CN108538797A - Liquid metal heat dissipation device - Google Patents
Liquid metal heat dissipation device Download PDFInfo
- Publication number
- CN108538797A CN108538797A CN201810204176.7A CN201810204176A CN108538797A CN 108538797 A CN108538797 A CN 108538797A CN 201810204176 A CN201810204176 A CN 201810204176A CN 108538797 A CN108538797 A CN 108538797A
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- Prior art keywords
- liquid metal
- micro
- heat sink
- hose
- runner
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- 229910001338 liquidmetal Inorganic materials 0.000 title claims abstract description 118
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 24
- 230000005855 radiation Effects 0.000 claims description 28
- 238000005192 partition Methods 0.000 claims description 25
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 6
- 229910052797 bismuth Inorganic materials 0.000 claims description 6
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 6
- 229910052733 gallium Inorganic materials 0.000 claims description 6
- 229910052738 indium Inorganic materials 0.000 claims description 6
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 6
- 229910052718 tin Inorganic materials 0.000 claims description 6
- 229910052725 zinc Inorganic materials 0.000 claims description 6
- 239000011701 zinc Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 230000003139 buffering effect Effects 0.000 claims 2
- 239000004744 fabric Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 8
- 238000001816 cooling Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000004577 thatch Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The embodiment of the invention provides a liquid metal heat dissipation device, which comprises: the heat dissipation end and the microchannel are subjected to heat sinking; and the heat dissipation end is connected with the micro-channel heat sink to form a circulating loop of liquid metal so as to finish heat dissipation of the equipment. According to the liquid metal heat dissipation device provided by the embodiment of the invention, the heat dissipation end is connected with the microchannel heat sink to form a circulating circulation loop of the liquid metal, and the liquid metal continuously absorbs the heat of equipment in the microchannel heat sink and exchanges heat with air at the heat dissipation end so as to realize efficient heat dissipation of the equipment.
Description
Technical field
The present invention relates to technical field of heat dissipation, more particularly, to a kind of liquid metal heat radiation device.
Background technology
In the current information-based and modernization of industry process, chip and various electronic circuit apparatus are gradually towards small-sized
Change, integrated and high-power direction is developed.While raising and the realization of various design functions of calculating speed, also bring
The heat power consumption and heat flow density of bigger, heat dissipation problem, which has been increasingly becoming, restricts chip and electronic circuit apparatus further develops
Technical bottleneck.
Currently, solving the main means of chip and various electronic circuit apparatus heat dissipation problems can be divided into three classes：Air-cooled, liquid
Cold and heat pipe.Single air-cooled radiating device is usually simple in structure, is cooled down by the heat exchange of the gaseous exchanges such as air, having can
The advantage high by property, but its heat-sinking capability much can not meet the cooling requirements of integrated chip and electronic circuit apparatus；Liquid cooling dissipates
The heat-sinking capability of thermal is more excellent, but the volume of liquid-cooling heat radiator is larger, is unfavorable for the miniaturization of equipment and integrated；
The excellent thermal conductivity of heat pipe, but when heat flow density is more than the working limit of heat pipe, heat pipe will be unable to work normally, and may go out
Existing temperature rises rapidly, or even the accident of booster occurs.
Traditional heat-dissipating device generally use split structure carries out driving device, conveyance conduit and thermal component independent
Design so that the volume of radiator is larger, is unfavorable for the miniaturization of equipment and integrated.Its main cause may be that tradition dissipates
The driving part volume of thermal is larger, thermal component heat dissipation area is larger or there are other attached thermal components, such as compresses
Refrigeration-type cooling system needs that compressor, condenser and throttle mechanism etc. is arranged.
Invention content
In order to overcome the above-mentioned problems in the prior art, the present invention to provide a kind of liquid metal heat radiation at least partly
Device.
The present invention provides a kind of liquid metal heat radiation device, including：Radiating end and micro-channel heat sink；Wherein, the heat dissipation
End is connected with the micro-channel heat sink, the circulation circuit of liquid metal is constituted, to complete the heat dissipation of equipment.
Wherein, the radiating end includes：Two turbofan, U-shaped liquid metal runner, radiating fin, multiple electromagnetic pumps,
There are two the upper cover plates of through-hole for lower cover and setting；The radiating fin is arranged in two of the U-shaped liquid metal runner
Side is to form upper surface radiating fin and lower surface radiating fin；The upper cover plate is closely pasted with the upper surface radiating fin
It closes, the lower cover is fitted closely with the lower surface radiating fin；Described two turbofan respectively on the upper cover plate
Two through-holes it is coaxially arranged, and described two turbofan are arranged in the inside of the U-shaped liquid metal runner；The electromagnetism
Pump, for providing driving force for the circulating for liquid metal inside the U-shaped liquid metal runner.
Wherein, the electromagnetic pump includes a pair of of permanent magnet and a pair of electrodes；Wherein, the permanent magnet is fitted tightly over respectively
The upper and lower surface of the U-shaped liquid metal runner, and attract each other without the radiating fin, the permanent magnet at bonding position；
The electrode is arranged in two sides of the U-shaped liquid metal runner, and the part of the electrode stretch into it is described U-shaped
Liquid metal runner.
Wherein, the diameter of the through-hole is less than or equal to the diameter of the turbofan.
Wherein, the micro-channel heat sink includes：Micro-channel heat sink ontology is arranged in micro-channel heat sink ontology side table
The liquid metal inlet tube in face, be arranged one side surface of micro-channel heat sink ontology liquid metal outlet pipe, be arranged in institute
It states the microchannel of micro-channel heat sink body interior, the first cushion chamber and the setting in the micro-channel heat sink body interior is set
In the second cushion chamber of the micro-channel heat sink body interior；
Wherein, the liquid metal inlet tube is connected to first cushion chamber, first cushion chamber and described second
Cushion chamber is connected to by the microchannel, and second cushion chamber is connected to the liquid metal outlet pipe.
Wherein, the microchannel includes multiple rectangular channels for being arranged in parallel in the micro-channel heat sink body interior.
Wherein, further include：Adapter and hose；The adapter, for connecting the U-shaped liquid metal runner and described
Hose；The hose, for connecting the adapter and the micro-channel heat sink, so that in the U-shaped liquid metal runner
The circulation circuit that liquid metal is formed between the micro-channel heat sink, to complete the heat dissipation of equipment.
Wherein, the adapter includes the first adapter and the second adapter, and the hose includes the first hose and second
Hose；Wherein, the both ends of first adapter respectively with the first end of the U-shaped liquid metal runner and first hose
First end connection, the second end of first hose connects with the liquid metal inlet tube；The two of second adapter
End is connect with the first end of the second end of the U-shaped liquid metal runner and second hose respectively, second hose
Second end is connected with the liquid metal outlet pipe.
Wherein, further include：First partition and second partition；Wherein, the both ends of the first partition are both provided with groove, institute
State the end that first partition is fixed on the U-shaped liquid metal runner by the groove；The quantity of the second partition is two
It is a, and described two second partition arranged for interval, described two second partitions are arranged among described two turbofan.
Wherein, the liquid metal is the metal fluid for including at least one of gallium, indium, tin, bismuth and zinc；Alternatively, described
Liquid metal be include in gallium, indium, tin, bismuth and zinc at least two alloy fluid.
To sum up, the present invention provides a kind of liquid metal heat radiation device, and radiating end is connected with micro-channel heat sink, constitutes liquid
The circulation circuit of metal, by the heat of liquid metal continuous absorption equipment in micro-channel heat sink, and radiating end with
Air exchanges heat, to realize the high efficiency and heat radiation to equipment.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is the present invention
Some embodiments for those of ordinary skill in the art without creative efforts, can also basis
These attached drawings obtain other attached drawings.
Fig. 1 is a kind of overall structure diagram of liquid metal heat radiation device provided in an embodiment of the present invention；
Fig. 2 is a kind of structural schematic diagram of the radiating end of liquid metal heat radiation device provided in an embodiment of the present invention；
Fig. 3 is a kind of structural schematic diagram of the micro-channel heat sink of liquid metal heat radiation device provided in an embodiment of the present invention；
Fig. 4 is a kind of operation principle schematic diagram of the electromagnetic pump of liquid metal heat radiation device provided in an embodiment of the present invention.
In figure, 1：Radiating end；2：Adapter；3：Hose；4：Micro-channel heat sink；5：Turbofan；6：U-shaped flow of liquid metal
Road；7：First partition；8：Second partition；9：Lower cover；10：Upper cover plate；11：Radiating fin；12：Permanent magnet；13：Electrode；14：
Magnet ring；15：Micro-channel heat sink inlet tube；16：Microchannel；17：First cushion chamber.
Specific implementation mode
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with attached drawing, to the embodiment of the present invention
In technical solution be explicitly described, it is clear that described embodiment is a part of the embodiment of the present invention, rather than complete
The embodiment in portion.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
Fig. 1 is a kind of overall structure diagram of liquid metal heat radiation device provided in an embodiment of the present invention, such as Fig. 1 institutes
Show, including：Radiating end 1 and micro-channel heat sink 4；
Wherein, the radiating end 1 and the micro-channel heat sink 4 connect, and the circulation circuit of liquid metal are constituted, with complete
The heat dissipation of forming apparatus.
It is understood that radiating end 1 is used for the heat of device for transferring；Micro-channel heat sink 4, for taking away dissipating for equipment
Heat.
Wherein, equipment can be chip or electronic circuit apparatus, be not especially limited in embodiments of the present invention.
It is understood that the liquid metal is the metal fluid for including at least one of gallium, indium, tin, bismuth and zinc；Or
Person, the liquid metal be include in gallium, indium, tin, bismuth and zinc at least two alloy fluid.It is excellent by introducing heat conductivility
Liquid metal material, realize high heat flux density under equipment high efficiency and heat radiation.
In embodiments of the present invention, radiating end is connected with micro-channel heat sink, constitutes the circulation circuit of liquid metal,
It by the heat of liquid metal continuous absorption equipment in micro-channel heat sink, and exchanges heat in radiating end and air, to realize
To the high efficiency and heat radiation of equipment.
Fig. 2 is a kind of structural schematic diagram of the radiating end of liquid metal heat radiation device provided in an embodiment of the present invention, such as Fig. 2
Shown, the radiating end 1 includes：Two turbofan 5, U-shaped liquid metal runner 6, radiating fin 11, multiple electromagnetic pumps, under
There are two the upper cover plates 10 of through-hole for cover board 9 and setting；
The radiating fin 11 is arranged in two sides of the U-shaped liquid metal runner 6 to form upper surface radiating fin
Piece and lower surface radiating fin；
The upper cover plate 10 is fitted closely with the upper surface radiating fin, and the lower cover 9 radiates with the lower surface
Fin fits closely；
Described two turbofan 5 are coaxially arranged with two through-holes on the upper cover plate 10 respectively, and described two whirlpools
Wheel fan 5 is arranged in the inside of the U-shaped liquid metal runner；
The electromagnetic pump, for providing driving for the circulating for liquid metal inside the U-shaped liquid metal runner 6
Power.
It is understood that turbofan 5 is used to provide the air of flowing to cool down radiating fin 11；U-shaped liquid metal
Runner 6 transmits the channel of heat as liquid metal, uses metal material or heat conductivility and mechanical performance in the present embodiment
Preferable organic or inorganic material；Radiating fin 11 is for extending heat dissipation area；Upper cover plate 10 and lower cover 9, with radiating fin
11 form the channel of air circulation；Through-hole at the setting of upper cover plate 10 two aspirates air for turbofan 5, and the diameter of through-hole is small
In or equal to turbofan 5 diameter.
It is understood that the radiating end 1 further includes first partition 7, the both ends of first partition 7 are both provided with groove,
The first partition 7 is fixed on the end of the U-shaped liquid metal runner 6 by the groove.First partition 7 is for closing institute
1 inner space of radiating end is stated, guiding air flows to the radiating fin 11.
On the basis of the above embodiments, the electromagnetic pump includes a pair of of permanent magnet 12 and a pair of electrodes 13；
Wherein, the permanent magnet 12 is fitted tightly over the upper and lower surface of the U-shaped liquid metal runner 6 respectively, and is bonded
It attracts each other without the radiating fin 11, the permanent magnet 12 at position；
The electrode 13 is arranged in two sides of the U-shaped liquid metal runner 6, and the part of the electrode 13
Stretch into the U-shaped liquid metal runner 6.
It is understood that permanent magnet 12 is for providing stable magnetic field for electromagnetic pump；Electrode 13 for electromagnetic pump for carrying
It is in embodiments of the present invention the metal electrodes such as copper, silver or graphite electrode for stable impressed current.
Preferably, the electromagnetic pump further includes magnet ring 14, and magnet ring 14 is used to enhance the magnetic induction intensity inside electromagnetic pump.Magnetic
Ring 14 is arranged in the lower section of the U-shaped liquid metal runner 6, and is arrangement between magnet ring 14 and the U-shaped liquid metal runner 6
Permanent magnet 12 below U-shaped liquid metal runner 6.
Preferably, the electromagnetic pump chooses two in embodiments of the present invention, and is sequentially arranged in the flow of liquid metal
The different location in road 6 circulates for liquid metal and provides sufficient driving force.
Preferably, the radiating end 1 further includes second partition 8；The quantity of the second partition 8 is two, and described two
8 arranged for interval of a second partition, described two second partitions 8 are arranged among described two turbofan 5.Described two
The distance between two partition boards 8 are equal to the width of the magnet ring 14.The length of described two second partitions 8 is less than or equal to described
The diameter of turbofan 5.The width of the magnet ring 14 is equal with the width of permanent magnet 12.
Fig. 4 is a kind of operation principle schematic diagram of the electromagnetic pump of liquid metal heat radiation device provided in an embodiment of the present invention,
As shown in figure 4, the electromagnetic pump is made of the permanent magnet 12, the electrode 13 and the liquid metal runner 6, it is liquid gold
What is belonged to circulates offer driving force.The direction for the impressed current that the magnetic field that the permanent magnet 12 provides is provided with the electrode 13
Be mutually perpendicular to, according to Lorentz force law, liquid metal will by the Lorentz force both perpendicular to magnetic field and direction of an electric field,
The flow resistance for overcoming liquid metal generates the flowing of the same direction, promotes liquid metal circulation cooling.
Fig. 3 is a kind of structural schematic diagram of the micro-channel heat sink of liquid metal heat radiation device provided in an embodiment of the present invention,
As shown in figure 3, including the sectional view of the sectional view and the directions B-B that carry out the directions A-A to micro-channel heat sink 4, the micro channel heat
Heavy 4 include：Micro-channel heat sink ontology, be arranged one side surface of micro-channel heat sink ontology liquid metal inlet tube 15, set
Set one side surface of micro-channel heat sink ontology liquid metal outlet pipe, be arranged in the micro-channel heat sink body interior
Microchannel 16 is arranged in the first cushion chamber 17 of the micro-channel heat sink body interior and setting in the micro-channel heat sink sheet
Second cushion chamber in internal portion；
Wherein, the liquid metal inlet tube 15 is connected to first cushion chamber 17, first cushion chamber 17 and institute
It states the second cushion chamber to be connected to by the microchannel 16, second cushion chamber is connected to the liquid metal outlet pipe.
Preferably, the microchannel 16 includes multiple is arranged in parallel in the micro-channel heat sink ontology in the present embodiment
The rectangular channel in portion.
Preferably, the micro-channel heat sink 4 uses metal material, such as copper or heat conductivility and machine in the present embodiment
Tool is of good performance inorganic or organic material.
On the basis of the above embodiments, further include：Adapter 2 and hose 3；
The adapter 2, for connecting the U-shaped liquid metal runner 6 and the hose 3；
The hose 3, for connecting the adapter 2 and the micro-channel heat sink 4, so that in the U-shaped liquid gold
Belong to the circulation circuit that liquid metal is formed between runner 6 and the micro-channel heat sink 4, to complete the heat dissipation of equipment.
It is understood that U-shaped liquid metal runner 6 and micro-channel heat sink 4 are connected by adapter 2 and hose 3
It connects, forms the circulation circuit of liquid metal, to complete the heat dissipation of equipment.
Preferably, the adapter 2 include the first adapter and the second adapter, the hose 3 include the first hose and
Second hose；
Wherein, the both ends of first adapter first end and described first with the U-shaped liquid metal runner 6 respectively
The first end of hose connects, and the second end of first hose is connected with the liquid metal inlet tube；
The both ends of second adapter respectively with the second end of the U-shaped liquid metal runner 6 and second hose
First end connection, the second end of second hose connects with the liquid metal outlet pipe.
A kind of liquid metal heat radiation device is provided in embodiments of the present invention, the long-range navigation generated using electromagnetism field interactions
Thatch power, driving liquid metal are circulated in heat sink interior, the heat of continuous absorption equipment in micro-channel heat sink, and
Radiating end exchanges heat with air, realizes the high efficiency and heat radiation to equipment.Meanwhile by U-shaped liquid metal runner, electromagnetic pump and heat dissipation
Fin is integrated, and use upside air inlet, circumferential outlet turbofan, realize densification, the miniaturization sum aggregate of radiator
Cheng Hua.The radiator can realize 100W/CM2The power consumption of effective heat dissipation of heat flow density, the electromagnetic pump is less than 5W.
Finally it should be noted that：The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
Present invention has been described in detail with reference to the aforementioned embodiments, it will be understood by those of ordinary skill in the art that：It still may be used
With technical scheme described in the above embodiments is modified or equivalent replacement of some of the technical features；
And these modifications or replacements, various embodiments of the present invention technical solution that it does not separate the essence of the corresponding technical solution spirit and
Range.
Claims (10)
1. a kind of liquid metal heat radiation device, which is characterized in that including：Radiating end and micro-channel heat sink；
Wherein, the radiating end is connected with the micro-channel heat sink, the circulation circuit of liquid metal is constituted, to complete equipment
Heat dissipation.
2. liquid metal heat radiation device according to claim 1, which is characterized in that the radiating end includes：Two turbines
There are two the upper cover plates of through-hole for fan, U-shaped liquid metal runner, radiating fin, multiple electromagnetic pumps, lower cover and setting；
The radiating fin is arranged in two sides of the U-shaped liquid metal runner to form upper surface radiating fin and following table
Face radiating fin；
The upper cover plate is fitted closely with the upper surface radiating fin, and the lower cover and the lower surface radiating fin are close
Fitting；
Described two turbofan are coaxially arranged with two through-holes on the upper cover plate respectively, and described two turbofan cloth
It sets in the inside of the U-shaped liquid metal runner；
The electromagnetic pump, for providing driving force for the circulating for liquid metal inside the U-shaped liquid metal runner.
3. liquid metal heat radiation device according to claim 2, which is characterized in that the electromagnetic pump includes a pair of of permanent magnet
And a pair of electrodes；
Wherein, the permanent magnet is fitted tightly over the upper and lower surface of the U-shaped liquid metal runner respectively, and at bonding position without
The radiating fin, the permanent magnet attract each other；
The electrode is arranged in two sides of the U-shaped liquid metal runner, and institute is stretched into the part of the electrode
State U-shaped liquid metal runner.
4. liquid metal heat radiation device according to claim 3, which is characterized in that the diameter of the through-hole is less than or waits
In the diameter of the turbofan.
5. liquid metal heat radiation device according to claim 2, which is characterized in that the micro-channel heat sink includes：It is micro- logical
Road heat sink body, be arranged one side surface of micro-channel heat sink ontology liquid metal inlet tube, be arranged in the microchannel
The liquid metal outlet pipe of one side surface of heat sink body, be arranged the microchannel of the micro-channel heat sink body interior, setting exist
First cushion chamber of the micro-channel heat sink body interior and be arranged the micro-channel heat sink body interior second buffering
Chamber；
Wherein, the liquid metal inlet tube is connected to first cushion chamber, first cushion chamber and second buffering
Chamber is connected to by the microchannel, and second cushion chamber is connected to the liquid metal outlet pipe.
6. liquid metal heat radiation device according to claim 5, which is characterized in that the microchannel includes multiple parallel cloth
Set the rectangular channel in the micro-channel heat sink body interior.
7. liquid metal heat radiation device according to claim 5, which is characterized in that further include：Adapter and hose；
The adapter, for connecting the U-shaped liquid metal runner and the hose；
The hose, for connecting the adapter and the micro-channel heat sink so that in the U-shaped liquid metal runner and
The circulation circuit that liquid metal is formed between the micro-channel heat sink, to complete the heat dissipation of equipment.
8. liquid metal heat radiation device according to claim 7, which is characterized in that the adapter includes the first adapter
With the second adapter, the hose includes the first hose and the second hose；
Wherein, the both ends of first adapter respectively with the first end of the U-shaped liquid metal runner and first hose
First end connection, the second end of first hose connects with the liquid metal inlet tube；
The both ends of second adapter respectively with the second end of the U-shaped liquid metal runner and second hose first
End connection, the second end of second hose are connected with the liquid metal outlet pipe.
9. liquid metal heat radiation device according to claim 3, which is characterized in that further include：First partition and second every
Plate；
Wherein, the both ends of the first partition are both provided with groove, and the first partition is fixed on described U-shaped by the groove
The end of liquid metal runner；
The quantity of the second partition is two, and described two second partition arranged for interval, and described two second partitions are uniformly distributed
It sets among described two turbofan.
10. liquid metal heat radiation device according to claim 1, which is characterized in that the liquid metal be include gallium,
The metal fluid of at least one of indium, tin, bismuth and zinc；
Alternatively, the liquid metal be include in gallium, indium, tin, bismuth and zinc at least two alloy fluid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810204176.7A CN108538797A (en) | 2018-03-13 | 2018-03-13 | Liquid metal heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810204176.7A CN108538797A (en) | 2018-03-13 | 2018-03-13 | Liquid metal heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108538797A true CN108538797A (en) | 2018-09-14 |
Family
ID=63484415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810204176.7A Pending CN108538797A (en) | 2018-03-13 | 2018-03-13 | Liquid metal heat dissipation device |
Country Status (1)
| Country | Link |
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| CN (1) | CN108538797A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110808231A (en) * | 2019-10-30 | 2020-02-18 | 中国科学院理化技术研究所 | Double-fluid heat dissipation device |
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| CN102458081A (en) * | 2010-10-22 | 2012-05-16 | 富瑞精密组件（昆山）有限公司 | Heat radiator and electronic device using same |
| CN202816913U (en) * | 2012-10-24 | 2013-03-20 | 中国电子科技集团公司第三十八研究所 | Microchannel liquid-cooled heat sink device |
| CN203038911U (en) * | 2013-01-07 | 2013-07-03 | 北京依米康散热技术有限公司 | Heat radiation device based on liquid metal |
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2018
- 2018-03-13 CN CN201810204176.7A patent/CN108538797A/en active Pending
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|---|---|---|---|---|
| CN201655785U (en) * | 2010-04-15 | 2010-11-24 | 华中科技大学 | Micro-channel heat sink for electronic packaging device |
| CN102458081A (en) * | 2010-10-22 | 2012-05-16 | 富瑞精密组件（昆山）有限公司 | Heat radiator and electronic device using same |
| CN202816913U (en) * | 2012-10-24 | 2013-03-20 | 中国电子科技集团公司第三十八研究所 | Microchannel liquid-cooled heat sink device |
| CN203038911U (en) * | 2013-01-07 | 2013-07-03 | 北京依米康散热技术有限公司 | Heat radiation device based on liquid metal |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110808231A (en) * | 2019-10-30 | 2020-02-18 | 中国科学院理化技术研究所 | Double-fluid heat dissipation device |
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Application publication date: 20180914 |