cooler 4 through the inlet pipe 61 after being discharged from the discharge pump 63 .
- the coolant 40 then flows inside the cooling case 20 as being in contact with respective wavy fins 30 .
- the heat from the respective wavy fins 30 is absorbed by the coolant 40 and warms up the coolant 40 .
- the coolant 40 is sent out through the outlet pipe 62 to the heat exchanger 64 .
- the coolant 40 is cooled down by heat dissipation to the air in the heat exchanger 64 , and the cooled coolant 40 is returned to the discharge pump 63 .
- the coolant 40 circulates through the cooler 4 in this way to cool down the heat conducted from the semiconductor device 2 to the wavy fins 30 .
- the coolant 40 may be, as in this embodiment, a liquid such as LLC, but not limited to liquids and may be gas such as air.
- FIG. 3 is a perspective view of the wavy fins 30 shown in FIG. 2 .
- FIG. 4 is a plan view of the wavy fins 30 shown in FIG. 3 .
- the wavy fins 30 extend in a flow direction in which the coolant 40 flows (direction indicated by an arrow in FIGS. 3 and 4 ), and there are five such fins formed on the underside of the plate 10 .
- the number of the wavy fins 30 is not limited to five and may be changed as required.
- These wavy fins 30 are integrally molded on the plate 10 by casting.
- Each wavy fin 30 winds in a meandering shape so as to increase the contact area with the coolant 40 and is spaced apart by about 1 mm from an adjacent wavy fin 30 in a direction orthogonal to the flow direction. Dimension h in the thickness direction (see FIG.
- each wavy fin 30 is about 3 mm which is slightly smaller than the dimension in the height direction of the side walls 22 .
- Flow paths for the coolant 40 are thus formed inside the cooling case 20 , so that the coolant 40 flows along the flow direction, meandering through between the adjacent wavy fins 30 .
- the distance (flow path width) d between adjacent wavy fins 30 is constant (about 1 mm) at any point in the flow direction as shown in FIG. 4 .
- This is for reducing a difference in pressure of the coolant 40 at an inlet side (left side in FIG. 4 ) of the wavy fins 30 and an outlet side (right side in FIG. 4 ) of the wavy fins 30 so as to reduce pressure loss of the cooler 4 .
- the distance d between adjacent wavy fins 30 varied in the flow direction, there would be large fluctuations in the coolant 40 pressure at the inlet and outlet sides of the wavy fins 30 , which would increase pressure loss of the cooler 4 .
- a large pressure loss in the cooler 4 would necessitate large driving force to drive the discharge pump 63 , and such driving energy would be wasted.
- the five wavy fins 30 in FIGS. 3 and 4 will be denoted by 30 A, 30 B, 30 C, 30 D, and 30 E in order in the direction orthogonal to the flow direction.
- the wavy fins 30 A and 30 E at both ends have a flat surface formed on one side. This is because one side of the wavy fins 30 A and 30 E faces the side wall 22 of the cooling case 20 .
- the other side of the wavy fins 30 A and 30 E is formed with raised curved portions 31 and lowered curved portions 32 alternately in the flow direction.
- the wavy fins 30 B, 30 C, and 30 E are also formed on both sides with the raised curved portions 31 and lowered curved portions 32 alternately in the flow direction.
- the raised curved portions 31 and lowered curved portions 32 of the adjacent wavy fins 30 face each other with spaced apart by about 1 mm.
- each wavy fin 30 are each formed with a bank 31 x .
- Each bank 31 x prevents creation of stagnation (stagnation points) of the coolant 40 in vicinity of each lowered curved portion 32 .
- These banks 31 x are integrally formed with the respective raised curved portions 31 by casting.
- This bank 31 x is the stagnation preventing member of the present invention.
- FIG. 5 is an end view of the cooler 4 taken along a line V-V shown in FIG. 4 .
- FIG. 6 is an end view of the cooler 4 taken along a line W-W shown in FIG. 4 .
- the bank 31 x has a shape like a generally vertical half of a taper as shown in FIGS. 5 and 6 , tapering toward the bottom wall 21 of the cooling case 20 .
- the tip portion of this bank 31 is not pointed but has a flat surface parallel to the bottom wall 21 .
- the tip shape of the bank 31 is not limited to the flat shape and may be changed as required, and it may be pointed.
- FIG. 7 is an enlarged view of a part X shown in FIG. 5 .
- the dimension s in the width direction (vertical direction in FIG. 7 ) of the bank 31 x is about 0.7 mm
- the dimension t in the height direction (lateral direction in FIG. 7 ) of the bank 31 x is about 0.5 mm.
- This bank 31 x thus generates flows of the coolant 40 as indicated by arrows in FIG. 7 . Namely, there are created flows of the coolant 40 from the raised curved portion 31 toward the opposite lowered curved portion 32 .
- FIG. 8 is a schematic diagram illustrating flow of the coolant 40 when there are no banks 31 x provided on the raised curved portions 31 .
- FIG. 9 is a schematic diagram illustrating the flow of the coolant 40 when there are banks 31 x provided on the raised curved portions 31 .
- FIG. 9 is an enlarged view of a part R shown in FIG. 4 .
- the coolant 40 does not flow smoothly near the lowered curved portions 32 (parts Q indicated by imaginary lines in FIG. 8 ) when the coolant 40 passes through between the raised curved portions 31 and the lowered curved portions 32 opposite to each other.
- the coolant 40 generally flows straight, the main stream MS that tends to flow straight does not easily bend along the lowered curved portions 32 . For this reason, there are created some stagnation (stagnation points) of the coolant 40 near the lowered curved portions 32 , and the cooling function of the coolant 40 cannot be fully exploited.
- part MS 1 of the main stream MS flows toward the lowered curved portions 32 when the coolant 40 passes through between the raised curved portions 31 and the lowered curved portions 32 opposite to each other. Therefore, the part MS 1 of the main stream MS mixes with the coolant 40 located near the lowered curved portions 32 . As a result, no stagnation of the coolant 40 occurs near the lowered curved portions 32 , so that the cooling function of the coolant 40 is fully exploited.
- the bank 31 x of this embodiment is provided at a base portion 31 a on the semiconductor device 2 side (left side in FIG. 5 to FIG. 7 ) of the raised curved portion 31 in the thickness direction (lateral direction in FIGS. 5 to 7 ) of the wavy fin 30 , as shown in FIGS. 5 to 7 .
- the reason why the bank 31 x is provided at the base portion 31 a will be explained using FIGS. 10 and 11 .
- FIG. 10 is a schematic graph showing the relationship between the distance from the base portion 31 a and the temperature of the wavy fins 30 and the coolant 40 when there are no banks 31 x provided on the base portions 31 a .
- FIG. 11 is a schematic graph showing the relationship between the distance from the base portion 31 a and the temperature of the wavy fins 30 and the coolant 40 when there are banks 31 x provided on the base portions 31 a .
- the solid line represents the temperature of the wavy fins 30
- the broken line represents the temperature of the coolant 40 .
- a portion of the raised curved portion 31 located on the side of the bottom wall 21 (right side in FIGS. 10 and 11 ) of the cooling case 20 in the thickness direction of the wavy fin 30 will be referred to as a distal portion 31 b.
- the temperature difference ⁇ T1 between the base portions 31 a and the coolant 40 is large, while the temperature difference ⁇ T2 between the distal portions 31 b and the coolant 40 is small.
- the base portions 31 a are formed closer to the semiconductor device 2 as a heat generating element than the distal portions 31 b and tend to be hot, because of which the coolant 40 located near the base portions 31 a cannot sufficiently absorb the heat of the hot base portions 31 a .
- the temperature difference ⁇ T1 is large, resulting in a low heat transfer coefficient of the wavy fins 30 .
- the temperature difference ⁇ T1 is small. This is because the coolant 40 located near the base portions 31 a is disturbed because of the banks 31 x and absorbs the heat of the hot base portions 31 a sufficiently.
- the temperature difference ⁇ T1 is made small, leading to a high heat transfer coefficient of the wavy fins 30 .
- the temperature difference between the wavy fins 30 and the coolant 40 is made smaller than when the banks 31 x are provided on other portions than the base portions 31 a , whereby the heat transfer coefficient of the wavy fins 30 can be effectively improved.
- the banks 31 x are provided only on the base portions 31 a as shown in FIGS. 5 to 7 , and not on other portions than the base portions 31 a . This is based on the following reason. If the banks 31 x are also provided on portions than the base portions 31 a , the main stream MS (see FIG. 9 ) of the coolant 40 would be largely obstructed. This would result in large fluctuations in the coolant 40 pressure at the inlet and outlet sides of the wavy fins 30 , which would increase pressure loss of the cooler 4 . Thus, providing the banks 31 x only on the base portions 31 a will improve the heat transfer coefficient of the wavy fins 30 as well as reduce an increase in pressure loss of the cooler 4 .
- FIG. 12 is a diagram showing actual measurements (measured values) of the heat transfer coefficient of the wavy fins and the pressure loss of the cooler when the coolant is flowing inside the cooler. The measurements were obtained in this test under conditions that the coolant 40 is discharged from the discharge pump 63 at a predetermined constant rate (L/min) and there is a small gap SM formed between end portions 30 a (see FIG. 2 ) of the wavy fins 30 and the bottom wall 21 of the cooling case 20 .
- L/min constant rate
- the circle indicates the measurement when there are banks 31 x provided as in this embodiment (see FIG. 9 ) while the square indicates the measurement when there are no banks 31 x (see FIG. 8 ).
- the heat transfer coefficient is U1 and the pressure loss is ⁇ P1.
- the heat transfer coefficient is U2 and the pressure loss is ⁇ P2.
- U1 is higher than U2 by about 9%, indicating that the heat transfer coefficient is increased by providing the banks 31 x .
- ⁇ P1 is larger than ⁇ P2, indicating that the pressure loss is increased by providing the banks 31 x.
- the heat transfer coefficient and the pressure loss are proportional to the flow rate and speed of the coolant 40 .
- the flow rate and speed of the coolant 40 have a relationship to the heat transfer coefficient and the pressure loss such that the larger the former, the larger the latter. Therefore, a comparison of the level of the heat transfer coefficient between a case where there are banks 31 x provided and another case where there are no banks 31 x needs to be made under a condition that the pressure loss is the same.
- the double square in FIG. 12 indicates the measurement when the pressure loss is made to ⁇ P1 by increasing the flow rate and speed of the coolant 40 when there are no banks 31 x based on the assumption above.
- the solid line shown in FIG. 12 indicates changes in the heat transfer coefficient and the pressure loss with the change in the flow rate and speed of the coolant 40 when there are no banks 31 x provided.
- the heat transfer coefficient when there are banks 31 x provided is higher than the heat transfer coefficient when there are no banks 31 x provided. Accordingly, it can be considered that while providing the banks 31 x increases the pressure loss, it can also largely improve the heat transfer coefficient. More specifically, it was confirmed that the temperature at the base portions 31 a of the wavy fins 30 was reduced by about 5° C. by providing the banks 31 x.
- this gap SM is about 0.3 mm, for example, which is shown exaggerated in FIG. 2 . If the coolant 40 flows into this gap SM, the flow speed of the main stream MS of the coolant 40 reduces, which in turn reduces the heat transfer coefficient of the wavy fins 30 .
- One possibility here would be to interpose a sheet member 80 made of an elastic material (such as rubber or resin) between the end portions 30 a of the wavy fins 30 and the bottom wall 21 of the cooling case 20 as shown in FIG. 13 in order to prevent the coolant 40 from flowing into the gap SM.
- the cost would be higher with the cooler 4 A shown in FIG. 13 because of the sheet member 80 being added as another component, as compared to the cooler 4 of this embodiment.
- the heat transfer coefficient of the wavy fins 30 can be effectively improved by providing the banks 31 x at the base portions 31 a according to the cooler 4 of the present embodiment.
- the cooler 4 can be configured less expensively, and pressure loss increase in the cooler 4 is reduced.
- the banks 31 x create flows of the coolant 40 from the raised curved portions 31 toward the opposite lowered curved portions 32 .
- the part MS 1 of the main stream MS of the coolant 40 can be mixed with the coolant 40 stagnating near the lowered curved portions 32 , whereby the heat transfer coefficient of the wavy fins 30 can be improved.
- stagnation of the coolant 40 near the lowered curved portions 32 can be prevented, so that the cooler 4 can have enhanced cooling performance.
- the banks 31 x provided at the base portions 31 a create flows of coolant from the base portions 31 a of the raised curved portions 31 toward the opposite lowered curved portions 32 .
- the coolant 40 is disturbed near the base portions 31 a of the wavy fins 30 where the temperature is relatively high. Therefore the heat transfer coefficient of the wavy fins 30 can be effectively improved.
- the banks 31 x are provided only at the base portions 31 a , pressure fluctuations of the coolant 40 caused by the banks 31 x can be reduced and pressure loss increase in the cooler 4 can be kept small.
- the tapered banks 31 x also create flows of the coolant 40 from the banks 31 x toward the bottom wall 21 of the cooling case 20 , in addition to the flows of the coolant 40 from the banks 31 x toward the lowered curved portions 32 . Therefore, the coolant 40 is disturbed largely near the banks 31 x , so that the heat exchange rate of the wavy fins 30 can be effectively improved.
- FIG. 14 is a schematic view illustrating the flow of the coolant 40 when there are protrusions 31 y provided on the raised curved portions 31 .
- the protrusions 31 y prevent creation of stagnation (stagnation point) of the coolant 40 near the lowered curved portions 32 .
- This protrusion 31 y is in a triangular column shape as shown in FIG. 14 and protrudes from the raised curved portion 31 toward the opposite lowered curved portion 32 .
- This protrusion 31 y is provided at the base portion 31 a of the raised curved portion 31 and integrally formed with the raised curved portion 31 by casting.
- the protrusions 31 y may be separate members from the wavy fins 30 and may be joined to the raised curved portions 31 by welding or bonding.
- the protrusion 31 y changes the direction of the part MS 1 of the main stream MS, and thereby the part MS 1 of the main stream MS flows toward the lowered curved portion 32 .
- the part MS 1 of the main stream MS is mixed with the coolant 40 located near the lowered curved portion 32 (part Q). As a result, no stagnation of the coolant 40 occurs near the lowered curved portions 32 , so that the cooling function of the coolant 40 is fully exploited.
- FIG. 15 is an enlarged view of a part Y shown in FIG. 14 .
- the dimension e in the width direction (lateral direction in FIG. 15 ) of the protrusion 31 y is about 0.1 mm
- the dimension f of the protruding distance of the protrusion 31 y from the surface of the raised curved portion 31 is about 0.1 mm.
- the dimension in the height direction (direction orthogonal to the paper plane of FIG. 15 ) of the protrusion 31 y is about 0.1 mm. That is, the protrusions 31 y are substantially smaller than the banks 31 x of the first embodiment. Since other configurations of the second embodiment are similar to the configurations of the first embodiment, the description will be omitted.
- the protrusions 31 y are very small as described above, the main stream MS of the coolant 40 is unlikely to be obstructed largely by the protrusions 31 y . Therefore, the pressure fluctuations of the coolant 40 are smaller than that in the first embodiment and the pressure loss of the cooler can be made small.
- the amount of the coolant 40 made to flow toward the lowered curved portions 32 by the protrusions 31 y is smaller than that of the coolant 40 made to flow toward the lowered curved portions 32 by the banks 31 x in the first embodiment. Accordingly, the amount of the coolant 40 mixed near the lowered curved portions 32 is smaller than that in the first embodiment, because of which an increase in the heat transfer coefficient of the wavy fins 30 is accordingly small.
- the triangle shown in FIG. 12 indicates the measurement in a test in which the protrusions 31 y are provided.
- the measurement indicated by the triangle was obtained in the test under the same conditions as the tests in which the measurements were made when the banks 31 x of the first embodiment are provided (circle in FIG. 12 ) and when the banks 31 x are not provided (square in FIG. 12 ).
- the heat transfer coefficient is U3, which is higher than U2 by about 5%. This indicates that providing the protrusions 31 y improves the heat transfer coefficient. However, it also indicates that, with the protrusions 31 y , the increase in the heat transfer coefficient is smaller than when the banks 31 x are provided.
- the pressure loss is ⁇ P3, which is slightly larger than ⁇ P2. This indicates that the pressure loss increase caused by the protrusions 31 y is very small. It also indicates that, with the protrusions 31 y , the pressure loss increase is sufficiently smaller than that of the case where the banks 31 x are provided.
- the stagnation preventing member is the protrusions 31 y , i.e., the stagnation preventing member can be provided with a very simple configuration. Since the protrusions 31 y are configured very small as shown in FIG. 15 , pressure fluctuations of the coolant 40 caused by the protrusions 31 y are reduced, so that there will be almost no increase in the pressure loss in the cooler. Since other advantageous effects of the second embodiment are similar to the advantageous effects of the first embodiment, the description will be omitted.
- second banks 21 x are provided on the bottom wall 21 of the cooling case 20 .
- FIG. 16 is an end view corresponding to FIG. 5 illustrating the second banks 21 x provided on the bottom wall 21 of the cooling case 20 .
- the banks 31 x are each provided at the base portions 31 a of the respective raised curved portions 31 , as with the first embodiment.
- the second banks 21 x are each located closer to distal portions 31 b of respective raised curved portions 31 on the bottom wall 21 side (right side in FIG. 16 ) of the cooling case 20 in the thickness direction of the wavy fins 30 , these second banks 21 x being integrally formed to the bottom wall 21 of the cooling case 20 .
- the second banks 21 x prevent creation of stagnation (stagnation points) of the coolant 40 near the lowered curved portions 32 , and correspond to the second stagnation preventing member of the present invention.
- FIG. 17 is an enlarged view of a part Z shown in FIG. 16 .
- the second bank 21 x has a shape like a generally vertical half of a taper as shown in FIG. 17 , tapering toward the plate 10 (left side of FIG. 17 ).
- a tip portion of this second bank 21 x is not pointed but has a flat surface parallel to the bottom wall 21 .
- the tip shape of the second bank 21 x is not limited to the flat shape and may be changed as required, and it may be pointed.
- the dimension j in the width direction (vertical direction in FIG. 17 ) of the second bank 21 x is about 0.7 mm, and the dimension g in the height direction (lateral direction in FIG. 17 ) of the bank 21 x is about 0.5 mm.
- This second bank 21 x thus generates flows of the coolant 40 as indicated by arrows in FIG. 17 . Namely, there are created flows of coolant from the distal portions 31 b of the raised curved portions 31 toward the opposite lowered curved portions 32 . Since other configurations of the third embodiment are similar to the configurations of the first embodiment, the description will be omitted.
- the banks 31 x and the second banks 21 x create flows of the coolant 40 from the raised curved portions 31 toward the opposite lowered curved portions 32 .
- the main stream MS of the coolant 40 that tends to flow straight can be mixed substantially with the coolant 40 stagnating near the lowered curved portions 32 , whereby the heat transfer coefficient of the wavy fins 30 can be largely improved.
- the heat transfer coefficient of the wavy fins 30 can be increased more than the first embodiment.
- the pressure fluctuations of the coolant 40 are large in the third embodiment since the space for the coolant 40 to flow in is reduced due to the second banks 21 x .
- the pressure loss in the cooler 4 B of the third embodiment is therefore larger than the pressure loss of the cooler 4 of the first embodiment. Since other advantageous effects of the third embodiment are similar to the advantageous effects of the first embodiment, the description will be omitted.
- FIG. 18 is an end view corresponding to FIG. 5 illustrating the second banks 90 x provided on the sheet member 90 .
- the flat plate-like sheet member 90 fills up the gap SM as shown in FIG. 18 .
- This sheet member 90 prevents the coolant 40 from flowing into the gap SM.
- the sheet member 90 is made of an elastic material (such as rubber or resin) and bonded to the bottom wall 21 of the cooling case 20 before the plate 10 and the wavy fins 30 are assembled to the cooling case 20 .
- the gap SM is about 0.3 mm, for example, and the sheet member 90 also has a thickness of about 0.3 mm, for example.
- the second banks 90 x are each located at the distal portions 31 b of the respective raised curved portions 31 , and formed integrally with the sheet member 90 .
- the second banks 90 x prevent creation of stagnation (stagnation points) of the coolant 40 near the respective lowered curved portions 32 , and correspond to the second stagnation preventing member of the present invention.
- the second bank 90 x has a shape like a generally vertical half of a taper, tapering toward the plate 10 (left side in FIG. 18 ). Since other configurations of the fourth embodiment are similar to the configurations of the first embodiment, the description will be omitted.
- the coolant 40 can be prevented from flowing into the gap SM. This prevents the main stream MS of the coolant 40 from slowing down, whereby the heat transfer coefficient of the wavy fins 30 can be improved.
- the banks 31 x and the second banks 90 x create flows of the coolant 40 from the raised curved portions 31 toward the opposite lowered curved portions 32 . Thereby, the main stream MS of the coolant 40 that tends to flow straight can be mixed substantially with the coolant 40 stagnating near the lowered curved portions 32 , whereby the heat transfer coefficient of the wavy fins 30 can be largely improved.
- the cost, however, is higher with the cooler 4 C of the fourth embodiment because of the sheet member 90 being added as another component, as compared to the cooler 4 of the first embodiment.
- the pressure fluctuations of the coolant 40 are larger since the space for the coolant 40 to flow in is reduced by the second banks 90 .
- the pressure loss of the cooler 4 C of the fourth embodiment is, therefore, larger than that of the cooler 4 of the first embodiment. Since other advantageous effects of the fourth embodiment are similar to the advantageous effects of the first embodiment, the description will be omitted.
- the banks 31 x are integrally formed to the respective raised curved portions 31 by casting.
- the banks 31 x may be separate from the plate 10 and may be joined to the raised curved portions 31 by welding or bonding.
- the banks 31 x are provided at the base portions 31 a of the raised curved portions 31 .
- the banks 31 x may be provided at other portions than the base portions 31 a of the raised curved portions 31 , for example at the distal portions 31 b of the raised curved portions 31 .
- the shape and the size of the banks 31 x may be changed as required.
- one protrusion 31 y is provided on each raised curved portion 31 .
- a plurality of protrusions 31 y may be provided on each raised curved portion 31 .
- two protrusions 31 y may be provided at the base portion 31 a of the raised curved portion 31 .
- one protrusion 31 y may be provided at the base portion 31 a of the raised curved portion 31
- another protrusion 31 y may be provided at the distal portion 31 b of the raised curved portion 31 .
- the shape and the size of the protrusions 31 y can be changed as required.
- the banks 31 x are provided at the base portions 31 a of the raised curved portions 31
- the second banks 21 x are provided at the distal portions 31 b of the raised curved portions 31
- protrusions may be provided at the base portions 31 a of the raised curved portions 31 instead of the banks 31 x
- protrusions may be provided at the distal portions 31 b of the raised curved portions 31 instead of the second banks 21 x.
- the second banks 90 x are provided on the sheet member 90 .
- protrusions may be provided on the sheet member 90 .
- the distance (flow path width) of the adjacent wavy fins 30 is made constant at any points in the flowing direction, but it may be changed at any points in the flowing direction.
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Abstract
A cooler includes a plate, a cooling case having a coolant flowing therein, and a plurality of wavy fins having a raised curved portion and a lowered curved portion formed alternately on a side face in a flow direction of the coolant. In this cooler, the coolant flows through between the raised curved portion and the lowered curved portion opposite to each other in a meandering manner. The raised curved portion is provided with a bank creating a flow of coolant from the raised curved portion toward the opposite lowered curved portion. With this bank, a part of a main stream of the coolant can be mixed with the coolant stagnating near the lowered curved portion, whereby the heat transfer coefficient of the wavy fins can be improved. Thus, stagnation of the coolant near the lowered curved portion can be prevented, so that the cooler can have enhanced cooling performance.
Description
- The present invention relates to a cooler in which a coolant flows along wavy fins arranged between a plate and a cooling case, and more particularly to a cooler with improved cooling performance.
- In hybrid electric vehicles or the like, an inverter device (power conversion device) performs power conversion. The inverter device having a semiconductor device mounted therein is equipped with a cooler for cooling the heat generated by switching the semiconductor device. The amount of heat the semiconductor device generates has been increasing since such an inverter device is required to be small and lightweight and yet to provide high power output. Accordingly, a cooler with improved cooling performance (heat transfer coefficient) to keep stable operation of the inverter device is being sought after.
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Patent Literature 1 specified below, for example, describes a cooler with improved cooling performance. The cooler described inPatent Literature 1 specified below includes a plate connected to a semiconductor device and a cooling case covered with the plate and containing a coolant flowing therein. To the plate are connected, as shown inFIG. 19 , a plurality of wavy fins 130 extending in a flow direction (direction indicated by an arrow inFIG. 19 ) in which coolant 140 flows, the wavy fins 130 each having raised curved portions 131 and lowered curved portions 132 formed alternately in the flow direction on both sides thereof. The coolant 140 thus flows through between the raised curved portions 131 and lowered curved portions 132 opposite to each other in a meandering manner. This helps to create turbulence more easily and results in improved cooling performance. -
- [Patent Literature 1] JP 2008-186820 A
- The cooler described above had the following problem. Namely, the coolant 140 generally tends to flow straight, because of which the coolant 140 does not flow smoothly near the lowered curved portions 132 (parts Q indicated by imaginary lines in
FIG. 19 ) when the coolant 140 passes through between the raised curved portions 131 and the lowered curved portions 132 opposite to each other as shown inFIG. 19 . In other words, the flow of coolant 140 can hardly bend along the lowered curved portion 132. This led to stagnation (stagnation points) of the coolant 140 near the lowered curved portions 132, resulting in the cooling function of the coolant 140 not being fully exploited. - The present invention has been devised to solve the above-described problem and it is an object of the invention to provide a cooler that prevents stagnation of coolant near lowered curved portions to improve the cooling performance.
- (1) A cooler according to an aspect of the present invention includes a plate connected to a semiconductor device, a cooling case covered with the plate and having a coolant flowing therein, and wavy fins connected to the plate, each wavy fin having a raised curved portion and a lowered curved portion formed alternately on a side face of the wavy fin in a flow direction of the coolant, the coolant flowing through between the raised curved portion and lowered curved portion opposite to each other in a meandering manner, wherein the raised curved portion is provided with a stagnation preventing member for creating a flow of coolant from the raised curved portion toward an opposite lowered curved portion.
- (2) In the cooler according to the above-described aspect of the present invention, the stagnation preventing member is provided preferably at a base portion of the raised curved portion on a semiconductor device side in a thickness direction of the wavy fins.
- (3) In the cooler according to the above-described aspect of the present invention, the stagnation preventing member is preferably a tapered bank tapering toward a bottom wall of the cooling case.
- (4) In the cooler according to the above-described aspect of the present invention, the stagnation preventing member may be a protrusion protruding from the raised curved portion toward the opposite lowered curved portion.
- (5) In the cooler according to the above-described aspect of the present invention, a second stagnation preventing member for creating a flow of coolant from the raised curved portion toward the opposite lowered curved portion may be provided, the second stagnation preventing member being positioned at a distal portion of the raised curved portion on a side of the bottom wall of the cooling case in a thickness direction of the wavy fins.
- The advantageous effects of the cooler will be described.
- With the configuration (1), the stagnation preventing member creates a flow of coolant from the raised curved portion toward an opposite lowered curved portion. Thereby, the main stream of the coolant that tends to flow straight can be mixed with the coolant stagnating near the lowered curved portion, whereby the heat transfer coefficient of the wavy fins can be improved. Thus, stagnation of the coolant near the lowered curved portion can be prevented, so that the cooler can have enhanced cooling performance.
- With the configuration (2), there is created a flow of the coolant from the base portion of the raised curved portion on the semiconductor device side toward the opposite lowered curved portion. Thereby, the coolant is disturbed near the base portions of the wavy fins where the temperature is relatively high. Therefore, the heat transfer coefficient of the wavy fins can be effectively improved. Moreover, by providing the stagnation preventing member only at the base portion, pressure fluctuations of the coolant caused by the stagnation preventing member can be reduced and pressure loss increase of the cooler can be kept small.
- With the configuration (3), the tapered bank creates a flow of the coolant from the bank toward the bottom wall of the cooling case in addition to the flow of coolant from the bank toward the lowered curved portion. Therefore, the coolant can be disturbed largely near the bank, so that the heat exchange rate of the wavy fins can be effectively improved.
- With the configuration (4), the stagnation preventing member is a protrusion, i.e., the stagnation preventing member can be provided with a very simple configuration. The protrusion can be configured small, so that pressure fluctuations of the coolant caused by the protrusion are reduced, and there will be almost no increase in the pressure loss in the cooler.
- With the configuration (5), the stagnation preventing member and the second stagnation preventing member create flow of the coolant from the raised curved portion toward the opposite lowered curved portion. Thereby, the main stream of the coolant that tends to flow straight can be mixed substantially with the coolant stagnating near the lowered curved portion, whereby the heat transfer coefficient of the wavy fins can be largely improved.
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FIG. 1 shows an overall configuration diagram of an inverter device; -
FIG. 2 shows a longitudinal end view of a cooler inFIG. 1 ; -
FIG. 3 shows a perspective view of wavy fins inFIG. 2 ; -
FIG. 4 shows a plan view of the wavy fins inFIG. 3 ; -
FIG. 5 shows an end view of the cooler taken along a line V-V inFIG. 4 ; -
FIG. 6 shows an end view of the cooler taken along a line W-W inFIG. 4 ; -
FIG. 7 shows an enlarged view of a part X inFIG. 5 ; -
FIG. 8 shows a schematic view illustrating flow of coolant when there are no banks provided on a raised curved portion; -
FIG. 9 shows a schematic view illustrating the flow of the coolant when there are banks provided on the raised curved portion; -
FIG. 10 is a schematic graph showing a relationship between a distance from a base portion and a temperature of the wavy fins and the coolant when there are no banks provided on a base portion; -
FIG. 11 is a schematic graph showing a relationship between the distance from the base portion and the temperature of the wavy fins and the coolant when there are banks provided on the base portion; -
FIG. 12 is a diagram indicating measured values of the heat transfer coefficient of the wavy fins and the pressure loss of the cooler when the coolant flows in the cooler; -
FIG. 13 is an end view of the cooler corresponding toFIG. 2 in a case where a sheet member is interposed between an end portion of the wavy fins and a bottom wall of the cooling case; -
FIG. 14 is a schematic view illustrating the flow of the coolant when there are protrusions provided on the raised curved portion in a second embodiment; -
FIG. 15 is an enlarged view of a part YinFIG. 14 ; -
FIG. 16 is an end view corresponding toFIG. 5 , illustrating a second bank is provided on a bottom wall of a cooling case in a third embodiment; -
FIG. 17 is an enlarged view of a part Z inFIG. 16 ; -
FIG. 18 is an end view corresponding toFIG. 5 , illustrating a second bank is provided on a sheet member in a forth embodiment; and -
FIG. 19 is an explanatory view explaining how stagnation of coolant is created near a lowered curved portion of a wavy fin in a prior art. - The cooler according to the present invention will be hereinafter described with reference to the drawings.
FIG. 1 is an overall configuration diagram schematically illustrating aninverter device 1 to which acooler 4 is applied. Thisinverter device 1 is mounted in hybrid electric vehicles or electric vehicles, for example, and includes asemiconductor device 2, aninsulating substrate 3, and thecooler 4, as shown inFIG. 1 . - The
semiconductor device 2 is an electronic component that forms an inverter circuit. Thissemiconductor device 2 is, for example, an IGBT or a diode and it is a heat generating element that generates heat by its switching operation. Thesemiconductor device 2 is joined onto the insulatingsubstrate 3 by soldering. - The insulating
substrate 3 provides electrical insulation between thesemiconductor device 2 and thecooler 4. This insulatingsubstrate 3 is, for example, a DBA substrate. The insulatingsubstrate 3 is joined onto thecooler 4 by brazing. Here, although thecooler 4 includes one eachsemiconductor device 2 and insulatingsubstrate 3 mounted thereon, there may be provided a plurality of them. - The
cooler 4 cools the heat generated by switching thesemiconductor device 2 with acoolant 40 flowing inside.FIG. 2 is a longitudinal end view of thecooler 4 shown inFIG. 1 ; it is viewed in a direction in which the coolant flows. Thecooler 4 includes aplate 10, a coolingcase 20, and a plurality ofwavy fins 30 as shown inFIG. 2 . - The
plate 10 functions as a lid member to thecooling case 20. Theplate 10 is formed of aluminum, for example, which has good thermal conductivity. Thisplate 10 is planar, and thewavy fins 30 are each integrally connected to theplate 10 at one side facing the coolingcase 20. Theplate 10 is connected to thesemiconductor device 2 via the insulatingsubstrate 3. - The cooling
case 20 is a case for thecoolant 40 to flow inside. The coolingcase 20 is formed of aluminum, for example, which has good thermal conductivity. This coolingcase 20 is an open-end box as shown inFIG. 2 and includes arectangular bottom wall 21 andside walls 22 extending vertically upwards inFIG. 2 from peripheral edges of thisbottom wall 21. - The
side walls 22 are formed with arecess 22 a for an O-ring 50 to be fitted in, and insertion holes 22 b forbolts 51 to be threaded in as shown inFIG. 2 . Thus, with the O-rings 50 fitted into therecesses 22 a in theside walls 22, theplate 10 is assembled to theside walls 22 of the coolingcase 20 by thebolts 51. Theplate 10 and thecooling case 20 may be assembled together by welding instead. - An
inlet pipe 61 is connected to theside wall 22 on the front side inFIG. 1 , while anoutlet pipe 62 is connected to theside wall 22 on the back side inFIG. 1 . Theinlet pipe 61 is connected to adischarge pump 63 via adischarge flow path 71. Theoutlet pipe 62 is connected to aheat exchanger 64 via areturn flow path 72. Thedischarge pump 63 and theheat exchanger 64 are connected to each other via anintake flow path 73. - Thus the
coolant 40 flows into thecooler 4 through theinlet pipe 61 after being discharged from thedischarge pump 63. Thecoolant 40 then flows inside the coolingcase 20 as being in contact with respectivewavy fins 30. At this time, the heat from the respectivewavy fins 30 is absorbed by thecoolant 40 and warms up thecoolant 40. After that, thecoolant 40 is sent out through theoutlet pipe 62 to theheat exchanger 64. Thereby, thecoolant 40 is cooled down by heat dissipation to the air in theheat exchanger 64, and the cooledcoolant 40 is returned to thedischarge pump 63. - The
coolant 40 circulates through thecooler 4 in this way to cool down the heat conducted from thesemiconductor device 2 to thewavy fins 30. Thecoolant 40 may be, as in this embodiment, a liquid such as LLC, but not limited to liquids and may be gas such as air.FIG. 3 is a perspective view of thewavy fins 30 shown inFIG. 2 .FIG. 4 is a plan view of thewavy fins 30 shown inFIG. 3 . - As shown in
FIGS. 3 and 4 , thewavy fins 30 extend in a flow direction in which thecoolant 40 flows (direction indicated by an arrow inFIGS. 3 and 4 ), and there are five such fins formed on the underside of theplate 10. The number of thewavy fins 30 is not limited to five and may be changed as required. Thesewavy fins 30 are integrally molded on theplate 10 by casting. Eachwavy fin 30 winds in a meandering shape so as to increase the contact area with thecoolant 40 and is spaced apart by about 1 mm from an adjacentwavy fin 30 in a direction orthogonal to the flow direction. Dimension h in the thickness direction (seeFIG. 7 ) of eachwavy fin 30 is about 3 mm which is slightly smaller than the dimension in the height direction of theside walls 22. Flow paths for thecoolant 40 are thus formed inside the coolingcase 20, so that thecoolant 40 flows along the flow direction, meandering through between the adjacentwavy fins 30. - In this embodiment, the distance (flow path width) d between adjacent
wavy fins 30 is constant (about 1 mm) at any point in the flow direction as shown inFIG. 4 . This is for reducing a difference in pressure of thecoolant 40 at an inlet side (left side inFIG. 4 ) of thewavy fins 30 and an outlet side (right side inFIG. 4 ) of thewavy fins 30 so as to reduce pressure loss of thecooler 4. Namely, if the distance d between adjacentwavy fins 30 varied in the flow direction, there would be large fluctuations in thecoolant 40 pressure at the inlet and outlet sides of thewavy fins 30, which would increase pressure loss of thecooler 4. A large pressure loss in thecooler 4 would necessitate large driving force to drive thedischarge pump 63, and such driving energy would be wasted. - Here, the five
wavy fins 30 inFIGS. 3 and 4 will be denoted by 30A, 30B, 30C, 30D, and 30E in order in the direction orthogonal to the flow direction. Thewavy fins wavy fins side wall 22 of the coolingcase 20. The other side of thewavy fins curved portions 31 and loweredcurved portions 32 alternately in the flow direction. Thewavy fins curved portions 31 and loweredcurved portions 32 alternately in the flow direction. Thus the raisedcurved portions 31 and loweredcurved portions 32 of the adjacentwavy fins 30 face each other with spaced apart by about 1 mm. - In this embodiment, as shown in
FIGS. 3 and 4 , the raisedcurved portions 31 of eachwavy fin 30 are each formed with abank 31 x. Eachbank 31 x prevents creation of stagnation (stagnation points) of thecoolant 40 in vicinity of each loweredcurved portion 32. Thesebanks 31 x are integrally formed with the respective raisedcurved portions 31 by casting. Thisbank 31 x is the stagnation preventing member of the present invention. Hereinafter thebank 31 x will be described in detail.FIG. 5 is an end view of thecooler 4 taken along a line V-V shown inFIG. 4 .FIG. 6 is an end view of thecooler 4 taken along a line W-W shown inFIG. 4 . - The
bank 31 x has a shape like a generally vertical half of a taper as shown inFIGS. 5 and 6 , tapering toward thebottom wall 21 of the coolingcase 20. The tip portion of thisbank 31 is not pointed but has a flat surface parallel to thebottom wall 21. The tip shape of thebank 31 is not limited to the flat shape and may be changed as required, and it may be pointed. -
FIG. 7 is an enlarged view of a part X shown inFIG. 5 . As shown inFIG. 7 , the dimension s in the width direction (vertical direction inFIG. 7 ) of thebank 31 x is about 0.7 mm, and the dimension t in the height direction (lateral direction inFIG. 7 ) of thebank 31 x is about 0.5 mm. Thisbank 31 x thus generates flows of thecoolant 40 as indicated by arrows inFIG. 7 . Namely, there are created flows of thecoolant 40 from the raisedcurved portion 31 toward the opposite loweredcurved portion 32. - Next, the advantageous effects of the
bank 31 x will be explained usingFIGS. 8 and 9 .FIG. 8 is a schematic diagram illustrating flow of thecoolant 40 when there are nobanks 31 x provided on the raisedcurved portions 31.FIG. 9 is a schematic diagram illustrating the flow of thecoolant 40 when there arebanks 31 x provided on the raisedcurved portions 31.FIG. 9 is an enlarged view of a part R shown inFIG. 4 . - When there are no
banks 31 x as shown inFIG. 8 , thecoolant 40 does not flow smoothly near the lowered curved portions 32 (parts Q indicated by imaginary lines inFIG. 8 ) when thecoolant 40 passes through between the raisedcurved portions 31 and the loweredcurved portions 32 opposite to each other. In other words, since thecoolant 40 generally flows straight, the main stream MS that tends to flow straight does not easily bend along the loweredcurved portions 32. For this reason, there are created some stagnation (stagnation points) of thecoolant 40 near the loweredcurved portions 32, and the cooling function of thecoolant 40 cannot be fully exploited. - On the other hand, when there are
banks 31 x provided as shown inFIG. 9 , part MS1 of the main stream MS flows toward the loweredcurved portions 32 when thecoolant 40 passes through between the raisedcurved portions 31 and the loweredcurved portions 32 opposite to each other. Therefore, the part MS1 of the main stream MS mixes with thecoolant 40 located near the loweredcurved portions 32. As a result, no stagnation of thecoolant 40 occurs near the loweredcurved portions 32, so that the cooling function of thecoolant 40 is fully exploited. - The
bank 31 x of this embodiment is provided at abase portion 31 a on thesemiconductor device 2 side (left side inFIG. 5 toFIG. 7 ) of the raisedcurved portion 31 in the thickness direction (lateral direction inFIGS. 5 to 7 ) of thewavy fin 30, as shown inFIGS. 5 to 7 . The reason why thebank 31 x is provided at thebase portion 31 a will be explained usingFIGS. 10 and 11 . -
FIG. 10 is a schematic graph showing the relationship between the distance from thebase portion 31 a and the temperature of thewavy fins 30 and thecoolant 40 when there are nobanks 31 x provided on thebase portions 31 a. On the other hand,FIG. 11 is a schematic graph showing the relationship between the distance from thebase portion 31 a and the temperature of thewavy fins 30 and thecoolant 40 when there arebanks 31 x provided on thebase portions 31 a. Here, inFIGS. 10 and 11 , the solid line represents the temperature of thewavy fins 30, while the broken line represents the temperature of thecoolant 40. A portion of the raisedcurved portion 31 located on the side of the bottom wall 21 (right side inFIGS. 10 and 11 ) of the coolingcase 20 in the thickness direction of thewavy fin 30 will be referred to as adistal portion 31 b. - As shown in
FIG. 10 , when there are nobanks 31 x provided on thebase portions 31 a, the temperature difference ΔT1 between thebase portions 31 a and thecoolant 40 is large, while the temperature difference ΔT2 between thedistal portions 31 b and thecoolant 40 is small. This is because thebase portions 31 a are formed closer to thesemiconductor device 2 as a heat generating element than thedistal portions 31 b and tend to be hot, because of which thecoolant 40 located near thebase portions 31 a cannot sufficiently absorb the heat of thehot base portions 31 a. Thus the temperature difference ΔT1 is large, resulting in a low heat transfer coefficient of thewavy fins 30. - In contrast, as shown in
FIG. 11 , when there arebanks 31 x provided on thebase portions 31 a, the temperature difference ΔT1 is small. This is because thecoolant 40 located near thebase portions 31 a is disturbed because of thebanks 31 x and absorbs the heat of thehot base portions 31 a sufficiently. Thus, by providingbanks 31 x on thebase portions 31 a, the temperature difference ΔT1 is made small, leading to a high heat transfer coefficient of thewavy fins 30. Namely, when thebanks 31 x are provided on thebase portions 31 a, the temperature difference between thewavy fins 30 and thecoolant 40 is made smaller than when thebanks 31 x are provided on other portions than thebase portions 31 a, whereby the heat transfer coefficient of thewavy fins 30 can be effectively improved. - In this embodiment, the
banks 31 x are provided only on thebase portions 31 a as shown inFIGS. 5 to 7 , and not on other portions than thebase portions 31 a. This is based on the following reason. If thebanks 31 x are also provided on portions than thebase portions 31 a, the main stream MS (seeFIG. 9 ) of thecoolant 40 would be largely obstructed. This would result in large fluctuations in thecoolant 40 pressure at the inlet and outlet sides of thewavy fins 30, which would increase pressure loss of thecooler 4. Thus, providing thebanks 31 x only on thebase portions 31 a will improve the heat transfer coefficient of thewavy fins 30 as well as reduce an increase in pressure loss of thecooler 4. - Next, test results of the heat transfer coefficient of the wavy fins and the pressure loss of the cooler will be described using
FIG. 12 .FIG. 12 is a diagram showing actual measurements (measured values) of the heat transfer coefficient of the wavy fins and the pressure loss of the cooler when the coolant is flowing inside the cooler. The measurements were obtained in this test under conditions that thecoolant 40 is discharged from thedischarge pump 63 at a predetermined constant rate (L/min) and there is a small gap SM formed betweenend portions 30 a (seeFIG. 2 ) of thewavy fins 30 and thebottom wall 21 of the coolingcase 20. - In
FIG. 12 , the circle indicates the measurement when there arebanks 31 x provided as in this embodiment (seeFIG. 9 ) while the square indicates the measurement when there are nobanks 31 x (seeFIG. 8 ). At the point indicated by the circle inFIG. 12 , the heat transfer coefficient is U1 and the pressure loss is ΔP1. At the point indicated by the square inFIG. 12 , the heat transfer coefficient is U2 and the pressure loss is ΔP2. U1 is higher than U2 by about 9%, indicating that the heat transfer coefficient is increased by providing thebanks 31 x. ΔP1 is larger than ΔP2, indicating that the pressure loss is increased by providing thebanks 31 x. - Here, the heat transfer coefficient and the pressure loss are proportional to the flow rate and speed of the
coolant 40. Namely, the flow rate and speed of thecoolant 40 have a relationship to the heat transfer coefficient and the pressure loss such that the larger the former, the larger the latter. Therefore, a comparison of the level of the heat transfer coefficient between a case where there arebanks 31 x provided and another case where there are nobanks 31 x needs to be made under a condition that the pressure loss is the same. The double square inFIG. 12 indicates the measurement when the pressure loss is made to ΔP1 by increasing the flow rate and speed of thecoolant 40 when there are nobanks 31 x based on the assumption above. The solid line shown inFIG. 12 indicates changes in the heat transfer coefficient and the pressure loss with the change in the flow rate and speed of thecoolant 40 when there are nobanks 31 x provided. - As is clear from a comparison between the circle and the double square indicated in
FIG. 12 , when the pressure loss is ΔP1, the heat transfer coefficient when there arebanks 31 x provided is higher than the heat transfer coefficient when there are nobanks 31 x provided. Accordingly, it can be considered that while providing thebanks 31 x increases the pressure loss, it can also largely improve the heat transfer coefficient. More specifically, it was confirmed that the temperature at thebase portions 31 a of thewavy fins 30 was reduced by about 5° C. by providing thebanks 31 x. - In this embodiment, as shown in
FIG. 2 , there is a small gap SM formed between theend portions 30 a of thewavy fins 30 and thebottom wall 21 of the coolingcase 20. This gap SM is about 0.3 mm, for example, which is shown exaggerated inFIG. 2 . If thecoolant 40 flows into this gap SM, the flow speed of the main stream MS of thecoolant 40 reduces, which in turn reduces the heat transfer coefficient of thewavy fins 30. However, in the cooler 4 of this embodiment, since the heat transfer coefficient of thewavy fins 30 is effectively improved by providing thebanks 31 x at thebase portions 31 a as described above, this reduction in the heat transfer coefficient of thewavy fins 30 caused by the formation of the gap SM does not become a problem. - One possibility here would be to interpose a
sheet member 80 made of an elastic material (such as rubber or resin) between theend portions 30 a of thewavy fins 30 and thebottom wall 21 of the coolingcase 20 as shown inFIG. 13 in order to prevent thecoolant 40 from flowing into the gap SM. The cost, however, would be higher with the cooler 4A shown inFIG. 13 because of thesheet member 80 being added as another component, as compared to thecooler 4 of this embodiment. - Moreover, with the cooler 4A shown in
FIG. 13 , there is a risk that theend portions 30 a of thewavy fins 30 are pressed to thesheet member 80 when theplate 10 with thewavy fins 30 is assembled to thecooling case 20, so that thesheet member 80 may enter in a space between adjacentwavy fins 30 as indicated by the imaginary lines KS inFIG. 13 . In this case, the pressure loss increases as compared to thecooler 4 of this embodiment since the space for thecoolant 40 to flow in is reduced. - In short, even without the
sheet member 80 to be fitted in the gap SM, the heat transfer coefficient of thewavy fins 30 can be effectively improved by providing thebanks 31 x at thebase portions 31 a according to thecooler 4 of the present embodiment. By not providing thesheet member 80, thecooler 4 can be configured less expensively, and pressure loss increase in thecooler 4 is reduced. - The advantageous effects of the
cooler 4 of the first embodiment will be described. In thiscooler 4, as shown inFIG. 9 , thebanks 31 x create flows of thecoolant 40 from the raisedcurved portions 31 toward the opposite loweredcurved portions 32. Thereby, the part MS1 of the main stream MS of thecoolant 40 can be mixed with thecoolant 40 stagnating near the loweredcurved portions 32, whereby the heat transfer coefficient of thewavy fins 30 can be improved. Thus, stagnation of thecoolant 40 near the loweredcurved portions 32 can be prevented, so that thecooler 4 can have enhanced cooling performance. - In the
cooler 4 of the first embodiment, as shown inFIG. 7 , thebanks 31 x provided at thebase portions 31 a create flows of coolant from thebase portions 31 a of the raisedcurved portions 31 toward the opposite loweredcurved portions 32. Thereby, thecoolant 40 is disturbed near thebase portions 31 a of thewavy fins 30 where the temperature is relatively high. Therefore the heat transfer coefficient of thewavy fins 30 can be effectively improved. Moreover, since thebanks 31 x are provided only at thebase portions 31 a, pressure fluctuations of thecoolant 40 caused by thebanks 31 x can be reduced and pressure loss increase in the cooler 4 can be kept small. - In the
cooler 4 of the first embodiment, as shown inFIG. 7 , the taperedbanks 31 x also create flows of thecoolant 40 from thebanks 31 x toward thebottom wall 21 of the coolingcase 20, in addition to the flows of thecoolant 40 from thebanks 31 x toward the loweredcurved portions 32. Therefore, thecoolant 40 is disturbed largely near thebanks 31 x, so that the heat exchange rate of thewavy fins 30 can be effectively improved. - Next, a second embodiment will be described using
FIGS. 14 and 15 . In the second embodiment,protrusions 31 y are provided in the raisedcurved portions 31 instead of thebanks 31 x of the first embodiment.FIG. 14 is a schematic view illustrating the flow of thecoolant 40 when there areprotrusions 31 y provided on the raisedcurved portions 31. - The
protrusions 31 y prevent creation of stagnation (stagnation point) of thecoolant 40 near the loweredcurved portions 32. Thisprotrusion 31 y is in a triangular column shape as shown inFIG. 14 and protrudes from the raisedcurved portion 31 toward the opposite loweredcurved portion 32. Thisprotrusion 31 y is provided at thebase portion 31 a of the raisedcurved portion 31 and integrally formed with the raisedcurved portion 31 by casting. Alternately, theprotrusions 31 y may be separate members from thewavy fins 30 and may be joined to the raisedcurved portions 31 by welding or bonding. - When the
coolant 40 passes through between the raisedcurved portion 31 and the loweredcurved portion 32 opposite to each other, as shown inFIG. 14 , theprotrusion 31 y changes the direction of the part MS1 of the main stream MS, and thereby the part MS1 of the main stream MS flows toward the loweredcurved portion 32. Thus, the part MS1 of the main stream MS is mixed with thecoolant 40 located near the lowered curved portion 32 (part Q). As a result, no stagnation of thecoolant 40 occurs near the loweredcurved portions 32, so that the cooling function of thecoolant 40 is fully exploited. -
FIG. 15 is an enlarged view of a part Y shown inFIG. 14 . As shown inFIG. 15 , the dimension e in the width direction (lateral direction inFIG. 15 ) of theprotrusion 31 y is about 0.1 mm, and the dimension f of the protruding distance of theprotrusion 31 y from the surface of the raisedcurved portion 31 is about 0.1 mm. The dimension in the height direction (direction orthogonal to the paper plane ofFIG. 15 ) of theprotrusion 31 y is about 0.1 mm. That is, theprotrusions 31 y are substantially smaller than thebanks 31 x of the first embodiment. Since other configurations of the second embodiment are similar to the configurations of the first embodiment, the description will be omitted. - Since the
protrusions 31 y are very small as described above, the main stream MS of thecoolant 40 is unlikely to be obstructed largely by theprotrusions 31 y. Therefore, the pressure fluctuations of thecoolant 40 are smaller than that in the first embodiment and the pressure loss of the cooler can be made small. However, the amount of thecoolant 40 made to flow toward the loweredcurved portions 32 by theprotrusions 31 y is smaller than that of thecoolant 40 made to flow toward the loweredcurved portions 32 by thebanks 31 x in the first embodiment. Accordingly, the amount of thecoolant 40 mixed near the loweredcurved portions 32 is smaller than that in the first embodiment, because of which an increase in the heat transfer coefficient of thewavy fins 30 is accordingly small. - The triangle shown in
FIG. 12 indicates the measurement in a test in which theprotrusions 31 y are provided. The measurement indicated by the triangle was obtained in the test under the same conditions as the tests in which the measurements were made when thebanks 31 x of the first embodiment are provided (circle inFIG. 12 ) and when thebanks 31 x are not provided (square inFIG. 12 ). - At the triangle in
FIG. 12 , the heat transfer coefficient is U3, which is higher than U2 by about 5%. This indicates that providing theprotrusions 31 y improves the heat transfer coefficient. However, it also indicates that, with theprotrusions 31 y, the increase in the heat transfer coefficient is smaller than when thebanks 31 x are provided. - At the triangle in
FIG. 12 , the pressure loss is ΔP3, which is slightly larger than ΔP2. This indicates that the pressure loss increase caused by theprotrusions 31 y is very small. It also indicates that, with theprotrusions 31 y, the pressure loss increase is sufficiently smaller than that of the case where thebanks 31 x are provided. - The advantageous effects of the second embodiment will be described. In the second embodiment, the stagnation preventing member is the
protrusions 31 y, i.e., the stagnation preventing member can be provided with a very simple configuration. Since theprotrusions 31 y are configured very small as shown inFIG. 15 , pressure fluctuations of thecoolant 40 caused by theprotrusions 31 y are reduced, so that there will be almost no increase in the pressure loss in the cooler. Since other advantageous effects of the second embodiment are similar to the advantageous effects of the first embodiment, the description will be omitted. - Next, a third embodiment will be described using
FIGS. 16 and 17 . In the third embodiment,second banks 21 x are provided on thebottom wall 21 of the coolingcase 20. -
FIG. 16 is an end view corresponding toFIG. 5 illustrating thesecond banks 21 x provided on thebottom wall 21 of the coolingcase 20. - As shown in
FIG. 16 , thebanks 31 x are each provided at thebase portions 31 a of the respective raisedcurved portions 31, as with the first embodiment. In the third embodiment, thesecond banks 21 x are each located closer todistal portions 31 b of respective raisedcurved portions 31 on thebottom wall 21 side (right side inFIG. 16 ) of the coolingcase 20 in the thickness direction of thewavy fins 30, thesesecond banks 21 x being integrally formed to thebottom wall 21 of the coolingcase 20. Thesecond banks 21 x prevent creation of stagnation (stagnation points) of thecoolant 40 near the loweredcurved portions 32, and correspond to the second stagnation preventing member of the present invention.FIG. 17 is an enlarged view of a part Z shown inFIG. 16 . - The
second bank 21 x has a shape like a generally vertical half of a taper as shown inFIG. 17 , tapering toward the plate 10 (left side ofFIG. 17 ). A tip portion of thissecond bank 21 x is not pointed but has a flat surface parallel to thebottom wall 21. The tip shape of thesecond bank 21 x is not limited to the flat shape and may be changed as required, and it may be pointed. - The dimension j in the width direction (vertical direction in
FIG. 17 ) of thesecond bank 21 x is about 0.7 mm, and the dimension g in the height direction (lateral direction inFIG. 17 ) of thebank 21 x is about 0.5 mm. Thissecond bank 21 x thus generates flows of thecoolant 40 as indicated by arrows inFIG. 17 . Namely, there are created flows of coolant from thedistal portions 31 b of the raisedcurved portions 31 toward the opposite loweredcurved portions 32. Since other configurations of the third embodiment are similar to the configurations of the first embodiment, the description will be omitted. - The advantageous effects of the third embodiment will be described. In the third embodiment, as shown in
FIG. 17 , thebanks 31 x and thesecond banks 21 x create flows of thecoolant 40 from the raisedcurved portions 31 toward the opposite loweredcurved portions 32. Thereby, the main stream MS of thecoolant 40 that tends to flow straight can be mixed substantially with thecoolant 40 stagnating near the loweredcurved portions 32, whereby the heat transfer coefficient of thewavy fins 30 can be largely improved. Namely, the heat transfer coefficient of thewavy fins 30 can be increased more than the first embodiment. - However, the pressure fluctuations of the
coolant 40 are large in the third embodiment since the space for thecoolant 40 to flow in is reduced due to thesecond banks 21 x. The pressure loss in the cooler 4B of the third embodiment is therefore larger than the pressure loss of thecooler 4 of the first embodiment. Since other advantageous effects of the third embodiment are similar to the advantageous effects of the first embodiment, the description will be omitted. - Next, a fourth embodiment will be described using
FIG. 18 . In the fourth embodiment, asheet member 90 is fitted in the gap SM between theend portions 30 a of thewavy fins 30 and thebottom wall 21 of the coolingcase 20, andsecond banks 90 x are provided to thissheet member 90.FIG. 18 is an end view corresponding toFIG. 5 illustrating thesecond banks 90 x provided on thesheet member 90. - The flat plate-
like sheet member 90 fills up the gap SM as shown inFIG. 18 . Thissheet member 90 prevents thecoolant 40 from flowing into the gap SM. Thesheet member 90 is made of an elastic material (such as rubber or resin) and bonded to thebottom wall 21 of the coolingcase 20 before theplate 10 and thewavy fins 30 are assembled to thecooling case 20. The gap SM is about 0.3 mm, for example, and thesheet member 90 also has a thickness of about 0.3 mm, for example. - In the fourth embodiment, the
second banks 90 x are each located at thedistal portions 31 b of the respective raisedcurved portions 31, and formed integrally with thesheet member 90. Thesecond banks 90 x prevent creation of stagnation (stagnation points) of thecoolant 40 near the respective loweredcurved portions 32, and correspond to the second stagnation preventing member of the present invention. Thesecond bank 90 x has a shape like a generally vertical half of a taper, tapering toward the plate 10 (left side inFIG. 18 ). Since other configurations of the fourth embodiment are similar to the configurations of the first embodiment, the description will be omitted. - The advantageous effects of the fourth embodiment will be described. In the fourth embodiment, since the gap SM is filled up with the
sheet member 90 as shown inFIG. 18 , thecoolant 40 can be prevented from flowing into the gap SM. This prevents the main stream MS of thecoolant 40 from slowing down, whereby the heat transfer coefficient of thewavy fins 30 can be improved. Moreover, thebanks 31 x and thesecond banks 90 x create flows of thecoolant 40 from the raisedcurved portions 31 toward the opposite loweredcurved portions 32. Thereby, the main stream MS of thecoolant 40 that tends to flow straight can be mixed substantially with thecoolant 40 stagnating near the loweredcurved portions 32, whereby the heat transfer coefficient of thewavy fins 30 can be largely improved. - The cost, however, is higher with the cooler 4C of the fourth embodiment because of the
sheet member 90 being added as another component, as compared to thecooler 4 of the first embodiment. The pressure fluctuations of thecoolant 40 are larger since the space for thecoolant 40 to flow in is reduced by thesecond banks 90. The pressure loss of the cooler 4C of the fourth embodiment is, therefore, larger than that of thecooler 4 of the first embodiment. Since other advantageous effects of the fourth embodiment are similar to the advantageous effects of the first embodiment, the description will be omitted. - While coolers according to the present invention have been described above, the present invention is not limited to these and can be modified in various manners without departing from the subject matter. In the first embodiment, for example, the
banks 31 x are integrally formed to the respective raisedcurved portions 31 by casting. Alternately, thebanks 31 x may be separate from theplate 10 and may be joined to the raisedcurved portions 31 by welding or bonding. In the first embodiment, thebanks 31 x are provided at thebase portions 31 a of the raisedcurved portions 31. Alternately, thebanks 31 x may be provided at other portions than thebase portions 31 a of the raisedcurved portions 31, for example at thedistal portions 31 b of the raisedcurved portions 31. The shape and the size of thebanks 31 x may be changed as required. - In the second embodiment, one
protrusion 31 y is provided on each raisedcurved portion 31. Alternately, a plurality ofprotrusions 31 y may be provided on each raisedcurved portion 31. For example, twoprotrusions 31 y may be provided at thebase portion 31 a of the raisedcurved portion 31. Alternatively, oneprotrusion 31 y may be provided at thebase portion 31 a of the raisedcurved portion 31, and anotherprotrusion 31 y may be provided at thedistal portion 31 b of the raisedcurved portion 31. The shape and the size of theprotrusions 31 y can be changed as required. - In the third embodiment, the
banks 31 x are provided at thebase portions 31 a of the raisedcurved portions 31, while thesecond banks 21 x are provided at thedistal portions 31 b of the raisedcurved portions 31. Alternately, protrusions may be provided at thebase portions 31 a of the raisedcurved portions 31 instead of thebanks 31 x. Alternatively, protrusions may be provided at thedistal portions 31 b of the raisedcurved portions 31 instead of thesecond banks 21 x. - In the forth embodiment, the
second banks 90 x are provided on thesheet member 90. Alternately, protrusions may be provided on thesheet member 90. - In each embodiment mentioned above, the distance (flow path width) of the adjacent
wavy fins 30 is made constant at any points in the flowing direction, but it may be changed at any points in the flowing direction. -
- 1 Inverter device
- 2 Semiconductor device
- 3 Insulating substrate
- 4, 4A, 4B, 4C Cooler
- 10 Plate
- 20 Cooling case
- 21 Bottom wall
- 21 x Second bank
- 30 Wavy fin
- 31 Raised curved portion
- 31 a Base portion
- 31 b Distal portion
- 31 x Bank
- 31 y Protrusion
- 32 Lowered curved portion
- 40 Coolant
- 90 Sheet member
- 90 x Second bank
Claims (7)
1. A cooler including:
a plate connected to a semiconductor device;
a cooling case covered with the plate and having a coolant flowing therein; and
wavy fins connected to the plate, each wavy fin having a raised curved portion and a lowered curved portion formed alternately on a side face of the wavy fin in a flow direction of the coolant, the coolant flowing through between the raised curved portion and the lowered curved portion of the adjacent wavy fins opposite to each other in a meandering manner,
wherein the raised curved portion is provided with a stagnation preventing member for creating a flow of coolant from the raised curved portion toward the opposite lowered curved portion, the stagnation preventing member being provided at a base portion of the raised curved portion on a semiconductor device side in a thickness direction of the wavy fins.
2. (canceled)
3. The cooler according to claim 1 , wherein the stagnation preventing member is a tapered bank tapering toward a bottom wall of the cooling case.
4. The cooler according to claim 1 , the stagnation preventing member is a protrusion protruding from the raised curved portion toward the opposite lowered curved portion.
5. The cooler according to claim 1 , wherein a second stagnation preventing member for creating a flow of coolant from the raised curved portion toward the opposite lowered curved portion is provided, the second stagnation preventing member being positioned at a distal portion of the raised curved portion on a side of the bottom wall of the cooling case in a thickness direction of the wavy fins.
6. The cooler according to claim 3 , wherein a second stagnation preventing member for creating a flow of coolant from the raised curved portion toward the opposite lowered curved portion is provided, the second stagnation preventing member being positioned at a distal portion of the raised curved portion on a side of the bottom wall of the cooling case in a thickness direction of the wavy fins.
7. The cooler according to claim 4 , wherein a second stagnation preventing member for creating a flow of coolant from the raised curved portion toward the opposite lowered curved portion is provided, the second stagnation preventing member being positioned at a distal portion of the raised curved portion on a side of the bottom wall of the cooling case in a thickness direction of the wavy fins.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2011/063048 WO2012169012A1 (en) | 2011-06-07 | 2011-06-07 | Cooler |
Publications (1)
Publication Number | Publication Date |
---|---|
US20130025837A1 true US20130025837A1 (en) | 2013-01-31 |
Family
ID=47295619
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/581,718 Abandoned US20130025837A1 (en) | 2011-06-07 | 2011-06-07 | Cooler |
Country Status (6)
Country | Link |
---|---|
US (1) | US20130025837A1 (en) |
EP (1) | EP2720262A4 (en) |
JP (1) | JP5454586B2 (en) |
KR (1) | KR101459204B1 (en) |
CN (1) | CN102934222B (en) |
WO (1) | WO2012169012A1 (en) |
Cited By (10)
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US20100180441A1 (en) * | 2009-01-20 | 2010-07-22 | Toyota Jidosha Kabushiki Kaisha | Method of brazing heat sink |
CN109520353A (en) * | 2018-12-20 | 2019-03-26 | 无锡博利达换热器有限公司 | Novel strip-fin oil cooler applied to combine harvester |
US20190101287A1 (en) * | 2016-06-01 | 2019-04-04 | Kawasaki Jukogyo Kabushiki Kaisha | Cooling structure for gas turbine engine |
US20190148259A1 (en) * | 2017-11-15 | 2019-05-16 | Fuji Electric Co., Ltd. | Power converter and power converter for railroad vehicle |
EP3683534A1 (en) * | 2019-01-17 | 2020-07-22 | LSIS Co., Ltd. | Heatsink module for inverter |
US10906405B2 (en) * | 2017-08-01 | 2021-02-02 | Fuji Electric Co., Ltd. | Power converter for railroad vehicle |
US11175102B1 (en) * | 2021-04-15 | 2021-11-16 | Chilldyne, Inc. | Liquid-cooled cold plate |
US20220011060A1 (en) * | 2020-07-10 | 2022-01-13 | Toyota Jidosha Kabushiki Kaisha | Cooling unit |
EP4102944A4 (en) * | 2020-02-03 | 2024-03-06 | LS Electric Co., Ltd. | Cooling plate and manufacturing method therefor |
US12009279B2 (en) | 2018-10-03 | 2024-06-11 | Fuji Electric Co., Ltd. | Semiconductor apparatus including cooler for cooling semiconductor element |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP7294126B2 (en) * | 2019-12-26 | 2023-06-20 | トヨタ自動車株式会社 | Cooler |
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- 2011-06-07 US US13/581,718 patent/US20130025837A1/en not_active Abandoned
- 2011-06-07 EP EP11857976.2A patent/EP2720262A4/en not_active Withdrawn
- 2011-06-07 JP JP2011544524A patent/JP5454586B2/en not_active Expired - Fee Related
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Cited By (14)
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US20100180441A1 (en) * | 2009-01-20 | 2010-07-22 | Toyota Jidosha Kabushiki Kaisha | Method of brazing heat sink |
US11215361B2 (en) * | 2016-06-01 | 2022-01-04 | Kawasaki Jukogyo Kabushiki Kaisha | Cooling structure with ribs for gas turbine engine |
US20190101287A1 (en) * | 2016-06-01 | 2019-04-04 | Kawasaki Jukogyo Kabushiki Kaisha | Cooling structure for gas turbine engine |
US10906405B2 (en) * | 2017-08-01 | 2021-02-02 | Fuji Electric Co., Ltd. | Power converter for railroad vehicle |
US20190148259A1 (en) * | 2017-11-15 | 2019-05-16 | Fuji Electric Co., Ltd. | Power converter and power converter for railroad vehicle |
US10453770B2 (en) * | 2017-11-15 | 2019-10-22 | Fuji Electric Co., Ltd. | Power converter and power converter for railroad vehicle |
US12009279B2 (en) | 2018-10-03 | 2024-06-11 | Fuji Electric Co., Ltd. | Semiconductor apparatus including cooler for cooling semiconductor element |
CN109520353A (en) * | 2018-12-20 | 2019-03-26 | 无锡博利达换热器有限公司 | Novel strip-fin oil cooler applied to combine harvester |
EP3683534A1 (en) * | 2019-01-17 | 2020-07-22 | LSIS Co., Ltd. | Heatsink module for inverter |
US11234348B2 (en) | 2019-01-17 | 2022-01-25 | Lsis Co., Ltd. | Heatsink module for inverter |
EP4102944A4 (en) * | 2020-02-03 | 2024-03-06 | LS Electric Co., Ltd. | Cooling plate and manufacturing method therefor |
US20220011060A1 (en) * | 2020-07-10 | 2022-01-13 | Toyota Jidosha Kabushiki Kaisha | Cooling unit |
US11808533B2 (en) * | 2020-07-10 | 2023-11-07 | Toyota Jidosha Kabushiki Kaisha | Cooling unit |
US11175102B1 (en) * | 2021-04-15 | 2021-11-16 | Chilldyne, Inc. | Liquid-cooled cold plate |
Also Published As
Publication number | Publication date |
---|---|
CN102934222A (en) | 2013-02-13 |
KR20130031825A (en) | 2013-03-29 |
JPWO2012169012A1 (en) | 2015-02-23 |
EP2720262A1 (en) | 2014-04-16 |
CN102934222B (en) | 2015-07-22 |
WO2012169012A1 (en) | 2012-12-13 |
EP2720262A4 (en) | 2015-06-17 |
JP5454586B2 (en) | 2014-03-26 |
KR101459204B1 (en) | 2014-11-07 |
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